CN111398778A - Online monitoring device and monitoring method for irradiation of sensitive structure of MEMS device - Google Patents

Online monitoring device and monitoring method for irradiation of sensitive structure of MEMS device Download PDF

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CN111398778A
CN111398778A CN202010181489.2A CN202010181489A CN111398778A CN 111398778 A CN111398778 A CN 111398778A CN 202010181489 A CN202010181489 A CN 202010181489A CN 111398778 A CN111398778 A CN 111398778A
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sensitive structure
irradiation
signal processing
mems device
processing circuit
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董显山
来萍
黄钦文
黄云
杨少华
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China Electronic Product Reliability and Environmental Testing Research Institute
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China Electronic Product Reliability and Environmental Testing Research Institute
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N17/00—Investigating resistance of materials to the weather, to corrosion, or to light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P21/00—Testing or calibrating of apparatus or devices covered by the preceding groups
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/001—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing
    • G01R31/002—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing where the device under test is an electronic circuit
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2817—Environmental-, stress-, or burn-in tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2829—Testing of circuits in sensor or actuator systems

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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

The application relates to an on-line monitoring device and a monitoring method for radiation of a sensitive structure of an MEMS device; the device comprises a movable carrier for isolating the sensitive structure from a signal processing circuit by a preset distance and a shielding body for carrying out radiation shielding on the signal processing circuit; the movable carrier comprises a first fixing part and a second fixing part, the first fixing part is used for arranging a sensitive structure, the second fixing part is used for arranging a signal processing circuit, the first fixing part and the second fixing part are arranged at intervals so that the sensitive structure is isolated from the signal processing circuit by a preset distance, and the sensitive structure is connected with the signal processing circuit; the shielding body is provided with a cavity, and the top of the shielding body is provided with an access hole communicated with the cavity for the access of a second fixing part provided with a signal processing circuit; and when the signal processing circuit is positioned in the cavity, irradiating, and obtaining a monitoring result based on the online output parameters of the MEMS device to be detected. The method and the device can realize irradiation and online monitoring only aiming at the sensitive structure.

Description

Online monitoring device and monitoring method for irradiation of sensitive structure of MEMS device
Technical Field
The application relates to the technical field of device monitoring, in particular to an on-line monitoring device and a monitoring method for radiation of a sensitive structure of an MEMS device.
Background
The Micro-Mechanical-System (MEMS) is manufactured by combining a Micro-machining process on the basis of a Micro-electronic manufacturing technology; typical MEMS devices may include accelerometers, gyroscopes, pressure sensors, microphones, and micro-mirrors, among others. The MEMS device can be applied to the fields of aerospace, nuclear application and the like.
In the application fields of aerospace, nuclear and the like, the MEMS device can be subjected to space radiation and nuclear radiation, so that radiation damage is caused, and the performance index of the MEMS device is drifted and even fails. The MEMS device sensitive structure has electromechanical coupling characteristics different from the integrated circuit mainly in an electrical structure, and the irradiation characteristics of the MEMS device sensitive structure are different from those of traditional components such as the integrated circuit. Therefore, in order to ensure that the MEMS device is reliably applied in a radiation occasion, an irradiation test is carried out only on a sensitive structure of the MEMS device to explore an irradiation damage mechanism of the MEMS device; in the irradiation test, relevant parameters of the MEMS device need to be detected to carry out irradiation damage research.
In the implementation process, the inventor finds that at least the following problems exist in the conventional technology: the traditional irradiation test parameter detection method of the prior electronic component can not carry out on-line monitoring on the sensitive structure of the component under irradiation.
Disclosure of Invention
Therefore, it is necessary to provide an online irradiation monitoring device and an online irradiation monitoring method for a sensitive structure of an MEMS device, which can perform online monitoring on the device under irradiation.
In order to achieve the above object, in one aspect, an embodiment of the present invention provides an online radiation monitoring device for a sensitive structure of an MEMS device, where the MEMS device to be tested includes a sensitive structure and a signal processing circuit matched with the sensitive structure;
the device comprises a movable carrier for isolating the sensitive structure from the signal processing circuit by a preset distance and a shielding body for carrying out irradiation shielding on the signal processing circuit;
the movable carrier comprises a first fixing part and a second fixing part, the first fixing part is used for arranging a sensitive structure, the second fixing part is used for arranging a signal processing circuit, the first fixing part and the second fixing part are arranged at intervals so that the sensitive structure is isolated from the signal processing circuit by a preset distance, and the sensitive structure is connected with the signal processing circuit; the shielding body is provided with a cavity, and the top of the shielding body is provided with an access hole communicated with the cavity for the access of a second fixing part provided with a signal processing circuit;
and when the signal processing circuit is positioned in the cavity, irradiating, and obtaining a monitoring result based on the online output parameters of the MEMS device to be detected.
