CN111376178A - Large-cutting-depth grinding wheel and preparation method thereof - Google Patents
Large-cutting-depth grinding wheel and preparation method thereof Download PDFInfo
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- CN111376178A CN111376178A CN202010320074.9A CN202010320074A CN111376178A CN 111376178 A CN111376178 A CN 111376178A CN 202010320074 A CN202010320074 A CN 202010320074A CN 111376178 A CN111376178 A CN 111376178A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
- B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/02—Compacting only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
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- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention belongs to the technical field of semiconductor processing, and particularly relates to a large-cutting-depth grinding wheel and a preparation method thereof. The large cutting and deep grinding wheel comprises the following raw materials in parts by weight: 14-21 parts of diamond, 28-46 parts of copper powder, 3-6 parts of graphite, 14-32 parts of carbonyl iron, 5-10 parts of corundum, 8-10 parts of phenolic resin and 1-2 parts of coupling agent. The grinding wheel of the invention meets the requirement of one-time feed amount of 10um/s, and the surface roughness value of the processed workpiece is below 400 nm.
Description
Technical Field
The invention belongs to the technical field of semiconductor processing, and particularly relates to a large-cutting-depth grinding wheel and a preparation method thereof.
Background
Silicon belongs to semiconductor materials, the semiconductor materials have wide application, and the silicon can be mainly used as an electronic rectifier, a silicon controlled rectifier, a silicon diode, a transistor, an integrated circuit, a solar cell and the like, and can also be used in the fields of Internet of things, artificial intelligence, vehicle-mounted intelligence and the like. The silicon crystal mainly comprises monocrystalline silicon and polycrystalline silicon, the purity of the silicon is mainly divided into 5-9N grade polycrystalline silicon and 9-12N grade monocrystalline silicon, and the higher the purity is, the higher the grade of the final processed product is. The method mainly comprises the steps of preparing a silicon wafer by cutting, grinding, polishing, slicing and other processes in the previous process, preparing an electronic device by thinning, cutting and other processes in the silicon wafer, grinding and polishing the silicon material and thinning and removing the silicon substrate in the actual processing process, and removing unnecessary silicon material.
Disclosure of Invention
In order to overcome the problems in the prior art, the invention provides a large-cutting-depth grinding wheel. The grinding wheel can grind single polysilicon, the feed amount of one-time feeding of 10um/s is met, and the roughness value of the surface of a processed workpiece is below 400 nm.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a large-cutting-depth grinding wheel comprises the following raw materials in parts by weight: 14-21 parts of diamond, 28-46 parts of copper powder, 3-6 parts of graphite, 14-32 parts of carbonyl iron, 5-10 parts of corundum, 8-10 parts of phenolic resin and 1-2 parts of coupling agent.
Preferably, the granularity of diamond is 200/230-270/325, the granularity of copper powder is 600-800 meshes, the granularity of graphite is 1200-1500 meshes, the granularity of carbonyl iron is more than 200 meshes, the granularity of corundum is w10-w20, the granularity of phenolic resin is 230-270 meshes, and the coupling agent is KH 792.
Specifically, the graphite and carbonyl iron are spherical, and the corundum is plate-shaped. Spherical graphite can enable the polishing effect to be better; the carbonyl iron has the main functions of improving the holding capacity of diamond grinding materials and improving the wear resistance of the grinding wheel, thereby influencing the durability of the grinding wheel; the corundum is used as an auxiliary abrasive, and the plate-shaped corundum has high strength, good toughness and good wear resistance.
The diamond is made of bare diamond (namely, unprocessed diamond), and is required to have good crystal form, high strength, more water chestnuts and good self-sharpening property.
The preparation method of the large cutting and grinding wheel comprises the following steps:
(1) dissolving phenolic resin in acetone to obtain a mixture A;
(2) mixing and sieving copper powder and carbonyl iron, and then mixing and sieving the copper powder and the carbonyl iron with diamond to obtain a mixture B;
(3) adding the mixture B and a coupling agent into the mixture A, and uniformly mixing to obtain a mixture C;
(4) drying the mixture C, mixing with corundum and graphite, and sieving to obtain a mixture D;
(5) and pressing and molding the mixture D to prepare the grinding wheel.
