CN111430572A - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN111430572A CN111430572A CN202010291107.1A CN202010291107A CN111430572A CN 111430572 A CN111430572 A CN 111430572A CN 202010291107 A CN202010291107 A CN 202010291107A CN 111430572 A CN111430572 A CN 111430572A
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Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention relates to a display panel and a display device. The display panel comprises a substrate, a first electrode and a second electrode, wherein the substrate comprises a display area and a non-display area; the frame sealing glue and the auxiliary metal layer are arranged in the non-display area and are arranged in the non-display area; the orthographic projection of the frame sealing glue towards the substrate and the orthographic projection of the auxiliary metal layer towards the substrate have an overlapping area; the orthographic projection of the outer edge of the frame sealing glue facing the substrate is positioned on one side of the orthographic projection of the outer edge of the auxiliary metal layer facing the substrate and far away from the display area. According to the display panel and the display device provided by the invention, the auxiliary metal layer is not exposed outside the frame sealing glue, and the outer side of the auxiliary metal layer is also partially blocked by the frame sealing glue, so that static electricity cannot be introduced into the metal layer from the outer side of the frame sealing glue in the process of carrying out static electricity test on the display screen or using the display screen, and an electronic element is damaged, so that the antistatic capacity of a packaging part is improved.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a display panel and a display device.
Background
The package of the O L ED display device mainly includes a film package and a Frit package, where the Frit package prints a frame sealing adhesive on a cover glass, and the frame sealing adhesive is heated by moving a laser beam to melt the frame sealing adhesive to form an airtight package, and the frame sealing adhesive is melted on a substrate to form a sealed body.
Disclosure of Invention
Based on this, the invention provides a display panel and a display device which improve the above problems, and solves the problem that antistatic capability of a sealing part of frame sealing glue is poor in Frit packaging of the existing display panel.
According to an aspect of the present application, there is provided a display panel including:
the display device comprises a substrate and a display panel, wherein the substrate comprises a display area and a non-display area, and the non-display area is arranged around the display area;
the frame sealing glue is arranged in the non-display area; and
the auxiliary metal layer is arranged in the non-display area;
the orthographic projection of the frame sealing glue towards the substrate and the orthographic projection of the auxiliary metal layer towards the substrate have an overlapping area;
the orthographic projection of the outer edge of the frame sealing glue facing the substrate is positioned on one side of the orthographic projection of the outer edge of the auxiliary metal layer facing the substrate and far away from the display area.
In one embodiment, the non-display area of the substrate is provided with metal wires;
the orthographic projection of the metal wiring facing the substrate and the orthographic projection of the frame sealing glue facing the substrate are not overlapped.
In an embodiment, the metal trace includes a voltage-stabilizing signal line electrically connected to the auxiliary metal layer.
In an embodiment, a distance between a forward projection of the outer edge of the frame sealing adhesive toward the substrate and a forward projection of the outer edge of the auxiliary metal layer toward the substrate is 10% to 50% of a width of the frame sealing adhesive; or
The distance between the orthographic projection of the outer edge of the frame sealing glue facing the substrate and the orthographic projection of the outer edge of the auxiliary metal layer facing the substrate is more than 50 microns.
In an embodiment, the display panel further includes a buffer layer and a plurality of functional film layers sequentially disposed on the substrate, the auxiliary metal layer is disposed between two adjacent functional film layers, and the frame sealing adhesive is disposed on a side of the plurality of functional film layers away from the substrate;
the functional film layer is one of a gate insulating layer, a dielectric layer, an interlayer insulating layer and a planarization layer;
preferably, the auxiliary metal layer is located between the gate insulating layer and the dielectric layer.
In an embodiment, at least a part of a surface of the frame sealing adhesive contacting the functional film layer is a non-flat surface.
In one embodiment, at least a part of the surface of the functional film layer, which is in contact with the frame sealing adhesive layer, is provided with a concave portion.
In an embodiment, the non-display region between the outer edge of the frame sealing adhesive and the outer edge of the auxiliary metal layer has a first via hole penetrating through the multi-layer functional film layer, and the frame sealing adhesive covers the first via hole and contacts the buffer layer.
