CN111459252A - Control method and device and electronic equipment - Google Patents
Control method and device and electronic equipment Download PDFInfo
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- CN111459252A CN111459252A CN202010245513.4A CN202010245513A CN111459252A CN 111459252 A CN111459252 A CN 111459252A CN 202010245513 A CN202010245513 A CN 202010245513A CN 111459252 A CN111459252 A CN 111459252A
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- G06—COMPUTING; CALCULATING OR COUNTING
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- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- G—PHYSICS
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- G06F11/00—Error detection; Error correction; Monitoring
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- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
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- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
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Abstract
The application discloses a control method, a control device and electronic equipment, wherein the method comprises the following steps: obtaining at least two first temperature values by using at least two temperature sensors arranged on at least two first positions of the electronic equipment; the first positions have first distances from the corresponding heating devices respectively, the first positions have second distances from the target area of the electronic equipment shell, and the first distances are smaller than the second distances; processing the at least two first temperature values to obtain a second temperature value, wherein the second temperature value represents a temperature value at a second position of the electronic equipment; wherein the second location has a third distance from the target area, the third distance being less than the second distance; and controlling a heat dissipation device of the electronic equipment at least based on the second temperature value.
Description
Technical Field
The present application relates to the field of device control technologies, and in particular, to a control method and apparatus, and an electronic device.
Background
In heat dissipation control of electronic equipment, generally, a fan is controlled in wind speed based on a temperature value associated with a heat source.
However, when the user uses the electronic device, the user directly contacts the position or the area which is not the heat generating source itself but is a certain distance away from the heat generating source, and it takes a certain time for the heat of the heat generating source to be transferred to the user contact area, so that the situation that the heat generated by the user is not matched with the heat dissipation control of the electronic device exists.
Disclosure of Invention
In view of the above, the present application provides a control method, an apparatus and an electronic device, including:
a control method, comprising:
obtaining at least two first temperature values by using at least two temperature sensors arranged on at least two first positions of the electronic equipment; the first positions have first distances from the corresponding heating devices respectively, the first positions have second distances from the target area of the electronic equipment shell, and the first distances are smaller than the second distances;
processing the at least two first temperature values to obtain a second temperature value, wherein the second temperature value represents a temperature value at a second position of the electronic equipment; wherein the second location has a third distance from the target area, the third distance being less than the second distance;
and controlling a heat dissipation device of the electronic equipment at least based on the second temperature value.
In the method, preferably, the target area is a first area corresponding to an input device on the electronic device housing;
and/or the presence of a gas in the gas,
the target area is a second area on the electronic device housing, which is in contact with a target object for maintaining the stability of the electronic device.
The above method, preferably, further comprises:
acquiring sensing parameters acquired by a first sensor and a second sensor in the electronic equipment; the sensing parameters acquired by the first sensor can represent whether the input device receives an input signal, and the sensing parameters acquired by the second sensor can represent whether the electronic equipment is in a motion state;
when the sensing parameter acquired by the first sensor indicates that the input device receives the input signal and the sensing parameter acquired by the second sensor indicates that the electronic equipment is in a non-motion state, the second temperature value indicates a temperature value at a second position having the third distance from the first area, so that the second temperature value is used for controlling a heat sink of the electronic equipment;
and under the condition that the sensing parameters acquired by the first sensor indicate that the input device does not receive the input signal and the sensing parameters acquired by the second sensor indicate that the electronic equipment is in the motion state, the second temperature value indicates a temperature value at a second position having the third distance from the second area, so that the second temperature value is used for controlling a heat dissipation device of the electronic equipment.
In the above method, preferably, when the sensing parameter acquired by the first sensor indicates that the input device receives the input signal and the sensing parameter acquired by the second sensor indicates that the electronic device is in the motion state, the second temperature value includes: a first target temperature value indicative of a second location at the third distance from the first zone and a second target temperature value indicative of a second location at the third distance from the second zone;
wherein controlling a heat sink of the electronic device based on at least the second temperature value comprises:
and controlling a heat dissipation device of the electronic equipment at least according to the first target temperature value and the second target temperature value.
Preferably, the method for controlling the heat dissipation device of the electronic device according to the first target temperature value and the second target temperature value includes:
and controlling a heat dissipation device of the electronic equipment based on the target temperature value meeting the control condition in the first target temperature value and the second target temperature value.
Preferably, the processing the at least two first temperature values to obtain the second temperature value includes:
processing the at least two first temperature values by using a temperature conversion algorithm to obtain a second temperature value;
the temperature conversion algorithm at least comprises a plurality of conversion parameters, and the conversion parameters are related to the association relationship between the first position and the second position.
The above method, preferably, further comprises:
obtaining the plurality of conversion parameters corresponding to the association relationship in a parameter set according to the association relationship between the first position and the second position;
wherein the conversion parameters in the parameter set are obtained by the following steps:
obtaining at least two first historical temperature values at the first location and a second historical temperature value at the second location at any one of a plurality of times;
and obtaining a conversion parameter converted from the at least two first historical temperature values to the second historical temperature value according to the at least two first historical temperature values and the second historical temperature value.
Preferably, the method for controlling the heat dissipation device of the electronic device based on at least the second temperature value includes:
controlling the heat dissipation parameter of the heat dissipation device of the electronic equipment to be matched with the second temperature value;
alternatively, the first and second electrodes may be,
controlling a heat sink of the electronic device based on at least the second temperature value, comprising:
controlling the heat dissipation parameter of the heat dissipation device of the electronic equipment to be a first parameter under the condition that the second temperature value is greater than the temperature threshold value;
and controlling the heat dissipation parameter of the heat dissipation device of the electronic equipment to be a second parameter when the second temperature value is less than or equal to the temperature threshold value.
