CN111410415A - Laser cutting device and method for double-layer glass substrate - Google Patents
Laser cutting device and method for double-layer glass substrate Download PDFInfo
- Publication number
- CN111410415A CN111410415A CN202010404671.XA CN202010404671A CN111410415A CN 111410415 A CN111410415 A CN 111410415A CN 202010404671 A CN202010404671 A CN 202010404671A CN 111410415 A CN111410415 A CN 111410415A
- Authority
- CN
- China
- Prior art keywords
- focusing element
- double
- laser
- glass substrate
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 117
- 239000011521 glass Substances 0.000 title claims abstract description 116
- 238000003698 laser cutting Methods 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000005520 cutting process Methods 0.000 claims abstract description 32
- 238000007493 shaping process Methods 0.000 claims description 40
- 238000001514 detection method Methods 0.000 claims description 13
- 238000003384 imaging method Methods 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 claims description 8
- 238000003754 machining Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 18
- 230000000694 effects Effects 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/076—Laminated glass comprising interlayers
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
Abstract
The application discloses a laser cutting device and method for a double-layer glass substrate. The laser cutting device comprises a shell, a light splitting element, a first focusing element, a second focusing element and a carrying platform. The light splitting element is arranged in the shell and is used for equally dividing the laser beam into two same laser beams; the first focusing element is used for receiving one of the two laser beams split by the light splitting element and cutting the double-layer glass substrate to be cut through the laser beam; the second focusing element is arranged opposite to the first focusing element and is used for receiving the other of the two laser beams split by the light splitting element and cutting the double-layer glass substrate to be cut through the laser beams; the carrying platform is used for placing a double-layer glass substrate to be cut, so that the double-layer glass substrate to be cut is positioned between the first focusing element and the second focusing element. The laser cutting device is high in machining efficiency, simple in structure and low in production cost.
Description
Technical Field
The application relates to the field of laser processing, in particular to a laser cutting device and method for a double-layer glass substrate.
Background
The liquid crystal display screen is an active matrix liquid crystal display driven by means of Thin Film Transistor (TFT), and is mainly characterized by that it uses current to stimulate liquid crystal molecules to produce points, lines and surfaces, and matches them with back lamp tube to form picture. The liquid crystal panel includes a double-layer glass substrate (upper and lower glass substrates), a black matrix, a color filter, a common electrode, a liquid crystal layer, a display electrode, and the like.
As the liquid crystal display is applied more and more widely, the market demand thereof is also greatly increased. In the manufacturing process of the liquid crystal display screen, in order to meet the requirement of a user on the narrow-frame full-face screen, the frame or the shape of the liquid crystal display screen needs to be processed. Because laser beam machining has the precision height, and processingquality is good, does not produce advantages such as dust piece basically, laser beam machining is applied to the appearance cutting of double glazing base plate such as liquid crystal display gradually.
At present, the device and the method for cutting the shape of the double-layer glass substrate have the problems of low processing efficiency and complex equipment structure.
Disclosure of Invention
The application aims to provide a laser cutting device and method for a double-layer glass substrate, the processing efficiency is high, and the equipment structure is simple.
The application discloses laser cutting device of double glazing base plate, laser cutting device includes shell, beam splitting component, first focusing element, second focusing element and microscope carrier. The light splitting element is arranged in the shell and is used for equally dividing the laser beam into two same laser beams; the first focusing element is used for receiving one of the two laser beams split by the light splitting element and cutting the double-layer glass substrate to be cut through the laser beam; the second focusing element is arranged opposite to the first focusing element and is used for receiving the other of the two laser beams split by the light splitting element and cutting the double-layer glass substrate to be cut through the laser beams; the carrying platform is used for placing a double-layer glass substrate to be cut, so that the double-layer glass substrate to be cut is positioned between the first focusing element and the second focusing element.
Optionally, the laser cutting device comprises a first beam shaping element and a second beam shaping element for increasing the focal depth of the laser beam; the first beam shaping element is arranged in the shell and is positioned on an optical path from the light splitting element to the first focusing element; the second beam shaping element is arranged in the shell and is positioned on an optical path of the laser beam from the light splitting element to the second focusing element.
Optionally, the laser cutting device comprises a first mirror and a second mirror arranged in the housing; the first reflector is used for reflecting the laser beam passing through the first beam shaping element to the first focusing element for receiving; the second reflector is used for reflecting the laser beam passing through the second beam shaping element to the second focusing element for receiving.
