CN106995673A - A kind of low-gravity composite heat-conducting insulating cement and preparation method thereof - Google Patents
A kind of low-gravity composite heat-conducting insulating cement and preparation method thereof Download PDFInfo
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- CN106995673A CN106995673A CN201710243884.7A CN201710243884A CN106995673A CN 106995673 A CN106995673 A CN 106995673A CN 201710243884 A CN201710243884 A CN 201710243884A CN 106995673 A CN106995673 A CN 106995673A
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C09J11/04—Non-macromolecular additives inorganic
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
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Abstract
The invention provides a kind of low-gravity composite heat-conducting insulating cement, it is prepared by filler, coupling agent, epoxy resin and curing agent, and the filler includes class graphitic carbon nitride.The application is using graphitic carbon nitride as main heat filling, using coupling agent as surface modifier, using epoxy resin as matrix, is prepared for a kind of thermal conductivity factor height, excellent mechanical performance, good insulation preformance and low-gravity composite heat-conducting insulating cement.
Description
Technical field
The present invention relates to technical field of composite materials, more particularly to a kind of low-gravity composite heat-conducting insulating cement and its preparation side
Method.
Background technology
Epoxy resins insulation glue has good physical and chemical performance, and its surface to metal and nonmetallic materials has excellent
Different adhesive strength, good electrical insulation properties, deformation retract rate is small, and product size stability is good, and hardness is high, pliability compared with
It is good, to most of solvent-stable, thus it is widely used in PCB, space flight and aviation, automobile production processing and new energy electricity
Basin irrigation seals field.With the high speed development of electronics industry, electronic component and electronic equipment are increasingly to light, thin, small direction
Development, certainly will so cause the heat produced during its internal components arrangement works to be not easy to distribute in the environment, so as to cause electricity
Sub- component temperature rise, influences its stability.This requires the epoxy resins insulation glue for purposes such as embedding, bondings to possess
Good heat-sinking capability so that the heat that electronic equipment is produced can be passed rapidly, and then keep the temperature of equipment
In certain scope.Meanwhile, epoxy resin is easily lighted, in order to avoid fire, also requires that epoxy insulation glue has anti-flammability.
And common epoxy resins insulation glue has the following disadvantages in the application：One is that thermal conductivity is low, only 0.2W/ (mK) left and right；
Two be poor flame retardant properties, and easy firing, burning can produce molten drop, and with a large amount of black smokes, environment is adversely affected.How to have
Effect ground improves the heat conductivility and fire resistance of epoxy resin simultaneously, is one of focus for studying at present.
At present, there is more company to both participate in production both at home and abroad or research and develop thermal conductive insulation glue, the DOW CORNING in such as U.S., figure advanced in years,
Electronics Co., Ltd. and Dongguan City Sheng En Electronic Science and Technology Co., Ltd.s etc. are crossed over by the companies such as Japanese SHIN-ETSU HANTOTAI, domestic Shenzhen.
However, with foreign countries production thermal conductive insulation glue product compared with, domestic thermal conductive insulation glue is not only expensive, and its thermal conductivity and
Other physicochemical properties are relatively low.Therefore develop performance it is suitable with same kind of products at abroad, while having leading for excellent fire resistance concurrently
Heat insulation glue has important practical significance.
It is to develop a kind of conventional method of thermal conductive insulation glue by filling the filler of high thermal conductivity coefficient in the polymer.It is existing
Technology is mainly by adding the fillers such as aluminum oxide, aluminium nitride, boron nitride, silicon nitride, and by silane coupler or other are super
Branched modification agent carries out surface modification to filler, filler is well mixed with epoxy resin-base, and raising filler is in the base
Dispersiveness, the thermal resistance between reduction filler and matrix.But above-mentioned inorganic filler generally requires larger amount of filling and (typically existed
50% or so) it can be only achieved high thermal conductivity factor, and the excessive adhesive property for influencing whether epoxy resin of amount of filling, it can process
Property is substantially reduced.The inorganic filler largely added simultaneously is larger with respect to epoxy resin density, is easily settled after addition, solidifies simultaneously
Epoxy resin afterwards is because proportion increase limits its application.It would therefore be highly desirable to research and develop a kind of thermal conductivity factor height, good mechanical property,
Excellent insulation performance and low-gravity composite heat-conducting insulating cement.