A control device, comprising:
the temperature acquisition unit is used for acquiring at least two first temperature values by utilizing at least two temperature sensors arranged on at least two first positions of the electronic equipment; the first positions have first distances from the corresponding heating devices respectively, the first positions have second distances from the target area of the electronic equipment shell, and the first distances are smaller than the second distances;
the temperature processing unit is used for processing the at least two first temperature values to obtain a second temperature value, and the second temperature value represents a temperature value at a second position of the electronic equipment; wherein the second location has a third distance from the target area, the third distance being less than the second distance;
and the heat dissipation control unit is used for controlling a heat dissipation device of the electronic equipment at least based on the second temperature value.
An electronic device, comprising:
a housing having a target area thereon;
at least two heat generating devices;
a heat sink for dissipating heat from the heat generating device;
the temperature sensors are arranged on at least two first positions of the electronic equipment and used for acquiring first temperature values on the first positions, wherein the first positions have first distances from the corresponding heating devices, the first positions have second distances from the target area, and the first distances are smaller than the second distances;
the controller is used for obtaining at least two first temperature values, processing the at least two first temperature values and obtaining a second temperature value, wherein the second temperature value represents a temperature value at a second position of the electronic equipment; wherein the second location has a third distance from the target area, the third distance being less than the second distance; and controlling the heat dissipation device at least based on the second temperature value.
According to the scheme, in the control method, the control device and the electronic equipment, the first temperature value on the first position corresponding to the heating device is used for generating the second temperature value on the second position corresponding to the target area of the shell, and the heat dissipation device is accurately controlled based on the second temperature value relatively close to the target area of the shell, namely the heat dissipation device is controlled according to the temperature value on the position corresponding to the target area which can be sensed, so that the control effect that the temperature sensed by a user of the electronic equipment is matched with the heat dissipation state of the heat dissipation device is formed, and the use experience of the user on the electronic equipment is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic diagram of a notebook computer with heat dissipation;
fig. 2 is a flowchart of a control method according to an embodiment of the present application;
FIGS. 3-9 are exemplary diagrams of embodiments of the present application, respectively;
FIG. 10 is a partial flow chart of a control method according to an embodiment of the present application;
fig. 11 is a schematic structural diagram of a control device according to a second embodiment of the present application;
fig. 12 is another schematic structural diagram of a control device according to a second embodiment of the present application;
fig. 13 is a schematic structural diagram of an electronic device according to a third embodiment of the present application.
Detailed Description
Taking the heat dissipation control of the notebook computer as an example, as shown in fig. 1, the notebook computer contains a heat generating device such as a Central Processing Unit (CPU) and a Graphics Processing Unit (GPU), and in order to enable the functions of the notebook computer such as video viewing, document editing, video conference, and the like to normally operate, a heat dissipating device such as a fan or a heat dissipating fin needs to be installed on the heat generating device.
When the heat dissipation control is specifically realized, a temperature sensor such as a thermometer is generally configured for the heating device, and then after the temperature value around the heating device is acquired, the heat dissipation parameters of the heat dissipation device such as the rotating speed of a fan or the flow rate of a heat dissipation medium are controlled according to the temperature value, so that the purpose of heat dissipation is achieved.
However, when the user uses the electronic device, the user directly touches not the heat generating device itself but a position or an area having a certain distance from the heat generating device, such as a palm rest area of a keyboard accessory on a notebook, the user's palm or wrist directly touches, or the bottom of the notebook, the user's leg directly touches the bottom, but not the processor. However, it takes a certain time for the heat of the heat generating device to be transferred to the area contacted by the user, so that the situation that the heat generated by the user is not matched with the heat dissipation control effect of the electronic device due to the delay of the heat transfer exists, for example, in the process of performing heat dissipation control on the notebook computer, the user feels that the notebook computer has not reached a high temperature but the high-speed operation noise of the notebook computer fan is large (the heat generating device is heated but not transferred to the user contact area), and for example, the user feels that the notebook computer is at a high temperature but the notebook computer fan is no longer in high-speed operation (the temperature of the heat generating device is reduced but the temperature of the user contact area is not reduced), so that poor use experience can be brought to the user in the heat dissipation scheme.
In order to solve the above problems, the inventors of the present application have further studied and found that: after the electronic equipment such as a notebook computer leaves a factory, distances between various heating devices in the corresponding electronic equipment and a shell of the electronic equipment and heat transfer media related between the various heating devices are fixed, so that the time delay of heat emitted by the heating devices reaching the shell and the temperature change state generated by the shell are regular, and therefore, the inventor of the application provides a control scheme capable of controlling a heat dissipation device of the electronic equipment, and at least two first temperature values are obtained by utilizing at least two temperature sensors arranged on at least two first positions of the electronic equipment; the first positions are respectively provided with a first distance from the corresponding heating devices, the first positions are respectively provided with a second distance from the target area of the shell of the electronic equipment, and the first distances are smaller than the second distances; then processing the at least two first temperature values to obtain a second temperature value, wherein the second temperature value represents a temperature value at a second position of the electronic equipment; the second position has a third distance with the target area, and the third distance is smaller than the second distance; and then controlling the heat dissipation device of the electronic equipment based on at least the second temperature value.
That is to say, the control scheme of the application is that a first temperature value on a first position corresponding to the heating device is used for generating a second temperature value on a second position corresponding to the target area of the housing, and then the heat dissipation device is accurately controlled based on the second temperature value relatively close to the target area of the housing, that is, the heat dissipation device is controlled according to the temperature value on the position corresponding to the target area which can be sensed by a user, so that a control effect that the sensed temperature of the equipment is matched with the heat dissipation state of the heat dissipation device by the user is achieved.
