CN111394725A - Device for recovering chlorine gas by acid etching copper recovery system - Google Patents
Device for recovering chlorine gas by acid etching copper recovery system Download PDFInfo
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- CN111394725A CN111394725A CN202010334297.0A CN202010334297A CN111394725A CN 111394725 A CN111394725 A CN 111394725A CN 202010334297 A CN202010334297 A CN 202010334297A CN 111394725 A CN111394725 A CN 111394725A
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- 238000005530 etching Methods 0.000 title claims abstract description 80
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 title claims abstract description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 25
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 25
- 239000010949 copper Substances 0.000 title claims abstract description 25
- 238000011084 recovery Methods 0.000 title claims abstract description 25
- 239000002253 acid Substances 0.000 title claims abstract description 22
- 239000007788 liquid Substances 0.000 claims abstract description 88
- 239000003814 drug Substances 0.000 claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 claims abstract description 31
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 239000002699 waste material Substances 0.000 claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 11
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 31
- 229910052801 chlorine Inorganic materials 0.000 claims description 31
- 239000000460 chlorine Substances 0.000 claims description 31
- 239000000126 substance Substances 0.000 claims description 13
- 239000011810 insulating material Substances 0.000 claims description 3
- 238000004134 energy conservation Methods 0.000 abstract description 3
- 230000009467 reduction Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 238000009434 installation Methods 0.000 abstract 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008929 regeneration Effects 0.000 description 3
- 238000011069 regeneration method Methods 0.000 description 3
- QWPPOHNGKGFGJK-UHFFFAOYSA-N hypochlorous acid Chemical compound ClO QWPPOHNGKGFGJK-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- XTEGARKTQYYJKE-UHFFFAOYSA-N chloric acid Chemical compound OCl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-N 0.000 description 1
- 229940005991 chloric acid Drugs 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B1/00—Electrolytic production of inorganic compounds or non-metals
- C25B1/01—Products
- C25B1/24—Halogens or compounds thereof
- C25B1/26—Chlorine; Compounds thereof
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention provides a device for recovering chlorine gas by an acid etching copper recovery system, which comprises a waste liquid tank, an electrolytic bath, an etching machine, a liquid medicine tank and a gas-liquid mixing and circulating mechanism, wherein the etching machine and the liquid medicine tank are of a supply integrated structure, the etching machine is arranged on one side of the starting end of an etching production line and is in feeding work connection with the etching production line, the waste liquid tank is arranged at the tail end of the etching production line and stores used etching liquid, the electrolytic bath is arranged on one side of the waste liquid tank and is used for recovering the etching liquid in the tank, the electrolytic bath is connected with chlorine gas supply equipment through a gas pipe, the gas-liquid mixing and circulating mechanism comprises a liquid medicine circulating pump, a jet device is arranged at the water outlet end of the liquid medicine circulating pump, the liquid medicine tank, the liquid medicine circulating pump and the jet device form circulating closed. The invention not only saves the installation cost and the production cost of equipment, but also has the effects of energy conservation and emission reduction.
Description
Technical Field
The invention mainly relates to the technical field of acid etching copper recovery, in particular to a device for recovering chlorine by using an acid etching copper recovery system.
Background
The equipment volume of the acid etching copper recovery system is large, the occupied area is 100-500 square meters, the arrangement of the existing production workshop of a client only considers the arrangement of the original equipment, and a lot of reserved space is not reserved. The adopted acid etching copper recovery system is generally newly increased and planned later, and only enough space is available for equipment arrangement far away from the original etching production equipment, so that the acid etching copper recovery system can be recycled on line only by being connected with an etching production line through a pipeline, and the functions of energy conservation and emission reduction are achieved;
at present, chlorine gas in an acid copper recovery system is generally absorbed in a chlorine gas dissolving cylinder of a copper recovery plant to form a regenerated liquid, and the regenerated etching liquid dissolved with the chlorine gas is conveyed to an etching production line by a pipeline and a pump. As the solubility of the chlorine in the regenerated etching solution is not high, in order to achieve the etching capacity required by the production line, a large amount of regenerated etching solution in which the chlorine is dissolved is required to be conveyed to the production line to participate in the reaction, and the failed etching solution is required to return to the regeneration solution cylinder and the dissolution cylinder of the acid copper recovery system in time for cyclic regeneration. The conveying process of the regenerated liquid has the following characteristics: 1. the conveying distance is long, 2, the specific gravity of the liquid is high, 3, the conveying circulation is large, 4, the flow speed is high, and 5, the pressure of the liquid in the pipeline is large;
in order to ensure the normal production of the production line, the acid copper recovery system needs to design a regeneration liquid cylinder and an absorption cylinder with large capacity, a large conveying pipeline and a high-power high-lift pump for matching use, the requirements on equipment and pipelines are very high, great potential safety hazards exist in the conveying process, and the consumed electric energy is very large.