Optionally, the laser cutting device includes a first Z-axis adjusting platform, and the first Z-axis adjusting platform is connected to the housing; the first Z-axis adjusting platform is used for driving the laser cutting device to integrally move along the Z-axis direction so as to change the distance from the first focusing element to the double-layer glass substrate to be cut.
Optionally, the laser cutting device includes a second Z-axis adjusting platform connected to the housing, the second focusing element is mounted on the second Z-axis adjusting platform, and the second Z-axis adjusting platform is configured to drive the second focusing element to move along the Z-axis direction, so as to change a distance from the second focusing element to the double-layer glass substrate to be cut.
Optionally, the laser cutting device includes an XY two-dimensional fine adjustment platform mounted on the housing; the first focusing element is mounted on the XY two-dimensional fine adjustment platform; the XY two-dimensional fine adjustment platform is used for driving the first focusing element to move along the X-axis direction or the Y-axis direction.
Optionally, the laser cutting device includes a CCD imaging detection element mounted on the housing, and the CCD imaging detection element is disposed opposite to the second focusing element and above the second focusing element.
The application also discloses a laser cutting method of the double-layer glass substrate, based on the laser cutting device, the method comprises the following steps:
placing a double-layer glass substrate to be cut on a carrying platform;
the light splitting element equally divides the laser beam into two same laser beams;
the first focusing element receives one of the two laser beams divided by the light splitting element, and the second focusing element receives the other of the two laser beams divided by the light splitting element;
the first focusing element cuts one layer of the double-layer glass substrate to be cut through laser beams; and simultaneously cutting the other layer of the double-layer glass substrate to be cut by the laser beam by the second focusing element.
Optionally, the step of equally dividing the laser beam into two identical laser beams by the light splitting element includes:
the first beam shaping element and the second beam shaping element increase the focal depth of the laser beam;
the first reflector reflects the laser beam passing through the first beam shaping element to a first focusing element for receiving; meanwhile, the second reflector reflects the laser beam passing through the second beam shaping element to be received by the second focusing element.
Optionally, the step of receiving, by the first focusing element, one of the two laser beams split by the beam splitting element, and receiving, by the second focusing element, the other of the two laser beams split by the beam splitting element further includes the following steps:
the first Z-axis adjusting platform drives the laser cutting device to integrally move along the Z-axis direction, so that the laser beam of the first focusing element is focused at the cutting position of one layer of glass of the double-layer glass substrate to be cut;
the second Z-axis adjusting platform drives the second focusing element to move along the Z-axis direction, so that the laser beam of the second focusing element is focused at the cutting position of the other layer of glass of the double-layer glass substrate to be cut;
driving the first focusing element to move along the X-axis direction or the Y-axis direction by the XY two-dimensional fine tuning platform, so that the position of the laser beam of the first focusing element on the double-layer glass substrate to be cut is superposed with the position of the laser beam of the second focusing element on the double-layer glass substrate to be cut;
and the CCD imaging detection element detects whether the positions of the laser beams of the first focusing element and the second focusing element are overlapped or not at the position of the double-layer glass substrate to be cut.
The laser cutting device of this application passes through the cooperation of beam splitting component and first focusing element, second focusing element, need not cut earlier after the one deck glass substrate, again with another layer of glass substrate upset cutting, machining efficiency is high. Simultaneously, should be for this scheme need not overturn liquid crystal display, can reduce the equipment that is used for the upset, only utilized the cooperation of beam splitting component and first focusing element, second focusing element moreover, simple structure, low in production cost.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
FIG. 1 is a schematic view of a double-glazing substrate according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a laser apparatus according to an embodiment of the present application;
FIG. 3 is another schematic diagram of a laser apparatus according to an embodiment of the present application;
FIG. 4 is a schematic view of a CCD imaging detection element according to an embodiment of the present application;
FIG. 5 is a schematic illustration of laser beam misalignment according to an embodiment of the present application;
FIG. 6 is a schematic illustration of laser beam coincidence according to an embodiment of the present application;
fig. 7 is a flow chart of a laser cutting method of an embodiment of the present application.