Preferably, in the step (2), the copper powder and the carbonyl iron are placed into a three-dimensional mixer to be mixed for 0.5-1.5h, then are sieved, and are mixed with diamond and sieved to obtain a mixture B.
Preferably, in the step (3), the mixture B and the coupling agent are added into the mixture A, stirred for 10-30min and mixed uniformly.
Preferably, the drying temperature of the mixture C in the step (4) is 70-90 ℃, and the drying time is 20-40 min.
Preferably, the copper powder and carbonyl iron in the step (2) are mixed and then sieved by a 200-mesh sieve.
The large-cutting-depth grinding wheel can be used for grinding single or polycrystalline silicon in semiconductor processing.
The invention has large cutting depth which can reach the feeding of 10um/s, the requirement of the grinding wheel layer is high hardness, the bonding agent holds the grinding material well, and the grinding material can not fall off and continuous sharpness is ensured when the large feeding is cut in, therefore, the principle of the invention is briefly introduced from the following contents.
The phenolic resin is pretreated (dissolved in acetone), the fluidity of the dissolved resin is considered to be good, the resin can be better wrapped on diamond and auxiliary materials, the holding force is enhanced, the acetone is volatilized at the later stage, and the mixture is directly pressed and molded into the grinding wheel. Because the load strength is high in the processing process and the requirement on cutting force is high, the requirement that the diamond must be subjected to continuous edge emergence in the grinding process to ensure certain sharpness is required, the conventional diamond with a good shape has high hardness but poor and insufficiently sharp edge emergence, and the grinding wheel is easy to dull and immovable.
Compared with the prior art, the invention has the beneficial effects that:
1. the grinding wheel can meet the requirement of feeding 10um/s at one time, and the roughness values of the surfaces of the processed single-crystal silicon and the processed polycrystalline silicon are less than 400 nm; the phenolic resin is pretreated, so that the phenolic resin can be better wrapped on diamond and auxiliary materials, and the holding force is enhanced;
2. selecting bare diamond to enhance the holding effect of the bare diamond and a bonding agent;
3. the grinding wheel prepared by the invention has a compact tissue structure in a microscopic view, so that the effect of grinding single polysilicon is good, and the service life of the grinding wheel is long.
Drawings
FIG. 1 is a schematic view of an abrasive layer of a grinding wheel;
FIG. 2 is a pictorial view of a grinding wheel manufactured in example 1;
FIG. 3 is a scanning electron micrograph of the surface of the grinding wheel according to example 3;
FIG. 4 is a scanning electron micrograph of the surface of the grinding wheel of comparative example 1;
FIG. 5 is a scanning electron micrograph of the surface of the grinding wheel of comparative example 2;
FIG. 6 is a scanning electron microscope image of the surface of the grinding wheel of example 3 after grinding;
FIG. 7 is a scanning electron microscope photograph of the ground surface of the grinding wheel of comparative example 1;
FIG. 8 is a scanning electron microscope photograph of the ground surface of the grinding wheel of comparative example 2;
FIG. 9 is a photograph of a workpiece ground with the grinding wheel of example 3;
FIG. 10 is a photograph of a workpiece ground with the grinding wheel of comparative example 1;
fig. 11 is a photograph of a workpiece ground with the grinding wheel of comparative example 2.
Detailed Description
The invention is further illustrated, but not limited, by the following examples and the accompanying drawings. The phenolic resin is Japanese Sumitomo 55529#, the phenolic resin is powder, and is called phenolic resin powder in the following, the manufacturer of bare diamond is Zhongnan diamond Co., Ltd, the manufacturer of graphite is Qingdao Haidao graphite Co., Ltd, the manufacturer of carbonyl iron is Jiangxi Yuean ultra-fine metal, the manufacturer of corundum is Shandong Hengjia high-purity aluminum industry science and technology Co., Ltd, and the manufacturer of copper powder is Qinghe county Tenghui metal material Co., Ltd. A schematic of the abrasive layer of the grinding wheel of the following example is shown in figure 1.
