CN111370555B - Light-emitting diode - Google Patents
Light-emitting diode Download PDFInfo
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- CN111370555B CN111370555B CN202010266477.XA CN202010266477A CN111370555B CN 111370555 B CN111370555 B CN 111370555B CN 202010266477 A CN202010266477 A CN 202010266477A CN 111370555 B CN111370555 B CN 111370555B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
Abstract
The invention discloses a light-emitting diode, which structurally comprises a cathode rod, a packaging connecting cover, an anode rod, a lead seat, a planar circuit, a circuit board, a groove and an inwards concave circuit, and has the following effects: the utility model discloses a luminous diode, including the luminous chip, the cover body is covered with the lead wire seat, the negative pole, encapsulation connecting cover and positive pole and lead wire seat constitute emitting diode, form packaging structure through the encapsulation connecting cover, can improve luminous chip's printing opacity efficiency and light emission face, the light that makes the luminous chip produce is more bright and light sense effect better, the discharge cover that can high-efficient in this process produce the luminous chip in service covers the body outside, avoid the heat to gather at the internal portion of cover, accelerate the circuit ageing, reduce luminous chip life, form connection structure through the lead wire seat, can pass through simple and easy rotation operation, make emitting diode vertical fixation on the recess of circuit board, and realize diode's high-efficient electric conductivity in the fixed process, make emitting diode after damaging, dismantle from the circuit board.
Description
Technical Field
The invention relates to the field of diodes, in particular to a light-emitting diode.
Background
The diode is an electronic device made of semiconductor material, it has one-way conductivity, namely when applying the forward voltage to the positive pole and negative pole of the diode, the diode is turned on, when applying the reverse voltage to the positive pole and negative pole, the diode is cut off, therefore, the turn-on and cut-off of the diode is equivalent to the turn-on and cut-off of the switch, the light-emitting diode is a semiconductor solid display device which can directly convert the electric energy into the light energy, the PN junction of the light-emitting diode is sealed in the transparent plastic shell, the appearance has square, rectangle and round, etc., the driving voltage of the light-emitting diode is low, the working current is small, it has the advantages of strong anti-vibration and impact ability, small volume, high reliability, power saving and long service life, etc., it is widely used in the circuit of signal indication, etc., the light-emitting diode needs to be welded on, the circuit of the circuit board is damaged by the strong force, so that the circuit can not be powered on, and the PN junction of the light-emitting diode is packaged in the transparent plastic shell, so that the heat dissipation performance is poor, the light-emitting diode needs to be developed, the problems that the light-emitting diode needs to be welded on the circuit of the circuit board when being connected, the light-emitting diode is not easy to detach and replace when being damaged, the circuit of the circuit board is damaged by the strong force, the circuit can not be powered on, and the heat dissipation performance of the PN junction of the light-emitting diode is poor when being packaged in.
Summary of the invention
Aiming at the defects of the prior art, the invention is realized by the following technical scheme: the utility model provides a light-emitting diode, its structure includes negative pole, encapsulation connecting cover, positive pole, pin boss, planar circuit, circuit board, recess, indent circuit, circuit board top surface be equipped with planar circuit, planar circuit and circuit board adopt interference fit, circuit board top be equipped with the recess, recess and circuit board structure as an organic whole, the recess inner wall on be equipped with the indent circuit, the indent circuit hug closely and fix on the recess inner wall, indent circuit and circuit board structure as an organic whole, recess top be equipped with the pin boss, pin boss and recess adopt screw-thread fit, pin boss top be equipped with the encapsulation connecting cover, encapsulation connecting cover bottom be equipped with positive pole and negative pole, the encapsulation connecting cover be connected with the pin boss through positive pole and negative pole.
As a further optimization of the technical scheme, the packaging connection cover consists of a light-transmitting cover, a light-emitting chip, a bracket and a packaging plate, wherein the packaging plate is arranged at the bottom of the light-transmitting cover and is buckled with the light-transmitting cover, the bracket is arranged at the center inside the light-transmitting cover, the bracket is vertically welded at the center of the top of the packaging plate, the light-emitting chip is arranged at the top of the bracket, and the light-emitting chip is buckled with the bracket.