Wherein, 1, CF glass substrate; 2. an ITO layer; 3. a black matrix layer; 4. a TFT glass substrate; 10. a laser beam; 20. a double-layer glass substrate; 100. a housing; 200. a light-splitting element; 300. a first focusing element; 400. a second focusing element; 500. a stage; 600. a first beam shaping element; 700. a second beam shaping element; 800. a first reflector; 900. a second reflector; 1000. a first Z-axis adjustment stage; 2000. a second Z-axis adjustment platform; 3000. an XY two-dimensional fine tuning platform; 4000. the CCD images the detecting element.
Detailed Description
It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implicitly indicating the number of technical features indicated. Thus, unless otherwise specified, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "plurality" means two or more. The terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or combinations thereof may be present or added.
Further, terms of orientation or positional relationship indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, are described based on the orientation or relative positional relationship shown in the drawings, are simply for convenience of description of the present application, and do not indicate that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.
Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, fixed connections, removable connections, and integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The present application is described in detail below with reference to the figures and alternative embodiments.
As the liquid crystal display is applied more and more widely, the market demand thereof is also greatly increased. In the manufacturing process of the liquid crystal display screen, in order to meet the requirement of a user on the narrow-frame full-face screen, the frame or the shape of the liquid crystal display screen needs to be processed. Because laser beam machining has the precision height, and processingquality is good, does not produce advantages such as dust piece basically, laser beam machining is applied to the appearance cutting of double glazing base plate such as liquid crystal display gradually.
As shown in fig. 1, the double glass substrates of the liquid crystal display panel are a CF glass substrate 1 and a TFT glass substrate 4, and the applicant found that the double glass substrates have an ITO layer 2, a black matrix layer 3, and the like in between, so that laser cannot penetrate through the upper and lower glass substrates and simultaneously cut the double glass. Therefore, the main practice of the applicant is: through CCD positioning, the upper glass substrate is cut by the laser beam 10, then the liquid crystal display screen is turned over, and then the lower glass substrate is cut by the laser beam 10 after the CCD positioning. However, the applicant finds that the method has the problems of low processing efficiency and complex corresponding equipment structure. And because two times of repeated positioning of the CCD exist positioning errors, the two times of cutting positions are not coincident, and the double-layer glass substrate has a layer staggering phenomenon.
In order to solve the above problems, as shown in fig. 2 to 6, a laser cutting apparatus for a double-glass substrate is disclosed as an embodiment of the present application. As shown in fig. 2 and 3 in particular, the laser cutting apparatus includes a housing 100, a light splitting element 200, a first focusing element 300, a second focusing element 400, and a carrier 500. The light splitting element 200 is arranged in the housing 100 and is used for equally dividing the laser beam 10 into two identical laser beams 10; the first focusing element 300 is configured to receive one of the two laser beams 10 split by the beam splitting element 200, and cut the double-layer glass substrate 20 to be cut by the laser beam 10; the second focusing element 400 is disposed opposite to the first focusing element 300, and is configured to receive the other of the two laser beams 10 divided by the beam splitting element 200, and cut the double-layer glass substrate 20 to be cut by the laser beam 10; the carrier 500 is used for placing the double-glass substrate 20 to be cut, so that the double-glass substrate 20 to be cut is located between the first focusing element 300 and the second focusing element 400.
The laser cutting device of this application passes through the cooperation of beam splitting component 200 and first focusing element 300, second focusing element 400, and first focusing element 300, second focusing element 400 can focus laser beam 10, make it have higher energy density when processing, and first focusing element 300 and second focusing element 400 can cut double glazing base plate 20 simultaneously, need not cut earlier after the good glass substrate of one deck, again with the glass substrate upset cutting another deck, and machining efficiency is high. Meanwhile, the scheme does not need to turn over the liquid crystal display screen, can reduce equipment for turning over, and only utilizes the matching of the light splitting element 200, the first focusing element 300 and the second focusing element 400, so that the structure is simple and the production cost is low.
Preferably, the light splitting element 200 is a light splitter; the first focusing element 300 and the second focusing element 400 are focusing objectives, and the central light spot size focused by the first focusing element 300 and the second focusing element 400 is 0.1um-10 um.
