CN111341712A - Wafer position calibration device and method - Google Patents
Wafer position calibration device and method Download PDFInfo
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- CN111341712A CN111341712A CN201811557495.2A CN201811557495A CN111341712A CN 111341712 A CN111341712 A CN 111341712A CN 201811557495 A CN201811557495 A CN 201811557495A CN 111341712 A CN111341712 A CN 111341712A
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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Abstract
The invention provides a wafer position checking device and a method, wherein the device comprises: a first sensor for outputting a first level signal, which is disposed at a first side of an inlet of each chamber; a second sensor for outputting a second level signal, which is disposed at a second side of the inlet of each chamber; the manipulator controller is used for controlling a manipulator and is provided with a first input channel and a second input channel; the manipulator controller acquires the manipulator coordinate information when at least one of the first level signal and the second level signal is switched between a high level and a low level, and determines the position information of the sensor which is switched based on the manipulator coordinate information; calculating and obtaining the actual position of the wafer based on the position information of the sensor which generates the conversion; and obtaining the target position of the wafer according to the actual position. The invention can effectively detect the actual position of the wafer while reducing the channels occupied by the sensor.
Description
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to a wafer position calibration device and method.
Background
Currently, in a semiconductor manufacturing process, as shown in fig. 1, a wafer to be processed is transferred from a wafer cassette 2 ' on a wafer loading cassette 1 ' to a wafer transfer station 3 ' by an atmospheric robot in a front end module of the apparatus, and then transferred to a process chamber 5 ' by a vacuum robot in a platform 4 ' for performing a process such as chemical vapor deposition, etching, etc.
Along with the reduction of the processing technology size and the line width of the wafer, the position precision of the wafer placed in the processing chamber by the vacuum mechanical arm is required to be higher and higher so as to ensure the accuracy, the repeatability and the yield of the wafer processing. Meanwhile, as the size of the wafer increases, the alignment accuracy for the wafer also increases.
In order to improve the accuracy of the wafer conveying position in the conveying system, currently, a plurality of optical fiber sensors 6 'are generally used in the existing wafer edge detection mode, the optical fiber sensors 6' are perpendicular to the surface of the wafer and are arranged at the inlet of each process cavity, when a vacuum manipulator conveys and transmits the wafer at each position in a vacuum conveying chamber, the wafer needs to pass through the corresponding projection position of the optical fiber sensor 6 ', and when no wafer passes through, the optical fiber sensor 6' acquires a signal; when the wafer passes by, the optical fiber sensors 6 'acquire another signal, and each optical fiber sensor 6' signal occupies one digital quantity channel. In fig. 1, the wafer transfer station 3 'is not provided with sensors, and each optical fiber sensor 6' occupies one digital channel.
The above sensor configuration requires each fiber sensor 6 'to occupy one digital channel, and for more chamber platforms or multi-size wafer-compatible platforms, more digital input channels are required, for example, when the platform 4' is a platform of eight process chambers 5 ', the number of channels provided by the vacuum controller is eight, and if the wafer transfer station 3' is also provided with a detection sensor, the number of channels required exceeds the number of channels provided by the current vacuum controller.
Disclosure of Invention
The present invention is directed to at least one of the technical problems of the prior art, and provides a wafer position calibration apparatus and method.
To achieve the object of the present invention, there is provided a wafer position calibration apparatus comprising:
a first sensor for outputting a first level signal, which is disposed at a first side of an inlet of each chamber;
a second sensor for outputting a second level signal, which is disposed at a second side of the inlet of each chamber;
the manipulator controller is used for controlling a manipulator and is provided with a first input channel and a second input channel, the first input channel is connected with the first sensor, and the second input channel is connected with the second sensor;
the manipulator controller acquires the manipulator coordinate information when at least one of the first level signal and the second level signal is switched between a high level and a low level, and determines the position information of the sensor which is switched based on the manipulator coordinate information; calculating and obtaining the actual position of the wafer based on the position information of the sensor which generates the conversion; and obtaining the target position of the wafer according to the actual position.
Preferably, the chamber comprises: a transfer chamber and/or a process chamber.
Preferably, at the inlet of the same chamber, the length of the line between the first sensor and the second sensor is smaller than the diameter of the wafer.
Preferably, the first sensor and the second sensor are optical fiber sensors.
