CN111434198A - 功率电子模块 - Google Patents
功率电子模块 Download PDFInfo
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Abstract
本发明涉及功率电子模块(200),包括电气连接到电气支撑件(201)的多个半导体功率电子部件(210),以及与每个部件(210)热接触的冷却装置(202),每个部件(210)位于电气支撑件(201)和冷却装置(202)之间并通过至少一个导电弹簧元件(220)而被安装在电气支撑件(201)上。
Description
背景技术
本发明涉及一种功率电子模块的生产,该功率电子模块具有高可靠性和易维护性,尤其在航空应用的情境内具有高可靠性和易维护性。
图1图示出了根据现有技术生产的功率电子模块100的结构。功率电子模块100具有基板101,该基板101由陶瓷材料制成并由电绝缘层101a布置在两个金属层101b、101c之间形成。金属层101b、101c可以根据各种技术来与电绝缘层101a组装在一起——例如通过AMB(活性金属钎焊)、通过DBC(直接敷铜)或者甚至通过DBA(直接敷铝)。基板101的上部金属层101b形成功率电路,一个或多个功率半导体部件102被组装在该功率电路上。功率半导体部件102通过互连密封件103而被组装在金属层101b上。互连密封件确保部件102与金属层101b之间的机械、电气和热接触。功率半导体部件102还通过金属接线电缆104而连接到由层101b形成的功率电路。
由于它们的缺陷,功率半导体部件102是因焦耳效应而损失的部位,并且表示重要的热源。因此,基板101的下部金属层101c经由互连密封件105而被转移到金属凸缘106上,后者被用来散布热通量并确保与金属散热器108的热连接。互连密封件105具有确保金属层101c与金属凸缘106之间的机械、电气和热接触的功能。凸缘106本身经由由热界面材料制成的层107而与金属散热器108组装在一起。层107例如是导热油脂、弹性薄膜或相变材料层。层107允许减小凸缘106和散热器108之间的接触热阻,以便确保更好地释放热通量。举例来说,散热器108提供有翅片109,使得可以使其热阻最小化,诸如空气之类的冷却剂穿过翅片109。
然而,上述功率电子模块100具有若干缺点。
首先,基板101的不同层101a、101b、101c以及凸缘106在它们之间具有不同的热膨胀系数,从而使得模块100对热疲劳现象敏感。在功率电子模块100经受的热循环期间,因此可能在基板101的电绝缘层101a中、在电气互连密封件103、105中和/或在金属接线电缆104与层101b之间的连接中出现裂纹。因此,这些裂纹风险影响模块100的可靠性。另外,金属接线电缆104的使用引发寄生电感的存在。
此外,通过互连密封件103转移功率半导体部件102以及通过金属接线电缆104连接功率半导体部件102限制了模块100的维修。功率半导体部件102的更换被证明确实非常约束。这尤其需要移除互连密封件103,对部件102断开布线,然后通过金属接线电缆104重复新部件的连接。在可能采取这些动作的情况下,因此需要多个步骤,这意味着费时和高成本的部件更换,以取得随机成功。因此,上面所描述的功率电子模块100极难维护,并且常见的解决方案包括在部件102发生故障的情况下整体上更换模块100。
此外,鉴于组装的复杂性,用于连接每个部件102的金属接线电缆104的存在限制了附加部件的添加或特定部件的更换。功率电子模块100的架构因此限制了附加部件的添加,并且因此限制了模块100可以应用的功率范围。
现有技术中已知的功率电子模块的另一种结构涉及通常以“压接(Press-Pack)”的名称指定的压制模块。在这种架构中,一个或多个功率半导体部件是直接夹在两个基板层之间的裸芯片的形式。与先前描述的架构相比,第二种架构具有若干优点。实际上,它尤其允许免除接线电缆或钎焊,对热疲劳不是非常敏感,并且允许减小寄生电感。但是,“压接”类型的架构仍然仅限于高功率部件(例如,晶闸管、门极可关断晶闸管GTO、绝缘栅双极晶体管IGBT)。此外,将功率半导体部件以类似三明治的方式安置在两层基板之间的事实可导致观察到对这些部件的不良压阻效应。另外,部件的安装被证明是精密的并且涉及高的制造成本。这种解决方案因此也被证明是有局限的。