Example 1
The large cutting and grinding wheel of the embodiment is composed of the following raw materials in parts by weight:
diamond, particle size 200/230, 20.7 parts; 45.2 parts of copper powder with the granularity of 600 meshes; 3.1 portions of graphite with the granularity of 1200 meshes; the carbonyl iron passes through a 200-mesh screen, and 14 parts of carbonyl iron are added; corundum, granularity w20, 5.1 parts; 8.9 portions of phenolic resin powder with the granularity of 230 meshes; coupling agent KH792, analytically pure, 1.4 parts.
The preparation of the grinding wheel comprises the following steps:
(1) mixing phenolic resin powder in the formula with 300ml of acetone in a stainless steel basin and stirring by using an electric stirrer until the phenolic resin powder is completely dissolved in the acetone to form a liquid mixture, thus obtaining a mixture A;
(2) mixing copper powder and carbonyl iron in a common three-dimensional mixer for 1h, sieving the mixture for 5 times through a stainless steel sieve of 200 meshes, and sieving the mixture and diamond (200 meshes) for 5 times to obtain a mixture B;
(3) pouring the mixture B and a coupling agent KH792 into the mixture A in the step 1, and stirring for 20min by using an electric stirrer to obtain a mixture C;
(4) putting the mixture C (with certain viscosity) obtained in the step (3) into an oven at 80 ℃ to be dried for 30min, checking whether the mixture in a basin is in a semi-dry state, taking out the mixture in the semi-dry state, crushing the mixture by using a stainless steel spoon, sieving the crushed mixture by using an 80-mesh sieve, continuously sieving the crushed mixture for 3 times, checking whether the sieved mixture can smell the taste of acetone (the special spicy smell), and checking whether the acetone-free smell represents that the mixture is completely dried; then mixing with corundum and graphite, and sieving with a 200-mesh sieve to obtain a mixture D;
(5) and pressing and molding the mixture D to prepare the grinding wheel, wherein the specific molding process is as follows:
① putting the mixture D into a mould, then feeding into a forming hot press, keeping the temperature at 190 ℃ for 1h, and pressing into a ring shape, specifically, firstly heating the press to 190 ℃, then setting the initial pressure of the press to 2Mpa, keeping the temperature and pressure for 3min, then increasing the pressure to 5Mpa, releasing gas for 5 times in 2min, then keeping the pressure and temperature for 1h, and then unloading the mould for standby;
② cutting the grinding wheel ring formed in step ① into 30 equidistant grinding wheel arcs according to the requirements of the drawing;
③, feeding the block-shaped grinding wheel arc in the step ② into a muffle furnace, and sintering and hardening according to a sintering curve (namely, firstly preserving heat at 80 ℃ for 2 hours, then raising the temperature to 120 ℃ and preserving heat for 5 hours, then raising the temperature to 150 ℃ and preserving heat for 2 hours, then raising the temperature to 180 ℃ and preserving heat for 10 hours, and finally naturally cooling to room temperature and taking out the block-shaped grinding wheel arc);
④ the block grinding wheel arc hardened in step ③ is processed as shown in the drawing, the block grinding wheel arc needs to be bonded to a substrate, the substrate groove is circular, and finally the circular grinding wheel is processed, as shown in fig. 2.
Example 2
The large cutting and grinding wheel of the embodiment is composed of the following raw materials in parts by weight:
diamond, particle size 270/325, 14 parts; copper powder with the granularity of 800 meshes and 28.7 parts; 6 portions of graphite with the granularity of 1500 meshes; passing carbonyl iron through a 200-mesh screen, and then, 31.5 parts; corundum, granularity w10, 9.8 parts; 8.4 parts of phenolic resin powder with the granularity of 270 meshes; coupling agent KH792, analytically pure, 1.6 parts.