The laser cutting apparatus includes a first beam shaping element 600 and a second beam shaping element 700 for increasing a focal depth of a laser beam 10; the first beam shaping element 600 is disposed in the housing 100 and located on the optical path from the beam splitting element 200 to the first focusing element 300 for the laser beam 10; the second beam shaping element 700 is disposed in the housing 100 and located on the optical path of the laser beam 10 from the beam splitting element 200 to the second focusing element 400. By the first beam shaping element 600 and the second beam shaping element 700, the depth of focus of the laser beam 10 can be increased as required, so that the laser beams 10 of the first focusing element 300 and the second focusing element 400 can be more easily focused on the glass substrate for cutting. The optical path described in this embodiment refers to a path along which the laser beam 10 travels.
Specifically, the first beam shaping element 600 and the second beam shaping element 700 may be a ring-shaped laser spot and lens combination, an aspheric lens combination, an axicon or a diffractive optical element, and the like. Preferably, the depth of focus/central spot of the laser beam 10 is > 10 after passing through the first beam shaping element 600 and the second beam shaping element 700.
The laser cutting apparatus includes a first reflecting mirror 800 and a second reflecting mirror 900 disposed in a housing 100; the first mirror 800 is used for reflecting the laser beam 10 passing through the first beam shaping element 600 to the first focusing element 300 for receiving; the second mirror 900 is used for reflecting the laser beam 10 passing through the second beam shaping element 700 to the second focusing element 400 for receiving. The reflection of the first mirror 800 and the second mirror 900 may reflect the laser beam 10 into the first focusing element 300 and the second focusing element 400, which are oppositely disposed.
Specifically, as shown in fig. 3, there are two first reflecting mirrors 800, one first reflecting mirror 800 is disposed below the first beam shaping element 600, the other first reflecting mirror 800 is disposed below the first focusing element 300, and the two first reflecting mirrors 800 are disposed on the same horizontal line. Second mirror 900 is disposed above second focusing element 400, to the right of second beam-shaping element 700.
The laser cutting device comprises a first Z-axis adjusting platform 1000, wherein the first Z-axis adjusting platform 1000 is connected with the shell 100; the first Z-axis adjusting platform 1000 is configured to drive the laser cutting apparatus to move along the Z-axis direction, so as to change the distance from the first focusing element 300 to the double-layer glass substrate 20 to be cut. The first focusing element can be adjusted to the distance from the first Z-axis adjusting platform 1000 to the double-layer glass substrate 20 to be cut, so that the laser beam 10 can be better focused on the double-layer glass substrate 20 to be cut, and the laser cutting effect is better. First Z axle adjusts platform 1000 can drive first Z axle and adjust platform 1000 through modes such as motor electric control. The X-axis direction, the Y-axis direction, and the Z-axis direction described in the application are shown as the lower left corner space rectangular coordinate system in fig. 2.
Further, the laser cutting device further includes a second Z-axis adjusting platform 2000 connected to the housing 100, the second focusing element 400 is mounted on the second Z-axis adjusting platform 2000, and the second Z-axis adjusting platform 2000 is configured to drive the second focusing element 400 to move along the Z-axis direction, so as to change a distance from the second focusing element 400 to the double-layer glass substrate 20 to be cut. On the basis of adjusting the first focusing element 300 through the first Z-axis adjusting platform 1000, the distance from the second focusing element to the double-layer glass substrate 20 to be cut is further adjusted, so that the laser beam 10 is better focused on the double-layer glass substrate 20 to be cut, and the laser cutting effect is better. The second Z-axis adjusting platform 2000 may drive the first Z-axis adjusting platform 1000 through electric adjustment of a motor and the like.
The laser cutting device comprises an XY two-dimensional fine adjustment platform 3000 mounted on the housing 100; the first focusing element 300 is mounted on the XY two-dimensional fine adjustment stage 3000; the XY two-dimensional fine adjustment platform 3000 is configured to drive the first focusing element 300 to move along the X axis direction or the Y axis direction, so that the position of the laser beam 10 of the first focusing element 300 on the double-layer glass substrate 20 to be cut coincides with the position of the laser beam 10 of the second focusing element 400 on the double-layer glass substrate 20 to be cut. The scheme that the second substrate can be cut only by turning over after the first layer of glass substrate is cut, then the second layer of glass substrate is cut, and the cutting is easy to misplace. In this embodiment, the XY two-dimensional fine adjustment platform 3000 adjusts the first focusing element 300 in the X-axis direction or the Y-axis direction, so that the position of the laser beam 10 of the first focusing element 300 on the double-layer glass substrate 20 to be cut coincides with the position of the laser beam 10 of the second focusing element 400 on the double-layer glass substrate 20 to be cut, thereby ensuring that the upper-layer glass substrate and the lower-layer glass substrate are not cut in a dislocation manner.
