TWI829723B - Use of resin compositions for heat storage materials, heat storage materials and articles including heat storage materials - Google Patents

Abstract

One aspect of the present invention provides a resin composition containing an acrylic resin containing a first monomer represented by the following formula (1), copolymerizable with a first monomer and having water-combinable properties. The monomer component of the second monomer of the reacted reactive group is polymerized. In the formula, R ¹ represents a hydrogen atom or a methyl group, and R ² represents an alkyl group having 12 to 30 carbon atoms.

Description

Use of resin compositions for heat storage materials, heat storage materials and Items including thermal storage materials

The present invention relates to a resin composition, heat storage material and articles including the heat storage material.

Thermal storage materials are materials that can extract stored energy in the form of heat as needed. The heat storage material can be used in air conditioning equipment, floor heating equipment, refrigerators, electronic components such as integrated circuit (IC) wafers, automobile interior and exterior decorative materials, automobile parts such as carbon canisters, and thermal insulation containers.

As a method of storing heat, latent heat storage using phase changes of substances is widely used in terms of the magnitude of heat. As a latent heat storage material, water-ice is widely known. Water-ice is a substance with a large amount of heat, but its phase change temperature is limited to 0°C in the atmosphere, so its application range is also limited. Therefore, paraffin is used as a latent heat storage material having a phase change temperature higher than 0° C. and 100° C. or lower. However, if paraffin wax undergoes a phase change by heating, it becomes liquid, which may cause fire or ignition. Therefore, in order to use paraffin as a heat storage material, it must be stored in a sealed container such as a bag to prevent the paraffin from leaking from the heat storage material, and the application field is limited.

As a method of improving a heat storage material containing paraffin, for example, Patent Document 1 discloses a method of using a gelling agent. The gel produced by the above method can maintain a gel-like molded body even after the phase change of paraffin wax. However, in the method described, it is used as a storage When using hot materials, it may cause liquid leakage or volatilization of heat storage materials.

In addition, as another improvement method, for example, Patent Document 2 discloses a method using a hydrogenated conjugated diene copolymer. In this method, the shape can be maintained near the melting or solidification temperature of the hydrocarbon compound. However, if the temperature is increased to a higher temperature, the compatibility is low, causing phase separation, resulting in leakage of the hydrocarbon compound.

In addition, as another improvement method, for example, Patent Document 3 discloses a method of microencapsulating a heat storage material. In this method, the heat storage material is encapsulated, so the operability is good regardless of the phase change. However, in high temperature areas, there is a risk that the heat storage material may ooze out of the capsule.

[Prior art documents]

[Patent Document]

[Patent Document 1] Japanese Patent Application Laid-Open No. 2000-109787

[Patent Document 2] Japanese Patent Application Publication No. 2014-95023

[Patent Document 3] Japanese Patent Application Publication No. 2005-23229

In one aspect, the object of the present invention is to provide a resin composition that can be preferably used as a thermal storage material. In another aspect, an object of the present invention is to provide a heat storage material excellent in heat storage.

The inventors of the present invention conducted diligent research and found that a resin composition containing a specific component can be suitably used as a heat storage material, that is, a heat storage material formed of the resin composition. The heat storage material has excellent heat storage capacity, and the present invention was completed. Among several aspects, the present invention provides the following [1] to [11].

[1] A resin composition containing an acrylic resin containing a first monomer represented by the following formula (1), copolymerizable with a first monomer and having reactivity with water. The monomer component of the second monomer of the base is polymerized.

[In the formula, R ¹ represents a hydrogen atom or a methyl group, and R ² represents an alkyl group with 12 to 30 carbon atoms]

[2] A resin composition containing an acrylic resin containing a first structural unit represented by the following formula (2) and a second structural unit having a reactive group that can react with water.

[Chemicalization 2]

[In the formula, R ³ represents a hydrogen atom or a methyl group, and R ⁴ represents an alkyl group with 12 to 30 carbon atoms]

[3] The resin composition according to [1] or [2], wherein the reactive group is an alkoxysilyl group or an isocyanate group.

[4] The resin composition according to [1], wherein the content of the first monomer is 60 parts by mass or more based on 100 parts by mass of the monomer component.

[5] The resin composition according to [1] or [4], wherein the content of the second monomer is 25 parts by mass or less based on 100 parts by mass of the monomer component.

[6] The resin composition according to [2], wherein the content of the first structural unit is 60 parts by mass or more based on 100 parts by mass of all structural units constituting the acrylic resin.

[7] The resin composition according to [2] or [6], wherein the content of the second structural unit is 25 parts by mass or less based on 100 parts by mass of all structural units constituting the acrylic resin.

[8] The resin composition according to any one of [1] to [7], wherein the content of the acrylic resin is 50 parts by mass or more with respect to 100 parts by mass of the resin composition.

[9] The resin composition according to any one of [1] to [8], which is used to form a heat storage material.

[10] A heat storage material including a cured product of the resin composition according to any one of [1] to [9].

[11] An article including: a heat source; and a cured product of the resin composition according to any one of [1] to [9] provided in thermal contact with the heat source.

