CN111408833B - 一种基于石墨烯增强的搅拌摩擦胶焊方法 - Google Patents

一种基于石墨烯增强的搅拌摩擦胶焊方法 Download PDF

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CN111408833B
CN111408833B CN202010254747.5A CN202010254747A CN111408833B CN 111408833 B CN111408833 B CN 111408833B CN 202010254747 A CN202010254747 A CN 202010254747A CN 111408833 B CN111408833 B CN 111408833B
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姬书得
宋崎
齐维维
熊需海
姜文辉
于海生
孟庆实
温琦
胡为
杨康
龚鹏
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Jiangxi Zhuang Long Uav Technology Co ltd
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Abstract

一种基于石墨烯增强的搅拌摩擦胶焊方法，步骤为：将下层板材置于搅拌摩擦焊机工装台上，在下层板材上表面搭接区涂抹液态胶层，液态胶层采用环氧树脂，液态胶层内添加有表面改性后的石墨烯，将上层板材置于下层板材之上；将搅拌头安装到搅拌摩擦焊机主轴上，主轴逆时针旋转并下扎，直到搅拌针在搭接区扎入指定深度，搅拌头的搅拌针采用正反螺纹结构，搅拌针的尖部设有左旋螺纹，搅拌针的根部设有右旋螺纹，搅拌针根部右旋螺纹的轴向高度小于上层板材的厚度；当搅拌针扎入指定深度后，搅拌针需要继续停留一段时间，再以设定速度移动，直到焊接完成；搅拌针移动时，需要同步施加超声振动，当焊接完成后，还需继续施加一段时间的超声振动。