As shown in fig. 4, the laser cutting apparatus further includes a CCD imaging detection element 4000 mounted on the housing 100, wherein the CCD imaging detection element 4000 is disposed opposite to the second focusing element 400 and above the second focusing element 400; the CCD imaging detection element 4000 is used to detect whether the laser beams 10 of the first focusing element 300 and the second focusing element 400 are overlapped on the double-glass substrate 20 to be cut. When the laser beams 10 of the first focusing element 300 and the second focusing element 400 are out of alignment as shown in fig. 5, they can be detected by the CCD imaging detection element 4000, and then adjusted to the alignment state as shown in fig. 6, thereby further ensuring that the upper glass substrate and the lower glass substrate are not cut off and misaligned.
The laser cutting device divides a laser beam 10 into two laser beams 10, adjusts the focusing positions of the laser beams 10 of the first focusing element 300 and the second focusing element 400, and simultaneously processes and cuts the upper layer and the lower layer of the double-layer glass substrate, so that the steps of positioning, cutting, product turning, positioning and cutting are omitted in the double-layer glass substrate cutting of the prior art, the equipment structure is simplified, and the processing efficiency is greatly improved; moreover, the overlapping degree of the light spots of the two laser beams 10 is high, the risk of dislocation of the upper layer and the lower layer of glass after cutting due to repeated positioning is avoided, and the processing quality is further improved.
As another embodiment of the present application, as shown in fig. 7, the present application further discloses a laser cutting method of a double-layer glass substrate, the laser cutting method is based on the laser cutting apparatus as described above, the method includes the steps of:
s100: placing a double-layer glass substrate to be cut on a carrying platform;
s200: the light splitting element equally divides the laser beam into two same laser beams;
s300: the first focusing element receives one of the two laser beams divided by the light splitting element, and the second focusing element receives the other of the two laser beams divided by the light splitting element;
s400: the first focusing element cuts one layer of the double-layer glass substrate to be cut through laser beams; while the second focusing element cuts another glass substrate of the double glass substrate to be cut by the laser beam.
The laser cutting method can simultaneously cut the double-layer glass substrate, and does not need to turn over and cut another layer of the glass substrate after cutting one layer of the glass substrate, so that the processing efficiency is high. Simultaneously, should be for this scheme need not overturn liquid crystal display, can reduce the equipment that is used for the upset, only utilized the cooperation of beam splitting component and first focusing element, second focusing element moreover, simple structure, low in production cost.
Specifically, the S200 spectroscopic element equally divides the laser beam into two identical laser beams, and then includes the steps of:
the first beam shaping element and the second beam shaping element increase the focal depth of the laser beam;
the first reflector reflects the laser beam passing through the first beam shaping element to a first focusing element for receiving; meanwhile, the second reflector reflects the laser beam passing through the second beam shaping element to be received by the second focusing element.
The focal depth of the laser beams is increased, so that the laser beams of the first focusing element and the second focusing element are easier to focus on the glass substrate for cutting.
Specifically, the step of receiving, by the S300 first focusing element, one of the two laser beams split by the beam splitting element, and receiving, by the second focusing element, the other of the two laser beams split by the beam splitting element further includes the following steps:
the first Z-axis adjusting platform drives the laser cutting device to integrally move along the Z-axis direction, so that the laser beam of the first focusing element is focused at the cutting position of one layer of glass of the double-layer glass substrate to be cut;
the second Z-axis adjusting platform drives the second focusing element to move along the Z-axis direction, so that the laser beam of the second focusing element is focused at the cutting position of the other layer of glass of the double-layer glass substrate to be cut;
driving the first focusing element to move along the X-axis direction or the Y-axis direction by the XY two-dimensional fine tuning platform, so that the position of the laser beam of the first focusing element on the double-layer glass substrate to be cut is superposed with the position of the laser beam of the second focusing element on the double-layer glass substrate to be cut;
and the CCD imaging detection element detects whether the positions of the laser beams of the first focusing element and the second focusing element are overlapped or not at the position of the double-layer glass substrate to be cut.
