CN111370597B

CN111370597B - Display substrate, manufacturing method thereof and display device

Info

Publication number: CN111370597B
Application number: CN202010197716.0A
Authority: CN
Inventors: 张磊; 何源; 刘珂
Original assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Priority date: 2020-03-19
Filing date: 2020-03-19
Publication date: 2023-07-04
Anticipated expiration: 2040-03-19
Also published as: CN111370597A

Abstract

The embodiment of the disclosure discloses a display substrate, a manufacturing method thereof and a display device, relates to the technical field of display, and is used for realizing patterning of electrodes and ensuring effective separation between electrodes corresponding to different pixels. The manufacturing method of the display substrate comprises the following steps: a substrate is provided, and a first electrode layer is formed on one side of the substrate. A pixel defining layer is formed on a surface of the first electrode layer facing away from the substrate. A passivation layer is formed on a surface of the exposed pixel defining layer facing away from the substrate, the passivation layer including a plurality of first openings. And developing the pixel defining layer to form second openings corresponding to the first openings respectively. The orthographic projection of the first opening on the substrate is positioned in the orthographic projection of the corresponding second opening on the substrate, and the first opening and the second opening form a second electrode isolation groove. The display substrate, the manufacturing method thereof and the display device are used for isolating adjacent cathodes in the OLED substrate.

Description

Display substrate, manufacturing method thereof and display device

Technical Field

The disclosure relates to the technical field of display, in particular to a display substrate, a manufacturing method thereof and a display device.

Background

An OLED (Organic Light Emitting Diode) display device has a series of advantages of self-luminescence, fast response speed, high brightness, full viewing angle, flexible display, etc., and thus is one of the display devices with great competition and development prospects.

According to different OLED driving modes in the OLED display device, the OLED display device comprises an Active-matrix organic light emitting diode (AMOLED) display device and a Passive-matrix organic light emitting diode (PMOLED) display device.

Disclosure of Invention

It is an aim of some embodiments of the present disclosure to provide a display substrate, a manufacturing method thereof, and a display device, for patterning electrodes (e.g. cathodes of OLEDs) and ensuring effective separation between electrodes corresponding to different sub-pixels.

In order to achieve the above objective, some embodiments of the present disclosure provide the following technical solutions:

in a first aspect, a method for manufacturing a display substrate is provided. The manufacturing method of the display substrate comprises the following steps: a substrate is provided, and a patterned first electrode layer is formed on one side of the substrate. A pixel defining layer is formed on a surface of the first electrode layer facing away from the substrate, and the pixel defining layer is exposed. A passivation layer is formed on a surface of the exposed pixel defining layer facing away from the substrate, the passivation layer including a plurality of first openings. The pixel defining layer is developed, and a second opening is formed in a portion of the pixel defining layer corresponding to the first opening. The orthographic projection of the first opening on the substrate is positioned in the orthographic projection of the corresponding second opening on the substrate, and the first opening and the second opening form a second electrode isolation groove.

In an embodiment of the present disclosure, the second electrode isolation groove is composed of a superposition of the second opening in the pixel defining layer and the corresponding first opening in the passivation layer. In this way, in the process of manufacturing the display substrate, the exposure process of the pixel defining layer is finished first, after the passivation layer and the subsequent processes such as the first opening in the passivation layer are manufactured, the region to be formed with the second opening in the pixel defining layer is then developed and removed, so that adverse effects on the second opening in the pixel defining layer caused by the passivation layer and the subsequent manufacturing processes of other film layers can be avoided, for example, the passivation layer or other film layers remain and fill in the second opening, and the forming shape of the second opening is affected.

In this way, under the condition that the orthographic projection of the first opening on the substrate is ensured to be positioned in the orthographic projection of the corresponding second opening on the substrate, the second opening in the pixel defining layer and the corresponding first opening in the passivation layer can be utilized to form the second electrode isolation groove which is relatively clear and sharp in edge, is similar to an inverted T shape and has enough groove depth, thereby effectively realizing the patterning of the second electrode layer and ensuring that the second electrodes (such as the cathodes of the OLED) corresponding to different sub-pixels can be effectively isolated.