The content of the invention
Present invention solves the technical problem that being to provide a kind of low-gravity high heat conduction compound inslation glue, what the application was provided answers
Closing thermal conductive insulation glue has good thermal conductivity factor height, machining property, excellent insulation performance and low-gravity advantage.
In view of this, this application provides a kind of low-gravity composite heat-conducting insulating cement, by filler, coupling agent, epoxy resin
Prepared with curing agent, the filler includes class graphitic carbon nitride.
It is preferred that, the filler also includes BN and Al2O3One or both of.
It is preferred that, the coupling agent is 5wt%~10wt% of the filler, and the content of the filler is no more than described multiple
Close the 50wt% of thermal conductive insulation glue.
It is preferred that, the coupling agent is one or both of silane coupler and titanate coupling agent.
It is preferred that, the filler is class graphitic carbon nitride, BN and Al2O3When, the class graphitic carbon nitride and BN matter
Amount is than being 1:1, the class graphitic carbon nitride and Al2O3Mass ratio be 1:1.
It is preferred that, the curing agent is ethylenediamine.
Present invention also provides the preparation method of described low-gravity composite heat-conducting insulating cement, including：
Curing agent is added after filler, coupling agent are mixed with epoxy resin to be solidified, and obtains low-gravity composite heat-conducting
Insulating cement.
It is preferred that, the process for preparing composite heat-conducting insulating cement is specially：
Filler is mixed with solvent, coupling agent is added and carries out ultrasound, dried after sealing, obtain modified filler；
By the modified filler and epoxy resin ultrasonic mixing, solidify after the grinding of three rollers with curing agent Hybrid Heating,
Obtain low-gravity composite heat-conducting insulating cement.
It is preferred that, the solvent is that volume ratio is (1~10):1 ethanol and the mixed solution of distilled water；The filler with
The volume ratio of the solvent is 1：(5~10).
It is preferred that, the condition of the solidification is 45~60 DEG C of 12~48h of vacuum drying solidification.
This application provides a kind of low-gravity composite heat-conducting insulating cement, it is by filler, coupling agent, epoxy resin and curing agent
Prepare, the filler includes class graphitic carbon nitride (g-C3N4)；g-C3N4As the semiconductor of graphite-like structure, compare
Metal oxide filler, it has associative key between stronger atom, with more complete crystalline structure, can substantially reduce thermal expansion
Phon scattering during dissipating, with higher thermal conductivity factor；Compared to the high heat-conductivity conducting of graphene, g-C3N4Due in the absence of
The electronics moved freely, with good insulating properties, while g-C3N4Also there is excellent toughness, low coefficient of friction and excellent
Good antiwear characteristic, g-C3N4Mainly in two kinds of light weight elements of C, N are constituted, its density is low very with respect to inorganic compound filler
It is many, therefore the application is by g-C3N4As the filler of composite heat-conducting insulating cement, composite heat-conducting insulating cement is set to have preferable heat conduction exhausted
Edge, high-termal conductivity, low-gravity and excellent mechanical performance.
Brief description of the drawings
Fig. 1 is the chemical constitution schematic diagram of class graphitic carbon nitride of the present invention；
Fig. 2 is the XRD spectra of class graphitic carbon nitride prepared by the embodiment of the present invention 1；
Fig. 3 is that the contrast TG of epoxy resin of the present invention and composite heat-conducting insulating cement schemes.
Embodiment
For a further understanding of the present invention, the preferred embodiment of the invention is described with reference to embodiment, still
It should be appreciated that these descriptions are simply to further illustrate the features and advantages of the present invention, rather than to the claims in the present invention
Limitation.
The embodiment of the invention discloses a kind of low-gravity composite heat-conducting insulating cement, by filler, coupling agent, epoxy resin with consolidating
Agent is prepared, and the filler includes class graphitic carbon nitride.
C3N4A kind of carboritride, it have five kinds of structures that may be present i.e. α phases, β phases, Emission in Cubic, quasi- Emission in Cubic and
Class graphite mould.Class graphite type carbon nitride g-C3N4Density is minimum, and energy is also minimum, is the most stable phase in carboritride；g-
C3N4Layer structure with similar graphite, interlayer contains C3N3Ring or C6N7It is connected and shape by the N atoms of end between ring, ring
Into the plane of one layer of infinite expanding；g-C3N4Chemical constitution it is as shown in Figure 1.