In one embodiment, the auxiliary metal layer includes a plurality of through holes, and two adjacent through holes are spaced;
the non-display area is provided with a second through hole penetrating through the multilayer functional film layer and the through hole, and the frame sealing glue covers the second through hole and is in contact with the buffer layer.
According to another aspect of the present application, there is also provided a display device including the display panel described above.
According to the display panel and the display device, the orthographic projection of the outer edge of the frame sealing glue towards the substrate is positioned on the side, away from the display area, of the orthographic projection of the outer edge of the auxiliary metal layer towards the substrate, namely the auxiliary metal layer is not exposed outside the frame sealing glue, and the outer side of the auxiliary metal layer is also partially blocked by the frame sealing glue, so that static electricity cannot be introduced into the auxiliary metal layer from the outer side of the frame sealing glue in the process of carrying out static electricity test on a display screen or using the display screen, so that electronic elements are damaged, and therefore the antistatic capacity of a packaging position is improved.
Drawings
FIG. 1 is a schematic cross-sectional view of a display panel according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of the display panel shown in FIG. 1;
fig. 3 is a schematic cross-sectional view of the display panel shown in fig. 2.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
One or more embodiments of the present invention will be described in detail with reference to the accompanying drawings, in which elements such as shapes, sizes, proportions, angles, and numbers of elements are merely examples, and in different embodiments, the same or corresponding elements may be denoted by the same reference numerals, and repeated descriptions thereof will be omitted.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Where the terms "comprising," "having," and "including" are used herein, another element may be added unless an explicit limitation is used, such as "only," "consisting of … …," etc. Unless mentioned to the contrary, terms in the singular may include the plural and are not to be construed as being one in number.
It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present invention.
Such as an O L ED (Organic L light-Emitting Diode) display, has self-luminous performance, has saved the backlight unit of comparatively power consumption than liquid crystal display, consequently has more energy-conserving advantage, by the wide application in intelligent terminal products such as cell-phone, panel computer.
When the O L ED display device works, electrons are injected from a cathode to a transmission layer, and in order to improve the quantity of injected carriers and improve the luminous efficiency, the cathode of the O L ED display device adopts a material with a work function close to that of a luminous layer and reduce energy level barriers.
The Frit packaging can form airtight packaging, so that effective packaging can be performed, and specifically, a Frit pattern is printed on a packaging area of a display substrate, then a packaging cover plate and the display substrate are aligned and attached, and then the Frit pattern is scanned by laser to be melted, so that the packaging cover plate and the display substrate are packaged together.
Generally, a display panel includes an effective display area and a bezel area surrounding the effective display area. The frame region may include a circuit region and a package region, the circuit region is provided with circuit leads, a driving circuit, and other structures, and the package region is provided with a packaging material for packaging the organic light emitting device and related circuit elements. Through can set up supplementary metal level in the encapsulation district to in the radium-shine melting process of Frit laser, improve the utilization ratio of laser and the melting homogeneity of Frit, the inventor research of this application discovers, and when frame sealing glue was printed on display substrate, partial supplementary metal level can be exposed outside the encapsulation glue, thereby influences the antistatic effect at display panel edge.
Before explaining the present invention in detail, some contents of the present invention are explained first to facilitate a clearer understanding of the technical aspects of the present invention.
Display area/non-display area: a display panel is a panel cut from a display panel mother board; the display panel includes an active area for forming light emitting elements, and a peripheral area where wiring lines for providing signal lines for display are not allowed to be cut off. For example, a display panel may include a display Area AA (Active Area, AA) for forming a light emitting element later, and may further include a non-display Area NAA (including an Area where a driving circuit and a chip are provided) for forming a display panel later.
TFT (Thin-film transistor) array: for controlling each pixel (light emitting element), it is possible to control the emission of each pixel (light emitting element), and also to control the amount by which each pixel emits. Therefore, the film layer of the TFT array segment is necessarily present in the display area, but the film layer of the TFT array segment is not completely located only in the display area AA, and due to the different effects of the film layer, a part of the film layer is formed and also present in the non-display area NAA, for example, in some embodiments, the film layer of the buffer layer, the interlayer insulating layer, the passivation layer, and the like, and may be present in both the display area AA and the non-display area NAA.