A wafer position calibration method, comprising:
receiving a first level signal sent by a first sensor arranged on a first side of an inlet of each chamber by using a first input channel; receiving a second level signal sent by a second sensor arranged on the second side of the inlet of each chamber by using a second input channel;
judging whether at least one of the first level signal and the second level signal is converted between a high level and a low level;
if so, acquiring the coordinate information of the manipulator, and determining the position information of the sensor which is converted based on the coordinate information of the manipulator;
calculating and obtaining the actual position of the wafer based on the position information of the sensor which generates the conversion;
and obtaining the target position of the wafer according to the actual position.
Preferably, the determining the target position of the wafer according to the actual position comprises:
comparing the actual position of the wafer with a pre-stored optimal position of the wafer to obtain an eccentricity distance of the wafer;
and calculating to obtain the target position of the wafer according to the eccentric distance.
Preferably, after the step of comparing the actual position of the wafer with the pre-stored optimal position of the wafer to obtain the eccentricity distance of the wafer, and before the step of calculating the target position of the wafer according to the eccentricity distance, the method further comprises:
judging whether the eccentric distance of the wafer exceeds a preset range, if not, calculating according to the eccentric distance to obtain the target position of the wafer; if yes, the process ends.
Preferably, the step of determining whether at least one of the first level signal and the second level signal has a transition between a high level and a low level further includes:
judging whether the first level signal and the second level signal are subjected to first conversion between a high level and a low level;
if the first conversion occurs, judging whether the level signal of the first conversion occurs the second conversion between the low level and the high level;
and if the second conversion occurs, continuing to acquire the coordinate information of the manipulator and determining the converted sensor based on the coordinate information of the manipulator.
Preferably, the step of obtaining the actual position of the wafer by calculation based on the position information of the sensor where the conversion occurs further includes:
obtaining the coordinates of two positions on the wafer according to the position information of the sensor subjected to the first conversion;
obtaining the coordinates of the other two positions on the wafer according to the position information of the sensor subjected to the second conversion;
and calculating to obtain the coordinates of the circle center of the wafer according to the coordinates of the two positions on the wafer and the coordinates of the other two positions on the wafer.
Preferably, the high level is a signal sent when the sensor is covered by the wafer; the low level is a signal sent when the sensor is not covered by the wafer; or, the high level is a signal sent when the sensor is not covered by the wafer; the low level is the signal sent when the sensor is covered by the wafer.
The invention has the following beneficial effects:
the invention provides a wafer position calibration device.A manipulator controller acquires manipulator coordinate information when at least one of a first level signal sent by a first sensor and a second level signal sent by a second sensor is converted between a high level and a low level, and determines the position information of the converted sensor based on the manipulator coordinate information; and calculating and obtaining the actual position of the wafer based on the position information of the sensor subjected to conversion, and obtaining the target position of the wafer according to the actual position. According to the invention, the first level signal and the second level signal are acquired by only utilizing two input channels, and when at least one of the first level signal and the second level signal is converted between a high level and a low level, the actual movement position of the wafer can be determined by combining the coordinate information of the mechanical arm, so that the actual position of the wafer can be effectively detected while channels occupied by the sensor are reduced, and a basis is provided for wafer calibration.
The invention also provides a wafer position calibration method, which comprises the steps of receiving first level signals of first sensors arranged on the first sides of the inlets of the chambers by utilizing the first input channels; receiving a second level signal of a second sensor disposed at a second side of the inlet of each chamber using a second input channel; judging whether at least one of the first level signal and the second level signal is converted between a high level and a low level; if so, acquiring the coordinate information of the manipulator, and determining the position information of the sensor which is converted based on the coordinate information of the manipulator; calculating and obtaining the actual position of the wafer based on the position information of the sensor where the conversion occurs; and obtaining the target position of the wafer according to the actual position. According to the invention, the first level signal and the second level signal are acquired by only utilizing two input channels, and when at least one of the first level signal and the second level signal is converted between a high level and a low level, the actual movement position of the wafer can be determined by combining the coordinate information of the mechanical arm, so that the actual position of the wafer can be effectively detected while channels occupied by the sensor are reduced, and a basis is provided for wafer calibration.
