CN206379373U - A kind of light emitting diode - Google Patents

A kind of light emitting diode Download PDF

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Publication number
CN206379373U
CN206379373U CN201720075213.XU CN201720075213U CN206379373U CN 206379373 U CN206379373 U CN 206379373U CN 201720075213 U CN201720075213 U CN 201720075213U CN 206379373 U CN206379373 U CN 206379373U
Authority
CN
China
Prior art keywords
metab
light emitting
emitting diode
encapsulation
connecting seat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201720075213.XU
Other languages
Chinese (zh)
Inventor
周忠琼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Kang Rui Electronics Co Ltd
Original Assignee
Dongguan Kang Rui Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Kang Rui Electronics Co Ltd filed Critical Dongguan Kang Rui Electronics Co Ltd
Priority to CN201720075213.XU priority Critical patent/CN206379373U/en
Application granted granted Critical
Publication of CN206379373U publication Critical patent/CN206379373U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Landscapes

  • Led Device Packages (AREA)

Abstract

The utility model discloses a kind of light emitting diode, including encapsulation, lead frame, plastic lens, connecting seat and metab, chip is installed inside the encapsulation, and beneath chips are fixed with support, the frame bottom is connected with below cathode rod, the plastic lens and is fixed with encapsulation, and package bottom is connected with threaded connecting sleeve, the sealing ring external stability has is connected with connecting seat above connecting seat, the metab, and the metab is internally connected with heat-conducting silica gel sheet.It is helicitic texture outside the encapsulation bottom of the light emitting diode, and its screw thread tang and the threaded recess kissing inside threaded connecting sleeve, it can will easily be encapsulated on threaded connecting sleeve and be dismantled and installed, encapsulation can be disassembled to replacing chip after light emitting diode failure, whole light emitting diode need not be changed, use more facilitates, metab bottom is wavy shaped configuration, heat is faster distributed, improve heat dispersion.