Hereinafter, a display panel in an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a schematic plan view of a display panel in an embodiment of the present application; fig. 2 illustrates a schematic cross-sectional structure of B-B of the display panel shown in fig. 1. For the purpose of illustration, the drawings show only the structures associated with embodiments of the invention.
Referring to the drawings, a display panel 100 according to an embodiment of the present application includes a substrate 10, and the substrate 10 includes a display area AA and a non-display area NAA, and the non-display area NAA is disposed around the display area AA.
Specifically, the substrate 10 may include or be an insulating substrate made of glass, quartz, ceramic, and/or plastic, etc., but the embodiment of the present invention is not limited thereto. The substrate 10 may include or be made of a metal substrate made of stainless steel or the like, or the substrate 10 may include or be made of any other suitable material available in the field of display devices. Preferably, the substrate 10 is a glass substrate.
In some embodiments, the display area AA has a rectangular shape, and the non-display area NAA is configured to be disposed around the rectangular display area AA. Of course, in other embodiments, the shape and arrangement of the display area AA and the non-display area NAA include, but are not limited to, the above-described examples, for example, when the display panel 100 is used for a wearable device worn on a user, the display area AA may have a circular shape like a watch; when the display panel 100 is used in a vehicle, the display area AA and the non-display area NAA may take a circular shape, a polygonal shape, or other shapes, for example.
The display area AA displays an image by pixels including at least light emitting elements, and the non-display area NAA is provided with metal traces, such as scan lines, data lines, and common electrode lines, connected to the pixels, and pads 90 for respectively providing driving signals to the scan lines, the data lines, and the common electrode lines.
In some embodiments, the display area AA is displayed by pixels arranged in an array, and each pixel may include a plurality of sub-pixels. The substrate 10 has a plurality of sub-pixel regions corresponding to the aforementioned sub-pixels, for example, the substrate 12 has a first sub-pixel region emitting red light, a second sub-pixel region emitting blue light, and a third sub-pixel region emitting green light. The first sub-pixel region, the second sub-pixel region and the third sub-pixel region of one group can form a pixel region.
It is understood that in other embodiments, each pixel region may also include other sub-pixel regions, which are not limited herein, for example, a fourth sub-pixel region emitting white light may also be included.
It is readily understood that a sub-pixel is the smallest unit for representing one color. Each sub-pixel region may be correspondingly provided with a driving layer, a pixel electrode, and a light emitting element, the driving layer being configured to be supplied to the pixel electrode in response to a scan signal from the scan line and a data signal from the data line, thereby controlling the sub-pixels to emit light.
It is easily understood that the light emitting element and the driving layer are disposed on the substrate 10, and an additional layer such as a buffer layer 20 may be formed on the substrate 10 before the driving layer is formed to prevent impurities from penetrating into a semiconductor layer of the driving layer. The buffer layer 20 may be formed on the entire surface of the substrate 10, or may be formed by patterning. The buffer layer 20 may include an inorganic insulating material such as SiNx or SiOx, and may have a single-layer structure or a multi-layer structure including the above inorganic insulating material.
The driving layer (thin-film transistor layer) may include a semiconductor layer, a gate electrode, a source electrode, and a drain electrode. The semiconductor layer may be formed of an amorphous silicon layer, a metal oxide, or a polysilicon layer, or may be formed of an organic semiconductor material. In some embodiments, the semiconductor layer includes a channel region and source and drain regions doped with a dopant.
The semiconductor layer may be covered with a gate insulating layer 30, and a first metal layer (including a gate electrode and a capacitor bottom plate, etc.) may be disposed on the gate insulating layer 30. In general, the gate insulating layer 30 may cover the entire surface of the substrate 10. In some embodiments, the gate insulating layer 30 may be formed by patterning. The gate insulating layer 30 may be formed of silicon oxide, silicon nitride, or other insulating organic or inorganic materials in consideration of adhesion to adjacent layers, formability of a stack target layer, and surface flatness. The first metal layer may be covered by a dielectric layer formed of silicon oxide, silicon nitride and/or other suitable insulating organic or inorganic material, and the second metal layer (including the capacitor top plate, etc.) is disposed on the dielectric layer 40 and covered by an interlayer insulating layer 50 formed of silicon oxide, silicon nitride and/or other suitable insulating organic or inorganic material. A portion of the gate insulating layer 30, the dielectric layer 40, and the interlayer insulating layer 50 may be removed, and a contact hole may be formed to expose a predetermined region of the semiconductor layer after the removal. The source and drain electrodes may contact the semiconductor layer via the contact holes.
