JP2008509528A - Tapered mask for deposition of materials for organic electronic devices - Google Patents

Abstract

  The electronic device includes a substrate, a structure having an opening, and a first electrode overlying the structure and in the opening. From the cross-sectional view, the structure in the opening has a negative slope. From a plan view, each opening has a perimeter that may or may not substantially correspond to the perimeter of the organic electronic component. The portions of the first electrode that are on the structure and in the opening are connected to each other. In a process for forming an electronic device, an organic active layer can be deposited in the opening, and the organic active layer has a liquid composition.

Description

  The present invention relates generally to electronic devices and methods for forming electronic devices. More particularly, the present invention relates to electronic devices that include organic electronic components.

(Statement about federal government support research)
This invention was made with DARPA grant number 4332 with government support. The government may have certain rights in the invention.

  Increasingly, active organic molecules are used in electronic devices. These active organic molecules have electronic or electron emission properties including electroluminescence. Electronic devices that incorporate organic active materials can be used to convert electrical energy into radiation and can include light emitting diodes, light emitting diode displays, or diode lasers. Electronic devices that incorporate organic active layers also generate signals in response to radiation (eg, photodetectors (eg, photoconductive cells, photoresistors, photoswitches, phototransistors, phototubes), infrared (“IR ") Detectors, biosensors), convert radiation into electrical energy (eg photovoltaic devices or solar cells), and perform logic functions (eg transistors or diodes).

US Pat. No. 4,356,429 US Pat. No. 4,539,507 US Pat. No. 5,247,190 US Pat. No. 5,408,109 US Pat. No. 5,317,169

  However, the manufacture of electronic components including organic active layers is difficult. The inconsistent formation of the organic active layer typically results in poor device performance and poor yield in the device manufacturing process. In the case of liquid deposition of the organic active layer, poor wetting of the electrodes can result in voids in the organic active layer.

  FIG. 1 shows a plan view of the prior art structure 102, and FIG. 2 shows a cross-sectional view of the prior art structure 102. The structure 102 has a perimeter with a positive slope when viewed from the cross-sectional view of FIG. As the liquid composition 106 is deposited in the well formed by the surrounding structure 102, it may form voids. Such voids reduce the available surface area for radiation emission or radiation absorption, resulting in reduced performance. A void, such as void 108, may also expose the underlying structure 104, such as an electrode. As additional layers are formed over the organic layers resulting from curing the liquid composition, these layers may contact the underlying structure 104, allowing an electrical short between the electrodes. And disable the affected organic electronic components.

  Furthermore, if the structure 102 is hydrophobic (ie, has a high wetting angle), poor wetting of the liquid composition 106 may occur in the well near the structure 102 and the organic layer becomes thin. May bring about. The organic layer can be thick enough to prevent electrical shorts between the electrodes, but a thin organic layer at the pixel edge can result in a low rectification ratio and low brightness efficiency.

  In one exemplary embodiment, an electronic device includes a substrate, a structure having an opening, and a first electrode overlying the structure and in the opening. From the cross-sectional view, the structure in the opening has a negative slope. From a plan view, each opening has a perimeter that substantially corresponds to the perimeter of the organic electronic component. The portions of the first electrode that are on the structure and in the opening are connected to each other.

  In a further embodiment, an electronic device includes a substrate, a first structure overlying the substrate, and a second structure overlying the substrate. From the cross-sectional view, the first structure has a negative slope, and from the plan view, the first structure has a first pattern. From the cross-sectional view, the second structure has a negative slope, and from the plan view, the second structure has a second pattern different from the first pattern. The first structure has a portion that contacts the second structure.

  In another exemplary embodiment, a method for forming an electronic device includes forming a structure having a negative slope and an opening. From a plan view, each opening has a perimeter that substantially corresponds to the perimeter of the organic electronic component. The method also includes depositing an organic active layer in the opening. The organic active layer has a liquid composition. The method further includes forming a first electrode overlying the structure and the organic active layer and within the opening. The portions of the first electrode that are on the structure and in the opening are connected to each other. The foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as defined in the appended claims.

  The invention is illustrated by way of example and not limitation in the accompanying figures.

  In one embodiment, an electronic device includes a substrate, a structure having an opening, and a first electrode overlying the structure and in the opening. From the cross-sectional view, the structure in the opening has a negative slope. From a plan view, each opening has a perimeter that substantially corresponds to the perimeter of the organic electronic component. The portions of the first electrode that are on the structure and in the opening are connected to each other.

  In one exemplary embodiment, the surface of the structure is hydrophobic. In a further exemplary embodiment, the second electrode is between the substrate and the structure. In additional embodiments, the second electrode has a surface that is hydrophilic. In another exemplary embodiment, the substrate includes a driver circuit coupled to the organic electronic component.

  In a further embodiment, an electronic device includes a substrate, a first structure overlying the substrate, and a second structure overlying the substrate. From the cross-sectional view, the first structure has a negative slope, and from the plan view, the first structure has a first pattern. From the cross-sectional view, the second structure has a negative slope, and from the plan view, the second structure has a second pattern different from the first pattern. The first structure has a portion that contacts the second structure.

  In one exemplary embodiment, the first structure includes openings, and from a plan view, each opening has a perimeter that substantially corresponds to the perimeter of the organic electronic component. In another exemplary embodiment, the electronic device includes an electrode overlying at least a portion of the first structure and the second structure. In a further exemplary embodiment, the electrodes are in the openings and are continuous between the openings. In additional embodiments, the second structure has a thickness that is at least 1.5 times greater than the thickness of the first structure. In another exemplary embodiment, the first structure has a thickness of about 3 micrometers or less. In a further exemplary embodiment, the second structure has a thickness of at least about 3 micrometers. In additional exemplary embodiments, the electronic device includes an electrode between the substrate and the first structure. In another exemplary embodiment, the electrode has a surface that is hydrophilic. In a further exemplary embodiment, the electronic device includes a passive matrix display. In additional exemplary embodiments, the first structure and the second structure have surfaces that are hydrophobic.