The preparation of the grinding wheel comprises the following steps:
(1) mixing phenolic resin powder in the formula with 260ml of acetone in a stainless steel basin and stirring by using an electric stirrer until the phenolic resin powder is completely dissolved in the acetone to form a liquid mixture, thus obtaining a mixture A;
(2) mixing copper powder and carbonyl iron in a common three-dimensional mixer for 1 hour, sieving the mixture for 5 times through a 240-mesh stainless steel sieve, and sieving the mixture and diamond (240 meshes) for 5 times to obtain a mixture B;
(3) pouring the mixture B and a coupling agent KH792 into the mixture A in the step 1, and stirring for 30min by using an electric stirrer to obtain a mixture C;
(4) putting the mixture C (with certain viscosity) obtained in the step 3 into a 70 ℃ oven to be dried for 30min, checking whether the mixture in a basin is in a semi-dry state, taking out the mixture in the semi-dry state, crushing the mixture by a stainless steel spoon, sieving the crushed mixture by a 100-mesh sieve, continuously sieving the crushed mixture for 3 times, checking whether the sieved mixture can smell the taste of acetone (the special spicy smell), and checking whether the acetone-free smell represents that the mixture is completely dried; then mixing with corundum and graphite, and sieving with a 200-mesh sieve to obtain a mixture D;
(5) and pressing and molding the mixture D to prepare the grinding wheel, wherein the specific molding process is as follows:
① putting the mixture D into a mould, then sending into a forming hot press, keeping the temperature at 185 ℃ for 1h, and pressing into a ring shape, specifically, firstly heating the press to 185 ℃, then keeping the initial pressure of the press at 2Mpa, keeping the temperature and the pressure for 2min, then increasing the pressure to 5Mpa, releasing gas for 5 times in 2min, then keeping the pressure and the temperature for 1h, and then unloading the mould for standby;
② cutting the grinding wheel ring formed in step ① into 30 equidistant grinding wheel arcs according to the requirements of the drawing;
③ the block-shaped grinding wheel arc of step ② is sent into a muffle furnace to be sintered and hardened according to the sintering curve (same as the example 1);
④ the block grinding wheel arc hardened in step ③ is processed according to the drawing requirements, the block grinding wheel arc needs to be bonded to a substrate, the substrate groove is circular, and finally the circular grinding wheel is processed.
Example 3
The large cutting and grinding wheel of the embodiment is composed of the following raw materials in parts by weight:
diamond, particle size 230/270, 18 parts; copper powder with the granularity of 800 meshes and 34.7 parts; 6 parts of graphite with the granularity of 1200 meshes; passing carbonyl iron through a 200-mesh screen, and 23.6 parts; corundum, granularity w14, 7.8 parts; 8.4 parts of phenolic resin powder with the granularity of 230 meshes; coupling agent KH792, analytically pure, 1.5 parts.