Therefore, g-C3N4As the semiconductor of graphite-like structure, compared to metal oxide filler, between stronger atom
Associative key, with more complete crystalline structure, can substantially reduce the phon scattering in thermal diffusion process, with higher heat conduction
Coefficient；Compared to the high heat-conductivity conducting of graphene, g-C3N4Due in the absence of the electronics moved freely, with good insulating properties,
It is a kind of extraordinary selection as heat-conductive insulation filling.
Simultaneously as g-C3N4With two-dimensional semiconductor characteristic, stratiform blocking effect can be formed by being added in epoxide-resin glue
Be catalyzed into carbon effect, improve the heat endurance and fire resistance of epoxide-resin glue.
Meanwhile, carbon nitride material has the hardness compared favourably with diamond, it is considered to be the superhard material of future new era,
Also there is excellent toughness, low coefficient of friction and excellent antiwear characteristic.Therefore, the application by adding in the epoxy
g-C3N4As main heat filling, the thermal conductivity factor of insulating cement can be not only improved, insulating cement exhausted in itself is maintained
Edge performance, can also improve the mechanical performances such as shock resistance, toughness, the hardness of insulating cement.Due to g-C3N4Mainly there are two kinds of light weights of C, N
Element is constituted, and its density is much lower relative to inorganic compound filler, and it is filled in epoxy resin heat conductive insulating glue in low ratio
There is very high potential value in the filling glue application of weight.
Further, BN and Al is also included in the filler2O3One or both of.Simultaneously including g- in filler
C3N4With hexagonal boron nitride, due to both layer structures, it can act synergistically to effectively improve the heat conduction of epoxy resins insulation glue
Performance.Simultaneously including g-C in filler3N4With spherical alumina powder, because two kinds of fillers of tabular-spherical stacking can increase
Plus more passages of heat, effectively improve the heat conductivility of epoxy resins insulation glue.Certainly, in order to further improve composite heat-conducting
The performance of insulating cement, the filler is preferably simultaneously including g-C3N4, BN and Al2O3, now, the class graphitic carbon nitride and BN
Mass ratio be 1:1, the class graphitic carbon nitride and Al2O3Mass ratio be 1:1.In order to improve the performance of thermal conductive insulation glue,
The content of filler described herein is no more than the 50wt% of composite heat-conducting insulating cement.
The effect of coupling agent is to connect g-C by chemical bond in the application3N4And epoxy resin, both interface heat of reduction
Resistance.The content of the coupling agent is 5wt%~10wt% of the packing quality, in a particular embodiment, the coupling agent
Content can be 5wt%, 6wt%, 7wt%, 8wt%, 9wt% or 10wt% of packing quality.The coupling agent is this area
Coupling agent known to technical staff, has no particular limits to this application, example, and the coupling agent can be silane coupler
KH550, KH560, KH570 or titanate coupling agent.The curing agent to be well known to those skilled in the art, example, it is described
Curing agent is ethylenediamine.
Present invention also provides the preparation method of composite heat-conducting insulating cement, including：
Curing agent is added after filler, coupling agent are mixed with epoxy resin to be solidified, and obtains composite heat-conducting insulating cement.
In order that raw material is more fully mixed, and effectively realize the abundant modification to filler, the composite heat-conducting insulating cement
Preparation process be specially：
Filler is mixed with solvent, coupling agent is added and carries out ultrasound, dried after sealing, obtain modified filler；
By the modified filler and epoxy resin ultrasonic mixing, solidify after the grinding of three rollers with curing agent Hybrid Heating,
Obtain low-gravity composite heat-conducting insulating cement.
In above process, the filler is class graphitic carbon nitride, may also include BN and Al2O3One or both of.
The preparation of herein described class graphitic carbon nitride is carried out according to mode well known to those skilled in the art, is not had to this application
Special limitation, example, the preparation of the class graphitic carbon nitride is specially：
Melamine is warming up to 400~600 DEG C in a nitrogen atmosphere, heating rate is 1~5 DEG C/min, roasting 2~
5h, cooling, obtains class graphitic carbon nitride.
The C of the class graphitic carbon nitride prepared according to the method described above:N ratios are close to class graphite structure carbonitride (g-C3N4)
Theoretical value.
