CN111375514A - Precise edge-pasting spraying device suitable for COF substrate and using method thereof - Google Patents

Precise edge-pasting spraying device suitable for COF substrate and using method thereof Download PDF

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Publication number
CN111375514A
CN111375514A CN202010349031.3A CN202010349031A CN111375514A CN 111375514 A CN111375514 A CN 111375514A CN 202010349031 A CN202010349031 A CN 202010349031A CN 111375514 A CN111375514 A CN 111375514A
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CN
China
Prior art keywords
adhesive tape
photoresist
machine
spraying
cof substrate
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Pending
Application number
CN202010349031.3A
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Chinese (zh)
Inventor
戚爱康
计晓东
孙彬
沈洪
李晓华
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Jiangsu Shangda Electronics Co Ltd
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Jiangsu Shangda Electronics Co Ltd
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Application filed by Jiangsu Shangda Electronics Co Ltd filed Critical Jiangsu Shangda Electronics Co Ltd
Priority to CN202010349031.3A priority Critical patent/CN111375514A/en
Publication of CN111375514A publication Critical patent/CN111375514A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B16/00Spray booths
    • B05B16/20Arrangements for spraying in combination with other operations, e.g. drying; Arrangements enabling a combination of spraying operations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/12Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/16Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
    • B05B12/20Masking elements, i.e. elements defining uncoated areas on an object to be coated
    • B05B12/24Masking elements, i.e. elements defining uncoated areas on an object to be coated made at least partly of flexible material, e.g. sheets of paper or fabric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/16Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
    • B05B12/20Masking elements, i.e. elements defining uncoated areas on an object to be coated
    • B05B12/26Masking elements, i.e. elements defining uncoated areas on an object to be coated for masking cavities
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0221Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0406Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being air
    • B05D3/0413Heating with air

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  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The invention relates to a precise edge-pasting spraying device suitable for a COF substrate and a using method thereof, belonging to the technical field of electronic circuit boards. Comprises a precise adhesive tape sticking machine, a stepping type spraying machine and a two-end adhesive tape stripping machine; the precise adhesive tape sticking machine is arranged at the front end of the stepping type spraying machine, the two-end adhesive tape stripping machine is arranged at the rear end of the stepping type spraying machine, and the COF substrate sequentially passes through the precise adhesive tape sticking machine, the stepping type spraying machine and the two-end adhesive tape stripping machine to finish adhesive tape sticking, photoresist spraying and adhesive tape stripping operations. The adhesive tape is firstly pasted on the PF hole of the base material according to needs, the spraying photoresist is prevented from leaking to the back of the base material, then the spraying machine is used for spraying the photoresist, the uniform deposition is carried out on the surface of the base material, the adhesive tape which is pasted previously is removed through the adhesive tape peeling machines at the two ends, the base material of the adhesive tape is removed, the edge of the photoresist is very smooth, the good appearance performance of the coating is ensured, the powerful guarantee is provided for the improvement of the production efficiency and the quality, and a large amount of cost and time are saved for enterprises.

Description

Precise edge-pasting spraying device suitable for COF substrate and using method thereof
Technical Field
The invention relates to a precise edge-pasting spraying device suitable for a COF substrate and a using method thereof, belonging to the technical field of electronic circuit boards.
Background
With the continuous development of science and technology, electronic products are developed towards miniaturization, intellectualization, high performance and high reliability. The packaging substrate is transited from FPC to COF, the PTCH value of the COF substrate is smaller and smaller, pins for packaging are denser and more precise, and the integrated circuit packaging not only directly influences the performance of an integrated circuit, an electronic module and even a complete machine, but also restricts the miniaturization, low cost and reliability of the whole electronic system. In the whole market link with increasingly competitive development, the reduction of the production cost is a subject to be faced by COF enterprises. The line of COF base plate is made mainly by the photoresist, and the cost of photoresist is high or not little, reduces the cost of photoresist, can play the effect of instant effect to practicing thrift the cost, and good photoresist coating is the prerequisite of accurate line preparation, and the prerequisite guarantee that improves production yield is to improve the coating quality of photoetching machine.
