CN111423697A - Thermosetting composite material with excellent heat conductivity and preparation method thereof - Google Patents
Thermosetting composite material with excellent heat conductivity and preparation method thereof Download PDFInfo
- Publication number
- CN111423697A CN111423697A CN202010271921.7A CN202010271921A CN111423697A CN 111423697 A CN111423697 A CN 111423697A CN 202010271921 A CN202010271921 A CN 202010271921A CN 111423697 A CN111423697 A CN 111423697A
- Authority
- CN
- China
- Prior art keywords
- parts
- polymer
- composite material
- powder
- thermosetting composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 39
- 239000002131 composite material Substances 0.000 title claims abstract description 36
- 238000002360 preparation method Methods 0.000 title abstract description 7
- 239000000835 fiber Substances 0.000 claims abstract description 13
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- 239000000080 wetting agent Substances 0.000 claims abstract description 10
- VTYYLEPIZMXCLO-UHFFFAOYSA-L calcium carbonate Substances [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims abstract description 9
- 229910000019 calcium carbonate Inorganic materials 0.000 claims abstract description 8
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 6
- 239000002994 raw material Substances 0.000 claims abstract description 4
- 229920000642 polymer Polymers 0.000 claims description 35
- 239000000843 powder Substances 0.000 claims description 21
- 239000004634 thermosetting polymer Substances 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000010439 graphite Substances 0.000 claims description 6
- 229910002804 graphite Inorganic materials 0.000 claims description 6
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 5
- 239000012765 fibrous filler Substances 0.000 claims description 5
- 229920006305 unsaturated polyester Polymers 0.000 claims description 4
- 239000010445 mica Substances 0.000 claims description 3
- 229910052618 mica group Inorganic materials 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims description 2
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 2
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 claims description 2
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims description 2
- 239000004641 Diallyl-phthalate Substances 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims description 2
- 229920000877 Melamine resin Polymers 0.000 claims description 2
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 claims description 2
- 239000003513 alkali Substances 0.000 claims description 2
- 229920000180 alkyd Polymers 0.000 claims description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 claims description 2
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 claims description 2
- 239000004643 cyanate ester Substances 0.000 claims description 2
- IVJISJACKSSFGE-UHFFFAOYSA-N formaldehyde;1,3,5-triazine-2,4,6-triamine Chemical compound O=C.NC1=NC(N)=NC(N)=N1 IVJISJACKSSFGE-UHFFFAOYSA-N 0.000 claims description 2
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 claims description 2
- XPFVYQJUAUNWIW-UHFFFAOYSA-N furfuryl alcohol Chemical compound OCC1=CC=CO1 XPFVYQJUAUNWIW-UHFFFAOYSA-N 0.000 claims description 2
- 150000003949 imides Chemical class 0.000 claims description 2
- 239000012948 isocyanate Substances 0.000 claims description 2
- 150000002513 isocyanates Chemical class 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- 229920003986 novolac Polymers 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 claims description 2
- 229920003987 resole Polymers 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 1
- 238000005452 bending Methods 0.000 abstract 1
- 239000000805 composite resin Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 230000007613 environmental effect Effects 0.000 abstract 1
- 229910021389 graphene Inorganic materials 0.000 abstract 1
- 239000011256 inorganic filler Substances 0.000 abstract 1
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 239000002562 thickening agent Substances 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
Abstract
The invention discloses a thermosetting composite material with excellent heat conductivity and a preparation method thereof, and relates to the field of thermosetting composite materials, wherein the thermosetting composite material is prepared from the following raw materials in parts by weight: 15-50 parts of unsaturated polyester-o-benzene-graphene composite resin, 0.5-1.5 parts of curing agent, 30-50 parts of inorganic filler and CaCO370‑120 part, 0.1-1 part of wetting agent, 0.1-0.5 part of thickening agent, 1-3 parts of parting agent, 10-30 parts of alkali-free high-strength fiber and 0.5-1.8 parts of auxiliary agent. The invention can solve the problems of low glossiness, low density, low bending strength, poor insulation effect and poor environmental protection performance of the traditional thermosetting composite material.
Description
Technical Field
The invention relates to the field of thermosetting composite materials, in particular to a thermosetting composite material with excellent heat conductivity and a preparation method thereof.
Background
The thermosetting composite material is a composite material prepared by taking a thermosetting polymer as a matrix resin and adding a proper filling material, such as glass fiber reinforced plastic, bakelite and the like. The fillers currently used in the preparation of thermoset composites are typically calcium carbonate, alumina, talc, clay, mica, graphite, glass flake, and the like. The reasonable selection of the filler can improve the performance of the composite material to the maximum extent, expand the application field of the composite material, save the raw material of the synthetic resin and reduce the production cost of the composite material. Accordingly, more desirable fillers have long been sought.