Since the driving layer has a complicated layer structure, the top surface thereof may be uneven, and the display panel further includes a planarization layer to form a sufficiently flat top surface. After forming the planarization layer, a via hole may be formed in the planarization layer to expose the source and drain electrodes of the driving layer.
In some embodiments, the organic electroluminescent display panel further includes a pixel defining layer formed on the planarization layer and exposing at least a portion of each pixel electrode. For example, the pixel defining layer may cover at least a portion of an edge of each pixel electrode, thereby exposing at least a portion of each pixel electrode. Thus, the pixel defining layer defines a plurality of pixel defining openings and spacing regions located between the pixel defining openings, a middle part or all parts of the pixel electrode are exposed through the pixel defining openings, and the light emitting element is arranged in the pixel defining openings.
The cathode opposite to the pixel electrode can cover the whole surface of the pixel defining layer and can be made of metals with lower power function, such as silver, lithium, magnesium, calcium, strontium, aluminum, indium and the like, or metal compounds or alloy materials. In some embodiments, the light emitting elements in the pixel defining openings can be covered by evaporation, and the spacing regions between the pixel defining openings can be defined by evaporation.
Specifically, for example, a driving layer, a pixel electrode, a pixel defining layer, a cathode layer, a capacitor plate, and a metal wiring for forming are formed in the display area AA; for example, the buffer layer 20, the gate insulating layer 30, the dielectric layer 40, the interlayer insulating layer 50, and the planarization layer (passivation layer) may be inorganic functional film layers formed of inorganic materials, which cover the display area AA and the non-display area NAA.
Referring to fig. 2 again, the display panel 100 further includes a frame sealing adhesive 60, and the frame sealing adhesive 60 is disposed in the non-display area NAA. Specifically, the frame sealing adhesive 60 forms a packaging region FR toward the projection region of the substrate 10.
Specifically, the frame sealing adhesive 60 may adopt a conventionally used glass frit, such as at least one of Al2O3, SnO, TeO2, MgO, CaO, ZnO, TiO2, WO3, Bi2O3, Fe2O3, and CuO, which is not specifically limited herein.
The display panel 100 further includes an encapsulation cover 70, and the encapsulation cover 70 covers the display area AA to encapsulate the display area AA, so as to prevent external moisture or oxygen from penetrating into the light emitting elements susceptible to the external moisture or oxygen. Specifically, the frit needs to be melted by laser, so that the frame sealing adhesive 60 adheres to the substrate 10 and the package cover plate 70 to realize the package.
Specifically, the package cover plate 70 may be made of glass, quartz, plastic, metal, or the like. Preferably, the package cover 70 is a glass cover.
In the embodiment of the invention, the display panel 100 further includes an auxiliary metal layer 80, the auxiliary metal layer 80 is disposed in the non-display area NAA, and an overlapping region exists between a forward projection of the sealant 60 toward the substrate 10 and a forward projection of the auxiliary metal layer 80 toward the substrate 10.
Because the frit needs to be subjected to laser melting in the encapsulation region FR, the overlapping region is formed between the orthographic projection of the frame sealing glue 60 towards the substrate 10 and the orthographic projection of the auxiliary metal layer 80 towards the substrate 10, so that the auxiliary metal layer 80 can serve as a heat conductor to more uniformly release the heat of the laser to the frit, the frit is uniformly melted, and the encapsulation effect of the display panel 100 is provided.
Further, the non-display area NAA of the substrate 10 is provided with a metal trace, and an orthogonal projection of the metal trace toward the substrate 10 and an orthogonal projection of the frame sealing adhesive 60 toward the substrate 10 have no overlapping region. The metal routing comprises a scanning line, a data line and a common electrode line. Therefore, no metal wiring is arranged below the glass material during laser, so that heat generated by laser cannot influence the metal wiring.
