CN111354503A - Conductive silver paste for flexible thin-film solar cell module and preparation method thereof - Google Patents
Conductive silver paste for flexible thin-film solar cell module and preparation method thereof Download PDFInfo
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- CN111354503A CN111354503A CN201811579638.XA CN201811579638A CN111354503A CN 111354503 A CN111354503 A CN 111354503A CN 201811579638 A CN201811579638 A CN 201811579638A CN 111354503 A CN111354503 A CN 111354503A
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- silver paste
- conductive silver
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 165
- 239000010409 thin film Substances 0.000 title claims abstract description 46
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 239000010949 copper Substances 0.000 claims abstract description 82
- 239000002245 particle Substances 0.000 claims abstract description 66
- 229910052802 copper Inorganic materials 0.000 claims abstract description 58
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 55
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 50
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 50
- 239000005416 organic matter Substances 0.000 claims abstract description 43
- 239000000853 adhesive Substances 0.000 claims abstract description 42
- 230000001070 adhesive effect Effects 0.000 claims abstract description 42
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 40
- 239000002184 metal Substances 0.000 claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 239000000203 mixture Substances 0.000 claims description 29
- 238000005096 rolling process Methods 0.000 claims description 28
- 238000003756 stirring Methods 0.000 claims description 26
- 239000011230 binding agent Substances 0.000 claims description 20
- 238000005303 weighing Methods 0.000 claims description 20
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 19
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- 239000003607 modifier Substances 0.000 claims description 19
- 229940116411 terpineol Drugs 0.000 claims description 19
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- 239000011347 resin Substances 0.000 claims description 17
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 14
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- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- ZFOZVQLOBQUTQQ-UHFFFAOYSA-N Tributyl citrate Chemical compound CCCCOC(=O)CC(O)(C(=O)OCCCC)CC(=O)OCCCC ZFOZVQLOBQUTQQ-UHFFFAOYSA-N 0.000 claims description 12
- IIZPXYDJLKNOIY-JXPKJXOSSA-N 1-palmitoyl-2-arachidonoyl-sn-glycero-3-phosphocholine Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@H](COP([O-])(=O)OCC[N+](C)(C)C)OC(=O)CCC\C=C/C\C=C/C\C=C/C\C=C/CCCCC IIZPXYDJLKNOIY-JXPKJXOSSA-N 0.000 claims description 11
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- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000000787 lecithin Substances 0.000 claims description 11
- 229940067606 lecithin Drugs 0.000 claims description 11
- 235000010445 lecithin Nutrition 0.000 claims description 11
- 229920001155 polypropylene Polymers 0.000 claims description 11
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 10
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 claims description 9
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 claims description 9
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 claims description 9
- 239000005642 Oleic acid Substances 0.000 claims description 9
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 claims description 9
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 claims description 9
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 9
- 239000000020 Nitrocellulose Substances 0.000 claims description 8
- 150000002148 esters Chemical class 0.000 claims description 8
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 8
- 229920001220 nitrocellulos Polymers 0.000 claims description 8
- 235000011837 pasties Nutrition 0.000 claims description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 7
- IFPMZBBHBZQTOV-UHFFFAOYSA-N 1,3,5-trinitro-2-(2,4,6-trinitrophenyl)-4-[2,4,6-trinitro-3-(2,4,6-trinitrophenyl)phenyl]benzene Chemical compound [O-][N+](=O)C1=CC([N+](=O)[O-])=CC([N+]([O-])=O)=C1C1=C([N+]([O-])=O)C=C([N+]([O-])=O)C(C=2C(=C(C=3C(=CC(=CC=3[N+]([O-])=O)[N+]([O-])=O)[N+]([O-])=O)C(=CC=2[N+]([O-])=O)[N+]([O-])=O)[N+]([O-])=O)=C1[N+]([O-])=O IFPMZBBHBZQTOV-UHFFFAOYSA-N 0.000 claims description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 6
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 claims description 6
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 6
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims description 6
- 239000003960 organic solvent Substances 0.000 claims description 6
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 claims description 6
- 229920001568 phenolic resin Polymers 0.000 claims description 6
- 229910052787 antimony Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- LOMVENUNSWAXEN-UHFFFAOYSA-N Methyl oxalate Chemical compound COC(=O)C(=O)OC LOMVENUNSWAXEN-UHFFFAOYSA-N 0.000 claims description 3
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 claims description 3
- 235000021355 Stearic acid Nutrition 0.000 claims description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052758 niobium Inorganic materials 0.000 claims description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 3
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 239000008117 stearic acid Substances 0.000 claims description 3
- 229910052727 yttrium Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000843 powder Substances 0.000 description 21
- 239000002002 slurry Substances 0.000 description 16
- 229910052709 silver Inorganic materials 0.000 description 13
- 239000004332 silver Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 238000012360 testing method Methods 0.000 description 11
- 229910001220 stainless steel Inorganic materials 0.000 description 10
- 239000010935 stainless steel Substances 0.000 description 10
- 235000019441 ethanol Nutrition 0.000 description 7
- 239000003921 oil Substances 0.000 description 7
- 238000001914 filtration Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Inorganic materials O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- LQZZUXJYWNFBMV-UHFFFAOYSA-N ethyl butylhexanol Natural products CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- HFLAMWCKUFHSAZ-UHFFFAOYSA-N niobium dioxide Inorganic materials O=[Nb]=O HFLAMWCKUFHSAZ-UHFFFAOYSA-N 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
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- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The invention relates to a conductive silver paste for a flexible thin-film solar cell module, which comprises the following components in percentage by mass: 70-80% of silver powder, 15-22% of organic adhesive, 1-10% of metal oxide auxiliary agent and 1-10% of organic matter coated and modified metal copper particles. The metal oxide auxiliary agent and the organic matter coated and modified metal copper particles added into the conductive silver paste have an obvious effect of improving the transverse tension resistance of the conductive silver paste after curing, and the organic matter coated and modified metal copper can also ensure that the conductivity of the conductive silver paste is not too low. The invention also relates to a preparation method of the conductive silver paste.
