CN111403449A - Display panel and manufacturing method thereof - Google Patents
Display panel and manufacturing method thereof Download PDFInfo
- Publication number
- CN111403449A CN111403449A CN202010221290.8A CN202010221290A CN111403449A CN 111403449 A CN111403449 A CN 111403449A CN 202010221290 A CN202010221290 A CN 202010221290A CN 111403449 A CN111403449 A CN 111403449A
- Authority
- CN
- China
- Prior art keywords
- layer
- display panel
- opening
- emitting device
- array substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 110
- 239000000758 substrate Substances 0.000 claims abstract description 96
- 239000011345 viscous material Substances 0.000 claims abstract description 56
- 238000000034 method Methods 0.000 claims abstract description 19
- 239000000853 adhesive Substances 0.000 claims description 86
- 230000001070 adhesive effect Effects 0.000 claims description 86
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 26
- 239000011159 matrix material Substances 0.000 claims description 22
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 22
- 229920002367 Polyisobutene Polymers 0.000 claims description 12
- 229920005549 butyl rubber Polymers 0.000 claims description 12
- 239000004200 microcrystalline wax Substances 0.000 claims description 12
- 235000019808 microcrystalline wax Nutrition 0.000 claims description 12
- 239000011368 organic material Substances 0.000 claims description 4
- 230000008569 process Effects 0.000 abstract description 9
- 239000010410 layer Substances 0.000 description 310
- 230000000694 effects Effects 0.000 description 14
- 229960001701 chloroform Drugs 0.000 description 12
- 238000001035 drying Methods 0.000 description 8
- 238000000926 separation method Methods 0.000 description 8
- 125000006850 spacer group Chemical group 0.000 description 8
- 239000000243 solution Substances 0.000 description 7
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 230000002159 abnormal effect Effects 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 229920006037 cross link polymer Polymers 0.000 description 4
- 230000003811 curling process Effects 0.000 description 4
- 239000002270 dispersing agent Substances 0.000 description 4
- 238000005265 energy consumption Methods 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- QXLPXWSKPNOQLE-UHFFFAOYSA-N methylpentynol Chemical compound CCC(C)(O)C#C QXLPXWSKPNOQLE-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920001621 AMOLED Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The application discloses a display panel and a manufacturing method thereof. The display panel includes: an array substrate; a pixel defining layer and a light emitting device layer on the array substrate; the pixel defining layer comprises a plurality of first openings and a plurality of second openings, wherein luminescent materials are arranged in the first openings, viscous materials are filled in the second openings, and the viscous materials are used for bonding the luminescent device layer and the array substrate. This application is through filling viscous material between array substrate and luminescent device layer, utilizes this viscous material to bond array substrate and luminescent device layer, and at display panel when the process of curling, thereby avoid because the adhesion between array substrate and the luminescent device layer is not enough, thereby leads to the rete to separate and causes display panel to show unusual technical problem.
Description
Technical Field
The application relates to the field of display, in particular to a display panel and a manufacturing method thereof.
Background
With the improvement of living standard, the active matrix organic light emitting diode (AMO L ED) is expected to replace the liquid crystal as the mainstream choice of the next generation display due to the characteristics of high contrast, wide viewing angle, fast response speed, flexibility, etc.
In the prior art, in the curling process of the display panel, due to the fact that the adhesion force between the array substrate and the light-emitting device layer is insufficient, the film layers are separated, and the display of the display panel is abnormal.
Therefore, a display panel and a method for fabricating the same are needed to solve the above-mentioned problems.
Disclosure of Invention
The application provides a display panel and a preparation method thereof, which aim to solve the technical problem that when the display panel is curled, due to insufficient adhesion between an array substrate and a light-emitting device layer, a film layer is separated, and therefore display of the display panel is abnormal.
In order to solve the above problems, the technical solution provided by the present application is as follows:
the application provides a display panel, display panel includes:
an array substrate;
a pixel defining layer and a light emitting device layer on the array substrate;
the pixel defining layer comprises a plurality of first openings and a plurality of second openings, wherein the first openings are filled with light-emitting materials, the second openings are filled with viscous materials, and the viscous materials are used for bonding the light-emitting device layer and the array substrate.
In the display panel of the present application, the display panel includes a planarization layer between the pixel defining layer and the array substrate;
the second opening penetrates through the pixel defining layer and extends to the flat layer.
In the display panel of the present application, a plurality of first protrusions and/or a plurality of first concave surfaces are provided on a first surface of the adhesive material in contact with the light emitting device layer;
the adhesive material is disposed in nesting relation with the light emitting device layer by a plurality of the first protrusions and/or a plurality of the first concave surfaces on the first surface.
In the display panel of the present application, a plurality of second protrusions and/or a plurality of second concave surfaces are disposed on a second surface of the pixel defining layer, which is in contact with the adhesive material;
the adhesive material is nested with the pixel definition layer by a plurality of the second protrusions and/or a plurality of the second concavities on the second surface.
In the display panel of the present application, the adhesive material includes propylene glycol methyl ether acetate, polyisobutylene, butyl rubber, microcrystalline wax, and chloroform.
In the display panel of the present application, the light emitting device layer includes a third opening corresponding to the second opening, the third opening penetrates the light emitting device layer and extends to the second opening, and the adhesive material is connected to the cathode layer in the light emitting device layer.
In the display panel of the present application, the second opening is disposed in the non-display region of the pixel defining layer.
In the display panel of the present application, the second opening is disposed between any two adjacent black matrices in the non-display region.
In the display panel of the present application, the organic material includes propylene glycol methyl ether acetate, polyisobutylene, butyl rubber, microcrystalline wax, chloroform, and a black dye;
the second via hole and the organic material are used as a black matrix of the non-display area.