Specifically, the auxiliary metal layer 80 and the metal traces may be formed simultaneously when patterned by an etching process, which simplifies the manufacturing process of the auxiliary metal layer 80 and improves the manufacturing efficiency of the display panel 100.
It should be understood that the non-display area NAA is provided with the aforementioned bonding pad 90, and the bonding pad 90 is connected to the metal trace, so that in order to avoid the influence on the bonding pad during laser irradiation, the projection area of the frame sealing adhesive 60 toward the substrate should also be disposed away from the bonding pad 90.
The orthographic projection of the outer edge of the frame sealing adhesive 60 toward the substrate 10 is located on the side of the outer edge of the auxiliary metal layer 80 facing the orthographic projection of the substrate 10 away from the display area AA.
It should be understood that the outer edge of the sealant 60 refers to an edge of the sealant 60 away from the display area AA, and the outer edge of the auxiliary metal layer 80 refers to an edge of the auxiliary metal layer 80 away from the display area AA.
It should be understood that the non-display region NAA between the outer edge of the sealant 60 and the outer edge of the auxiliary metal layer 80 should have a support structure for supporting the sealant 60, which may be the substrate 10, or the substrate 10, the gate insulating layer 20, the dielectric layer 30, the interlayer insulating layer 40 and the planarization layer.
Therefore, the orthographic projection of the outer edge of the frame sealing adhesive 60 towards the substrate 10 is positioned on one side of the orthographic projection of the outer edge of the auxiliary metal layer 80 towards the substrate 10, which is far away from the display area AA, i.e. the auxiliary metal layer 80 is not exposed outside the frame sealing adhesive 60, and the outer side of the auxiliary metal layer 80 is also partially blocked by the frame sealing adhesive 60, so that static electricity cannot be introduced into the auxiliary metal layer 80 from the outer side of the frame sealing adhesive 60 in the process of carrying out static electricity test on a display screen or using the display screen, thereby damaging electronic elements, and therefore, the antistatic capability of a packaging part is improved.
As a preferred embodiment, the metal trace includes a voltage-stabilized signal line electrically connected to the auxiliary metal layer 80.
Note that the voltage stabilization signal line is a signal line that can supply a stable voltage to the auxiliary metal layer 80, and specifically, Vdd, Vss, Vref, or the like.
Because the auxiliary metal layer 80 occupies a large area of the display panel 100, and because the auxiliary metal layer is made of metal, charges can be accumulated in the manufacturing, transporting or using processes of the display panel 100, and the charges accumulated in the auxiliary metal layer 80 can be released through the voltage-stabilizing signal line by arranging the auxiliary metal layer 80 to be connected with the voltage-stabilizing signal line.
In some embodiments, the metal trace is located between the auxiliary metal layer 80 and the display area AA, the voltage-stabilizing signal line is located at the outermost side of the metal trace away from the non-display area NAA, and the auxiliary metal layer 80 and the voltage-stabilizing signal line may be overlapped at the edges of the two. The edge lap joint mode is easy to realize, and the manufacturing process is simplified.
In some embodiments, the distance between the orthographic projection of the outer edge of the sealant 60 toward the substrate 10 and the orthographic projection of the outer edge of the auxiliary metal layer 80 toward the substrate 10 is 10% to 50% of the width of the sealant 60. Specifically, the width direction of the sealant 60 is the left-right direction shown in fig. 2, and in another embodiment, a distance between an orthogonal projection of the outer edge of the sealant 60 toward the substrate 10 and an orthogonal projection of the outer edge of the auxiliary metal layer 80 toward the substrate 10 is greater than 50 μm. The inventor finds that if the distance between the outer edge of the frame sealing adhesive 60 and the outer edge of the auxiliary metal layer 80 is too large, the encapsulation effect of the frame sealing adhesive 60 is affected, so that the distance between the orthographic projection of the outer edge of the frame sealing adhesive 60 towards the substrate 10 and the orthographic projection of the outer edge of the auxiliary metal layer 80 towards the substrate 10 is 10% -50% of the width of the frame sealing adhesive 60 or the distance is more than 50 micrometers, and the antistatic capability of the edge can be improved.