Description
Technical Field
The invention relates to the technical field of solar cells, in particular to conductive silver paste for a flexible thin-film solar cell module and a preparation method thereof.
Background
At present, when an industrialized thin-film solar cell module is manufactured, conductive silver paste is needed to be used for connecting a positive electrode and a negative electrode when two adjacent thin-film cells are connected in series. The thin-film solar cell is a flexible solar cell, and the connection effect between adjacent cell sheets of the module is particularly important in the folding process which may occur in the practical application of the module. If the silver paste has poor adhesion, low transverse tensile strength, poor stability, low conductivity and the like, adjacent battery plates are likely to be separated, the efficiency and the service life of the assembly are affected, and the whole assembly can be failed under severe conditions. In addition, when the cell modules are connected in series, the conduction between the positive electrode and the negative electrode is realized by utilizing the bonding and curing of the conductive silver paste and the copper electrode, the fusion property of the copper electrode and the silver paste and the size of the contact resistance also directly influence the output of the module current, if the contact resistance of the copper electrode and the silver paste is too large, the internal consumption is high, and the efficiency of the thin-film solar cell is greatly reduced.
In the prior art, a tensile force assistant or an inorganic adhesive is usually added in the process of preparing the conductive silver paste, the tensile force assistant is metal oxide particles such as Sn, Sb and the like, the inorganic adhesive is a glass frit, and most of the glass frit contains metal oxides of toxic substances such as Pb and the like. Although the transverse tension or the conductivity of the conductive silver paste of the crystalline silicon solar cell is improved by the components, the combination of the inorganic components containing Pb is not suitable for the flexible thin-film solar conductive silver paste and can damage the comprehensive conductivity of the component; meanwhile, the prior arts do not give enough attention to the problem of how to improve the adhesion and fusion of the copper electrode and the silver paste of the solar cell and reduce the contact resistance between the copper electrode and the silver paste. In addition, sufficient densification at the bond site is also required to improve the weatherability of the bond site.
Therefore, the invention aims to develop the conductive silver paste for connecting the positive electrode and the negative electrode of the solar cell piece, which is stable, has high adhesion, high tensile strength and high conductivity and is in good contact with a copper electrode, and is particularly suitable for the field of flexible thin-film solar cells to be popularized.
Disclosure of Invention
Technical problem to be solved
In order to solve the above problems in the prior art, the invention provides a conductive silver paste for a flexible thin-film solar cell module, which can ensure that the conductive silver paste has sufficient adhesion, transverse tension resistance and stability by changing the components of the conductive silver paste, and can improve the conductivity of the conductive silver paste, improve the contact between the conductive silver paste and a copper electrode, so that a current carrier can more smoothly pass through a contact surface between the silver and the copper, and ensure the transmission efficiency of current between a positive electrode and a negative electrode. The invention also relates to a preparation method of the conductive silver paste.
(II) technical scheme
In order to achieve the purpose, the invention adopts the main technical scheme that:
the conductive silver paste for the flexible thin-film solar cell module comprises the following components in percentage by mass: 70-80% of silver powder, 15-22% of organic adhesive, 1-10% of metal oxide auxiliary agent and 1-10% of organic matter coated and modified metal copper particles.
Preferably, the conductive silver paste comprises, in mass percent: 70-75% of silver powder, 15-20% of organic adhesive, 2-8% of metal oxide auxiliary agent and 2-8% of organic matter coated and modified metal copper particles.
Preferably, the organic matter coated modified metal copper particles are prepared by coating terpineol, PVP or oleic acid on the surface of metal copper with the particle size of 1-100 nm to modify the metal copper particles.
The organic matter is coated with the modified metal copper, so that the conductivity of the conductive silver paste is improved, the wettability of the conductive silver paste on a copper electrode is improved, the contact between the conductive silver paste and the copper electrode is improved, the contact resistance between silver and copper when the thin-film solar cell modules are connected in series is reduced, the using amount of expensive silver powder can be saved, and the cost is reduced.