Drawings
FIG. 1 is a block diagram of a prior art chamber and sensor;
FIG. 2 is a schematic structural diagram of a wafer position calibration apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic view of wafer movement according to an embodiment of the present invention;
FIG. 4 is a flowchart illustrating a method for calibrating a wafer position according to an embodiment of the present invention;
FIG. 5 is another flowchart of a wafer position calibration method according to an embodiment of the invention.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the following describes the wafer position calibration apparatus and method provided by the present invention in detail with reference to the accompanying drawings.
Example one
FIG. 2 is a schematic structural diagram of a wafer position calibration apparatus according to an embodiment of the present invention. The method comprises the following steps: the robot comprises a first sensor, a second sensor and a manipulator controller for controlling the manipulator; wherein the first sensor is used for outputting a first level signal, as shown in fig. 3, and is disposed at the first side of the inlet of each chamber; the second sensor is used for outputting a second level signal, as shown in fig. 3, and is arranged on the second side of the inlet of each chamber; the manipulator controller is provided with a first input channel and a second input channel, the first input channel is connected with the first sensor, and the second input channel is connected with the second sensor; the manipulator controller acquires manipulator coordinate information when at least one of the first level signal and the second level signal is switched between a high level and a low level, and determines position information of a sensor which is switched based on the manipulator coordinate information; calculating and obtaining the actual position of the wafer based on the position information of the sensor where the conversion occurs; and obtains the target position of the wafer based on the actual position.
According to the wafer position calibration device provided by the invention, a manipulator controller receives a first level signal of a first sensor by using a first input channel; receiving a second level signal of a second sensor by using a second input channel, acquiring coordinate information of the manipulator when at least one of the first level signal and the second level signal is converted between a high level and a low level, and determining position information of the sensor subjected to conversion based on the coordinate information of the manipulator; the actual position of the wafer is calculated and obtained based on the position information of the sensor which is converted, and the target position of the wafer is obtained according to the actual position of the wafer, so that the actual position of the wafer can be effectively detected while channels occupied by the sensor are reduced, and a basis is provided for wafer calibration.
In this embodiment, the output end of the first sensor at each chamber inlet is connected to the robot controller, so that the first input channel on the robot controller receives the output signal of the first sensor, i.e., the first level signal; in order to ensure the transmission safety of the first level signal, in another embodiment of the present invention, a first diode is further connected between the first sensor and the manipulator controller, a positive end of the first diode is connected to an output end of the first sensor, and a negative end of the first diode is connected to the manipulator controller; the output end of the second sensor of each chamber inlet is connected with the manipulator controller, so that a second input channel on the manipulator controller receives the output signal of the second sensor, namely a second level signal; in order to ensure the transmission safety of the second level signal, in another embodiment of the present invention, a second diode is further connected between the second sensor and the manipulator controller, a positive terminal of the second diode is connected to the output terminal of the second sensor, and a negative terminal of the second diode is connected to the manipulator controller.
Specifically, the chamber includes: a transfer chamber and/or a process chamber. In the embodiment of the invention, the chamber can be a transfer chamber, a process chamber or a transfer chamber and a process chamber.
Further, in another embodiment of the present invention, at the inlet of the same chamber, the length of the straight line connecting the first sensor and the second sensor is smaller than the diameter of the wafer. In this embodiment, at the entry of same cavity, set up the length of straight line between first sensor and the second sensor to be less than the diameter of wafer, when can be convenient for manipulator carry shape for circular wafer pass first sensor and second sensor, conversion between high level and the low level all can appear in first sensor and second sensor, and guarantee first sensor and second sensor are all in time quick to sending out signals to manipulator controller.
Further, in another embodiment of the present invention, the first sensor and the second sensor are fiber sensors. In the embodiment, in view of the characteristics of high sensitivity, electromagnetic interference resistance, strong atomic radiation performance, strong adaptability, small size and the like of optical fiber transmission, the optical fiber sensors are adopted by the first sensor and the second sensor, so that the wafer position calibration device disclosed by the invention is more flexible and has high accuracy.
As shown in fig. 3, a plurality of first sensors and second sensors are disposed at the inlet of each chamber, and each of the first sensors and the second sensors is disposed at both sides of each chamber, which may be a process chamber or/and a transfer chamber. Referring to fig. 3, the present invention may implement that the output terminals of the first sensors a located at the first side of the inlet of each chamber (PM1, PM2, PM3, PM4, LC, LB) are connected in parallel and send a first level signal to the robot controller, when all the first sensors a share a first input channel; the output ends of the second sensors a 'positioned at the second side of the inlet of each chamber (PM1, PM2, PM3, PM4, LC, LB) are connected in parallel and send a second level signal to the robot controller, when all the second sensors a' share a second input channel; the first side and the second side of the chamber inlet are two different positions in this embodiment. Since the manipulator can only carry a slide in one chamber at a time, the parallel connection of the sensor signals does not influence the calculation of the coordinate position of the controller, so that the previous multiple signal channels are saved into two signal input channels.
