CN111422821A - Microsystem packaging method - Google Patents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
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Abstract
The application relates to a microsystem packaging method. The microsystem packaging method can complete the integration of microsystem architecture by integrating the interface electrode and the micro device general circuit on the substrate and forming a preformed package with at least one open cavity on the side of the substrate facing the micro device general circuit. The integration level and the mass production performance of the micro system framework can be improved by enabling the preformed packaging body to wrap the micro device universal circuit, the openness of the micro system framework can be improved by exposing the interface electrode in the open cavity, an open interface electrode is provided for subsequently integrating and packaging the micro device on the interface electrode, and flexible type selection and scene application of the micro device can be realized.
Description
Technical Field
The present application relates to the field of microsystems technologies, and in particular, to a microsystem packaging method.
Background
With the comprehensive entrance of the human society into the information age, more and more scenes and objects need to be monitored in real time in production and life, such as the running conditions of vehicles, the line safety of urban pipe galleries, the real-time states of logistics goods, the health degree of the environment and human bodies, and the like. Because the monitoring requirements have the characteristics of low information density, wide distribution range, difficult maintenance and management, low added value and the like, the monitoring requirements put forward higher requirements on the size, power consumption, cost, information fusion degree and intelligent degree of the sensing system, and the traditional sensing system is difficult to be competent.
The advent of microsensors has made possible miniaturized, lightweight, low-cost, intelligent sensing microsystems, and microsystem integration technology is critical for microsensors going from raw wafers to end-use applications. In the conventional scheme, a system-in-package process is usually adopted to perform one-step molding on a microsensor wafer, a matched special functional circuit wafer and a closed package required by an application scene, so that a scene-oriented special microsystem is formed, and a downstream terminal equipment manufacturer can obtain a special scene-oriented terminal product by adding only a small amount of peripheral auxiliary devices. Therefore, the special microsystem for scenes manufactured by the method has the defects of narrow application range, incapability of being reused and the like.
Disclosure of Invention
Therefore, it is necessary to provide a method for packaging a microsystem, which aims at the problem that the microsystem in the conventional scheme has a narrow application range and cannot be reused.
The application provides a microsystem packaging method, which comprises the following steps:
integrating an interface electrode and a micro device general circuit on a substrate;
forming a pre-formed package with at least one open cavity on a side of the substrate facing the micro device general circuit, the pre-formed package encasing the micro device general circuit and exposing the interface electrode within the open cavity;
a micro device is integrated and packaged on the interface electrode.
In one embodiment, the integration and packaging of the micro device on the interface electrode includes:
selecting the micro device according to the application scene of the micro system;
soldering the micro device to the interface electrode;
and packaging the micro device.
In one embodiment, the packaging the micro device includes:
processing a cover plate according to the type of the micro device and the position of the interface electrode on the substrate;
and covering the preformed package body by adopting the cover plate to finish the packaging of the micro device.
In one embodiment, before integrating the interface electrode and the micro device general circuit on the substrate, the method comprises the following steps:
preparing the substrate comprising a plurality of microsystem architectures.
In one embodiment, before selecting the micro device according to the micro system application scenario, the method includes:
and performing singulation processing on the substrate comprising the plurality of microsystem architectures to obtain a plurality of independent microsystem architectures.
In one embodiment, the packaging the micro device includes:
processing a cover plate according to the type of the micro device in each micro system architecture;
and covering the corresponding open cavity by using the cover plate to finish the packaging of the micro device in each micro system architecture.
In one embodiment, the integrated interface electrode and micro device common circuit on a substrate includes:
a plurality of interface electrodes are integrated on the substrate and distributed in an array manner;
and integrating a universal functional electronic component on one side of the substrate facing the interface electrode to form the universal circuit of the micro device.
In one embodiment, the micro devices are micro sensors, micro actuators, and/or other ASIC chips.
In one embodiment, the forming a pre-molded package with at least one open cavity on a side of the substrate facing the micro device general circuit includes:
and processing the preformed package with at least one open cavity by adopting a precision machining method according to the positions of the interface electrode and the micro device general circuit on the substrate, and fixing the preformed package on the side, facing the micro device general circuit, of the substrate.
In one embodiment, the fixing the preformed package to the side of the substrate facing the universal circuit of the micro device includes:
and fixing the preformed package on one side of the substrate facing the universal circuit of the micro device by adopting an adhesive joint, welding or other mechanical methods.
In one embodiment, the forming a pre-molded package with at least one open cavity on a side of the substrate facing the micro device general circuit includes:
and directly forming the preformed package with at least one open chamber on the side of the substrate facing the micro device general circuit by using a cofferdam filling or injection molding encapsulation method according to the positions of the interface electrode and the micro device general circuit on the substrate.