Preferably, the silver powder is a spherical silver powder having an average particle diameter of 0.5 to 3 μm. The silver powder particles in the particle size range are moderate in size, and the parameters such as fineness of finished slurry can be guaranteed to meet the use requirements of the conductive silver paste for the flexible thin-film solar cell module.
Preferably, the organic binder is composed of 75-90 wt% of organic solvent and 10-25 wt% of high molecular organic resin; the organic solvent is selected from one or a combination of more of terpineol, diethylene glycol monobutyl ether, 2-hydroxyethyl-2-methyl-2-acrylic acid, ethylene glycol phenyl ether acetate, butyl carbitol acetate, dioctyl phthalate, glycol dodecate, dimethyl oxalate and triethanolamine; the high molecular organic resin is selected from one or more of nitrocellulose, polypropylene resin, phenolic resin, stearic acid, rosin and lecithin.
The organic adhesive is mainly used for uniformly dispersing spherical silver powder, a metal oxide auxiliary agent and organic matter coated and modified metal copper particles, so that the cohesiveness of the conductive silver paste is improved, and the reliability of the solar battery pack in series connection is ensured.
Preferably, the metal oxide auxiliary agent is one or a combination of more of metal oxides containing Sb, Sn, Cu, Zn, Fe, B, Y, Nb, Pd and the like. The addition of the metal oxide auxiliary agent can effectively improve the stability, weather resistance and transverse tensile strength of the cured conductive silver paste, thereby improving the reliability and service life of the thin-film solar cell module. Preferably, the metal oxide auxiliary agent contains SnO, the mass percentage of the metal oxide auxiliary agent in the conductive silver paste is less than 1%, and the SnO in the mass percentage range can not reduce the conductivity of the conductive silver paste, and can improve the density and the weather resistance of the bonding part of the conductive silver paste.
Preferably, the conductive silver paste is further added with a surface modifier, and the addition amount enables the viscosity of the conductive silver paste to reach 18000-22000mPa & s; the surface modifier is one or a mixture of more of alcohol ester dodeca, butyl carbitol acetate, oleic acid and tributyl citrate. The surface modifier is used for adjusting and improving the processing performances of the silver paste such as viscosity, wettability, thixotropy and the like.
The invention also provides a preparation method of the conductive silver paste for the flexible thin-film solar cell module, which comprises the following steps:
s1, weighing the components forming the organic adhesive according to the formula ratio, mixing and heating the components to 80-100 ℃ in a container, and stirring to obtain a paste-shaped organic adhesive with uniform color;
s2, mixing and stirring the pasty organic adhesive and the organic matter coated and modified metal copper particles to form a mixture; adjusting the rolling temperature of a three-roller machine, and rolling and dispersing the mixture on the three-roller machine for 5-10 times;
and S3, continuously adding the silver powder and the metal oxide auxiliary agent into a three-roller machine, stirring while adding to uniformly disperse the silver powder and the metal oxide auxiliary agent until the silver powder and the metal oxide auxiliary agent are completely added, and rolling and dispersing for 20-25 times by using the three-roller machine to obtain the homogeneous conductive silver paste.
Preferably, in S1, the organic binder comprises: 20 wt% of terpineol, 28 wt% of dioctyl phthalate, 20 wt% of diethylene glycol butyl ether, 9 wt% of diethylene glycol monobutyl ether, 14 wt% of nitrocellulose, 6 wt% of phenolic resin and 3 wt% of rosin; or:
the organic adhesive comprises the following components: 20% of terpineol, 29% of ethylene glycol phenyl ether acetate, 29% of diethylene glycol butyl ether, 2% of glycol decaester, 14% of rosin, 3% of polypropylene resin and 3% of lecithin.
Preferably, in S1, the heating is oil bath constant temperature heating to 80-90 ℃, and the stirring time is 4 h.
Preferably, the rolling temperature is 25-28 ℃ in S2-S3.
Preferably, after the step S3, adding the surface modifier and uniformly stirring to adjust the viscosity to 18000-22000mPa & S; the surface modifier is one or a mixture of more of alcohol ester dodeca, butyl carbitol acetate, oleic acid and tributyl citrate.
(III) advantageous effects
The invention has the beneficial effects that:
the conductive silver paste for the flexible thin-film solar cell module contains organic adhesives in proper proportion and types, can uniformly disperse silver powder, metal oxide auxiliaries and the like, improves the cohesiveness of the conductive silver paste, and ensures the reliability of the flexible thin-film solar cell module in series connection. The metal oxide auxiliary agent can effectively improve the stability and reliability of the solidified conductive silver paste and the transverse tensile strength of the conductive silver paste. The organic matter coated modified metal copper can be well dissolved with the organic adhesive and well dispersed in the organic adhesive due to the organic matter coated outside. When the conductive silver paste is used, the conductive silver paste is bonded with the copper electrode and is heated and cured at 110-150 ℃, and the conductive silver paste contains the organic matter coated and modified metal copper, so that the conductive silver paste has good wettability and contact property on the same copper electrode, the contact resistance of a bonding part can be reduced, and the transverse tensile strength of the bonding part can be improved. In addition, the copper particles coated by the organic matter also have higher conductivity, so that the using amount of expensive silver powder can be reduced, and the prepared conductive silver paste has higher conductivity. The tin oxide also enables the cured conductive silver paste to have better compactness, improves the weather resistance and tensile crack strength of a bonding part, relieves the corrosion of acid and alkali in the external environment on the bonding part, and prolongs the service life of the flexible thin-film solar cell module.