The existing COF production is roll-to-roll, and the roller type coating is mostly adopted for coating photoresist, so that the following problems exist:
1) the roller type coating is to coat on the whole substrate surface, and due to the fluidity of the photoresist, the photoresist overflows into a nearby PF hole, and the back of a COF substrate is left along the hole wall, so that the back of the COF substrate is polluted, and after being dried, the photoresist can be wound into a reel, so that the indentation and the wrinkle of the substrate are caused, and the substrate is rejected badly.
2) In the roll-to-roll production process of COF products, a roll of COF substrate is bound to have a connection joint, and in one situation, if a roller coating unit does not avoid the COF substrate joint, the roller is seriously damaged. In another situation, if the roller coating unit avoids the COF substrate joint, the roller coating unit needs to be manually operated to retreat to avoid the joint, and the coating unit is manually reset after the joint runs past, so that the inaccuracy of the angle and the position can cause coating deviation and even cause product breakage due to uneven tension in the process of roll-to-roll transmission of the product in the manual adjustment process of the roller unit.
3) In roller type coating, the film thickness is mainly controlled by the rotating speed of a roller and the clearance of a substrate, and once the rotating speed and the spacing are not accurately controlled, the film thickness consistency of the whole roll of COF substrate after coating is difficult to ensure.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a precise edge-pasting spraying device suitable for a COF substrate and a using method thereof.
The invention is realized by the following technical scheme: the utility model provides a precision hem spraying device suitable for COF base plate which characterized in that: comprises a precise adhesive tape sticking machine, a stepping type spraying machine and a two-end adhesive tape stripping machine; the precise adhesive tape sticking machine is arranged at the front end of the stepping type spraying machine, the two-end adhesive tape stripping machine is arranged at the rear end of the stepping type spraying machine, and the COF substrate sequentially passes through the precise adhesive tape sticking machine, the stepping type spraying machine and the two-end adhesive tape stripping machine to finish adhesive tape sticking, photoresist spraying and adhesive tape stripping operations.
The precision adhesive tape sticking machine comprises a CCD (charge coupled device) alignment camera I, a pressing wheel I, an adhesive tape reel I, a transmission bearing wheel I and a bearing wheel I, wherein an adhesive tape is arranged in the adhesive tape reel I, the adhesive tape is pressed on a PF (chip on film) hole of a COF (chip on film) substrate through the pressing wheel I, the transmission bearing wheel I conveys the pressed COF substrate away and transmits the COF substrate to a stepping spraying machine through the bearing wheel I, the CCD alignment camera I is arranged at the rear end of the pressing wheel I, and the position of the adhesive tape is captured by the CCD alignment camera I in the transmission process of the COF substrate with the adhesive tape and is fed back to a;
the step-by-step spraying machine comprises a spraying machine body, a spraying unit and a positive-pressure vacuum cavity, wherein CCD (charge coupled device) alignment cameras II are arranged at two ends of the spraying machine body, the CCD alignment cameras II capture corresponding PF (positive-pressure coefficient) holes in COF (chip on film) substrates and use the PF holes as positioning spraying areas, high-pressure atomizing nozzles are arranged on the spraying unit, the spraying unit is connected with a drawing pump, the drawing pump is connected with a photoresist storage tank, photoresist enters from the photoresist storage tank and enters the spraying unit under the action of the drawing pump and is sprayed out from the high-pressure atomizing nozzles, and the photoresist is uniformly deposited on the surface of;
the two-end adhesive tape stripping machine comprises a pinch roller II, an adhesive tape reel II, a transmission bearing wheel II and a bearing wheel II, COF (chip on film) base materials pasted with adhesive tapes are transmitted from the stepping spraying machine by the bearing wheel II, the front ends of the adhesive tapes are wound on the adhesive tape reel II, and the COF base materials stripped by the transmission bearing wheel II are transmitted away.