Description

A kind of light emitting diode
Technical field
The utility model is related to diode technologies field, specially a kind of light emitting diode.
Background technology
With economic prosperity, the continuous raising of people's living standard, the development of production technology is become better and better, people It is more and more harsher to the utilization of oneself time, in life, our requirement more and more highers for equipment, it is desirable to be able to by right The innovation of equipment improves the operating efficiency of equipment, reduces the working time, improves service efficiency, is allowed to give play to the valency of maximum Value, significantly develops with the development of science and technology, light emitting diode has, and its development is given people in display, instruction, remote control Brought great convenience when carrying out equipment research and manufacture with the communications field, its type and quantity is also just growing day by day.Mesh Although the light emitting diode type and quantity of preceding in the market are very more, most light emitting diode be all integral packaging into Type, after light emitting diode breaks down, it is merely able to change whole light emitting diode, causes the substantial amounts of wasting of resources, and And existing light emitting diode itself is without heat abstractor, it is impossible to which very long progress is radiated, and makes operating efficiency and service life Receive certain influence.
Utility model content
The purpose of this utility model is to provide a kind of light emitting diode, to solve the current city that above-mentioned background technology is proposed Light emitting diode on field is merely able to change whole light emitting diode after breaking down, and causes the substantial amounts of wasting of resources and luminous The problem of diode itself is without heat abstractor.
To achieve the above object, the utility model provides following technical scheme:A kind of light emitting diode, including encapsulate, draw Chip is installed inside coil holder, plastic lens, connecting seat and metab, the encapsulation, and beneath chips are fixed with support, institute State frame bottom and be connected with cathode rod, the lead frame top is connected with above cathode rod and anode rod, the anode rod and set Have and chip is connected with the right side of connecting wire, and connecting wire, encapsulation is fixed with below the plastic lens, and package bottom is connected There is threaded connecting sleeve, the connecting seat is internally provided with threaded connecting sleeve, and threaded connecting sleeve is externally connected to sealing ring, described Sealing ring external stability, which has to be connected with outside connecting seat, and metab above connecting seat, the metab, is provided with fixation Groove, the metab is internally connected with heat-conducting silica gel sheet, and heat-conducting silica gel sheet is internally connected with lead frame.
It is preferred that, it is the screw thread inside helicitic texture, and its screw thread tang and threaded connecting sleeve outside the encapsulation bottom Recess kissing.
It is preferred that, it is provided with anti-reflection film above the plastic lens.
It is preferred that, the fixing groove is cirque structure, and position is arranged on the height middle of metab.
It is preferred that, it is structure as a whole above the metab with connecting seat, and metab bottom is wavy shaped configuration.
Compared with prior art, the beneficial effects of the utility model are:It is spiral shell outside the encapsulation bottom of the light emitting diode Line structure, and its screw thread tang and the threaded recess kissing inside threaded connecting sleeve, can will easily be encapsulated in threaded connection Put and dismantled and installed, encapsulation can be disassembled to replacing chip after light emitting diode failure, without Whole light emitting diode is changed, use more facilitates, and anti-reflection film is provided with above plastic lens, it is possible to increase light transmissive strong Degree, becomes apparent from illumination, fixing groove is cirque structure, and position is arranged on the height middle of metab, is installing When easily light emitting diode can be fixed by fixing groove, be convenient for installing, be with connecting seat above metab Integrative-structure, and metab bottom is wavy shaped configuration, can make even heat is dispersed to the corrugated circular arc in bottom, Heat is faster distributed, improve heat dispersion.
Brief description of the drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is the utility model structural metal base vertical view.
In figure:1st, encapsulate, 2, chip, 3, support, 4, cathode rod, 5, lead frame, 6, anti-reflection film, 7, plastic lens, 8, even Connect wire, 9, anode rod, 10, connecting seat, 11, fixing groove, 12, metab, 13, sealing ring, 14, threaded connecting sleeve, 15, lead Hot silica gel piece.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made The every other embodiment obtained, belongs to the scope of the utility model protection.
Fig. 1-2 is referred to, the utility model provides a kind of technical scheme:A kind of light emitting diode, including encapsulation 1, lead It is screw thread knot to be provided with inside frame 5, plastic lens 7, connecting seat 10 and metab 12, encapsulation 1 outside chip 2,1 bottom of encapsulation Structure, and its screw thread tang and the threaded recess kissing inside threaded connecting sleeve 14, can be easily by encapsulation 1 in threaded connecting sleeve Dismantled and installed on 14, encapsulation 1 can be disassembled to replacing chip 2, nothing after light emitting diode failure Whole light emitting diode need to be changed, use more facilitates, and the lower section of chip 2 is fixed with support 3, the bottom of support 3 is connected with negative electrode Bar 4, the top of lead frame 5 is connected with cathode rod 4 and anode rod 9, and the top of anode rod 9 is provided with connecting wire 8, and connecting wire 8 Right side is connected with chip 2, and the lower section of plastic lens 7 is fixed with encapsulation 1, and the top of plastic lens 7 is provided with anti-reflection film 6, it is possible to increase Light transmissive intensity, becomes apparent from illumination, and 1 bottom of encapsulation is connected with threaded connecting sleeve 14, and connecting seat 10 is internally provided with Threaded connecting sleeve 14, and threaded connecting sleeve 14 is externally connected to sealing ring 13, the external stability of sealing ring 13 has connecting seat 10, metal The top of base 12, which is connected with outside connecting seat 10, and metab 12, is provided with fixing groove 11, and fixing groove 11 is cirque structure, , when mounted can be convenient by light emitting diode by fixing groove 11 and position is arranged on the height middle of metab 12 Fix, metab 12 is internally connected with heat-conducting silica gel sheet 15, the top of metab 12 is structure as a whole with connecting seat 10, and The bottom of metab 12 is wavy shaped configuration, and can make even heat is dispersed to the corrugated circular arc in bottom, enables heat It is enough faster to distribute, and heat-conducting silica gel sheet 15 is internally connected with lead frame 5.
Operation principle:In the use light emitting diode, it can be incited somebody to action first by the fixing groove 11 in metab 12 Light emitting diode is fixed, and then the lead frame 5 of LED bottom is connected on circuit, so as to will easily send out Optical diode is installed, after installation, it is possible to which progress is used, in use, electric current can pass through connection from anode rod 9 Wire 8 is entered in chip 2, and then outflow forms loop from cathode rod 4, so that chip 2 lights shinny, chip 2 is sent Illumination can be shone out by plastic lens 7, and when by anti-reflection film 6 on plastic lens 7, it is possible to increase light transmissive Intensity, becomes apparent from illumination, if after light emitting diode breaks down, can first take out and be connected to connecting seat 10 and screw thread company Sealing ring 13 between female connector 14, is then connected through a screw thread and takes out encapsulation 1 from threaded connecting sleeve 14, and changes chip 2, Without changing whole light emitting diode, it is to avoid the waste of resource, after the chip 2 more renewed, then encapsulation 1 passed through into screw thread It is connected in threaded connecting sleeve 14, sealing ring 13, the energy of sealing ring 13 is then set up between connecting seat 10 and threaded connecting sleeve 14 Sealing property is enough improved, in light emitting diode in use, the wavelike structure of the bottom of metab 12 can be quickly equal by heat Even distributes, and improves radiating effect, meanwhile, it is arranged on the heat-conducting silica gel sheet 15 between lead frame 5 and metab 12 Good thermal diffusivity can be possessed and can be insulated, light emitting diode is ensure that light-emitting diodes while quick heat radiating The normal work of pipe, so as to complete a series of activities.
Although the utility model is described in detail with reference to the foregoing embodiments, come for those skilled in the art Say, it can still be modified to the technical scheme described in foregoing embodiments, or which part technical characteristic is entered Row equivalent substitution, all within spirit of the present utility model and principle, any modification, equivalent substitution and improvements made etc. all should Within protection domain of the present utility model.