The application also provides a manufacturing method of the display panel, which comprises the following steps:
forming a pixel defining layer on the array substrate;
forming a plurality of first openings and a plurality of second openings on the pixel defining layer;
filling a viscous material in the second opening;
filling a luminescent material in the first opening;
forming a light emitting device layer on the pixel defining layer;
wherein the adhesive material is used for bonding the light emitting device layer and the array substrate.
Has the advantages that: this application is through filling viscous material between array substrate and luminescent device layer, utilizes this viscous material to bond array substrate and luminescent device layer, and at display panel when the process of curling, thereby avoid because the adhesion between array substrate and the luminescent device layer is not enough, thereby leads to the rete to separate and causes display panel to show unusual technical problem.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a display panel according to the present application;
FIG. 2 is a top view partially schematic view of a display panel of the present application;
FIG. 3 is a partial schematic view of a first structure of a display panel according to the present application;
FIG. 4 is a partial schematic view of a second structure of a display panel according to the present application;
FIG. 5 is a top view partially illustrating a third structure of a display panel according to the present application;
FIG. 6 is a partial schematic view of a fourth structure of the display panel of the present application;
FIG. 7 is a partial schematic view of a fifth structure of a display panel according to the present application;
fig. 8 is a flowchart illustrating steps of a method for manufacturing a display panel according to the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
In the prior art, in the curling process of the display panel, due to the fact that the adhesion force between the array substrate and the light-emitting device layer is insufficient, the film layers are separated, and the display of the display panel is abnormal.
Referring to fig. 1 to 7, the present application provides a display panel 100, where the display panel 100 includes:
an array substrate 200;
a pixel defining layer 300 and a light emitting device layer 400 on the array substrate 200;
the pixel defining layer 300 includes a plurality of first openings 301 and a plurality of second openings, the first openings 301 are filled with a light emitting material, the second openings are filled with a viscous material 500, and the viscous material 500 is used for bonding the light emitting device layer 400 and the array substrate 200.
This application is through filling viscous material between array substrate and luminescent device layer, utilizes this viscous material to bond array substrate and luminescent device layer, and at display panel when the process of curling, thereby avoid because the adhesion between array substrate and the luminescent device layer is not enough, thereby leads to the rete to separate and causes display panel to show unusual technical problem.
The technical solution of the present application will now be described with reference to specific embodiments.
Example one
Referring to fig. 1 to 4, the present application provides a display panel 100, where the display panel 100 includes an array substrate 200, a pixel definition layer 300 on the array substrate 200, and a light emitting device layer 400. The pixel defining layer 300 includes a plurality of first openings 301 and a plurality of second openings 302, the first openings 301 are filled with a light emitting material, the second openings 302 are filled with a viscous material 500, and the viscous material 500 is used for bonding the light emitting device layer 400 and the array substrate 200. In this embodiment, the array substrate 200 sequentially includes a first substrate, a first buffer layer, a second substrate, a second buffer layer, an active layer, a first gate insulating layer, a first gate layer, a second gate insulating layer, a second gate layer, an interlayer insulating layer, and a source drain layer 220.
In this embodiment, the first substrate includes a first substrate, a first buffer layer, a second substrate, a second buffer layer, an active layer, a first gate insulating layer, a first gate layer, a second gate insulating layer, a second gate layer, and an interlayer insulating layer of the array substrate 200.
In this embodiment, the display panel 100 includes a planarization layer 210 located between the pixel definition layer 300 and the array substrate 200. The second opening 302 penetrates the pixel defining layer 300 and extends to the planarization layer 210. The deeper the depth of the second opening 302, the larger the contact area between the adhesive material 500 in the second opening 302 and the surrounding film layers, and the better the bonding effect, please refer to fig. 4 specifically.
In this embodiment, the depth of the second opening 302 may be such that the second opening penetrates through the pixel defining layer 300 and exposes the planarization layer 210, and the planarization layer 210 is not etched and invaded by the second opening 302, as shown in fig. 1.
In this embodiment, the depth of the second opening 302 may be such that it penetrates through the pixel defining layer 300 and includes a portion of the second opening 302 in the planarization layer 210. The second opening 302 does not extend through the planarization layer 210. The adhesive material 500 is filled in the second opening 302, and the contact area between the adhesive material 500 in the second opening 302 and the surrounding film layers is increased, so that the array substrate 200 and the light emitting device layer 400 can be better bonded. Because the source/drain layer 220 is included between the planarization layer 210 and the interlayer insulating layer, if the second opening 302 penetrates through the planarization layer 210, the depth of the hole is too deep, which may easily damage the source/drain layer 220, specifically refer to fig. 1 and 2.
In this embodiment, a plurality of first protrusions 501 and/or a plurality of first recesses 502 are disposed on a first surface of the adhesive material 500 contacting the light emitting device layer 400. The adhesive material 500 is nested with the light emitting device layer 400 by the first protrusions 501 and/or the first concavities 502 on the first surface, as shown in fig. 4. The first surface is any one of the surfaces of the adhesive material 500, so that the contact area between the adhesive material 500 and the light-emitting device layer 400 is increased, the adhesion between the adhesive material 500 and the light-emitting device layer 400 is increased, and the stability between the two film layers is improved.
In this embodiment, a plurality of second protrusions 303 and/or a plurality of second concave surfaces 304 are disposed on a second surface of the pixel defining layer 300, which is in contact with the adhesive material 500. The adhesive material 500 is nested with the pixel defining layer 300 by the second protrusions 303 and/or the second concavities 304 on the second surface, as shown in fig. 3. The second surface is any one surface of the pixel defining layer 300, the contact area between the adhesive material 500 and the pixel defining layer 300 is increased, the adhesion between the adhesive material 500 and the pixel defining layer 300 is increased, and the stability between the two film layers is improved.