During composite heat-conducting insulating cement is prepared, coupling agent is added after filler is mixed with solvent first, is coupled
After agent is modified to filler, modified filler is obtained.In above process, the group on the coupling agent and the filler surface is such as
Hydroxyl etc. reacts bonding, is then grafted onto filler surface, realizes and the surface of filler is modified.In above process, the solvent
It is (1~10) for volume ratio:1 ethanol and the mixed solution of distilled water, in a particular embodiment, the ethanol and distilled water
Volume ratio is 3:1；The volume ratio of the filler and the solvent is 1：(5~10).The ultrasonic time is 10~30min；
Add after coupling agent, the modification of filler carried out in a sealed meter environment to prevent solvent from largely volatilizing, time of sealing stirring for 1~
5h。
After filler modified, the preparation of composite heat-conducting insulating cement is carried out, will be after the modified filler mixes with epoxy resin
Ultrasound, is heating and curing after being mixed with curing agent, obtains composite heat-conducting insulating cement.In above process, the curing agent by with
The epoxide group reactive polymeric curing molding of epoxy resin, obtains composite heat-conducting insulating cement.The ultrasonic time be 10~
30min, heating-up temperature is 65~100 DEG C, and the heat time is 2~8h；It is described to be solidificated under the conditions of 45~60 DEG C of vacuum drying
Carry out, the hardening time is 12~48h.
The application is preferably mixed using class graphitic carbon nitride as main heat filling with other fillers, using coupling agent as table
Face modifying agent, using epoxy resin as matrix, is prepared for a kind of thermal conductivity factor height, excellent mechanical performance, good insulation preformance and low
The composite heat-conducting insulating cement of proportion.
For a further understanding of the present invention, the composite heat-conducting insulating cement that the present invention is provided is carried out with reference to embodiment detailed
Describe in detail bright, protection scope of the present invention is not limited by the following examples.
Embodiment 1
Weigh 5g melamines to be put in corundum crucible and be capped, be warming up to 550 DEG C, liter under nitrogen atmosphere in tube furnace
Warm speed is 3 DEG C of min-1, and be calcined at 550 DEG C after 4h, naturally cool to room temperature and obtain faint yellow solid, grinding produces class graphite
Type carbonitride (g-C3N4).Fig. 2 is the XRD spectrum of class graphitic carbon nitride manufactured in the present embodiment, and table 1 is prepared for the present embodiment
Class graphitic carbon nitride constituent content analysis table.
The constituent content analysis table of the class graphitic carbon nitride manufactured in the present embodiment of table 1
| Element | C | H | N |
| Content (%) | 33.75 | 1.34 | 60.38 |
Class graphitic carbon nitride in following examples is prepared according to the method for embodiment 1.
Embodiment 2
1) weigh 3g and prepare g-C3N4, it is 3 to be added to 50mL volume ratios：1 ethanol is with distilling in water mixed solution, ultrasound
25min, adds and is sealed at 0.3g silane couplers KH570,65 DEG C with preservative film, mechanical agitation 4h, pours into natural in glass dish
Under the conditions of solvent flashing 12h, dry in baking oven, obtain the g-C of surface modification3N4Modified filler；
2) 20 parts of the modified filler prepared in step 1 is weighed, is added in 80 parts of epoxy resin E51, is added at 65 DEG C
Thermal agitation 5h, adds 0.5 part of curing agent ethylene diamine after the grinding of three rollers, is well mixed, is extracted in 45 DEG C of vacuum drying chambers
Bubble 15min, removes after the bubble in epoxy resin mixed liquor, is poured into the mould got ready, in 45 DEG C of vacuum drying chambers
Extract after bubble, solidify 24h, obtain compound adhesive.
Embodiment 3
1) mass ratio 1 is weighed:1 BN and g-C3N4Mixed fillers 3g, it is 3 to be added to 50mL volume ratios：1 ethanol and steaming
In distilled water mixed solution, ultrasonic 25min is added and sealed at 0.3g silane coupler KH570,65 DEG C with preservative film, machinery is stirred
4h is mixed, pours into glass dish and is dried under natural conditions in solvent flashing 12h, baking oven, the BN/g-C of surface modification is obtained3N4Mixing
Modified filler；
2) 20 parts of the mixed and modified filler prepared in step 1 is weighed, is added in 80 parts of epoxy resin E51, at 65 DEG C
Lower heating stirring 5h, adds 0.5 part of curing agent ethylene diamine after the grinding of three rollers, is well mixed, in 45 DEG C of vacuum drying chambers
Bubble 15min is extracted, removes after the bubble in epoxy resin mixed liquor, is poured into the mould got ready, 45 DEG C of vacuum drying
Extracted in case after bubble, solidify 24h, obtain compound adhesive.