According to one aspect of the present invention, a resin composition that can be preferably used as a heat storage material can be provided. Furthermore, regarding the resin composition according to one aspect of the present invention, a cured product of the resin composition can be easily obtained at room temperature (for example, 25°C) without using a curing agent. According to another aspect of the present invention, a heat storage material excellent in heat storage can be provided. In addition, the heat storage material according to one aspect of the present invention can suppress liquid leakage above the phase change temperature of the heat storage material and has excellent heat resistance.

1: Items

2:Heat source

3: Heat storage material

FIG. 1 is a schematic cross-sectional view showing one embodiment of an article including a heat storage material.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as appropriate. In addition, this invention is not limited to the following embodiment.

The so-called "(meth)acrylate" in this specification refers to "acrylate" and its corresponding "methacrylate", and the so-called "(meth)acrylyl" refers to "acrylyl" and its corresponding of "methacrylyl".

The weight average molecular weight (Mw) and number average molecules in this specification The amount (Mn) refers to a value determined using gel permeation chromatography (Gel Permeation Chromatography, GPC) under the following conditions and using polystyrene as a standard substance.

． Measuring machine: HLC-8320GPC (product name, manufactured by Tosoh Corporation)

． Analysis column: TSKgel SuperMultipore HZ-H (3 connections) (product name, manufactured by Tosoh Corporation)

． Guard column: TSKguardcolumn SuperMP(HZ)-H (product name, manufactured by Tosoh Corporation)

． Eluent: Tetrahydrofuran (THF)

． Measuring temperature: 25℃

In this specification, "excellent heat resistance" means that the 1% weight loss temperature measured by thermogravimetric analysis-differential thermal analysis (TG-DTA) is 280°C or higher.

The resin composition of one embodiment contains an acrylic resin. Acrylic resin is a polymer obtained by polymerizing monomer components including a first monomer and a second monomer.

The first monomer is represented by the following formula (1).

In the formula, R ¹ represents a hydrogen atom or a methyl group, and R ² represents an alkyl group having 12 to 30 carbon atoms.

The alkyl group represented by R ² may be linear or branched. The number of carbon atoms of the alkyl group represented by R ² is preferably 12 to 28, more preferably 12 to 26, further preferably 12 to 24, particularly preferably 12 to 22.

In other words, the first monomer is an alkyl (meth)acrylate having a linear or branched alkyl group having 12 to 30 carbon atoms at the end of the ester group. Examples of the first monomer include: (meth)lauryl acrylate (lauryl (meth)acrylate), myristyl (meth)acrylate, and cetyl (meth)acrylate. Ester, stearyl (meth)acrylate (stearyl (meth)acrylate), behenyl (meth)acrylate (behenyl (meth)acrylate), behenyl (meth)acrylate Tetraester, hexadecyl (meth)acrylate, octadecyl(meth)acrylate, etc. These first monomers may be used alone or in combination of two or more. The first monomer is preferably selected from the group consisting of dodecyl (meth)acrylate (lauryl (meth)acrylate), myristyl (meth)acrylate, and stearyl (meth)acrylate. At least one of the group consisting of (stearyl (meth)acrylate) and behenyl (meth)acrylate (behenyl (meth)acrylate).

From the viewpoint of obtaining sufficient heat storage when forming a heat storage material, the content of the first monomer is preferably 60 parts by mass or more, more preferably 80 parts by mass or more, based on 100 parts by mass of the monomer component. For example, The amount may be 98 parts by mass or less.

The second monomer is a monomer that is copolymerizable with the first monomer and has a reactive group that can react with water (reactive monomer). In order to be copolymerizable with the first monomer, the second monomer contains a group having an ethylenically unsaturated bond (ethylenically unsaturated group). as ethylenically unsaturated Examples of the radical include (meth)acrylyl, vinyl, and allyl. The second monomer is preferably a monomer having a reactive group capable of reacting with water and a (meth)acrylyl group.

The reactive group in the second monomer can react with water at room temperature (for example, 25°C). Water can be, for example, moisture contained in the air. The reactive group in the second monomer is, for example, an alkoxysilyl group or an isocyanate group. That is, the second monomer is, for example, an alkoxysilyl group-containing monomer or an isocyanate group-containing monomer. Since the second monomer contains a reactive group having the above-mentioned properties, it may also be called a moisture-curable or room-temperature curable monomer. The reactive group in the second monomer may be a monomer that can react with a curing agent described below.

The second monomer is preferably a monomer represented by the following formula (3).

In the formula, R ⁵ represents a hydrogen atom or a methyl group, and R ⁶ represents a monovalent organic group having the reactive group capable of reacting with water, preferably a monovalent organic group having an alkoxysilyl group or an isocyanate group. .

When R ⁶ is a monovalent organic group having an alkoxysilyl group, R ⁶ is represented by the following formula (4), for example.