In the preparation process of the conductive silver paste, the organic adhesive and the organic matter coated and modified metal copper particles are uniformly dispersed, the two materials contain organic matters and are easy to disperse, silver powder is added, a three-roller machine is used for rolling for 20-25 times, the silver powder is extruded into the organic adhesive under the action of the rolling force of the three-roller machine, high homogenization is realized, and the uniformity, stability and reliability of the conductive silver paste are guaranteed.
According to the conductive silver paste, the metal oxide auxiliary agent and the organic matter coating modified metal copper particles are added, so that the stability, reliability and conductivity of the silver paste after solidification can be effectively improved, the contact resistance between a positive electrode and a negative electrode when flexible thin-film solar cell modules are connected in series is reduced, the efficiency of the thin-film solar cell modules is improved, and the service life of the thin-film solar cell modules is prolonged. The conductive silver paste disclosed by the invention is strong in adhesive force and high in stability, can ensure the close and effective connection of two adjacent battery pieces, reduces the risks of transverse tearing and positive and negative electrode disconnection, and can effectively improve the service life and reliability of the assembly. The invention improves the contact property of the silver-copper surface, realizes the contact optimization of the conductive silver paste and the Cu pole piece surface, enables the current carrier to freely and smoothly pass through the silver-copper contact surface, and improves the transmission efficiency of the current between the positive electrode and the negative electrode.
The conductive silver paste disclosed by the invention is excellent in performance, provides an improved idea for improving the performance of the conductive silver paste for the flexible thin-film solar cell, is simple in process, and can meet the requirement of industrial production and use.
Drawings
Fig. 1 is a flow chart of a preparation method of the conductive silver paste for the flexible thin-film solar cell module.
Detailed Description
For the purpose of better explaining the present invention and to facilitate understanding, the present invention will be described in detail by way of specific embodiments with reference to the accompanying drawings.
The invention provides a conductive silver paste for a flexible thin-film solar cell module, which comprises the following components in percentage by mass: 70-80% of silver powder, 15-22% of organic adhesive, 1-10% of metal oxide auxiliary agent and 1-10% of organic matter coated and modified metal copper particles. Preferably, the conductive silver paste contains 70-75% of silver powder, 15-20% of organic binder, 2-8% of metal oxide assistant and 2-8% of organic matter coated and modified metal copper particles. Preferably, the silver powder has a spherical shape with an average particle diameter of 0.5 to 3 μm.
Preferably, the organic matter coated modified metal copper particles are prepared by coating terpineol, PVP or oleic acid on metal copper with the particle size of 1-100 nm to modify superfine metal copper, so that the superfine copper is prevented from being agglomerated or oxidized due to larger surface activation energy.
Preferably, the organic binder is composed of 75-90 wt% of organic solvent and 10-25 wt% of high molecular organic resin; the organic solvent is selected from one or a combination of more of terpineol, diethylene glycol monobutyl ether, 2-hydroxyethyl-2-methyl-2-acrylic acid, ethylene glycol phenyl ether acetate, butyl carbitol acetate, dioctyl phthalate, glycol dodecate, dimethyl oxalate and triethanolamine; the high molecular organic resin is selected from one or more of nitrocellulose, polypropylene resin, phenolic resin, stearic acid, rosin and lecithin.
Preferably, the metal oxide auxiliary agent is one or a combination of more of metal oxides containing Sb, Sn, Cu, Zn, Fe, B, Y, Nb, Pd and the like; more preferably, the metal oxide promoter contains SnO.
Preferably, the conductive silver paste can be further added with a surface modifier, and the addition amount enables the viscosity of the conductive silver paste to reach 18000-22000mPa & s; the surface modifier is one or a mixture of more of alcohol ester dodeca, butyl carbitol acetate, oleic acid and tributyl citrate. The surface modifier is used for adjusting and improving the processing performances of the silver paste such as viscosity, wettability, thixotropy and the like.
As shown in fig. 1, the invention provides a method for preparing conductive silver paste for a flexible thin film solar cell module, which comprises the following steps:
s1, weighing the components forming the organic adhesive according to the formula ratio, mixing in a container, heating to 80-100 ℃, and continuously stirring to obtain a paste organic adhesive with uniform color for later use; preferably, the mixture is heated to 80-90 ℃ at constant temperature by adopting an oil bath, and the stirring time is 4 hours.
S2, mixing the pasty organic adhesive and the organic matter coated and modified metal copper particles, and continuously stirring to form a mixture; adjusting the rolling temperature and the rolling gap of a three-roller machine, and rolling and dispersing the mixture on the three-roller machine for 5-10 times; the rolling temperature is preferably 25-28 ℃.
