CN111334237A - Polyurethane organic silicon conductive adhesive and preparation method and application thereof - Google Patents
Polyurethane organic silicon conductive adhesive and preparation method and application thereof Download PDFInfo
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- CN111334237A CN111334237A CN202010283972.1A CN202010283972A CN111334237A CN 111334237 A CN111334237 A CN 111334237A CN 202010283972 A CN202010283972 A CN 202010283972A CN 111334237 A CN111334237 A CN 111334237A
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- silicone oil
- conductive adhesive
- hydroxyl
- polyurethane
- silver powder
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- 239000000853 adhesive Substances 0.000 title claims abstract description 77
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 77
- 239000004814 polyurethane Substances 0.000 title claims abstract description 37
- 229920002635 polyurethane Polymers 0.000 title claims abstract description 37
- 238000002360 preparation method Methods 0.000 title claims description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title abstract description 9
- 229910052710 silicon Inorganic materials 0.000 title abstract description 9
- 239000010703 silicon Substances 0.000 title abstract description 9
- 229920002545 silicone oil Polymers 0.000 claims abstract description 103
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 65
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 28
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 25
- 239000002994 raw material Substances 0.000 claims abstract description 10
- 229920001296 polysiloxane Polymers 0.000 claims description 15
- -1 olefin compound Chemical class 0.000 claims description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims description 11
- 239000001257 hydrogen Substances 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 239000004332 silver Substances 0.000 claims description 11
- 238000007599 discharging Methods 0.000 claims description 9
- 238000000227 grinding Methods 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 9
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 9
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 claims description 8
- IAQRGUVFOMOMEM-UHFFFAOYSA-N but-2-ene Chemical compound CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 claims description 8
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 claims description 6
- QMMOXUPEWRXHJS-UHFFFAOYSA-N pentene-2 Natural products CCC=CC QMMOXUPEWRXHJS-UHFFFAOYSA-N 0.000 claims description 6
- 239000012948 isocyanate Substances 0.000 claims description 5
- 150000002513 isocyanates Chemical group 0.000 claims description 5
- XNMQEEKYCVKGBD-UHFFFAOYSA-N dimethylacetylene Natural products CC#CC XNMQEEKYCVKGBD-UHFFFAOYSA-N 0.000 claims description 4
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 4
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 4
- RYKZRKKEYSRDNF-UHFFFAOYSA-N 3-methylidenepentane Chemical compound CCC(=C)CC RYKZRKKEYSRDNF-UHFFFAOYSA-N 0.000 claims description 3
- LDTAOIUHUHHCMU-UHFFFAOYSA-N 3-methylpent-1-ene Chemical compound CCC(C)C=C LDTAOIUHUHHCMU-UHFFFAOYSA-N 0.000 claims description 3
- BEQGRRJLJLVQAQ-UHFFFAOYSA-N 3-methylpent-2-ene Chemical compound CCC(C)=CC BEQGRRJLJLVQAQ-UHFFFAOYSA-N 0.000 claims description 3
- 238000011161 development Methods 0.000 abstract description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 14
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 14
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 7
- 229910052697 platinum Inorganic materials 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- ZSPTYLOMNJNZNG-UHFFFAOYSA-N 3-Buten-1-ol Chemical compound OCCC=C ZSPTYLOMNJNZNG-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 238000006459 hydrosilylation reaction Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- QXRRAZIZHCWBQY-UHFFFAOYSA-N 1,1-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1(CN=C=O)CCCCC1 QXRRAZIZHCWBQY-UHFFFAOYSA-N 0.000 description 1
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 1
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- ICLCCFKUSALICQ-UHFFFAOYSA-N 1-isocyanato-4-(4-isocyanato-3-methylphenyl)-2-methylbenzene Chemical compound C1=C(N=C=O)C(C)=CC(C=2C=C(C)C(N=C=O)=CC=2)=C1 ICLCCFKUSALICQ-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- ABWDWYZSKJSXRD-UHFFFAOYSA-N N=C=O.N=C=O.C1CC=CC1 Chemical compound N=C=O.N=C=O.C1CC=CC1 ABWDWYZSKJSXRD-UHFFFAOYSA-N 0.000 description 1