[Chemistry 5]

In the formula, R ⁷ represents an alkylene group, R ⁸ , R ⁹ and R ¹⁰ each independently represent an alkoxy group or an alkyl group, and * represents a bond. At least one of R ⁸ , R ⁹ and R ¹⁰ is an alkoxy group. It can be: R ⁸ , R ⁹ and R ¹⁰ are all alkoxy groups; it can also be: one of R ⁸ , R ⁹ and R ¹⁰ is an alkyl group, and the other two are alkoxy groups.

The alkylene group represented by R ⁷ may be linear or branched. The carbon number of the alkylene group represented by R ⁷ may be, for example, 1 to 10, 1 to 8, 1 to 6, or 1 to 4.

The alkoxy group represented by R ⁸ , R ⁹ or R ¹⁰ may independently be linear or branched. The number of carbon atoms in the alkoxy group may be independently, for example, 1 to 10, 1 to 8, 1 to 6, 1 to 4, or 1 to 2. The alkoxy group is preferably a methoxy group.

When any one of R ⁸ , R ⁹ or R ¹⁰ is an alkyl group, the alkyl group may be independently linear or branched. The number of carbon atoms in the alkyl group may be independently, for example, 1 to 10, 1 to 8, 1 to 6, 1 to 4, or 1 to 2. The alkyl group is preferably methyl.

Regarding the alkoxysilyl group in the alkoxysilyl group-containing monomer, more specifically, it may be trimethoxysilyl group, triethoxysilyl group, methyldimethoxysilyl group, methyldimethoxysilyl group, etc. Ethoxysilyl, etc.

Examples of the alkoxysilyl group-containing monomer represented by formula (3) include: 3-methacryloxypropyltrimethoxysilane, 8-methacryloxyoctyltrimethyl Oxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-acryloxypropyltrimethoxysilane Silane etc.

When R ⁶ is a monovalent organic group having an isocyanate group, R ⁶ is represented by the following formula (5), for example.

[Chemical 6]＊-R ¹¹ -N=C=O (5)

In the formula, R ¹¹ represents an alkylene group, and * represents a bond.

The alkylene group represented by R ¹¹ may be the same as the alkylene group represented by R ⁷ .

Examples of the isocyanate group-containing monomer represented by formula (3) include 2-methacryloxyethyl isocyanate, 2-acrylyloxyethyl isocyanate, and the like.

These second monomers may be used alone or in combination of two or more. From the viewpoint of easy hardening at room temperature, the second monomer is preferably an alkoxysilyl group-containing monomer having an alkoxysilyl group as a reactive group, and more preferably a trimethoxysilyl group-containing monomer. The monomer is preferably a trimethoxysilyl group-containing (meth)acrylic acid monomer. It can also be said that the second monomer is a silane compound having a (meth)acrylyl group.

From the viewpoint that the heat storage material has excellent heat storage capacity, the content of the second monomer may be 2 parts by mass or more, 3 parts by mass or more, 5 parts by mass or more, 7 parts by mass or more, based on 100 parts by mass of the monomer component. 8 parts by mass or more, can be 25 parts by mass or more below, preferably 20 parts by mass or less, more preferably 15 parts by mass or less, further preferably 13 parts by mass or less, particularly preferably 10 parts by mass or less.

In addition to the first monomer and the second monomer, the monomer component may further contain other monomers if necessary. Examples of other monomers include: (methyl)acrylate, ethyl(meth)acrylate, propyl(meth)acrylate, butyl(meth)acrylate, etc. The terminal of the ester group has a carbon number of less than 12 ( Alkyl (meth)acrylate with an alkyl group having 1 to 11 carbon atoms; isobornyl (meth)acrylate and dicyclopentyl (meth)acrylate are equal to (methyl) having a cyclic hydrocarbon group at the end of the ester group ) cycloalkyl acrylate, etc. Other monomers can be used individually by 1 type or in combination of 2 or more types.

In one embodiment, the monomer component only contains a first monomer, a second monomer, and an optional third monomer, where the third monomer is selected from the group consisting of ester groups having carbon numbers 1 to 11 at the end thereof. At least one of the group consisting of alkyl (meth)acrylic acid alkyl esters and (meth)acrylic acid cycloalkyl esters having a cyclic hydrocarbon group at the end of the ester group. In other words, in one embodiment, the monomer component does not contain monomers other than the first monomer, the second monomer, and the third monomer (for example, a (meth)acrylic monomer having a siloxane skeleton). Regarding the monomer components, in one embodiment, only the first monomer and the second monomer may be included, and in another embodiment, only the first monomer, the second monomer, and the third monomer may be included.

Acrylic resin can be obtained by polymerizing a monomer component including a first monomer, a second monomer, and other monomers used if necessary. The polymerization method can be appropriately selected from known polymerization methods such as various radical polymerizations, and examples thereof include suspension polymerization, solution polymerization, block polymerization, and the like. As a polymerization method, acrylic resin When the weight average molecular weight of the fat becomes large (for example, 200,000 or more), it is preferable to use the suspension polymerization method. When the weight average molecular weight of the acrylic resin becomes small (for example, 100,000 or less), it is preferable to use the solution polymerization method. .

When the suspension polymerization method is used, a dispersion liquid is prepared by mixing monomer components as raw materials, a polymerization initiator, an optional chain transfer agent, water, a suspending agent, and a reducing agent.