Description

一种基于石墨烯增强的搅拌摩擦胶焊方法
技术领域
本发明属于搅拌摩擦焊技术领域，特别是涉及一种基于石墨烯增强的搅拌摩擦胶焊方法。
背景技术
由于胶焊结构具有密封性能好、拉伸性能高等优点，已经广泛地应用于航空航天等领域，其在制造过程中多采用先在连接区域及其附近涂胶、再焊接、后胶固化的工艺流程。
目前，实现胶焊结构的方法主要包括激光焊、电阻焊和电弧焊等。但是，在焊接过程中，由于上述焊接方法温度较高，一方面待焊母材因受到大量的热输入而软化严重，另一方面焊缝区材料经历熔化再固化的过程，容易产生气孔等二次缺陷，同时混入焊缝中的胶受热会分解产生气体，这些气体一部分会通过焊缝处熔化的金属排出，而另一部分会残留在焊缝中并进一步增加气孔缺陷的数量。
上述的问题严重影响接头的力学性能，限制了胶焊技术的应用范围。再有，焊缝区以外的胶接区是实现胶焊结构密封性的重要部分，然而采用熔化焊连接时，大的热量会使胶接区的胶分解甚至碳化，因此不利于结构的密封性。
公开号为CN102126086A公开了一种激光胶接点焊方法的中国专利申请，其首先采用小功率激光预热使得胶层固化，然后利用大功率激光焊接实现胶焊结构，该方案虽然避免了胶层气泡从焊缝处溢出的问题，但是大功率的激光依然使得母材软化严重，因此大大降低了胶焊结构的力学性能。
为此，搅拌摩擦胶焊结构逐渐体现出优势。搅拌摩擦焊作为一种固相连接技术，其具有焊接温度低、接头质量高等优点，可大幅度降低焊接时材料的软化程度，进而有效提高焊接接头的拉伸强度。但是，利用传统的搅拌摩擦焊方式实现胶焊结构时，胶层受到搅拌针的搅拌作用将不可避免地进入焊缝区，这些残胶将引起应力集中，从而降低焊缝的力学性能，并且少量胶层还会分解产生气体，这些气体无法排出将残留在焊缝区与胶接区中。残留在焊缝区的气体会降低接头的力学性能，同时残留在胶接区的气体则会降低胶焊结构的密封性。
发明内容
针对现有技术存在的问题，本发明提供一种基于石墨烯增强的搅拌摩擦胶焊方法，能够有效增强胶焊结构的力学性能，有效提高胶焊接头的密封能力，有效增强胶层固化后的强韧性，能够满足监测胶焊结构连接质量的目的，进而有效保证胶焊结构使用时的可靠性。
为了实现上述目的，本发明采用如下技术方案：一种基于石墨烯增强的搅拌摩擦胶焊方法，包括如下步骤：
步骤一：将下层板材置于搅拌摩擦焊机的工装台上，然后在下层板材上表面的搭接区涂抹上液态胶层，再将上层板材置于下层板材之上；其中，液态胶层采用环氧树脂，在液态胶层内添加有石墨烯，并且石墨烯在液态胶层内的添加比例为0.1％～40％；
步骤二：将搅拌头安装到搅拌摩擦焊机的主轴上，启动搅拌摩擦焊机，主轴以100～5000rpm的转速逆时针旋转，然后使主轴以1～20mm/min的速度下扎，直到搅拌针在搭接区扎入指定深度；其中，搅拌头的搅拌针采用正反螺纹结构，搅拌针的尖部设有左旋螺纹，搅拌针的根部设有右旋螺纹，且搅拌针根部右旋螺纹的轴向高度比上层板材的厚度小0～5mm；
步骤三：当搅拌针扎入指定深度后，搅拌针继续停留0～50s，然后以5～500mm/min的速度移动，直到焊接完成。
所述下层板材的厚度为1～20mm，所述上层板材的厚度为1～20mm，下层板材和上层板材为金属材料或热塑性聚合物材料，在下层板材和上层板材构成的胶焊结构中，下层板材和上层板材中至少一个为金属材料。
在步骤三中，当搅拌针以5～500mm/min的速度移动时，需要同步施加超声振动，超声振动的功率为60～2000W，超声振动的振幅为15～55μm，且当焊接完成后，需要继续施加0～300s的超声振动。
添加在所述液态胶层内的石墨烯为表面改性后的石墨烯。
所述石墨烯可由碳纳米管或二氧化硅纳米颗粒进行代替。
本发明的有益效果：
本发明的基于石墨烯增强的搅拌摩擦胶焊方法，搅拌头采用了正反螺纹结构搅拌针，当搅拌头逆时针旋转时，搅拌针可驱动上层板材中的材料向下流动，同时可驱动下层板材中的材料向上流动，进而在上层板材与下层板材中间的搭接界面处汇集形成材料集中区，材料集中区会对搭接界面处的焊核区两侧的材料施加水平挤压，进而减少液态胶层进入焊核区，同时促进搭接界面处的焊核宽度明显变大。另外，由于搅拌区内塑性材料沿垂直方向的流动行为的改变，正反螺纹结构搅拌针可使搭接接头中钩状缺陷和冷搭接减小，从而使焊接接头的力学性能得到大幅度提升。
本发明的基于石墨烯增强的搅拌摩擦胶焊方法，在液态胶层内均匀混合了表面改性后的石墨烯。首先，表面改性后的石墨烯能够有效避免因石墨烯在胶层中的团聚从而降低焊缝区力学性能的现象。其次，石墨烯能够产生细化晶粒和钉扎的作用，可以弥补液态胶层进入焊缝所引起的焊接接头力学性能下降的问题，甚至在合适的添加比例下还可使焊接接头获得更高的力学性能。另外，液态胶层中添加石墨烯后，还能够增强液态胶层固化后的强韧性。再有，液态胶层中添加石墨烯后，可使胶层获得导电性能，在胶焊结构后续使用过程中，可以通过监测胶焊结构的电信号变化，实现对胶焊结构连接质量进行监测，有效保证胶焊结构使用时的可靠性。
本发明的基于石墨烯增强的搅拌摩擦胶焊方法，在搅拌针移动时施加了超声振动，在超声振动作用下，可以增加焊缝区的材料流动，进一步细化金属材料的晶粒，提高焊缝区承载能力；改善胶接区固液界面湿润特性，有利于获得更高的胶接质量；促进胶接区气体的排出，有利于提高胶接区的综合性能。另外，焊接完成后继续施加超声振动，可以继续排出胶接区气体，同时消除焊后残余应力。
附图说明
图1为搅拌针采用正反螺纹结构的搅拌头结构示意图；
图2为搅拌摩擦胶焊过程示意图；
图3为正反螺纹结构搅拌针的焊接流场示意图；
图中，1—下层板材，2—液态胶层，3—上层板材，4—搅拌头，5—搭接界面，6—材料集中区。
具体实施方式
下面结合附图和具体实施例对本发明做进一步的详细说明。
本实施例中，关于下层板材1与上层板材3的组合，可以采用厚度为4mm的7075铝合金(下层板材1)与厚度为2mm的2024铝合金(上层板材3)的组合，或者采用两张厚度为3mm的2024铝合金(下层板材1和上层板材3)的组合，或者采用厚度为4mm的7075铝合金(下层板材1)与厚度为2mm的树脂基复合材料(上层板材3)的组合。
一种基于石墨烯增强的搅拌摩擦胶焊方法，包括如下步骤：
步骤一：将下层板材1置于搅拌摩擦焊机的工装台上，然后在下层板材1上表面的搭接区涂抹上液态胶层2，再将上层板材3置于下层板材1之上；其中，液态胶层2采用环氧树脂，在液态胶层2内添加有表面改性后的石墨烯，并且石墨烯在液态胶层2内的添加比例为20％；
步骤二：将图1所示的搅拌头4安装到搅拌摩擦焊机的主轴上，启动搅拌摩擦焊机，主轴以2000rpm的转速逆时针旋转，然后使主轴以10mm/min的速度下扎，直到搅拌针在搭接区扎入指定深度；其中，搅拌头4的搅拌针采用正反螺纹结构，搅拌针的尖部设有左旋螺纹，搅拌针的根部设有右旋螺纹，且搅拌针根部右旋螺纹的轴向高度比上层板材3的厚度小2mm；
步骤三：当搅拌针扎入指定深度后，搅拌针继续停留25s，然后以50mm/min的速度移动，搅拌摩擦胶焊过程如图2所示，正反螺纹结构搅拌针的焊接流场如图3所示，直到焊接完成；当搅拌针以50mm/min的速度移动时，需要同步施加超声振动，超声振动的功率为1000W，超声振动的振幅为20μm，且当焊接完成后，需要继续施加200s的超声振动。
实施例中的方案并非用以限制本发明的专利保护范围，凡未脱离本发明所为的等效实施或变更，均包含于本案的专利范围中。