The width of the adhesive tape is 3-10mm, the width of the adhesive tape is selected according to the size of an area needing to be coated with photoresist, the thickness of the adhesive tape is 2-10um PET adhesive tape, and the thickness of the adhesive tape is matched with the thickness of the photoresist needing to be sprayed.
The step-type spraying machine uniformly sprays the photoresist on the surface of the COF substrate which is not covered by the adhesive tape through the high-pressure atomizing nozzle, and the sprayed photoresist is quickly leveled under the action of the positive-pressure vacuum cavity.
The step-type coating machine is provided with a hot air drying mechanism, and the COF substrate is dried by the hot air drying mechanism.
In addition, the invention also provides a use method of the precise edge-pasting spraying device suitable for the COF substrate, which is characterized by comprising the following steps: firstly, replacing an adhesive tape reel I with an adhesive tape, pressing the adhesive tape on a COF (chip on film) substrate by a heating and pressurizing press wheel I, conveying the pressed COF substrate away by a conveying bearing wheel I, conveying the COF substrate to a stepping spraying machine by the bearing wheel I, capturing the position of the adhesive tape by a CCD (charge coupled device) alignment camera I in the conveying process of the COF substrate with the adhesive tape, and feeding the position back to a front-end controller;
CCD contraposition cameras II at two ends of the stepping spraying machine capture corresponding PF holes on the COF substrate and use the PF holes as a positioning spraying area, after contraposition is completed, the spraying machine body moves to an initial position, a spraying unit sprays photoresist, the sprayed photoresist is in an atomized drop shape and is uniformly deposited on the surface of the COF substrate, the photoresist cannot be quickly leveled in a frame body after spraying due to certain viscosity, a vacuum air blowing port is formed in a positive-pressure vacuum cavity, air can be uniformly blown to the COF substrate from the vacuum air blowing port, and the smoothness of the surface of the photoresist dripped in the frame body is ensured;
and finally, the COF substrate with the adhesive tape is conveyed from the stepping spraying machine by the bearing wheel II, the front end of the adhesive tape is wound on the adhesive tape reel II, the adhesive tape is peeled by the adhesive tape reel II, and the peeled COF substrate is conveyed away by the conveying bearing wheel II.
The invention has the beneficial effects that: according to needs, the adhesive tape is pasted on the PF hole of the base material, the spraying photoresist is prevented from leaking to the back of the base material, the spraying machine is used for spraying the photoresist, the high-pressure atomizing nozzle is arranged in the nozzle, the sprayed photoresist meets the condition that air is instantly atomized, the uniform deposition is carried out on the surface of the base material, the thickness of the photoresist can be controlled through the pressure and the speed of the nozzle, and the accurate coating is realized. The adhesive tape applied previously is removed through the adhesive tape stripping machines at the two ends, the base material of the adhesive tape is removed, the edge of the photoresist is very smooth, the good appearance performance of coating is guaranteed, and powerful guarantee is provided for the improvement of production efficiency and quality. The invention combines the actual production of COF substrates, and saves a great deal of cost and time for enterprises.
Drawings
The invention is further illustrated below with reference to the figures and examples.
FIG. 1 is a schematic view of the precise glue applicator and the step-by-step coater of the present invention;
FIG. 2 is a schematic view of a two-end tape stripper of the present invention;
FIG. 3 is a schematic view of a step sprayer spray unit of the present invention;
FIG. 4 is a schematic diagram of the spray effect of the high pressure atomizing nozzle of the present invention;
FIG. 5 is a schematic view showing the effect of the COF substrate tape of the present invention after application;
FIG. 6 is a schematic diagram showing the effect of the COF substrate coated with the photoresist of the present invention;
fig. 7 is a schematic view showing the effect of the COF substrate of the present invention after peeling the tape.
Detailed Description
As shown in fig. 1 to 7, the precise edge-pasting spraying device suitable for COF substrates is characterized in that: comprises a precise adhesive tape sticking machine, a stepping type spraying machine and a two-end adhesive tape stripping machine; the precise adhesive tape sticking machine is arranged at the front end of the stepping type spraying machine, the two-end adhesive tape stripping machines are arranged at the rear end of the stepping type spraying machine, and the COF substrate 1 sequentially passes through the precise adhesive tape sticking machine, the stepping type spraying machine and the two-end adhesive tape stripping machines to complete the operations of adhesive tape 2 sticking, photoresist 3 spraying and adhesive tape 2 stripping.