因此,需要生产一种对热疲劳不是很敏感、易于维护、简化新部件的添加、具有易于实现的冷却系统、没有不良压阻效应的适用于任何功率范围的可靠的功率电子模块,从而降低制造成本并使寄生电感最小化。
发明内容
本发明旨在克服上述缺点。
为此,本发明提出了一种功率电子模块,包括电气连接到电气支撑件的多个半导体功率电子部件以及与每个部件热接触的冷却装置,每个部件存在于电气支撑件和冷却装置之间,每个部件还经由至少一个导电弹簧元件而被安装在电气支撑件上。
上述功率电子模块具有以下优点。弹簧元件是可缩回的并且允许部件与电气支撑件的电气连接。另外,弹簧元件在部件上施用受控的压力,从而保持其被固定。因此,相关于现有技术,免除了将涉及寄生电感和故障风险的金属接线电缆的使用以及将部件转移到互连密封件。因此,功率电子模块的可靠性得到增强。此外,通过将部件简单地支承在至少一个弹簧元件上来建立每个部件与电气支撑件之间的电气接触。每个部件与弹簧元件之间的机械和电气接触通过冷却装置施用在每个部件上的支承力而被保持。因此,在特定部件发生故障的情况下,模块可易于拆卸,故障部件通过简单的取出而是可接近的和可更换的。因此,模块具有较高的可维护性。模块的这种高可维护性允许在不涉及组装复杂性的情况下附加部件的添加或(一个或多个)部件的特定更换,从而赋予其模块化性质。因此,可以根据应用来制定各种功率范围,尤其是低功率和/或平均功率应用。
在一个示例性实施例中,每个部件包括面对电气支撑件安置的第一侧面,所述第一侧面包括电极,并且所述至少一个弹簧元件在电极中的至少一个与电气支撑件之间建立电气连接。
在一个示例性实施例中,每个部件包括与第一侧面相对的第二侧面,并且模块还包括安置在冷却装置和每个部件的第二侧面之间的热界面。
在一个示例性实施例中,在电极中的所述至少一个与电气支撑件之间建立电气连接的所述至少一个弹簧元件包括钎焊到电气支撑件的第一端。
在一个示例性实施例中,所述至少一个弹簧元件包括支承在电极中的所述至少一个上的第二端。
在一个示例性实施例中,每个部件被封装在电子表面安装的封装中。
在一个示例性实施例中,定位框架被安置在电气支撑件和冷却装置之间,并且包括通孔,每个通孔被配置为分别容纳部件和至少一个弹簧元件。
在一个示例性实施例中,至少一个所述部件是功率晶体管或功率二极管。
在一个示例性实施例中,以上概述的模块包括由多个部件形成的功率转换器。
附图说明
本发明的其他特征和优点将从参考附图并通过非限制性示例的方式给出的本发明特定实施例的以下描述中显现出来,在附图中:
-图1是根据现有技术生产的功率电子模块的截面图,
-图2是根据本发明生产的功率电子模块的截面图,
-图3图示出了可以由根据本发明生产的功率电子模块所实现的电子电路的示例,
-图4A至图4E图示出了与组装根据本发明的功率电子模块的步骤相对应的透视图,
-图5图示出了根据本发明的功率电子模块在组装之后的透视图。
具体实施方式
图2图示出了根据本发明的功率电子模块200。模块200包括电气连接到电气支撑件201的一个或多个功率电子部件210。这里以示例的方式图示出了两个部件210,可以设想完全不同数目的部件。每个功率电子部件210是半导体功率部件,或者是晶体管,或者是二极管。半导体功率电子部件210例如是JFET(结型场效应晶体管)、绝缘栅型场效应晶体管MOSFET(金属氧化物半导体场效应晶体管)、异质结构电子晶体管HEMT(高电子迁移率晶体管)、PIN二极管(正本征负二极管)或肖特基二极管。
通过示例的方式,电气支撑件201是多层基板。多层基板例如可以具有:带有印刷电路的导电层,该印刷电路包括面对(一个或多个)部件210的导电迹线;用于对部件210进行控制的中间导电层(例如:用于控制晶体管的栅极电压);和用于对部件210进行电极化的导电层,这些导电层通过绝缘层隔开。