Embodiment 4
1) mass ratio 1 is weighed:1 Al2O3With g-C3N4Mixed fillers 3g, be added to 50ml volume ratios for 3：1 ethanol
With distilling in water mixed solution, ultrasonic 25min adds 0.3g silane coupler KH570, sealing stirring 4h, pours into glass dish
Dried under middle natural conditions in solvent flashing 12h, baking oven, obtain the g-C of surface modification3N4/Al2O3Mixed and modified filler；
2) 20 parts of the modified filler prepared in step 1 is weighed, is added in 80 parts of epoxy resin E51, is added at 65 DEG C
Heat stirs 5h, adds 0.5 part of curing agent ethylene diamine after the grinding of three rollers, is well mixed, 15min is vacuumized in freeze drier,
It is poured into after removing the bubble in epoxy resin composition in the mould got ready, solidifies 24h, obtain compound adhesive.
Embodiment 5
1) preparation g-C is weighed3N43g, it is 3 to be added to 50ml volume ratios：1 ethanol is with distilling in water mixed solution, ultrasound
25min, adds and is sealed at 0.3g silane coupler KH570,65 DEG C with preservative film, mechanical agitation 4h, pour into glass dish from
Dried in solvent flashing 12h under the conditions of so, baking oven, obtain surface and be modified g-C3N4Modified filler；
2) 50 parts of the modified filler prepared in step 1 is weighed, is added in 50 parts of epoxy resin E51, is added at 65 DEG C
Thermal agitation 5h, adds 0.5 part of curing agent ethylene diamine after the grinding of three rollers, is well mixed, is extracted in 45 DEG C of vacuum drying chambers
Bubble 15min, removes after the bubble in epoxy resin mixed liquor, is poured into the mould got ready, in 45 DEG C of vacuum drying chambers
Extract after bubble, solidify 24h, obtain compound adhesive.
Embodiment 6
1) mass ratio 1 is weighed:1 BN and g-C3N4Mixed fillers 3g, be added to 50ml volume ratios for 3：1 ethanol with
Distill in water mixed solution, ultrasonic 25min, add and sealed at 0.3g silane coupler KH570,65 DEG C with preservative film, machinery
4h is stirred, pours into glass dish and is dried under natural conditions in solvent flashing 12h, baking oven, surface is obtained and is modified BN/g-C3N4Mixing
Modified filler；
2) 50 parts of the modified filler prepared in step 1 is weighed, is added in 50 parts of epoxy resin E51, is added at 65 DEG C
Thermal agitation 5h, adds 0.5 part of curing agent ethylene diamine after the grinding of three rollers, is well mixed, is extracted in 45 DEG C of vacuum drying chambers
Bubble 15min, removes after the bubble in epoxy resin mixed liquor, is poured into the mould got ready, in 45 DEG C of vacuum drying chambers
Extract after bubble, solidify 24h, obtain compound adhesive.
Embodiment 7
1) mass ratio 1 is weighed:1 Al2O3With g-C3N4Mixed fillers 3g, be added to 50ml volume ratios for 3：1 ethanol
With distilling in water mixed solution, ultrasonic 25min adds packing quality 0.3g silane coupler KH570, sealing stirring 4h,
Volatilize ethanol under natural conditions, and drying obtains the g-C of surface modification in baking oven3N4/Al2O3Mixed and modified filler；
2) 50 parts of the modified filler prepared in step 1 is weighed, is added in 50 parts of epoxy resin E51, is added at 65 DEG C
Heat stirs 5h, adds 0.5 part of curing agent ethylene diamine after the grinding of three rollers, is well mixed, 15min is vacuumized in freeze drier,
It is poured into after removing the bubble in epoxy resin composition in the mould got ready, solidifies 24h, obtain compound adhesive.
Comparative example 1
1) preparation Al is weighed2O33g, it is 3 to be added to 50ml volume ratios：1 ethanol is with distilling in water mixed solution, ultrasound
25min, adds and is sealed at 0.3g silane coupler KH570,65 DEG C with preservative film, mechanical agitation 4h, pour into glass dish from
Dried in solvent flashing 12h under the conditions of so, baking oven, obtain the Al of surface modification2O3Modified filler；
2) 20 parts of the modified filler prepared in step 1 is weighed, is added in 80 parts of epoxy resin E51, is added at 65 DEG C
Thermal agitation 5h, adds 0.5 part of curing agent ethylene diamine after the grinding of three rollers, is well mixed, is extracted in 45 DEG C of vacuum drying chambers
Bubble 15min, removes after the bubble in epoxy resin mixed liquor, is poured into the mould got ready, in 45 DEG C of vacuum drying chambers
Extract after bubble, solidify 24h, obtain compound adhesive.