In one embodiment, the mobile carrier is a printed circuit board;
the sensitive structure and the signal processing circuit are connected by printed circuits of the printed circuit board.
In one embodiment, the printed circuit board is a rectangular printed circuit board; the first fixing part is arranged at one end of the rectangular printed circuit board along the length direction, and the second fixing part is arranged at the other end of the rectangular printed circuit board along the length direction;
the preset distance is greater than or equal to 30 cm; the length of the rectangular printed circuit board is 40 cm.
In one embodiment, the printed circuit board is provided with a mounting hole for fixing; the number of mounting holes is 4.
In one embodiment, the signal processing circuit comprises a sensitive structure detection circuit and a data transmission circuit; the online output parameter comprises a voltage signal;
the sensitive structure detection circuit is used for acquiring a voltage signal and outputting the voltage signal through the data transmission circuit.
In one embodiment, the sensitive structure detection circuit is a digital acquisition circuit; the data transmission circuit is a remote communication circuit.
In one embodiment, the shield body is a hexahedral shield box;
the hexahedral shielding box is made of radiation shielding material.
In one embodiment, the shield is built up from a stack of lead bricks.
An on-line monitoring system for the irradiation of a sensitive structure of an MEMS device comprises a direct-current voltage source and a monitoring computer arranged outside an irradiation chamber; the device also comprises an online radiation monitoring device of the sensitive structure of the MEMS device;
the direct-current voltage source supplies power to the MEMS device to be tested; the monitoring computer is connected with the MEMS device sensitive structure irradiation on-line monitoring device through a wired cable.
An online monitoring method for the irradiation of the sensitive structure of the MEMS device based on the online monitoring device for the irradiation of the sensitive structure of the MEMS device comprises the following steps:
arranging a sensitive structure of the MEMS device to be detected on a first fixing part of the movable carrier, arranging a signal processing circuit of the MEMS device to be detected on a second fixing part of the movable carrier, and connecting the sensitive structure and the signal processing circuit;
when the signal processing circuit is confirmed to be positioned in the cavity, irradiating to obtain online output parameters of the MEMS device to be tested;
and carrying out data analysis on the online output parameters to obtain a monitoring result.
One of the above technical solutions has the following advantages and beneficial effects:
the method is applicable to cobalt source gamma irradiation; specifically, the sensitive structure in the MEMS device to be detected is separated from the signal processing circuit through the movable carrier, mechanical separation of the sensitive structure and the signal processing circuit is realized, electrical connection is realized at the same time, and then the signal processing circuit is subjected to irradiation shielding through the shielding body, so that irradiation and online monitoring only aiming at the sensitive structure are realized; when the MEMS device is monitored, the signal processing circuit part is completely placed in the cavity of the shielding body, the sensitive structure is exposed in an irradiation environment, the shielding of the circuit part can be realized, only the sensitive structure is irradiated, and meanwhile, the parameters of the MEMS device to be monitored can be output on line to realize on-line monitoring.
Drawings
The foregoing and other objects, features and advantages of the application will be apparent from the following more particular description of preferred embodiments of the application, as illustrated in the accompanying drawings. Like reference numerals refer to like parts throughout the drawings, and the drawings are not intended to be drawn to scale in actual dimensions, emphasis instead being placed upon illustrating the subject matter of the present application.
FIG. 1 is a schematic structural diagram of an irradiation on-line monitoring device for a sensitive structure of a MEMS device in one embodiment;
FIG. 2a is a schematic view illustrating an installation of a chip to be tested in the on-line irradiation monitoring device for the sensitive structure of the MEMS device in one embodiment;
FIG. 2b is a schematic diagram illustrating a structure of a mobile carrier and a chip under test according to an embodiment;
FIG. 3 is a schematic structural diagram of an irradiation on-line monitoring device for a sensitive structure of a MEMS device in another embodiment;
FIG. 4 is a schematic diagram of another embodiment of a mobile carrier and a chip under test;
FIG. 5 is an internal block diagram of a monitoring computer in one embodiment;
FIG. 6 is an internal structural view of a monitoring computer in another embodiment;
FIG. 7 is a schematic flow chart of an irradiation on-line monitoring method for a sensitive structure of a MEMS device in one embodiment.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are shown in the drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element and be integral therewith, or intervening elements may also be present. The terms "fixed portion", "one end", "the other end" and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The conventional irradiation test parameter detection method for the electronic component at present can comprise the following modes: one method is off-line detection, namely, a sample (for example, an MEMS device to be detected, specifically, an MEMS device) is placed in an irradiation environment, the sample is not powered on, and sample parameters are detected before and after an irradiation test, so as to evaluate the irradiation damage characteristics of the sample. The other is online monitoring, specifically, when a sample is placed in an irradiation environment, the sample is electrified, and the change rule of sample parameters along with irradiation dose is obtained in the whole irradiation process; the online monitoring method can obtain the change condition of the sample in the irradiation damage process, and can be suitable for the irradiation damage mechanism research of the device.