Examples of the suspending agent include water-soluble polymers such as polyvinyl alcohol, methylcellulose, and polyacrylamide, and poorly soluble inorganic substances such as calcium phosphate and magnesium pyrophosphate. Among these, water-soluble polymers such as polyvinyl alcohol are preferably used.

The blending amount of the suspending agent is preferably 0.005 to 1 part by mass, more preferably 0.01 to 0.07 parts by mass relative to 100 parts by mass of the total amount of monomer components as raw materials. When the suspension polymerization method is used, molecular weight regulators such as thiol compounds, thioglycol, carbon tetrachloride, and α-methylstyrene dimer may also be added if necessary. The polymerization temperature is preferably 0°C to 200°C, more preferably 40°C to 120°C, and even more preferably 50°C to 110°C.

When a solution polymerization method is used, examples of the solvent used include aromatic solvents such as toluene and xylene, ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone, ethyl acetate, Ester solvents such as butyl acetate, chlorine solvents such as carbon tetrachloride, alcohol solvents such as 2-propanol and 2-butanol, etc. From the viewpoint of the polymerizability of the obtained acrylic resin, the solid content concentration in the solution at the start of solution polymerization is preferably 40 mass% to 70 mass%, more preferably 50 mass% to 60 mass%. The polymerization temperature is preferably 0°C~200°C, more preferably 40°C~120°C, and even more preferably 50°C~ 110℃.

The polymerization initiator used in each polymerization method can be used without particular limitation as long as it is a radical polymerization initiator. Examples of the radical polymerization initiator include benzoyl peroxide, lauryl peroxide, di-tert-butylperoxyhexahydroterephthalate, and tert-butylperoxy-2-ethyl. Organic peroxides such as 1,1-tert-butylperoxy-3,3,5-trimethylcyclohexane, tert-butylperoxyisopropyl carbonate, azobisisopropyl carbonate, etc. Azo compounds such as butyronitrile, azobis-4-methoxy-2,4-dimethylvaleronitrile, azobicyclohexanone-1-carbonitrile, azodibenzylcarbonitrile, etc.

From the viewpoint of fully polymerizing the monomers, the amount of the polymerization initiator is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, and still more preferably 0.1 parts by mass, based on 100 parts by mass of the total amount of the monomers. More than one serving. From the viewpoint that the molecular weight of the acrylic resin is in a preferable range, decomposition products are suppressed, and preferable bonding strength is obtained when used as a heat storage material, the polymerization initiator is The blending amount of is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and still more preferably 3 parts by mass or less.

The acrylic resin obtained in this manner has a structural unit derived from the first monomer and a structural unit derived from the second monomer. That is, the resin composition of one embodiment contains an acrylic resin containing a first structural unit (structural unit derived from the first monomer) and a second structural unit (structural unit derived from the second monomer).

The first structural unit is represented by the following formula (2).

[Chemical 7]

In the formula, R ³ represents a hydrogen atom or a methyl group, and R ⁴ represents an alkyl group having 12 to 30 carbon atoms.

The alkyl group represented by R ⁴ may be linear or branched. The carbon number of the alkyl group represented by R ⁴ is preferably 12 to 28, more preferably 12 to 26, further preferably 12 to 24, particularly preferably 12 to 22. Examples of the alkyl group represented by R ⁴ include dodecyl (lauryl), tetradecyl, hexadecyl, octadecyl (stearyl), behenyl ), twenty-four bases, twenty-six bases, twenty-eight bases, etc. The alkyl group represented by R ⁴ is preferably selected from the group consisting of dodecyl (lauryl), tetradecyl, octadecyl (stearyl) and behenyl (behenyl) at least one of them. The acrylic resin contains one or more types of these first structural units.

From the viewpoint that the heat storage material has excellent heat storage capacity, the content of the first structural unit is preferably 60 parts by mass or more, more preferably 80 parts by mass or more, based on 100 parts by mass of all the structural units constituting the acrylic resin. For example, It is 98 parts by mass or less.

The second structural unit has a reactive group capable of reacting with water. The reactive group is, for example, at least one group selected from the group consisting of an alkoxysilyl group and an isocyanate group. The second structural unit is, for example, a structural unit derived from the alkoxysilyl group-containing monomer or isocyanate group-containing monomer. Acrylic resin contains the second structure of these One or more than two types of units.

The second structural unit is preferably a structural unit represented by the following formula (6).

In the formula, R ¹² represents a hydrogen atom or a methyl group, and R ¹³ represents a monovalent organic group having the reactive group capable of reacting with water. The reactive group contained in the organic group represented by R ¹³ may be the reactive group, preferably an alkoxysilyl group or an isocyanate group, more preferably an alkoxysilyl group.

When the reactive group contained in the organic group represented by R ¹³ is an alkoxysilyl group, the second structural unit is preferably represented by the following formula (7).