In a specific implementation, the target area of the housing is an area on the first side and/or the second side of the housing, and the first side is opposite to the second side. For example, the target area may be a first area on the electronic device housing corresponding to the input device, i.e., an area on the first side; and/or the target area may be a second area of the electronic device housing that is in contact with a target that maintains the stability of the electronic device, i.e., an area on the second side.
Based on the implementation, in the technical scheme of the application, the mode of controlling the heat dissipation device can be selected based on the sensing parameters acquired by the first sensor and the second sensor in the electronic equipment; the sensing parameters acquired by the first sensor can represent whether the input device receives an input signal, and the sensing parameters acquired by the second sensor can represent whether the electronic equipment is in a motion state;
for example, when the sensing parameter collected by the first sensor indicates that the input device receives the input signal and the sensing parameter collected by the second sensor indicates that the electronic device is in the non-motion state, the second temperature value indicates a temperature value at a second position having a third distance from the first area, so that the second temperature value is used for controlling a heat sink of the electronic device;
when the sensing parameter representation input device acquired by the first sensor does not receive the input signal and the sensing parameter representation electronic equipment acquired by the second sensor is in a motion state, the second temperature value represents a temperature value at a second position having a third distance from the second area, so that the second temperature value is used for controlling a heat dissipation device of the electronic equipment;
in addition, when the sensing parameter collected by the first sensor indicates that the input device receives the input signal and the sensing parameter collected by the second sensor indicates that the electronic device is in the motion state, the second temperature value includes: characterizing the first target temperature value at a second location a third distance from the first zone and characterizing the second target temperature value at a second location a third distance from the second zone;
correspondingly, when controlling the heat dissipation device of the electronic device based on at least the second temperature value, the method specifically includes:
the method includes controlling a heat sink of the electronic device at least according to a first target temperature value and a second target temperature value, for example, controlling the heat sink of the electronic device based on a target temperature value that satisfies a control condition, such as a higher or lower target temperature value, of the first target temperature value and the second target temperature value.
In an implementation manner, in the technical scheme of the application, at least two first temperature values can be processed by using a temperature conversion algorithm to obtain a second temperature value; the temperature conversion algorithm at least comprises a plurality of conversion parameters, and the conversion parameters are related to the incidence relation between the first position and the second position. And the association relationship includes: a spatial distance and/or a spatial medium between the first location and the second location.
Based on this, in the technical scheme of the application, a plurality of conversion parameters corresponding to the association relationship can be obtained in the parameter set according to the association relationship between the first position and the second position;
and the scaling parameters in the parameter set can be obtained by:
obtaining at least two first historical temperature values at a first location and a second historical temperature value at a second location at any one of a plurality of times; and obtaining a conversion parameter converted from the at least two first historical temperature values to the second historical temperature value according to the at least two first historical temperature values and the second historical temperature value.
In the concrete implementation, at least based on the second temperature value, control the heat abstractor of the electronic equipment, including: controlling the heat dissipation parameter of the heat dissipation device of the electronic equipment to be matched with the second temperature value;
or, in another implementation, controlling a heat dissipation device of the electronic device based on at least the second temperature value includes: controlling the heat dissipation parameter of the heat dissipation device of the electronic equipment to be a first parameter under the condition that the second temperature value is greater than the temperature threshold value; and controlling the heat dissipation parameter of the heat dissipation device of the electronic equipment to be a second parameter when the second temperature value is less than or equal to the temperature threshold value.
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 2, a flowchart of an implementation of a control method provided in an embodiment of the present application is shown, where the method is applied to an electronic device having a heat generating device and a heat dissipating device, such as an electronic device like a mobile phone, a pad, or a notebook. The technical scheme in the embodiment is mainly used for improving the heat dissipation control effect of the electronic equipment.
In a specific implementation, the control method in this embodiment may include the following steps:
step 201: at least two first temperature values are obtained by means of at least two temperature sensors arranged at least two first locations of the electronic device.
Wherein the first positions have a first distance from the respective corresponding heat generating devices, as shown in fig. 3, and the first positions a have a second distance from the target area M of the electronic device housing, the first distance being smaller than the second distance. That is to say, the temperature sensor is disposed at a first position close to the corresponding heat generating device, based on which, in this embodiment, the temperature near the heat generating device is collected to obtain a first temperature value corresponding to each heat generating device, and the first temperature value may be regarded as a current temperature value of the heat generating device.
It should be noted that, in this embodiment, one temperature sensor is configured for each heat generating device, and accordingly, a first distance is formed between each temperature sensor and its corresponding heat generating device.
Step 202: and processing the at least two first temperature values to obtain a second temperature value.
As shown in fig. 3, in this embodiment, according to the first temperature value corresponding to the heat generating device, the second temperature value at the position closer to the target area of the housing is obtained, that is, the distance from the target area is smaller than the temperature value at the second position B between the target area and the first position, and the second temperature value at this time is closer to the temperature value of the target area M that may be contacted.
Step 203: and controlling a heat dissipation device of the electronic equipment at least based on the second temperature value.
The heat dissipation device can be a fan, a heat dissipation fin or a liquid heat dissipation device in the electronic equipment, and can dissipate heat of the heating device. Based on the above implementation, in this embodiment, the second temperature value closer to the target area that may be contacted is used as the reference data for the heat dissipation control, and the heat dissipation parameters, such as the rotation speed of the fan, the vibration amplitude and frequency of the heat sink, or the flow rate of the heat dissipation medium in the liquid heat dissipation device, are correspondingly adjusted according to the second temperature value, so that the heat perception on the target area is matched with the heat dissipation state of the heat dissipation device on the basis of implementing the heat dissipation of the heat dissipation device on the heating device. For example, if the temperature value sensed by the user on the target area is high, the fan is controlled to operate at a high speed, and if the temperature value sensed by the user on the target area is not high, the fan is controlled to operate at a low speed.