The traditional thermosetting composite material has poor heat-conducting property and cannot meet the actual use requirement.
Disclosure of Invention
The invention aims to solve the technical problem of providing a thermosetting composite material with excellent heat conductivity and a preparation method thereof, and solves the problem of poor heat conductivity of the traditional thermosetting composite material.
The technical scheme adopted by the invention for solving the technical problems is as follows: a thermosetting composite material with excellent heat conductivity is prepared from the following raw materials in parts by weight: 15-65 parts of thermosetting polymer, 4-20 parts of spherical ceramic powder, 3-15 parts of flaky heat conducting powder, 2-4 parts of fibrous filler and CaCO320-50 parts of wetting agent, 0.1-1 part of parting agent, 1-3 parts of alkali-free high-strength fiber and 0.5-1.8 parts of auxiliary agent.
Further, the thermosetting polymer is one or more of epoxy polymer, unsaturated polyester polymer, polyimide polymer, bismaleimide triazine polymer, cyanate ester polymer, vinyl polymer, benzoxazine polymer, benzocyclobutene polymer, alkyd polymer, phenol-formaldehyde polymer, phenol novolac polymer, resol polymer, melamine-formaldehyde polymer, urea-formaldehyde polymer, methylolfuran polymer, isocyanate polymer, diallyl phthalate polymer, triallyl cyanurate polymer, triallyl isocyanurate polymer, and unsaturated polyester imide.
Further, the spherical ceramic powder is one or more of alumina powder, silicon carbide powder, magnesium hydroxide powder and aluminum hydroxide powder.
Further, the flaky heat conduction powder is one or more of talcum powder and mica powder.
Further, the fibrous filler is one or more of graphite fiber and oxide whisker.
Further, the wetting agent is BYK-W9010, and the release agent is RS-404.
The invention also provides a preparation method of the thermosetting composite material with excellent heat-conducting property, which comprises the following steps of 15-65 parts of thermosetting polymer, 4-20 parts of spherical ceramic powder, 3-15 parts of flaky heat-conducting powder, 2-4 parts of fibrous filler and CaCO320-50 parts of wetting agent, 0.1-1 part of parting agent, 1-3 parts of non-alkali high-strength fiber, 10-30 parts of assistant and 0.5-1.8 parts of blending to prepare the thermosetting composite material with excellent heat-conducting property.
The invention has the following beneficial effects:
the thermosetting composite material has excellent heat conducting performance and heat conducting coefficient up to 2.3W/m.
Detailed Description
Example 1:
15 portions of epoxy resin, 4 portions of alumina powder, 3 portions of talcum powder, 2 portions of graphite fiber and CaCO320 parts of BYK-W9010 wetting agent 0.1 part, 1 part of RS-404 release agent, 10 parts of alkali-free high-strength fiber and 0.5 part of auxiliary agent, and blending to prepare the thermosetting composite material with excellent heat-conducting property.
The resulting thermoset composite had a thermal conductivity of 2.13 watts/meter.
Example 2:
40 parts of epoxy resin, 12 parts of alumina powder, 9 parts of talcum powder, 3 parts of graphite fiber and CaCO335 parts of BYK-W9010 wetting agent 0.5 part, 2 parts of RS-404 release agent, 20 parts of alkali-free high-strength fiber and 1.1 parts of auxiliary agent are blended to prepare the thermosetting composite material with excellent heat-conducting property.
The thermal conductivity of the obtained thermosetting composite material is 2.3W/m.
Example 3:
65 portions of epoxy resin, 20 portions of alumina powder, 15 portions of talcum powder, 4 portions of graphite fiber and CaCO350 parts of BYK-W9010 wetting agent, 1 part of RS-404 release agent, 30 parts of alkali-free high-strength fiber and 1.8 parts of auxiliary agent are blended to prepare the thermosetting composite material with excellent heat conductivity.
The resulting thermoset composite had a thermal conductivity of 2.16 watts/meter.
The thermosetting composite material has excellent heat conducting performance and heat conducting coefficient up to 2.3W/m.
The above description is only a preferred embodiment of the present invention, and not intended to limit the present invention in any way, and those skilled in the art can make various changes and modifications to the equivalent embodiments without departing from the scope of the present invention, and all such changes, modifications, equivalents and improvements that can be made to the above embodiments without departing from the technical spirit of the present invention are within the spirit and principle of the present invention.
Claims (7)
1. The thermosetting composite material with excellent heat conductivity is characterized by comprising the following raw materials in parts by weight: 15-65 parts of thermosetting polymer, 4-20 parts of spherical ceramic powder, 3-15 parts of flaky heat conducting powder and 2-4 parts of fibrous fillerPortion (CaCO)320-50 parts of wetting agent, 0.1-1 part of parting agent, 1-3 parts of alkali-free high-strength fiber and 0.5-1.8 parts of auxiliary agent.