S3, continuously adding the silver powder and the metal oxide auxiliary agent into a three-roller machine, stirring while adding until the silver powder and the metal oxide auxiliary agent are completely added, and rolling and dispersing for 20-25 times by using the three-roller machine to obtain homogeneous conductive silver paste;
s4, adding a surface modifier and uniformly stirring to adjust the viscosity to 18000-22000mPa & S; the surface modifier is one or a mixture of more of alcohol ester dodeca, butyl carbitol acetate, oleic acid and tributyl citrate.
Preferably, in S1, the organic binder comprises: 20 wt% of terpineol, 28 wt% of dioctyl phthalate, 20 wt% of diethylene glycol butyl ether, 9 wt% of diethylene glycol monobutyl ether, 14 wt% of nitrocellulose, 6 wt% of phenolic resin and 3 wt% of rosin; or:
the organic adhesive comprises the following components: 20% of terpineol, 29% of ethylene glycol phenyl ether acetate, 29% of diethylene glycol butyl ether, 2% of glycol decaester, 14% of rosin, 3% of polypropylene resin and 3% of lecithin.
In order to further illustrate the characteristics and technical effects of the scheme of the present invention, the following specific examples and experimental test results are combined for illustration.
Example 1
(1) Preparation of organic Binders
Respectively weighing 20% of terpineol, 29% of ethylene glycol phenyl ether acetate, 29% of diethylene glycol butyl ether, 2% of glycol decahydrate, 14% of rosin, 3% of polypropylene resin and 3% of lecithin in percentage by mass, uniformly mixing in a beaker, heating to 90 ℃ at constant temperature in an oil bath, and continuously stirring for 4 hours to obtain the pasty organic adhesive with uniform color for later use.
(2) The preparation of the conductive slurry comprises the following four steps:
firstly, weighing 20 mass percent of the organic binder and 2 mass percent of organic matter coated and modified Cu particles, fully and uniformly stirring the organic binder and the organic matter coated and modified Cu particles in a stainless steel round basin, and simultaneously weighing 75 mass percent of silver powder (spherical silver powder with the average particle size of 0.5-3 mu m) and 3 mass percent of metal oxide doping auxiliary agent SnO powder (the particle size is equivalent to that of the silver powder) in the other stainless steel round basin for later use.
The organic coating modified Cu particles can be prepared by arc plasma method at 1.013 x 105H at about Pa2And Ar atmosphere. The method comprises forming ultrafine copper metal particles by arc plasma method, allowing the formed ultrafine copper particles to be isolated from each other without agglomeration in the atmosphere, and performing surface treatment with organic terpineol vapor before the particles collide with each other to form secondary particles to obtain copper particles coated with uniform organic substance, wherein the coating thickness is 4-10 nm. The organic matter coated and modified Cu particles can also be prepared into Cu by co-heating copper sulfate, alkali and reducing agent solution2O particles and drying, then Cu2Slowly heating and reacting the O particles, the organic matters and the reducing agent in a water phase, washing with absolute ethyl alcohol, filtering, and drying to obtain the organic matter-coatedCopper particles. In the present application, each of examples and comparative examples employs terpineol-coated modified Cu particles prepared by the former method.
And secondly, dispersing the mixture of the organic binder and the organic matter modified Cu particles obtained in the first step on a three-roll machine for 10 times, then continuously adding silver powder and metal oxide doping aid SnO powder into the three-roll machine, continuously stirring by using a scraper knife to ensure uniform dispersion until the silver powder and the metal oxide doping aid SnO powder are completely added, and rolling the mixture for 25 times by using a three-roll machine to control the rolling temperature and the rolling gap.
And step three, testing the viscosity of the slurry rolled in the step two, adding a proper amount of surface modifier alcohol ester twelve, and adjusting the viscosity to 22000mPa & s. Then, the mixture is stirred manually or is put into a stirrer to be stirred for 30min until the slurry is uniform and the wettability is good.
And fourthly, filtering and packaging.
When the conductive silver paste is used for connecting thin film battery components in series, a proper amount of conductive silver paste is coated on the positive and negative electrodes (copper electrodes) of two flexible thin film solar components connected in series, and then the conductive silver paste is heated and cured for 25min at the temperature of 110-150 ℃ (the actual measurement temperature is 110-120 ℃).
Example 2
(1) Preparation of organic Binders
Respectively weighing 20% of terpineol, 29% of ethylene glycol phenyl ether acetate, 24% of diethylene glycol butyl ether, 2% of glycol decahydrate, 14% of rosin, 3% of polypropylene resin, 5% of nitrocellulose and 3% of lecithin in percentage by mass, uniformly mixing in a beaker, heating to 90 ℃ at constant temperature in an oil bath, and continuously stirring for 4 hours to obtain the pasty organic adhesive with uniform color for later use.
(2) The preparation of the conductive slurry comprises the following four steps:
firstly, weighing 20 mass percent of the organic adhesive and 8 mass percent of organic matter coated and modified Cu particles, fully and uniformly stirring the organic adhesive and the organic matter coated and modified Cu particles in a stainless steel round basin, and simultaneously weighing 70 mass percent of silver powder (spherical silver powder with the average particle size of 0.5-3 mu m), 1 mass percent of metal oxide doping auxiliary agent ZnO powder and 1 mass percent of Y2O3The powder (the particle size of the auxiliary agent is equivalent to that of the silver powder) is put in another stainless steel round basin for standby.