The precise adhesive tape sticking machine comprises a CCD (charge coupled device) alignment camera I4, a pressing wheel I5, an adhesive tape reel I6, a transmission bearing wheel I7 and a bearing wheel I8, wherein an adhesive tape 2 is arranged in the adhesive tape reel I6, the adhesive tape 2 is pressed on a PF (particle Filter) hole 9 of a COF (chip on film) substrate 1 through the pressing wheel I5, the transmission bearing wheel I7 conveys the pressed COF substrate 1 away and transmits the COF substrate 1 to a stepping spraying machine through the bearing wheel I8, the CCD alignment camera I4 is arranged at the rear end of the pressing wheel I5, the CCD alignment camera I4 is an edge-walking CCD (charge coupled device), the edge of the adhesive tape 2 is consistent with the COF substrate 1, if the edge of the adhesive tape 2 is inconsistent with the COF substrate 1, the CCD alignment camera I4 can capture the adhesive tape and feed back to a front-end controller, and the controller receives a feedback signal and immediately adjusts;
the stepping type spraying machine comprises a spraying machine body 10, a spraying unit 11 and a positive pressure vacuum cavity 12, wherein CCD (charge coupled device) alignment cameras II 13 are arranged at two ends of the spraying machine body 10, the CCD alignment cameras II 13 capture corresponding PF holes 9 on a COF (chip on film) substrate 1 and use the PF holes 9 as positioning spraying areas, servo motor control is arranged at the rear ends of the CCD alignment cameras II 13, the CCD alignment cameras II 13 can move left and right to be automatically adjusted according to the positions of the PF holes 9, the captured PF holes 9 are guaranteed to be complete and accurate, so that the spraying position is guaranteed to be accurate, a high-pressure atomizing nozzle 14 is arranged on the spraying unit 11, the spraying unit 11 is connected with a drawing pump 15, the drawing pump 15 is connected with a photoresist storage tank 16, photoresist 3 enters from the photoresist storage tank 16 to the spraying unit 11 to be sprayed from the high-pressure atomizing nozzle 14 under the action of the drawing; a vacuum blowing port is arranged in the positive pressure vacuum cavity 12, and air can be uniformly blown to the COF substrate 1 from the vacuum blowing port, so that the smoothness of the surface of the photoresist dripped in the frame is ensured. The thickness of the sprayed photoresist 3 can be precisely controlled. The thickness H of the photoresist 3 = the pressure T of the actual ejection multiplied by the substrate transfer speed S.
The two-end adhesive tape stripping machine comprises a pinch roller II 17, an adhesive tape reel II 18, a transmission bearing wheel II 19 and a bearing wheel II 20, the COF substrate 1 with the adhesive tape 2 is transmitted from the stepping spraying machine by the bearing wheel II 20, the front end of the adhesive tape 2 is wound on the adhesive tape reel II 18, and the stripped COF substrate 1 is transmitted away by the transmission bearing wheel II 19.
The width of the adhesive tape 2 is 3-10mm, the width of the adhesive tape 2 is selected according to the size of the area needing to be coated with the photoresist 3, the thickness of the adhesive tape 2 is 2-10um PET adhesive tape, and the thickness of the adhesive tape 2 is matched with the thickness of the photoresist 3 needing to be sprayed.
The step-type spraying machine uniformly sprays the photoresist 3 on the surface of the COF substrate 1 which is not covered by the adhesive tape 2 through the high-pressure atomizing nozzle 14, and the sprayed photoresist 3 is quickly leveled under the action of the positive-pressure vacuum cavity 12. The photoresist 3 is sprayed out through high pressure and meets air to be instantly atomized, and finally, the photoresist is uniformly deposited on the surface of the COF substrate 1. The high pressure mist nozzle 14 is easy to replace and disassemble, and can be disassembled and cleaned when the machine stops working for a long time, so as to prevent the photoresist from solidifying and blocking the nozzle.