- HDONYZHVZVCMLR-UHFFFAOYSA-N N=C=O.N=C=O.CC1CCCCC1 Chemical compound N=C=O.N=C=O.CC1CCCCC1 HDONYZHVZVCMLR-UHFFFAOYSA-N 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- JGCWKVKYRNXTMD-UHFFFAOYSA-N bicyclo[2.2.1]heptane;isocyanic acid Chemical compound N=C=O.N=C=O.C1CC2CCC1C2 JGCWKVKYRNXTMD-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- KQWGXHWJMSMDJJ-UHFFFAOYSA-N cyclohexyl isocyanate Chemical compound O=C=NC1CCCCC1 KQWGXHWJMSMDJJ-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/61—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7614—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
The invention discloses a polyurethane organic silicon conductive adhesive which is prepared from the following raw materials, by weight, 20-30 parts of silicone oil, 3-7 parts of a cross-linking agent and 60-80 parts of silver powder; the silicone oil is hydroxyl silicone oil. According to the invention, the organic silicon is modified, so that the prepared conductive adhesive has excellent mechanical strength, adhesive force and conductive performance, is suitable for being popularized and used as a tile stacking adhesive in the field of solar cells, and has a wide development prospect.
Description
Technical Field
The invention relates to the technical field of conductive adhesives, in particular to a polyurethane organic silicon conductive adhesive and a preparation method and application thereof.
Background
The conductive adhesive is an adhesive with certain conductive performance after being cured, and generally takes a matrix and conductive particles as main components, and the conductive particles and a bonding base material are combined together through the bonding action after the matrix is cured to form a conductive path so as to realize the conductive connection of bonded materials.
Due to the unique structure, the organic silicon has a series of excellent properties, such as lower glass transition temperature, excellent high and low temperature resistance and oxidation resistance, excellent electrical insulation and thermal stability, excellent air permeability and biocompatibility and the like, but the organic silicon has the defects of low mechanical strength and poor adhesion, and is limited to be used in the field of conductive adhesives.
Disclosure of Invention
In order to solve the problems, the first aspect of the invention provides a polyurethane organosilicon conductive adhesive, which comprises 20-30 parts by weight of silicone oil, 3-7 parts by weight of a cross-linking agent and 60-80 parts by weight of silver powder; the silicone oil is hydroxyl silicone oil.
As a preferable technical scheme, the hydroxyl silicone oil is hydroxyl-terminated silicone oil, and the preparation raw material of the hydroxyl-terminated silicone oil comprises hydrogen-terminated silicone oil.
As a preferable technical scheme, the hydrogen content of the hydrogen-terminated silicone oil is 0.02-0.06 wt%.
As a preferable technical scheme, the viscosity of the hydrogen-terminated silicone oil at 25 ℃ is 40-200 cSt.
As a preferable technical scheme, the preparation raw material of the hydroxyl silicone oil also comprises a hydroxyl substituted olefin compound.
As a preferred technical scheme, the olefin compound is selected from one or more of propylene, 1-butene, 2-butene, 1-pentene, 2-pentene, 3-methyl-1-pentene, 3-methyl-2-pentene and 2-ethyl-1-butene.
As a preferable technical scheme, the dosage of the hydroxyl substituted olefin compound is 1-3 wt% of the hydrogen-terminated silicone oil.
As a preferable technical scheme, the cross-linking agent is isocyanate with-NCO functionality being more than or equal to 2.
The second aspect of the invention provides a preparation method of the polyurethane organosilicon conductive adhesive, which comprises the following steps: adding silicone oil, a cross-linking agent and silver powder into a stirrer, mixing, grinding, defoaming and discharging to obtain the silver-based ink.
The third aspect of the invention provides an application of the polyurethane organosilicon conductive adhesive in the field of solar cells.
Has the advantages that: the invention provides a polyurethane organosilicon conductive adhesive and a preparation method and application thereof, and the prepared conductive adhesive has excellent mechanical strength, adhesive force and conductivity by modifying organosilicon, is suitable for being popularized and used as a tile stacking adhesive in the field of solar cells, and has wide development prospect.