As the further optimization of the technical scheme, the light-transmitting cover consists of a cover body, lenses, a heat-inducing side rod and a progressive inner rod, wherein the heat-inducing side rod is arranged on two sides of the inner part of the cover body and is embedded and fixed on the cover body, the heat-inducing side rod is arranged on the progressive inner rod from top to bottom, the progressive inner rod is transversely embedded and arranged on the heat-inducing side rod, the cover body is internally provided with the lenses at the front end and the rear end, and the lenses are embedded and fixed with the cover body.
As the further optimization of this technical scheme, the encapsulation dish constitute by the foundation ring, draw hot branch, insulating lead joint, metal disc, fin, the inside central point of foundation ring put and be equipped with the metal disc, the foundation ring in circle distribute and draw hot branch, draw hot branch and foundation ring and weld mutually, the foundation ring be connected with the metal disc through drawing hot branch, metal disc bottom be equipped with the fin, fin and metal disc weld mutually, the metal disc both sides be equipped with insulating lead joint, insulating lead joint and metal disc lock mutually.
As the further optimization of this technical scheme, the lead wire seat constitute by insulating outer seat, regulation inner seat, positive pole lead wire gasket, insulating branch, negative pole lead wire gasket, insulating outer seat central point put and be equipped with the regulation inner seat, regulation inner seat and insulating outer seat gomphosis, regulation inner seat both sides be equipped with positive pole lead wire gasket and negative pole lead wire gasket, positive pole lead wire gasket and negative pole lead wire gasket gomphosis fix in insulating outer seat bottom, regulation inner seat bottom be equipped with insulating branch, insulating branch cooperate with the regulation inner seat.
As the further optimization of this technical scheme, regulation inner base connect inner ring, insulating frame, adjustable ring, connect the pole to constitute, the inside central point of insulating frame put and be equipped with the adjustable ring, adjustable ring and insulating frame adopt sliding fit, insulating frame bottom central point put and be equipped with the connection inner ring, connection inner ring and insulating frame adopt sliding fit, adjustable ring and connect and be equipped with between the inner ring and connect the pole, the adjustable ring through connect the pole and be connected the interior jogged joint.
Advantageous effects
The light-emitting diode provided by the invention has the advantages of reasonable design, strong functionality and the following beneficial effects:
according to the invention, the cathode rod, the packaging connecting cover, the anode rod and the lead seat form the light-emitting diode, the packaging structure is formed by the packaging connecting cover, the light transmission efficiency and the light emitting surface of the light-emitting chip can be improved, the light generated by the light-emitting chip is brighter and better in light sensing effect, the light generated in the operation of the light-emitting chip can be efficiently discharged out of the cover body in the process, the heat is prevented from being accumulated in the cover body, the line aging is accelerated, the service life of the light-emitting chip is reduced, the connecting structure is formed by the lead seat, the light-emitting diode can be vertically fixed on the groove of the circuit board through simple rotating operation, the high-efficiency conductivity of the diode is realized in the vertical fixing process, the light-emitting diode is easily disassembled from the circuit board after being damaged;
according to the invention, the cover body, the lenses, the heat inducing side rod and the progressive inner rod are connected to form the light enhancement structure, the two lenses which are in the circular arc-shaped plate-shaped structure and in the axial symmetry structure are arranged inside the cover body which is in the circular structure, when light generated in the operation of the light-emitting chip is in contact with the lenses and the cover body in sequence, the light can enhance the light transmission efficiency and the light emitting surface of the light-emitting chip under the refraction effect generated by the lenses and the cover body, so that the light generated by the light-emitting chip is brighter and has better light sensing effect;