Disclosure of Invention
The invention mainly provides a device for recovering chlorine gas by an acid etching copper recovery system, which is used for solving the technical problems in the background technology.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a device for recovering chlorine gas by an acid etching copper recovery system comprises a waste liquid tank, an electrolytic tank, an etching machine, a liquid medicine tank and a gas-liquid mixing and circulating mechanism, wherein the etching machine and the liquid medicine tank are of a supply integrated structure, the etching machine is arranged on one side of the starting end of an etching production line and is in feeding work connection with the etching production line, the waste liquid tank is arranged at the tail end of the etching production line and stores used etching liquid, the electrolytic tank is arranged on one side of the waste liquid tank and recovers the etching liquid in the tank, and the electrolytic tank is connected with chlorine gas supply equipment through a gas pipe;
the gas-liquid mixing circulation mechanism comprises a liquid medicine circulating pump, an ejector is arranged at the water outlet end of the liquid medicine circulating pump, the liquid medicine tank, the liquid medicine circulating pump and the ejector form circulating closed connection through circulating pipes, and the ejector is connected with the chlorine gas supply equipment through a gas conveying pipe II.
Furthermore, a liquid flow-limiting valve is installed on the pipe body of the circulating pipe close to the water outlet end of the liquid medicine tank, and a pressure relief valve is installed on the pipe body of the circulating pipe close to the water inlet end of the liquid medicine tank.
Further, an air draft mechanism is arranged on one side of the etching machine and comprises an exhaust fan, and the exhaust fan is connected with the top of the liquid medicine tank through an air pipe.
Further, an axial flow fan is mounted on the first gas conveying pipe and conducts flow along the direction from the electrolytic bath to the chlorine gas supply equipment.
Furthermore, a check valve is installed on the second gas conveying pipe and is a gas check valve.
Furthermore, the second gas conveying pipe is located an overflow pipe is connected to the pipe body between the chlorine supply equipment and the one-way valve, and one end of the second gas conveying pipe, which is far away from the overflow pipe, is connected with a chlorine temporary storage tank.
Furthermore, a stop valve is installed on the overflow pipe, and the stop valve is of a manual-automatic integrated type.
Furthermore, a heat-resistant heat-insulating material layer is arranged on the outer wall of the circulating pipe.
Compared with the prior art, the invention has the beneficial effects that:
firstly, the invention adopts a chlorine conveying mode to replace the conventional mode of conveying a large amount of regenerated liquid, does not need a chlorine absorption dissolving cylinder, directly utilizes the chemical water tank of the existing etching machine as the chlorine absorption dissolving cylinder, reduces the occupied area of equipment and reduces the investment of the equipment;
secondly, the invention utilizes the suction force of the vacuum degree of the ejector to convey chlorine to the production line to participate in production, thus completely avoiding the electric energy consumed by the absorption cylinder for absorbing and conveying liquid, ensuring that the pressure in the pipeline is low and the conveyed substance is pure chlorine participating in reaction, avoiding the defects of large potential safety hazard and large energy consumption existing in long-distance liquid conveying, and achieving the effects of energy conservation and emission reduction;
thirdly, the chlorine gas is directly absorbed and dissolved in the liquid medicine tank of the etching machine, the generated hydrochloric acid and hypochlorous acid can immediately participate in the etching production consumption, and the continuous dissolution, the continuous consumption and the repeated multiple dissolution can be realized, so that the solution can not overflow due to the low solubility of the chlorine gas and the easy supersaturation. And even if the chlorine is not dissolved in the liquid medicine due to saturation, the chlorine can be directly reacted and consumed with copper when contacting with the copper plate, so that the chlorine can be greatly utilized to participate in etching reaction, the addition of hydrochloric acid and oxidizing agents (hypochlorous acid and chloric acid substances) is reduced, and the production cost is reduced.