Detailed Description
The invention will be further understood by reference to the following detailed description of preferred embodiments of the invention and the examples included therein. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. To the extent that a definition of a particular term disclosed in the prior art is inconsistent with any definitions provided herein, the definition of the term provided herein controls.
As used herein, a feature that does not define a singular or plural form is also intended to include a plural form of the feature unless the context clearly indicates otherwise. It will be further understood that the term "prepared from …," as used herein, is synonymous with "comprising," including, "comprising," "having," "including," and/or "containing," when used in this specification means that the recited composition, step, method, article, or device is present, but does not preclude the presence or addition of one or more other compositions, steps, methods, articles, or devices. Furthermore, the use of "preferred," "preferably," "more preferred," etc., when describing embodiments of the present application, is meant to refer to embodiments of the invention that may provide certain benefits, under certain circumstances. However, other embodiments may be preferred, under the same or other circumstances. In addition, the recitation of one or more preferred embodiments does not imply that other embodiments are not useful, nor is it intended to exclude other embodiments from the scope of the invention.
In order to solve the problems, the first aspect of the invention provides a polyurethane organosilicon conductive adhesive, which comprises 20-30 parts by weight of silicone oil, 3-7 parts by weight of a cross-linking agent and 60-80 parts by weight of silver powder; the silicone oil is hydroxyl silicone oil.
The silicone oil is generally a linear polysiloxane which remains in a liquid state at room temperature and has excellent properties such as heat resistance, electrical insulation, weather resistance, and hydrophobicity, but has poor mechanical strength and adhesion when used as a raw material for an adhesive, and insufficient compatibility with a conductive powder when used as a raw material for a conductive adhesive. The selection of the hydroxyl silicone oil can increase the compatibility between raw materials and improve various defects of the silicone oil used for the conductive adhesive through a crosslinking reaction.
In order to improve the adhesion and mechanical strength of the conductive adhesive, in some preferred embodiments, the hydroxyl silicone oil is hydroxyl-terminated silicone oil, and the raw material for preparing the hydroxyl-terminated silicone oil comprises hydrogen-terminated silicone oil. The silicone oil is prepared into hydroxyl-terminated silicone oil, the molecular structure obtained by the reaction of the silicone oil and a cross-linking agent is adjusted, so that the hard sections and the soft sections in the conductive adhesive are alternated, the hard sections obviously improve the mechanical property of the material, the cohesive force of the adhesive material is enhanced, the soft sections improve the physical adhesion force, the balance between the cohesive force and the adhesion force is realized, and the integral adhesive force of the conductive adhesive is improved.
In order to adjust the reactivity of the hydrogen-terminated silicone oil and the physical adhesion of the conductive adhesive, in some preferred embodiments, the hydrogen content of the hydrogen-terminated silicone oil is 0.02 to 0.06 wt%. The Si-H bond in the hydrogen-terminated silicone oil has stronger reactivity, the hydroxyl-terminated silicone oil can be obtained through hydrosilylation, when the hydrogen content is too high, the crosslinking points in the conductive adhesive are increased, the cohesive force is too high, the adhesive force is reduced, otherwise, when the hydrogen content is too low, the modification effect of the organic silicon is poor, and the requirement of the organic silicon as the raw material of the conductive adhesive cannot be met.
In order to improve the production efficiency and the mechanical strength of the conductive adhesive, in some preferred embodiments, the hydrogen-terminated silicone oil has a viscosity of 40-200 cSt at 25 ℃. When the viscosity of the hydrogen-terminated silicone oil is too large, stirring is not easy, the production efficiency is reduced, the production cost is increased, the soft section in the prepared conductive adhesive is obviously increased, the interval between the hard sections is increased, the mechanical property is reduced, and otherwise, when the viscosity of the hydrogen-terminated silicone oil is too small, the adhesive force of the conductive adhesive is greatly reduced.