The compound adhesive that embodiment 2~7 is prepared with comparative example 1 is detected that testing result is as shown in table 2.
The performance data table for the compound adhesive that the embodiment of table 2 is prepared with comparative example
Fig. 3 is the TG curve maps for the compound adhesive that epoxy resin is prepared with embodiment 2.Understand that the present invention passes through with reference to upper table
G-C is added in the epoxy3N4Or mixed fillers, before epoxy resin electrical insulation properties and machining property is kept
Put, compared to traditional industrial filler (such as Al2O3) prepare composite heat-conducting insulating cement there is excellent heat conductivility, it is fire-retardant
Performance.
According to statistics, in a home-use new-energy automobile cell panel weight about 150~400kg, heat conduction casting glue
Usage amount about 20~50kg.Conventional casting glue uses Al at this stage2O3, silicon powder etc. make heat filling, glue proportion generally exists
1.8~2.2g/cm3；Its performance requirement is：0.4~0.8W/m*K of heat conduction, limited oxygen index >=22, and with good flowing
Property.If the proportion of glue is down into 1.6g/cm3Hereinafter, then under equal packing volume, the weight of glue reduces 10~30%.With
50kg casting glues consumption is calculated, then can reduce by 5~15kg." use and structure design of the 5~15kg " weight from new material, work
It is significant to automotive light weight technology in terms of skill.By the proportion in table, the g-C prepared by the present invention3N4/ ring
Oxygen tree fat thermal conductive insulation glue not only heat conductivility, superior flame retardant property, and proportion is very low, in new-energy automobile lightweight
There is huge application value.
The explanation of above example is only intended to the method and its core concept for helping to understand the present invention.It should be pointed out that pair
, under the premise without departing from the principles of the invention, can also be to present invention progress for those skilled in the art
Some improvement and modification, these are improved and modification is also fallen into the protection domain of the claims in the present invention.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or using the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope caused.
Claims (10)
1. a kind of low-gravity composite heat-conducting insulating cement, is prepared by filler, coupling agent, epoxy resin and curing agent, described to fill out
Material includes class graphitic carbon nitride.
2. low-gravity composite heat-conducting insulating cement according to claim 1, it is characterised in that the filler also include BN and
Al2O3One or both of.
3. low-gravity composite heat-conducting insulating cement according to claim 1, it is characterised in that the coupling agent is the filler
5wt%~10wt%, the content of the filler is no more than the 50wt% of the composite heat-conducting insulating cement.
4. low-gravity composite heat-conducting insulating cement according to claim 1, it is characterised in that the coupling agent is silane coupled
One or both of agent and titanate coupling agent.
5. low-gravity composite heat-conducting insulating cement according to claim 1, it is characterised in that the filler is class graphite-like nitrogen
Change carbon, BN and Al2O3When, the class graphitic carbon nitride and BN mass ratio are 1:1, the class graphitic carbon nitride and Al2O3
Mass ratio be 1:1.
6. low-gravity composite heat-conducting insulating cement according to claim 1, it is characterised in that the curing agent is ethylenediamine.
7. the preparation method of the low-gravity composite heat-conducting insulating cement described in claim 1, including：
Curing agent is added after filler, coupling agent are mixed with epoxy resin to be solidified, and obtains the insulation of low-gravity composite heat-conducting
Glue.
8. preparation method according to claim 7, it is characterised in that the process for preparing composite heat-conducting insulating cement is specially：
Filler is mixed with solvent, coupling agent is added and carries out ultrasound, dried after sealing, obtain modified filler；
By the modified filler and epoxy resin ultrasonic mixing, solidify after the grinding of three rollers with curing agent Hybrid Heating, obtain
Low-gravity composite heat-conducting insulating cement.
9. preparation method according to claim 8, it is characterised in that the solvent is that volume ratio is (1~10):1 second
The mixed solution of alcohol and distilled water；The volume ratio of the filler and the solvent is 1：(5~10).
10. the preparation method according to claim 7 or 8, it is characterised in that the condition of the solidification is 45~60 DEG C of vacuum
12~48h of dry solidification.
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