The step-type coating machine is provided with a hot air drying mechanism, and the COF substrate 1 is dried through the hot air drying mechanism.
In addition, the invention also provides a use method of the precise edge-pasting spraying device suitable for the COF substrate, which is characterized by comprising the following steps: firstly, an adhesive tape reel I6 is replaced with an adhesive tape 2, the adhesive tape 2 is pressed on a COF substrate 1 through a heating and pressurizing press wheel I5, a transmission bearing wheel I7 conveys the pressed COF substrate 1 away, the COF substrate 1 is transmitted to a stepping spraying machine through a bearing wheel I8, and the position of the adhesive tape 2 is captured by a CCD (charge coupled device) contraposition camera I4 and fed back to a front-end controller in the transmission process of the COF substrate 1 with the adhesive tape 2;
CCD contraposition cameras II 13 at two ends of the stepping spraying machine capture corresponding PF holes 9 on the COF substrate 1 and use the PF holes 9 as a positioning spraying area, after contraposition is completed, a spraying machine body 10 moves to an initial position, a spraying unit 11 sprays photoresist 3, the sprayed photoresist 3 is in an atomized droplet shape and is uniformly deposited on the surface of the COF substrate 1, the photoresist 3 cannot be quickly leveled in a frame body after spraying due to certain viscosity, a vacuum blowing port is formed in a positive pressure vacuum cavity 12, and the photoresist 3 which is dripped in the frame body can be uniformly blown to the COF substrate 1 from the vacuum blowing port, so that the surface smoothness of the photoresist 3 in the frame body is ensured;
and finally, the COF substrate 1 with the adhesive tape 2 is conveyed from the stepping spraying machine by a bearing wheel II 20, the front end of the adhesive tape 2 is wound on an adhesive tape reel II 18, the adhesive tape reel II 18 peels off the adhesive tape 2, and the peeled COF substrate 1 is conveyed away by a conveying bearing wheel II 19.

Claims (6)

1. The utility model provides a precision hem spraying device suitable for COF base plate which characterized in that: comprises a precise adhesive tape sticking machine, a stepping type spraying machine and a two-end adhesive tape stripping machine; the precise adhesive tape sticking machine is arranged at the front end of the stepping type spraying machine, the two-end adhesive tape stripping machines are arranged at the rear end of the stepping type spraying machine, and the COF substrate (1) sequentially passes through the precise adhesive tape sticking machine, the stepping type spraying machine and the two-end adhesive tape stripping machines to finish the operations of adhesive tape (2) sticking, photoresist (3) spraying and adhesive tape (2) stripping.
2. The precise edge-pasting spraying device suitable for the COF substrate as claimed in claim 1, wherein: the precision adhesive tape sticking machine comprises a CCD (charge coupled device) alignment camera I (4), a pressing wheel I (5), an adhesive tape reel I (6), a transmission bearing wheel I (7) and a bearing wheel I (8), an adhesive tape (2) is arranged in the adhesive tape reel I (6), the adhesive tape (2) is pressed on a PF (9) of a COF (chip on film) substrate (1) through the pressing wheel I (5), the transmission bearing wheel I (7) conveys the pressed COF substrate (1) away and transmits the COF substrate to a stepping spraying machine through the bearing wheel I (8), the CCD alignment camera I (4) is arranged at the rear end of the pressing wheel I (5), and the COF substrate (1) with the adhesive tape (2) is captured by the CCD alignment camera I (4) in the transmission process and fed back to a front end controller;
the stepping type coating machine comprises a coating machine body (10), a coating unit (11) and a positive pressure vacuum cavity (12), CCD (charge coupled device) alignment cameras II (13) are arranged at two ends of the coating machine body (10), the CCD alignment cameras II (13) capture corresponding PF holes (9) on a COF (chip on film) substrate (1) and use the PF holes (9) as positioning coating areas, a high-pressure atomizing nozzle (14) is arranged on the coating unit (11), the coating unit (11) is connected with a drawing pump (15), the drawing pump (15) is connected with a photoresist storage tank (16), photoresist (3) enters the coating unit (11) from the photoresist storage tank (16) under the action of the drawing pump (15) and is ejected from the high-pressure atomizing nozzle (14), and the photoresist is uniformly deposited on the surface of the COF substrate (1);
the two-end adhesive tape stripping machine comprises a pinch roller II (17), an adhesive tape reel II (18), a transmission bearing wheel II (19) and a bearing wheel II (20), the COF base material (1) pasted with the adhesive tape (2) is transmitted from the stepping spraying machine by the bearing wheel II (20), the front end of the adhesive tape (2) is wound on the adhesive tape reel II (18), and the stripped COF base material (1) is conveyed away by the transmission bearing wheel II (19).