In summary, compared with the related art in which the second electrode isolation groove is formed by the first recess groove in the planarization layer and the first opening in the passivation layer, and the pixel defining layer is formed on the surface of the passivation layer facing away from the substrate, the manufacturing method of the display substrate provided by the embodiment of the application effectively simplifies the manufacturing process of the display substrate, can ensure the forming effect of the second electrode isolation groove in the display substrate, and avoids the problem that the second electrode isolation groove is formed first and then is filled with the residual of the subsequent film layer, so that patterning of the second electrode (for example, the cathode of the OLED) can be effectively realized by using each second electrode isolation groove, and effective isolation between the second electrodes corresponding to different sub-pixels can be ensured.

In some embodiments, the method of fabricating a display substrate further includes, prior to developing the pixel defining layer: a spacer layer is formed on a surface of the passivation layer facing away from the substrate.

In some embodiments, the fabrication material of the pixel defining layer includes a positive photoresist. Exposing the pixel defining layer includes exposing a portion of the pixel defining layer to be removed.

In some embodiments, where the method of fabricating a display substrate includes forming a spacer layer, the spacer layer is fabricated from the same material as the pixel defining layer. Developing the pixel defining layer, further comprising: the spacer layer and the pixel defining layer are developed by a one-time development process to obtain a patterned spacer layer and a patterned pixel defining layer.

In some embodiments, forming a passivation layer on a surface of the exposed pixel defining layer facing away from the substrate includes: and forming a passivation film on the surface of the exposed pixel defining layer, which is away from the substrate, by adopting a vapor deposition process, wherein the deposition temperature of the vapor deposition process is lower than a first threshold value. And carrying out dry etching on the passivation film to obtain the passivation layer.

In a second aspect, a display substrate is provided. The display substrate is manufactured by adopting the manufacturing method of the display substrate provided by the technical scheme. The display substrate includes: the pixel electrode structure comprises a substrate, a plurality of first electrodes arranged on the substrate, and a pixel defining layer and a passivation layer which are stacked on the surfaces of the plurality of first electrodes, which are away from the substrate. Wherein the passivation layer includes a plurality of first openings. The pixel defining layer includes second openings in one-to-one correspondence with the first openings. The orthographic projection of the first opening on the substrate is positioned in the orthographic projection of the corresponding second opening on the substrate, and the first opening and the second opening form a second electrode isolation groove.

In some embodiments, the display substrate further comprises a plurality of spacers. A plurality of spacers are dispersed on a surface of the passivation layer facing away from the substrate and/or on a surface of the pixel defining layer not covered by the passivation layer.

In some embodiments, the pixel defining layer further includes a plurality of third openings in one-to-one correspondence with the first electrodes. Portions of the first electrodes are exposed in the corresponding third openings. The passivation layer does not cover the plurality of third openings. The display substrate further includes a light emitting layer and a second electrode layer stacked on a side of the passivation layer facing away from the substrate. The light-emitting layers and the second electrode layers in the adjacent two third openings are separated by corresponding second electrode separation grooves.

In some embodiments, the orthographic projection shape of the second opening on a plane perpendicular to the substrate comprises an inverted trapezoid.

The beneficial effects achieved by the display substrate provided by the embodiments of the present disclosure are the same as those achieved by the manufacturing method of the display substrate provided by the above technical solution, and are not described herein in detail.

In a third aspect, a display device is provided. The display device comprises the display substrate provided by the technical scheme.

The beneficial effects achieved by the display device provided by the embodiment of the present disclosure are the same as those achieved by the display substrate provided by the above technical solution, and will not be described in detail herein.