2. A thermosetting composite material with excellent thermal conductivity according to claim 1, wherein the thermosetting polymer is one or more of epoxy polymer, unsaturated polyester polymer, polyimide polymer, bismaleimide triazine polymer, cyanate ester polymer, vinyl polymer, benzoxazine polymer, benzocyclobutene polymer, alkyd polymer, phenol-formaldehyde novolac polymer, resol polymer, melamine-formaldehyde polymer, urea-formaldehyde polymer, methylolfuran polymer, isocyanate polymer, diallyl phthalate polymer, triallyl cyanurate polymer, triallyl isocyanurate polymer, and unsaturated polyester imide.
3. The thermosetting composite material with excellent heat conductivity as claimed in claim 1, wherein the spherical ceramic powder is one or more of alumina powder, silicon carbide powder, magnesium hydroxide powder and aluminum hydroxide powder.
4. The thermosetting composite material with excellent heat conductivity as claimed in claim 1, wherein the flaky heat conductive powder is one or more of talc powder and mica powder.
5. The thermosetting composite material with excellent heat conductivity as claimed in claim 1, wherein the fibrous filler is one or more of graphite fiber and oxide whisker.
6. The thermosetting composite material with excellent thermal conductivity as claimed in any one of claims 1 to 4, wherein the wetting agent is BYK-W9010, and the release agent is RS-404.
7. The method for preparing a thermosetting composite material with excellent thermal conductivity as claimed in claim 1, wherein the thermosetting polymer is 15-65 parts by weight, the spherical ceramic powder is 4-20 parts by weight, the flaky thermal conductive powder is 3-15 parts by weight, the fibrous filler is 2-4 parts by weight, CaCO320-50 parts of wetting agent, 0.1-1 part of parting agent, 1-3 parts of non-alkali high-strength fiber, 10-30 parts of assistant and 0.5-1.8 parts of blending to prepare the thermosetting composite material with excellent heat-conducting property.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010271921.7A CN111423697A (en) | 2020-04-09 | 2020-04-09 | Thermosetting composite material with excellent heat conductivity and preparation method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010271921.7A CN111423697A (en) | 2020-04-09 | 2020-04-09 | Thermosetting composite material with excellent heat conductivity and preparation method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN111423697A true CN111423697A (en) | 2020-07-17 |
Family
ID=71557698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010271921.7A Pending CN111423697A (en) | 2020-04-09 | 2020-04-09 | Thermosetting composite material with excellent heat conductivity and preparation method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111423697A (en) |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009054567A1 (en) * | 2007-10-23 | 2009-04-30 | Cheil Industries Inc. | Thermal conductive polymer composite and article using the same |
CN101787178A (en) * | 2010-03-09 | 2010-07-28 | 王全胜 | Heat-conduction electric insulation composite material component and manufacturing method thereof |
CN102234410A (en) * | 2010-04-28 | 2011-11-09 | 上海合复新材料科技有限公司 | Heat-conducting thermosetting molding composite material and application thereof |
CN102260413A (en) * | 2010-05-28 | 2011-11-30 | 合复新材料科技(无锡)有限公司 | Composite material component with high flame retardation performance and high heat conduction performance, and its manufacture method |
CN102408610A (en) * | 2011-11-14 | 2012-04-11 | 联塑市政管道(河北)有限公司 | Functional polyethylene pipe and preparation method thereof |
CN102532897A (en) * | 2010-12-27 | 2012-07-04 | 合肥杰事杰新材料股份有限公司 | Electric-insulating heat-conducting polyphenyl thioether composite material and preparation method thereof |
CN104479389A (en) * | 2014-08-06 | 2015-04-01 | 宁国中奕橡塑有限公司 | Thermoset composite |
CN105754348A (en) * | 2016-03-08 | 2016-07-13 | 安徽大学 | Low-filling high-heat-conductivity organic-inorganic compound |
CN107236506A (en) * | 2017-06-28 | 2017-10-10 | 常州水精灵环保设备有限公司 | A kind of double-component epoxy resin embedding adhesive |
CN108285612A (en) * | 2017-01-09 | 2018-07-17 | 江南大学 | A kind of high heat conductive insulating thermosetting polymer and preparation method |
CN108641372A (en) * | 2018-05-02 | 2018-10-12 | 苏州捷德瑞精密机械有限公司 | A kind of preparation method of elastomer thermal interface material |
CN109181316A (en) * | 2018-08-31 | 2019-01-11 | 清华大学深圳研究生院 | Heat-conductive composite material and preparation method thereof |
-
2020
- 2020-04-09 CN CN202010271921.7A patent/CN111423697A/en active Pending
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009054567A1 (en) * | 2007-10-23 | 2009-04-30 | Cheil Industries Inc. | Thermal conductive polymer composite and article using the same |