According to the above scheme, in the control method provided in the first embodiment of the present application, the first temperature value at the first position corresponding to the heating device is used to generate the second temperature value at the second position corresponding to the target area of the casing, and then the heat dissipation device is accurately controlled based on the second temperature value relatively close to the target area of the casing, that is, the heat dissipation device is controlled according to the temperature value at the position corresponding to the target area to be sensed, so that a control effect that the temperature sensed by the user of the electronic device is matched with the heat dissipation state of the heat dissipation device is formed, thereby improving the user experience of the electronic device.
In a specific implementation, the target area may be any area on the housing that may be contacted, specifically, the target area may be an area on the first side surface and/or the second side surface of the housing, the first side surface is opposite to the second side surface, and a heat generating device, a temperature sensor, a heat dissipating device, and the like of the electronic device are disposed between the first side surface and the second side surface. For example:
in one case, the target area on the housing may be a first area on the housing of the electronic device corresponding to the input device, as shown in fig. 4, the input device may be a device such as a keyboard or a touch screen, the first area is an area that a user may contact when performing an input operation using the input device, such as a palm rest area, and based on this, the obtained second temperature value is a temperature value at a second position close to the first area;
in another case, the target area on the housing may be a second area on the electronic device housing that is in contact with a target that maintains the stability of the electronic device. As shown in fig. 5, the object for maintaining the stability of the electronic device refers to an object, such as a desktop or a leg of a person, which can fix or relatively stably place the electronic device in a certain area or position, and the second area is an area, such as a notebook D-side area or a pad back-side area, which is touched by the electronic device after the user places the electronic device when using the electronic device. Based on this, the second temperature value obtained in this embodiment is a temperature value at a second position close to the second area.
In another case, the target area on the housing may include two or more areas, for example, the target area includes both a first area on the electronic device housing corresponding to the input device and a second area on the electronic device housing contacting with an object for maintaining the electronic device stable, as shown in fig. 6, based on which the second temperature value obtained in this embodiment includes both a temperature value at a second position close to the first area and a temperature value at a second position close to the second area.
Based on the above situations, in this embodiment, when the heat dissipation control is specifically implemented, the sensor configured in the electronic device may be used to obtain the corresponding sensing parameter. For example, the sensing parameters collected by the first sensor are obtained, and the sensing parameters collected by the second sensor are obtained, where the first sensor may be a sensor configured for an input device in the electronic device, such as a capacitance sensor, to monitor whether the input device is performing an input operation, such as a user typing in a text, and thus the sensing parameters collected by the first sensor can indicate whether the input device receives an input signal, and the second sensor may be a gravity sensor or an acceleration sensor, to monitor whether the electronic device is in a motion state, such as a notebook is placed on a human leg, and thus the sensing parameters collected by the second sensor can indicate whether the electronic device is in a motion state. Then, the states represented by the sensing parameters are judged to determine a specific heat dissipation control mode, which is as follows:
in one implementation, when the sensing parameter collected by the first sensor indicates that the input device receives the input signal and the sensing parameter collected by the second sensor indicates that the electronic device is in the non-motion state, the second temperature value indicates a temperature value at a second position having a third distance from the first area, so that the second temperature value is used for controlling a heat sink of the electronic device. That is to say, when it is monitored that the input device on the electronic apparatus is in the relatively stationary state while the input device on the electronic apparatus is in the input operation, it indicates that the user of the electronic apparatus may perform the keyboard input operation by placing the electronic apparatus on the relatively stationary desktop, at this time, in this embodiment, the first area corresponding to the input device is used as the target area of the housing, and the second temperature value at the second position close to the first area is used as the reference data to control the heat dissipation device of the electronic apparatus. For example, as shown in fig. 7, the target area is a palm rest area corresponding to a keyboard on the C-side of the notebook, at this time, in this embodiment, a first temperature value acquired by the temperature sensor at the first position is processed to obtain a second temperature value at a second position close to the palm rest area, and the heat dissipation device is controlled based on the second temperature value at the position close to the palm rest area, so that a control effect that the temperature sensed on the wrist of the user performing input operation by using the keyboard matches the heat dissipation state of the heat dissipation device is formed;
in another implementation, when the sensing parameter collected by the first sensor indicates that the input device does not receive the input signal and the sensing parameter collected by the second sensor indicates that the electronic device is in the motion state, the second temperature value indicates a temperature value at a second position having a third distance from the second area, so that the second temperature value is used for controlling a heat sink of the electronic device. That is, when it is monitored that the input device on the electronic device is not operated to input and the electronic device is in a state of relative motion, it indicates that the user of the electronic device may perform operations such as video playing or image browsing on the bottom of the electronic device, such as placing the electronic device on a leg (for example, on a jerky or bumpy) or holding the electronic device in a hand, and at this time, the user does not operate to input the input device. For example, as shown in fig. 8, the target area is a bottom area of the D-surface of the notebook, in this embodiment, a first temperature value collected by the temperature sensor at the first position is processed to obtain a second temperature value at a second position close to the bottom area, and the heat dissipation device is controlled based on the second temperature value at the position close to the bottom area, so that a control effect that a temperature sensed by the legs of a user who stably supports the notebook for video viewing matches a heat dissipation state of the heat dissipation device is achieved.