  In another exemplary embodiment, a method for forming an electronic device includes forming a structure having a negative slope and an opening. From a plan view, each opening has a perimeter that substantially corresponds to the perimeter of the organic electronic component. The method also includes depositing an organic active layer in the opening. The organic active layer has a liquid composition. The method further includes forming a first electrode overlying the structure and the organic active layer and within the opening. The portions of the first electrode that are on the structure and in the opening are connected to each other.

  In one exemplary embodiment, the method includes forming a second electrode before forming the structure, and after forming the structure, a portion of the second electrode is exposed along the bottom of the opening. Is done. In another exemplary embodiment, the liquid composition contacts the second electrode with a wetting angle of less than 90 degrees. In a further exemplary embodiment, the liquid composition contacts the structure with a wetting angle of at least 45 degrees.

  For each of the exemplary embodiments disclosed above, the organic electronic component can include an organic active layer.

  Other features and advantages of the invention will be apparent from the following detailed description, and from the claims. The detailed description first deals with the definition, then the structure, the layers and components of the electronic device, the process for forming the electronic device, and other embodiments.

(1. Definition and clarification of terms)
Before addressing details of embodiments described below, some terms are defined or clarified. As used herein, the term “active” when referring to a layer or material is intended to mean a layer or material that has electronic or emissive properties. The active layer material can emit radiation or exhibit a change in electron-hole pair concentration upon receipt of radiation.

  The term “active matrix” is intended to mean an array of electronic components and corresponding driver circuitry within the array.

  The term “circuit” is intended to mean a collection of electronic components that collectively function when properly connected and supplied with an appropriate potential. Circuits can include active matrix pixels in a display array, column or row decoders, column or row array strobes, sense amplifiers, signal or data drivers, and the like.

  The term “connected” with respect to an electronic component, circuit, or portion thereof refers to two or more electronic components, circuits, or any combination of at least one electronic component and at least one circuit, It is intended to mean having no intervening electronic components in between. Parasitic resistance, parasitic capacitance, or both are not considered electronic components for the purposes of this definition. In one embodiment, the electronic components are connected when they are electrically shorted together and at substantially the same voltage. Note that the electronic components can be connected together using fiber optic lines to allow optical signals to be transmitted between such electronic components.

  The term “coupled” refers to two or more electronic components, circuits, systems, such that a signal (eg, current, voltage, or optical signal) can be transmitted from one to another. Or intended to mean any connection, coupling, or association of (1) at least one electronic component, (2) at least one circuit, or (3) any combination of at least one system. Is done. Non-limiting examples of “coupled” may include direct connections between electronic components, circuits or electronic components with switches (eg, transistors) connected therebetween, and the like.

  The term “driver circuit” is intended to mean a circuit configured to control the activation of an electronic component, such as an organic electronic component.

  The term “electrically continuous” is intended to mean a layer, member, or structure that forms a conductive path without an electrical open circuit.

  The term “electrode” is intended to mean a structure configured to transport a carrier. For example, the electrode can be an anode, a cathode. Electrodes can include transistors, capacitors, resistors, inductors, diodes, organic electronic components, and power supply portions.

  The term “electronic component” is intended to mean the lowest level unit of a circuit that performs an electrical function. Electronic components can include transistors, diodes, resistors, capacitors, inductors, and the like. An electronic component is a capacitive coupling between two conductors connected to different electronic components where parasitic resistance (eg, wire resistance) or parasitic capacitance (eg, a capacitor between conductors is not intended or accidental) ) Is not included.

  The term “electronic device” is intended to mean a collection of circuits, electronic components, or combinations thereof that collectively function when properly connected and supplied with an appropriate potential. The electronic device can include or be part of a system. Examples of electronic devices include displays, sensor arrays, computer systems, avionics, automobiles, cell phones, and many other consumer and industrial electronic products.

  The term “hydrophilic” is intended to mean that the edge of the liquid exhibits a wetting angle of less than 90 degrees with respect to the contacting surface.

  The term “hydrophobic” is intended to mean that the edge of the liquid exhibits a wetting angle of 90 degrees or more with respect to the contacting surface.

  The term “layer” is used interchangeably with the term “film” and refers to a coating covering a desired area. This area can be as large as the entire device, as small as a specific functional area such as an actual visual display, or as small as one subpixel. The film can be formed by any conventional deposition technique including vapor deposition and liquid deposition. Typical liquid deposition techniques include continuous deposition techniques such as spin coating, gravure coating, curtain coating, dip coating, slot die coating, spray coating, and continuous nozzle coating, as well as inkjet printing, gravure printing, and screen printing. Examples include, but are not limited to, discontinuous deposition techniques.

  The term “liquid composition” may be dissolved in one or more liquid media to form a solution, dispersed in one or more liquid media to form a dispersion, or one or more It is intended to mean an organic active material that is suspended in a liquid medium to form a suspension or emulsion.

  The term “negative tilt” is intended to mean a feature of a structure in which the side of the structure forms an acute angle with respect to a substantially planar surface on which the structure is formed.

  The term “opening” is intended to mean a region characterized by the absence of a particular structure surrounding the region when viewed in plan view.