according to the invention, the bottom ring, the heat-leading support rods, the insulating lead connectors, the metal disc and the fins are connected to form a heat-radiating structure, under the action of an axisymmetric structure formed by matching the two vertical heat-leading support rods with the progressive inner rod, the heat-receiving surface in the cover body can be increased, so that redundant heat is conducted to the metal disc through the structure formed by the heat-leading side rods and the progressive inner rod, and the fins arranged in parallel at the bottom of the metal disc quickly discharge the heat, thereby avoiding the heat from being accumulated in the cover body and accelerating the aging of a circuit, and further prolonging the service life of a light-emitting chip;
the adjusting ring is connected with the insulating support rod through the connecting inner ring, the insulating support rod is in threaded connection with the groove through the concave circuit, the concave circuit can ensure that the circuit is complete when the planar circuit meets the groove, the cathode rod and the anode rod can be well connected with the planar circuit under the connecting action of the cathode lead gasket and the anode lead gasket, the light-emitting diode can be fixed on the groove through the insulating support rod only by rotating the adjusting ring clockwise in the operation process, the completeness of the circuit cannot be influenced in the process, the insulating support rod can be separated from the groove only by rotating the adjusting ring anticlockwise in the disassembly process, and the light-emitting diode can be separated from the circuit board.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic side view of an LED according to the present invention;
FIG. 2 is a schematic side view of a cross-sectional structure of the package connecting cap of the present invention;
FIG. 3 is a schematic top sectional view of a light transmissive cover according to the present invention;
FIG. 4 is a schematic bottom plan view of the package tray of the present invention;
FIG. 5 is a schematic side sectional view of a lead frame according to the present invention;
fig. 6 is a schematic view of the bottom structure of the adjusting inner seat of the present invention.
In the figure: cathode rod-1, packaging connecting cover-2, light-transmitting cover-21, cover body-21 a, lens-21 b, heat-leading side rod-21 c, progressive inner rod-21 d, light-emitting chip-22, bracket-23, packaging disc-24, bottom ring-24 a, heat-leading support rod-24 b, insulating lead joint-24 c, metal disc-24 d, fin-24 e, anode rod-3, lead seat-4, insulating outer seat-41, adjusting inner seat-42, connecting inner ring-42 a, insulating frame-42 b, adjusting ring-42 c, connecting rod-42 d, anode lead gasket-43, insulating support rod-44, cathode lead gasket-45, planar circuit-5, circuit board-6, groove-7, A recessed circuit-8.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easy to understand, the following description and the accompanying drawings further illustrate the preferred embodiments of the invention.
Example 1
Referring to fig. 1-4, the present invention provides an embodiment of a light emitting diode:
referring to fig. 1, a light emitting diode comprises a cathode rod 1, a package connecting cover 2, an anode rod 3, a lead seat 4, a planar circuit 5, a circuit board 6, a groove 7 and an inner concave circuit 8, wherein the planar circuit 5 is arranged on the top surface of the circuit board 6, the planar circuit 5 and the circuit board 6 are in interference fit, the groove 7 is arranged on the top of the circuit board 6, the groove 7 and the circuit board 6 are in an integrated structure, the groove 7 is in a circular structure, the inner concave circuit 8 is arranged on the inner wall of the groove 7, the inner concave circuit 8 is tightly fixed on the inner wall of the groove 7, the inner concave circuit 8 and the circuit board 6 are in an integrated structure, the lead seat 4 is arranged above the groove 7, the lead seat 4 and the groove 7 are in threaded fit, the package connecting cover 2 is arranged above the lead seat 4, the anode rod 3 and the cathode rod 1 are arranged at the bottom of the package connecting cover 2 in, the packaging connection cover 2 is connected with the lead seat 4 through the anode rod 3 and the cathode rod 1.
Referring to fig. 2, the package connecting cover 2 is composed of a light-transmitting cover 21, a light-emitting chip 22, a bracket 23 and a package tray 24, the package tray 24 is disposed at the bottom of the light-transmitting cover 21, the package tray 24 is fastened to the light-transmitting cover 21, the bracket 23 is disposed at the center of the inside of the light-transmitting cover 21, the bracket 23 is vertically welded to the center of the top of the package tray 24, the light-emitting chip 22 is disposed at the top of the bracket 23, the light-emitting chip 22 is fastened to the bracket 23, and the light-emitting chip 22 is electrically connected to the cathode rod 1 and the anode rod 3.