According to the microsystem packaging method, the interface electrode and the micro device general circuit are integrated on the substrate, and the preformed package body with at least one open cavity is formed on one side, facing the micro device general circuit, of the substrate, so that the microsystem architecture can be integrated. The preformed packaging body is used for coating the universal circuit of the micro device, so that the integration level and the mass production performance of the micro system framework can be improved, the openness of the micro system framework can be improved by exposing the interface electrode in the open cavity, an open interface electrode is provided for subsequently integrating and packaging the micro device on the interface electrode, and the flexible type selection and the expansion of applicable scenes of the micro device can be realized.
Drawings
FIG. 1 is a flowchart of a microsystem packaging method according to an embodiment of the present disclosure;
FIG. 2 is a side view of a microsystem structure obtained by a microsystem packaging method according to an embodiment of the present disclosure;
FIG. 3 is a top view of a microsystem structure obtained by a microsystem packaging method according to an embodiment of the present disclosure;
fig. 4 is a top view of a microsystem structure obtained by a microsystem packaging method according to an embodiment of the present disclosure after secondary packaging;
fig. 5 is a flowchart of another microsystem packaging method according to an embodiment of the present disclosure.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and those skilled in the art will be able to make similar modifications without departing from the spirit of the application and it is therefore not intended to be limited to the embodiments disclosed below.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
It can be understood that the microsystem chip prepared by the existing method only aims at a specific scene, and secondary type selection and integration cannot be performed on the micro sensor packaged inside, so that the defects of low openness degree, narrow application range, poor flexibility, low raw material utilization rate, low technical popularization rate and the like exist. When the application scene of the sensor changes, only the whole set of the customized microsystem can be redesigned, and a large amount of material cost and time cost are consumed. In addition, some key links such as substrate manufacturing, injection molding, encapsulation and the like in the process steps have the defects of high processing threshold, high research and development cost, long processing period and the like, so that the design investment risk of the micro system is high, and the product diversity and the technical popularization rate of the micro system industry are limited.
The preparation of the existing sensing microsystem comprises three main parts, namely microsensor integration, microelectronic integration and packaging molding. The micro-electronic integration and packaging molding have relatively uniform industrial standards, and the micro-sensor faces to natural entity objects, has various types and parameters, so that the standards are not uniform when facing to various application industries. Therefore, considering that the existing sensing micro system depends on a one-step molding process, the process coupling relationship of the integration of the micro sensor and the integration of other common parts (including microelectronic integration and package body molding) is too tight, so that the micro sensor is sealed in the micro system too early, and an open micro system packaging and processing scheme is lost, the application provides a micro system packaging method, which can keep the main body (microelectronic circuit and package body) of the micro system unchanged, open the micro system to the outside to replace the micro sensor, thereby leaving the opportunity of the secondary integration of the micro sensor to an application developer close to a user so as to improve the utilization efficiency and the application flexibility of the micro system.
Referring to fig. 1-2, the present application provides a microsystem packaging method, including:
step S10, integrating the interface electrode 20 and the microdevice common circuit 30 on the substrate 10;
step S20, forming a pre-molded package 40 with at least one open cavity 410 on a side of the substrate 10 facing the micro device general circuit 30, the pre-molded package 40 covering the micro device general circuit 30 and exposing the interface electrode 20 in the open cavity 410;
in step S30, a micro device is integrated and packaged on the interface electrode 20.
In step S10, the substrate 10 implements a carrier for the interface electrodes 20 and the microdevice generic circuit 30 to interconnect internal electrical signals and mechanically secure internal components. All components in the microsystem manufactured by the microsystem packaging method can be carried by the substrate 10, and are electrically interconnected through signal lines (metal traces) in the substrate 10. The integration of the interface electrode 20 and the micro device common circuit 30 on the substrate 10 can facilitate the secondary integration of the micro device and improve the integration level of the manufactured micro system. The interface electrode 20 may be a micro device common interface including one or more sets of metal electrodes for connecting the micro devices secondarily integrated in the subsequent step to the substrate 10 and electrically interconnecting with the micro device common circuit 30 through the substrate 10. The micro device general circuit 30 is a general part of the micro system architecture 100, and may include common microelectronic circuits such as signal conditioning, data processing, wireless communication, power management, and the like, so as to provide intelligent algorithms such as signal processing, network adaptation, power management, and the like required by the micro system architecture after the micro device is secondarily integrated, and complete analysis, operation, control, and communication tasks required by the micro system architecture.