Example two
FIG. 4 is a flowchart of a wafer position calibration method according to an embodiment of the present invention, which includes the following steps:
step 101: a first input channel is used for receiving a first level signal sent by a first sensor arranged on a first side of an inlet of each chamber.
Step 102: and receiving a second level signal transmitted by a second sensor arranged on the second side of the inlet of each chamber by using a second input channel.
Step 103: judging whether at least one of the first level signal and the second level signal is converted between a high level and a low level; if yes, go to step 104; otherwise, return to execute step 103.
Specifically. The step of determining whether at least one of the first level signal and the second level signal has a transition between a high level and a low level, further comprises:
judging whether the first level signal and the second level signal are subjected to first conversion between a high level and a low level; if the first conversion occurs, judging whether the position signal with the first conversion occurs second conversion between a low level and a high level; if the second conversion occurs, step 104 is performed.
Further, the high level is a signal sent when the sensor is covered by the wafer; low level is the signal sent when the sensor is not covered by the wafer; alternatively, the high level is the signal sent when the sensor is not covered by the wafer; the low level is the signal sent when the sensor is covered by the wafer.
Step 104: and acquiring the coordinate information of the manipulator.
Step 105: the position information of the sensor where the conversion occurs is determined based on the robot coordinate information.
Specifically, the step of obtaining the actual position of the wafer based on the position information of the sensor where the conversion occurs by calculation further includes:
obtaining the coordinates of two positions on the wafer according to the position information of the sensor subjected to the first conversion; obtaining the coordinates of the other two positions on the wafer according to the position information of the sensor subjected to the second conversion; and calculating to obtain the coordinates of the center of the circle of the wafer according to the coordinates of the two positions on the wafer and the coordinates of the other two positions on the wafer.
Specifically, the shape of the wafer may be a circle, and when the shape of the wafer is not a circle, the coordinates of two locations on the inscribed circle of the wafer may be obtained from the position information of the sensor where the first conversion occurs, the coordinates of the other two locations on the inscribed circle of the wafer may be obtained from the position information of the sensor where the second conversion occurs, and the coordinates of the center of the inscribed circle of the wafer may be calculated from the coordinates of the two locations on the wafer and the coordinates of the other two locations.
Step 106: the actual position of the wafer is calculated based on the position information of the sensor where the conversion occurred.
Step 107: and obtaining the target position of the wafer according to the actual position.
Specifically, the step of obtaining the target position of the wafer according to the actual position further includes steps 1071 to 1073:
step 1071: the actual position of the wafer is calculated based on the position information of the sensor where the conversion occurred.
Step 1072: the actual position of the wafer is compared with the pre-stored optimum position of the wafer to obtain the eccentricity distance of the wafer.
Referring to fig. 3, the robot controller pre-stores the optimum position of the wafer at the position S ", and compares the actual position of the wafer with the pre-stored optimum position of the wafer at the position S", for example, vector subtraction, to obtain the eccentricity △ S of the wafer.
Step 1073: and calculating to obtain the target position of the wafer according to the eccentric distance.
Referring to fig. 3, the target position S of the center of the wafer can be obtained by calculating the eccentricity △ S in superposition with a target optimum value (when the wafer needs to be moved to the position 6, the robot controller prestores the target optimum value of the position 6. further, the calculation of the target position needs to be completed before the robot moves the wafer to the retracted position 4 and rotates to the position 5.
According to the wafer position calibration method provided by the embodiment of the invention, a first input channel is used for receiving a first level signal sent by a first sensor arranged on the first side of an inlet of each chamber; receiving a second level signal transmitted by a second sensor arranged on a second side of the inlet of each chamber by using a second channel; determining the position information of a sensor which generates high level and low level conversion based on the coordinate information of the mechanical arm, and calculating and obtaining the actual position of the wafer based on the position information of the sensor which generates the conversion; the wafer position detection method provided by the invention receives the signals of the sensors at the inlets of the chambers only through the two input channels, determines the position information of the sensors with high level and low level signal conversion according to the manipulator coordinate signals, and determines the actual position of the wafer based on the position information of the sensors with high level and low level signal conversion, thereby effectively detecting the actual position of the wafer while reducing the channels occupied by the sensors, and providing a basis for wafer calibration.