  The term “organic electronic device” is intended to mean a device comprising one or more semiconductor layers or materials. Organic electronic devices include (1) devices that convert electrical energy into radiation (eg, light emitting diodes, light emitting diode displays, or diode lasers), and (2) devices that detect signals through electronic processes (eg, photodetectors ( (E.g., photoconductive cells, photoresistors, photoswitches, phototransistors, or phototubes), IR detectors, or biosensors), (3) devices that convert radiation into electrical energy (e.g., photovoltaic devices or solar cells). And (4) devices (eg, transistors or diodes) that include one or more electronic components that include one or more organic semiconductor layers.

  The term “on” when used to refer to a layer, member, or structure in a device does not necessarily mean that one layer, member, or structure is immediately adjacent to another layer, member, or structure. It does not mean adjacent or in contact with another layer, member, or structure.

  The term “passive matrix” is intended to mean an array of electronic components that does not have any driver circuitry.

  The term “perimeter” is intended to mean a layer, member, or structure boundary that forms a closed planar shape from a plan view.

  The term “structure” means one or more patterned layers or members, alone or in combination with other patterned layers or members, to form a unit that serves the intended purpose. Is intended. Examples of the structure include an electrode, a well structure, a cathode separator, and the like.

  The term “substrate” can be rigid or flexible and can include, but is not limited to, glass, polymer, metal, or ceramic materials, or combinations thereof. It is intended to mean a base material that can include one or more layers of material.

  The term “wetting angle” is intended to mean the tangential angle at the edge interface between a gas, liquid, and solid surface, measured from the solid surface through the liquid to the gas / liquid interface.

  As used herein, “comprises”, “comprising”, “includes”, “including”, “has”, “having” The terms, or any other variation thereof, are intended to cover non-exclusive inclusions. For example, a process, method, article, or device that includes a list of elements is not necessarily limited to only those elements, but is not explicitly described or unique to such process, method, article, or apparatus. Other elements may be included. Further, unless expressly stated otherwise, “or” refers to an inclusive “or” and not an exclusive “or”. For example, condition A or B is satisfied by any one of the following: A is true (or present) and B is false (or absent), A is false (or absent) and B is true (or present), and A and Both B are true (or exist).

  Also, the use of “a” or “an” is used to describe elements and components of the invention. This is done merely for convenience and to give a general sense of the invention. This description should be read to include one or at least one and the singular also includes the plural unless it is obvious that it is meant otherwise.

  Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Although methods and materials similar or equivalent to those described herein can be used in the practice or testing of the present invention, suitable methods and materials are described below. All publications, patent applications, patents, and other references cited herein are incorporated by reference in their entirety. In case of conflict, the present specification, including definitions, will control. In addition, the materials, methods, and examples are illustrative only and not intended to be limiting.

(2. Structure, layers and components of electronic devices)
In certain embodiments, an electronic device includes an array of organic electronic components and a structure having openings corresponding to the periphery of each of the organic electronic components when viewed in plan view. The structure has a negative slope at the opening when viewed from a cross-sectional view. Each organic electronic component can include first and second electrodes (eg, an anode and a cathode) separated by one or more layers including an organic active layer. In one embodiment, the exemplary electronic device can also include a second structure having a negative slope, such as an electrode separator (eg, a cathode separator).

  In one exemplary embodiment, the array of organic electronic components can be part of a passive matrix. In another exemplary embodiment, the array of organic electronic components can be part of an active matrix. Thus, exemplary embodiments of electronic devices can include active matrix displays and passive matrix displays.

  In general, each organic electronic component includes two electrodes separated by one or more organic active layers. In addition, other layers such as a hole transport layer and an electron transport layer can be included between the two electrodes. The structure having an opening corresponding to the periphery of each of the organic electronic components defines a well in which a portion of the organic electronic component is formed. Therefore, these structures can sometimes be described here as well structures.

  The cross section of the well structure may affect the organic layer formation. FIG. 3 shows a cross-sectional view of an exemplary structure 302. The structure 302 has a negatively sloped wall or perimeter 304 and forms an acute angle with the underlying structure 308. FIG. 4 shows a portion of the periphery of an exemplary structure 402 that forms an acute angle α (alpha) between the underlying structural surface 406 and the structural wall 404. In one exemplary embodiment, the angle α (alpha) is 0 ° to 90 °, such as 0 ° to 60 °, or 10 ° to 45 °. In an alternative embodiment, the angle α (alpha) can be approximately equal to or greater than the capillary angle.

  As shown in FIG. 5, the finger 310 can be seen as the liquid composition 306 is deposited within the perimeter of the opening formed by the structure 302. As the opening in structure 302 fills, the liquid composition forms a void-free layer. 6 shows a plan view of the filled opening, and FIG. 7 shows a cross-sectional view at section line 7-7 in FIG. As the liquid composition 306 is deposited along the perimeter 304, it covers the underlying structure 308. In one exemplary embodiment, the liquid forms a layer that is substantially more uniform compared to a structure and liquid composition similar to those shown in FIGS.

  With respect to the structure of FIG. 4, FIG. 8 shows a layer 808 formed overlying surface 406. A liquid composition can be deposited and the solvent extracted to form layer 808. As shown, layer 808 contacts structural wall 404 and covers surface 406. Electronic devices that include such layers are less likely to short circuit. In addition, more uniform layers reduce the potential for poor device performance characteristics (eg, low rectification ratio, low brightness efficiency, etc.) found in devices where organic layers are observed to be thin near the well structure To do.

  In one embodiment, an electronic device includes a substrate, a first structure having a negative slope, and a second structure having a negative slope when viewed from a cross-sectional view. The first structure is on the substrate and has a first pattern from a plan view. The second structure is on the substrate and has a second pattern different from the first pattern from the plan view. In one embodiment, the first structure is a well structure, which is an array of openings in which organic electronic components can be formed. The second structure can be, for example, an electrode separator structure.