The preparation of the grinding wheel comprises the following steps:
(1) mixing phenolic resin powder in the formula with 300ml of acetone in a stainless steel basin and stirring by using an electric stirrer until the phenolic resin powder is completely dissolved in the acetone to form a liquid mixture, thus obtaining a mixture A;
(2) mixing copper powder and carbonyl iron in a common three-dimensional mixer for 1h, sieving the mixture for 5 times through a stainless steel sieve of 200 meshes, and sieving the mixture and diamond (200 meshes) for 5 times to obtain a mixture B;
(3) pouring the mixture B and a coupling agent KH792 into the mixture A in the step 1, and stirring for 30min by using an electric stirrer to obtain a mixture C;
(4) putting the mixture C (with certain viscosity) obtained in the step 3 into a 70 ℃ oven to be dried for 30min, checking whether the mixture in a basin is in a semi-dry state, taking out the mixture in the semi-dry state, crushing the mixture by a stainless steel spoon, sieving the crushed mixture by a 60-mesh sieve, continuously sieving the crushed mixture for 3 times, checking whether the sieved mixture can smell the taste of acetone (the special spicy smell), and the absence of the smell of acetone represents that the mixture is completely dried; then mixing with corundum and graphite, and sieving with a 200-mesh sieve to obtain a mixture D;
(5) and pressing and molding the mixture D to prepare the grinding wheel, wherein the specific molding process is as follows:
① putting the mixture D into a mold, then feeding into a molding hot press, keeping the temperature at 185 ℃ for 40min, and pressing into a ring shape, specifically, firstly heating the press to 185 ℃, then keeping the initial pressure of the press at 2Mpa, keeping the temperature and the pressure for 2min, then increasing the pressure to 5Mpa, discharging gas for 5 times in 2min, then keeping the pressure and the temperature for 40min, and then unloading the mold for standby;
② cutting the grinding wheel ring formed in step ① into 30 equidistant grinding wheel arcs according to the requirements of the drawing;
③ the block-shaped grinding wheel arc of step ② is sent into a muffle furnace to be sintered and hardened according to the sintering curve (same as the example 1);
④ the block grinding wheel arc hardened in step ③ is processed according to the drawing requirements, the block grinding wheel arc needs to be bonded to a substrate, the substrate groove is circular, and finally the circular grinding wheel is processed.
Comparative example 1
This comparative example was made on the basis of example 3, omitting the carbonyl iron and corundum from the batch of example 3, otherwise identical to example 3.
Comparative example 2
This comparative example was made on the basis of example 3, omitting the dissolution of the phenolic resin powder of step (1) in acetone in the production process of example 3, and the other contents were identical to those of example 3.
The grinding wheels prepared in example 3 and comparative examples 1 and 2 were subjected to scanning electron microscopy analysis, and see fig. 3, 4 and 5, respectively.
As can be seen from fig. 3 and 4, the diamond of comparative example 1 has a gap with the binder, and the abrasive is easily knocked off and loses the grinding force under a large cutting depth condition. As can be seen from fig. 3 and 5, the material in fig. 3 is more tightly and tightly combined than in fig. 5, and the cracks in fig. 5 are more numerous. That is, after the phenolic resin is dissolved in acetone in example 3, the bonding degree of the grinding material and the bonding agent of the grinding wheel prepared by the method is better than that of the grinding material and the bonding agent of the grinding wheel prepared by directly adopting the phenolic resin in comparative example 2. In comparative example 2, although the dissolution of the phenolic resin powder is only lacked, the bonding between the abrasive and the binder is not dense as shown in fig. 3, which shows that the holding force of the binder to the abrasive is insufficient, and when the abrasive is fed in a large cutting depth, the abrasive is prematurely fallen off due to the insufficient holding force, which is specifically shown in fig. 8.
The grinding effect of the grinding wheels prepared in example 3, comparative example 1 and comparative example 2 is shown in table 1, and the scanning electron micrographs of the grinding wheels prepared in example 3, comparative example 1 and comparative example 2 after grinding are respectively shown in fig. 6, fig. 7 and fig. 8; photographs of the workpieces ground by the grinding wheels prepared in example 3, comparative example 1 and comparative example 2 are shown in fig. 9, fig. 10 and fig. 11, respectively.