The online monitoring method for the MEMS device irradiation test can comprise the following steps:
one is the whole irradiation on-line monitoring method, put MEMS device (including MEMS sensitive structure and detection processing circuit) into the irradiation environment wholly, monitor the output isoparametric of the whole device on line, although can obtain the data (namely the irradiation damage degradation data) in the whole irradiation test process, the irradiation damage degradation data not only include MEMS sensitive structure, also include the radiation damage of the integrated circuit, difficult to distinguish, namely this method can't isolate the influence of the detection processing circuit, is unfavorable for the mechanism study of the irradiation damage of MEMS structure.
The other method is a through hole on-line monitoring method, namely a certain part of a test sample is accurately irradiated in a through hole mode, specifically, a through hole is arranged in a shielding device and is aligned with the part of the test sample to be irradiated, so that accurate radiation (such as very small light spots of a proton source in a proton irradiation test) on a tiny part of an integrated circuit can be realized, however, the method is suitable for a single-particle overturning effect of heavy ion irradiation of the integrated circuit or strong-beam irradiation sources such as electron irradiation, proton irradiation and the like, but is not suitable for a cobalt source irradiation (total ionization dose effect) test, and the whole environment is filled with gamma rays during the cobalt source irradiation test.
Above, the total ionization dose effect is the main radiation damage effect of the MEMS sensitive structure, and the cobalt source irradiation is a conventional irradiation test for the total ionization dose effect. The traditional irradiation test monitoring method can not realize on-line monitoring only aiming at the irradiation of the MEMS sensitive structure under the irradiation environment such as a cobalt source.
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The MEMS accelerometer can comprise three functional modules, namely ① MEMS sensitive structure chips which are cores of the MEMS devices, ② integrated circuit processing chips such as an ASIC (application specific integrated circuit), a voltage stabilizer and the like, and a ③ substrate which realizes electric connection and board-level packaging, wherein the MEMS sensitive structure chips and the integrated circuit processing chips are integrated together.
In the traditional off-line detection, the MEMS sensitive structure chip is irradiated independently, parameter detection is carried out through a processing circuit (namely a circuit processing chip) before and after an irradiation test, and the parameters of the MEMS device cannot be obtained in the irradiation test process for on-line monitoring; the reason is that the MEMS sensitive structure chip and the integrated circuit processing chip cannot be in working states at the same time by adopting the traditional off-line detection.
For an MEMS sensitive structure, the total ionization dose effect is used as an important radiation sensitive effect, and a cobalt source is generally adopted for gamma ray radiation in a ground test; the environment of the cobalt source gamma irradiation test is characterized in that the whole environment is full of gamma rays. When the MEMS device is placed in a cobalt source irradiation environment, the MEMS sensitive structure and the integrated processing circuit are irradiated simultaneously. Based on the method and the device, only the MEMS sensitive structure can be irradiated, and then the irradiation damage mechanism research of the MEMS sensitive structure is completed.
In one embodiment, as shown in fig. 1, an online monitoring device for radiation of a sensitive structure of a MEMS device is provided, which is described by taking the application of the device to cobalt source gamma radiation as an example; the MEMS device to be tested comprises a sensitive structure 210 and a signal processing circuit 220 matched with the sensitive structure 210;
the on-line monitoring device for the radiation of the sensitive structure of the MEMS device may include a mobile carrier 100 for isolating the sensitive structure 210 from the signal processing circuit 220 by a predetermined distance, and a shielding body 300 for radiation shielding the signal processing circuit 220;
as shown in fig. 2a and 2b, the mobile carrier 100 may include a first fixing portion 110 for disposing the sensitive structure 210 and a second fixing portion 120 for disposing the signal processing circuit 220, the first fixing portion 110 and the second fixing portion 120 are disposed at an interval to isolate the sensitive structure 210 from the signal processing circuit 220 by a predetermined distance, and the sensitive structure 210 is connected to the signal processing circuit 220; as shown in fig. 1, the shielding body 300 has a cavity 310, and the top of the shielding body 300 has an access hole 320 communicated with the cavity 310 for accessing the second fixing portion 120 disposed with the signal processing circuit 220;
the irradiation is performed while the signal processing circuit 220 is located in the cavity 310 and the monitoring result is obtained based on the on-line output parameters of the MEMS device under test.