Claims (2)

1.一种基于石墨烯增强的搅拌摩擦胶焊方法，其特征在于包括如下步骤：
步骤一：将下层板材置于搅拌摩擦焊机的工装台上，然后在下层板材上表面的搭接区涂抹上液态胶层，再将上层板材置于下层板材之上；其中，液态胶层采用环氧树脂，在液态胶层内添加有表面改性后的石墨烯，并且石墨烯在液态胶层内的添加比例为0.1%～40%；
步骤二：将搅拌头安装到搅拌摩擦焊机的主轴上，启动搅拌摩擦焊机，使主轴以100～5000rpm的转速逆时针旋转，然后使主轴以1～20mm/min的速度下扎，直到搅拌针在搭接区扎入指定深度；其中，搅拌头的搅拌针采用正反螺纹结构，搅拌针的尖部设有左旋螺纹，搅拌针的根部设有右旋螺纹，且搅拌针根部右旋螺纹的轴向高度比上层板材的厚度小0～5mm；
步骤三：当搅拌针扎入指定深度后，搅拌针继续停留0～50s，然后以5～500mm/min的速度移动，并且需要同步施加超声振动，超声振动的功率为60～2000W，超声振动的振幅为15～55μm，直到焊接完成，且当焊接完成后，需要继续施加0～300s的超声振动。
2.根据权利要求1所述的一种基于石墨烯增强的搅拌摩擦胶焊方法，其特征在于：所述下层板材的厚度为1～20mm，所述上层板材的厚度为1～20mm，下层板材和上层板材为金属材料或热塑性聚合物材料，在下层板材和上层板材构成的胶焊结构中，下层板材和上层板材中至少一个为金属材料。
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