CN1113375A - 在基底上沉积固体物质的方法 - Google Patents

在基底上沉积固体物质的方法 Download PDF

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CN1113375A
CN1113375A CN95102359.4A CN95102359A CN1113375A CN 1113375 A CN1113375 A CN 1113375A CN 95102359 A CN95102359 A CN 95102359A CN 1113375 A CN1113375 A CN 1113375A
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solution
solvent
liquid gas
substrate
liquified gas
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E·张
S-C黄
P·斯特拉顿
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Linde LLC
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BOC Group Inc
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/02Processes for applying liquids or other fluent materials performed by spraying
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/02Processes for applying liquids or other fluent materials performed by spraying
    • B05D1/025Processes for applying liquids or other fluent materials performed by spraying using gas close to its critical state

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

本发明涉及在基底的表面上沉积固体物质的方 法,其中固体物质溶于溶剂中形成第一溶液,再将第 一溶液溶于液化气体中以形成相对于液化气体有充 足溶剂浓度的第二溶液,将溶液喷在基底上,结果部 分液化气体快速蒸发成气体,第二溶液的剩余部分接 触涂覆着基底,剩余的液化气体和溶剂一起蒸发,固 体物质作为沉积物留在基底上。该方法可用于电子 工业,在焊接前用焊剂涂覆印刷线路板。