In some embodiments, the display panel 100 further includes a buffer layer 20 and a plurality of functional film layers sequentially disposed on the substrate, the auxiliary metal layer 80 is disposed between two adjacent functional film layers, and the sealant 60 is disposed on a side of the plurality of functional film layers away from the substrate 10, wherein the functional film layer is one of the gate insulating layer 30, the dielectric layer 40, the interlayer insulating layer 50, and the planarization layer. Therefore, the auxiliary metal layer 80 can be fabricated in the same layer as the first metal layer, the second metal layer or the third metal layer, which simplifies the fabrication process of the display panel 100.
Preferably, the auxiliary metal layer 80 is located between the gate insulating layer 30 and the dielectric layer 40. That is, the auxiliary metal layer 80 can be fabricated on the same layer as the first metal layer, and compared with other positions, the auxiliary metal layer 80 is located between the gate insulating layer 30 and the dielectric layer 40, that is, located at a position farthest from the frame sealing adhesive 60, and in the laser process, the auxiliary metal layer 80 can transfer heat to the upper multi-layer film structure, so as to increase the bonding force between the upper multi-layer films and the frame sealing adhesive 60.
In some embodiments, at least a portion of the surface of the sealant 60 contacting the functional film layer is a non-flat surface.
For example, in some embodiments, the uneven surface may be a three-dimensional curved surface with undulations, and the three-dimensional curved surface with undulations may be a three-dimensional curved surface with regular undulations or a three-dimensional curved surface with irregular undulations. Illustratively, the three-dimensional curved surface may be a three-dimensional curved surface having an arc-shaped undulation, a three-dimensional curved surface having a sawtooth undulation, a three-dimensional curved surface having a square undulation, or a three-dimensional curved surface having a random undulation.
In other embodiments, the non-planar surface may exhibit a rough surface having at least one of protrusions or recesses, for example, the protrusions may embody at least one of stalactite-like peak protrusions, hills, particulate rocks, or other regular and irregular protrusions, and the recesses exhibit at least one of holes, grooves, or cracks. It is easy to understand that since the frame sealing adhesive 60 can be formed by using the laser melting of the glass frit, after the rough surface is obtained by surface treatment of the functional film layer, the glass frit can be filled between two adjacent convex portions and into the concave portions of the functional film layer with the rough surface, and the two adjacent convex portions and the concave portions can be embedded with each other after melting. Thus, the bonding force is stronger, and the packaging reliability of the frame sealing glue 60 is improved.
Thus, the contact area between the frame sealing glue 60 and the functional film layer is increased, and the bonding force between the frame sealing glue 60 and the substrate 10 is improved, so that the packaging reliability of the frame sealing glue 60 is improved.
It can be understood that the shape of the three-dimensional curved surface may be simple or complex regular undulations, or simple or complex irregular undulations, and the purpose of increasing the bonding force between the frame sealing adhesive 60 and the substrate 10 is to be achieved.
The cross-sectional shape of the recess in the second direction may be a circular hole shape, for example, specifically, a perfect circle or an ellipse, and may also be a rectangular or polygonal hole. In other embodiments, the recess may be a groove extending along the second direction, and the cross-sectional shape of the recess in the vertical direction may be, for example, a rectangle, a square, a regular trapezoid, an inverted trapezoid, a polygon, or a combination of partial shapes thereof.
In some embodiments, the cross-sectional size of the recess gradually increases toward the substrate 10 in the vertical direction. For example, the cross-sectional shape of the recess is a regular trapezoid, and the cross-sectional size of the recess gradually increases from the upper end to the lower end, and may be formed by a patterning process. Thus, when the frame sealing adhesive 60 is embedded in the recess, the frame sealing adhesive cannot be separated due to the limitation of the side wall of the recess, and the bonding force between the frame sealing adhesive 60 and the interlayer insulating layer 50 is improved.
It is understood that the patterning process may form the aforementioned recess by exposure through a mask and then development; of course, in other embodiments, the recess may be formed by dry etching, which is not limited herein.
In some embodiments, the sidewalls of the recess are non-planar surfaces. For example, the side walls of the recess may exhibit an undulating three-dimensional surface, a surface with projections or recesses, or be stepped, etc. Thus, the contact area between the frame sealing adhesive 60 and the interlayer insulating layer 50 is increased, and the bonding force between the frame sealing adhesive 60 and the interlayer insulating layer is further improved, so that the packaging reliability of the frame sealing adhesive 60 is improved.