Secondly, dispersing the mixture of the organic adhesive and the organic matter coated and modified Cu particles obtained in the first step on a three-roller machine for 10 times, and then continuously adding silver powder and metal oxide doping aids ZnO and Y into the three-roller machine2O3And continuously stirring the powder by using a scraper knife to ensure uniform dispersion until the silver powder and the metal oxide doping auxiliary agent are completely added, and rolling the mixture for 20 times by using a three-roller machine to control the rolling temperature and the rolling gap.
And step three, testing the viscosity of the slurry rolled in the step two, adding a proper amount of citric acid serving as a surface modifier, and adjusting the viscosity to 18000mPa & s. Then, the mixture is stirred manually or is put into a stirrer to be stirred for 30min until the slurry is uniform and the wettability is good.
And fourthly, filtering and packaging.
When the conductive silver paste is used for connecting thin film battery components in series, a proper amount of conductive silver paste is coated on the positive and negative electrodes (copper pole pieces) of two flexible thin film solar components connected in series, and then the conductive silver paste is heated and cured for 25-30 min at the temperature of 110-150 ℃ (the actually measured temperature is 110-120 ℃).
Example 3
(1) Preparation of organic Binders
30 percent of terpineol, 29 percent of ethylene glycol phenyl ether acetate, 29 percent of diethylene glycol butyl ether, 2 percent of decaglycol ester, 4 percent of rosin, 3 percent of polypropylene resin and 3 percent of lecithin are respectively weighed and evenly mixed in a beaker, heated to 90 ℃ at constant temperature in an oil bath and continuously stirred for 4 hours to obtain the pasty organic adhesive with uniform color for later use.
(2) The preparation of the conductive slurry comprises the following four steps:
firstly, weighing 15 mass percent of the organic adhesive and 3 mass percent of organic matter coated and modified Cu particles, fully and uniformly stirring the organic adhesive and the organic matter coated and modified Cu particles in a stainless steel round basin, and simultaneously weighing 80 mass percent of silver powder (spherical silver powder with the average particle size of 0.5-3 mu m) and 1 mass percent of metal oxide doping auxiliary agent Sb2O3Powder and 1% of PdO powder (particle size of assistant and silver)Powder equivalent) is put in another stainless steel round basin for standby.
Secondly, dispersing the mixture of the organic adhesive and the organic matter coated and modified Cu particles obtained in the first step on a three-roller machine for 10 times, and then continuously adding silver powder and a metal oxide doping auxiliary agent Sb into the three-roller machine2O3And PdO powder is continuously stirred by a scraper knife to ensure uniform dispersion until the silver powder and the metal oxide doping auxiliary agent are completely added, and the mixture is rolled for 20 times by using a three-roller machine to control the rolling temperature and the rolling gap.
And thirdly, testing the viscosity of the slurry rolled in the second step, adding a proper amount of surface modifier alcohol ester twelve, and adjusting the viscosity to 20000mPa s. Then, the mixture is stirred manually or is put into a stirrer to be stirred for 30min until the slurry is uniform and the wettability is good.
And fourthly, filtering and packaging.
When the conductive silver paste is used for connecting thin film battery components in series, a proper amount of conductive silver paste is coated on the positive and negative electrodes (copper pole pieces) of two flexible thin film solar components connected in series, and then the conductive silver paste is heated and cured for 25-30 min at the temperature of 110-150 ℃ (the actually measured temperature is 110-120 ℃).
Example 4
(1) Preparation of organic Binders
Respectively weighing 20% of terpineol, 29% of ethylene glycol phenyl ether acetate, 21% of diethylene glycol butyl ether, 10% of decaglycol ester, 7% of rosin, 3% of polypropylene resin and 10% of lecithin in percentage by mass, uniformly mixing in a beaker, heating to 90 ℃ at constant temperature in an oil bath, and continuously stirring for 4 hours to obtain the pasty organic adhesive with uniform color for later use.
(2) The preparation of the conductive slurry comprises the following four steps:
firstly, weighing 20 mass percent of the organic adhesive and 2 mass percent of organic matter coated and modified Cu particles, fully and uniformly stirring the organic adhesive and the organic matter coated and modified Cu particles in a stainless steel round basin, and simultaneously weighing 75 mass percent of silver powder (spherical silver powder with the average particle size of 0.5-3 mu m), 2 mass percent of metal oxide doping auxiliary agent CuO powder and 1 mass percent of NbO2The powder (the particle size of the auxiliary agent is equivalent to that of the silver powder) is equivalent to the other stainless steel round basinAnd (4) preparing for later use.