In another implementation, in a case that the sensing parameter collected by the first sensor indicates that the input device receives the input signal and the sensing parameter collected by the second sensor indicates that the electronic device is in the motion state, the second temperature value includes: a first target temperature value indicative of a second location at a third distance from the first zone and a second target temperature value indicative of a second location at a third distance from the second zone.
It should be noted that, the first target temperature value and the second target temperature value may be different because the corresponding second positions are different, and the space distances between the corresponding second positions and the heat generating device are different, and in addition, the space medium, i.e., the heat conducting medium, between the corresponding second positions and the heat generating device may also be different, and so on. Taking a notebook as an example, if a heat generating device such as a processor in the notebook structure is close to a housing on one side of the input device, the first target temperature value at the second position close to the first area is generally higher than the second target temperature value at the second position close to the second area; alternatively, if the input device in the notebook result is a structure with slits, which can achieve a certain heat dissipation effect, the first target temperature value at the second position close to the first area is usually lower than the second target temperature value at the second position close to the second area.
Based on this, in this embodiment, when the step 203 controls the heat dissipation device of the electronic device based on at least the second temperature value, the following method is specifically implemented:
and controlling a heat dissipation device of the electronic equipment at least according to the first target temperature value and the second target temperature value.
For example, in this embodiment, a first target temperature value and a second target temperature value are considered comprehensively, and a heat dissipation device of the electronic device is controlled based on a target temperature value that satisfies a control condition in the first target temperature value and the second target temperature value.
That is, in this embodiment, when it is monitored that an input operation is performed on an input device on the electronic apparatus and the electronic apparatus is in a state of relative motion, it is described that a user of the electronic apparatus may place the electronic apparatus on a leg and perform the input operation on the input device, in this embodiment, a first region corresponding to the input device and a second region at a position where an object for maintaining stability of the electronic apparatus, such as a leg, are taken together as a target region of the housing, and accordingly, in this embodiment, a first target temperature value at a second position close to the first region and a second target temperature value at a second position close to the second region are taken as reference data to control the heat sink of the electronic apparatus together. For example, as shown in fig. 9, the target area includes both a palm rest area corresponding to a keyboard on the C-side of the notebook and a bottom area of the D-side of the notebook, and at this time, in this embodiment, a first target temperature value at a second position close to the palm rest area and a second target temperature value at a second position close to the bottom area are obtained by processing based on a first temperature value acquired by a temperature sensor at the first position, and then the heat dissipation device is controlled based on the first target temperature value and the second target temperature value, so that a control effect that the temperature sensed on the legs and wrists of the user who stably supports the notebook with the legs for keyboard input matches the heat dissipation state of the heat dissipation device is achieved.
In a specific implementation, in this embodiment, a temperature value meeting a control condition is selected from the first target temperature value and the second target temperature value to control the heat dissipation device, as follows:
if the control conditions are as follows: if the first target temperature value is selected, the control condition may indicate that the heat dissipation control effect perceived by the user on the first area needs to be improved, and then the first target temperature value of the two target temperature values is selected in this embodiment to perform heat dissipation control on the heat dissipation device.
If the control conditions are as follows: if the second target temperature value is selected, the control condition may indicate that the heat dissipation control effect perceived by the user on the second area needs to be improved, and then the second target temperature value of the two target temperature values is selected to perform heat dissipation control on the heat dissipation device in this embodiment.
Or:
if the control conditions are as follows: selecting a higher target temperature value, wherein the control condition may represent that the sensitivity of heat dissipation control needs to be improved and the heat dissipation effect needs to be enhanced, and because the higher target temperature value is selected as the reference data of the heat dissipation device, the target temperature value which is easy to rise can meet the heat dissipation condition of the heat dissipation device firstly, and if the target temperature value is higher than the heat dissipation threshold value, the heat dissipation control is performed on the heat dissipation device, so that the purposes of improving the sensitivity of the heat dissipation control and enhancing the heat dissipation effect are achieved;
if the control conditions are as follows: if a lower target temperature value is selected, the control condition may indicate that the load of the heat dissipation device needs to be reduced, because the lower target temperature value is selected as the reference data of the heat dissipation device, the target temperature value which is not easy to increase may meet the heat dissipation condition of the heat dissipation device later, for example, the heat dissipation control may be performed on the heat dissipation device only when the target temperature value which is not easy to increase increases to a heat dissipation threshold value, thereby achieving the purpose of reducing the load of the heat dissipation device.
In an implementation manner, when the at least two first temperature values are processed to obtain the second temperature value in step 202 of this embodiment, the at least two first temperature values may be processed by using a temperature scaling algorithm to obtain the second temperature value.
The temperature conversion algorithm at least comprises a plurality of conversion parameters, and the conversion parameters are related to the incidence relation between the first position and the second position. Based on this, in practical implementation, in accordance with the association relationship between the first position and the second position, a plurality of conversion parameters corresponding to the association relationship may be obtained in the parameter set.
The association relationship means: the spatial distance and/or the spatial medium between the first and the second position, i.e. the scaling parameter is related to the distance and/or the medium of the space between the first and the second position at which the heat transfer is possible, the spatial distance between the first and the second position being different and/or the spatial medium between the first and the second position being different, the respective scaling parameters being different.
And the scaling parameters in the parameter set are obtained by:
step 1001: at least two first historical temperature values at a first location and a second historical temperature value at a second location at any one of a plurality of times are obtained.
That is to say, in this embodiment, historical temperature data generated by testing the electronic device may be obtained in advance, so as to obtain a plurality of sets of temperature data, where each set of temperature data includes at least two first historical temperature values at a first position at a corresponding time and a second historical temperature value at a second position at the time.