Through first Z axle regulation platform, can adjust the first focus and expect the distance of cut double glazing base plate to the first focus for the better focus of laser beam is expected the cut double glazing base plate on, makes laser cutting effect better. And further adjusting the distance from the second focusing element to the double-layer glass substrate to be cut, so that the laser beam is better focused on the double-layer glass substrate to be cut, and the laser cutting effect is better. The XY two-dimensional fine adjustment platform enables the position of the laser beam of the first focusing element on the double-layer glass substrate to be cut to coincide with the position of the laser beam of the second focusing element on the double-layer glass substrate to be cut by adjusting the first focusing element in the X-axis direction or the Y-axis direction, so that the upper-layer glass substrate and the lower-layer glass substrate can be cut without dislocation. Whether the laser beams of the first focusing element and the second focusing element are overlapped or not is detected through the CCD imaging detection element, and the cutting of the upper layer glass substrate and the lower layer glass substrate is further ensured not to be dislocated.
According to the laser cutting method, the laser beam is divided into two laser beams, the focusing positions of the first focusing element and the second focusing element are adjusted, the upper layer and the lower layer of the double-layer glass substrate are simultaneously processed and cut, the steps of positioning, cutting, product turning, positioning and cutting in advance in the double-layer glass substrate cutting in the prior art are omitted, the equipment structure is simplified, and the processing efficiency is greatly improved; moreover, the overlapping degree of the light spots of the two laser beams is high, the risk of dislocation of the upper layer and the lower layer of glass after cutting due to repeated positioning is avoided, and the processing quality is further improved.
It should be noted that, the limitations of each step in the present disclosure are not considered to limit the order of the steps without affecting the implementation of the specific embodiments, and the steps written in the foregoing may be executed first, or executed later, or even executed simultaneously, and as long as the present disclosure can be implemented, all the steps should be considered as belonging to the protection scope of the present application.
The foregoing is a more detailed description of the present application in connection with specific alternative embodiments, and the specific implementations of the present application are not to be considered limited to these descriptions. For those skilled in the art to which the present application pertains, several simple deductions or substitutions may be made without departing from the concept of the present application, and all should be considered as belonging to the protection scope of the present application.
Claims (10)
1. A laser cutting apparatus for a double-glazing substrate, comprising:
a housing;
the light splitting element is arranged in the shell and is used for equally dividing the laser beam into two same laser beams;
the first focusing element is used for receiving one of the two laser beams split by the beam splitting element and cutting the double-layer glass substrate to be cut through the laser beams;
the second focusing element is arranged opposite to the first focusing element and used for receiving the other of the two laser beams split by the light splitting element and cutting the double-layer glass substrate to be cut through the laser beams;
and the carrying platform is used for placing the double-layer glass substrate to be cut, so that the double-layer glass substrate to be cut is positioned between the first focusing element and the second focusing element.
2. The laser cutting apparatus for double-glass substrates as claimed in claim 1, wherein the laser cutting apparatus comprises a first beam shaping element and a second beam shaping element for increasing a focal depth of the laser beam; the first beam shaping element is arranged in the shell and is positioned on an optical path from the light splitting element to the first focusing element; the second beam shaping element is arranged in the shell and is positioned on an optical path of the laser beam from the light splitting element to the second focusing element.
3. The laser cutting apparatus for double-glass substrates as claimed in claim 2, wherein the laser cutting apparatus comprises a first reflecting mirror and a second reflecting mirror disposed in the housing; the first reflector is used for reflecting the laser beam passing through the first beam shaping element to the first focusing element for receiving; the second reflector is used for reflecting the laser beam passing through the second beam shaping element to the second focusing element for receiving.
4. The laser cutting apparatus for double-glazing substrates of claim 1 wherein the laser cutting apparatus comprises a first Z-axis adjustment stage, the first Z-axis adjustment stage being coupled to the housing; the first Z-axis adjusting platform is used for driving the laser cutting device to integrally move along the Z-axis direction so as to change the distance from the first focusing element to the double-layer glass substrate to be cut.
5. The laser cutting apparatus for double-glazing substrates of claim 4, wherein the laser cutting apparatus comprises a second Z-axis adjusting platform connected to the housing, the second focusing element is mounted on the second Z-axis adjusting platform, and the second Z-axis adjusting platform is used for moving the second focusing element along the Z-axis direction to change the distance from the second focusing element to the double-glazing substrate to be cut.