  In another embodiment, from a plan view, each opening in the first structure has a perimeter that substantially corresponds to the perimeter of the organic electronic component.

  In one example, the second structure can have a thickness of about 3 to 10 micrometers. The first structure can have a thickness of less than 3 micrometers, such as about 1 to 3 micrometers, or less than 1 micrometer, such as about 0.4 micrometers. The second structure can, for example, have a thickness that is at least 1.5 times greater than the thickness of the first structure.

  In another embodiment, an electronic device includes a substrate, a structure (eg, a well structure), and a first electrode. The structure has an opening and has a negative slope in the opening when viewed from a cross-sectional view. From a plan view, each of the openings has a perimeter that substantially corresponds to the perimeter of the organic electronic component. The first electrode is on the structure and in the opening. The portions of the first electrode that are on the structure and within the opening are connected to each other. In certain examples, the organic electronic component can include one or more organic active layers. In one embodiment, the first electrode can be a common electrode (eg, a common cathode or a common anode for an array of organic electronic components). In another exemplary embodiment, the second electrode can be between the substrate and the structure. In a further exemplary embodiment, the organic electronic component can be coupled to a driver circuit (not shown) that is in the substrate. It should be noted that in one embodiment, the second electrode can be formed before the first electrode.

  In one exemplary embodiment, the one or more structures having a negative slope have a substantially hydrophobic surface. The surface exhibits a wetting angle with the liquid composition of greater than 45 °, such as 90 ° or more. In contrast, an underlying structure, such as an electrode, can have a substantially hydrophilic surface, and a liquid composition of less than 90 °, such as less than 60 °, or from about 0 ° to about 45 °. Indicates the wetting angle.

(3. Process for forming an electronic device)
An exemplary process for forming an electronic device includes forming one or more structures on a substrate and having a negative slope from a cross-sectional perspective view. One exemplary process that can be used for a passive matrix display is shown in FIGS. Variations on this process can be used to form other electronic devices.

  FIG. 9 shows a plan view of a portion of an exemplary process sequence, and FIG. 10 shows a cross-sectional view of the portion viewed from section line 10-10 of FIG. An electrode 904 is deposited on the substrate 902. The substrate 902 can be a flexible substrate comprising a glass or ceramic material, or at least one polymer film. In one exemplary embodiment, the substrate 902 is transparent. Optionally, the substrate 902 can include a barrier layer, such as a uniform barrier layer or a patterned barrier layer.

  Electrode 904 can be an anode or a cathode. FIG. 9 shows the electrodes 904 as parallel strips. Alternatively, the electrode 904 can be a patterned array of structures having a plan view shape such as a square, rectangle, circle, triangle, ellipse or the like. In general, the electrodes can be formed using conventional processes (eg, deposition, patterning, or combinations thereof).

  The electrode 904 can include a conductive material. In one embodiment, the conductive material can include a transparent conductive material such as indium tin oxide (ITO). Examples of other transparent conductive materials include indium zinc oxide, zinc oxide, and tin oxide. Other exemplary conductive materials include zinc tin oxide (ZTO), elemental metals, metal alloys, and combinations thereof. Electrode 904 can also be coupled to a conductive lead (not shown). In one exemplary embodiment, the electrode 904 can have a hydrophilic surface.

  Subsequent layers can be deposited and patterned from a cross-sectional view into a structure with a negative slope. FIG. 11 shows a plan view of this sequence in the process, and FIG. 12 shows a cross-sectional view of this sequence. A structure 1106 having an opening 1108 and having a negative slope in the opening 1108 is formed when viewed from a cross-sectional view. The opening 1108 can expose a portion of the electrode 904. As can be seen from the plan view, the bottom of the opening 1108 can include a portion of the electrode 904 or can include a portion of the substrate 902.

  In one exemplary embodiment, structure 1106 can be formed from a resist or polymer layer. The resist can be, for example, a negative resist material or a positive resist material. Resist can be deposited on the substrate 902 and on the electrode 904. Typical liquid deposition techniques include continuous deposition techniques such as spin coating, gravure coating, curtain coating, dip coating, slot die coating, spray coating, and continuous nozzle coating, as well as inkjet printing, gravure printing, and screen printing. Examples include, but are not limited to, discontinuous deposition techniques. The resist can be patterned by selective exposure to radiation, such as ultraviolet (UV) radiation. In one embodiment, a resist is spin deposited and baked (not shown). The resist is exposed to UV radiation through a mask (not shown), developed and baked, leaving a structure with a negative slope in the opening. Negative tilt can either (1) use UV flood irradiation (not parallel) when using the mask, or (2) move the resist layer while the mask is between the resist layer and a radiation source (not shown). This can be achieved by excessive irradiation.

  In another exemplary embodiment, a sacrificial structure can be used. In one embodiment, a sacrificial layer is deposited and patterned to form a sacrificial structure having a positive slope. In a more specific embodiment, from a cross-sectional view, the sacrificial structure has a complementary profile as compared to the subsequently formed first structure 1106. The thickness of the sacrificial layer is substantially the same as the subsequently formed first structure. In one embodiment, a sacrificial layer is deposited over the first electrode 904 and the substrate 902. A patterned resist layer is formed on the sacrificial layer using conventional techniques. In one particular embodiment, sloped sidewalls are formed using conventional resist etch etch techniques. In another specific embodiment, a conventional isotropic etch is used. The patterned resist layer is then removed using a conventional resist removal process.