Table 1 grinding test of grinding wheels prepared in example 3 and comparative example 1
As can be seen from fig. 6 and 7, after the grinding wheel is ground, the abrasive grains in fig. 6 do not fall off, which indicates that the holding force of the bonding agent on the abrasive is strong, while fig. 7 indicates that after the grinding wheel is ground, the abrasive grains fall off seriously, the holding is not good, and the grinding wheel is easy to burn in the grinding process, that is, compared with comparative example 1, carbonyl iron and corundum auxiliary materials are added in example 3, so that the structure of the grinding wheel is compact, and the durability is enhanced. As shown in fig. 8, after the grinding wheel of comparative example 2 is ground, compared with example 3, in comparative example 2, the contact area between the resin powder and each raw material is reduced by only one step of dissolving the phenolic resin powder in advance, and the bonding degree is relatively reduced, although the structure is compact and the same as other raw materials, the abrasive falling phenomenon does not occur in the initial grinding stage, and as the number of the processed workpieces is increased, the grinding force is gradually increased to a certain degree and is greater than the holding force of the bonding agent to the abrasive, the abrasive falls from the bonding agent, which is why the grinding current is basically no different from that in example 3 at the beginning and the load is out of tolerance at the later stage.
As can be seen from fig. 9-11, after grinding by the grinding wheel, the workpiece in fig. 9 has uniform, fine and smooth texture without deep scratches, the roughness meets the requirement, the workpiece in fig. 10 has deeper texture and excessive roughness, the workpiece in fig. 11 has fine texture, but a texture messy texture crossing site appears, the roughness value does not exceed the excessive roughness value, but the apparent quality is affected.
Claims (8)
1. The large cutting-depth grinding wheel is characterized by comprising the following raw materials in parts by weight: 14-21 parts of diamond, 28-46 parts of copper powder, 3-6 parts of graphite, 14-32 parts of carbonyl iron, 5-10 parts of corundum, 8-10 parts of phenolic resin and 1-2 parts of coupling agent.
2. The large-cut-depth grinding wheel as claimed in claim 1, wherein the grain size of diamond is 200/230-270/325, the grain size of copper powder is 600-800 meshes, the grain size of graphite is 1200-1500 meshes, the grain size of carbonyl iron is more than 200 meshes, the grain size of corundum is w10-w20, the grain size of phenolic resin is 230-270 meshes, and the coupling agent is KH 792.
3. The large-cut-depth grinding wheel according to claim 1, wherein the graphite and carbonyl iron are spherical in shape, and the corundum is plate-like in shape.
4. A method of making a large-cut grinding wheel according to any one of claims 1 to 3, comprising the steps of:
(1) dissolving phenolic resin in acetone to obtain a mixture A;
(2) mixing and sieving copper powder and carbonyl iron, and then mixing and sieving the copper powder and the carbonyl iron with diamond to obtain a mixture B;
(3) adding the mixture B and a coupling agent into the mixture A, and uniformly mixing to obtain a mixture C;
(4) drying the mixture C, mixing with corundum and graphite, and sieving to obtain a mixture D;
(5) and pressing and molding the mixture D to prepare the grinding wheel.
5. The method for preparing the large-cutting-depth grinding wheel according to claim 4, wherein in the step (2), the copper powder and the carbonyl iron are placed into a three-dimensional mixer, mixed for 0.5-1.5h, sieved, mixed with the diamond and sieved to obtain a mixture B.
6. The method for preparing a large-cutting-depth grinding wheel according to claim 4, wherein the mixture B and the coupling agent are added into the mixture A in the step (3), stirred for 10-30min and uniformly mixed.
7. The method for preparing a large-cut-back grinding wheel according to claim 4, wherein the drying temperature of the mixture C in the step (4) is 70-90 ℃ and the drying time is 20-40 min.
8. Use of a large-cut grinding wheel according to any one of claims 1 to 3 in semiconductor processing, for grinding of mono-and poly-crystalline silicon.
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| CN105583743A (en) * | 2015-12-23 | 2016-05-18 | 郑州磨料磨具磨削研究所有限公司 | Diamond grinding wheel and manufacturing method thereof |
| CN106217274A (en) * | 2016-08-10 | 2016-12-14 | 吴迪 | A kind of preparation method of hexafluoropropylene oxide phenol-formaldehyde resin modified emery wheel |
| CN108747856A (en) * | 2018-05-10 | 2018-11-06 | 郑州磨料磨具磨削研究所有限公司 | A kind of resin wheel, preparation method and application for piezoelectric ceramics grinding |
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