6. The laser cutting apparatus for double-glazing substrates of claim 1, wherein the laser cutting apparatus comprises an XY two-dimensional fine adjustment stage mounted on the housing; the first focusing element is mounted on the XY two-dimensional fine adjustment platform; the XY two-dimensional fine adjustment platform is used for driving the first focusing element to move along the X-axis direction or the Y-axis direction.
7. The laser cutting apparatus for double-glazing substrates of claim 1, wherein the laser cutting apparatus comprises a CCD imaging detection element mounted on the housing, the CCD imaging detection element being disposed opposite to and above the second focusing element.
8. A laser cutting method of a double-glazing substrate based on the laser cutting device according to any of claims 1 to 7, characterized in that the method comprises the steps of:
placing a double-layer glass substrate to be cut on a carrying platform;
the light splitting element equally divides the laser beam into two same laser beams;
the first focusing element receives one of the two laser beams divided by the light splitting element, and the second focusing element receives the other of the two laser beams divided by the light splitting element;
the first focusing element cuts one layer of the double-layer glass substrate to be cut through laser beams; while the second focusing element cuts another glass substrate of the double glass substrate to be cut by the laser beam.
9. The laser cutting method of a double-glazing substrate as claimed in claim 8, wherein said beam splitter comprises the steps of, after equally dividing the laser beam into two identical laser beams:
the first beam shaping element and the second beam shaping element increase the focal depth of the laser beam;
the first reflector reflects the laser beam passing through the first beam shaping element to a first focusing element for receiving; meanwhile, the second reflector reflects the laser beam passing through the second beam shaping element to be received by the second focusing element.
10. The method of claim 8, wherein the step of receiving one of the two laser beams split by the beam splitting element by the first focusing element and the other of the two laser beams split by the beam splitting element by the second focusing element is preceded by the step of:
the first Z-axis adjusting platform drives the laser cutting device to integrally move along the Z-axis direction, so that the laser beam of the first focusing element is focused at the cutting position of one layer of glass of the double-layer glass substrate to be cut;
the second Z-axis adjusting platform drives the second focusing element to move along the Z-axis direction, so that the laser beam of the second focusing element is focused at the cutting position of the other layer of glass of the double-layer glass substrate to be cut;
driving the first focusing element to move along the X-axis direction or the Y-axis direction by the XY two-dimensional fine tuning platform, so that the position of the laser beam of the first focusing element on the double-layer glass substrate to be cut is superposed with the position of the laser beam of the second focusing element on the double-layer glass substrate to be cut;
and the CCD imaging detection element detects whether the positions of the laser beams of the first focusing element and the second focusing element are overlapped or not at the position of the double-layer glass substrate to be cut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010404671.XA CN111410415A (en) | 2020-05-13 | 2020-05-13 | Laser cutting device and method for double-layer glass substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010404671.XA CN111410415A (en) | 2020-05-13 | 2020-05-13 | Laser cutting device and method for double-layer glass substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111410415A true CN111410415A (en) | 2020-07-14 |
Family
ID=71487300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010404671.XA Pending CN111410415A (en) | 2020-05-13 | 2020-05-13 | Laser cutting device and method for double-layer glass substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111410415A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115499638A (en) * | 2021-06-17 | 2022-12-20 | 深圳市光鉴科技有限公司 | Display device and electronic equipment with 3D module of making a video recording |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1433563A (en) * | 1973-05-04 | 1976-04-28 | Commissariat Energie Atomique | Method of and apparatus for cutting glass |
| CN101658979A (en) * | 2009-10-09 | 2010-03-03 | 廊坊昊博金刚石有限公司 | Laser double-faced synchronous machining system and machining method thereof |