The viscosity unit cSt, in the present application, the name centistokes, is a kinematic viscosity unit representing the ratio of the dynamic viscosity of a fluid to the density of the fluid at the same temperature, in the International System of units (SI), the kinematic viscosity unit is m2/s，1cSt＝10-6m2/s＝1mm2The amount/s can be measured according to the method described in GB/T256-88 or ASTM D445-96.
The hydrogen-terminated silicone oil in the present application may be commercially available, for example, UC-616 series product manufactured by Jiaxing Union chemical Co., Ltd., preferably UC-616-79.
In some preferred embodiments, the starting material for the preparation of the hydroxy silicone oil further comprises a hydroxy-substituted olefinic compound.
In some embodiments, the olefinic compound is selected from the group consisting of mixtures of one or more of propylene, 1-butene, 2-butene, 1-pentene, 2-pentene, 3-methyl-1-pentene, 3-methyl-2-pentene, 2-ethyl-1-butene.
In some preferred embodiments, the olefin compound is selected from one or more of propylene, 1-butene, and 2-butene, in terms of heat resistance, weather resistance, and the like of the conductive adhesive.
In some preferred embodiments, the hydroxy-substituted alkene compound is 1-propen-3-ol (CAS number: 107-18-6) or 3-buten-1-ol (CAS number: 627-27-0).
In some preferred embodiments, the hydroxy-substituted olefin compound is used in an amount of 1 to 3 wt% based on the hydrogen-terminated silicone oil.
The hydroxyl-terminated silicone oil can be prepared by hydrosilylation, and the specific preparation method can be any one known by those skilled in the art, for example, the hydroxyl-terminated silicone oil and the hydroxyl-substituted olefin compound react for 3 to 5 hours at a temperature of between 80 and 100 ℃ under the action of a platinum catalyst to obtain the hydroxyl-terminated silicone oil.
In some preferred embodiments, the crosslinker is an isocyanate having a-NCO functionality of 2 or more. the-NCO group in the isocyanate and the-OH group in the hydroxyl-terminated silicone oil can generate cross linking to form a hard section in the conductive adhesive, so that the mechanical property of the conductive adhesive is improved, the content of the polar group can be increased, and the chemical adhesive force is provided for the adhesive.
Examples of isocyanates having an-NCO functionality of not less than 2 include 1, 3-cyclopentane diisocyanate, 1, 3-cyclopentene diisocyanate, 1, 4-cyclohexane diisocyanate, 1, 3-cyclohexane diisocyanate, isophorone diisocyanate (IPDI)), methylenebis (cyclohexyl isocyanate) (H12MDI), methylcyclohexane diisocyanate, norbornane diisocyanate (NBDI), bis (isocyanatomethyl) cyclohexane (H6XDI), Toluene Diisocyanate (TDI), m-phenylene diisocyanate, p-phenylene diisocyanate, 4 ' -diphenyl diisocyanate, 1, 5-Naphthalene Diisocyanate (NDI), diphenylmethane diisocyanate (MDI), 4 ' -toluidine diisocyanate (TODI), 4 ' -diphenyl ether diisocyanate, methyl ethyl ketone diisocyanate, hexamethylene Diisocyanate (HDI) and polymers thereof.
In some preferred embodiments, the silver powder is a plate-like silver powder and/or a spherical silver powder.
The flake silver powder and the spherical silver powder can be obtained in the market, and the shapes can be customized with manufacturers.
In order to improve the conductivity of the conductive adhesive, in some preferred embodiments, the silver powder is a mixture of flake silver powder and spherical silver powder, and the weight ratio of the silver powder is (18-22): 1. the inventor finds that, in a careful study, when a certain proportion of the flake silver powder and the spherical silver powder are added into the conductive adhesive, the conductive performance of the conductive adhesive is remarkably improved, the reason is that the flake silver powder is in surface-to-surface contact in the conductive adhesive, the contact area is large, the conductive efficiency is higher, and the spherical silver powder can fill the gaps between the flake silver powders, become a path bridge between the non-contact flake silver powders and reduce the volume resistance. The inventor finds in a great deal of practice that when the proportion of the flake silver powder is too large, the filling effect of the spherical silver powder is not obvious, and the influence on the electric conductivity is not obvious, and on the contrary, when the proportion of the flake silver powder is too small, the contact area of the electric conductor in the conductive adhesive is reduced, and the electric conductivity is poor.