Drawings

The accompanying drawings, which are included to provide a further understanding of embodiments of the disclosure and are incorporated in and constitute a part of this disclosure, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure and not to limit the disclosure unduly. In the drawings:

FIG. 1 is a partial cross-sectional view of a display substrate according to the related art;

FIG. 2 is a flow chart of a manufacturing process of the display substrate shown in FIG. 1;

fig. 3 is a schematic top view of a display substrate according to an embodiment of the disclosure;

FIG. 4 is a cross-sectional view of the display substrate shown in FIG. 3 in the AA' direction;

FIG. 5 is a schematic cross-sectional view of the display substrate shown in FIG. 3 in the AA' direction;

FIG. 6 is a diagram of a manufacturing process of the display substrate shown in FIG. 4;

FIG. 7 is a diagram showing a manufacturing process of the display substrate shown in FIG. 5;

fig. 8 is a flowchart of a method for manufacturing a display substrate according to an embodiment of the disclosure;

fig. 9 is a flowchart of another method for manufacturing a display substrate according to an embodiment of the disclosure.

Detailed Description

In order to facilitate understanding, the technical solutions provided by some embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. It is obvious that the described embodiments are only some embodiments of the proposed solution, but not all embodiments. All other embodiments that are available to those of skill in the art based on some embodiments of the present disclosure are within the scope of the present disclosure.

Currently, as shown in fig. 1 and 2, in an OLED display device, an OLED substrate includes at least: a substrate 1, and a planarization layer 9, a passivation layer 4, a first electrode layer, a pixel defining layer 3, a spacer layer 6, a light emitting layer 7, and a second electrode layer 8, which are sequentially disposed on the substrate 1. The first electrode layer is an anode layer and comprises a plurality of anodes. The second electrode layer 8 is a cathode layer. The pixel defining layer 3 has opening regions in one-to-one correspondence with a plurality of anodes. The portions of both the light-emitting layer 7 and the cathode layer located within each open area constitute an OLED with the corresponding anode. The passivation layer 4 is provided with a plurality of first openings 41, and the planarization layer 9 is provided with first countersinks 91 corresponding to the first openings 41 one by one. Each of the first countersinks 91 overlaps the corresponding first opening 41 and may serve as a cathode barrier groove 51, thereby patterning the cathode layer, i.e., obtaining a one-to-one correspondence of cathodes with the sub-pixels. And further, the independent control of the working states of all the sub-pixels can be realized.

The process of manufacturing the OLED substrate is generally as shown in (a) to (j) in fig. 2.

Referring to fig. 2 (a), a substrate 1 is provided, and a planarization layer 9 and a passivation layer 4 are sequentially formed on the substrate 1.

Here, the substrate 1 is not a blank substrate, and a pixel circuit layer is formed on the surface thereof, that is, at least pixel driving circuits corresponding to the sub-pixels respectively are formed, and each pixel driving circuit includes at least one thin film transistor and at least one storage capacitor. The film structure of the pixel circuit layer is related to the type of thin film transistor.

As shown in fig. 1, the thin film transistor is exemplified by a bottom gate thin film transistor, and the film layer structure of the corresponding pixel circuit layer includes a patterned gate layer 11, a gate insulating layer 12, a patterned semiconductor layer 13, a patterned source-drain electrode layer (including a source electrode 14 and a drain electrode 15), and an interlayer insulating layer 16, which are sequentially disposed.

The planarization layer 9 and the passivation layer 4 are sequentially stacked on the surface of the interlayer insulating layer 16.

Referring to fig. 2 (b), the passivation layer 4 is patterned, and at least a plurality of first openings 41 are formed in the passivation layer 4. Then, with the passivation layer 4 as a mask, a first recess 91 is formed in the planarizing layer 9 at a portion corresponding to each first opening 41. Each first countersink 91 overlaps the corresponding first opening 41, and may serve as a cathode separation groove 51.

Referring to fig. 2 (c), a first electrode layer is formed on the surface of the passivation layer 4 facing away from the substrate 1 and the surface of the planarization layer 9 not covered by the passivation layer 4.