| CN105643110A (en) * | 2014-11-14 | 2016-06-08 | 大族激光科技产业集团股份有限公司 | Precise laser cutting system |
| CN207414597U (en) * | 2017-10-17 | 2018-05-29 | 广州市莱塞激光设备有限公司 | A kind of double-sided laser cutting machine for packaging material |
| CN110066104A (en) * | 2019-04-26 | 2019-07-30 | 中国人民武装警察部队工程大学 | A kind of device and processing method of laser double-surface processing glass |
| CN110091075A (en) * | 2019-05-31 | 2019-08-06 | 大族激光科技产业集团股份有限公司 | Wafer grooving method and device |
| CN212315935U (en) * | 2020-05-13 | 2021-01-08 | 大族激光科技产业集团股份有限公司 | Laser cutting device for double-layer glass substrate |
-
2020
- 2020-05-13 CN CN202010404671.XA patent/CN111410415A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1433563A (en) * | 1973-05-04 | 1976-04-28 | Commissariat Energie Atomique | Method of and apparatus for cutting glass |
| CN101658979A (en) * | 2009-10-09 | 2010-03-03 | 廊坊昊博金刚石有限公司 | Laser double-faced synchronous machining system and machining method thereof |
| CN105643110A (en) * | 2014-11-14 | 2016-06-08 | 大族激光科技产业集团股份有限公司 | Precise laser cutting system |
| CN207414597U (en) * | 2017-10-17 | 2018-05-29 | 广州市莱塞激光设备有限公司 | A kind of double-sided laser cutting machine for packaging material |
| CN110066104A (en) * | 2019-04-26 | 2019-07-30 | 中国人民武装警察部队工程大学 | A kind of device and processing method of laser double-surface processing glass |
| CN110091075A (en) * | 2019-05-31 | 2019-08-06 | 大族激光科技产业集团股份有限公司 | Wafer grooving method and device |
| CN212315935U (en) * | 2020-05-13 | 2021-01-08 | 大族激光科技产业集团股份有限公司 | Laser cutting device for double-layer glass substrate |
Non-Patent Citations (2)
| Title |
|---|
| 杨贺来、徐九南主编: "金属工艺学实习教程", 30 April 2007, 北京交通大学出版社, pages: 284 * |
| 谭峭峰等著: "激光束二元光学变换及其应用", 30 November 2016, 北京：国防工业出版社, pages: 8 - 9 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115499638A (en) * | 2021-06-17 | 2022-12-20 | 深圳市光鉴科技有限公司 | Display device and electronic equipment with 3D module of making a video recording |
| CN115499638B (en) * | 2021-06-17 | 2024-05-07 | 深圳市光鉴科技有限公司 | Display device and electronic equipment with 3D camera module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2015152156A1 (en) | Laser processing device and laser processing method | |
| CN104535052A (en) | Lens array and PD array high-precision alignment mounting device and alignment method thereof | |
| US20140251963A1 (en) | Laser machining method and laser machining device | |
| KR100838684B1 (en) | Apparatus and method for bonding substrates | |
| CN212315935U (en) | Laser cutting device for double-layer glass substrate | |
| CN1134055C (en) | Method of and apparatus for aligning bonding head of bonder or pick and place machine | |
| CN1924696B (en) | Projector | |
| CN1414827A (en) | Substrate conducting wiring cutting method and device, electronic device manufacturing method and device | |
| CN111410415A (en) | Laser cutting device and method for double-layer glass substrate | |
| JP2006227036A (en) | Liquid crystal optical lens apparatus and its driving method | |
| CN113281910A (en) | Method and device for correcting position of light spot of laser | |
| CN1220094C (en) | Method and system for regulating position of optical system and optical modulator | |
| CN1360218A (en) | Projection type display device | |
| US11914116B2 (en) | Optical system | |
| KR100832801B1 (en) | Laser cutting device using polygon mirror | |
| CN109064886A (en) | A kind of binding board horizontal alignment system and method | |
| CN112059419A (en) | Sound membrane cutting device and working method thereof | |
| CN2715188Y (en) | Hot press bond equipment | |
| CN2702336Y (en) | Location identification apparatus and hot compression equipment | |
| CN1307462C (en) | Position modulation device and method of light modulation equipment and its initial position modulation clamp | |
| KR100904034B1 (en) | Laser multiple cutting device | |
| CN113050292A (en) | Optical system for optical axis calibration and optical axis calibration method | |
| CN113701727A (en) | Fine adjustment reflector lens frame assembly, laser directivity adjustment device and adjustment method | |
| JP2012042436A (en) | Positioning mark recognition device for fpd module, and assembly device for fpd module | |
| CN220399719U (en) | Optical lens adjusting system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220803 Address after: 518000 101, building 6, Wanyan Industrial Zone, Qiaotou community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Han's Semiconductor Equipment Technology Co.,Ltd. Address before: 518000 No. 9988 Shennan Road, Nanshan District, Shenzhen, Guangdong Applicant before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. |
|
| TA01 | Transfer of patent application right |