In particular, it has been found that the height of the protruding portions or the depth of the recessed portions fitted into each other directly affects the bonding force between the film layers, and when the height of the protruding portions or the depth of the recessed portions fitted into each other is too small, the bonding force between the protruding portions and the recessed portions is not increased significantly. When the height of the protruding portions or the depth of the recessed portions fitted to each other is too large, physical properties of both are affected, and even a defect is caused.
Specifically, in one embodiment, the non-display area NAA between the outer edge of the frame sealing adhesive 60 and the outer edge of the auxiliary metal layer 80 has a first via hole 11 penetrating through the multi-layer functional film layer, and the frame sealing adhesive 60 covers the first via hole 11 and contacts the buffer layer 20. In addition, the buffer layer 20 is made of an inorganic insulating material, and the bonding force between the frame sealing glue 60 and the inorganic material is better than that between the frame sealing glue 60 and the inorganic material because the buffer layer 20 is made of an organic material, so that the first via hole 11 penetrating through the functional film layer is formed, the frame sealing glue 60 is in contact with the buffer layer 20, the packaging reliability of the frame sealing glue 60 can be improved, and the packaging effect of the display panel 100 is better. Further, the first via hole 11 includes a plurality of first via holes 11, and the plurality of first via holes 11 are arranged at intervals.
Referring to fig. 2 and fig. 3 again, in other embodiments, the auxiliary metal layer 80 includes a plurality of through holes 81, two adjacent through holes are disposed at intervals, the non-display area NAA has second via holes 12 penetrating through the functional film layer and the through holes 8, and the sealant FR covers the second via holes 12 and contacts the buffer layer 20. Similarly, the second via hole 12 has a depth of a plurality of functional film layers, which can improve the bonding force between the two, and in addition, since the buffer layer 20 is made of an inorganic insulating material, the bonding force between the frame sealing adhesive 60 and the inorganic material is better than that of an organic material, the second via hole 12 penetrating through the functional film layers and the through hole 81 is formed, so that the frame sealing adhesive 60 contacts with the buffer layer, which can improve the packaging reliability of the frame sealing adhesive 60, and the packaging effect of the display panel 100 is better. Further, the second via 12 includes a plurality of second vias 12, and the plurality of second vias 12 are arranged at intervals. In other embodiments, the package region 40 may also have a combination of the first via 11 and the second via 12.
Based on the same inventive concept, the application also provides a display device comprising the display panel.
The display device can be any product or part with a touch display function, such as a mobile phone, a tablet personal computer, a television, a display, a notebook computer, a digital photo frame, a vehicle-mounted device, a wearable device or an internet of things device.
In the display panel 100 and the display device, since the orthographic projection of the outer edge of the frame sealing adhesive 60 toward the substrate 10 is located on the side of the orthographic projection of the outer edge of the auxiliary metal layer 80 toward the substrate 10 away from the display area AA, that is, the auxiliary metal layer 80 is not exposed outside the frame sealing adhesive 60, and the outer side of the auxiliary metal layer 80 is also partially blocked by the frame sealing adhesive 60, static electricity cannot be introduced into the auxiliary metal layer 80 from the outer side of the frame sealing adhesive 60 during a static electricity test on a display screen or a use of the display screen, so that electronic elements are damaged, and therefore, the antistatic capability of a packaging part is improved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A display panel, comprising:
the display device comprises a substrate and a display panel, wherein the substrate comprises a display area and a non-display area, and the non-display area is arranged around the display area;
the frame sealing glue is arranged in the non-display area; and
the auxiliary metal layer is arranged in the non-display area;
the orthographic projection of the frame sealing glue towards the substrate and the orthographic projection of the auxiliary metal layer towards the substrate have an overlapping area;
the orthographic projection of the outer edge of the frame sealing glue facing the substrate is positioned on one side of the orthographic projection of the outer edge of the auxiliary metal layer facing the substrate and far away from the display area.