Claims (5)

1. a kind of light emitting diode, including encapsulation (1), lead frame (5), plastic lens (7), connecting seat (10) and metab (12), it is characterised in that:It is provided with inside the encapsulation (1) below chip (2), and chip (2) and is fixed with support (3), it is described Support (3) bottom is connected with above cathode rod (4), the lead frame (5) and is connected with cathode rod (4) and anode rod (9), the sun It is provided with the right side of connecting wire (8), and connecting wire (8) and is connected with chip (2), the plastic lens (7) above pole bar (9) Side is fixed with encapsulation (1), and encapsulation (1) bottom is connected with threaded connecting sleeve (14), and the connecting seat (10) is internally provided with spiral shell Line adapter sleeve (14), and threaded connecting sleeve (14) is externally connected to sealing ring (13), sealing ring (13) external stability has company It is connected with above joint chair (10), the metab (12) outside connecting seat (10), and metab (12) and is provided with fixing groove (11), the metab (12) is internally connected with heat-conducting silica gel sheet (15), and heat-conducting silica gel sheet (15) is internally connected with lead Frame (5).
2. a kind of light emitting diode according to claim 1, it is characterised in that:It is screw thread outside described encapsulation (1) bottom Structure, and its screw thread tang threaded recess kissing internal with threaded connecting sleeve (14).
3. a kind of light emitting diode according to claim 1, it is characterised in that:It is provided with above the plastic lens (7) Anti-reflection film (6).
4. a kind of light emitting diode according to claim 1, it is characterised in that:The fixing groove (11) is annular knot Structure, and position is arranged on the height middle of metab (12).
5. a kind of light emitting diode according to claim 1, it is characterised in that:With being connected above the metab (12) Seat (10) is structure as a whole, and metab (12) bottom is wavy shaped configuration.
CN201720075213.XU 2017-01-19 2017-01-19 A kind of light emitting diode Expired - Fee Related CN206379373U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720075213.XU CN206379373U (en) 2017-01-19 2017-01-19 A kind of light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720075213.XU CN206379373U (en) 2017-01-19 2017-01-19 A kind of light emitting diode

Publications (1)

Publication Number Publication Date
CN206379373U true CN206379373U (en) 2017-08-04

Family

ID=59400538

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720075213.XU Expired - Fee Related CN206379373U (en) 2017-01-19 2017-01-19 A kind of light emitting diode

Country Status (1)

Country Link
CN (1) CN206379373U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108847441A (en) * 2018-06-26 2018-11-20 芜湖乐知智能科技有限公司 A kind of light emitting diode of high efficiency and heat radiation
CN111370555A (en) * 2020-04-07 2020-07-03 向春雷 Light-emitting diode

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108847441A (en) * 2018-06-26 2018-11-20 芜湖乐知智能科技有限公司 A kind of light emitting diode of high efficiency and heat radiation
CN108847441B (en) * 2018-06-26 2019-10-29 浙江飞天光电股份有限公司 A kind of light emitting diode of high efficiency and heat radiation
CN111370555A (en) * 2020-04-07 2020-07-03 向春雷 Light-emitting diode

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Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CB03 Change of inventor or designer information
CB03 Change of inventor or designer information

Inventor after: Zhou Zhongqiu

Inventor before: Zhou Zhongqiong

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170804

Termination date: 20200119