Specifically, according to the present application, the movable carrier 100 is designed to mechanically separate the sensitive structure 210 from the signal processing circuit 220 and simultaneously electrically connect the sensitive structure to the signal processing circuit 220, and then the signal processing circuit 220 is shielded by the shielding body 300, so that irradiation and online monitoring only for the sensitive structure 210 are realized.
It should be noted that the sensitive structure 210 in this application may be a sensitive structure chip in a chip to be tested; the signal processing Circuit 220 may be an Integrated Circuit processing chip such as an ASIC (Application Specific Integrated Circuit), a voltage regulator, or the like. In one particular example, the signal processing circuit 220 may include an integrated circuit, a discrete device, or the like.
The MEMS device to be tested in the application comprises a sensitive structure 210 and a signal processing circuit 220 matched with the sensitive structure 210, namely the sensitive structure 210 and the signal processing circuit 220 in the MEMS device to be tested are integrated; the application proposes that a sensitive structure 210 in the MEMS device to be tested is separated from a signal processing circuit 220 through a movable carrier 100, so as to realize mechanical separation and electrical connection of the two; namely, on the one hand, the sensitive structure 210 and the signal processing circuit 220 are isolated for a long distance (i.e., a preset distance); on the other hand, the two are electrically interconnected through corresponding connection modes.
For example, the sensitive structure 210 and the signal processing circuit 220 may be electrically connected by PCB wiring, or may be electrically connected by a flat cable or a cable; it should be noted that, the manner of electrical connection achieved through the flat cable and the cable may cause a large parasitic capacitance, and further may seriously interfere with the output of the MEMS device, and for this reason, the present application proposes to use the PCB routing to electrically connect the sensitive structure 210 and the signal processing circuit 220.
Specifically, as shown in fig. 2b, the sensitive structure 210 and the signal processing circuit 220 are isolated on the mobile carrier 100 for a long distance, and then the two are electrically connected through the routing, so that the isolation of the two is mechanically achieved and the electrical interconnection is also achieved. The preset distance may be obtained according to the irradiation environment and parameters of the MEMS device to be measured, for example, the first fixing portion 110 and the second fixing portion 120 are spaced apart from each other, so that the sensitive structure 210 is separated from the signal processing circuit 220 by a distance of 30 cm.
It should be noted that, the shape and material of the movable carrier 100 are not particularly limited in the present application, and the sensitive structure 210 in the MEMS device to be tested can be separated from the signal processing circuit 220, so as to achieve mechanical separation and electrical connection between the two, and meanwhile, the shape of one end can be matched with the movable carrier of the access hole 320 of the shielding body 300. For example, a PCB (printed circuit Board) Board.
Further, the shielding body 300 proposed in the present application may be made of a radiation shielding material; the shielding body 300 has a cavity 310, and the top of the shielding body 300 has an access hole 320 communicated with the cavity 310 for the second fixing portion 120 disposed with the signal processing circuit 220 to enter and exit; that is, based on the shielding body 300 in the present application, the chip to be tested can be fixed in the radiation shielding body 300 by the movable carrier, so that the sensitive structure 210 can be exposed to radiation and then placed in the radiation test environment. The front surface of the shield 300 shown in fig. 1 is depicted with a black dashed line to show the signal processing circuit 220 located in the cavity 310.
Based on the on-line radiation monitoring device for the sensitive structure of the MEMS device, the circuit part of the MEMS device to be tested can be completely placed in the shielding body 300, and the sensitive structure 210 is exposed out of the shielding body 300. Wherein, the shape of the access hole 320 communicated with the cavity 310 matches the shape of the end of the second fixing portion 120 disposed with the signal processing circuit 220, so that the mobile carrier 100 can be placed in the inlet and the middle of the shielding body 300; specifically, one end of the second fixing portion 120 of the mobile carrier 100, on which the signal processing circuit 220 is disposed, is placed in the shield 300 and fixed.
It should be noted that the shape and the manufacturing method of the shield 300 are not particularly limited, and the shield can be made of radiation shielding material, such as lead bricks stacked together; for another example, a hexahedral case structure is made of a lead material.
Further, as shown in fig. 4, when the signal processing circuit 220 is located in the cavity 310, the total ionization dose effect irradiation is performed, irradiation parameters such as dose rate are set, an irradiation test is started, and a monitoring result is obtained based on the online output parameters of the MEMS device to be detected.
Based on the method and the device, the response of the sensitive structure under different dose rates, different responses of the MEMS device to be tested under the closed-loop detection circuit and the open-loop detection circuit, different responses of the MEMS device to be tested under the same detection circuit and different circuit parameters, and the radiation resistance intensity of different sensitive structures can be researched. And then the irradiation damage mechanism of the sensitive structure is researched through data analysis.