In this embodiment, the cross-sectional area of the second opening 302 in the first cross-section is gradually increased in a direction away from the array substrate 200. The first section is parallel to the array substrate 200. By increasing the cross-sectional area of the second opening 302 adjacent to the light emitting device layer 400 in the first cross-section, the area of the adhesive material 500 contacting the light emitting device layer 400 is increased, and the array substrate 200 and the light emitting device layer 400 can be better bonded.
In this embodiment, the adhesive material 500 includes propylene glycol methyl ether acetate, polyisobutylene, butyl rubber, microcrystalline wax, and chloroform. The propylene glycol methyl ether acetate is a solvent, and may be used to dissolve other substances in the viscous material 500. The addition of the chloroform may better improve the adhesion between the adhesive material 500 and the light emitting device layer 400, and particularly, may enhance the adhesion between the adhesive material 500 and the hole injection layer in the light emitting device layer 400.
In this embodiment, in the preparation process of the viscous material 500, the added contents are as follows: 54% propylene glycol methyl ether acetate, 23% polyisobutylene, 18% butyl rubber, 3% microcrystalline wax, and 2% chloroform. After filling the second opening 302 with the above-mentioned components in the above-mentioned ratio, the solvent of the adhesive material 500, i.e., the propylene glycol methyl ether acetate, may be precipitated by drying under reduced pressure, and the final remaining propylene glycol methyl ether acetate may account for less than 10% by mass of the original components. This not only reduces the energy consumption and difficulty of the drying process, but also properly increases the flexibility of the adhesive material 500, thereby better improving the stress when the display panel 100 is twisted.
In the present embodiment, the second opening 302 is disposed in the non-display region of the pixel defining layer 300, please refer to fig. 2 specifically. The second opening 302 does not occupy the aperture ratio of the display panel 100 in the non-display area of the display panel 100, while the non-display area is distributed around the display area, and the second opening 302 and the adhesive material 500 are also distributed around the display area, so that when the display panel 100 is curled, the stress can be better dispersed, the adhesion can be enhanced, and the reliability between the film layers of the display panel 100 can be improved.
In this embodiment, the second opening 302 is disposed between any two adjacent black matrixes 310 in the non-display area, please refer to fig. 2 specifically. The black matrixes 310 are used for shielding non-display devices such as signal lines, and the second opening 302 is arranged between any two adjacent black matrixes 310, so that a non-display device area, the array substrate 200 and the light-emitting device layer 400 can be bonded tightly, and the display panel 100 is prevented from being separated when being curled.
In this embodiment, the second opening 302 is disposed between any two adjacent spacers 320 in the non-display area, please refer to fig. 2 specifically. The spacers 320 are used for relieving stress when the display panel 100 is squeezed, and the second openings 302 are arranged between any two adjacent spacers 320 and are matched with each other, so that a non-display device area, the array substrate 200 and the light-emitting device layer 400 can be bonded tightly, and separation is avoided when the display panel 100 is curled.
In this embodiment, the black matrix 310 is located between any two of the first openings 301, and particularly referring to fig. 2, a light shielding effect can be better achieved, so as to prevent color mixing in a light emitting region.
In this embodiment, the opening shape of the second opening 302 in the pixel region may be a closed figure, including a circle, a rectangle, and a triangle, which is not limited herein. Wherein, because of the circular characteristic, the closed figure of the same girth, the circular area is the biggest, when the opening shape is circular, please refer to fig. 2 specifically, the bonding effect is the best.
In this embodiment, the light emitting device layer 400 includes a cathode layer 430, a light emitting material layer 420, and an anode layer 410. The luminescent material layer 420 includes a conductive layer, a luminescent material, and an emission layer. The conductive layer includes a hole injection layer and a hole transport layer. The emission layer includes an electron transport layer and an electron injection layer.
In this embodiment, when the temperature is increased, the bonding capability of the adhesive material 500 is enhanced, that is, when the display panel 100 operates, the temperature of the display panel 100 is increased, so that, in the normal operating range of the display panel 100, as the working strength of the display panel 100 is increased, the higher the temperature is, the stronger the bonding capability of the adhesive material 500 is, the better the bonding effect is, and the firmer the inter-film layers in the display panel 100 are, and the separation is not easy.
This embodiment is through filling viscous material between array substrate and light emitting device layer, utilizes this viscous material to bond array substrate and light emitting device layer, avoids display panel to lead to the rete to separate at the crimping in-process because the adhesion between array substrate and the light emitting device layer is not enough, causes display panel to show unusual technical problem.
Example two
Referring to fig. 1 to 5, the present embodiment is the same as or similar to the first embodiment, except that:
the adhesive material 500 includes propylene glycol methyl ether acetate, polyisobutylene, butyl rubber, microcrystalline wax, chloroform, and black dye.
In this embodiment, the second opening 302 and the adhesive material 500 are used as a black matrix of the non-display area. By adding the black dye, the black matrix 310 in the non-display area is replaced with the second opening 302 and the adhesive material 500 added with the black dye, specifically referring to fig. 5, so that the manufacturing process of the black matrix 310 is reduced, and the adhesive material 500 not only can play a role in shading the original black matrix 310, but also can play a role in bonding the array substrate 200 and the light emitting device layer 400.
In this embodiment, in the preparation process of the viscous material 500, the added contents are, by mass: 34% of propylene glycol methyl ether acetate, 23% of polyisobutylene, 18% of butyl rubber, 3% of microcrystalline wax, 2% of trichloromethane and 20% of black dye. After filling the second opening 302 with the above-mentioned components in the above-mentioned ratio, the solvent of the adhesive material 500, i.e., the propylene glycol methyl ether acetate, may be precipitated by drying under reduced pressure, and the final remaining propylene glycol methyl ether acetate may account for less than 10% by mass of the original components. This not only reduces the energy consumption and difficulty of the drying process, but also properly increases the flexibility of the adhesive material 500, thereby better improving the stress when the display panel 100 is twisted.