每个部件210通过导电弹簧元件220电气连接到电气支撑件201。更具体地,每个部件210在第一侧面210a上具有面对电气支撑件201的电极210c。每个电极210c可以通过一个或多个弹簧元件220电气连接到电气支撑件201。弹簧元件220是可缩回的,并以低电阻率允许电流通过,取决于模型而通常为每个连接器10A至15A。每个弹簧元件220的第一端220a被固定到电气支撑件201。在所图示的示例中,每个弹簧元件220的每个第一端220a通过钎料221连接到电气支撑件201。每个弹簧元件220还包括第二自由端220b,第二自由端220b经由恢复力而支承在部件210的至少一个电极210c上,从而在部件210和电气支撑件201之间建立电气接触。换句话说,每个第二端220b未被固定到部件210,在部件210和第二端220b之间的简单支承使得可以确保部件210与电气支撑件201的电气连接。
在图2以及图4B至图4D中所图示的示例中,每个导电弹簧元件220是弹簧接触连接器。这种类型的连接器尤其是由Smiths公司提供的。但是,任何能够在部件210上施用机械恢复力的导电且可机械变形的元件都可以被用作弹簧元件220。
每个半导体功率电子部件210具有与第一侧面210a相对的第二侧面210b。每个部件210的第二侧面210b与冷却装置202热接触。因此,每个部件210存在于电气支撑件201和冷却装置202之间。冷却装置202例如是设置有翅片的散热器,诸如空气之类的冷却剂穿过翅片。热界面203被安置在每个第二侧面210b和冷却装置202之间,以便改善每个部件210的冷却。层203例如是导热油脂、弹性薄膜或者甚至是相变材料层,其使得可以减小每个第二侧面210b与冷却装置202之间的接触热阻。
冷却装置202在每个部件210的第二侧面210b上施用机械支承力,以便间接地保持每个部件210的第一侧面210a抵靠弹簧元件220的第二端220b进行支承。
为了保证每个部件210和电气支撑件201之间的良好电气接触,并且为了确保每个部件210和冷却装置202之间的良好热接触,机械压力装置204完成由冷却装置202施用在部件210上的机械力。
此外,为了保证部件210在弹簧元件220上的良好定位,在电气支撑件201和冷却装置202之间安置定位框架205。定位框架205包括一个或多个通孔205a。每个通孔205a被布置在定位框架205中,以容纳部件210以及将部件210电气连接到电气支撑件201的弹簧元件220。
优选地,为了优化在每个部件210的第一侧面210a上存在的电极与(一个或多个)弹簧元件220之间的电气接触,每个部件是SiP(系统级封装)的形式,也就是说被封装在表面安装的封装中。这种封装让部件仅在一侧上定位电极,并且易于用户处理。封装的部件210例如是包括控制电路的硅MOSFET晶体管、硅JFET晶体管和/或氮化镓GaN HEMT晶体管。
上面所描述的功率电子模块200可以被实现用于低功率和/或平均功率应用,尤其是用于航空应用。例如,各种功率电子模块200可以执行被用于飞机的非推进系统的电气化的功率转换功能。这些功能尤其可以覆盖用于所有类型的功率转换的飞机主网络的电源:交流转直流(AC/DC)、直流转交流(DC/AC)、交流转交流(AC/AC)或直流转直流(DC/DC)。
图3图示出了可以由功率电子模块200执行的电子功能的示例。该图中图示的电子电路具有经由三相反相器300将DC能量转换成AC能量的功能。三相反相器300由三个单相反相器臂301-i组成,其中i=1、2或3,而没有外部续流二极管。每个反相器臂301-i结合两个晶体管THi和TLi作为电子半导体功率部件210。在该示例中,晶体管THi和TLi是氮化镓HEMT晶体管,并且包括三个电极:漏极、栅极和源极。通过电子半导体功率部件210的反向导通来确保续流功能。然而,可以通过必要时添加充当续流二极管的部件来使用任何其他类型的半导体功率部件,其可以具有其他数目的电极等等。
每个反相器臂301–i在这里包括:
-电极H,其承载功率总线的高电位并且其连接到晶体管THi的漏极DHi,
-电极GHi,其是晶体管THi的栅极,对应于控制电极,