2. The display panel according to claim 1, wherein the non-display area of the substrate is provided with metal traces;
the orthographic projection of the metal wiring facing the substrate and the orthographic projection of the frame sealing glue facing the substrate are not overlapped.
3. The display panel according to claim 2, wherein the metal traces comprise voltage-stabilizing signal lines electrically connected to the auxiliary metal layer.
4. The display panel of claim 1, wherein a distance between a forward projection of an outer edge of the frame sealing glue towards the substrate and a forward projection of an outer edge of the auxiliary metal layer towards the substrate ranges from 10% to 50% of a width of the frame sealing glue; or
The distance between the orthographic projection of the outer edge of the frame sealing glue facing the substrate and the orthographic projection of the outer edge of the auxiliary metal layer facing the substrate is more than 50 microns.
5. The display panel according to claim 1, further comprising a buffer layer and a plurality of functional film layers sequentially disposed on the substrate, wherein the auxiliary metal layer is disposed between two adjacent functional film layers, and the sealant is disposed on a side of the functional film layers away from the substrate;
the functional film layer is one of a gate insulating layer, a dielectric layer, an interlayer insulating layer and a planarization layer;
preferably, the auxiliary metal layer is located between the gate insulating layer and the dielectric layer.
6. The display panel according to claim 5, wherein at least a portion of the surface of the frame sealing adhesive contacting the functional film layer is a non-flat surface.
7. The display panel according to claim 6, wherein at least a portion of the surface of the frame sealing adhesive contacting the functional film layer has a concave portion.
8. The display panel of claim 7, wherein the non-display region between the outer edge of the sealant and the outer edge of the auxiliary metal layer has a first via penetrating through the multi-layer functional film layer, and the sealant covers the first via and contacts the buffer layer.
9. The display panel according to claim 7, wherein the auxiliary metal layer comprises a plurality of through holes, and two adjacent through holes are spaced apart from each other;
the non-display area is provided with a second through hole penetrating through the multilayer functional film layer and the through hole, and the frame sealing glue covers the second through hole and is in contact with the buffer layer.
10. A display device comprising the display panel according to any one of claims 1 to 9.
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| CN202010291107.1A CN111430572A (en) | 2020-04-14 | 2020-04-14 | Display panel and display device |
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| CN202010291107.1A CN111430572A (en) | 2020-04-14 | 2020-04-14 | Display panel and display device |
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| CN111430572A true CN111430572A (en) | 2020-07-17 |
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| CN111968537A (en) * | 2020-09-03 | 2020-11-20 | 厦门天马微电子有限公司 | Display module and electronic equipment |
| WO2022027556A1 (en) * | 2020-08-07 | 2022-02-10 | 京东方科技集团股份有限公司 | Display substrate and display device |
| CN114079020A (en) * | 2020-08-18 | 2022-02-22 | 华为技术有限公司 | Display screen, packaging method thereof and terminal |
| WO2022067520A1 (en) * | 2020-09-29 | 2022-04-07 | 京东方科技集团股份有限公司 | Display substrate and manufacturing method therefor, and display device |
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| WO2022027556A1 (en) * | 2020-08-07 | 2022-02-10 | 京东方科技集团股份有限公司 | Display substrate and display device |
| US11917876B2 (en) | 2020-08-07 | 2024-02-27 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display substrate and display apparatus |
| CN114079020A (en) * | 2020-08-18 | 2022-02-22 | 华为技术有限公司 | Display screen, packaging method thereof and terminal |
| CN114079020B (en) * | 2020-08-18 | 2022-11-01 | 华为技术有限公司 | Display screen, packaging method thereof and terminal |
| CN111968537A (en) * | 2020-09-03 | 2020-11-20 | 厦门天马微电子有限公司 | Display module and electronic equipment |
| CN111968537B (en) * | 2020-09-03 | 2022-04-12 | 厦门天马微电子有限公司 | Display module and electronic equipment |
| WO2022067520A1 (en) * | 2020-09-29 | 2022-04-07 | 京东方科技集团股份有限公司 | Display substrate and manufacturing method therefor, and display device |
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| US12029086B2 (en) | 2020-09-29 | 2024-07-02 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display substrate, manufacturing method thereof, and display device |
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Application publication date: 20200717 |