[Chemical 9]

In the formula, R ¹² represents a hydrogen atom or a methyl group, R ¹⁴ represents an alkylene group, and R ¹⁵ , R ¹⁶ and R ¹⁷ each independently represent an alkoxy group or an alkyl group. At least one of R ¹⁵ , R ¹⁶ and R ¹⁷ is an alkoxy group. It can be: R ¹⁵ , R ¹⁶ and R ¹⁷ are all alkoxy groups; it can also be: one of R ¹⁵ , R ¹⁶ and R ¹⁷ is an alkyl group, and the other two are alkoxy groups.

The alkylene group represented by R ¹⁴ may be linear or branched. The carbon number of the alkylene group represented by R ¹⁴ may be, for example, 1 to 10, 1 to 8, 1 to 6, or 1 to 4.

The alkoxy groups represented by R ¹⁵ , R ¹⁶ and R ¹⁷ may each independently be linear or branched. The number of carbon atoms in the alkoxy group may be independently, for example, 1 to 10, 1 to 8, 1 to 6, 1 to 4, or 1 to 2. The alkoxy group is preferably a methoxy group.

When any one of R ¹⁵ , R ¹⁶ and R ¹⁷ is an alkyl group, the alkyl group may be independently linear or branched. The number of carbon atoms in the alkyl group may be independently, for example, 1 to 10, 1 to 8, 1 to 6, 1 to 4, or 1 to 2. The alkyl group is preferably methyl.

When the reactive group contained in the organic group represented by R ¹³ is an isocyanate group, the second structural unit is preferably represented by the following formula (8).

In the formula, R ¹² represents a hydrogen atom or a methyl group, and R ¹⁸ represents an alkylene group.

The alkylene group represented by R ¹⁸ may be the same as the alkylene group represented by R ¹⁴ .

From the viewpoint of obtaining sufficient heat storage when forming a heat storage material, the content of the second structural unit may be 2 parts by mass or more, 3 parts by mass or more, or 5 parts by mass with respect to 100 parts by mass of all structural units constituting the acrylic resin. More than 7 parts by mass or more than 8 parts by mass, it can be 25 parts by mass or less, preferably 20 parts by mass or less, more preferably 15 parts by mass or less, more preferably 13 parts by mass or less, especially 10 parts by mass portion or less.

In addition to the first structural unit and the second structural unit, the acrylic resin may further contain other structural units if necessary. The other structural units may be structural units derived from said other monomers.

In one embodiment, the acrylic resin only contains a first structural unit, a second structural unit and an optional third structural unit, and the third structural unit is selected from From the group consisting of (meth)acrylic acid alkyl esters having an alkyl group with 1 to 11 carbon atoms at the end of the ester group and (meth)acrylic acid cycloalkyl esters having a cyclic hydrocarbon group at the end of the ester group of at least one monomer. In other words, in one embodiment, the acrylic resin does not contain structural units other than the first structural unit, the second structural unit, and the third structural unit (for example, structural units derived from (meth)acrylic monomers having a siloxane skeleton. ). The acrylic resin may contain only the first structural unit and the second structural unit in one embodiment, and may contain only the first structural unit, the second structural unit and the third structural unit in another embodiment.

The acrylic resin may be any of a random copolymer, a block copolymer, or a graft copolymer.

From the viewpoint that the heat storage material has excellent heat storage capacity, the content of the acrylic resin is preferably 50 parts by mass or more, more preferably 70 parts by mass or more, and still more preferably 80 parts by mass or more based on 100 parts by mass of the resin composition. The content of the acrylic resin may be 100 parts by mass or less, 99.5 parts by mass or less, or 99.3 parts by mass or less relative to 100 parts by mass of the resin composition.

From the viewpoint of easy hardening at room temperature (hardening by moisture), the resin composition may further contain a catalyst. Examples of the catalyst include catalysts containing aluminum or tin. Examples of the catalyst containing aluminum include aluminum complexes such as aluminum bis(ethyl acetate acetate)(2,4-pentanedioneate). Examples of the tin-containing catalyst include dibutyltin dilaurate. As a catalyst, when the reactive group is an alkoxysilyl group, aluminum bis(ethyl acetate acetate)(2,4-pentanedioate) can be preferably used. When the reactive group is In the case of an isocyanate group, dibutyltin dilaurate is preferably used.

When the resin composition is used to form a heat storage material, the resin composition may further contain a curing agent from the viewpoint of further suppressing leakage and volatilization of the heat storage material and further improving heat resistance. The curing agent is one that can react with the reactive group contained in the second monomer (second structural unit). Examples of the curing agent include isocyanate curing agents, phenol curing agents, amine curing agents, imidazole curing agents, acid anhydride curing agents, carboxylic acid curing agents, and the like. These hardeners can be used individually by 1 type or in combination of 2 or more types.