-电极GHiSHi,其对应于被施加到栅极GHi的控制信号的参考电位。电极GHiSHi连接到作为晶体管THi的源极的电极SHi,
-承载电荷电位的电极U、V或W,也就是说反相器臂301-i的出口。该电极连接到晶体管THi的源极Shi并连接到晶体管TLi的漏极DLi,
-电极GLi,其是晶体管TLi的栅极,对应于控制电极,
-电极GLiSLi,其对应于被施加到栅极GLi的控制信号的参考电位,该栅极GLi连接到电极SLi,
-电极L,其承载功率总线的低电位并且其连接到晶体管TLi的源极SLi。
这样归组在一起的三个反相器臂301-i允许执行用于DC/AC功率转换的三相反相器功能300。
在图4A至图4E中图示出了组装产生上述电子电路的功率电子模块200的步骤。
在图4A中,电气支撑件201被预先制造,以便确保电气连接和绝缘功能。电气支撑件201例如是金属化陶瓷基板(例如,直接敷铜DBC、或通过直接敷铝DBA)、绝缘金属基板(IMS)或印刷电路板(PCB)。
在所图示的示例中,电气支撑件201是具有三个金属层(例如,由铜或任何其他导电材料制成)的多层印刷电路,每个金属层被绝缘层隔开。
第一金属层包括导电迹线201a,其旨在路由总线的低电位L和高电位H并且连接晶体管THi和TLi的电极Shi、DLi。从图4A中可以看出,第一金属层被安置在绝缘层的表面上,在该图中对应于电气支撑件201的可见侧面。
不可见的第二金属层被掩埋在电气支撑件201中,并且具有路由晶体管THi和TLi的控制信号的功能。第一金属层和第二金属层被绝缘层隔开、金属化孔(过孔)穿过绝缘层使在第一金属层和第二金属层之间形成电气连接。在图4A中所图示的示例中,过孔是双头螺栓201c的形式,控制电路201b(驱动器)与双头螺栓201c电气和机械地(例如通过钎焊)连接(虚线箭头)。控制电路201b还电气地和机械地连接到导电迹线201a,从而使得可以将出自第二金属层的控制信号传送到晶体管THi和TLi的控制电极。
不可见的第三金属层通过第一绝缘层而与第二层隔开,并且通过第二绝缘层而与电气支撑件201的外部隔开。该第二绝缘层对应于图5中所图示的电气支撑件201的可见侧面。第三金属层通过穿过各个绝缘层的金属化孔(过孔)来恢复晶体管THi和TLi的出口U、V和W,以便将它们连接到外部环境。
第三金属层还包括低功率梳状连接器201d,在图5中可见。该梳状连接器201d还构成了第二金属层和第三金属层之间的导电过孔,并使得可以从电气支撑件201的外部朝向第二金属层路由用于晶体管THi和TLi的控制信号。如上所解释,控制信号然后通过诸如双头螺栓201c的导电过孔而被传输到各个控制电路201b,并从每个控制电路201b传输到关联的晶体管。
如图4B中所图示,弹簧元件220然后被固定在电气支撑件201的第一层上,以便建立与PCB的导电迹线的机械和电气接触。弹簧元件220可以通过钎焊、胶合、烧结、强制机械插入或任何其他固定方式而电气地和机械地连接到电气支撑件201。在所图示的示例中,连接器被钎焊在导电迹线201a和控制电路201b上。取决于晶体管THi和TLi的电极的间隔,若干弹簧元件220可能可以被安置为同时面对相同的电极,从而优化与该电极的电气接触。因此,在针对晶体管THi和TLi所图示的示例中:
-两个弹簧元件220被安置为同时面对电极SHi或SLi,
-弹簧元件220被安置为面对电极GHi、GLi、GHiSHi或GLiSLi,
-三个弹簧元件220被安置为同时面对电极DHi或DLi。
定位框架205然后被安置在电气支撑件201上。如图4C中可见,孔口205a先前已经被布置在其中以便允许弹簧元件220通过。每个孔口205a旨在容纳部件210,这里是晶体管THi或TLi,因此当它们支承在弹簧元件220上时充当晶体管THi、TLi的引导。然后,晶体管THi、TLi各自被定位在孔口205中,并支承在它们相应的弹簧元件220上(参见图4D)。更具体地,晶体管THi、TLi的每个第一侧面210a的电极面对它们相应的弹簧元件220而被定位,通过在其上支承而建立机械和电气接触。然后,每个晶体管THi、TLi的第二侧面210b面对孔口205a的外部,该第二侧面210b旨在被冷却。