The present invention will be explained in detail below with reference to the drawings and specific embodiments.
Drawings
FIG. 1 is a schematic diagram of the overall recovery system of the present invention;
FIG. 2 is a schematic view of the gas-liquid mixing circulation mechanism of the present invention;
FIG. 3 is a flow chart of the recovery system operation of the present invention.
In the figure: 100. a waste liquid tank; 101. an electrolytic cell; 102. an axial flow fan; 103. a first gas transmission pipe; 104. chlorine gas supply equipment; 105. a second gas conveying pipe; 1051. a one-way valve; 106. a gas-liquid mixing circulation mechanism; 1061. a liquid medicine circulating pump; 1062. an ejector; 107. a liquid medicine tank; 108. a circulation pipe; 1081. a liquid flow restriction valve; 1082. a pressure relief valve; 109. an etching machine; 110. an air draft mechanism; 111. an overflow pipe; 1111. a stop valve; 112. chlorine temporary storage tank.
Detailed Description
In order to facilitate an understanding of the invention, the invention will now be described more fully hereinafter with reference to the accompanying drawings, in which several embodiments of the invention are shown, but which may be embodied in different forms and not limited to the embodiments described herein, but which are provided so as to provide a more thorough and complete disclosure of the invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may be present, and when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present, as the terms "vertical", "horizontal", "left", "right" and the like are used herein for descriptive purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, and the knowledge of the terms used herein in the specification of the present invention is for the purpose of describing particular embodiments and is not intended to limit the present invention, and the term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 and 2, a device for recovering chlorine gas by an acid etching copper recovery system comprises a waste liquid tank 100, an electrolytic tank 101, an etching machine 109, a liquid medicine tank 107 and a gas-liquid mixing and circulating mechanism 106, and is characterized in that the etching machine 109 and the liquid medicine tank 107 are integrated, the liquid medicine tank 107 is used as a liquid medicine supply device of the etching machine 109, the etching machine 109 is arranged at one side of the initial end of the etching production line and is connected with the etching production line in a feeding manner, the etching machine 109 sends etching liquid medicine to the production line, the waste liquid tank 100 is arranged at the tail end of the etching production line and stores used etching liquid, the electrolytic tank 101 is arranged at one side of the waste liquid tank 100 and recovers the etching liquid in the tank, the electrolytic tank 101 is connected with a chlorine gas supply device 104 through a gas pipe 103, and the chlorine gas supply device 104 is used as a chlorine gas storage device for supplying subsequent chlorine gas, the gas-liquid mixing and circulating mechanism 106 comprises a liquid medicine circulating pump 1061, an ejector 1062 is arranged at the water outlet end of the liquid medicine circulating pump 1061, the liquid medicine tank 107, the liquid medicine circulating pump 1061 and the ejector 1062 are in circulating closed connection through a circulating pipe 108, a heat-resistant heat-insulating material layer is arranged on the outer wall of the circulating pipe 108 to better insulate the liquid medicine, and the ejector 1062 is connected with the chlorine gas supply equipment 104 through a gas pipe two 105.
Referring to fig. 2, a liquid flow-limiting valve 1081 is installed on the pipe body of the circulation pipe 108 near the water outlet end of the chemical tank 107, and a pressure-relief valve 1082 is installed on the pipe body of the circulation pipe 108 near the water inlet end of the chemical tank 107. In this embodiment, the liquid flow-limiting valve 1081 is used to limit the circulation flow rate of the liquid medicine in the liquid medicine tank 107, and the liquid flow-limiting valve 1081 may be an SX21W-16P type flow-limiting valve, so as to control the change of the flow rate of the liquid medicine, when the liquid medicine and the chlorine gas are mixed in the ejector 1062 to generate high pressure and then flow into the liquid medicine tank 107, the pressure contained in the liquid medicine is released through the automatic opening and closing of the pressure relief valve 1082 in the pipeline, so that the pressure is adjusted, and the risk of disconnection of the interface of the circulation pipe 108 or deformation of the pipe body.