In step S20, the microsystem architecture is formed by forming the pre-molded package 40 on the side of the substrate 10 facing the micro device general circuit 30, the pre-molded package 40 encapsulating the micro device general circuit 30, and exposing the interface electrode 20 in the open cavity 410 to form the open interface electrode 20. By forming a through hole in the preformed package 40 and covering the preformed package 40 on the substrate 10, one end of the through hole can be closed by the substrate 10 to form an open cavity 410, wherein the open cavity 410 can be semi-open or fully open. In this embodiment, by forming the pre-formed package 40, the micro device universal circuit 30 may be pre-embedded, so that the open cavity 410 and other functional parts may be integrated in a single package at high density, thereby ensuring high integration of the micro system architecture, and thus improving the integration level of the micro system manufactured by the micro system packaging method, so that the overall size of the micro system may reach millimeter level, which is improved by magnitude compared with a board level micro system. In addition, through the open cavity 410 and the open interface electrode 20, the micro system architecture formed by the micro system packaging method can still perform secondary integration on the required micro device according to the micro system application scene after delivery, or change the micro device after secondary integration. By encapsulating the microdevice generic circuit 30 with the pre-formed package 40, the overall integration of the microsystem fabricated by the microsystem packaging method may be improved.
It is understood that the steps S10 and S20 are processes of the open-type microsystem pre-molding stage in the microsystem packaging method, and the microsystem architecture can be formed. Step S30 is to perform a secondary integration process on the micro device by using the micro system architecture obtained in steps S10 and S20, that is, after the micro system architecture is completed, the required micro device is integrated and packaged on the interface electrode 20. It can be understood that the setting of the step S10 and the step S20 can improve the openness of the microsystem architecture, and the microsystem architecture can be directly delivered to a downstream manufacturer for secondary integration of the microsystem, and the downstream manufacturer only needs to select a required microsystem to integrate into the open microsystem architecture according to the scene requirements of the terminal user and perform simple electrical connection and packaging, so that a microsystem chip facing to the terminal application scene can be obtained, the technical threshold of the microsystem industry chain, the investment risk and the difficulty of participating in the main body are significantly reduced, and the microsystem technology can be more quickly applied and widely popularized. Compared with a microsystem packaging method in the traditional scheme, the microsystem formed by the microsystem packaging method can change the micro device integrated in the microsystem framework, and the material utilization rate and the flexibility of microsystem application are improved.
The microsystem packaging method provided by the present application can complete the integration of the microsystem architecture by integrating the interface electrode 20 and the microdevice generic circuit 30 on the substrate 10 and forming the pre-molded package 40 with at least one open cavity 410 on the side of the substrate 10 facing the microdevice generic circuit 30. The integration level and the mass-producibility of the microsystem architecture can be improved by coating the micro device universal circuit 30 with the preformed package 40, the openness of the microsystem architecture can be improved by exposing the interface electrode 20 in the open chamber 410, the open interface electrode 20 is provided for subsequently integrating and packaging the micro device on the interface electrode 20, and flexible selection and expansion of applicable scenes of the micro device can be realized.
Therefore, the microsystem packaging method provided by the application can divide the primary forming process of the existing microsystem into two stages of the prefabrication forming of the microsystem framework and the secondary integration of the microsystem, so that two links of the microsystem framework integration and the microsystem integration are not influenced and independently developed, the high integration degree and the mass production performance of the whole microsystem can be ensured, and the integration difficulty of the microsystem secondary integration and the technical thresholds of upstream and downstream links such as chip design, wafer processing, system integration, application opening and the like in the microsystem industrial chain can be reduced. According to the microsystem packaging method, the microsystem architecture is integrated, the microsystem is secondarily integrated, the micro device selection opportunity is left to downstream users, the flexibility of microsystem development and application can be improved, deep labor division is promoted, repeated production is reduced, the resource efficiency is improved, the optimized configuration of microsystem production resources is promoted, and the application range of the microsystem is expanded.
In one embodiment, the integration and packaging of the micro device on the interface electrode 20 includes: selecting a micro device according to the application scene of the micro system; soldering the micro device to the interface electrode 20; and packaging the micro device. In this embodiment, the sensing requirements of the microsystem application scenario can be met, and the micro devices required by the scenario are secondarily integrated by combining the open chamber 410 and the open interface electrode 20. In one embodiment, the micro device may be a micro sensor, micro actuator or other ASIC chip. Meanwhile, the micro devices may be in the form of a bare wafer and/or a packaged chip. The micro device to be integrated after being selected according to the application scenario of the micro system may be mechanically fixed in the open cavity 410 by using materials such as silver paste, silica gel, or solder, and then electrically connected to the interface electrode 20 on the substrate 10 by using methods such as wire bonding, solder welding, or a custom adapter plate. It can be understood that the flexibility of the microsystem packaging method can be improved by selecting the micro device according to the application scene of the microsystem, and the application range of the manufactured microsystem is expanded.