Referring to fig. 3, the light-transmitting cover 21 includes a cover body 21a, two lenses 21b, two heat-guiding side rods 21c and a progressive inner rod 21d, two heat-guiding side rods 21c are arranged on two sides of the inside of the cover body 21a in an axisymmetric structure, the heat-guiding side rods 21c are in a conical cylindrical structure and are embedded and fixed on the cover body 21a, the progressive inner rod 21d is arranged on the heat-guiding side rods 21c from top to bottom, the progressive inner rod 21d is transversely embedded on the heat-guiding side rods 21c, two lenses 21b are arranged on the front and rear ends of the inside of the cover body 21a in an axisymmetric structure, and the lenses 21b are in an arc plate-shaped structure and are embedded with the cover body 21 a.
Referring to fig. 4, the package tray 24 is composed of a bottom ring 24a, a heat-conducting support rod 24b, an insulating lead connector 24c, a metal tray 24d and a fin 24e, the metal tray 24d is arranged at the center inside the bottom ring 24a, the heat-conducting support rods 24b are uniformly distributed on the inner ring of the bottom ring 24a, the heat-conducting support rods 24b are welded with the bottom ring 24a, the bottom ring 24a is connected with the metal tray 24d through the heat-conducting support rods 24b, more than two fins 24e are arranged at the bottom of the metal tray 24d in parallel and equidistantly, the fin 24e is welded with the metal tray 24d, two insulating lead connectors 24c are arranged on two sides of the metal tray 24d in an axially symmetric structure, the insulating lead connectors 24c are fastened with the metal tray 24d, and the insulating lead connectors 24c are matched with the cathode rod 1 and the anode rod 3.
When the LED lamp is used, the cover body 21a, the lens 21b, the heat-inducing side rod 21c and the progressive inner rod 21d are connected to form a light-enhancing structure, the two lenses 21b in the arc-shaped plate-shaped structure in the axial symmetry structure are arranged in the cover body 21a in the circular structure, when light generated in the operation of the light-emitting chip 22 is sequentially contacted with the lens 21b and the cover body 21a, the light can enhance the light transmission efficiency and the light emitting surface of the light-emitting chip 22 under the refraction effect of the lens 21b and the cover body 21a, so that the light generated by the light-emitting chip 22 is brighter and better in light sensing effect, because the bottom ring 24a, the heat-inducing support rod 24b, the insulating lead connector 24c, the metal disc 24d and the fin 24e are connected to form a heat-dissipating structure, and under the axial symmetry structure effect formed by the two upright heat-inducing side rods 21c matching with the progressive inner rod 21d, the heat-receiving surface, the redundant heat is conducted to the metal disc 24d through a structure consisting of the heat-leading side rods 21c and the progressive inner rod 21d, and the fins 24e arranged in parallel at the bottom of the metal disc 24d quickly discharge the heat, so that the heat is prevented from being accumulated in the cover body 21a, the line aging is accelerated, and the service life of the light-emitting chip 22 is prolonged;
example 2
Referring to fig. 1 to 6, the present invention provides a light emitting diode, in which:
referring to fig. 1, a light emitting diode comprises a cathode rod 1, a package connecting cover 2, an anode rod 3, a lead seat 4, a planar circuit 5, a circuit board 6, a groove 7 and an inner concave circuit 8, wherein the planar circuit 5 is arranged on the top surface of the circuit board 6, the planar circuit 5 and the circuit board 6 are in interference fit, the groove 7 is arranged on the top of the circuit board 6, the groove 7 and the circuit board 6 are in an integrated structure, the groove 7 is in a circular structure, the inner concave circuit 8 is arranged on the inner wall of the groove 7, the inner concave circuit 8 is tightly fixed on the inner wall of the groove 7, the inner concave circuit 8 and the circuit board 6 are in an integrated structure, the lead seat 4 is arranged above the groove 7, the lead seat 4 and the groove 7 are in threaded fit, the package connecting cover 2 is arranged above the lead seat 4, the anode rod 3 and the cathode rod 1 are arranged at the bottom of the package connecting cover 2 in, the packaging connection cover 2 is connected with the lead seat 4 through the anode rod 3 and the cathode rod 1.