The second aspect of the invention provides a preparation method of the polyurethane organosilicon conductive adhesive, which comprises the following steps: adding silicone oil, a cross-linking agent and silver powder into a stirrer, mixing, grinding, defoaming and discharging to obtain the silver-based ink.
The third aspect of the invention provides an application of the polyurethane organosilicon conductive adhesive in the field of solar cells.
Examples
The technical solution of the present invention is described in detail by the following examples, but the scope of the present invention is not limited to the examples. Unless otherwise specified, the starting materials in the present invention are all commercially available.
Example 1
Embodiment 1 provides a polyurethane silicone conductive adhesive, which is prepared from 25 parts by weight of silicone oil, 5 parts by weight of cross-linking agent and 70 parts by weight of silver powder.
The silicone oil is hydroxyl silicone oil; the hydroxyl silicone oil is hydroxyl-terminated silicone oil; the preparation method of the hydroxyl-terminated silicone oil comprises the following steps: 100g of hydrogen-terminated silicone oil (purchased from Jiaxing combined chemical Co., Ltd., brand UC-616-79, hydrogen content of 0.031-0.033 wt%, viscosity of 80-110 cSt), 1.91g of 1-propylene-3-ol (CAS number: 107-18-6) and 0.408g of metal platinum are reacted for 4 hours at 90 ℃ to obtain the catalyst.
The cross-linking agent is Toluene Diisocyanate (TDI); the silver powder is flake silver powder.
The embodiment also provides a preparation method of the polyurethane organosilicon conductive adhesive, which comprises the following steps: adding silicone oil, a cross-linking agent and silver powder into a stirrer, mixing, grinding, defoaming and discharging to obtain the silver-based ink.
Example 2
Embodiment 2 provides a polyurethane silicone conductive adhesive, which is prepared from 23 parts by weight of silicone oil, 7 parts by weight of a crosslinking agent and 70 parts by weight of silver powder.
The silicone oil is hydroxyl silicone oil; the hydroxyl silicone oil is hydroxyl-terminated silicone oil; the preparation method of the hydroxyl-terminated silicone oil comprises the following steps: 100g of hydrogen-terminated silicone oil (purchased from Jiaxing combined chemical Co., Ltd., brand UC-616-79, hydrogen content of 0.031-0.033 wt%, viscosity of 80-110 cSt), 1.91g of 1-propylene-3-ol (CAS number: 107-18-6) and 0.408g of metal platinum are reacted for 4 hours at 90 ℃ to obtain the catalyst.
The cross-linking agent is Toluene Diisocyanate (TDI); the silver powder is flake silver powder.
The embodiment also provides a preparation method of the polyurethane organosilicon conductive adhesive, which comprises the following steps: adding silicone oil, a cross-linking agent and silver powder into a stirrer, mixing, grinding, defoaming and discharging to obtain the silver-based ink.
Example 3
Embodiment 3 provides a polyurethane silicone conductive adhesive, which is prepared from 25 parts by weight of silicone oil, 5 parts by weight of a crosslinking agent and 70 parts by weight of silver powder.
The silicone oil is hydroxyl silicone oil; the hydroxyl silicone oil is hydroxyl-terminated silicone oil; the preparation method of the hydroxyl-terminated silicone oil comprises the following steps: 100g of hydrogen-terminated silicone oil (purchased from Jiaxing combined chemical Co., Ltd., brand UC-616-50, hydrogen content of 0.048-0.053 wt% and viscosity of 40-60 cSt), 1.91g of 1-propylene-3-ol (CAS number: 107-18-6) and 0.408g of metal platinum are reacted for 4 hours at 90 ℃ to obtain the catalyst.
The cross-linking agent is Toluene Diisocyanate (TDI); the silver powder is flake silver powder.
The embodiment also provides a preparation method of the polyurethane organosilicon conductive adhesive, which comprises the following steps: adding silicone oil, a cross-linking agent and silver powder into a stirrer, mixing, grinding, defoaming and discharging to obtain the silver-based ink.