In one embodiment, a method for packaging a micro device includes: processing the cover plate 50 according to the type of the micro device and the position of the interface electrode 20 on the substrate 10; the pre-formed package 40 is covered with a cover plate 50 to complete the packaging of the micro devices. In this embodiment, a suitable cover plate 50 may be selected and processed according to the type of the micro device, for example, a through hole or a window may be formed in the cover plate 50 according to the type of the micro device to be integrated, or a flat plate that can seal the open chamber 410 may be selected. After the cover plate 50 is processed, the preformed package 40 is completely covered by the cover plate 50, so that the whole preformed package 40 can be protected, and the service life of the microsystem manufactured by the microsystem packaging method is prolonged. It will be appreciated that the cover plate 50 may be secured to the top surface of the preformed package 40 by gluing or parallel seam welding, etc., and covers the open cavity 410 and its internal integrated micro devices. After the cover plate 50 is adopted to package the micro device, the micro sensor secondary integration facing a certain application scene can be completed, and a final micro system chip is obtained.
In one embodiment, before integrating the interface electrode 20 and the micro device common circuit 30 on the substrate 10, the method comprises: a substrate 10 comprising a plurality of microsystem architectures is prepared. In the present embodiment, the substrate 10 may be composed of a plate material, a signal line, a pad electrode, and a necessary dielectric layer, a solder resist layer, and the like. In one embodiment, the material of the substrate 10 may be FR4 or BT resin plate, or may be other polymer or metal or ceramic material, and the material of the signal line and the pad electrode may be copper foil. In addition, a layer of gold material can be deposited on the surface of the pad electrode or other necessary treatments can be carried out, and the wire bonding in the subsequent process can be facilitated. In one embodiment, the substrate 10 including multiple microsystem architectures may be a composite, i.e., each substrate 10 may have multiple repeated microsystem architectures for simultaneously preparing multiple identical microsystem architectures or complete microsystem chips.
In one embodiment, before selecting the micro devices according to the micro system application scenario, the method comprises: the substrate 10 including the plurality of microsystem architectures is singulated to obtain a plurality of independent microsystem architectures. In the present embodiment, the substrate 10 with multiple repeated microsystem architectures and the preformed package 40 thereon may be singulated according to the independent microsystem architecture to obtain multiple independent open microsystem architectures. Subsequently, the open chamber 410 of each microsystem architecture can be provided with the required cover plate 50 according to the microsystem application scenario, i.e. each microsystem architecture can form a deliverable open microsystem chip product, wherein the cover plates 50 may be the same or different between different microsystem architectures. It can be understood that the above steps can simplify the flow when manufacturing the microsystem architecture in batch, thereby improving the efficiency of the microsystem packaging method and expanding the application range of the microsystem packaging method.
In one embodiment, a method for packaging a micro device includes: machining the cover plate 50 according to the type of micro devices in each micro system architecture; the cover plate 50 is used to cover the corresponding open chamber 410, completing the packaging of the micro devices in each micro system architecture. In the present embodiment, the cover plate 50 may cover only the open chamber 410 to implement packaging of the micro devices integrated in the open chamber 410. It will be appreciated that, since the cover plate 50 need not cover the entire preformed package 40, the process flow of the cover plate 50 can be simplified and the material of the cover plate 50 can be saved in certain application scenarios (e.g., environmental friendliness).
In one embodiment, the integration of the interface electrode 20 and the microdevice generic circuit 30 on the substrate 10 includes: a plurality of interface electrodes 20 are integrated on the substrate 10, and the plurality of interface electrodes 20 are distributed in an array; a microdevice general-purpose circuit 30 is formed by integrating general-purpose electronic components on the side of the substrate 10 facing the interface electrode 20. In the present embodiment, general-purpose electronic components, which may be bare wafers or packaged components, are integrated on the substrate 10. In one embodiment, the general-purpose electronic components may be active components such as asic chips required for analog signal conditioning, digital signal processing, wireless communication, power management, and external interfaces, and passive components such as resistors, capacitors, and inductors. It will be appreciated that for packaged components, automated soldering may be used for mounting, such as reflow soldering or wave soldering. For a bare wafer, integration may be performed by wire bonding or the like.
In one embodiment, the micro devices are micro sensors, micro actuators, and/or other ASIC chips. In this embodiment, the micro sensors that are secondarily integrated by the microsystem packaging method may include a bare wafer micro sensor 610, a packaged micro sensor 620, and/or a custom interposer micro sensor 630. The bare wafer microsensor 610 can be integrated by bonding with a lead 640, the packaged microsensor 620 can be integrated by soldering tin mounting, and the custom adapter plate microsensor 630 can be integrated by a custom-designed adapter plate through lead bonding, soldering tin mounting or conductive silver paste. Of course, the above-mentioned various microsensors can also be integrated by other common connection methods according to actual situations, and the application is not limited to this specifically.