  Another layer used for the first structure 1106 is deposited over the sacrificial structure and within the opening of the sacrificial structure. In one embodiment, the other layer is at least as thick as the sacrificial structure. In other embodiments, the other layer is substantially thicker than the sacrificial layer. Other layer portions outside the sacrificial structure are removed using etching or polishing techniques that are conventional within inorganic semiconductor technology. After the portion is removed, a first structure is formed. Next, the sacrificial structure is removed to form an opening 1108 in the first structure 1106.

  In one embodiment, the material for the first structure and sacrificial structure allows one material of the first structure and sacrificial structure to be selectively removed compared to the other structure. Is different. Exemplary materials include metals, oxides, nitrides, and resists. The material for the sacrificial layer can be selected such that it can be selectively removed from the substrate 902 without causing significant damage to the first electrode 904. After reading this specification, one of ordinary skill in the art will be able to select materials that meet the needs or desires.

  After formation, the structure 1106 can have a pattern. The pattern can be, for example, the pattern shown in FIG. Alternative patterns are shown in FIGS. 13 and 14. FIG. 13 shows a lattice pattern. 14 includes an elliptical opening 1404 oriented across the underlying electrode, a circular opening 1406, and an elliptical opening 1408 oriented along the underlying electrode when viewed from a plan view. A pattern that can be used.

  In another embodiment, another pattern can include columns oriented substantially parallel to the length of electrode 904. Each of the columns has a negative slope and has at least a portion covering the substrate 902 at a position adjacent to and between the electrodes 904. The combination of the rows and the subsequently formed electrode separator structure can result in a rectangular opening from a plan view. The combination of structures is formed before any one or more of the liquid compositions are formed on the substrate.

  A second structure can optionally be deposited on the substrate 902 and the structure 1106. The second structure may or may not be in contact with the portion of the electrode 904 depending on the pattern of the first structure 1106. The second structure can be, for example, an electrode separator structure. 15, 16, 17, and 18 illustrate an exemplary process sequence that includes the second structure 1510. FIG. FIG. 15 shows a plan view including a second structure 1510 oriented substantially perpendicular to the electrode structure 904. FIG. 16 shows a cross-sectional view at the section line 16-16 between the length of the second structure 1510 and parallel to the length of the second structure 1510. 17 and 18 show cross-sectional views perpendicular to the second structure 1510. 17 shows a cross-sectional view through opening 1108 at section line 17-17, and FIG. 18 shows a cross-sectional view away from opening 1108 at section line 18-18.

  As shown in FIGS. 17 and 18, the cross-sectional view of the second structure 1510 has a negative slope. The second structure 1510 may or may not include a portion of the first structure 1106 at the opening. In an alternative embodiment, the second structure 1510 can be formed to be completely over the first structure 1106. In general, the second structure 1510 can be formed by techniques similar to those described with respect to the first structure 1106.

Once the first structure 1106 and optionally the second structure 1510 are formed, the electrode 904 exposed through the opening can be cleaned, such as by UV / ozone cleaning. Structures 1108 and 1510 can be treated to produce a hydrophobic surface. For example, a fluorine-containing plasma can be used to treat the surfaces of structures 1108 and 1510. The fluorine plasma can be formed using a gas such as CF ₄ , C ₂ F ₆ , NF ₃ , SF ₆ , or combinations thereof. The plasma process can include direct irradiation plasma or use downstream plasma. Further, the plasma can include O ₂ . In one exemplary embodiment, the fluorine-containing plasma, such as about 8% _{O 2,} can contain 0-20% of _{O 2.}

In one particular embodiment, a March PX500 model plasma generator by March Plasma Systems of Concord, California, Concord, is used to generate the plasma. The equipment consists of a perforated ground plate and a floating substrate plate in flow-through mode. In this embodiment, a 6 inch floating substrate plate is treated with a plasma formed from a CF ₄ / O ₂ gas composition. Gas composition may comprise 80 to 100% by volume of CF _4, such as CF ₄ to about 92 volume%, and _{O 2} for 0-20 vol%, such as about 8% by volume of _{O 2.} The substrate can be irradiated using 200-500 W plasma, such as 400 W plasma, at a pressure of 300-600 mTorr, such as 400 mTorr, for 2-5 minutes, such as about 3 minutes.

  19 and 20 show an exemplary sequence in the process of depositing the organic layer 1913. The organic layer 1913 can include one or more organic layers. In one embodiment shown in FIG. 20, the organic layer 1913 includes a charge transport layer 1914 and an organic active layer 1912. When present, a charge transport layer 1914 is formed over the first electrode 904 and before the organic active layer 1912 is formed. The charge transport layer 1914 can serve a number of purposes. In one embodiment, charge transport layer 1914 is a hole transport layer. Although not shown, an additional charge transport layer can be formed on the organic active layer 1912. Thus, the organic layer 1913 can include the organic active layer 1912 and one or both of the charge transport layers or no charge transport layer at all. Each of the charge transport layer 1914, the organic active layer 1912, and the additional charge transport layer can include one or more layers. In another embodiment, a single layer having a stepped or continuously changing composition can be used in place of a separate charge transport layer and an organic active layer.

  Returning to FIGS. 19 and 20, a charge transport layer 1914 and an organic active layer 1912 are sequentially formed on the electrode 904. Each of the charge transport layer 1914 and the organic active layer 1912 can be applied to, for example, continuous deposition techniques such as spin coating, gravure coating, curtain coating, dip coating, slot die coating, spray coating, and continuous nozzle coating, inkjet printing, gravure printing, And can be formed by, but not limited to, discontinuous deposition techniques such as screen printing, casting, and vapor deposition. For example, a liquid composition comprising an organic material can be dispensed through a nozzle, such as a micro nozzle. One or both of the charge transport layer 1914 and the organic active layer 1912 can be cured after application.