In this embodiment, the 20% black dye may include 10% carbon black, 5% dispersant, 2% cross-linked polymer, and 3% cross-linked monomer. The proportion can ensure that the color of the viscous material 500 is blackened to achieve the shading effect of the original black matrix 310, and the bonding capacity of the viscous material 500 is not greatly changed.
In this embodiment, the dispersant may include methylpentanol. The crosslinked polymer may include dicumyl peroxide. The crosslinking monomer may include hydroxyethyl methacrylate.
This embodiment is through add black dye in the viscous material, make the viscous material replaces former black matrix, has reduced the process of black matrix, and viscous material both can play the shading effect of former black matrix, can play the effect of bonding array substrate and light emitting device layer again, has avoided display panel to curl the in-process because the adhesion between array substrate and the light emitting device layer is not enough, leads to the rete to separate, causes display panel to show unusual technical problem.
EXAMPLE III
Referring to fig. 1 to 7, the present embodiment is the same as or similar to the first or second embodiment, except that:
the light emitting device layer 400 includes a third opening 401 corresponding to the second opening 302, and the third opening 401 penetrates the light emitting material layer 420 and extends to the second opening 302.
In this embodiment, the second opening 302 is filled with a viscous material 500, and the viscous material 500 is connected to the cathode layer 430 of the light emitting device layer 400, as shown in fig. 6. The adhesive material 500 has strong adhesion to the cathode layer 430 of the light emitting device layer 400, so that the pixel defining layer 300 and the cathode layer 430 can be well bonded, and the film layers are not easily separated when the display panel 100 is curled.
In this embodiment, the second opening 302 and the third opening 401 are filled with a viscous material 500, and the viscous material 500 is connected to the cathode layer 430 of the light emitting device layer 400, as shown in fig. 7. The adhesive material 500 has strong adhesion to the cathode layer 430 of the light emitting device layer 400, so that the pixel defining layer 300 can be well bonded to the cathode layer 430, the adhesive material 500 has certain elasticity, and the adhesive material 500 in the second opening 302 and the third opening 401 can bond each film layer of the light emitting device layer 400 and also can serve as a limiting device of the light emitting device layer 400, so that the separation of the film layers of the display panel 100 during curling is prevented, and the dislocation movement between the film layers is avoided.
In this embodiment, the second opening 302 and the third opening 401 are not filled with the adhesive material 500. The pixel defining layer 300 is connected to the cathode layer 430 of the light emitting device layer 400, and the adhesion between the pixel defining layer 300 and the cathode layer 430 of the light emitting device layer 400 is sufficient to relieve stress between the film layers when the display panel 100 is rolled.
In this embodiment, the planarization layer 210 includes a plurality of fourth openings 211, and the fourth openings 211 penetrate through the planarization layer 210 and extend to the source drain layer 220 of the array substrate 200. The anode layer 410 is electrically connected to the source/drain layer 220 through the fourth opening 211, as shown in fig. 1. The source drain layer 220 is electrically connected to the active layer 230.
This embodiment is through the patterning light emitting device layer, with adhesive material and cathode layer direct connection, utilize the strong adhesion between adhesive material and the cathode layer, when display panel is curling, avoid separating between the rete, improve user experience.
In the first to third embodiments, the viscous material is filled between the array substrate and the light emitting device layer, and the array substrate and the light emitting device layer are bonded by using the viscous material, so that the technical problem that the display of the display panel is abnormal due to the separation of the film layers caused by insufficient adhesion between the array substrate and the light emitting device layer in the curling process of the display panel is solved.
Referring to fig. 8, the present application further provides a manufacturing method of a display panel 100, including:
s10, forming a pixel defining layer 300 on the array substrate 200;
s20, forming a plurality of first openings 301 and a plurality of second openings 302 on the pixel defining layer 300;
s30, filling the second opening 302 with a viscous material 500;
s40, filling the first opening 301 with a light emitting material;
s50, forming a light emitting device layer 400 on the pixel defining layer 300;
s60, wherein the adhesive material 500 is used to bond the light emitting device layer 400 and the array substrate 200.
This application is through filling viscous material between array substrate and luminescent device layer, utilizes this viscous material to bond array substrate and luminescent device layer, and at display panel when the process of curling, thereby avoid because the adhesion between array substrate and the luminescent device layer is not enough, thereby leads to the rete to separate and causes display panel to show unusual technical problem.
The technical solution of the present application will now be described with reference to specific embodiments.
Example four
S10, forming a pixel defining layer 300 on the array substrate 200.
In this embodiment, the step before S10 further includes:
s01, forming a planarization layer 210 on the array substrate 200, and forming a plurality of fourth openings 211 on the planarization layer 210, where the fourth openings 211 penetrate through the planarization layer 210 and extend to the source and drain layers 220 of the array substrate 200, as shown in fig. 1.
In this embodiment, the formation of the array substrate 200 includes sequentially forming a first buffer layer, a second substrate, a second buffer layer, an active layer, a first gate insulating layer, a first gate layer, a second gate insulating layer, a second gate layer, an interlayer insulating layer, and a source/drain layer 220 on a first substrate.
S02, forming an anode layer 410 of the light emitting device layer 400 on the pixel defining layer 300, the anode layer 410 being electrically connected to the array substrate 200 through the fourth opening 211.
In this embodiment, the anode layer 410 is electrically connected to the source/drain layer 220 through the fourth opening 211, specifically, refer to fig. 1.