Referring to fig. 2 (d), the first electrode layer is patterned to obtain a plurality of first electrodes 2 corresponding to the sub-pixels one by one.

Here, each first electrode 2 can be connected to the drain of one thin film transistor in the corresponding pixel driving circuit through the corresponding opening in the planarization layer 9.

Referring to fig. 2 (e), a spin-coating process is used to fabricate the pixel defining layer 3 on the surface of the passivation layer 4 facing away from the substrate 1 and on the surface of the first electrode layer facing away from the substrate 1.

The pixel defining layer 3 is typically formed of a light-transmitting resin, and the spin-coated pixel defining layer 3 fills up each cathode barrier groove 51.

Referring to fig. 2 (f), the pixel defining layer 3 is patterned, at least a portion of the pixel defining layer 3 located in each cathode isolation groove 51 is removed, and an opening region 33 is formed at a portion of the pixel defining layer 3 corresponding to each first electrode 2.

Since the first countersink 91 in the cathode isolation groove 51 is made by using the corresponding first opening 41 in the passivation layer 4 as a mask, the opening size of the first opening 41 in the same cathode isolation groove 51 is smaller than the opening size of the first countersink 91. In this way, during the process of patterning the pixel defining layer 3, the portion of the pixel defining layer 3 located in the cathode barrier groove 51 is difficult to be removed entirely, that is, residues are generated in the cathode barrier groove 51, under the influence of the exposure and development process.

Referring to fig. 2 (g), a spacer layer 6 is formed on the surface of the pixel defining layer 3 facing away from the substrate 1 by a spin-coating process.

The spacer layer 6 is typically made of a light-transmitting resin, and the spin-coated spacer layer 6 fills up the cathode separator grooves 51.

Referring to fig. 2 (h), the spacer layer 6 is patterned to remove at least the portion of the spacer layer 6 located in each cathode isolation groove 51 and form a plurality of spacers.

Similarly, during the process of patterning the spacer layer 6, the portion of the spacer layer 6 located in the cathode barrier groove 51 is difficult to be removed entirely, i.e., residues are generated in the cathode barrier groove 51, under the influence of the exposure and development process.

Then, as shown in fig. 2 (i) and (j), a light-emitting layer 7 and a second electrode layer 8 are sequentially formed on the side of the spacer layer 6 facing away from the substrate 1 by an evaporation process. Wherein the light emitting layer 7 is formed in the opening region 33 of the pixel defining layer 3 corresponding to each first electrode 2 through a metal mask. The second electrode layer 8 may be entirely evaporated so that the second electrode layer 8 is partitioned by the cathode partition grooves 51.

However, since the partial materials of the pixel defining layer 3 and the spacer layer 6 remain in the cathode barrier groove 51, the shape profile of the cathode barrier groove 51 is regular and smooth, and the second electrode layer 8 is easily stuck on the inner wall of the cathode barrier groove 51 during the process of manufacturing the second electrode layer 8, thereby making it difficult for the second electrode layer 8 to be effectively blocked by the cathode barrier groove 51.

Based on this, referring to fig. 3 and 4, some embodiments of the present disclosure provide a display substrate. The display substrate includes: a substrate 1, a plurality of first electrodes 2 provided on the substrate 1, and a pixel defining layer 3 and a passivation layer 4 provided on a surface of the plurality of first electrodes 2 facing away from the substrate 1.

The passivation layer 4 includes a plurality of first openings 41. The pixel defining layer 3 includes second openings 31 in one-to-one correspondence with the first openings 41. The orthographic projection of each first opening 41 on the substrate 1 is located within the orthographic projection of the corresponding second opening 31 on the substrate 1, and the first opening 41 and the second opening 31 constitute the second electrode-blocking groove 5.