According to the on-line monitoring device for the irradiation of the sensitive structure of the MEMS device, the sensitive structure in the MEMS device to be detected is separated from the signal processing circuit through the movable carrier, so that the mechanical separation and the electrical connection of the sensitive structure and the signal processing circuit are realized, and then the signal processing circuit is subjected to irradiation shielding through the shielding body, so that the irradiation and the on-line monitoring only aiming at the sensitive structure are realized; when monitoring, the signal processing circuit part can be completely placed in the cavity of the shielding body based on the method, the sensitive structure is exposed in an irradiation environment, shielding of the circuit part can be achieved, only the sensitive structure is irradiated, meanwhile, parameters of the MEMS device to be detected can be output on line, online monitoring is achieved, and then irradiation damage mechanism research of the sensitive structure can be carried out.
In one embodiment, as shown in fig. 3, an online monitoring device for radiation of a sensitive structure of a MEMS device is provided, which is exemplified by the application of the device to cobalt source gamma radiation and the MEMS device; the MEMS device to be tested comprises a sensitive structure and a signal processing circuit matched with the sensitive structure;
the on-line monitoring device for the radiation of the sensitive structure of the MEMS device can comprise a movable carrier for isolating the sensitive structure from the signal processing circuit by a preset distance and a shielding body for carrying out radiation shielding on the signal processing circuit;
the movable carrier can comprise a first fixing part for arranging the sensitive structure and a second fixing part for arranging the signal processing circuit, the first fixing part and the second fixing part are arranged at intervals so that the sensitive structure is isolated from the signal processing circuit at a preset distance, and the sensitive structure is connected with the signal processing circuit; the shielding body is provided with a cavity, and the top of the shielding body is provided with an access hole communicated with the cavity for the access of a second fixing part provided with a signal processing circuit;
and when the signal processing circuit is positioned in the cavity, irradiating, and obtaining a monitoring result based on the online output parameters of the MEMS device to be detected.
In a specific embodiment, the mobile carrier is a printed circuit board (i.e., PCB);
the sensitive structure and the signal processing circuit are connected by printed circuits of the printed circuit board.
In a specific embodiment, the printed circuit board is a rectangular printed circuit board (i.e., a rectangular PCB board); the first fixing part is arranged at one end of the rectangular printed circuit board along the length direction, and the second fixing part is arranged at the other end of the rectangular printed circuit board along the length direction;
the preset distance is greater than or equal to 30 cm; the length of the rectangular printed circuit board is 40 cm.
Specifically, as shown in fig. 4, the present application proposes to separate the MEMS sensitive structure from the signal processing circuit by using a PCB, and then shield the signal processing circuit from radiation by using a shielding body (e.g., a hexahedral shielding box), so as to achieve radiation and online monitoring only for the MEMS sensitive structure.
As shown in fig. 4, the MEMS sensitive structure and the signal processing circuit are isolated from each other by a long distance on the PCB, and the PCB is electrically connected to each other by the trace, so that the MEMS sensitive structure and the signal processing circuit are mechanically isolated from each other and electrically interconnected. Meanwhile, the PCB board in FIG. 4 has mounting holes for fixing the PCB board.
Further, the PCB of the present application may be a rectangular PCB, for example, a PCB with a length of 40 cm; then, devices such as an integrated circuit, a discrete device, etc. (i.e., a signal processing circuit) may be disposed at one end of the PCB; arranging the MEMS sensitive structure at the other end of the PCB, wherein the distance between the MEMS sensitive structure and other electronic components is more than 30 cm; meanwhile, the MEMS sensitive structure and the processing circuit can be electrically connected through the PCB routing.
In a particular embodiment, the signal processing circuit 220 may include a sensitive structure detection circuit and a data transmission circuit; the online output parameter may include a voltage signal;
the sensitive structure detection circuit is used for acquiring a voltage signal and outputting the voltage signal through the data transmission circuit.
In one particular example, the sensitive structure detection circuit is a digital acquisition circuit; the data transmission circuit is a remote communication circuit.
Specifically, the signal processing circuit in fig. 4 may include a detection circuit of the MEMS sensitive structure, which can output parameters such as analog/digital voltage of the MEMS device, and a transmission circuit for data transmission.
Furthermore, the sensitive structure detection circuit can be a digital acquisition circuit; namely, the voltage output analog signal of the MEMS device can be converted into a 422 digital signal by adopting a digital acquisition circuit; the MEMS device may also include communication circuitry for remotely transmitting the parameter to be measured.
In one specific embodiment, as shown in FIG. 3, the shield is a hexahedral shield can;
the hexahedral shielding box is made of radiation shielding material.