  In this embodiment, the charge transport layer 1914 is a hole transport layer. The hole transport layer can potentially be used to increase lifetime and improve device reliability as compared to devices where the conductive member 904 is in direct contact with the organic active layer 1912. In one particular embodiment, the hole transport layer is an organic polymer such as polyaniline (“PANI”), poly (3,4-ethylenedioxythiophene) (“PEDOT”), or tetrathiafulvalene tetracyanoquinodi. Organic charge transfer compounds such as methane (TTF-TCQN) can be included. The hole transport layer typically has a thickness in the range of about 100-250 nm.

  The hole transport layer is typically conductive to allow electrons to be removed from the subsequently formed active region and transferred to the conductive member 904. Although the conductive member 904 and the optional hole transport layer are conductive, typically the conductivity of the conductive member 904 is significantly greater than the hole transport layer.

  The composition of the organic active layer 1912 is typically dependent on the application of the organic electronic device. When the organic active layer 1912 is used in a radiation emitting organic electronic device, the material of the organic active layer 1912 emits radiation when a sufficient bias voltage is applied to the electrode layer. The radiation emitting active layer can contain almost any organic electroluminescent material or other organic radiation emitting material.

  Such materials can be small molecule materials or polymeric materials. Examples of the small molecule material include those described in US Patent Publication (Patent Document 1) and US Patent Publication (Patent Document 2). Alternatively, examples of the polymer material include those described in US Patent Publication (Patent Document 3), US Patent Publication (Patent Document 4), and US Patent Publication (Patent Document 5). An exemplary material is a semiconducting conjugated polymer. An example of such a polymer is poly (phenylene vinylene) (“PPV”). The luminescent material can be dispersed in a matrix of another material, with or without additives, but typically forms a layer alone. The organic active layer generally has a thickness in the range of about 40-100 nm.

  When the organic active layer 1912 is incorporated into a radiation-receptive organic electronic device, the material of the organic active layer 1912 can include many conjugated polymers and electroluminescent materials. Such materials include, for example, many conjugated polymers and electroluminescent and photoluminescent materials. Specific examples include poly (2-methoxy, 5- (2-ethyl-hexyloxy) -1,4-phenylene vinylene) (“MEH-PPV”), and MEH-PPV complexes with CN-PPV. Can be mentioned. The organic active layer 1912 typically has a thickness in the range of about 50-500 nm.

  Although not shown, an optional electron transport layer can be formed on the organic active layer 1912. The electron transport layer is another example of the charge transport layer. The electron transport layer is typically conductive to allow electrons to be injected from the subsequently formed cathode and transferred to the organic active layer 1912. The subsequently formed cathode and optional electron transport layer are conductive, but typically the conductivity of the cathode is significantly greater than the electron transport layer.

In one particular embodiment, the electron transport layer comprises a metal chelated oxinoid compound (eg, Alq3), a phenanthroline-based compound (eg, 2,9-dimethyl-4,7-diphenyl-1,10- Phenanthroline (“DDPA”), 4,7-diphenyl-1,10-phenanthroline (“DPA”)), azole compounds (eg 2- (4-biphenyl) -5- (4-t-butylphenyl) -1 , 3,4-oxadiazole (“PBD”), 3- (4-biphenyl) -4-phenyl-5- (4-tert-butylphenyl) -1,2,4-triazole (“TAZ”), Or any one or combination thereof, or any electron transport layer is inorganic and BaO, Li Or it may include Li ₂ O. Electron transport layer typically has a thickness in a range of about 30 to 500 nm.

  Any one or more of the charge transport layer 1914, the organic active layer 1912, and the additional charge transport layer can be applied as a liquid composition comprising one or more liquid media. Hydrophobic and hydrophilic surfaces are specific to the liquid medium in the liquid composition. In one embodiment, the liquid composition can include a co-solvent including, for example, alcohols, glycols, and glycol ethers. The solvent for the organic active layer liquid medium can be selected so as not to dissolve the charge transport layer. Alternatively, the solvent can be selected such that the charge transport layer is soluble or partially soluble in the solvent.

  In certain embodiments, the negative slope of the structure 1106 causes a capillary effect and draws a liquid composition of organic material around the opening 1108. Once cured, the organic active layer 1912 covers the underlying layers in the opening 1106, such as the electrode 904 and the charge transport layer 1914, and between conductive members such as electrodes (eg, anode and cathode). Prevent electrical short circuit.

  In this embodiment, the second electrode is formed on the organic layer 1913 including the charge transport layer 1914 and the organic active layer 1912. FIG. 21 is a plan view of the process sequence, and FIGS. 22 and 23 are cross-sectional views of the process sequence. In one embodiment, a layer is deposited using a stencil mask to form a conductive member 2118 over the second structure 1510 and an electrode 2116 over the organic active layer 1913 and over a portion of the structure 1106. To form. The height difference between electrode 2116 and conductive member 2118 prevents them from being connected. As shown in FIG. 22, the electrode layer 2116 overlies the layer in the opening 1108 and the portion of the first structure 1106. The portion of the electrode layer 2116 that overlies the layer in the opening 1108 and the portion of the electrode 2116 that overlies the portion of the first structure 1106 are connected together to form an electrically continuous structure.