It will be appreciated that the substrate 1 is provided with pixel driving circuits respectively connected to the first electrodes 2. The pixel driving circuit is generally formed by at least one thin film transistor (Thin Film Transistor, TFT for short) and at least one storage capacitor connected in series-parallel. Alternatively, the film layer structure of the pixel driving circuit is different depending on the different types of thin film transistors, for example, a top gate type thin film transistor or a bottom gate type thin film transistor. The embodiment of the disclosure is not limited in this way, and the setting can be selected according to actual requirements.

It should be noted that referring to fig. 4 and 5, the pixel defining layer 3 further includes a plurality of third openings 32 corresponding to the first electrodes 2 one by one. A portion of each first electrode 2 is exposed within the corresponding third opening 32. The passivation layer 4 does not cover the respective third openings 32.

Here, the third opening 32 corresponds to an opening region of the pixel defining layer 3 for defining each sub-pixel, that is, a region of the pixel defining layer 3 for forming each light emitting device.

With continued reference to fig. 4 and 5, the display substrate further includes a light emitting layer 7 and a second electrode layer 8 sequentially stacked on a side of the passivation layer 4 facing away from the substrate 1. The light-emitting layer 7 is formed in each third opening 32 using a metal mask. The second electrode layers 8 located in the adjacent two third openings 32 are partitioned by the corresponding second electrode partition grooves 5. In this way, the first electrode 2, the portion of the light-emitting layer 7, and the portion of the second electrode layer 8, which correspond to each third opening 32, constitute a light-emitting device corresponding to the sub-pixel.

Optionally, the light emitting device comprises an OLED or a quantum dot light emitting diode (Quantum Dot Light Emitting Diodes, QLED for short).

In addition, the first electrode 2 is an anode, and the second electrode layer 8 is a cathode layer; alternatively, the first electrode 2 is a cathode, and the second electrode layer 8 is an anode layer; all that is required. And the setting is specifically selected according to the actual situation.

As shown in fig. 6 and 8, the method for manufacturing the display substrate in the above embodiment includes S100 to S600.

S100, providing a substrate 1.

Here, the substrate 1 includes a rigid substrate or a flexible substrate. The substrate 1 is provided with a plurality of pixel driving circuits, and each pixel driving circuit is formed by at least one thin film transistor and at least one storage capacitor in series-parallel connection and is used for driving the light emitting device in the corresponding sub-pixel.

Alternatively, as shown in fig. 4, each thin film transistor in the pixel driving circuit is a bottom gate thin film transistor.

S200, forming a patterned first electrode layer on one side of the substrate 1.

The first electrode layer includes first electrodes 2 in one-to-one correspondence with the sub-pixels. The first electrode is connected to the drain of a thin film transistor in a corresponding pixel driving circuit on the substrate 1.

Alternatively, the first electrode 2 is an anode or a cathode of the light emitting device to be formed, and is specifically selected according to actual requirements. The first electrode layer is made of a material with higher conductivity, for example: metals such as magnesium, aluminum and silver, or transparent conductive materials such as Indium Tin Oxide (ITO).

S300, forming a pixel defining layer 3 on a surface of the first electrode layer facing away from the substrate 1, and exposing the pixel defining layer 3.

The pixel defining layer 3 is formed by using a photosensitive material, for example: positive photoresist, negative photoresist, thermoplastic polyimide resin, or the like. The mask used in exposing the pixel defining layer 3 is related to its material.

As illustrated in (a) and (b) of fig. 6, the pixel defining layer 3 is formed using positive photoresist spin coating, for example. Each opening of the mask corresponds to a portion to be removed (i.e., a portion where the exposure pattern is located) in the pixel defining layer 3. The cross-sectional shape of each exposure pattern in the pixel defining layer 3 in the direction perpendicular to the substrate 1 is in an inverted trapezoid. After exposing the pixel defining layer 3, portions of the pixel defining layer 3 for forming the second opening 31 and the third opening 32 can be removed by a subsequent developing process.

Alternatively, the exposure process described above is performed using a high pressure mercury lamp. The high-pressure mercury lamp has higher luminous efficiency and longer service life, thereby being beneficial to improving the exposure efficiency of the exposure process.