Referring to fig. 2, the package connecting cover 2 is composed of a light-transmitting cover 21, a light-emitting chip 22, a bracket 23 and a package tray 24, the package tray 24 is disposed at the bottom of the light-transmitting cover 21, the package tray 24 is fastened to the light-transmitting cover 21, the bracket 23 is disposed at the center of the inside of the light-transmitting cover 21, the bracket 23 is vertically welded to the center of the top of the package tray 24, the light-emitting chip 22 is disposed at the top of the bracket 23, the light-emitting chip 22 is fastened to the bracket 23, and the light-emitting chip 22 is electrically connected to the cathode rod 1 and the anode rod 3.
Referring to fig. 3, the light-transmitting cover 21 includes a cover body 21a, two lenses 21b, two heat-guiding side rods 21c and a progressive inner rod 21d, two heat-guiding side rods 21c are arranged on two sides of the inside of the cover body 21a in an axisymmetric structure, the heat-guiding side rods 21c are in a conical cylindrical structure and are embedded and fixed on the cover body 21a, the progressive inner rod 21d is arranged on the heat-guiding side rods 21c from top to bottom, the progressive inner rod 21d is transversely embedded on the heat-guiding side rods 21c, two lenses 21b are arranged on the front and rear ends of the inside of the cover body 21a in an axisymmetric structure, and the lenses 21b are in an arc plate-shaped structure and are embedded with the cover body 21 a.
Referring to fig. 4, the package tray 24 is composed of a bottom ring 24a, a heat-conducting support rod 24b, an insulating lead connector 24c, a metal tray 24d and a fin 24e, the metal tray 24d is arranged at the center inside the bottom ring 24a, the heat-conducting support rods 24b are uniformly distributed on the inner ring of the bottom ring 24a, the heat-conducting support rods 24b are welded with the bottom ring 24a, the bottom ring 24a is connected with the metal tray 24d through the heat-conducting support rods 24b, more than two fins 24e are arranged at the bottom of the metal tray 24d in parallel and equidistantly, the fin 24e is welded with the metal tray 24d, two insulating lead connectors 24c are arranged on two sides of the metal tray 24d in an axially symmetric structure, the insulating lead connectors 24c are fastened with the metal tray 24d, and the insulating lead connectors 24c are matched with the cathode rod 1 and the anode rod 3.
Referring to fig. 5, the lead frame 4 comprises an insulating outer frame 41, an inner frame 42, an anode lead pad 43, an insulating support rod 44, and a cathode lead pad 45, the insulating outer seat 41 is in a rectangular structure, an adjusting inner seat 42 is arranged at the center of the insulating outer seat, the adjusting inner seat 42 is embedded with the insulating outer seat 41, an anode lead gasket 43 and a cathode lead gasket 45 are arranged on two sides of the adjusting inner seat 42, the anode lead gasket 43 and the cathode lead gasket 45 are embedded and fixed at the bottom of the insulating outer seat 41, the anode rod 3 is matched with the planar circuit 5 through an anode lead gasket 43, the cathode rod 1 is matched with the planar circuit 5 through a cathode lead gasket 45, the bottom of the adjusting inner seat 42 is provided with an insulating support rod 44, the insulating support rod 44 is matched with the adjusting inner seat 42, and the insulating support rod 44 is in threaded fit with the groove 7 through the concave circuit 8.