Description

本发明涉及一种基底的表面上沉积一种细分散状态固体物质的方法。更具体的是,本发明涉及这样一个方法,该方法是将物质溶解形成溶液,再将其溶入液化气体中,然后喷洒在基底上。溶剂和液化气体蒸发掉后,物质就留在基底上成为沉积物。
有许多不同的方法适用于将不同的固体沉积在种种基底上。例如,在焊接操作中,需要将焊剂沉积在要焊接于印刷线路板上的电气元件导体上。在这种情况下,印刷线路板及导体可以称为是焊剂的基底。焊剂沉积的操作就是先令焊剂发泡,然后将含有焊剂的悬浮液刷在导体及线路板的导体区域上。但是,上述的焊接剂沉积方法要用大量的焊剂。最近的操作方法是将焊剂溶于一溶剂中,然后用压缩空气将溶液喷在导体及线路板上。溶剂挥发后,留下了细分散沉积的焊剂。
使用溶剂来沉积焊剂的问题是许多溶剂在环保上有害。因此,该技术领域需要用环境安全的化合物来代替可能有害的溶剂。这类方案可在美国专利第5,106,659号中发现,该方法是用液体的或超临界态的二氧化碳来稀释油漆,然后将所得的混合物喷在待油漆的表面上。
美国专利第5,106,659号的油漆喷雾法并非对所有的物质都适用。例如,对于焊剂沉积,焊剂不象油漆,它不会溶于二氧化碳中。试图将焊剂和液态二氧化碳的混合物进行喷雾是不成功的,这是因为一部分液态二氧化碳在离开喷嘴进入大气膨胀时有固体颗粒形成。固体的二氧化碳冰颗粒会起磨料的作用,会除去最初沉积的焊剂颗粒。另外,由于焊剂不象油漆颜料那样是微细分散的,若是将焊剂固体与二氧化碳混合然后喷在基底表面上,焊剂固体不会均匀分散地沉积在上面。
正如将作讨论的是,本发明涉及将固体物质如焊剂沉积在基底上,产生一种在基底上可控制的细分散沉积物的方法。
本发明提供了一种将固体物质转换到基底表面上的方法。根据本方法,先将固体物质溶于溶剂中产生第一溶液。溶解前的固体物质不是象它沉积在基底上状态那样细分散。例如,溶解前的固体物质可能是一些大颗粒,而沉积状态则是细粉状。固体物质在基底上的沉积密度至少可以部分地由第一溶液中固体物质的浓度来调节。关于这点,可以使用完全饱和的溶液,使基底单位面积上固体物质沉积得最多,即得到最大的“沉积密度”。固体物质在液化气体中是不溶的。而第一溶液则可以溶解在液化气体中。另外,溶剂在液化气体膨胀时有降低液化气体凝固点的作用。将第一溶液溶解在液化气体中,形成第二溶液,其中溶剂相对于液化气体的浓度足够大,从而基本上可以防止液化气体快速蒸发成气体,含有剩余液化气体的第二溶液就包覆在基底表面。然后那剩余的液化气体及溶剂蒸发掉,固体物质作为沉积物留在基底上。
溶剂用量最好的办法是,溶液中溶剂的浓度尽量小,但相对于液化气体来说,溶剂仍有足够的浓度以防止膨胀时液化气体的凝固。这样,使用的溶剂量可以最少,而基底上的沉积物可以是很微细分散的。
本发明可在许多不同条件下实施。本发明一般来说,其大多数是在大气压力的条件下在基底上沉积的。但是应当明白,本发明也可用于在小于大气压力及大于大气压力的条件下,也可以在不含空气的或惰性的气氛下进行沉积。此外,虽然本发明是就焊剂沉积进行讨论,但不难明白,其应用不限于焊剂沉积。
第一步,将要沉积在基底上的固体首先与溶剂混合形成第一溶液。第一溶液中的固体物质浓度可以按所需的沉积密度来预定。随着浓度的增加,可以沉积更多的固体。至于焊剂,其物质可以是有机酸,例如己二酸、水杨酸和枸橼酸,但不限于此。适用的溶剂包括醇类和酮类,如甲醇和丙酮。例如,第一溶液由己二酸和甲醇构成,其浓度约为10%(重量)。该溶液在室温是饱和溶液,中产生很大的沉积密度。
在形成了第一溶液后,将它随后溶解在液化气体中,对于焊剂沉积来说,最好是溶于液化的二氧化碳中。根据本发明的用途以及所涉及的物质,也可以用其它液化气体,如丙烷。在本发明中,沉积物质基本上不溶于液化气体,但溶剂和该物质形成的溶液则能溶于液化气体中,这里和权利要求书中所用的术语“溶解的”是指符合无机化学中的定义,即固体物质被分散有溶剂中。
将物质起初溶解于其中的溶剂,可以降低液化气体膨胀时液化气体的凝固点,对于焊剂沉积的情况,将焊剂和溶剂形成的溶液溶解在液体二氧化碳中,然后将其置入约900磅/吋2压力的气体钢瓶中。由于将其得到的是酸性溶液,这种第二溶液应保存在镍制的或镀镍的钢瓶中。
为了实现沉积过程,按现有技术已知的办法,由钢瓶通过一低温管线连接到一喷嘴,以便将二氧化碳气体、沉积物质和第二溶液喷到基底上。对于焊剂沉积,可以采用典型的锥形喷嘴,应该注意,喷嘴的类型和其它参数一样也会影响沉积密度。在通常的环境温度下,高压下的液体二氧化碳可以起将溶液喷在基底上的推进剂作用,压力从贮存钢瓶中的压力变成环境大气压力,就使液体二氧化碳发生膨胀,若所要沉积的物质只是溶于二氧化碳中而不预先加溶剂,则当其喷在基底上时,二氧化碳将蒸发并也固化成一些小的干冰晶体,其效果是会从基底表面上除去已沉积的物质。而溶剂的加入通过降低液体二氧化碳的凝固点来克服这个毛病,它基本上可能防止液化气体的凝固。
在本发明所有的实施例方案中,溶剂相对于液化气体的浓度必须足够,以便防止液体在膨胀时的凝固。另外,溶剂的浓度还应尽量少,以控制使用对环境可能有害的溶剂。对于焊剂沉积,甲醇在液体二氧化碳中的浓度是占甲醇和二氧化碳溶液重量的15%。这样,当溶剂、液体二氧化碳和焊剂或其它物质形成的第二溶液喷在基底上时,一部分液化气体快速蒸发成蒸气,但仍有会液化气体的剩余溶液包覆在基底上。
一旦物质被溶液包覆后,其中的溶剂(对于焊剂,是甲醇)和剩余的液体二氧化碳在室温条件下蒸发,结果物质就作为沉积物留在基底上。但应当明白,这种蒸发过程可以藉外加的方式促进,视溶剂和液化气体的种类及喷覆的条件而异。
虽然本发明已结合一较佳实施方案作了描述,但该技术领域的人员应当知道,在不背离本发明精神和范围的条件下作出许多添加、变化及修改。