In this embodiment, the first substrate includes a first substrate, a first buffer layer, a second substrate, a second buffer layer, an active layer, a first gate insulating layer, a first gate layer, a second gate insulating layer, a second gate layer, and an interlayer insulating layer of the array substrate 200.
S20, forming a plurality of first openings 301 and a plurality of second openings 302 on the pixel defining layer 300.
In this embodiment, before step S20, the method further includes:
s198, forming a plurality of fifth openings and a plurality of sixth openings on the pixel defining layer 300.
S199, forming a black matrix 310 in the fifth opening and forming a spacer 320 in the sixth opening, please refer to fig. 2.
In this embodiment, the array substrate 200 includes a flat layer 210 adjacent to one side of the pixel defining layer 300. The second opening 302 penetrates the pixel defining layer 300 and extends to the planarization layer 210, as shown in fig. 4. The deeper the depth of the second opening 302, the larger the contact area of the adhesive material 500 with the surrounding film layers in the second opening 302, and the better the bonding effect.
In this embodiment, the depth of the second opening 302 may be such that the second opening penetrates through the pixel defining layer 300 and exposes the planarization layer 210, specifically, referring to fig. 1, the planarization layer 210 is not etched and invaded by the second opening 302.
In this embodiment, the depth of the second opening 302 may be such that it penetrates through the pixel defining layer 300 and includes a portion of the second opening 302 in the planarization layer 210. The second opening 302 does not extend through the planarization layer 210, as shown in fig. 4. The adhesive material 500 is filled in the second opening 302, and the contact area between the adhesive material 500 in the second opening 302 and the surrounding film layers is increased, so that the array substrate 200 and the light emitting device layer 400 can be better bonded. Because the source/drain layer 220 is included between the planarization layer 210 and the interlayer insulating layer, if the second opening 302 penetrates through the planarization layer 210, the depth of the hole is too deep, which may easily damage the source/drain layer 220.
In this embodiment, a plurality of first protrusions 501 and/or a plurality of first recesses 502 are disposed on a first surface of the adhesive material 500 contacting the light emitting device layer 400. The adhesive material 500 is nested with the light emitting device layer 400 by a plurality of the first protrusions 501 and/or a plurality of the first concavities 502 on the first surface. The first surface is any one of the surfaces of the adhesive material 500, and in particular, referring to fig. 4, the contact area between the adhesive material 500 and the light emitting device layer 400 is increased, the adhesion between the adhesive material 500 and the light emitting device layer 400 is increased, and the stability between the two film layers is improved.
In this embodiment, a plurality of second protrusions 303 and/or a plurality of second concave surfaces 304 are disposed on a second surface of the pixel defining layer 300, which is in contact with the adhesive material 500. The adhesive material 500 is nested with the pixel definition layer 300 by a plurality of the second protrusions 303 and/or a plurality of the second concavities 304 on the second surface. The second surface is any surface of the pixel defining layer 300, and specifically, referring to fig. 3, the contact area between the adhesive material 500 and the pixel defining layer 300 is increased, the adhesion between the adhesive material 500 and the pixel defining layer 300 is increased, and the stability between the two film layers is improved.
In this embodiment, the cross-sectional area of the second opening 302 in the first cross-section is gradually increased in a direction away from the array substrate 200. The first section is parallel to the array substrate 200. By increasing the cross-sectional area of the second opening 302 adjacent to the light emitting device layer 400 in the first cross-section, the area of the adhesive material 500 contacting the light emitting device layer 400 is increased, and the array substrate 200 and the light emitting device layer 400 can be better bonded.
In the present embodiment, the second opening 302 is disposed in the non-display region of the pixel defining layer 300, please refer to fig. 2 specifically. The second opening 302 does not occupy the aperture ratio of the display panel 100 in the non-display area of the display panel 100, while the non-display area is distributed around the display area, and the second opening 302 and the adhesive material 500 are also distributed around the display area, so that when the display panel 100 is curled, the stress can be better dispersed, the adhesion can be enhanced, and the reliability between the film layers of the display panel 100 can be improved.
In this embodiment, the second opening 302 is disposed between any two adjacent black matrixes 310 in the non-display area, please refer to fig. 2 specifically. The black matrixes 310 are used for shielding non-display devices such as signal lines, and the second opening 302 is arranged between any two adjacent black matrixes 310, so that a non-display device area, the array substrate 200 and the light-emitting device layer 400 can be bonded tightly, and the display panel 100 is prevented from being separated when being curled.
In this embodiment, the second opening 302 is disposed between any two adjacent spacers 320 in the non-display area, please refer to fig. 2 specifically. The spacers 320 are used for relieving stress when the display panel 100 is squeezed, and the second openings 302 are arranged between any two adjacent spacers 320 and are matched with each other, so that a non-display device area, the array substrate 200 and the light-emitting device layer 400 can be bonded tightly, and separation is avoided when the display panel 100 is curled.
In this embodiment, the black matrix 310 is located between any two of the first openings 301, and particularly referring to fig. 2, a light shielding effect can be better achieved, so as to prevent color mixing in a light emitting region.
In this embodiment, the opening shape of the second opening 302 in the pixel region may be a closed figure, including a circle, a rectangle, and a triangle, which is not limited herein. Wherein, because of the circular characteristic, the closed figure of the same girth, the circular area is the biggest, when the opening shape is circular, please refer to fig. 2 specifically, the bonding effect is the best.
S30, filling the second opening 302 with the viscous material 500.
In this embodiment, the adhesive material 500 includes propylene glycol methyl ether acetate, polyisobutylene, butyl rubber, microcrystalline wax, and chloroform. The propylene glycol methyl ether acetate is a solvent, and may be used to dissolve other substances in the viscous material 500. The addition of the chloroform may better improve the adhesion between the adhesive material 500 and the light emitting device layer 400, and particularly, may enhance the adhesion between the adhesive material 500 and the hole injection layer in the light emitting device layer 400.