In a particular embodiment, the shield is built up using a stack of lead bricks.
Specifically, the testing device arranged on the PCB is arranged in the hexahedral shielding box shown in fig. 3, the circuit part is completely arranged in the hexahedral shielding box, the MEMS sensitive structure is exposed outside the hexahedral shielding box and then is arranged in an irradiation environment, so that the circuit part can be shielded, only the MEMS sensitive structure is irradiated, and meanwhile, the parameters of the MEMS device can be output on line to realize on-line monitoring.
Furthermore, the shielding body in the application can be a hexahedral shielding box, six surfaces of which are made of radiation shielding materials, wherein a port (i.e. an access hole) for placing a PCB (printed circuit board) is reserved on the top surface; the shielding body can be built by adopting a method of stacking lead bricks.
In the above, the method can be suitable for cobalt source gamma irradiation; specifically, the sensitive structure in the MEMS device to be detected is separated from the signal processing circuit through the PCB, mechanical separation and electrical connection of the sensitive structure and the signal processing circuit are achieved, and then the signal processing circuit is subjected to irradiation shielding through the hexahedral shielding box, so that irradiation and online monitoring only aiming at the sensitive structure are achieved; when the MEMS device parameter monitoring device is used for monitoring, the signal processing circuit part is completely placed in the hexahedral shielding box, the sensitive structure is exposed in an irradiation environment, the shielding of the circuit part can be realized, only the sensitive structure is irradiated, and meanwhile, the MEMS device parameter to be detected can be output on line to realize on-line monitoring.
In one embodiment, an online radiation monitoring system for a sensitive structure of a MEMS device is provided, which is exemplified by application of the system to cobalt source gamma radiation and the MEMS device; comprises a direct current voltage source and a monitoring computer arranged outside an irradiation chamber; the device also comprises an online radiation monitoring device of the sensitive structure of the MEMS device;
the direct-current voltage source supplies power to the MEMS device to be tested; the monitoring computer is connected with the MEMS device sensitive structure irradiation on-line monitoring device through a wired cable.
Specifically, the MEMS device to be detected is fixed by adopting the on-line irradiation monitoring device for the sensitive structure of the MEMS device, the signal processing circuit part is completely placed in the cavity of the shielding body, and the sensitive structure is exposed in an irradiation environment.
Further, a DC voltage source may be used to power the MEMS device; converting the voltage output analog signal of the MEMS device into a 422 digital signal by adopting a digital acquisition circuit; the signal is transmitted to a computer (namely, a monitoring computer) outside the irradiation room by using a long-distance wired cable.
Co 60 (namely cobalt-60) can be adopted for ionizing total dose effect irradiation, irradiation parameters such as dose rate and the like are set, and an irradiation test is started. In the irradiation process, the change condition of the output voltage of the MEMS device along with the irradiation dose is obtained on a monitoring computer.
The system mechanically separates and electrically connects the MEMS structure and the processing circuit through a movable carrier in the MEMS device sensitive structure irradiation online monitoring device, and then carries out irradiation shielding on the processing circuit through a shielding body, so that irradiation and online monitoring only aiming at the MEMS sensitive structure are realized, the change condition of the output voltage of the MEMS device along with the irradiation dose is obtained on a monitoring computer, the problem that the parameter online monitoring only aiming at the irradiation of the MEMS sensitive structure cannot be completed by the existing method is solved, the online monitoring of the MEMS device sensitive structure in the irradiation test process can be realized by adopting the system, and the irradiation damage mechanism research of the MEMS sensitive structure can be developed.
In one embodiment, the monitoring computer may be a server, and the internal structure thereof may be as shown in fig. 5. The monitoring computer includes a processor, a memory, a network interface, and a database connected by a system bus. Wherein the processor of the monitoring computer is configured to provide computational and control capabilities. The memory of the monitoring computer comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program, and a database. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The database of the monitoring computer is used for storing real-time parameters which are monitored online when the MEMS sensitive structure is irradiated, and can also be used for storing online degradation data when the MEMS sensitive structure is damaged by irradiation. The network interface of the monitoring computer is used for connecting and communicating with an external MEMS device sensitive structure irradiation online monitoring device.
In one embodiment, the monitoring computer may be a terminal, and the internal structure thereof may be as shown in fig. 6. The monitoring computer comprises a processor, a memory, a network interface, a display screen and an input device which are connected through a system bus. Wherein the processor of the monitoring computer is configured to provide computational and control capabilities. The memory of the monitoring computer comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The network interface of the monitoring computer is used for connecting and communicating with an external MEMS device sensitive structure irradiation online monitoring device. The display screen of the monitoring computer can be a liquid crystal display screen or an electronic ink display screen, and the input device of the monitoring computer can be a touch layer covered on the display screen, a key, a track ball or a touch pad arranged on the shell of the monitoring computer, an external keyboard, a touch pad or a mouse and the like.