In a specific implementation, in this embodiment, the infrared camera and other devices may be used to detect the temperature of the electronic device at multiple times within one hour or other duration, so as to obtain the multiple sets of temperature data.
Step 1002: and obtaining a conversion parameter converted from the at least two first historical temperature values to the second historical temperature value according to the at least two first historical temperature values and the second historical temperature value.
In this embodiment, the conversion parameter for converting the first historical temperature value into the second historical temperature value may be obtained by analyzing the corresponding relationship between the first historical temperature value and the second historical temperature value.
In a specific implementation, in this embodiment, a multiple equation, such as a multiple equation with x1, x2 and the like as independent variables and y as dependent variables, may be preset by using a regression algorithm, and coefficients and constants of respective variables in the multiple equation are initialized, and then at least two first historical temperature values and second historical temperature values in each set of temperature data are substituted into the multiple equation as independent variables x1, x2 and the like and dependent variable y, respectively, and the coefficients and constants in the multiple equation are optimized until they tend to be unchanged, so that the coefficients and constants of the optimized multiple equation obtained thereby are conversion parameters.
Based on this, in this embodiment, a multivariate equation, that is, a temperature scaling algorithm, may be constructed based on the scaling parameter, and when the second temperature value is obtained, at least two obtained first temperature values may be input as arguments into the multivariate equation having the optimized coefficient and constant, and then the multivariate equation is calculated to obtain an output result of the multivariate equation, that is, the second temperature value.
It should be noted that the number of the first historical temperature values is consistent with the number of the independent variables in the multivariate equation, and the number of the first temperature values is also consistent with the number of the independent variables in the multivariate equation.
In a specific implementation, when the step 203 of this embodiment controls the heat dissipation device of the electronic device based on at least the second temperature value, the following different manners may be specifically implemented:
in one implementation, in this embodiment, the heat dissipation parameter of the heat dissipation device of the electronic device may be controlled to match the second temperature value; specifically, a parameter list including a plurality of standard parameters may be set in advance for the heat dissipation device, each standard parameter corresponds to one temperature threshold, in this embodiment, after the second temperature value is obtained, the standard parameter matched with the second temperature value is obtained through table lookup, and then the current heat dissipation parameter of the heat dissipation device is controlled to be consistent with the standard parameter.
For example, in this embodiment, a linear matching list is set for the fan of the notebook computer, and then according to each standard rotation speed parameter in the linear matching list, the current rotation speed of the fan is controlled to be consistent with the standard rotation speed parameter matched with the second temperature value, the higher the second temperature value is, the larger the corresponding standard rotation speed parameter is, the larger the rotation speed adjusted by the corresponding fan is, thereby implementing linear control of the heat dissipation device.
In another implementation, in this embodiment, the heat dissipation parameter of the heat dissipation device of the electronic device may be controlled to be the first parameter when the second temperature value is greater than the temperature threshold; and under the condition that the second temperature value is less than or equal to the temperature threshold value, controlling the heat dissipation parameter of the heat dissipation device of the electronic equipment to be the second parameter, wherein the heat dissipation effect of the heat dissipation device under the first parameter is higher than the heat dissipation effect of the heat dissipation device under the second parameter, for example, the heat dissipation effect of the fan under the rotating speed parameter of 200 revolutions per second is better than the heat dissipation effect of the fan under the rotating speed parameter of 100 revolutions per second. That is to say, in this embodiment, a temperature threshold and a standard parameter related to the temperature threshold are set in advance for the heat dissipation device, in this embodiment, after the second temperature value is obtained, by determining the magnitude between the second temperature value and the temperature threshold, if the second temperature value has exceeded the temperature threshold, the current heat dissipation parameter of the heat dissipation device is controlled to be the corresponding first parameter, so as to enhance the heat dissipation effect; and if the second temperature value is still smaller than the temperature threshold value, controlling the current heat dissipation parameter of the heat dissipation device to be the corresponding second parameter so as to reduce the load of the heat dissipation device.
For example, in this embodiment, a 37-degree threshold is set for the fan of the notebook, and according to the threshold, the fan is controlled to perform heat dissipation at a high or low rotation speed, if the temperature is higher than 37 degrees, the fan is controlled to operate at a high rotation speed to enhance heat dissipation, and if the temperature is lower than 37 degrees, the fan is controlled to operate at a low rotation speed to reduce energy consumption of the fan and reduce load.
Referring to fig. 11, a schematic structural diagram of a control device according to a second embodiment of the present disclosure is provided, where the control device may be configured in an electronic device having a heat generating device and a heat dissipating device, such as an electronic device like a mobile phone, a pad, or a notebook. The technical scheme in the embodiment is mainly used for improving the heat dissipation control effect of the electronic equipment.
In a specific implementation, the control device in this embodiment may include the following structure:
a temperature acquisition unit 1101 for obtaining at least two first temperature values by using at least two temperature sensors disposed at least two first locations of the electronic device; the first positions are respectively provided with a first distance from the corresponding heating devices, the first positions are respectively provided with a second distance from the target area of the shell of the electronic equipment, and the first distances are smaller than the second distances;
the temperature processing unit 1102 is configured to process at least two first temperature values to obtain a second temperature value, where the second temperature value represents a temperature value at a second location of the electronic device; the second position has a third distance with the target area, and the third distance is smaller than the second distance;
a heat dissipation control unit 1103, configured to control a heat dissipation apparatus of the electronic device based on at least the second temperature value.