In this embodiment, in the preparation process of the viscous material 500, the added contents are as follows: 54% propylene glycol methyl ether acetate, 23% polyisobutylene, 18% butyl rubber, 3% microcrystalline wax, and 2% chloroform. After filling the second opening 302 with the above-mentioned components in the above-mentioned ratio, the solvent of the adhesive material 500, i.e., the propylene glycol methyl ether acetate, may be precipitated by drying under reduced pressure, and the final remaining propylene glycol methyl ether acetate may account for less than 10% by mass of the original components. This not only reduces the energy consumption and difficulty of the drying process, but also properly increases the flexibility of the adhesive material 500, thereby better improving the stress when the display panel 100 is twisted.
In this embodiment, when the temperature is increased, the bonding capability of the adhesive material 500 is enhanced, that is, when the display panel 100 operates, the temperature of the display panel 100 is increased, so that, in the normal operating range of the display panel 100, as the working strength of the display panel 100 is increased, the higher the temperature is, the stronger the bonding capability of the adhesive material 500 is, the better the bonding effect is, and the firmer the inter-film layers in the display panel 100 are, and the separation is not easy.
S40, filling the first opening 301 with a light emitting material.
In this embodiment, step S40 includes:
s41, a conductive layer of the light emitting device layer 400 is formed on the pixel electrode layer.
In this embodiment, the conductive layer includes a hole injection layer and a hole transport layer.
S42, filling the first opening 301 with a light emitting material.
The luminescent material is organic molecules or organic polymers.
S50, forming a light emitting device layer 400 on the pixel defining layer 300.
In this embodiment, step S50 includes:
s51, forming an emission layer of the light emitting device layer 400 on the pixel defining layer 300.
In this embodiment, the emission layer includes an electron transport layer and an electron injection layer.
In this embodiment, the light emitting material layer 420 of the light emitting device layer 400 includes the conductive layer, the light emitting material, and the emission layer.
S52, forming a cathode layer 430 layer on the pixel defining layer 300, as shown in fig. 1.
S60, wherein the adhesive material 500 is used to bond the light emitting device layer 400 and the array substrate 200.
This embodiment is through filling viscous material between array substrate and light emitting device layer, utilizes this viscous material to bond array substrate and light emitting device layer, avoids display panel at the curling in-process because the adhesion between array substrate and the light emitting device layer is not enough, leads to the rete separation, avoids causing display panel to show unusual technical problem.
EXAMPLE five
This embodiment is the same as or similar to embodiment four, except that:
the adhesive material 500 includes propylene glycol methyl ether acetate, polyisobutylene, butyl rubber, microcrystalline wax, chloroform, and black dye.
In this embodiment, in step S198, a plurality of second openings 302 and a plurality of sixth openings are formed on the pixel defining layer 300. S199, forming a black matrix 310 in the second opening 302 and forming a spacer 320 in the sixth opening, please refer to fig. 5.
In this embodiment, the second opening 302 and the adhesive material 500 are used as the black matrix 310 of the non-display area, please refer to fig. 5 specifically. Through the addition of the black dye, the black matrix 310 in the non-display area is replaced by the adhesive material 500 added with the black dye, so that the manufacturing process of the black matrix 310 is reduced, and the adhesive material 500 can not only play a role in shading the original black matrix 310, but also play a role in bonding the array substrate 200 and the light-emitting device layer 400.
In this embodiment, in the preparation process of the viscous material 500, the added contents are, by mass: 34% of propylene glycol methyl ether acetate, 23% of polyisobutylene, 18% of butyl rubber, 3% of microcrystalline wax, 2% of trichloromethane and 20% of black dye. After filling the second opening 302 with the above-mentioned components in the above-mentioned ratio, the solvent of the adhesive material 500, i.e., the propylene glycol methyl ether acetate, may be precipitated by drying under reduced pressure, and the final remaining propylene glycol methyl ether acetate may account for less than 10% by mass of the original components. This not only reduces the energy consumption and difficulty of the drying process, but also properly increases the flexibility of the adhesive material 500, thereby better improving the stress when the display panel 100 is twisted.
In this embodiment, the 20% black dye may include 10% carbon black, 5% dispersant, 2% cross-linked polymer, and 3% cross-linked monomer. The proportion can ensure that the color of the viscous material 500 is blackened to achieve the shading effect of the original black matrix 310, and the bonding capacity of the viscous material 500 is not greatly changed.
In this embodiment, the dispersant may include methylpentanol. The crosslinked polymer may include dicumyl peroxide. The crosslinking monomer may include hydroxyethyl methacrylate.
This embodiment is through add black dye in the viscous material, make the viscous material replaces former black matrix, has reduced the process of black matrix, and viscous material both can play the shading effect of former black matrix, can play the effect of bonding array substrate and light emitting device layer again, has avoided display panel to curl the in-process because the adhesion between array substrate and the light emitting device layer is not enough, leads to the rete to separate, causes display panel to show unusual technical problem.
EXAMPLE six
This embodiment is the same as or similar to embodiment four or five, except that:
referring to fig. 6 and 7, after step S51, the method further includes:
s511, forming a third opening 401 on the light emitting material layer 420, wherein the third opening 401 penetrates through the light emitting material layer 420 and extends to the second opening 302.
The light emitting material layer 420 of the light emitting device layer 400 includes a third opening 401 corresponding to the second opening 302, and the third opening 401 penetrates the light emitting material layer 420 and extends to the second opening 302.
In this embodiment, the second opening 302 is filled with a viscous material 500, and the viscous material 500 is connected to the cathode layer 430 of the light emitting device layer 400, as shown in fig. 6. The adhesive material 500 has strong adhesion to the cathode layer 430 of the light emitting device layer 400, so that the pixel defining layer 300 and the cathode layer 430 can be well bonded, and the film layers are not easily separated when the display panel 100 is curled.