Referring to fig. 1, an axial flow fan 102 is installed on the first gas pipe 103, and the axial flow fan 102 guides flow along the direction from the electrolytic cell 101 to the chlorine gas supply device 104. In this embodiment, the axial flow fan 102 accelerates the transportation of chlorine gas from the electrolytic cell 101 to the chlorine gas supply device 104, thereby improving the production efficiency.
Referring to fig. 1 again, a check valve 1051 is installed on the second gas pipe 105, the check valve 1051 is a gas check valve, an overflow pipe 111 is connected to a pipe body of the second gas pipe 105 located between the chlorine supply device 104 and the check valve 1051, one end of the overflow pipe 111, which is far away from the second gas pipe 105, is connected to a chlorine temporary storage tank 112, and a stop valve 1111 is installed on the overflow pipe 111, and the stop valve 1111 is a manual-automatic integrated type. In this embodiment, the one-way valve 1051 limits that the chlorine in the second gas delivery pipe 105 cannot flow back, if one end of the ejector 1062 is blocked, the chlorine is delivered to enter the temporary chlorine storage tank 112 through the overflow pipe 111 after the flow of the front end of the one-way valve 1051 is stopped, and is stored, the stop valve 1111 on the overflow pipe 111 can be manually operated to open and close and also can be automatically operated to open and close by utilizing a manual-automatic integrated design, so that the chlorine cannot leak under the condition of negligence of workers, and the production safety is improved.
Referring to fig. 1-3, the present invention operates in the following manner:
after the etching production line is started, the etching solution is taken out from the chemical solution tank 107 by the etching machine 109 at the beginning end and sent into the etching production line, then the used etching solution is gathered by the waste solution tank 100 at the tail end of the etching production line and sent into the electrolytic tank 101 to be electrolyzed again to extract chlorine, the chlorine is introduced into the chlorine supply device 104 through the axial flow fan 102 on the gas pipe I103, then the chlorine enters the jet device 1062 along the gas pipe II 105 to be mixed with the etching solution at high pressure and then enters the chemical solution tank 107 to be dissolved in the process that the etching solution is circulated by the chemical solution tank 107, the etching solution in the chemical solution tank 107 is continuously supplemented when the etching solution is continuously extracted from the chemical solution tank 107 by the etching machine 109, and the redundant gas in the chemical solution tank 107 is recovered and discharged by the air draft mechanism 110.
The invention is described above with reference to the accompanying drawings, it is obvious that the invention is not limited to the above-described embodiments, and it is within the scope of the invention to adopt such insubstantial modifications of the inventive method concept and solution, or to apply the inventive concept and solution directly to other applications without modification.
Claims (8)
1. A device for recovering chlorine gas by an acid etching copper recovery system comprises a waste liquid tank (100), an electrolytic tank (101), an etching machine (109), a liquid medicine tank (107) and a gas-liquid mixing and circulating mechanism (106), and is characterized in that the etching machine (109) and the liquid medicine tank (107) are of a supply integrated structure, the etching machine (109) is arranged on one side of the starting end of an etching production line and is in feeding work connection with the etching production line, the waste liquid tank (100) is arranged at the tail end of the etching production line and stores used etching liquid, the electrolytic tank (101) is arranged on one side of the waste liquid tank (100) and recovers the etching liquid in the tank, and the electrolytic tank (101) is connected with a chlorine gas supply device (104) through a gas pipe I (103);
the gas-liquid mixing circulating mechanism (106) comprises a liquid medicine circulating pump (1061), an ejector (1062) is arranged at the water outlet end of the liquid medicine circulating pump (1061), the liquid medicine tank (107), the liquid medicine circulating pump (1061) and the ejector (1062) form circulating closed connection through a circulating pipe (108), and the ejector (1062) is connected with the chlorine gas supply equipment (104) through a gas pipe II (105).