In one embodiment, forming the pre-molded package 40 with at least one open cavity 410 on a side of the substrate 10 facing the micro device generic circuit 30 includes: the pre-molded package 40 with at least one open cavity 410 is processed using precision machining methods according to the positions of the interface electrodes 20 and the micro device common circuit 30 on the substrate 10, and the pre-molded package 40 is fixed to the side of the substrate 10 facing the micro device common circuit 30. In one embodiment, the fixing of the preformed package 40 to the side of the substrate 10 facing the micro device common circuit 30 includes: the preformed package 40 is attached to the substrate 10 on the side facing the micro device common circuitry 30 by gluing, soldering or other mechanical means. In this embodiment, by processing the preformed package 40 by a precision machining method, a large batch of preformed packages 40 with high precision requirements and high complexity can be processed, and the application range of the microsystem packaging method can be expanded.
In one embodiment, forming the pre-molded package 40 with at least one open cavity 410 on a side of the substrate 10 facing the micro device generic circuit 30 includes: depending on the position of the interface electrode 20 and the micro device generic circuit 30 on the substrate 10, a preformed package 40 with at least one open cavity 410 is directly formed on the side of the substrate 10 facing the micro device generic circuit 30 using a dam-filling or injection molding potting process.
Referring to fig. 2-4, in one embodiment, a complete microsystem packaging structure can be obtained by performing a microsystem architecture pre-molding and performing a secondary integration of the micro devices in the microsystem packaging method. The packaging structure comprises a pre-formed open type micro system framework and a complete packaging structure which adopts the open type micro system framework to complete the secondary integration of the micro device. The concrete structure is as follows:
in the pre-formed open-type micro-system architecture, the substrate 10 of the micro-system is located at the bottom and is a common bottom plate embedded with signal lines required by the micro-system and carrying functional components of the micro-system. The open-type interface electrode 20 may be located on the upper surface of the substrate 10, and is one or more sets of reserved metal electrode arrays integrally formed with the substrate 10, which may be used to access the micro device. The pre-embedded micro device general function circuit 30 may be attached to the upper surface of the substrate 10, and may spatially avoid the open interface electrode 20, wherein the micro device general function circuit 30 may include general microelectronic circuits such as an analog conditioning circuit, a digital processing circuit, a wireless communication circuit, and a power management circuit. The preformed package 40 covers the upper side of the substrate 10, covers the micro device general-function circuit 30, and exposes the open type interface electrode 20 through the open cavity 410 formed in the preformed package 40 in a spatial structure, that is, the open cavity 410 is located above the open type interface electrode 20 and may be a through cavity.
In the micro system obtained after the secondary integration of the micro devices, the open chamber 410 is used for the secondary integration of the micro devices, and the micro devices to be secondarily integrated may be directly connected to the open type interface electrode 20 located below the open chamber 410. The cover plate 50 may be a flat plate for supporting the integrated micro devices in the open chamber 410, and is disposed on the upper surface of the preformed package 40, which may protect the integrated micro devices. The cover plate 50 may be fixedly connected to the preformed package 40 by mechanical means such as gluing, welding, etc.
It can be understood that the microsystem packaging structure manufactured by the microsystem packaging method provided by the present application has the pre-embedded micro device general circuit 30 and the pre-molded package 40 having the open cavity 410, wherein the pre-molded package 40 can protect the micro device general circuit 30, and the open cavity 410, the interface electrode 20 and the various cavity cover plates 50 on the pre-molded package 40 can be used for flexibly realizing secondary integration of various micro devices or other application-related devices. It should be noted that the package structure of the microsystem and the package structure after the secondary integration in the above embodiments are only for illustration and do not limit the present application. Therefore, open microsystem packaging architectures of similar topology are within the scope of this patent.
In combination with the above-described package structure, fabrication process, and secondary integrated micro device for an open micro system, the present application provides three more detailed embodiments.
The first embodiment is as follows: an open microsystem for precise machining and a structure and a process for secondarily integrating a mechanical microsensor.