S400, forming a passivation layer 4 on a surface of the exposed pixel defining layer 3 facing away from the substrate 1, the passivation layer 4 comprising a plurality of first openings 41.

As shown in fig. 6 (c), a passivation film is formed on the surface of the exposed pixel defining layer 3 facing away from the substrate 1 using a vapor deposition process. The deposition temperature of the vapor deposition process is below a first threshold.

Here, the first threshold value may be set according to the material selection of the pixel defining layer 3 to ensure that the vapor deposition process of the passivation film does not destroy the functional characteristics of the pixel defining layer 3. Alternatively, the deposition temperature of the vapor deposition process is 70 ℃ to 80 ℃.

As shown in (d) of fig. 6, the passivation film is patterned to obtain the passivation layer 4 having at least the plurality of first openings 41. Optionally, the passivation film is patterned using a dry etching process. Thus, the manufacturing temperature of the passivation layer 4 and the dry etching process thereof do not affect the material characteristics of the pixel defining layer 3, i.e., the manufacturing of the passivation layer 4 is prevented from generating defects to the exposure pattern in the pixel defining layer 3.

It will be appreciated that the third openings 32 in the pixel defining layer 3 are for accommodating light emitting devices in corresponding sub-pixels, and that the passivation layer 4 does not cover portions of the pixel defining layer 3 for forming the respective third openings 32.

S500, developing the pixel defining layer 3, and forming the second openings 31 in the pixel defining layer 3 at the portions corresponding to the first openings 41. The orthographic projection of each first opening 41 on the substrate 1 is located within the orthographic projection of the corresponding second opening 31 on the substrate, and said first opening 41 and said second opening 31 constitute the second electrode-separating groove 5.

Here, since the pixel defining layer 3 further includes a plurality of third openings 32, the above-described development of the pixel defining layer 3 further includes forming a plurality of third openings 32 in one-to-one correspondence with the first electrodes 2. Each first electrode 2 is exposed in the corresponding third opening 32.

After the pixel defining layer 3 is developed, the structure of the pixel defining layer 3 is as shown in (e) of fig. 6. For example, the opening size of the first opening 41 in the same second electrode-separating groove 5 is smaller than the opening size of the second opening 31 thereof. Since the exposure process of the pixel defining layer 3 is completed before the passivation layer 4 is fabricated, after the portion to be removed in the pixel defining layer 3 is removed by the developing process, the edge of the second electrode isolation trench 5 formed by the second opening 31 in the pixel defining layer 3 and the corresponding first opening 41 in the passivation layer 4 is relatively sharp and sharp, has a shape similar to an inverted T shape, and has a sufficient trench depth.

After the second electrode isolation groove 5 is completed, as shown in (f) and (g) of fig. 6, the method for manufacturing a display substrate further includes: s600.

S600, a light-emitting layer 7 and a second electrode layer 8 are sequentially stacked on the passivation layer 4 side facing away from the substrate 1 by using an evaporation process. In this way, the light emitting layer 7 is formed in each third opening 32 through the metal mask plate, and the second electrode layer 8 can be effectively divided by each second electrode dividing groove 5 to obtain light emitting devices which are located in the third openings 32 and correspond to the sub-pixels one by one. Thus, the patterning of the second electrode layer 8 can be effectively realized by using each second electrode isolation groove 5, and effective isolation between the second electrodes (such as the cathodes of the OLED) corresponding to different sub-pixels can be ensured.

In the embodiment of the present disclosure, the second electrode isolation groove 5 is constituted by superimposing the second opening 31 in the pixel defining layer 3 and the corresponding first opening 41 in the passivation layer 4. In this way, in the process of manufacturing the display substrate, the exposure process of the pixel defining layer 3 is completed, and after the passivation layer 4 and the subsequent processes of the first opening 41 in the passivation layer 4 are manufactured, the area where the second opening 31 is to be formed in the pixel defining layer 3 is further developed and removed, so that adverse effects on the second opening 31 in the pixel defining layer 3 caused by the passivation layer 4 and the subsequent manufacturing processes of other film layers (such as an organic layer) can be avoided, for example, the passivation layer 4 or other film layers remain and fill in the second opening 31, thereby affecting the forming shape of the second opening 31.