It will be appreciated by those skilled in the art that the configurations shown in fig. 5 and 6 are only block diagrams of some configurations relevant to the present disclosure, and do not constitute a limitation on the monitoring computer to which the present disclosure may be applied, and a particular monitoring computer may include more or less components than those shown in the drawings, or may combine some components, or have a different arrangement of components.
In one embodiment, as shown in fig. 7, an online monitoring method for radiation of a sensitive structure of a MEMS device is provided, which is exemplified by applying the method to cobalt source gamma radiation and MEMS accelerometer; the method comprises the following steps:
step S710, arranging the sensitive structure of the MEMS device to be tested on a first fixing part of the movable carrier, arranging the signal processing circuit of the MEMS device to be tested on a second fixing part of the movable carrier, and connecting the sensitive structure and the signal processing circuit;
s720, confirming that the signal processing circuit is irradiated when positioned in the cavity, and acquiring online output parameters of the MEMS device to be tested;
and step S730, carrying out data analysis on the online output parameters to obtain a monitoring result.
Specifically, based on the application, the sensitive structure and the signal processing circuit can be mechanically separated and electrically connected, and then subsequent tests and monitoring can be completed. The following describes an implementation process of performing irradiation on-line monitoring on a sensitive structure of the MEMS accelerometer by using the device and the method for monitoring irradiation on-line monitoring on a sensitive structure of the MEMS device, taking the MEMS device as an example:
it was confirmed that MEMS accelerometers contain sensitive structures as well as integrated circuits, discrete devices, etc. Based on the on-line monitoring device for the irradiation of the sensitive structure of the MEMS device, a PCB (printed circuit board) with the length of 40cm is adopted, and devices (namely a signal processing circuit) such as an integrated circuit and a discrete device are arranged at one end of the PCB; and arranging the MEMS sensitive structure at the other end of the PCB, wherein the distance between the MEMS sensitive structure and other electronic components is more than 30 cm.
Furthermore, the MEMS sensitive structure and the signal processing circuit can be electrically connected through PCB wiring.
The shielding body provided by the application is used for completing irradiation shielding of the signal processing circuit; the PCB board shielding box comprises a shielding box body, a PCB board and a PCB board, wherein the shielding box body is made of a lead material, and an access hole is formed in the top of the shielding box body, so that the PCB board can be placed in the shielding box body at the inlet and the middle of the shielding box body; and placing the PCB into a hexahedral shielding box, wherein one end of the PCB provided with chips such as a processing circuit and the like is placed into the hexahedral shielding box and fixed.
Supplying power to the MEMS accelerometer by adopting a direct-current voltage source; converting the voltage output analog signal of the MEMS accelerometer into a 422 digital signal by adopting a digital acquisition circuit; the signal is transmitted to a computer (namely, a monitoring computer) outside the irradiation room by using a long-distance wired cable.
Co 60 (namely cobalt-60) is adopted for ionizing total dose effect irradiation, irradiation parameters such as dose rate and the like are set, and an irradiation test is started. In the irradiation process, the change condition of the output voltage of the MEMS accelerometer along with the irradiation dose is obtained on a monitoring computer.
In a specific example, according to the above test method, responses of the sensitive structures at different dose rates, different responses of the MEMS devices to be tested under the closed-loop detection circuit and the open-loop detection circuit, different responses of the MEMS devices to be tested under the same detection circuit and different circuit parameters, and radiation resistance of different sensitive structures can be further improved. And then the irradiation damage mechanism of the sensitive structure is researched through data analysis.
In the method, the MEMS structure and the processing circuit are mechanically separated and electrically connected through the PCB in the MEMS device sensitive structure irradiation online monitoring device, and then the processing circuit is subjected to irradiation shielding through the hexahedral shielding box, so that the irradiation and online monitoring only aiming at the MEMS sensitive structure are realized, the problem that the parameter online monitoring only aiming at the irradiation of the MEMS sensitive structure cannot be completed in the traditional method is solved, and the online monitoring of the MEMS device sensitive structure in the irradiation test process can be realized by adopting the method, so that the irradiation damage mechanism research of the MEMS sensitive structure can be carried out.
It should be understood that, although the steps in the flowchart of fig. 7 are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least a portion of the steps in fig. 7 may include multiple sub-steps or multiple stages that are not necessarily performed at the same time, but may be performed at different times, and the order of performance of the sub-steps or stages is not necessarily sequential, but may be performed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.