Referring to fig. 2-3 together, a specific structure of the open microsystem pre-forming in this embodiment will be described, wherein the substrate 10 may be an FR4 printed circuit board with a size of 10mm × mm 3510 mm ×.8mm, the open interface electrodes 20 integrally formed on the upper surface thereof are two sets of electrode arrays, each set of the electrode arrays is distributed on an area of 4mm × mm 04mm, each set includes 5 surface gold-plated copper pads with a thickness of 2 μm, the surface gold-plated copper pads with a size of 0.8mm × mm 0.5mm, the micro device general circuit 30 may be an AD8235 differential instrumentation amplifier, a CC1350 wireless microcontroller, an RT9078 power management chip and general circuits composed of 0201 package resistors, capacitors and inductors, occupy an area of 8mm × mm, and do not overlap with the open interface electrodes 20, the pre-formed package 40 may be a package made of a metal material fixed on the substrate 10, the open cavity 410 may be a package with a size of 10mm × mm × mm, a size of 10mm × mm, the open cavity 410 may be fixed on a package substrate with a size of 10mm 585 mm, and may be exposed through a through hole of a through-plated package 20, and a through-plated package with a size of 10mm 468 mm, such as 10mm, which may be exposed through hole of a through 10mm, and exposed through hole 20, and a through hole of a through 30 mm.
Referring to fig. 4, the micro-sensor die 610 may be a 1-die pressure micro-sensor die of 0.9mm × 0.9.9 mm × 0.6.6 mm, which is located on the upper surface of a 4mm × 4mm open interface electrode 20 area of an 8mm × 8mm × 2mm × mm open chamber 410 for measuring the internal air pressure of a car tire of 0 to 700kPa, the custom interposer micro-sensor 630 may be a 3mm × 3.25.25 mm × 1.06.06 mm packaged acceleration micro-sensor, which is located on the upper surface of another 4mm × 4mm open interface electrode 20 area of the open chamber 410 for measuring the tire acceleration within a range of ± 200g, and after the integration of the micro-sensor is completed, a tire pressure sensing micro-system chip facing a tire pressure monitoring scene may be obtained, the size of which is 10mm × 10mm × 3 mm.
Referring to fig. 5, the process flow of preparing the tire pressure sensing micro system chip for the tire pressure monitoring scene in this embodiment is as follows:
step S1, preparing the substrate 10, preparing the micro-system substrate 10 by using FR4 plates, wherein the signal lines and the pad electrodes can be made of copper foil materials, and gold materials with the thickness of 2 microns are deposited on the pad electrodes.
In step S2, the interface electrode 20 and the microdevice generic circuit 30 are integrated on the substrate 10. A micro device universal circuit 30 consisting of a required differential instrument amplifier, a wireless microcontroller, a power management chip, a resistor, a capacitor, an inductor and the like is attached to a micro system substrate 10 by adopting a standard automatic mounting welding process, and meanwhile, an interface electrode 20 is integrated on the substrate 10.
And step S3, processing the preformed package 40, manufacturing the required 10mm × 10mm × 2mm preformed package 40 meeting the requirement by adopting a precision machining process, and fastening the preformed package 40 and the substrate 10 by a standard automatic mounting and welding process.
And S4, cutting the microsystem chip, cutting the substrate 10 with 100 repeated microsystem architectures and the preformed package 40 fastened on the substrate according to an independent microsystem architecture with the thickness of 10mm × 10mm, and providing 1 metal cover plate 50 with a through hole for each microsystem architecture.
And step S5, integrating the microsensors for the second time. For the sensing requirement of a tire pressure monitoring scene, a user-defined adapter plate is used for integrating an acceleration micro-sensor through a standard welding process in the open chamber 410, and then a pressure micro-sensor wafer is integrated into a pressure micro-sensor wafer through a silica gel and lead bonding process.
And step S6, sensing the finished product of the cover plate of the micro system. A cover plate 50 with through holes is fastened to the top surface of the preformed package 40 using a standard parallel seam welding process to cover all components inside the open cavity 410. And finally, obtaining a final tire pressure monitoring perception micro-system chip, having high integration level comparable to that of a special tire pressure monitoring micro-system chip, and having stronger openness and flexibility.
Example two: cofferdam filling open type microsystem and structure and process for secondary integration of magnetic intensity microsensors.
Referring to fig. 2-3, a specific structure of the open microsystem preform molding in the present embodiment is described, wherein the substrate 10 may be a 12mm × mm ×.5mm high-density BT resin substrate, the open interface electrode 20 may be a set of electrode arrays located on the upper surface of the substrate 10 and integrally molded with the substrate 10, the electrode arrays are distributed over an area of 9.8mm × 04.9mm, and include 27 copper pads with 0.8mm 5630.5 mm surface gold plating, the thickness of the gold plating is 2 μm, the microdevice general circuit 30 may be a general circuit located on the upper surface of the substrate 10 and composed of an AD8235 differential instrumentation amplifier, a CC1350 wireless microcontroller, an RT9078 power management chip and a plurality of 0201 package resistors, capacitors and inductors, occupies an area of 9.8mm ×.9mm of the substrate, and does not overlap with the open interface electrode 20, the precision pre-mold package 40 is fixed on the substrate 10 by using a dam filling process, the size of 12mm × mm is that the open-type microsystem pre-mold 20 is a bare chip with a bare chip 20, a bare chip package 20, a bare chip.