Examples of the isocyanate-based hardener include toluene diisocyanate (TDI) (2,4-toluene diisocyanate or 2,6-toluene diisocyanate or mixtures thereof), phenylene diisocyanate (m-phenylene diisocyanate) diisocyanate or p-phenylene diisocyanate or mixtures thereof), 4,4'-diphenyl diisocyanate, 1,5-naphthalene diisocyanate (NDI), diphenylmethane diisocyanate (4,4' -Diphenylmethane diisocyanate, 2,4'-diphenylmethane diisocyanate or 2,2'-diphenylmethane diisocyanate or mixtures thereof) (diphenylmethane diisocyanate, MDI), 4,4'-toluidine diisocyanate Aromatic diisocyanates such as toluidine diisocyanate (TODI), 4,4'-diphenyl ether diisocyanate, 1,3-xylylene diisocyanate or 1,4-xylylene diisocyanate or Its mixture) (xylylene diisocyanate, xylylene diisocyanate (TMXDI), ω,ω'-diisocyanate-1,4-diethylbenzene, etc. As isocyanate hardeners, there are also: three Methylene diisocyanate, 1,2-propylene diisocyanate, butylene diisocyanate (tetramethylene diisocyanate, 1,2-butylene diisocyanate, 2,3-butylene diisocyanate, 1 ,3-butylene diisocyanate), 1,5-pentamethylene diisocyanate (PDI), 1,6-hexamethylene diisocyanate (HDI), 2,4,4- Aliphatic diisocyanates such as trimethylhexamethylene diisocyanate or 2,2,4-trimethylhexamethylene diisocyanate, 2,6-diisocyanate methyl hexanoate, 1,3-cyclopentane diisocyanate Isocyanate, 1,3-cyclopentene diisocyanate, cyclohexane diisocyanate (1,4-cyclohexane diisocyanate, 1,3-cyclohexane diisocyanate), 3-methyl isocyanate-3,5 ,5-Trimethylcyclohexyl isocyanate (isophorone diisocyanate) (isophorone diisocyanate, IPDI), methylene bis (cyclohexyl isocyanate) (4,4'-methylene bis (cyclohexyl isocyanate), 2 , 4'-methylene bis (cyclohexyl isocyanate) or 2,2'-methylene bis (cyclohexyl isocyanate), their trans, trans isomers (trans, trans), trans, cis isomers ( trans, cis), cis, cis isomer, or mixture thereof) (H12MDI), methylcyclohexane diisocyanate (methyl-2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane Alkane diisocyanate), norbornane diisocyanate (various isomers or mixtures thereof) (norbornane diisocyanate, NBDI), bis(methyl isocyanate) cyclohexane (1,3-bis(methyl isocyanate) Alicyclic diisocyanates such as cyclohexane or 1,4-bis(isocyanatomethyl)cyclohexane or its mixture) (H6XDI), etc.

Examples of the phenolic hardener include bisphenol A, bisphenol F, bisphenol S, 4,4'-biphenylphenol, tetramethylbisphenol A, dimethylbisphenol A, and tetramethylbisphenol. Phenol F, dimethylbisphenol F, tetramethylbisphenol S, dimethylbisphenol S, tetramethyl-4,4'-biphenol, dimethyl-4,4'-biphenylphenol, 1-(4-Hydroxyphenyl)-2-[4-(1,1-bis-(4- Hydroxyphenyl)ethyl)phenyl]propane, 2,2'-methylene-bis(4-methyl-6-tert-butylphenol), 4,4'-butylene-bis(3-methyl 6-tert-butylphenol), trihydroxyphenylmethane, resorcinol, hydroquinone, pyrogallol, phenols with diisopropylidene skeleton; 1,1- Di-4-hydroxyphenyl fluoride and other phenols with fluorine skeleton; cresols; ethylphenols; butylphenols; octylphenols; bisphenol A, bisphenol F, bisphenol S, naphthol Various phenol-based novolak resins, phenol novolak resins containing xylylene skeleton, phenol novolak resins containing dicyclopentadiene skeleton, phenol novolak resins containing biphenyl skeleton, phenol novolac resins containing fluorine skeleton Various novolac resins such as phenol novolac resin and furan skeleton-containing phenol novolac resin.

Examples of the amine-based curing agent include: diaminodiphenylmethane, diaminodiphenyltriane, diaminodiphenyl ether, p-phenylenediamine, m-phenylenediamine, o-phenylenediamine, 1 , 5-diaminonaphthalene, metaxylylenediamine and other aromatic amines, ethylenediamine, diethylenediamine, isophoronediamine, bis(4-amino-3-methyldicyclohexyl) Methane, polyetherdiamine and other aliphatic amines; dicyandiamine, 1-(o-tolyl)biguanide and other guanidines, etc.

Examples of the imidazole-based hardener include 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2 -Phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl -2-Phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 2,3-dihydro-1H-pyrrole-[1,2-a]benzimidazole, 2,4-bis Amino-6(2'-methylimidazole(1'))ethyl-s-triazine, 2,4-diamino-6(2'-undecylimidazole(1'))ethyl-s-triazine Triazine, 2,4-diamino-6(2'-ethyl-4-methylimidazole(1'))ethyl-s-triazine, 2,4-diamino-6(2'-methyl Imidazole(1'))ethyl-s-triazine. Isocyanuric acid adduct, 2-methyl Imidazole isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-3,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5 -Hydroxymethylimidazole, 1-cyanoethyl-2-phenyl-3,5-dicyanoethoxymethylimidazole, etc.