According to the above scheme, in the control device provided in the second embodiment of the present application, the first temperature value at the first position corresponding to the heating device is used to generate the second temperature value at the second position corresponding to the target area of the casing, and the heat dissipation device is accurately controlled based on the second temperature value relatively close to the target area of the casing, that is, the heat dissipation device is controlled according to the temperature value at the position corresponding to the target area to be sensed, so that a control effect that the temperature sensed by the user of the electronic device is matched with the heat dissipation state of the heat dissipation device is formed, and the use experience of the user on the electronic device is improved.
In a specific implementation, the target area is a first area corresponding to an input device on the electronic device shell; and/or the target area is a second area on the electronic equipment shell, which is in contact with a target object for maintaining the stability of the electronic equipment.
In one implementation, the apparatus in this embodiment may further include the following structure, as shown in fig. 12:
a parameter obtaining unit 1104, configured to obtain sensing parameters acquired by a first sensor and a second sensor in the electronic device; the sensing parameters acquired by the first sensor can represent whether the input device receives an input signal, and the sensing parameters acquired by the second sensor can represent whether the electronic equipment is in a motion state;
when the sensing parameter acquired by the first sensor indicates that the input device receives an input signal and the sensing parameter acquired by the second sensor indicates that the electronic device is in a non-motion state, the second temperature value indicates a temperature value at a second position having the third distance from the first area, so that the heat dissipation control unit 1103 controls the heat dissipation device of the electronic device with the second temperature value;
when the sensing parameter acquired by the first sensor indicates that the input device does not receive an input signal and the sensing parameter acquired by the second sensor indicates that the electronic device is in a motion state, the second temperature value indicates a temperature value at a second position having the third distance from the second area, so that the heat dissipation control unit 1103 controls the heat dissipation device of the electronic device with the second temperature value.
When the sensing parameter collected by the first sensor indicates that the input device receives the input signal and the sensing parameter collected by the second sensor indicates that the electronic equipment is in the motion state, the second temperature value includes: a first target temperature value indicative of a second location at the third distance from the first zone and a second target temperature value indicative of a second location at the third distance from the second zone;
the heat dissipation control unit 1103 is specifically configured to: and controlling a heat dissipation device of the electronic equipment at least according to the first target temperature value and the second target temperature value. For example, the heat dissipation device of the electronic device is controlled based on a target temperature value that satisfies a control condition, from among the first target temperature value and the second target temperature value.
In a specific implementation, the temperature processing unit 1102 processes the at least two first temperature values, and obtains a second temperature value specifically used for: processing the at least two first temperature values by using a temperature conversion algorithm to obtain a second temperature value; the temperature conversion algorithm at least comprises a plurality of conversion parameters, and the conversion parameters are related to the association relationship between the first position and the second position.
In one implementation, the apparatus in this embodiment may further include the following structure, as shown in fig. 12:
a parameter processing unit 1105, configured to obtain, in a parameter set, the plurality of conversion parameters corresponding to the association relationship according to the association relationship between the first location and the second location;
the parameter processing unit 1105 is further configured to: obtaining at least two first historical temperature values at the first location and a second historical temperature value at the second location at any one of a plurality of times; and obtaining a conversion parameter converted from the at least two first historical temperature values to the second historical temperature value according to the at least two first historical temperature values and the second historical temperature value.
In an implementation manner, the heat dissipation control unit 1103 is specifically configured to control a heat dissipation parameter of a heat dissipation device of the electronic device to match the second temperature value; alternatively, the heat dissipation control unit 1103 is specifically configured to control the heat dissipation parameter of the heat dissipation device of the electronic device to be the first parameter when the second temperature value is greater than the temperature threshold; and controlling the heat dissipation parameter of the heat dissipation device of the electronic equipment to be a second parameter when the second temperature value is less than or equal to the temperature threshold value.
It should be noted that, the specific implementation of each unit in the present embodiment may refer to the foregoing content, and is not described in detail here.
Referring to fig. 13, which is a schematic structural diagram of an electronic device according to a third embodiment of the present disclosure, the electronic device in the third embodiment may be an electronic device having a heat generating device and a heat dissipating device, such as an electronic device like a mobile phone, a pad, or a notebook. The technical scheme in the embodiment is mainly used for improving the heat dissipation control effect of the electronic equipment.
In a specific implementation, the electronic device in this embodiment may include the following structure:
a housing 1301, wherein the housing 1301 is provided with a target area M;
at least two heat generating devices 1302;
a heat sink 1303 for dissipating heat of the heat generating device 1302;
at least two temperature sensors 1304, disposed on at least two first positions a of the electronic device, for acquiring first temperature values at the first positions a, where the first positions have first distances from the respective corresponding heat generating devices 1302, the first positions a have second distances from the target area M, and the first distances are smaller than the second distances;
the controller 1305 is configured to obtain at least two first temperature values, process the at least two first temperature values, and obtain a second temperature value, where the second temperature value represents a temperature value at a second location B of the electronic device; the second position B has a third distance with the target area M, and the third distance is smaller than the second distance; and controlling the heat dissipation device 1303 at least based on the second temperature value.
According to the above scheme, in the electronic device provided in the third embodiment of the present application, the first temperature value at the first position corresponding to the heating device is used to generate the second temperature value at the second position corresponding to the target area of the housing, and the heat dissipation device is accurately controlled based on the second temperature value relatively close to the target area of the housing, that is, the heat dissipation device is controlled according to the temperature value at the position corresponding to the target area to be sensed, so that a control effect that the temperature sensed by the user of the electronic device is matched with the heat dissipation state of the heat dissipation device is formed, and the use experience of the user on the electronic device is improved.