Referring to fig. 4, the packaged microsensor 620 can be a 2-piece SOT-23 packaged magnetic intensity microsensor with the size of 2.95mm × 2.8mm ×.45mm, and is located on the upper surface of the open interface electrode 20 of the 9.8mm ×.9mm ×.5mm open chamber 410, and the sensitive axes are orthogonal and used for measuring the magnetic field intensity in the X-axis direction and the Y-axis direction.
Referring to fig. 5, the process flow of preparing the non-contact leakage sensing micro-system chip oriented to the power transmission safety scenario in this embodiment is as follows:
step S1, preparing the substrate 10, preparing the high-density microsystem substrate 10 by using BT resin plates, selecting copper foil material for the signal lines and the pad electrodes, depositing gold material with a thickness of 3 microns for the pad electrodes, and in order to improve the yield, each BT plate may have a size of 120mm × 120mm and may include 100 repeated microsystem architectures of 12mm × 12 mm.
In step S2, the interface electrode 20 and the microdevice generic circuit 30 are integrated on the substrate 10. A micro device universal circuit 30 consisting of a required differential instrument amplifier, a wireless microcontroller, a power management chip, a resistor, a capacitor, an inductor and the like is attached to a micro system substrate 10 by adopting a standard automatic mounting welding process.
Step S3, the preformed package 40 is processed, and the preformed package 40 with 12mm × 12mm × 1.5mm meeting the requirement is directly manufactured on the substrate 10 by adopting a precise dispensing cofferdam filling process.
And step S4, cutting the microsystem chip, carrying out cutting operation on the substrate 10 with 100 repeated microsystem architectures and the preformed package 40 on which cofferdams are filled and formed according to the independent microsystem architecture of 12mm × 12mm, and allocating 1 sealed BT resin cover plate for each microsystem architecture.
And step S5, integrating the microsensors for the second time. For the perception requirement of a power transmission safety scene, the magnetic intensity microsensor is directly integrated in the open chamber 410 by using a standard welding process.
And step S6, sensing the finished product of the cover plate of the micro system. A closed cover plate 50 is secured by gluing to the upper surface of the dam filled pre-form package 40 covering all the microsensors inside the open chamber 410. And finally, completing secondary integration of the magnetic intensity micro-sensor facing the electric leakage monitoring scene to obtain a final electric leakage perception micro-system chip, wherein the chip has high integration level, openness and flexibility.
Example three: an injection molding encapsulation open-type microsystem and a structure and a process for secondarily integrating a gas humidity sensitive microsensor thereof.
Referring to fig. 2-3 together, a specific structure of the open microsystem preform molding in this embodiment is described, where the substrate 10 may be a 15mm × mm ×.5mm high-density BT resin substrate, the open interface electrode 20 may be a five-set electrode array located on the upper surface of the substrate 10 and integrally molded with the substrate 10, and the five-set electrode array is distributed over an area of 12.8mm × 06.4mm, and includes 30 copper pads with 0.5mm ×.5mm surface gold plating, the thickness of the gold plating layer is 3 μm, the micro device universal circuit 30 may be a universal circuit located on the upper surface of the substrate 10 and composed of a T L V9064 four-channel amplifier, a CC1350 wireless microcontroller, a TPS61099 power management chip, and a plurality of 0201 package resistors, capacitors, and inductors, occupies an area of 12.8mm 2.4 mm on the substrate, and does not overlap with the open interface electrode 20, the preform package 40 may be a BT molding encapsulation package fixed on the substrate 10 by an injection molding process, the BT encapsulation package 20 may have a through hole size of 15mm, 5mm, 15mm, 5mm, and 15mm, 15 mm.
Referring to fig. 4, the bare microsensor wafer 610 can be 4 gas microsensors with a size of 2mm × mm 392 mm ×.5mm, which are located on the upper surface of the open interface electrode 20 of the 12.8mm ×.6.4 mm × mm open chamber 410 for measuring 4 different gas response curves, and the packaged microsensor 620 can be 1 temperature and humidity microsensor with a size of 3mm × mm ×.1mm for measuring the temperature and humidity in the environment, and after microsensor integration is completed, the gas and humidity sensitive micro system chip facing the space quality scene is formed, with a size of 15mm × mm ×.8 mm.
Referring to fig. 5, the process flow for preparing the air-moisture sensitive micro system chip oriented to the spatial quality scene is as follows:
step S1, preparing a substrate 10, preparing a high-density micro-system substrate by using BT resin plates, selecting copper foil materials for signal wires and pad electrodes, depositing gold materials with the thickness of 3 microns on the pad electrodes, and in order to improve the yield, the size of each BT plate can be 150mm × 150mm, and 100 repeated micro-system frameworks with the thickness of 15mm × 15mm can be included.