  In one embodiment, electrode 2116 acts as the cathode. The layer of electrode 2116 closest to organic layer 1913 can be selected from rare earth metals including Group 1 metals (eg, Li, Cs), Group 2 (alkaline earth) metals, lanthanides and actinides. Electrode layers 2116 and 2118 have a thickness in the range of about 300-600 nm. In one particular non-limiting embodiment, a Ba layer of less than about 10 nm and then an Al layer of about 500 nm can be deposited. The Al layer can be replaced with either a metal or a metal alloy, or can be used in connection with either a metal or a metal alloy.

  As shown in FIGS. 21, 22, and 23, organic electronic components formed from an anode such as electrode 904, an organic layer 1913, and a cathode such as electrode 2116 are addressed via peripheral circuitry. Is possible. For example, applying a potential across one selected row of electrodes 2116 and one selected column of electrodes 904 activates one organic electronic component.

  An encapsulation layer (not shown) can be formed over the array and peripheral and remote circuitry to form substantially complete electrical devices such as electronic displays, radiation detectors, and photovoltaic cells. . The encapsulation layer can be attached to the rail such that there is no organic layer between it and the substrate. Radiation can be transmitted through the encapsulation layer. In that case, the encapsulation layer must be transparent to radiation.

(4. Other embodiments)
After formation of the organic electronic component, the first structure 1106 and the second structure 1510 can optionally be changed or removed. In one exemplary embodiment, the electronic device can be heated to about the glass transition temperature of the material forming the structure 1106 or structure 1510. Such heating can result in reflow, which, when viewed from a cross-sectional perspective view, causes the structure tilt to change in the final device. In another embodiment, an etch process can be used to remove structures such as structure 1106. Thus, the cross-sectional appearance of the final electronic device can be different from the structures and layers shown in FIGS. 21, 22, and 23.

  The electronic device formed by the process shown in FIGS. 9-23 is a passive matrix device. In an alternative embodiment, the electronic device can be an active matrix device. Figures 24 and 25 show exemplary active matrix devices. FIG. 25 shows a cross section of the electronic component at section line 25-25 in FIG. Each organic electronic component 2416 can include a unique electrode 2406 having an associated driver circuit 2418. The driver circuit 2418 can be incorporated into a substrate 2402 on which a unique electrode 2406 is formed. The well structure 2404 can have an opening corresponding to the periphery of the organic electronic component 2416. Other structures, such as some of the other well structures described with respect to passive matrix devices, can be used in other embodiments. The well structure 2404 has a negative slope at the opening when viewed from a cross-sectional perspective view. An organic layer 2408 can be on the unique electrode 2406 and can include a hole transport layer 2412 and an organic active layer 2410. Optionally, the organic layer 2408 can include an electron transport layer (not shown). Further, the organic electronic component 2416 can include a common electrode 2414. Each organic electronic component 2416 can then be activated by an active matrix mechanism, such as by driver circuit 2418.

  In the various embodiments shown above, the electrode can be a cathode or an anode. For example, electrode 904 can be an anode or a cathode. Similarly, electrode 2116 can be an anode or a cathode. In one particular embodiment, the electrode 904 is a transparent anode overlying a transparent substrate 902. For electronic display devices, radiation emitted from organic electronic components can be emitted through the transparent anode and substrate. Alternatively, the electrode 904 can be a transparent cathode.

  In another embodiment, the electrode 904 and the substrate 902 can be opaque or reflective. In this embodiment, the electrode 2116 can be formed from a transparent material, and in the case of a radiation emitting device, radiation can be emitted from the organic electronic component through the electrode 2116.

  In a further embodiment, the process for forming the electronic device is a sensor array, photodetector, photoconductive cell, photoresistor, photoswitch, phototransistor, phototube, IR detector, biosensor, photovoltaic cell or solar. It can be used when manufacturing a radiation response device such as a battery. The radiation responsive device can include a transparent substrate and a substrate side electrode. Alternatively, the radiation responsive device can include an electrode that is transparent.

  In further embodiments, the process for forming the electronic device can be used for inorganic devices. In one embodiment, a liquid composition for forming the inorganic layer may be used to allow better coating of the liquid composition adjacent to the same or other structure having a negative slope.

  In the foregoing specification, the invention has been described with reference to specific embodiments. However, one of ordinary skill in the art appreciates that various modifications and changes can be made without departing from the scope of the present invention as set forth in the claims below. The specification and drawings are, accordingly, to be regarded in an illustrative sense rather than a restrictive sense, and all such modifications are intended to be included within the scope of the invention.

  Benefits, other advantages, and solutions to problems have been described above with regard to specific embodiments. However, any benefit, advantage, solution to a problem, and any element that may cause any benefit, advantage, or solution to occur or become more significant is not an important claim in any or all of the claims. Should not be construed as necessary or essential features or elements.