It should be noted that, the specific implementation of the controller in this embodiment may refer to the corresponding content in the foregoing, and is not described in detail here.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative components and steps have been described above generally in terms of their functionality in order to clearly illustrate this interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in Random Access Memory (RAM), memory, Read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A control method, comprising:
obtaining at least two first temperature values by using at least two temperature sensors arranged on at least two first positions of the electronic equipment; the first positions have first distances from the corresponding heating devices respectively, the first positions have second distances from the target area of the electronic equipment shell, and the first distances are smaller than the second distances;
processing the at least two first temperature values to obtain a second temperature value, wherein the second temperature value represents a temperature value at a second position of the electronic equipment; wherein the second location has a third distance from the target area, the third distance being less than the second distance;
and controlling a heat dissipation device of the electronic equipment at least based on the second temperature value.
2. The method of claim 1, the target area being a first area on the electronic device housing corresponding to an input device;
and/or the presence of a gas in the gas,
the target area is a second area on the electronic device housing, which is in contact with a target object for maintaining the stability of the electronic device.
3. The method of claim 2, further comprising:
acquiring sensing parameters acquired by a first sensor and a second sensor in the electronic equipment; the sensing parameters acquired by the first sensor can represent whether the input device receives an input signal, and the sensing parameters acquired by the second sensor can represent whether the electronic equipment is in a motion state;
when the sensing parameter acquired by the first sensor indicates that the input device receives the input signal and the sensing parameter acquired by the second sensor indicates that the electronic equipment is in a non-motion state, the second temperature value indicates a temperature value at a second position having the third distance from the first area, so that the second temperature value is used for controlling a heat sink of the electronic equipment;
and under the condition that the sensing parameters acquired by the first sensor indicate that the input device does not receive the input signal and the sensing parameters acquired by the second sensor indicate that the electronic equipment is in the motion state, the second temperature value indicates a temperature value at a second position having the third distance from the second area, so that the second temperature value is used for controlling a heat dissipation device of the electronic equipment.
4. The method of claim 3, wherein the second temperature value comprises, in the case that the sensing parameter collected by the first sensor indicates that the input device receives an input signal and the sensing parameter collected by the second sensor indicates that the electronic equipment is in a motion state: a first target temperature value indicative of a second location at the third distance from the first zone and a second target temperature value indicative of a second location at the third distance from the second zone;
wherein controlling a heat sink of the electronic device based on at least the second temperature value comprises:
and controlling a heat dissipation device of the electronic equipment at least according to the first target temperature value and the second target temperature value.
5. The method of claim 4, controlling a heat sink of the electronic device according to the first target temperature value and the second target temperature value, comprising:
and controlling a heat dissipation device of the electronic equipment based on the target temperature value meeting the control condition in the first target temperature value and the second target temperature value.
6. The method of claim 1, processing the at least two first temperature values to obtain a second temperature value, comprising:
processing the at least two first temperature values by using a temperature conversion algorithm to obtain a second temperature value;
the temperature conversion algorithm at least comprises a plurality of conversion parameters, and the conversion parameters are related to the association relationship between the first position and the second position.
7. The method of claim 6, further comprising:
obtaining the plurality of conversion parameters corresponding to the association relationship in a parameter set according to the association relationship between the first position and the second position;
wherein the conversion parameters in the parameter set are obtained by the following steps:
obtaining at least two first historical temperature values at the first location and a second historical temperature value at the second location at any one of a plurality of times;
and obtaining a conversion parameter converted from the at least two first historical temperature values to the second historical temperature value according to the at least two first historical temperature values and the second historical temperature value.
8. The method of claim 1 or 2, controlling a heat sink of the electronic device based on at least the second temperature value, comprising:
controlling the heat dissipation parameter of the heat dissipation device of the electronic equipment to be matched with the second temperature value;
alternatively, the first and second electrodes may be,
controlling a heat sink of the electronic device based on at least the second temperature value, comprising:
controlling the heat dissipation parameter of the heat dissipation device of the electronic equipment to be a first parameter under the condition that the second temperature value is greater than the temperature threshold value;
and controlling the heat dissipation parameter of the heat dissipation device of the electronic equipment to be a second parameter when the second temperature value is less than or equal to the temperature threshold value.
9. A control device, comprising:
the temperature acquisition unit is used for acquiring at least two first temperature values by utilizing at least two temperature sensors arranged on at least two first positions of the electronic equipment; the first positions have first distances from the corresponding heating devices respectively, the first positions have second distances from the target area of the electronic equipment shell, and the first distances are smaller than the second distances;
the temperature processing unit is used for processing the at least two first temperature values to obtain a second temperature value, and the second temperature value represents a temperature value at a second position of the electronic equipment; wherein the second location has a third distance from the target area, the third distance being less than the second distance;
and the heat dissipation control unit is used for controlling a heat dissipation device of the electronic equipment at least based on the second temperature value.
10. An electronic device, comprising:
a housing having a target area thereon;
at least two heat generating devices;
a heat sink for dissipating heat from the heat generating device;
the temperature sensors are arranged on at least two first positions of the electronic equipment and used for acquiring first temperature values on the first positions, wherein the first positions have first distances from the corresponding heating devices, the first positions have second distances from the target area, and the first distances are smaller than the second distances;
the controller is used for obtaining at least two first temperature values, processing the at least two first temperature values and obtaining a second temperature value, wherein the second temperature value represents a temperature value at a second position of the electronic equipment; wherein the second location has a third distance from the target area, the third distance being less than the second distance; and controlling the heat dissipation device at least based on the second temperature value.
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| WO2022095925A1 (en) * | 2020-11-06 | 2022-05-12 | 中兴通讯股份有限公司 | Heat dissipation control method and apparatus, heat dissipation system, computer device and readable medium |
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