CN101787178A (en) * | 2010-03-09 | 2010-07-28 | 王全胜 | Heat-conduction electric insulation composite material component and manufacturing method thereof |
CN102234410A (en) * | 2010-04-28 | 2011-11-09 | 上海合复新材料科技有限公司 | Heat-conducting thermosetting molding composite material and application thereof |
CN102260413A (en) * | 2010-05-28 | 2011-11-30 | 合复新材料科技(无锡)有限公司 | Composite material component with high flame retardation performance and high heat conduction performance, and its manufacture method |
CN102532897A (en) * | 2010-12-27 | 2012-07-04 | 合肥杰事杰新材料股份有限公司 | Electric-insulating heat-conducting polyphenyl thioether composite material and preparation method thereof |
CN102408610A (en) * | 2011-11-14 | 2012-04-11 | 联塑市政管道(河北)有限公司 | Functional polyethylene pipe and preparation method thereof |
CN104479389A (en) * | 2014-08-06 | 2015-04-01 | 宁国中奕橡塑有限公司 | Thermoset composite |
CN105754348A (en) * | 2016-03-08 | 2016-07-13 | 安徽大学 | Low-filling high-heat-conductivity organic-inorganic compound |
CN108285612A (en) * | 2017-01-09 | 2018-07-17 | 江南大学 | A kind of high heat conductive insulating thermosetting polymer and preparation method |
CN107236506A (en) * | 2017-06-28 | 2017-10-10 | 常州水精灵环保设备有限公司 | A kind of double-component epoxy resin embedding adhesive |
CN108641372A (en) * | 2018-05-02 | 2018-10-12 | 苏州捷德瑞精密机械有限公司 | A kind of preparation method of elastomer thermal interface material |
CN109181316A (en) * | 2018-08-31 | 2019-01-11 | 清华大学深圳研究生院 | Heat-conductive composite material and preparation method thereof |
Non-Patent Citations (1)
Title |
---|
刘升华 等: "不同形态填料填充导热复合材料的研究进展" * |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102337014A (en) | Resin-based composite material with controllable linear expansion coefficient and preparation method thereof | |
CN103304911A (en) | Flame-retardant reinforced ABS (Acrylonitrile Butadiene Styrene) material and preparation method thereof | |
CN103342891A (en) | High-performance flame-retardant heat-conductive plastic material and preparation method thereof | |
CN104559061A (en) | High-thermal conductivity insulated carbon filler, high-thermal conductivity insulated epoxy resin composite material and preparation method thereof | |
CN105199619B (en) | Aluminum-based copper-clad plate high-heat-conductivity glue membrane preparation method | |
CN101824147B (en) | Modified bismaleimide-triazine resin and preparation method thereof | |
CN105062054A (en) | High-heat-conducting aging-resistant PA10T composite heat radiating material for LED lamp and preparation method therefor | |
CN104031355A (en) | Epoxy resin composition cured and modified by carboxyl-containing polyether nitrile sulphone ketone copolymer as well as preparation method and application of epoxy resin composition | |
CN111423697A (en) | Thermosetting composite material with excellent heat conductivity and preparation method thereof | |
JP2818926B2 (en) | Resin composition for high frequency electronic components | |
CN103013033B (en) | Nanometer and high heat conductivity type composite plastic cement | |
JP2017081136A (en) | Fiber-reinforced plastic molded product | |
CN106995673A (en) | A kind of low-gravity composite heat-conducting insulating cement and preparation method thereof | |
CN116694030A (en) | Ultra-light high-strength composite material and preparation method and application thereof | |
CN113387703B (en) | Directional graphite material and preparation method thereof | |
CN104987713A (en) | Polyamide 10T composite thermal dissipation material with high thermal conductivity for light-emitting diode lamp, and preparation method thereof | |
CN105131591A (en) | Heat-resistant PA10T composite heat-dissipating material used in LED light and preparation method thereof | |
CN110408177B (en) | Heat-conducting plastic with single-layer filler structure and preparation method and application thereof | |
JP2008248048A (en) | Molding material of high heat conductive thermoplastic resin | |
Tan et al. | Dielectric and thermal properties of GFs/PTFE composites with hybrid fillers of Al2O3 and hBN for microwave substrate applications | |
CN105694355A (en) | Resin based composite | |
CN111500039A (en) | Thermosetting composite material with high gloss and excellent electrical property and preparation method thereof | |
CN102863737B (en) | Preparation method of halogen-free flame-retardant epoxy-resin-modified phenolic FRP material | |
JP3748939B2 (en) | Laminate for superconducting equipment and method for manufacturing the same | |
CN105062057A (en) | High-wear-resisting PA10T composite heat radiating material for LED lamp and preparation method therefor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200717 |