Referring to fig. 6, the adjusting inner seat 42 is composed of a connecting inner ring 42a, an insulating frame 42b, an adjusting ring 42c and a connecting rod 42d, the insulating frame 42b is arranged at the center of the insulating outer seat 41 and is embedded with the insulating outer seat, the adjusting ring 42c is arranged at the center of the inside of the insulating frame 42b, the adjusting ring 42c and the insulating frame 42b are in sliding fit, the connecting inner ring 42a is arranged at the center of the bottom of the insulating frame 42b, the connecting inner ring 42a and the insulating frame 42b are in sliding fit, the connecting rod 42d is arranged between the adjusting ring 42c and the connecting inner ring 42a, the adjusting ring 42c is connected with the connecting inner ring 42a through the connecting rod 42d, and the adjusting ring 42c is connected with the insulating support rod 44 through the connecting inner ring 42 a.
In the use combination embodiment one, be connected with insulating strut 44 through connecting inner ring 42a through adjusting ring 42c, and insulating strut 44 is through indent circuit 8 and recess 7 threaded connection, the setting of indent circuit 8 can guarantee that planar circuit 5 can guarantee that the circuit is complete when meeting recess 7, make cathode pole 1 and anode pole 3 under the connecting action of cathode lead gasket 45 and anode lead gasket 43, can carry out good connection with planar circuit 5, only need clockwise rotation adjusting ring 42c in operation process, can make emitting diode fix on recess 7 through insulating strut 44, and can not influence the completion of circuit in this in-process, only need anticlockwise rotation adjusting ring 42c during the dismantlement, can make insulating strut 44 separate from recess 7, emitting diode can break away from circuit board 6 this moment.
The specific realization principle is as follows:
the light-emitting diode is formed by the cathode rod 1, the packaging connecting cover 2, the anode rod 3 and the lead seat 4, the packaging structure is formed by the packaging connecting cover 2, the light transmission efficiency and the light emitting surface of the light-emitting chip 22 can be improved, the light generated by the light-emitting chip 22 is brighter and better in light sensing effect, the light generated by the light-emitting chip 22 in operation can be efficiently discharged out of the cover body 21a in the process, the heat is prevented from being accumulated in the cover body 21a, the line aging is accelerated, the service life of the light-emitting chip 22 is shortened, because the cover body 21a, the lens 21b, the heat-leading side rod 21c and the progressive inner rod 21d are connected to form the light enhancement structure, the two lenses 21b which are in the circular structure are arranged in the cover body 21a, when the light generated in the operation of the light-emitting chip 22 is in contact with the lens 21b and the cover, the light can be under the refraction effect that lens 21b and cover body 21a produce, enhance the light transmission efficiency and the light emitting face of the light emitting chip 22, make the light that the light emitting chip 22 produces feel better light, because the bottom ring 24a, draw hot branch pole 24b, insulating lead wire connector 24c and metal disc 24d and fin 24e connect and form the heat dissipation structure, under the shaft symmetry structure effect that two upright draw hot side pole 21c cooperate to step on the inner pole 21d to form, can increase the heat receiving face inside the cover body 21a, make the surplus heat conduct to metal disc 24d through drawing the structure that hot side pole 21c and step on the inner pole 21d make up, and the fin 24e that is set up in parallel each other by the metal disc 24d bottom discharges the heat fast, avoid the heat to gather inside the cover body 21a, accelerate the ageing of the circuit, thus improve the life of the light emitting chip 22, form the connection structure through the lead wire seat 4, the LED can be vertically fixed on the groove 7 of the circuit board 6 through simple rotation operation, and the high-efficiency conductivity of the LED is realized in the vertical fixing process, so that the LED is easily disassembled from the circuit board 6 after being damaged, thereby improving the practicability of the LED, because the adjusting ring 42c is connected with the insulating support rod 44 through the connecting inner ring 42a, and the insulating support rod 44 is in threaded connection with the groove 7 through the concave circuit 8, the arrangement of the concave circuit 8 can ensure that the circuit is complete when the planar circuit 5 meets the groove 7, the cathode rod 1 and the anode rod 3 can be well connected with the planar circuit 5 under the connecting action of the cathode lead gasket 45 and the anode lead gasket 43, the LED can be fixed on the groove 7 through the insulating support rod 44 only by clockwise rotating the adjusting ring 42c in the operation process, in the process, the completeness of the circuit is not affected, and the insulation support rod 44 can be separated from the groove 7 only by rotating the adjusting ring 42c anticlockwise during disassembly, and at the moment, the light-emitting diode can be separated from the circuit board 6.