Examples of acid anhydride-based hardeners include phthalic anhydride, trimellitic anhydride, pyromellitic dianhydride, benzophenone tetracarboxylic anhydride, ethylene glycol trimellitic anhydride, and biphenyl tetracarboxylic anhydride. and other aromatic carboxylic acid anhydrides; azelaic acid, sebacic acid, dodecanedioic acid and other aliphatic carboxylic acid anhydrides, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, resistant anhydride, chloro-bridged anhydride, bicyclic Alicyclic carboxylic acid anhydrides such as heptenedicarboxylic anhydride, etc.

Examples of carboxylic acid-based hardeners include succinic acid, glutaric acid, adipic acid, sebacic acid, phthalic acid, isophthalic acid, terephthalic acid, and the like.

The content of the hardener may be 0.01 parts by mass or more and may be 10 parts by mass or less based on 100 parts by mass of the resin composition.

The resin composition may also contain no hardener. Even in this case, since the second structural unit in the acrylic resin has a reactive group that can react with water, the acrylic resin can react with, for example, moisture contained in the air to be hardened. That is, the resin composition can also be said to be a moisture-curable (moisture-curable) resin composition.

The resin composition may also contain other additives if necessary. Examples of other additives include hardening accelerators, antioxidants, colorants, fillers, crystal nucleating agents, thermal stabilizers, thermal conductive materials, plasticizers, foaming agents, flame retardants, vibration damping agents, and the like. Other additives can be used individually by 1 type or in combination of 2 or more types.

The resin composition may be solid or liquid at 90°C.

When the resin composition is in liquid form, from the viewpoint of excellent fluidity and workability, the viscosity of the resin composition at 90°C is preferably 100 Pa. s or less, preferably 50Pa. s or less, preferably 20Pa. s or less, preferably 10Pa. s or less. From the same point of view, the viscosity of the resin composition is preferably 100 Pa at the melting point of the acrylic resin + 20°C. s or less, preferably 50Pa. s or less, preferably 20Pa. s or less, preferably 10 Pa. viscosity below s. The viscosity of the resin composition at 90°C or the viscosity at the melting point of the acrylic resin + 20°C may be, for example, 0.5 Pa. s or above.

The viscosity of the resin composition is a value measured based on Japanese Industrial Standards (JIS) Z 8803, specifically measured with an E-type viscometer (PE-80L manufactured by Toki Sangyo Co., Ltd.) And the value obtained. Furthermore, the viscometer can be calibrated based on JIS Z 8809-JS14000. In addition, the melting point of the acrylic resin refers to a value measured by the method described in the Examples.

The resin composition described above can be preferably used as a heat storage material (preferably as a resin composition for heat storage materials) by hardening the resin composition. The resin composition can be hardened at room temperature (for example, 25°C). That is, a heat storage material according to one embodiment includes a cured product of the resin composition. In the heat storage material, the cured product of acrylic resin functions as a component with heat storage properties. Therefore, in one embodiment, the heat storage material (resin composition) may not include, for example, the heat storage material used in the previous heat storage material. Heat storage capsules containing latent heat storage materials can achieve excellent heat storage even under the above circumstances.

The heat storage material (hardened product of the resin composition) can be flexibly used in various fields. Thermal storage materials can be used in cars, buildings, public facilities, underground streets, etc. Air-conditioning equipment (increasing the efficiency of air-conditioning equipment), piping in factories (heat storage in piping), automobile engines (insulation around the engine), electronic parts (preventing temperature rise of electronic parts), underwear fibers, etc.

In each of these uses, the heat storage material (hardened material of the resin composition) can be placed in thermal contact with a heat source that generates heat in each use, so that the heat of the heat source can be stored. That is, one embodiment of the present invention is an article including: a heat source; and a heat storage material (hardened product of the resin composition) provided in thermal contact with the heat source.

FIG. 1 is a schematic cross-sectional view showing one embodiment of an article including a heat storage material. As shown in FIG. 1 , the article 1 includes: a heat source 2 ; and a heat storage material 3 arranged in thermal contact with the heat source 2 . The heat storage material 3 only needs to be arranged in thermal contact with at least a part of the heat source 2. As shown in FIG. 1, a part of the heat source 2 may be exposed, or it may be arranged to cover the entire surface of the heat source 2. As long as the heat storage material 3 is in thermal contact with the heat source 2, the heat source 2 and the heat storage material 3 may be in direct contact, or other components (such as thermally conductive components) may be disposed between the heat source 2 and the heat storage material 3.

For example, when the heat storage material 3 is used with air conditioning equipment (or parts thereof), piping, or an engine of a car as the heat source 2, the heat storage material 3 is in thermal contact with the heat source 2. 3 stores the heat generated from the heat source 2, making it easy to maintain the heat source 2 at a temperature above a certain level (heat preservation). When the heat storage material 3 is used as an underwear fiber, the heat storage material 3 stores heat generated from the human body as the heat source 2, so that warmth can be felt for a long time.