3. The precise edge-pasting spraying device suitable for the COF substrate as claimed in claim 1, wherein: the width of the adhesive tape (2) is 3-10mm, the width of the adhesive tape (2) is selected according to the size of an area coated with the photoresist (3) as required, the thickness of the adhesive tape (2) is 2-10um PET adhesive tape, and the thickness of the adhesive tape (2) is matched with the thickness of the photoresist (3) to be sprayed.
4. The precise edge-pasting spraying device suitable for the COF substrate as claimed in claim 1, wherein: the step-type spraying machine uniformly sprays the photoresist (3) on the surface of the COF substrate (1) which is not covered by the adhesive tape (2) through the high-pressure atomizing nozzle (14), and the sprayed photoresist (3) is quickly leveled under the action of the positive-pressure vacuum cavity (12).
5. The precise edge-pasting spraying device suitable for the COF substrate as claimed in claim 1, wherein: the step-type coating machine is provided with a hot air drying mechanism, and the COF substrate (1) is dried through the hot air drying mechanism.
6. The use method of the precise edge-pasting spraying device suitable for the COF substrate as claimed in any one of claims 1 to 5, is characterized by comprising the following steps: firstly, replacing an adhesive tape reel I (6) with an adhesive tape (2), pressing the adhesive tape (2) on a COF (chip on film) substrate (1) through a heating and pressurizing press wheel I (5), conveying the pressed COF substrate (1) away through a conveying bearing wheel I (7), and conveying the COF substrate (1) to a stepping spraying machine through a bearing wheel I (8), wherein the position of the adhesive tape (2) is captured by a CCD (charge coupled device) alignment camera I (4) in the conveying process of the COF substrate (1) with the adhesive tape (2) attached, and the position is fed back to a front-end controller;
CCD contraposition cameras II (13) at two ends of the stepping spraying machine capture corresponding PF holes (9) on the COF substrate (1) and use the PF holes (9) as a positioning spraying area, after contraposition is completed, a spraying machine body (10) moves to an initial position, a spraying unit (11) sprays photoresist (3), the sprayed photoresist (3) is in a fog-like dripping shape and is uniformly deposited on the surface of the COF substrate (1), the photoresist (3) has certain viscosity and cannot be quickly leveled in a frame body after spraying, a vacuum blowing port is formed in a positive pressure vacuum cavity (12), air can be uniformly blown to the COF substrate (1) from the vacuum blowing port, and the surface smoothness of the photoresist (3) in the frame body is ensured;
and finally, the COF substrate (1) with the adhesive tape (2) is conveyed from the stepping spraying machine by a bearing wheel II (20), the front end of the adhesive tape (2) is wound on an adhesive tape reel II (18), the adhesive tape reel II (18) peels off the adhesive tape (2), and the peeled COF substrate (1) is conveyed away by a conveying bearing wheel II (19).
CN202010349031.3A 2020-04-28 2020-04-28 Precise edge-pasting spraying device suitable for COF substrate and using method thereof Pending CN111375514A (en)

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CN112221891A (en) * 2020-09-11 2021-01-15 衡阳华灏新材料科技有限公司 Stepping test type coating method for COF substrate

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