Example 4
Embodiment 4 provides a polyurethane silicone conductive adhesive, which is prepared from 25 parts by weight of silicone oil, 5 parts by weight of a crosslinking agent, and 70 parts by weight of silver powder.
The silicone oil is hydroxyl silicone oil; the hydroxyl silicone oil is hydroxyl-terminated silicone oil; the preparation method of the hydroxyl-terminated silicone oil comprises the following steps: 100g of hydrogen-terminated silicone oil (purchased from Jiaxing combined chemical Co., Ltd., the brand UC-616-100, the hydrogen content is 0.025-0.027 wt%, the viscosity is 100-150 cSt), 1.91g of 1-propylene-3-ol (CAS number: 107-18-6) and 0.408g of metal platinum are reacted for 4 hours at the temperature of 90 ℃ to obtain the catalyst.
The cross-linking agent is Toluene Diisocyanate (TDI); the silver powder is flake silver powder.
The embodiment also provides a preparation method of the polyurethane organosilicon conductive adhesive, which comprises the following steps: adding silicone oil, a cross-linking agent and silver powder into a stirrer, mixing, grinding, defoaming and discharging to obtain the silver-based ink.
Example 5
Embodiment 5 provides a polyurethane silicone conductive adhesive, which is prepared from 25 parts by weight of silicone oil, 5 parts by weight of a crosslinking agent, and 70 parts by weight of silver powder.
The silicone oil is hydroxyl silicone oil; the hydroxyl silicone oil is hydroxyl-terminated silicone oil; the preparation method of the hydroxyl-terminated silicone oil comprises the following steps: 100g of hydrogen-terminated silicone oil (purchased from Jiaxing combined chemical Co., Ltd., brand UC-616-79, hydrogen content of 0.031-0.033 wt%, viscosity of 80-110 cSt), 1.91g of 1-propylene-3-ol (CAS number: 107-18-6) and 0.408g of metal platinum are reacted for 4 hours at 90 ℃ to obtain the catalyst.
The cross-linking agent is Toluene Diisocyanate (TDI); the silver powder is a mixture of flake silver powder and spherical silver powder, and the weight ratio of the silver powder to the spherical silver powder is 10: 1.
the embodiment also provides a preparation method of the polyurethane organosilicon conductive adhesive, which comprises the following steps: adding silicone oil, a cross-linking agent and silver powder into a stirrer, mixing, grinding, defoaming and discharging to obtain the silver-based ink.
Example 6
Embodiment 6 provides a polyurethane silicone conductive adhesive, which is prepared from 25 parts by weight of silicone oil, 5 parts by weight of a crosslinking agent, and 70 parts by weight of silver powder.
The silicone oil is hydroxyl silicone oil; the hydroxyl silicone oil is hydroxyl-terminated silicone oil; the preparation method of the hydroxyl-terminated silicone oil comprises the following steps: 100g of hydrogen-terminated silicone oil (purchased from Jiaxing combined chemical Co., Ltd., brand UC-616-79, hydrogen content of 0.031-0.033 wt%, viscosity of 80-110 cSt), 1.91g of 1-propylene-3-ol (CAS number: 107-18-6) and 0.408g of metal platinum are reacted for 4 hours at 90 ℃ to obtain the catalyst.
The cross-linking agent is Toluene Diisocyanate (TDI); the silver powder is a mixture of flake silver powder and spherical silver powder, and the weight ratio of the silver powder to the spherical silver powder is 20: 1.
the embodiment also provides a preparation method of the polyurethane organosilicon conductive adhesive, which comprises the following steps: adding silicone oil, a cross-linking agent and silver powder into a stirrer, mixing, grinding, defoaming and discharging to obtain the silver-based ink.
Evaluation of Performance
1. Volume resistivity: the volume resistivity of the polyurethane organosilicon conductive adhesive obtained in examples 1-6 was tested, the test method refers to the conductive adhesive resistivity test method of QJ 1525-88, the conductive adhesive was cured at 150 ℃ for 1min, the thickness of the adhesive film was 10mm, 5 samples were tested in each example, the average value of the measured volume resistivity was taken and recorded in table 1.