In this way, with the second openings 31 in the pixel defining layer 3 and the corresponding first openings 41 in the passivation layer 4, the second electrode isolation trenches 5 having a relatively sharp edge, a shape similar to an inverted T and a sufficient trench depth can be formed while ensuring that the orthographic projection of the first openings 41 on the substrate 1 is located within the orthographic projection of the corresponding second openings 31 on the substrate 1, thereby effectively realizing the patterning of the second electrode layer 8 and ensuring that the second electrodes (e.g., the cathode of the OLED) corresponding to different sub-pixels can be effectively isolated from each other.

In summary, compared with the existing method in which the cathode isolation groove 51 in the OLED substrate is formed by the first countersink 91 in the planarization layer 9 and the first opening 41 in the passivation layer 4, and the pixel defining layer 3 is formed on the surface of the passivation layer 4 facing away from the substrate 1, the manufacturing method of the display substrate provided by the embodiment of the application effectively simplifies the manufacturing process of the display substrate, can ensure the forming effect of the second electrode isolation groove 5 in the display substrate, and avoids the problem that the second electrode isolation groove 5 is formed first and then is filled with the residual of the subsequent film layer, so that the patterning of the second electrode layer 8 can be effectively realized by using each second electrode isolation groove 5, and the second electrodes (for example, the cathodes of the OLEDs) corresponding to different sub-pixels can be effectively isolated.

Referring to fig. 3 and 5, in some embodiments, the display substrate further includes a spacer layer 6, and the spacer layer 6 includes a plurality of spacers disposed on a surface of the passivation layer 4 facing away from the substrate 1 and a surface of the pixel defining layer 3 not covered by the passivation layer 4. The light-emitting layer 7 and the second electrode layer 8 in the display substrate are located on the side of the spacer layer 6 facing away from the substrate 1.

Optionally, the material of the spacer layer 6 is the same as or similar to that of the pixel defining layer 3, which facilitates the manufacturing process for simplifying the manufacturing process of the display substrate.

When the display substrate has the structure shown in fig. 5, the method for manufacturing the display substrate includes S100 to S600 as shown in fig. 9. The manufacturing process of S100 to S400 and the film structures formed by the manufacturing process are the same as those in the foregoing embodiments, please refer to (a) to (d) in fig. 7, and the description thereof is omitted here.

S450, a spacer layer 6 is formed on the surface of the passivation layer 4 facing away from the substrate 1, as shown in fig. 7 (e).

Here, the spacer layer 6 is formed of the same or similar material as the pixel defining layer 3.

S500', the spacer layer 6 and the pixel defining layer 3 are developed by a single development process to obtain a patterned spacer layer 6 and a patterned pixel defining layer 3, as shown in (f) of fig. 7.

The spacer layer 6 is formed by adopting the same or similar material as the pixel defining layer 3, so that the patterning of the spacer layer 6 and the pixel defining layer 3 can be realized at one time, the manufacturing process of the display substrate is simplified, and the production efficiency of the display substrate is improved.

Accordingly, after the spacer layer 6 is manufactured, as shown in (g) and (h) of fig. 7, the manufacturing method of the display substrate further includes S600.

S600, a light-emitting layer 7 and a second electrode layer 8 are sequentially stacked on the passivation layer 4 side facing away from the substrate 1 by using an evaporation process.

Thus, the light emitting layers 7 are formed in the third openings 32 through the metal mask plate, and the second electrode layers 8 can be effectively divided by the second electrode isolation grooves 5, so that light emitting devices which are positioned in the third openings 32 and correspond to the sub-pixels one by one are obtained. Thus, the patterning of the second electrode layer 8 can be effectively realized by using each second electrode isolation groove 5, and effective isolation between the second electrodes (such as the cathodes of the OLED) corresponding to different sub-pixels can be ensured.