In this embodiment, after step S511, the method further includes:
s512, filling the adhesive material 500 in the third opening 401, where the adhesive material 500 is connected to the cathode layer 430 of the light emitting device layer 400, specifically refer to fig. 7.
In this embodiment, the adhesive material 500 has a strong adhesion with the cathode layer 430 of the light emitting device layer 400, so that the pixel defining layer 300 can be well bonded with the cathode layer 430, the adhesive material 500 has a certain elasticity, and the adhesive material 500 in the second opening 302 and the third opening 401, referring to fig. 7 specifically, can bond each film layer of the light emitting device layer 400, and can also serve as a limiting device of the light emitting device layer 400, so as to prevent the film layers from being separated when the display panel 100 is curled, and avoid the dislocation movement between the film layers.
In this embodiment, step S30 is eliminated, and the second opening 302 and the third opening 401 are not filled with the adhesive material 500. The pixel defining layer 300 is connected to the cathode layer 430 of the light emitting device layer 400, and the adhesion between the pixel defining layer 300 and the cathode layer 430 of the light emitting device layer 400 is sufficient to relieve stress between the film layers when the display panel 100 is rolled.
This embodiment is through the patterning light emitting device layer, with adhesive material and cathode layer direct connection, utilize the strong adhesion between adhesive material and the cathode layer, when display panel is curling, avoid separating between the rete, improve user experience.
In the fourth to sixth embodiments, the viscous material is filled between the array substrate and the light emitting device layer, and the array substrate and the light emitting device layer are bonded by using the viscous material, so that the technical problem that the display of the display panel is abnormal due to the separation of the film layers caused by insufficient adhesion between the array substrate and the light emitting device layer in the curling process of the display panel is solved.
The application discloses a display panel and a manufacturing method thereof. The display panel includes: an array substrate; a pixel defining layer and a light emitting device layer on the array substrate; the pixel defining layer comprises a plurality of first openings and a plurality of second openings, wherein luminescent materials are arranged in the first openings, viscous materials are filled in the second openings, and the viscous materials are used for bonding the luminescent device layer and the array substrate. This application is through filling viscous material between array substrate and luminescent device layer, utilizes this viscous material to bond array substrate and luminescent device layer, and when display panel was curling the process, it was not enough to avoid because the adhesion between array substrate and the luminescent device layer, leads to the rete to separate and causes display panel to show unusual technical problem.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The above embodiments of the present application are described in detail, and specific examples are applied in the present application to explain the principles and implementations of the present application, and the description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (10)
1. A display panel, comprising:
an array substrate;
a pixel defining layer and a light emitting device layer on the array substrate;
the pixel defining layer comprises a plurality of first openings and a plurality of second openings, wherein the first openings are filled with light-emitting materials, the second openings are filled with viscous materials, and the viscous materials are used for bonding the light-emitting device layer and the array substrate.
2. The display panel according to claim 1, wherein the display panel comprises a planarization layer between the pixel defining layer and the array substrate;
the second opening penetrates through the pixel defining layer and extends to the flat layer.
3. The display panel according to claim 1, wherein a first surface of the adhesive material which is in contact with the light-emitting device layer is provided with a plurality of first protrusions and/or a plurality of first concave surfaces;
the adhesive material is disposed in nesting relation with the light emitting device layer by a plurality of the first protrusions and/or a plurality of the first concave surfaces on the first surface.
4. The display panel according to claim 1 or 3, wherein a second surface of the pixel defining layer in contact with the adhesive material is provided with a plurality of second protrusions and/or a plurality of second concavities;
the adhesive material is nested with the pixel definition layer by a plurality of the second protrusions and/or a plurality of the second concavities on the second surface.
5. The display panel of claim 1, wherein the adhesive material comprises propylene glycol methyl ether acetate, polyisobutylene, butyl rubber, microcrystalline wax, and chloroform.
6. The display panel according to claim 1, wherein the light-emitting device layer includes a third opening corresponding to the second opening, the third opening extending through and to the second opening, and wherein the adhesive material is connected to a cathode layer in the light-emitting device layer.
7. The display panel according to claim 1, wherein the second opening is disposed in a non-display region of the pixel defining layer.
8. The display panel according to claim 7, wherein the second opening is provided between any two adjacent black matrices in the non-display region.
9. The display panel according to claim 7, wherein the organic material comprises propylene glycol methyl ether acetate, polyisobutylene, butyl rubber, microcrystalline wax, chloroform, and black dye;
the second via hole and the organic material are used as a black matrix of the non-display area.