2. The apparatus for recovering chlorine in an acid etching copper recovery system according to claim 1, wherein the liquid flow-limiting valve (1081) is installed on the pipe body of the circulation pipe (108) near the water outlet end of the chemical tank (107), and the pressure-relief valve (1082) is installed on the pipe body of the circulation pipe (108) near the water inlet end of the chemical tank (107).
3. The device for recovering chlorine gas in the acid etching copper recovery system according to claim 1, wherein an air draft mechanism (110) is arranged on one side of the etching machine (109), the air draft mechanism (110) comprises an air draft fan, and the air draft fan is connected with the top of the liquid medicine tank (107) through an air pipe.
4. The device for recovering chlorine of the acid etching copper recovery system according to claim 1, wherein an axial flow fan (102) is installed on the first gas conveying pipe (103), and the axial flow fan (102) guides flow in the direction from the electrolytic bath (101) to the chlorine gas supply device (104).
5. The device for recovering chlorine of the acid etching copper recovery system according to claim 1, wherein a one-way valve (1051) is installed on the second gas delivery pipe (105), and the one-way valve (1051) is a gas check valve.
6. The device for recovering chlorine in the acid etching copper recovery system according to claim 5, wherein an overflow pipe (111) is connected to the pipe body of the second gas pipe (105) between the chlorine supply device (104) and the one-way valve (1051), and one end of the overflow pipe (111) far away from the second gas pipe (105) is connected to a chlorine temporary storage tank (112).
7. The device for recovering chlorine of the acid etching copper recovery system according to claim 6, wherein the overflow pipe (111) is provided with a stop valve (1111), and the stop valve (1111) is manually and automatically integrated.
8. The apparatus for recovering chlorine gas in an acid etching copper recovery system as claimed in claim 1, wherein the outer wall of said circulation pipe (108) is provided with a heat-resistant insulating material layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010334297.0A CN111394725A (en) | 2020-04-24 | 2020-04-24 | Device for recovering chlorine gas by acid etching copper recovery system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010334297.0A CN111394725A (en) | 2020-04-24 | 2020-04-24 | Device for recovering chlorine gas by acid etching copper recovery system |
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| Publication Number | Publication Date |
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| CN111394725A true CN111394725A (en) | 2020-07-10 |
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| CN202010334297.0A Pending CN111394725A (en) | 2020-04-24 | 2020-04-24 | Device for recovering chlorine gas by acid etching copper recovery system |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002266086A (en) * | 2001-03-08 | 2002-09-18 | Nittetsu Mining Co Ltd | Method for regenerating etchant |
| CN105177583A (en) * | 2015-09-09 | 2015-12-23 | 成都虹华环保科技股份有限公司 | Method and system for circulating and regenerating zero-emission waste acidic etching solutions |
| CN109023373A (en) * | 2018-06-27 | 2018-12-18 | 江苏净拓环保科技有限公司 | System for chlorine treatment in acidity etching liquid recycling copper recovery system |
| CN109161895A (en) * | 2018-08-27 | 2019-01-08 | 安徽绿洲危险废物综合利用有限公司 | Acid copper chloride etching liquid copper reclaiming system and reclaiming method |
| CN212357397U (en) * | 2020-04-24 | 2021-01-15 | 深圳市京中康科技有限公司 | Device for recovering chlorine gas by acid etching copper recovery system |
-
2020
- 2020-04-24 CN CN202010334297.0A patent/CN111394725A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002266086A (en) * | 2001-03-08 | 2002-09-18 | Nittetsu Mining Co Ltd | Method for regenerating etchant |
| CN105177583A (en) * | 2015-09-09 | 2015-12-23 | 成都虹华环保科技股份有限公司 | Method and system for circulating and regenerating zero-emission waste acidic etching solutions |
| CN109023373A (en) * | 2018-06-27 | 2018-12-18 | 江苏净拓环保科技有限公司 | System for chlorine treatment in acidity etching liquid recycling copper recovery system |
| CN109161895A (en) * | 2018-08-27 | 2019-01-08 | 安徽绿洲危险废物综合利用有限公司 | Acid copper chloride etching liquid copper reclaiming system and reclaiming method |
| CN212357397U (en) * | 2020-04-24 | 2021-01-15 | 深圳市京中康科技有限公司 | Device for recovering chlorine gas by acid etching copper recovery system |
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