The embodiment of the disclosure also provides a display device, which comprises the display substrate provided by the embodiment. The display substrate in the display device has the same advantages as those in the above embodiments, and will not be described here again.

In some embodiments, the display device is an OLED display panel or a quantum dot light emitting diode (Quantum Dot Light Emitting Diodes, QLED) display panel.

In some embodiments, the display device is a product or component with a display function, such as electronic paper, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, or a navigator.

The foregoing is merely specific embodiments of the disclosure, but the protection scope of the disclosure is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the disclosure, and it is intended to cover the protection scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A method for manufacturing a display substrate, comprising:

providing a substrate, and forming a patterned first electrode layer on one side of the substrate;

forming a pixel defining layer on a surface of the first electrode layer facing away from the substrate, exposing the pixel defining layer;

forming a passivation film on the exposed surface of the pixel defining layer, which is far away from the substrate, by adopting a vapor deposition process, wherein the deposition temperature of the vapor deposition process is lower than a first threshold value; carrying out dry etching on the passivation film to form a passivation layer; the passivation layer includes a plurality of first openings;

developing the pixel defining layer, and forming a second opening in a portion of the pixel defining layer corresponding to the first opening; the orthographic projection of the first opening on the substrate is positioned in the orthographic projection of the corresponding second opening on the substrate, and the first opening and the second opening form a second electrode isolation groove.

2. The method of manufacturing a display substrate according to claim 1, wherein before developing the pixel defining layer, the method further comprises: and forming a spacer layer on the surface of the passivation layer, which is away from the substrate.

3. The method for manufacturing a display substrate according to claim 1 or 2, wherein,

the manufacturing materials of the pixel defining layer comprise positive photoresist;

exposing the pixel defining layer includes exposing a portion of the pixel defining layer to be removed.

4. A method of manufacturing a display substrate according to claim 3, wherein in the case where the method of manufacturing includes forming a spacer layer, a manufacturing material of the spacer layer is the same as that of the pixel defining layer;

developing the pixel defining layer further comprises:

the spacer layer and the pixel defining layer are developed by a one-time development process to obtain a patterned spacer layer and a patterned pixel defining layer.

5. A display substrate, characterized in that the display substrate is manufactured and formed by the manufacturing method of any one of claims 1 to 4; the display substrate includes: a substrate, a plurality of first electrodes disposed on the substrate, and a pixel defining layer and a passivation layer stacked on a surface of the plurality of first electrodes facing away from the substrate; wherein,,

the passivation layer comprises a plurality of first openings, and the pixel defining layer comprises second openings which are in one-to-one correspondence with the first openings; the orthographic projection of the first opening on the substrate is positioned in the orthographic projection of the corresponding second opening on the substrate, and the first opening and the second opening form a second electrode isolation groove.

6. The display substrate of claim 5, further comprising a plurality of spacers; the plurality of spacers are dispersed on a surface of the passivation layer facing away from the substrate and/or on a surface of the pixel defining layer not covered by the passivation layer.

7. The display substrate according to claim 5 or 6, wherein the pixel defining layer further comprises a plurality of third openings in one-to-one correspondence with the first electrodes, portions of the first electrodes being exposed in the corresponding third openings; the passivation layer does not cover the plurality of third openings;

the display substrate further includes: laminating a light emitting layer and a second electrode layer which are arranged on one side of the passivation layer, which is away from the substrate;

the light-emitting layers and the second electrode layers which are positioned in the adjacent two third openings are separated by the corresponding second electrode separation grooves.

8. The display substrate of claim 5 or 6, wherein the orthographic projection shape of the second opening on a plane perpendicular to the substrate comprises an inverted trapezoid.

9. A display device comprising the display substrate according to any one of claims 5 to 8.