Secondly, dispersing the mixture of the organic adhesive and the organic matter coated and modified Cu particles obtained in the first step on a three-roll machine for 10 times, and then continuously adding silver powder and metal oxide doping aids CuO and NbO into the three-roll machine2And continuously stirring the powder by using a scraper knife to ensure uniform dispersion until the silver powder and the metal oxide doping auxiliary agent powder are completely added, and rolling the mixture for 20 times by using a three-roller machine to control the rolling temperature and the rolling gap.
And step three, testing the viscosity of the slurry rolled in the step two, adding a proper amount of surface modifier alcohol ester twelve, and adjusting the viscosity to 21000 mPa.s. Then, the mixture is stirred manually or is put into a stirrer to be stirred for 30min until the slurry is uniform and the wettability is good.
And fourthly, filtering and packaging.
When the conductive silver paste is used for connecting thin film battery components in series, a proper amount of conductive silver paste is coated on the positive and negative electrodes (copper pole pieces) of two flexible thin film solar components connected in series, and then the conductive silver paste is heated and cured for 25-30 min at the temperature of 110-150 ℃ (the actually measured temperature is 110-120 ℃).
Example 5
(1) Preparation of organic Binders
Respectively weighing 20% of terpineol, 28% of ethylene glycol phenyl ether acetate, 25% of diethylene glycol butyl ether, 2% of dodecanol ester, 9% of rosin, 5% of nitrocellulose, 8% of polypropylene resin and 3% of lecithin in percentage by mass, uniformly mixing in a beaker, heating to 90 ℃ at constant temperature in an oil bath, and continuously stirring for 4 hours to obtain the pasty organic adhesive with uniform color for later use.
(2) The preparation of the conductive slurry comprises the following four steps:
firstly, weighing 18 mass percent of the organic binder and 3 mass percent of organic matter coated and modified Cu particles, fully and uniformly stirring the organic binder and the organic matter coated and modified Cu particles in a stainless steel round basin, and simultaneously weighing 75 mass percent of silver powder (spherical silver powder with the average particle size of 0.5-3 mu m), 2 mass percent of metal oxide doping auxiliary agent ZnO powder and 2 mass percent of SnO powder (the particle size of the auxiliary agent is equivalent to that of the silver powder) in the other stainless steel round basin for later use.
And secondly, dispersing the mixture of the organic adhesive and the organic matter coated and modified Cu particles obtained in the first step on a three-roll machine for 10 times, then continuously adding silver powder and metal oxide doping auxiliary agents ZnO and SnO powder into the three-roll machine, continuously stirring by using a scraper knife to ensure uniform dispersion until the silver powder and the metal oxide doping auxiliary agent powder are completely added, and rolling the mixture for 25 times by using a three-roll machine to control the rolling temperature and the rolling gap.
And thirdly, testing the viscosity of the slurry rolled in the second step, adding a proper amount of surface modifier butyl carbitol acetate, and adjusting the viscosity to 22000mPa & s. Then, the mixture is stirred manually or is put into a stirrer to be stirred for 30min until the slurry is uniform and the wettability is good.
And fourthly, filtering and packaging.
When the conductive silver paste is used for connecting thin film battery components in series, a proper amount of conductive silver paste is coated on the positive and negative electrodes (copper pole pieces) of two flexible thin film solar components connected in series, and then the conductive silver paste is heated and cured for 25-30 min at the temperature of 110-150 ℃ (the actually measured temperature is 110-120 ℃).
Comparative example 1
In the first step of step (2) of example 1, 2% of the organic matter-coated modified Cu particles were removed during weighing, so that the conductive silver paste components were: 20% of organic binder, 75% of silver powder and 5% of metal oxide doping aid SnO powder.
The other operating conditions and procedure were the same as in example 1, and the viscosity was adjusted to 22000 mPas.
Comparative example 2
This comparative example is the first step of step (2) of example 1, when weighing, 3% of SnO powder was removed, and the composition of the conductive silver paste was changed to: 20% of organic binder, 78% of silver powder and 2% of organic-coated modified Cu particles.
The other operating conditions and procedure were the same as in example 1, and the viscosity was adjusted to 22000 mPas.
Comparative example 3
In the first step of step (2) of example 1, 3% of SnO powder and 2% of organic matter-coated modified Cu particles were removed during weighing, so that the conductive silver paste had the following components: 20% of organic binder and 80% of silver powder.
The other operating conditions and procedure were the same as in example 1, and the viscosity was adjusted to 22000 mPas.
When the conductive silver paste is used for series connection of thin film battery components, a proper amount of conductive silver paste prepared in comparative examples 1-3 is coated on the positive and negative electrodes (copper pole pieces) of two flexible thin film solar components which are connected in series, and then the conductive silver paste is heated and cured for 25min at the temperature of 110-150 ℃ (actually measured temperature of 110-120 ℃).