然后,冷却装置202被定位在定位框架205上,以便在晶体管THi或TLi的每个第二侧面210b上施用压力。这种压力允许以下二者:
-施用支承力,该支承力可以在必要时补偿由弹簧元件220施用在每个晶体管THi、TLi上的恢复力。晶体管和弹簧元件220之间的电气接触因此被优化。然而,弹簧元件220可以被配置为在每个晶体管THi、TLi上施用受控的压力,使得可以在没有冷却装置202的支承力的情况下将它们保持固定,
-保持与每个晶体管THi、TLi的第二侧面210b的机械接触,以便对其进行冷却。
可以设想各种机械压力方式,以便保持和/或完成由冷却装置202施用在部件上的压力。因此,在图4E中,一组螺钉202a和螺母202b允许通过布置在冷却装置202中、冷却框架202中和电气支撑件201中的孔205b、201e来固定冷却装置202。然而,可以设想其他固定方式,例如通过夹持的固定装置。热界面被放置在每个晶体管THi、TLi与冷却装置202之间,以便改善每个晶体管的冷却。
图5是图4E的仰视图,图示出了在组装之后所获得的功率电子模块200。尤其是观察到连接器的存在,从而允许电气连接到反相器臂301-i的出口U、V、W,电气连接到总线的低电位L、高电位H以及用于晶体管THi、TLi的控制的梳状连接器201d。
上述的功率电子模块200具有以下优点。每个部件210的电极210c都沿相同的侧面即第一侧面210a进行取向,而每个部件210的第二侧面210b旨在冷却部件。弹簧元件220通过在部件210上施用受控的压力来允许电极210c与电气支撑件201电气连接,从而保持它们被固定。因此,相关于现有技术,可以免除金属接线电缆104的使用以及将部件转移到互连密封件。因此,可以减少寄生电感并消除在各种热循环期间可以观察到的与电缆和密封件有关的故障风险。因此,功率电子模块200的可靠性得到增强。
此外,通过简单地将部件210的电极210c支承在弹簧元件220上来建立每个部件210与电气支撑件201之间的电气接触。通过冷却装置202施用在每个部件210的第二侧面210b上的支承力来完成部件210与弹簧元件220之间的机械和电气接触。因此,在特定部件发生故障的情况下,模块200可易于拆卸,故障部件通过简单的取出而是可接近和可更换的。因此,模块200具有较高的可维护性。模块200的这种易于维护性允许在不意味着任何组装复杂性的情况下附加部件的添加或(一个或多个)部件的特定更换,从而赋予其模块化性质。因此,可以根据应用来制定各种功率范围,尤其是低功率和/或平均功率。
Claims (9)
1.一种功率电子模块(200),包括电气连接到电气支撑件(201)的多个半导体功率电子部件(210),以及与每个部件(210)热接触的冷却装置(202),其特征在于,每个部件(210)存在于所述电气支撑件(201)和所述冷却装置(202)之间,并且每个部件(210)经由至少一个导电弹簧元件(220)而被安装在所述电气支撑件(201)上。
2.根据权利要求1所述的模块(200),其中,每个部件(210)包括面对所述电气支撑件(201)安置的第一侧面(210a),所述第一侧面包括电极(210c),并且所述至少一个弹簧元件(220)在所述电极(210c)中的至少一个与所述电气支撑件(201)之间建立电气连接。
3.根据权利要求2所述的模块(200),其中,每个部件(210)包括与所述第一侧面(210a)相对的第二侧面(210b),所述模块(200)还包括安置在所述冷却装置(202)和每个部件(210)的所述第二侧面(210b)之间的热界面(203)。
4.根据权利要求3所述的模块(200),其中,在所述电极(210c)中的所述至少一个与所述电气支撑件(201)之间建立电气连接的所述至少一个弹簧元件(220)包括钎焊到所述电气支撑件(201)的第一端(220a)。
5.根据权利要求4所述的模块(200),其中,所述至少一个弹簧元件(220)包括支承在所述电极(210c)中的所述至少一个上的第二端(220b)。