Claims (9)

1、一种将固体物质沉积在基底表面的方法,其步骤包括:
将固体物质溶于一溶剂中生成第一溶液,溶解前的固体物质沉积不象它在所述基底上沉积时那样微细分散的,固体物质在所述基底上的沉积密度可藉第一溶液中固体物质的浓度进行至少部分的调节;
固体物质不溶于液化气体中,但第一溶液在所述的液化气体中是可溶的,溶剂能降低所述液化气体膨胀时液化气体的凝固点;
将所述的第一溶液溶于所述的液化气体中形成第二溶液,其中溶剂相对于所述液化气体的浓度足够大,这样可以基本上防止所述液化气体膨胀时的凝固;
将所述的第二溶液喷在所述的基底上,结果一部分液化气体快速蒸发成气体,而含有剩余所述液化气体的所述第二溶液接触包覆着所述的基底;
待所述溶剂剩余的所述液化气体蒸发后所述的固体物质就作为沉积物留在基底上。
2、根据权利要求1所述的方法,其中所述的第一溶液是饱和溶液。
3、根据权利要求1所述的方法,其中所述的溶剂浓度是能基本上防止所述液化气体在膨胀时凝固所需的最小浓度。
4、根据权利要求1所述的方法,其中所述的液化气体包括液体二氧化碳。
5、根据权利要求1所述的方法,其中所述的固体物质是从己二酸、水杨酸或枸橼酸这些有机酸形成的焊剂。
6、根据权利要求5所述的方法,其中所述的溶剂包括如甲醇或丙酮这些有机溶剂。
7、根据权利要求6所述的方法,其中所述的第一溶液中固体物质浓度是在甲醇中约10%(重量)的已二酸。
8、根据权利要求6所述的方法,其中所述的溶剂包括甲醇,所述的液化气体包括液体二氧化碳,所述溶剂相对于所述液化所述的浓度是在所述二氧化碳中为15%(重量)所述的甲醇。
9、根据权利要求7所述的方法,其中所述的溶剂包括甲醇,所述的液化气体包括液体二氧化碳,所述溶剂相对于所述液化所述的浓度是在所述二氧化碳中为15%(重量)所述的甲醇。
CN95102359.4A 1994-03-23 1995-03-23 在基底上沉积固体物质的方法 Pending CN1113375A (zh)

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US08/216,701 1994-03-23
US08/216,701 US5415897A (en) 1994-03-23 1994-03-23 Method of depositing solid substance on a substrate

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AU (1) AU1497295A (zh)
CA (1) CA2142943C (zh)
CZ (1) CZ293804B6 (zh)
FI (1) FI115119B (zh)
HU (1) HU216029B (zh)
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AU1497295A (en) 1995-10-05
FI951353A (fi) 1995-09-24
CZ68395A3 (en) 1995-10-18
HU9500811D0 (en) 1995-05-29
PL307806A1 (en) 1995-10-02
CA2142943A1 (en) 1995-09-24
HU216029B (hu) 1999-04-28
FI115119B (fi) 2005-03-15
SK37095A3 (en) 1995-10-11
US5415897A (en) 1995-05-16
CA2142943C (en) 1999-12-21
CZ293804B6 (cs) 2004-08-18
EP0678343A1 (en) 1995-10-25
FI951353A0 (fi) 1995-03-22

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