2. Adhesion force: the adhesion of the polyurethane silicone conductive adhesives obtained in examples 1 to 6 was tested by a peel strength tester, and the substrate was an electroplated silver plate, and the results are shown in table 1.
3. Elongation at break: the elongation at break test of the polyurethane organosilicon conductive adhesive obtained in examples 1-6 was performed by using a universal tester, and the results are shown in table 1.
TABLE 1
| Examples | Volume resistivity/Ω · cm | adhesion/MPa | Elongation at break/% |
| Example 1 | 3.1*10-3 | 4.0 | 200 |
| Example 2 | 4.2*10-3 | 5.0 | 300 |
| Example 3 | 3.0*10-3 | 2.6 | 120 |
| Example 4 | 3.6*10-3 | 2.9 | 360 |
| Example 5 | 5.9*10-3 | 3.8 | 180 |
| Example 6 | 2.7*10-3 | 4.1 | 190 |
The embodiments 1 to 6 show that the polyurethane organosilicon conductive adhesive provided by the invention has excellent mechanical strength, adhesive force and conductive performance, is suitable for being popularized and used as a tile stacking adhesive in the field of solar cells, and has a wide development prospect.
Finally, it should be understood that the above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The polyurethane organosilicon conductive adhesive is characterized by comprising 20-30 parts by weight of silicone oil, 3-7 parts by weight of cross-linking agent and 60-80 parts by weight of silver powder; the silicone oil is hydroxyl silicone oil.
2. The polyurethane silicone conductive adhesive according to claim 1, wherein the hydroxyl silicone oil is a hydroxyl-terminated silicone oil, and the raw material for preparing the hydroxyl-terminated silicone oil comprises hydrogen-terminated silicone oil.
3. The polyurethane silicone conductive adhesive according to claim 2, wherein the hydrogen content of the hydrogen-terminated silicone oil is 0.02 to 0.06 wt%.
4. The polyurethane silicone conductive adhesive according to claim 3, wherein the hydrogen-terminated silicone oil has a viscosity of 40 to 200cSt at 25 ℃.
5. The polyurethane silicone conductive adhesive according to any one of claims 2 to 4, wherein the hydroxyl silicone oil is prepared from a raw material further comprising a hydroxyl-substituted olefin compound.
6. The polyurethane silicone conductive adhesive according to claim 5, wherein the olefin compound is selected from one or more of propylene, 1-butene, 2-butene, 1-pentene, 2-pentene, 3-methyl-1-pentene, 3-methyl-2-pentene, and 2-ethyl-1-butene.
7. The polyurethane silicone conductive adhesive according to claim 5, wherein the hydroxyl-substituted olefin compound is used in an amount of 1 to 3 wt% based on the hydrogen-terminated silicone oil.
8. The polyurethane silicone conductive adhesive according to claim 1, wherein the crosslinking agent is an isocyanate having-NCO functionality of not less than 2.
9. The preparation method of the polyurethane organosilicon conductive adhesive according to any claim 1 to 8, characterized by comprising the following steps: adding silicone oil, a cross-linking agent and silver powder into a stirrer, mixing, grinding, defoaming and discharging to obtain the silver-based ink.
10. Application of the polyurethane organosilicon conductive adhesive according to any one of claims 1 to 8 in the field of solar cells.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114210597A (en) * | 2022-02-22 | 2022-03-22 | 深圳市正和兴电子有限公司 | Conductive adhesive recommendation method and system for semiconductor device and readable storage medium |
| WO2023100425A1 (en) * | 2021-12-03 | 2023-06-08 | Tdk株式会社 | Solar cell module |
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2020
- 2020-04-13 CN CN202010283972.1A patent/CN111334237A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023100425A1 (en) * | 2021-12-03 | 2023-06-08 | Tdk株式会社 | Solar cell module |
| CN114210597A (en) * | 2022-02-22 | 2022-03-22 | 深圳市正和兴电子有限公司 | Conductive adhesive recommendation method and system for semiconductor device and readable storage medium |
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