In an embodiment, a computer-readable storage medium is provided, on which a computer program is stored, which computer program, when being executed by a processor, realizes the steps of any of the methods described above.
It will be understood by those of ordinary skill in the art that all or a portion of the processes of the methods of the embodiments described above may be implemented by instructions associated with hardware via a computer program that may be stored on a non-volatile computer-readable storage medium, which when executed, may include the processes of the embodiments of the methods described above, wherein any reference to memory, storage, database, or other medium used in the embodiments provided herein may include non-volatile and/or volatile memory.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. An on-line monitoring device for radiation of a sensitive structure of an MEMS device is characterized in that the MEMS device to be tested comprises a sensitive structure and a signal processing circuit matched with the sensitive structure;
the device comprises a movable carrier for isolating the sensitive structure from the signal processing circuit by a preset distance and a shielding body for carrying out irradiation shielding on the signal processing circuit;
the movable carrier comprises a first fixing part and a second fixing part, the first fixing part is used for arranging the sensitive structure, the second fixing part is used for arranging the signal processing circuit, the first fixing part and the second fixing part are arranged at intervals so that the sensitive structure is isolated from the signal processing circuit by the preset distance, and the sensitive structure is connected with the signal processing circuit; the shielding body is provided with a cavity, and the top of the shielding body is provided with an access hole communicated with the cavity so as to allow the second fixing part provided with the signal processing circuit to enter and exit;
and when the signal processing circuit is positioned in the cavity, irradiating, and obtaining a monitoring result based on the online output parameters of the MEMS device to be detected.
2. The on-line monitoring device for the irradiation of the sensitive structure of the MEMS device as claimed in claim 1, wherein the mobile carrier is a printed circuit board;
the sensitive structure and the signal processing circuit are connected through a printed circuit of the printed circuit board.
3. The on-line monitoring device for the irradiation of the sensitive structure of the MEMS device as claimed in claim 2, wherein the printed circuit board is a rectangular printed circuit board; the first fixing part is arranged at one end of the rectangular printed circuit board along the length direction, and the second fixing part is arranged at the other end of the rectangular printed circuit board along the length direction;
the preset distance is greater than or equal to 30 centimeters; the length of the rectangular printed circuit board is 40 cm.
4. The on-line monitoring device for the irradiation of the sensitive structure of the MEMS device as claimed in claim 2, wherein the printed circuit board is provided with a mounting hole for fixing; the number of the mounting holes is 4.
5. The on-line monitoring device for the irradiation of the sensitive structure of the MEMS device as claimed in any one of claims 1 to 4, wherein the signal processing circuit comprises a sensitive structure detection circuit and a data transmission circuit; the online output parameter comprises a voltage signal;
the sensitive structure detection circuit is used for acquiring the voltage signal and outputting the voltage signal through the data transmission circuit.
6. The on-line monitoring device for the irradiation of the sensitive structure of the MEMS device according to claim 5, wherein the sensitive structure detection circuit is a digital acquisition circuit; the data transmission circuit is a remote communication circuit.
7. The on-line monitoring device for the irradiation of the sensitive structure of the MEMS device as claimed in any one of claims 1 to 4, wherein the shielding body is a hexahedral shielding box;
the hexahedral shielding box is made of radiation shielding materials.
8. The on-line monitoring device for the irradiation of the sensitive structure of the MEMS device as claimed in any one of claims 1 to 4, wherein the shielding body is built by stacking lead bricks.
9. An on-line monitoring system for radiation of a sensitive structure of an MEMS device is characterized by comprising a direct-current voltage source and a monitoring computer arranged outside a radiation chamber; the on-line monitoring device for the irradiation of the sensitive structure of the MEMS device is further comprised in any one of the claims 1 to 8;
the direct-current voltage source supplies power to the MEMS device to be tested; and the monitoring computer is connected with the MEMS device sensitive structure irradiation online monitoring device through a wired cable.
10. An online monitoring method for the irradiation of the sensitive structure of the MEMS device based on the online monitoring device for the irradiation of the sensitive structure of the MEMS device of any one of claims 1 to 8, which is characterized by comprising the following steps:
arranging the sensitive structure of the MEMS device to be detected on a first fixing part of the movable carrier, arranging the signal processing circuit of the MEMS device to be detected on a second fixing part of the movable carrier, and connecting the sensitive structure and the signal processing circuit;
when the signal processing circuit is confirmed to be positioned in the cavity, irradiating to obtain online output parameters of the MEMS device to be tested;
and carrying out data analysis on the online output parameters to obtain a monitoring result.
CN202010181489.2A 2020-03-16 2020-03-16 Online monitoring device and monitoring method for irradiation of sensitive structure of MEMS device Pending CN111398778A (en)

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