The conductive silver pastes prepared in examples 1 to 5 and comparative examples 1 to 3 were subjected to a performance test, and after the conductive silver paste was completely cured, the copper electrode was pulled with a 180 ° pulling force, and the test was conducted to evaluate the transverse pulling force. And testing the contact resistance between the cured silver paste and the copper electrode by using a current-voltmeter (two testing ends of the current-voltmeter are respectively connected on the conductive silver paste and the copper electrode). The test results are given in the following table:
the test result shows that:
after being cured, the electric conductivity of the conductive silver paste in the embodiments 1-5 is higher than that of the comparative example 1 and is slightly lower than that of the comparative examples 2-3, the contact resistance of the embodiments 1-5 is obviously lower than that of the comparative example 1 and is basically close to that of the comparative examples 2-3; however, the transverse tension resistance of the conductive silver paste in examples 1 to 5 is superior to that of comparative examples 1 to 3, which shows that the addition of the metal oxide auxiliary agent and the organic matter coated and modified metal copper particles in the conductive silver paste has an obvious effect of improving the transverse tension resistance after curing, and the organic matter coated and modified metal copper replaces part of the metal oxide auxiliary agent, so that the conductivity of the conductive silver paste is not too low.
The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The conductive silver paste for the flexible thin-film solar cell module is characterized by comprising the following components in percentage by mass: 70-80% of silver powder, 15-22% of organic adhesive, 1-10% of metal oxide auxiliary agent and 1-10% of organic matter coated and modified metal copper particles.
2. The conductive silver paste for the flexible thin-film solar cell module according to claim 1, wherein the conductive silver paste comprises, by mass: 70-75% of silver powder, 15-20% of organic adhesive, 2-8% of metal oxide auxiliary agent and 2-8% of organic matter coated and modified metal copper particles.
3. The conductive silver paste for the flexible thin-film solar cell module according to claim 1, wherein the organic matter coated modified metal copper particles are coated on the surface of the metal copper with the particle size of 1-100 nm by terpineol, PVP or oleic acid.
4. The conductive silver paste for the flexible thin-film solar cell module according to claim 1, wherein the silver powder is spherical silver powder with an average particle size of 0.5-3 μm.
5. The conductive silver paste for the flexible thin-film solar cell module according to claim 1, wherein the organic binder is composed of 75-90 wt% of organic solvent and 10-25 wt% of high molecular organic resin; the organic solvent is selected from one or a combination of more of terpineol, diethylene glycol monobutyl ether, 2-hydroxyethyl-2-methyl-2-acrylic acid, ethylene glycol phenyl ether acetate, butyl carbitol acetate, dioctyl phthalate, glycol dodecate, dimethyl oxalate and triethanolamine; the high molecular organic resin is selected from one or more of nitrocellulose, polypropylene resin, phenolic resin, stearic acid, rosin and lecithin.
6. The conductive silver paste for the flexible thin-film solar cell module according to claim 1, wherein the metal oxide auxiliary agent is one or a combination of more of metal oxides such as Sb, Sn, Cu, Zn, Fe, B, Y, Nb and Pd.
7. The conductive silver paste for the flexible thin-film solar cell module as claimed in claim 1, wherein the conductive silver paste is further added with a surface modifier, and the addition amount enables the viscosity of the conductive silver paste to reach 18000-22000 mPa-s; the surface modifier is one or a mixture of more of alcohol ester dodeca, butyl carbitol acetate, oleic acid and tributyl citrate.
8. The preparation method of the conductive silver paste for the flexible thin-film solar cell module, which is described in any one of claims 1 to 7, comprises the following steps:
s1, weighing the components forming the organic adhesive according to the formula ratio, mixing and heating the components to 80-100 ℃ in a container, and stirring to obtain a paste-shaped organic adhesive with uniform color;
s2, mixing and stirring the pasty organic adhesive and the organic matter coated and modified metal copper particles to form a mixture; adjusting the rolling temperature of a three-roller machine, and rolling and dispersing the mixture on the three-roller machine for 5-10 times;
and S3, continuously adding the silver powder and the metal oxide auxiliary agent into a three-roller machine, stirring while adding to uniformly disperse the silver powder and the metal oxide auxiliary agent until the silver powder and the metal oxide auxiliary agent are completely added, and rolling and dispersing for 20-25 times by using the three-roller machine to obtain the homogeneous conductive silver paste.
9. The method according to claim 8, wherein in S1, the organic binder comprises: 20 wt% of terpineol, 28 wt% of dioctyl phthalate, 20 wt% of diethylene glycol butyl ether, 9 wt% of diethylene glycol monobutyl ether, 14 wt% of nitrocellulose, 6 wt% of phenolic resin and 3 wt% of rosin; or:
the organic adhesive comprises the following components: 20% of terpineol, 29% of ethylene glycol phenyl ether acetate, 29% of diethylene glycol butyl ether, 2% of glycol decaester, 14% of rosin, 3% of polypropylene resin and 3% of lecithin.
10. The method according to claim 8, wherein after step S3, the surface modifier is added and stirred uniformly to adjust the viscosity to 18000-22000 mPa-S; the surface modifier is one or a mixture of more of alcohol ester dodeca, butyl carbitol acetate, oleic acid and tributyl citrate.
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| CN117410010A (en) * | 2023-10-16 | 2024-01-16 | 上海银浆科技有限公司 | Low-temperature conductive silver paste for HJT battery and preparation method thereof |
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Application publication date: 20200630 |