Each includes a plan view and a cross-sectional view of a portion of a prior art well structure. Each includes a plan view and a cross-sectional view of a portion of a prior art well structure. FIG. 2 includes a cross-sectional view, a plan view, a plan view, and a cross-sectional view of a portion of an exemplary embodiment of a well structure before, during, and after a liquid composition is disposed in the well structure. FIG. 9 includes cross-sectional views of the well structure of FIGS. 3, 5, 6, and 7 before and after the liquid composition contacts an edge having a negative slope. FIG. 2 includes a cross-sectional view, a plan view, a plan view, and a cross-sectional view of a portion of an exemplary embodiment of a well structure before, during, and after a liquid composition is disposed in the well structure. FIG. 2 includes a cross-sectional view, a plan view, a plan view, and a cross-sectional view of a portion of an exemplary embodiment of a well structure before, during, and after a liquid composition is disposed in the well structure. FIG. 2 includes a cross-sectional view, a plan view, a plan view, and a cross-sectional view of a portion of an exemplary embodiment of a well structure before, during, and after a liquid composition is disposed in the well structure. FIG. 9 includes cross-sectional views of the well structure of FIGS. 3, 5, 6, and 7 before and after the liquid composition contacts an edge having a negative slope. FIG. 4 includes a plan view and a cross-sectional view, respectively, of a portion of a substrate after forming a first electrode on the substrate. FIG. 4 includes a plan view and a cross-sectional view, respectively, of a portion of a substrate after forming a first electrode on the substrate. FIG. 11 includes plan and cross-sectional views, respectively, of the substrate of FIGS. 9 and 10 after the well structure is formed over the substrate and the first electrode. FIG. 11 includes plan and cross-sectional views, respectively, of the substrate of FIGS. 9 and 10 after the well structure is formed over the substrate and the first electrode. 1 includes a cross-sectional view illustrating an exemplary well structure pattern. 1 includes a cross-sectional view illustrating an exemplary well structure pattern. FIG. 13 includes plan views of the substrates of FIGS. 11 and 12 after a separator structure is formed over the substrate, first electrode, and well structure. FIG. 15 includes cross-sectional views at section lines 16-16, 17-17, and 18-18, respectively. FIG. 15 includes cross-sectional views at section lines 16-16, 17-17, and 18-18, respectively. FIG. 15 includes cross-sectional views at section lines 16-16, 17-17, and 18-18, respectively. FIG. 16 includes plan and cross-sectional views, respectively, of the substrate of FIG. 15 after an organic layer has been formed over the substrate, first electrode, well structure, and separator structure. FIG. 16 includes plan and cross-sectional views, respectively, of the substrate of FIG. 15 after an organic layer has been formed over the substrate, first electrode, well structure, and separator structure. A plan view, a cross-sectional view, and a cross-sectional view, respectively, of the substrate of FIGS. 19 and 20 after the second electrode is formed on the substrate, the first electrode, the well structure, the separator structure, and the organic layer. Including the figure. A plan view, a cross-sectional view, and a cross-sectional view, respectively, of the substrate of FIGS. 19 and 20 after the second electrode is formed on the substrate, the first electrode, the well structure, the separator structure, and the organic layer. Including the figure. A plan view, a cross-sectional view, and a cross-sectional view, respectively, of the substrate of FIGS. 19 and 20 after the second electrode is formed on the substrate, the first electrode, the well structure, the separator structure, and the organic layer. Including the figure. FIG. 2 includes a plan view and a cross-sectional view, respectively, of a portion of an active matrix display having a common electrode. FIG. 2 includes a plan view and a cross-sectional view, respectively, of a portion of an active matrix display having a common electrode.

Claims (22)

A substrate,
A structure having an opening, wherein from a cross-sectional view, the structure in the opening has a negative slope, and from a plan view, each opening has a periphery substantially corresponding to the periphery of the organic electronic component When,
A first electrode overlying the structure and within the opening, wherein the portions of the first electrode overlying the structure and within the opening include first electrodes connected to each other An electronic device characterized by that.   The electronic device of claim 1, wherein the organic electronic component includes an organic active layer.   The electronic device according to claim 2, wherein a surface of the structure is hydrophobic.   The electronic device of claim 1, further comprising a second electrode between the substrate and the structure.   The electronic device according to claim 4, wherein the second electrode has a hydrophilic surface.   The electronic device of claim 1, wherein the substrate includes a driver circuit coupled to the organic electronic component. A substrate,
A first structure overlying the substrate,
From a cross-sectional view, the first structure has a negative slope,
From a plan view, the first structure has a first pattern;
A second structure overlying the substrate,
From a cross-sectional view, the second structure has a negative slope,
From the plan view, the second structure has a second pattern different from the first pattern;
An electronic device, wherein the first structure includes a second structure having a portion in contact with the second structure.   8. The electronic device of claim 7, wherein the first structure includes an opening, and from a plan view, each opening has a perimeter that substantially corresponds to the perimeter of the organic electronic component.   9. The electronic device of claim 8, further comprising an electrode overlying at least a portion of the first structure and the second structure.   The electronic device according to claim 9, wherein the electrode is in the opening and is continuous between the openings.   9. The electronic device of claim 8, wherein the organic electronic component includes an organic active layer.   The electronic device of claim 7, wherein the second structure has a thickness that is at least 1.5 times greater than a thickness of the first structure.   The electronic device of claim 7, wherein the first structure has a thickness of about 3 micrometers or less.   The electronic device of claim 7, wherein the second structure has a thickness of at least about 3 micrometers.   8. The electronic device of claim 7, further comprising an electrode between the substrate and the first structure.   16. The electronic device according to claim 15, wherein the electrode has a surface that is hydrophilic.   The electronic device of claim 7, wherein the electronic device comprises a passive matrix display.   The electronic device according to claim 7, wherein the first structure and the second structure have a hydrophobic surface. A method for forming an electronic device comprising:
Forming a structure having a negative slope and an opening, each plan view having a perimeter substantially corresponding to the perimeter of the organic electronic component from a plan view;
Depositing an organic active layer in the opening, wherein the organic active layer comprises a liquid composition;
Forming a first electrode overlying the structure and the organic active layer and within the opening, the portion of the first electrode overlying the structure and within the opening; And connecting them to each other.   The method further includes forming a second electrode before forming the structure, and after forming the structure, a portion of the second electrode is exposed along the bottom of the opening. The method of claim 19.   21. The method of claim 20, wherein the liquid composition contacts the second electrode with a wetting angle of less than 90 degrees.   21. The method of claim 20, wherein the liquid composition contacts the structure with a wetting angle of at least 45 degrees.

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