In step S2, the interface electrode 20 and the microdevice generic circuit 30 are integrated on the substrate 10. A micro device universal circuit 30 consisting of a required multi-channel operational amplifier, a wireless microcontroller, a power management chip, a resistor, a capacitor, an inductor and the like is attached to the micro system substrate 10 by adopting a standard automatic mounting welding process.
And S3, processing the preformed package 40, and directly manufacturing the open BT plastic package preformed package 40 with the thickness of 15mm × 15mm × 2mm meeting the requirement on the substrate 10 by adopting a standard injection molding encapsulation process.
And S4, cutting the microsystem chip, cutting the substrate 10 with 100 repeated microsystem architectures and the packaging body which is injection molded on the substrate according to an independent 15mm × 15mm microsystem architecture, and allocating 1 BT resin cover plate 50 with an air hole array for each microsystem architecture.
And step S5, integrating the microsensors for the second time. For the air quality scene perception requirement, the packaged temperature and humidity microsensors are directly integrated in the open chamber 410 by using a standard welding process, and the gas microsensor wafer is integrated by using silver colloid and lead bonding.
And step S6, sensing the finished product of the cover plate of the micro system. The cover plate 50 with the vent holes is fastened to the upper surface of the BT molding compound package by using an adhesive method, covering all the micro sensors inside the open cavity 410. And finally, the secondary integration of the air humidity sensitive micro-sensor facing the air quality monitoring scene is completed, and the final air quality perception micro-system chip is obtained, and has high integration level, packaging openness and scene flexibility.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (11)
1. A microsystem packaging method, comprising:
integrating a plurality of interface electrodes and a micro device universal circuit on a substrate;
forming a pre-formed package with at least one open cavity on a side of the substrate facing the micro device general circuit, the pre-formed package encasing the micro device general circuit and exposing the interface electrode within the open cavity;
a micro device is integrated and packaged on the interface electrode.
2. The microsystem packaging method as claimed in claim 1, wherein the integrating and packaging of the microdevice on the interface electrode comprises:
selecting the micro device according to the application scene of the micro system;
soldering the micro device to the interface electrode;
and packaging the micro device.
3. The microsystem packaging method as claimed in claim 2, wherein the packaging of the microdevice comprises:
processing a cover plate according to the type of the micro device and the position of the interface electrode on the substrate;
and covering the preformed package body by adopting the cover plate to finish the packaging of the micro device.
4. The microsystem packaging method as claimed in claim 2, characterized in that before the integration of the interface electrodes and the microdevice generic circuitry on the substrate, it comprises:
preparing the substrate comprising a plurality of microsystem architectures.
5. The microsystem packaging method as claimed in claim 4, characterized in that before the selection of the microdevice according to the microsystem application scenario, it comprises:
and performing singulation processing on the substrate comprising the plurality of microsystem architectures to obtain a plurality of independent microsystem architectures.
6. The microsystem packaging method as claimed in claim 5, wherein the packaging of the microdevice comprises:
processing a cover plate according to the type of the micro device in each micro system architecture;
and covering the corresponding open cavity by using the cover plate to finish the packaging of the micro device in each micro system architecture.
7. The microsystem packaging method as claimed in claim 1, wherein the integrating of the interface electrodes and the microdevice generic circuitry on the substrate comprises:
a plurality of interface electrodes are integrated on the substrate and distributed in an array manner;
and integrating a universal functional electronic component on one side of the substrate facing the interface electrode to form the universal circuit of the micro device.
8. The microsystem packaging method according to claim 1, characterized in that the microdevice is a microsensor, a microactuator and/or another ASIC chip.
9. The microsystem packaging method as claimed in claim 1, wherein the forming of the pre-molded package with at least one open cavity on the side of the substrate facing the micro device common circuitry comprises:
and processing the preformed package with at least one open cavity by adopting a precision machining method according to the positions of the interface electrode and the micro device general circuit on the substrate, and fixing the preformed package on the side, facing the micro device general circuit, of the substrate.
10. The microsystem packaging method as claimed in claim 9, wherein the fixing of the pre-molded package to the side of the substrate facing the micro device common circuit comprises:
and fixing the preformed package on one side of the substrate facing the universal circuit of the micro device by adopting an adhesive joint, welding or other mechanical methods.
11. The microsystem packaging method as claimed in claim 1, wherein the forming of the pre-molded package with at least one open cavity on the side of the substrate facing the micro device common circuitry comprises:
and directly forming the preformed package with at least one open chamber on the side of the substrate facing the micro device general circuit by using a cofferdam filling or injection molding encapsulation method according to the positions of the interface electrode and the micro device general circuit on the substrate.
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Application publication date: 20200717 |