6.根据权利要求1至5中任一项所述的模块(200),其中,每个部件(210)被封装在电子表面安装的封装中。
7.根据权利要求1至6中任一项所述的模块(200),还包括定位框架(205),该定位框架(205)被安置在所述电气支撑件(201)和所述冷却装置(202)之间并且包括通孔(205a),每个通孔被配置为分别容纳部件(210)和至少一个弹簧元件(220)。
8.根据权利要求1至7中任一项所述的模块(200),其中,至少一个所述部件(210)是功率晶体管或功率二极管。
9.根据权利要求1至8中任一项所述的模块(200),包括由多个部件(210)形成的功率转换器。
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FR1761065A FR3074012B1 (fr) | 2017-11-22 | 2017-11-22 | Module electronique de puissance |
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PCT/FR2018/052922 WO2019102135A1 (fr) | 2017-11-22 | 2018-11-20 | Module electronique de puissance |
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EP (1) | EP3714669B1 (zh) |
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DE19942770A1 (de) * | 1999-09-08 | 2001-03-15 | Ixys Semiconductor Gmbh | Leistungshalbleiter-Modul |
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2018
- 2018-11-20 US US16/766,059 patent/US11139732B2/en active Active
- 2018-11-20 EP EP18816198.8A patent/EP3714669B1/fr active Active
- 2018-11-20 WO PCT/FR2018/052922 patent/WO2019102135A1/fr unknown
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CN1264175A (zh) * | 1999-01-27 | 2000-08-23 | Abb(瑞士)股份有限公司 | 功率半导体模块 |
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US20140160691A1 (en) * | 2012-12-12 | 2014-06-12 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor module and method of manufacturing the same |
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WO2019102135A1 (fr) | 2019-05-31 |
US11139732B2 (en) | 2021-10-05 |
EP3714669B1 (fr) | 2021-07-28 |
US20200336061A1 (en) | 2020-10-22 |
EP3714669A1 (fr) | 2020-09-30 |
FR3074012B1 (fr) | 2019-12-06 |
FR3074012A1 (fr) | 2019-05-24 |
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