In fig. 3, in the process of moving the circular wafer from position 1 to position 4, the light of the sensor is blocked at position 2, the robot controller obtains a high level signal, when the wafer moves to position 3, the edge of the wafer leaves the light of the sensor, at this time, the sensor again generates a low level signal output due to the state change, and then the actual position S "of the center of the wafer circle is obtained through calculation by the software algorithm integrated in the robot controller.
In the embodiment of the invention, the wafer detection of all chambers can be satisfied only by signals of two input channels, namely the first input channel and the second input channel, and compared with the prior art that each sensor is connected with one input channel of the manipulator controller, the invention saves the input channels of the manipulator controller, and can accurately detect the position of the wafer while saving the input channels.
EXAMPLE III
FIG. 5 is a flowchart of another method for calibrating a wafer position according to an embodiment of the present invention, which includes the following steps:
step 200: and starting.
Step 201: a first input channel is used for receiving a first level signal sent by a first sensor arranged on a first side of an inlet of each chamber.
Step 202: and receiving a second level signal transmitted by a second sensor arranged on the second side of the inlet of each chamber by using a second input channel.
Step 203: judging whether at least one of the first level signal and the second level signal is converted between a high level and a low level; if yes, go to step 204; otherwise, return to execute step 203.
Step 204: manipulator coordinate information is acquired.
Step 205: the position information of the sensor where the conversion occurs is determined based on the robot coordinate information.
Step 206: the actual position of the wafer is calculated based on the position information of the sensor where the conversion occurred.
Step 207: the actual position of the wafer is compared with the pre-stored optimum position of the wafer to obtain the eccentricity distance of the wafer.
Step 208: judging whether the eccentric distance of the wafer exceeds a preset range, if not, executing a step 209; otherwise, step 210 is performed.
Step 209: and calculating to obtain the target position of the wafer according to the eccentric distance.
Step 210: and (6) ending.
According to the wafer position detection method provided by the embodiment of the invention, before the target position of the wafer is obtained according to the eccentricity calculation, whether the eccentricity exceeds the preset range is judged firstly, and if the eccentricity does not exceed the preset range, the target position of the wafer is calculated according to the eccentricity. By the method, whether the deviation position of the wafer is within a reasonable range can be predetermined by judging whether the eccentric distance exceeds a preset range, and if so, the target position can be calculated by adopting the current eccentric distance; when the eccentric distance of the wafer is not within a reasonable range, an alarm can be sent to warn the deviation of the wafer direction.
Example four
To the above method embodiment, the present invention further provides a wafer position detecting device, including: the device comprises a first acquisition unit, a second acquisition unit, a judgment unit and a control unit.
The first acquisition unit is used for receiving a first level signal sent by a first sensor arranged on the first side of an inlet of each chamber by using a first input channel; the second acquisition unit is used for receiving a second level signal sent by a second sensor arranged on the second side of the inlet of each chamber by using a second input channel; the judging unit is used for judging whether at least one of the first level signal and the second level signal is converted between a high level and a low level and sending a judgment result to the control unit; the control unit acquires the coordinate information of the mechanical arm according to the judgment result and determines a sensor for conversion based on the coordinate information of the mechanical arm; the actual position of the wafer is obtained by calculation based on the position information of the sensor where the conversion has occurred, and the target position of the wafer is obtained from the actual position.
The wafer detection device provided by the embodiment of the invention utilizes the first input channel to receive the first level signal sent by the first sensor arranged at the first side of the inlet of each chamber; receiving a second level signal sent by a second sensor arranged on a second side of the inlet of each chamber by using a second input channel; judging whether at least one of the first level signal and the second level signal is converted between a high level and a low level, if so, acquiring coordinate information of the manipulator, and determining a sensor for conversion based on the coordinate information of the manipulator; and calculating and obtaining the actual position of the wafer based on the position information of the sensor subjected to conversion, and obtaining the target position of the wafer according to the actual position. The invention can effectively detect the actual position of the wafer while reducing the channels occupied by the sensor.
Specifically, the determining unit includes a first determining module and a second determining module.
The first judging module is used for judging whether the first level signal and the second level signal are subjected to first conversion between a high level and a low level.
The second judging module is used for judging whether the position signal subjected to the first conversion is subjected to second conversion between a low level and a high level after the first conversion is carried out; and if the second conversion occurs, sending the conversion result to the control unit so that the control unit acquires the coordinate information of the manipulator, determines the sensor which is subjected to the conversion based on the coordinate information of the manipulator, calculates and obtains the actual position of the wafer based on the position information of the sensor which is subjected to the first conversion and the second conversion, and obtains the target position of the wafer according to the actual position.
Specifically, the control unit is further used for obtaining coordinates of two positions on the wafer according to the position information of the sensor subjected to the first conversion; obtaining the coordinates of the other two positions on the wafer according to the position information of the sensor subjected to the second conversion; and calculating to obtain the coordinates of the center of the circle of the wafer according to the coordinates of the two positions on the wafer and the coordinates of the other two positions on the wafer. In the embodiment of the invention, when the shape of the wafer is circular, the actual circle center position of the wafer can be effectively positioned; when the shape of the wafer is not circular, the center of the wafer inscribed circle can be effectively positioned.
Specifically, in the embodiment of the present invention, the high level is a signal sent when the sensor is covered by the wafer; low level is the signal sent when the sensor is not covered by the wafer; alternatively, the high level is the signal sent when the sensor is not covered by the wafer; the low level is the signal sent when the sensor is covered by the wafer.
Further, in another embodiment of the present invention, the determining unit is further configured to compare the wafer position with a pre-stored optimal position of the wafer to obtain an eccentric distance of the wafer; the control unit is also used for calculating and obtaining the target position of the wafer according to the eccentric distance.
Furthermore, in another embodiment of the present invention, the determining unit is further configured to determine whether the eccentric distance of the wafer exceeds a preset range after obtaining the eccentric distance of the wafer, and send the evaluation result to the control unit; and when the control unit does not exceed the preset range, calculating and obtaining the target position of the wafer according to the eccentric distance.
In summary, the wafer position detecting method and apparatus provided by the embodiments of the present invention utilize the first input channel to receive the first level signal sent by the first sensor disposed on the first side of the inlet of each chamber, utilize the second input channel to receive the second level signal sent by the second sensor disposed on the second side of the inlet of each chamber, when at least one of the first level signal and the second level signal is switched between the high level and the low level, the control unit determines the sensor that is switched according to the robot coordinate information, and calculates and obtains the actual position of the wafer based on the position information of the sensor that is switched.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A wafer position calibration device, comprising:
a first sensor for outputting a first level signal, which is disposed at a first side of an inlet of each chamber;
a second sensor for outputting a second level signal, which is disposed at a second side of the inlet of each chamber;
the manipulator controller is used for controlling a manipulator and is provided with a first input channel and a second input channel, the first input channel is connected with the first sensor, and the second input channel is connected with the second sensor;
the manipulator controller acquires the manipulator coordinate information when at least one of the first level signal and the second level signal is switched between a high level and a low level, and determines the position information of the sensor which is switched based on the manipulator coordinate information; calculating and obtaining the actual position of the wafer based on the position information of the sensor which generates the conversion; and obtaining the target position of the wafer according to the actual position.
2. A wafer position calibration device as recited in claim 1, wherein the chamber comprises: a transfer chamber and/or a process chamber.
3. A wafer position calibration device as recited in claim 2, wherein a length of a straight line connecting the first sensor and the second sensor is smaller than a diameter of the wafer at an inlet of the same chamber.
4. A wafer position calibration device as set forth in any one of claims 1-3 wherein said first sensor and said second sensor are fiber optic sensors.
5. A method for calibrating a wafer position, comprising:
receiving a first level signal sent by a first sensor arranged on a first side of an inlet of each chamber by using a first input channel; receiving a second level signal sent by a second sensor arranged on the second side of the inlet of each chamber by using a second input channel;
judging whether at least one of the first level signal and the second level signal is converted between a high level and a low level;
if so, acquiring the coordinate information of the manipulator, and determining the position information of the sensor which is converted based on the coordinate information of the manipulator;
calculating and obtaining the actual position of the wafer based on the position information of the sensor which generates the conversion;
and obtaining the target position of the wafer according to the actual position.
6. A wafer position calibration method as claimed in claim 5, characterized in that said determining a target position of the wafer from the actual position comprises:
comparing the actual position of the wafer with a pre-stored optimal position of the wafer to obtain an eccentricity distance of the wafer;
and calculating to obtain the target position of the wafer according to the eccentric distance.
7. A wafer position calibration method as defined in claim 6, further comprising, after the step of comparing the actual position of the wafer with the pre-stored optimum position of the wafer to obtain the decentering distance of the wafer, and before the step of calculating the target position of the wafer according to the decentering distance:
judging whether the eccentric distance of the wafer exceeds a preset range, if not, calculating according to the eccentric distance to obtain the target position of the wafer; if yes, the process ends.
8. A method as defined in claim 5, wherein the step of determining whether at least one of the first level signal and the second level signal transitions between a high level and a low level further comprises:
judging whether the first level signal and the second level signal are subjected to first conversion between a high level and a low level;
if the first conversion occurs, judging whether the level signal of the first conversion occurs the second conversion between the low level and the high level;
and if the second conversion occurs, continuing to acquire the coordinate information of the manipulator and determining the converted sensor based on the coordinate information of the manipulator.
9. A wafer position calibration method as recited in claim 8, wherein the step of obtaining the actual position of the wafer based on the position information calculation of the sensor where the conversion occurred further comprises:
obtaining the coordinates of two positions on the wafer according to the position information of the sensor subjected to the first conversion;
obtaining the coordinates of the other two positions on the wafer according to the position information of the sensor subjected to the second conversion;
and calculating to obtain the coordinates of the circle center of the wafer according to the coordinates of the two positions on the wafer and the coordinates of the other two positions on the wafer.
10. A wafer position calibration method as recited in claim 5, wherein the high level is a signal transmitted when the sensor is covered by the wafer; the low level is a signal sent when the sensor is not covered by the wafer; or, the high level is a signal sent when the sensor is not covered by the wafer; the low level is the signal sent when the sensor is covered by the wafer.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006019388A (en) * | 2004-06-30 | 2006-01-19 | Yaskawa Electric Corp | Wafer pre-alignment apparatus and pre-alignment method |
| CN201181931Y (en) * | 2008-01-25 | 2009-01-14 | 长沙南车电气设备有限公司 | Automatic switchover apparatus for multiplex pulse signal |
| CN101383311A (en) * | 2007-09-04 | 2009-03-11 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Wafer transmission system |
| CN202406224U (en) * | 2011-12-16 | 2012-08-29 | 栾志超 | Multipath image acquisition front-end device |
| WO2013143677A1 (en) * | 2012-03-30 | 2013-10-03 | Innolas Semiconductor GmbH | Handling unit for wafers and method for picking up a wafer |
| CN104122814A (en) * | 2014-05-14 | 2014-10-29 | 黄山市北川电子科技有限公司 | Switching volume acquisition and conversion detection circuit and detection method thereof |
| CN105655266A (en) * | 2014-11-12 | 2016-06-08 | 沈阳新松机器人自动化股份有限公司 | DSP-based wafer eccentricity online detection apparatus and method |
-
2018
- 2018-12-19 CN CN201811557495.2A patent/CN111341712B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006019388A (en) * | 2004-06-30 | 2006-01-19 | Yaskawa Electric Corp | Wafer pre-alignment apparatus and pre-alignment method |
| CN101383311A (en) * | 2007-09-04 | 2009-03-11 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Wafer transmission system |
| CN201181931Y (en) * | 2008-01-25 | 2009-01-14 | 长沙南车电气设备有限公司 | Automatic switchover apparatus for multiplex pulse signal |
| CN202406224U (en) * | 2011-12-16 | 2012-08-29 | 栾志超 | Multipath image acquisition front-end device |
| WO2013143677A1 (en) * | 2012-03-30 | 2013-10-03 | Innolas Semiconductor GmbH | Handling unit for wafers and method for picking up a wafer |
| CN104122814A (en) * | 2014-05-14 | 2014-10-29 | 黄山市北川电子科技有限公司 | Switching volume acquisition and conversion detection circuit and detection method thereof |
| CN105655266A (en) * | 2014-11-12 | 2016-06-08 | 沈阳新松机器人自动化股份有限公司 | DSP-based wafer eccentricity online detection apparatus and method |
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