While there have been shown and described what are at present considered the fundamental principles of the invention, the essential features and advantages thereof, it will be understood by those skilled in the art that the present invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but rather, is capable of numerous changes and modifications in various forms without departing from the spirit or essential characteristics thereof, and it is intended that the invention be limited not by the foregoing descriptions, but rather by the appended claims and their equivalents.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (3)
1. The utility model provides a light-emitting diode, its structure includes negative pole (1), encapsulation connecting cover (2), positive pole (3), lead frame (4), planar circuit (5), circuit board (6), recess (7), indent circuit (8), circuit board (6) top surface be equipped with planar circuit (5), circuit board (6) top be equipped with recess (7), recess (7) inner wall on be equipped with indent circuit (8), recess (7) top be equipped with lead frame (4), lead frame (4) top be equipped with encapsulation connecting cover (2), encapsulation connecting cover (2) bottom be equipped with positive pole (3) and negative pole (1), its characterized in that:
the packaging connecting cover (2) consists of a light-transmitting cover (21), a light-emitting chip (22), a bracket (23) and a packaging disc (24), the packaging disc (24) is arranged at the bottom of the light-transmitting cover (21), the bracket (23) is arranged in the light-transmitting cover (21), and the light-emitting chip (22) is arranged at the top of the bracket (23);
the light-transmitting cover (21) consists of a cover body (21a), lenses (21b), heat-leading side rods (21c) and a progressive inner rod (21d), wherein the heat-leading side rods (21c) are arranged on two sides in the cover body (21a), the progressive inner rod (21d) is arranged on the heat-leading side rods (21c) from top to bottom, and the lenses (21b) are arranged in the cover body (21a) in front and at the back;
encapsulation dish (24) constitute by end ring (24a), draw hot branch (24b), insulating lead joint (24c), metal disc (24d), fin (24e), end ring (24a) inside be equipped with metal disc (24d), end ring (24a) inner circle on distribute and draw hot branch (24b), metal disc (24d) bottom be equipped with fin (24e), metal disc (24d) both sides be equipped with insulating lead joint (24 c).
2. A light emitting diode according to claim 1 wherein: lead wire seat (4) constitute by insulating outer seat (41), regulation inner seat (42), positive pole lead wire gasket (43), insulating branch (44), negative pole lead wire gasket (45), insulating outer seat (41) central point put and be equipped with regulation inner seat (42), regulation inner seat (42) both sides be equipped with positive pole lead wire gasket (43) and negative pole lead wire gasket (45), regulation inner seat (42) bottom be equipped with insulating branch (44).
3. A light emitting diode according to claim 2, wherein: adjust inner (42) by connecting inner ring (42a), insulating frame (42b), adjustable ring (42c), connect pole (42d) to constitute, insulating frame (42b) inside be equipped with adjustable ring (42c), insulating frame (42b) bottom be equipped with and connect inner ring (42a), adjustable ring (42c) and connect and be equipped with between inner ring (42a) and connect pole (42 d).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010266477.XA CN111370555B (en) | 2020-04-07 | 2020-04-07 | Light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010266477.XA CN111370555B (en) | 2020-04-07 | 2020-04-07 | Light-emitting diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111370555A CN111370555A (en) | 2020-07-03 |
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| JP2000101150A (en) * | 1998-09-21 | 2000-04-07 | Tadao Noda | Insertable light emitting diode and two-layer electrode panel for feeding power |
| US6903380B2 (en) * | 2003-04-11 | 2005-06-07 | Weldon Technologies, Inc. | High power light emitting diode |
| CN206379373U (en) * | 2017-01-19 | 2017-08-04 | 东莞市康瑞电子有限公司 | A kind of light emitting diode |
| CN207925482U (en) * | 2017-12-02 | 2018-09-28 | 深圳市嘉兴南电科技有限公司 | A kind of energy-efficient diode |
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