10. A method for manufacturing a display panel is characterized by comprising the following steps:
forming a pixel defining layer on the array substrate;
forming a plurality of first openings and a plurality of second openings on the pixel defining layer;
filling a viscous material in the second opening;
filling a luminescent material in the first opening;
forming a light emitting device layer on the pixel defining layer;
wherein the adhesive material is used for bonding the light emitting device layer and the array substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010221290.8A CN111403449B (en) | 2020-03-26 | Display panel and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010221290.8A CN111403449B (en) | 2020-03-26 | Display panel and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111403449A true CN111403449A (en) | 2020-07-10 |
| CN111403449B CN111403449B (en) | 2024-04-23 |
Family
ID=
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111509015A (en) * | 2020-04-27 | 2020-08-07 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN112531000A (en) * | 2020-12-02 | 2021-03-19 | 山东傲晟智能科技有限公司 | OLED display panel and manufacturing method thereof |
| CN113487965A (en) * | 2021-06-22 | 2021-10-08 | 武汉华星光电半导体显示技术有限公司 | Support member, manufacturing method thereof and display module |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030227019A1 (en) * | 2002-06-07 | 2003-12-11 | Lg Electronics Inc. | AMEL display panel and method for fabricating the same |
| KR100714011B1 (en) * | 2005-11-30 | 2007-05-04 | 삼성에스디아이 주식회사 | Flat panel display and method for making flat panel display using the same |
| CN103887261A (en) * | 2014-03-03 | 2014-06-25 | 京东方科技集团股份有限公司 | Flexible displayer and manufacturing method thereof |
| CN206076240U (en) * | 2016-10-14 | 2017-04-05 | 上海天马微电子有限公司 | Display floater and display device |
| CN109411622A (en) * | 2018-09-29 | 2019-03-01 | 云谷（固安）科技有限公司 | Flexible display panels and flexible display apparatus |
| CN109461757A (en) * | 2018-08-31 | 2019-03-12 | 云谷（固安）科技有限公司 | Display panel and preparation method thereof, display device |
| CN110112195A (en) * | 2019-04-30 | 2019-08-09 | 武汉华星光电半导体显示技术有限公司 | Display panel |
| CN110416440A (en) * | 2019-08-06 | 2019-11-05 | 京东方科技集团股份有限公司 | A kind of preparation method of display panel, display panel and display device |
| CN110581229A (en) * | 2019-09-11 | 2019-12-17 | 云谷（固安）科技有限公司 | display panel, display device and preparation method of display panel |
| CN110739343A (en) * | 2019-11-29 | 2020-01-31 | 合肥维信诺科技有限公司 | Display panel, preparation method thereof and display device |
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030227019A1 (en) * | 2002-06-07 | 2003-12-11 | Lg Electronics Inc. | AMEL display panel and method for fabricating the same |
| KR100714011B1 (en) * | 2005-11-30 | 2007-05-04 | 삼성에스디아이 주식회사 | Flat panel display and method for making flat panel display using the same |
| CN103887261A (en) * | 2014-03-03 | 2014-06-25 | 京东方科技集团股份有限公司 | Flexible displayer and manufacturing method thereof |
| CN206076240U (en) * | 2016-10-14 | 2017-04-05 | 上海天马微电子有限公司 | Display floater and display device |
| CN109461757A (en) * | 2018-08-31 | 2019-03-12 | 云谷（固安）科技有限公司 | Display panel and preparation method thereof, display device |
| CN109411622A (en) * | 2018-09-29 | 2019-03-01 | 云谷（固安）科技有限公司 | Flexible display panels and flexible display apparatus |
| CN110112195A (en) * | 2019-04-30 | 2019-08-09 | 武汉华星光电半导体显示技术有限公司 | Display panel |
| CN110416440A (en) * | 2019-08-06 | 2019-11-05 | 京东方科技集团股份有限公司 | A kind of preparation method of display panel, display panel and display device |
| CN110581229A (en) * | 2019-09-11 | 2019-12-17 | 云谷（固安）科技有限公司 | display panel, display device and preparation method of display panel |
| CN110739343A (en) * | 2019-11-29 | 2020-01-31 | 合肥维信诺科技有限公司 | Display panel, preparation method thereof and display device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111509015A (en) * | 2020-04-27 | 2020-08-07 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| WO2021217820A1 (en) * | 2020-04-27 | 2021-11-04 | 武汉华星光电半导体显示技术有限公司 | Display panel and display apparatus |
| US11832481B2 (en) | 2020-04-27 | 2023-11-28 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display panel and display device including adhesive through hole connecting cathode and pixel defining block |
| CN112531000A (en) * | 2020-12-02 | 2021-03-19 | 山东傲晟智能科技有限公司 | OLED display panel and manufacturing method thereof |
| CN113487965A (en) * | 2021-06-22 | 2021-10-08 | 武汉华星光电半导体显示技术有限公司 | Support member, manufacturing method thereof and display module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108172604B (en) | OLED packaging structure, packaging method and display device | |
| CN109904341B (en) | O L ED display panel and preparation method thereof | |
| KR101546552B1 (en) | Organic el device and manufacturing method thereof | |
| US11024687B2 (en) | Array substrate with a pixel defining layer with groove between sub-pixel areas | |
| KR20190029343A (en) | Display device using semiconductor light emitting device | |
| US7656477B2 (en) | Reflective display device and method for fabricating the same | |
| JP2008509528A (en) | Tapered mask for deposition of materials for organic electronic devices | |
| US20070237488A1 (en) | Conductive transparent material, manufacturing method thereof and display device comprising the same | |
| CN107644894B (en) | Organic electroluminescent device, preparation method thereof and display device | |
| CN108899346B (en) | Display panel and display device | |
| US20070236425A1 (en) | Organic light emitting display device | |
| KR20150104462A (en) | Display device using semiconductor light emitting device | |
| CN111403449A (en) | Display panel and manufacturing method thereof | |
| KR102110871B1 (en) | Display device using semiconductor light emitting device | |
| WO2020224134A1 (en) | Passive electro-organic light-emitting diode substrate, manufacturing method, and peeling plate | |
| EP3916792A1 (en) | Organic light-emitting display panel and manufacturing method thereof | |
| CN111403449B (en) | Display panel and manufacturing method thereof | |
| WO2024060773A1 (en) | Display panel and display device | |
| CN111725425A (en) | Display panel and manufacturing method thereof | |
| CN111769140B (en) | Display panel and display module | |
| KR20200016127A (en) | Display device using semiconductor light emitting device | |
| CN112993182A (en) | Display panel and display device | |
| CN111725276A (en) | Light emitting device, display device and manufacturing method of light emitting device | |
| CN111403625B (en) | OLED display panel | |
| CN111584737A (en) | Display panel and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant |