CN111341712B - Wafer position calibration device and method - Google Patents
Wafer position calibration device and method Download PDFInfo
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- CN111341712B CN111341712B CN201811557495.2A CN201811557495A CN111341712B CN 111341712 B CN111341712 B CN 111341712B CN 201811557495 A CN201811557495 A CN 201811557495A CN 111341712 B CN111341712 B CN 111341712B
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- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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Abstract
The invention provides a wafer position checking device and a method, wherein the device comprises the following steps: a first sensor for outputting a first level signal, which is disposed at an inlet first side of each chamber; a second sensor for outputting a second level signal, which is disposed at an inlet second side of each chamber; the manipulator controller is used for controlling the manipulator and is provided with a first input channel and a second input channel; the manipulator controller obtains the manipulator coordinate information when at least one of the first level signal and the second level signal is converted between a high level and a low level, and determines the position information of a sensor subjected to conversion based on the manipulator coordinate information; calculating and obtaining the actual position of the wafer based on the position information of the sensor subjected to conversion; and obtaining a target position of the wafer according to the actual position. By the invention, the actual position of the wafer can be effectively detected while the channels occupied by the sensor are reduced.
Description
Technical Field
The present invention relates to the field of semiconductor manufacturing, and in particular, to a wafer position calibration apparatus and method.
Background
Currently, in the semiconductor manufacturing process, as shown in fig. 1, wafers to be processed are transferred from a cassette 2' on a wafer cassette 1' to a wafer transfer station 3' through an atmospheric robot in a front end module of the apparatus, and then transferred to a process chamber 5' by a vacuum robot in a stage 4' for performing processes such as chemical vapor deposition, etching, etc.
As wafer processing technology size and line width decrease, the accuracy of the position of the vacuum robot to place the wafer in the processing chamber is also required to be higher and higher, so as to ensure the accuracy, repeatability and yield of wafer processing. At the same time, as the wafer size increases, the alignment accuracy for the wafer increases.
In order to improve the accuracy of the transmission position of the wafer in the transmission system, a plurality of optical fiber sensors 6 'are generally utilized in the existing wafer edge detection mode, the optical fiber sensors 6' are arranged at the inlet of each process cavity perpendicularly to the surface of the wafer, when the vacuum mechanical arm carries and transmits the wafer at each position in the vacuum transmission chamber, the wafer needs to pass through the projection position of the corresponding optical fiber sensor 6', and when no wafer passes through, the optical fiber sensor 6' acquires a signal; as the wafer passes, the fibre-optic sensors 6 'acquire another signal, each fibre-optic sensor 6' signal occupying a digital quantity channel. In fig. 1, the wafer transfer station 3 'is not provided with sensors, and each optical fiber sensor 6' occupies a digital quantity channel.
The above sensor configuration requires that each optical fiber sensor 6 'occupy one digital channel, and for more chamber platforms or multi-size wafer compatible platforms, more digital input channels are required, for example, when the platform 4' is the platform of eight process chambers 5', the number of channels provided by the vacuum controller is eight, if the detecting sensor is also provided at the wafer transfer station 3', the number of channels required exceeds the number of channels provided by the current vacuum controller.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art, and provides a wafer position calibration device and a method.
In order to achieve the object of the present invention, there is provided a wafer position calibration apparatus comprising:
a first sensor for outputting a first level signal, which is disposed at an inlet first side of each chamber;
a second sensor for outputting a second level signal, which is disposed at an inlet second side of each chamber;
the manipulator controller is used for controlling the manipulator and is provided with a first input channel and a second input channel, the first input channel is connected with the first sensor, and the second input channel is connected with the second sensor;
the manipulator controller obtains the manipulator coordinate information when at least one of the first level signal and the second level signal is converted between a high level and a low level, and determines the position information of a sensor subjected to conversion based on the manipulator coordinate information; calculating and obtaining the actual position of the wafer based on the position information of the sensor subjected to conversion; and obtaining a target position of the wafer according to the actual position.
Preferably, the chamber comprises: a transfer chamber and/or a process chamber.
Preferably, at the entrance of the same chamber, the length of the line between the first sensor and the second sensor is smaller than the diameter of the wafer.
Preferably, the first sensor and the second sensor are optical fiber sensors.
A wafer position calibration method, comprising:
receiving, with a first input channel, a first level signal transmitted by a first sensor disposed on a first side of an inlet of each chamber; and receiving, with a second input channel, a second level signal transmitted by a second sensor disposed on a second side of the inlet of each chamber;
judging whether at least one of the first level signal and the second level signal generates transition between high level and low level;
if yes, acquiring manipulator coordinate information, and determining position information of a sensor subjected to conversion based on the manipulator coordinate information;
calculating and obtaining the actual position of the wafer based on the position information of the sensor subjected to conversion;
and obtaining the target position of the wafer according to the actual position.
Preferably, the determining the target position of the wafer according to the actual position includes:
comparing the actual position of the wafer with a pre-stored optimal position of the wafer to obtain an eccentric distance of the wafer;
and calculating and obtaining the target position of the wafer according to the eccentric distance.
Preferably, after the step of comparing the actual position of the wafer with a pre-stored optimal position of the wafer to obtain an eccentric distance of the wafer, and before the step of obtaining a target position of the wafer according to the eccentric distance calculation, the method further comprises:
judging whether the eccentric distance of the wafer exceeds a preset range, if not, carrying out the step of obtaining the target position of the wafer according to the eccentric distance calculation; if yes, the flow ends.
Preferably, the step of determining whether at least one of the first level signal and the second level signal makes a transition between a high level and a low level further includes:
judging whether the first level signal and the second level signal occur in a first transition between a high level and a low level;
if the first transition occurs, judging whether the level signal of the first transition occurs between a low level and a high level for the second transition;
and if the second conversion occurs, continuing to execute the steps of acquiring the coordinate information of the manipulator and determining the sensor subjected to the conversion based on the coordinate information of the manipulator.
Preferably, the step of calculating the actual position of the wafer based on the position information of the sensor that generates the conversion further includes:
obtaining coordinates of two positions on the wafer according to the position information of the sensor subjected to the first conversion;
obtaining coordinates of two other positions on the wafer according to the position information of the sensor subjected to the second conversion;
and calculating according to the coordinates of the two positions on the wafer and the coordinates of the other two positions on the wafer to obtain the center coordinates of the wafer.
Preferably, the high level is a signal transmitted when the sensor is covered by a wafer; the low level is a signal sent when the sensor is not covered by the wafer; alternatively, the high level is a signal transmitted when the sensor is not covered by the wafer; the low level is the signal sent when the sensor is covered by the wafer.
The invention has the following beneficial effects:
the invention provides a wafer position calibration device, wherein a manipulator controller acquires manipulator coordinate information when at least one of a first level signal sent by a first sensor and a second level signal sent by a second sensor is converted between a high level and a low level, and determines the position information of the converted sensor based on the manipulator coordinate information; the actual position of the wafer is calculated based on the position information of the sensor where the conversion occurs, and the target position of the wafer is obtained from the actual position. According to the invention, the first level signal and the second level signal are obtained only by using the two input channels, and when at least one of the first level signal and the second level signal is converted between high level and low level, the actual movement position of the wafer can be determined by combining the coordinate information of the manipulator, so that the actual position of the wafer can be effectively detected while the channels occupied by the sensor are reduced, and a basis is provided for wafer calibration.
The invention also provides a wafer position calibration method, which utilizes a first input channel to receive a first level signal of a first sensor arranged at a first side of an inlet of each chamber; receiving a second level signal of a second sensor disposed on a second side of the inlet of each chamber using a second input channel; judging whether at least one of the first level signal and the second level signal generates transition between high level and low level; if yes, acquiring the coordinate information of the manipulator, and determining the position information of the sensor subjected to conversion based on the coordinate information of the manipulator; calculating and obtaining the actual position of the wafer based on the position information of the sensor subjected to conversion; the target position of the wafer is obtained from the actual position. According to the invention, the first level signal and the second level signal are obtained only by using the two input channels, and when at least one of the first level signal and the second level signal is converted between high level and low level, the actual movement position of the wafer can be determined by combining the coordinate information of the manipulator, so that the actual position of the wafer can be effectively detected while the channels occupied by the sensor are reduced, and a basis is provided for wafer calibration.
Drawings
FIG. 1 is a block diagram of a chamber and sensor of the prior art;
FIG. 2 is a schematic diagram of a wafer position calibration apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of wafer movement in accordance with an embodiment of the present invention;
FIG. 4 is a flow chart of a wafer position calibration method according to an embodiment of the present invention;
FIG. 5 is a flowchart of another method for calibrating a wafer position according to an embodiment of the present invention.
Detailed Description
In order to better understand the technical solutions of the present invention, the following describes the wafer position calibration device and method provided by the present invention in detail with reference to the accompanying drawings.
Example 1
Fig. 2 is a schematic structural diagram of a wafer position calibration device according to an embodiment of the invention. Comprising the following steps: a first sensor, a second sensor, and a robot controller for controlling the robot; wherein the first sensor is configured to output a first level signal, as shown in fig. 3, disposed at a first side of an inlet of each chamber; the second sensor is used for outputting a second level signal, and is arranged on the second side of the inlet of each chamber as shown in fig. 3; the manipulator controller is provided with a first input channel and a second input channel, the first input channel is connected with the first sensor, and the second input channel is connected with the second sensor; the method comprises the steps that when at least one of a first level signal and a second level signal is converted between a high level and a low level, the manipulator controller obtains manipulator coordinate information, and position information of a sensor subjected to conversion is determined based on the manipulator coordinate information; calculating and obtaining the actual position of the wafer based on the position information of the sensor subjected to conversion; and obtaining a target position of the wafer according to the actual position.
The wafer position calibration device provided by the invention has the advantages that the manipulator controller receives a first level signal of the first sensor through the first input channel; receiving a second level signal of a second sensor by using a second input channel, acquiring coordinate information of a manipulator when at least one of the first level signal and the second level signal is converted between a high level and a low level, and determining position information of the converted sensor based on the manipulator coordinate information; the actual position of the wafer is obtained by calculation based on the position information of the sensor which generates the conversion, and the target position of the wafer is obtained according to the actual position of the wafer, so that the actual position of the wafer can be effectively detected while channels occupied by the sensor are reduced, and a basis is provided for wafer calibration.
In this embodiment, the output ends of the first sensors at the inlets of the chambers are all connected with the manipulator controller, so that the first input channel on the manipulator controller receives the output signal-the first level signal of the first sensor; in order to ensure the transmission safety of the first level signal, in another embodiment of the invention, a first diode is further connected between the first sensor and the manipulator controller, the positive end of the first diode is connected with the output end of the first sensor, and the negative end of the first diode is connected with the manipulator controller; the output ends of the second sensors at the inlets of the chambers are connected with the manipulator controller, so that a second input channel on the manipulator controller receives an output signal-a second level signal of the second sensor; in order to ensure the transmission safety of the second level signal, in another embodiment of the present invention, a second diode is further connected between the second sensor and the manipulator controller, the positive terminal of the second diode is connected to the output terminal of the second sensor, and the negative terminal of the second diode is connected to the manipulator controller.
Specifically, the chamber includes: a transfer chamber and/or a process chamber. In the embodiment of the invention, the chamber can be a transfer chamber, a process chamber or a transfer chamber and a process chamber.
Further, in another embodiment of the present invention, at the entrance of the same chamber, the length of the straight line between the first sensor and the second sensor is smaller than the diameter of the wafer. In this embodiment, at the entrance of the same chamber, the length of the straight line connecting line between the first sensor and the second sensor is set to be smaller than the diameter of the wafer, so that when the manipulator carries the wafer with a circular shape to pass through the first sensor and the second sensor, the first sensor and the second sensor can both generate the transition between the high level and the low level, and the first sensor and the second sensor can both timely and rapidly send signals to the manipulator controller.
Further, in another embodiment of the present invention, the first sensor and the second sensor are optical fiber sensors. In this embodiment, in view of the characteristics of high sensitivity, electromagnetic interference resistance, strong atomic radiation performance, strong adaptability, small size and the like of optical fiber transmission, the first sensor and the second sensor both adopt optical fiber sensors, so that the wafer position calibration device provided by the invention is more flexible and has high accuracy.
As shown in fig. 3, the first sensor and the second sensor are disposed at the inlet of each chamber, and each of the first sensor and the second sensor is disposed at two sides of each chamber, which may be a process chamber or/and a transfer chamber. Referring to fig. 3, the present invention may implement that the output ends of the first sensors a located at the first sides of the inlets of the respective chambers (PM 1, PM2, PM3, PM4, LC, LB) are connected in parallel and then transmit a first level signal to the robot controller, where all the first sensors a share a first input channel; the output ends of the second sensors A 'positioned at the second side of the inlets of the chambers (PM 1, PM2, PM3, PM4, LC and LB) are connected in parallel and then send a second level signal to the manipulator controller, and all the second sensors A' share a second input channel; in this embodiment, the first side and the second side of the chamber inlet are at two different positions. Because the manipulator can only slide on one chamber at a time, the parallel connection of sensor signals does not influence the controller to calculate the coordinate position, so that the prior multiple signal channels are saved as two signal input channels.
Example two
FIG. 4 is a flowchart showing a wafer position calibration method according to an embodiment of the invention, which includes the following steps:
step 101: a first level signal transmitted by a first sensor disposed on a first side of an inlet of each chamber is received with a first input channel.
Step 102: a second level signal transmitted by a second sensor disposed on a second side of the inlet of each chamber is received using a second input channel.
Step 103: judging whether at least one of the first level signal and the second level signal generates transition between high level and low level; if yes, go to step 104; otherwise, go back to step 103.
Specifically, the present invention relates to a method for manufacturing a semiconductor device. The step of determining whether at least one of the first level signal and the second level signal has a transition between a high level and a low level, further comprises:
judging whether the first level signal and the second level signal are subjected to first transition between a high level and a low level; if the first transition occurs, judging whether the position signal with the first transition occurs between the low level and the high level for the second transition; if the second transition occurs, step 104 is performed.
Further, the high level is a signal transmitted when the sensor is covered by the wafer; the low level is the signal sent when the sensor is not covered by the wafer; alternatively, the high level is a signal sent when the sensor is not covered by the wafer; the low level is the signal sent when the sensor is covered by the wafer.
Step 104: and acquiring the coordinate information of the manipulator.
Step 105: position information of the sensor where the conversion occurs is determined based on the robot coordinate information.
Specifically, the step of calculating the actual position of the wafer based on the position information of the sensor where the conversion occurs, further includes:
acquiring coordinates of two positions on the wafer according to the position information of the sensor subjected to the first conversion; acquiring coordinates of two other positions on the wafer according to the position information of the sensor subjected to the second conversion; and calculating according to the coordinates of two positions on the wafer and the coordinates of the other two positions on the wafer to obtain the center coordinates of the wafer.
Specifically, the shape of the wafer may be a circle, and when the shape of the wafer is not a circle, coordinates of two positions on the inscribed circle of the wafer may be obtained by the position information of the sensor that has undergone the first conversion, coordinates of the other two positions on the inscribed circle of the wafer may be obtained by the position information of the sensor that has undergone the second conversion, and center coordinates of the inscribed circle of the wafer may be calculated by the coordinates of the two positions and the coordinates of the other two positions on the wafer.
Step 106: the actual position of the wafer is calculated based on the position information of the sensor where the conversion takes place.
Step 107: the target position of the wafer is obtained from the actual position.
Specifically, obtaining the target position of the wafer from the actual position further includes steps 1071 to 1073:
step 1071: the actual position of the wafer is calculated based on the position information of the sensor where the conversion takes place.
Step 1072: the actual position of the wafer is compared with the pre-stored optimal position of the wafer to obtain the eccentric distance of the wafer.
Referring to fig. 3, the robot controller pre-stores the optimal position of the wafer at the position S ", and compares the actual position of the wafer with the pre-stored optimal position of the wafer at the position S", such as vector subtraction, to obtain the eccentric distance Δs of the wafer.
Step 1073: and calculating according to the eccentric distance to obtain the target position of the wafer.
Referring to fig. 3, the eccentric distance Δs is calculated by superimposing it with the target optimum value (the target optimum value of the position 6 is pre-stored in the robot controller when the wafer needs to be moved to the position 6), so as to obtain the target position S of the center of the wafer. Further, the calculation of the target position needs to be done before the robot arm moves the wafer to the retracted position 4 and rotates to the position 5. In the embodiment of the invention, the optimal position of the wafer is preset, after the actual position of the wafer is obtained, the actual position of the wafer is compared with the pre-stored optimal position of the wafer to obtain the eccentric distance of the wafer, and the target position of the wafer is obtained by the eccentric distance. The invention can determine the deviation position of the wafer, thereby providing basis for effectively adjusting the wafer.
The wafer position calibration method provided by the embodiment of the invention utilizes a first input channel to receive a first level signal sent by a first sensor arranged at the first side of the inlet of each chamber; receiving, with a second channel, a second level signal transmitted by a second sensor disposed on a second side of an inlet of each chamber; determining position information of a sensor subjected to high-level and low-level conversion based on the manipulator coordinate information, and calculating the actual position of the wafer based on the position information of the sensor subjected to conversion; according to the wafer position detection method provided by the invention, the signals of the sensors at the inlets of the chambers are received only through the two input channels, the position information of the sensors with high-level and low-level signal conversion is determined by the manipulator coordinate signals, and the actual position of the wafer is determined based on the position information of the sensors with high-level and low-level signal conversion, so that the actual position of the wafer can be effectively detected while the channels occupied by the sensors are reduced, and a basis is provided for wafer calibration.
In fig. 3, during the movement of the circular wafer from the position 1 to the position 4, the sensor light is blocked at the position 2, the manipulator controller obtains a high-level signal, when the wafer moves to the position 3, the edge of the wafer leaves the sensor light, at this time, the sensor generates a low-level signal output again due to the state change, and then the actual wafer circular center position S is obtained through calculation by the software algorithm integrated in the manipulator controller.
In the embodiment of the invention, the wafer detection of all the chambers can be satisfied only by the signals of the first input channel and the second input channel, compared with the prior art that each sensor is connected with one input channel of the manipulator controller, the input channel of the manipulator controller is saved, and the position of the wafer can be accurately detected while the input channels are saved.
Example III
FIG. 5 is a flowchart showing another wafer position calibration method according to an embodiment of the present invention, which includes the following steps:
step 200: starting.
Step 201: a first level signal transmitted by a first sensor disposed on a first side of an inlet of each chamber is received with a first input channel.
Step 202: a second level signal transmitted by a second sensor disposed on a second side of the inlet of each chamber is received using a second input channel.
Step 203: judging whether at least one of the first level signal and the second level signal generates transition between high level and low level; if yes, go to step 204; otherwise, go back to step 203.
Step 204: the manipulator coordinate information is acquired.
Step 205: position information of the sensor where the conversion occurs is determined based on the robot coordinate information.
Step 206: the actual position of the wafer is calculated based on the position information of the sensor where the conversion takes place.
Step 207: the actual position of the wafer is compared with the pre-stored optimal position of the wafer to obtain the eccentric distance of the wafer.
Step 208: judging whether the eccentric distance of the wafer exceeds a preset range, if not, executing step 209; otherwise, step 210 is performed.
Step 209: and calculating according to the eccentric distance to obtain the target position of the wafer.
Step 210: and (5) ending.
According to the wafer position detection method provided by the embodiment of the invention, before the target position of the wafer is obtained according to the eccentricity calculation, whether the eccentric distance exceeds a preset range is firstly judged, and if the eccentric distance does not exceed the preset range, the target position of the wafer is calculated according to the eccentricity. According to the invention, whether the deviation position of the wafer is within a reasonable range can be determined in advance by judging whether the eccentric distance exceeds the preset range, and if so, the current eccentric distance can be adopted to calculate the target position; when the eccentric distance of the wafer is not within a reasonable range, an alarm can be sent out to make the direction of the alarm wafer deviate.
Example IV
The present invention also provides a wafer position detecting device, for the embodiment of the method, including: the device comprises a first acquisition unit, a second acquisition unit, a judgment unit and a control unit.
The first acquisition unit is used for receiving a first level signal sent by a first sensor arranged at the first side of the inlet of each chamber by using a first input channel; the second acquisition unit is used for receiving a second level signal sent by a second sensor arranged at the second side of the inlet of each chamber by using a second input channel; the judging unit is used for judging whether at least one of the first level signal and the second level signal generates the transition between the high level and the low level, and sending the judging result to the control unit; the control unit acquires the coordinate information of the manipulator according to the judging result, and determines a sensor which is converted based on the coordinate information of the manipulator; the actual position of the wafer is calculated based on the position information of the sensor where the conversion occurs, and the target position of the wafer is obtained from the actual position.
The wafer detection device provided by the embodiment of the invention utilizes a first input channel to receive a first level signal sent by a first sensor arranged at the first side of the inlet of each chamber; receiving, with a second input channel, a second level signal transmitted by a second sensor disposed on a second side of the inlet of each chamber; judging whether at least one of the first level signal and the second level signal is converted between a high level and a low level, if so, acquiring manipulator coordinate information, and determining a sensor for conversion based on the manipulator coordinate information; the actual position of the wafer is calculated based on the position information of the sensor where the conversion occurs, and the target position of the wafer is obtained from the actual position. The invention can effectively detect the actual position of the wafer while reducing the channels occupied by the sensor.
Specifically, the judging unit includes a first judging module and a second judging module.
The first judging module is used for judging whether the first level signal and the second level signal are subjected to first transition between high level and low level.
The second judging module is used for judging whether the position signal subjected to the first conversion is subjected to the second conversion between the low level and the high level after the first conversion; if the second conversion occurs, the conversion result is sent to the control unit, so that the control unit obtains the coordinate information of the manipulator, determines the sensor with the conversion based on the coordinate information of the manipulator, calculates and obtains the actual position of the wafer based on the position information of the sensor with the first conversion and the second conversion, and obtains the target position of the wafer according to the actual position.
Specifically, the control unit is further used for obtaining coordinates of two positions on the wafer according to the position information of the sensor subjected to the first conversion; acquiring coordinates of two other positions on the wafer according to the position information of the sensor subjected to the second conversion; and calculating according to the coordinates of two positions on the wafer and the coordinates of the other two positions on the wafer to obtain the center coordinates of the wafer. In the embodiment of the invention, when the shape of the wafer is circular, the actual circle center position of the wafer can be effectively positioned; when the shape of the wafer is not circular, the center of the inscribed circle of the wafer can be effectively positioned.
Specifically, in the embodiment of the invention, the high level is a signal sent when the sensor is covered by the wafer; the low level is the signal sent when the sensor is not covered by the wafer; alternatively, the high level is a signal sent when the sensor is not covered by the wafer; the low level is the signal sent when the sensor is covered by the wafer.
Further, in another embodiment of the present invention, the judging unit is further configured to compare the wafer position with a pre-stored optimal position of the wafer to obtain an eccentric distance of the wafer; the control unit is also used for obtaining the target position of the wafer according to the eccentric distance calculation.
Still further, in another embodiment of the present invention, the judging unit is further configured to judge whether the eccentric distance of the wafer exceeds a preset range after obtaining the eccentric distance of the wafer, and send the evaluation result to the control unit; and when the control unit does not exceed the preset range, the control unit calculates and obtains the target position of the wafer according to the eccentric distance.
In summary, in the wafer position detection method and apparatus provided in the embodiments of the present invention, a first input channel is used to receive a first level signal sent by a first sensor disposed on a first side of an inlet of each chamber, a second input channel is used to receive a second level signal sent by a second sensor disposed on a second side of an inlet of each chamber, and when at least one of the first level signal and the second level signal is converted between a high level and a low level, a control unit determines the sensor that is converted according to the coordinate information of the manipulator, and calculates the actual position of the wafer based on the position information of the sensor that is converted.
It is to be understood that the above embodiments are merely illustrative of the application of the principles of the present invention, but not in limitation thereof. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the invention, and are also considered to be within the scope of the invention.
Claims (10)
1. A wafer position calibration apparatus, comprising:
the output ends of the first sensors are connected in parallel and then output a first level signal, and each first sensor is arranged on the first side of the inlet of each chamber;
the output ends of the second sensors are connected in parallel and then output a second level signal, and each second sensor is arranged on the second side of the inlet of each chamber;
the manipulator controller is used for controlling the manipulator and is provided with a first input channel and a second input channel, the first input channel is connected with the first sensor, and the second input channel is connected with the second sensor;
the manipulator controller only utilizes two input channels to acquire a first level signal and a second level signal, acquires the manipulator coordinate information when at least one of the first level signal and the second level signal is converted between a high level and a low level, and determines the position information of a sensor subjected to conversion based on the manipulator coordinate information; calculating and obtaining the actual position of the wafer based on the position information of the sensor subjected to conversion; and obtaining a target position of the wafer according to the actual position.
2. The wafer position calibration device of claim 1, wherein the chamber comprises: a transfer chamber and/or a process chamber.
3. The wafer position calibration device of claim 2, wherein a length of a straight line between the first sensor and the second sensor at an inlet of the same chamber is smaller than a diameter of the wafer.
4. The wafer position calibration device of any one of claims 1-3, wherein the first sensor and the second sensor are fiber optic sensors.
5. A method for calibrating a wafer position, comprising:
receiving, with a first input channel, a first level signal transmitted by a first sensor disposed on a first side of an inlet of each chamber; and receiving, with a second input channel, a second level signal transmitted by a second sensor disposed on a second side of the inlet of each chamber;
the output ends of the first sensors at the first side of the inlet of each chamber are connected in parallel and then output the first level signal, and the output ends of the second sensors at the second side of the inlet of each chamber are connected in parallel and then output the second level signal;
judging whether at least one of the first level signal and the second level signal generates transition between high level and low level;
if yes, acquiring manipulator coordinate information, and determining position information of a sensor subjected to conversion based on the manipulator coordinate information;
calculating and obtaining the actual position of the wafer based on the position information of the sensor subjected to conversion;
and obtaining the target position of the wafer according to the actual position.
6. The wafer position calibration method of claim 5, wherein said determining a target position of the wafer from the actual position comprises:
comparing the actual position of the wafer with a pre-stored optimal position of the wafer to obtain an eccentric distance of the wafer;
and calculating and obtaining the target position of the wafer according to the eccentric distance.
7. The wafer position calibration method according to claim 6, characterized by further comprising, after the step of comparing the actual position of the wafer with a pre-stored optimal position of the wafer to obtain an eccentric distance of the wafer, and before the step of obtaining a target position of the wafer from the eccentric distance calculation:
judging whether the eccentric distance of the wafer exceeds a preset range, if not, carrying out the step of obtaining the target position of the wafer according to the eccentric distance calculation; if yes, the flow ends.
8. The wafer position calibration method according to claim 5, wherein the step of judging whether at least one of the first level signal and the second level signal makes a transition between a high level and a low level, further comprises:
judging whether the first level signal and the second level signal occur in a first transition between a high level and a low level;
if the first transition occurs, judging whether the level signal of the first transition occurs between a low level and a high level for the second transition;
and if the second conversion occurs, continuing to execute the steps of acquiring the coordinate information of the manipulator and determining the sensor subjected to the conversion based on the coordinate information of the manipulator.
9. The wafer position calibration method according to claim 8, wherein the step of calculating an actual position of the wafer based on the position information of the sensor that has undergone the conversion further comprises:
obtaining coordinates of two positions on the wafer according to the position information of the sensor subjected to the first conversion;
obtaining coordinates of two other positions on the wafer according to the position information of the sensor subjected to the second conversion;
and calculating according to the coordinates of the two positions on the wafer and the coordinates of the other two positions on the wafer to obtain the center coordinates of the wafer.
10. The wafer position calibration method according to claim 5, wherein the high level is a signal transmitted when the sensor is covered with the wafer; the low level is a signal sent when the sensor is not covered by the wafer; alternatively, the high level is a signal transmitted when the sensor is not covered by the wafer; the low level is the signal sent when the sensor is covered by the wafer.
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