For example, regarding the heat storage material 3, it is the same as the electronic component as the heat source 2. When used, the heat generated in the electronic components can be stored by being arranged in thermal contact with the electronic components. In this case, for example, if the heat storage material is placed in further thermal contact with the heat radiating member, the heat stored in the heat storage material can be gradually released, and the heat generated in the electronic component can be suppressed from being released suddenly. to the outside (partially high temperature near electronic parts).

The heat storage material 3 can be formed into a sheet-like (film-like) hardened material and placed in the heat source 2 . When the resin composition is solid at 90° C., the sheet-shaped heat storage material 3 can be obtained, for example, by heating, melting, and molding the resin composition. That is, in one embodiment, the manufacturing method of the heat storage material 3 includes the step of heating and melting the resin composition and shaping it (shaping step). The forming in the forming step may be injection molding, compression molding or transfer molding. In this case, the heat storage material 3 does not need a casing, and the heat storage material 3 can be attached to the object to be installed alone, or rolled, or installed in various states.

In another embodiment, the cured product of the resin composition can also be used for purposes other than heat storage materials. The hardened material can be preferably used to form, for example, a waterproof material, a frost-proof material, a refractive index adjusting material, a lubricating material, an adsorbent material, a thermosetting stress relaxing material, or a low dielectric material. The waterproof material, anti-frost material, refractive index adjusting material, lubricating material, adsorbent material, thermosetting stress relaxing material and low dielectric material may each include, for example, a hardened product of the resin composition.

[Example]

Hereinafter, the present invention will be described in more detail using examples, but the present invention is not limited to the following examples.

[Synthesis of acrylic resin]

Acrylic resin 1A to acrylic resin 1F used in Examples 1-1 to 1-6 were synthesized by a known suspension polymerization method as follows.

(Synthesis example of acrylic resin 1A)

A 500 mL flask including a stirrer, a thermometer, a nitrogen gas inlet pipe, a discharge pipe, and a heating mantle was used as a reactor, and nitrogen gas was circulated in the flask at 100 mL/min.

Next, 80 g of myristyl acrylate, 10 g of butyl acrylate, and 10 g of 3-methacryloxypropyltrimethoxysilane were mixed as monomers, and 0.41 lauryl peroxide as a polymerization initiator was added. g. 0.12g of n-octylmercaptan as a chain transfer agent was dissolved to obtain a mixture. Then, 201.3 g of water (200 parts by mass with respect to 100 parts by mass of the mixture) and 0.2 g of polyvinyl alcohol (PVA) as a suspending agent (0.02 parts by mass with respect to 100 parts by mass of the mixture) were added to the mixture. part) and 0.1 g of ascorbic acid as a reducing agent to prepare a dispersion.

Then, the dispersion liquid was supplied into a flask (reactor) in which nitrogen gas was circulated and the dissolved oxygen was 1 ppm or less, and the dispersion was heated while stirring at a stirring speed of 250 times/min at an internal temperature of 50° C. in the reactor for 4 hours. reaction. While taking samples during the reaction, the polymerization rate was calculated based on the specific gravity of the produced resin. After confirming that the polymerization rate was 80% or more, the temperature was raised to 70°C and the reaction was continued for 2 hours. Thereafter, the product in the reactor is cooled, and the product is taken out, washed with water, dehydrated, and dried to obtain acrylic resin 1A.

Regarding acrylic resin 1B ~ acrylic resin 1F, except for the monomer components Except for changing the monomer components shown in Table 1, it was synthesized by the same method as the synthesis example of acrylic resin 1A.

[Synthesis of acrylic resin]

The acrylic resins 2A to 2F used in Examples 2-1 to 2-6 were synthesized by a known solution polymerization method as follows.

(Synthesis example of acrylic resin 2A)

A 500 mL flask including a stirrer, a thermometer, a nitrogen gas inlet pipe, a discharge pipe and a heating mantle was used as a reactor, and 80 g of myristyl acrylate, 10 g of butyl acrylate, and 3-methacryloxypropyl were used as monomers. 10g of trimethoxysilane and 81.8g of 2-propanol as a solvent were mixed and added to the reactor, stirred at room temperature (25°C) at a stirring speed of 250 times/min, and nitrogen was circulated at 100mL/min for 1 hour. . Thereafter, the temperature was increased to 70° C. over 30 minutes. After the temperature increase was completed, a solution in which 0.28 g of azobisisobutyronitrile was dissolved in 2 ml of methyl ethyl ketone was added to the reactor to start the reaction. Thereafter, the reaction was carried out for 5 hours with stirring at an internal temperature of 70°C in the reactor. Thereafter, 0.05 g of azobisisobutyronitrile was dissolved in methyl ethyl ketone 2 The solution obtained in mL was added to the reactor, the temperature was raised to 90°C over 15 minutes, and the reaction was continued for 2 hours. Thereafter, the solvent is removed and dried to obtain acrylic resin 2A.

Acrylic resin 2B to acrylic resin 2F were synthesized by the same method as the synthesis example of acrylic resin 2A, except that the monomer components were changed to those shown in Table 2. Table 2 shows the melting point of each acrylic resin obtained.

(Synthesis example of acrylic resin 2G)

Use a 500mL flask including a stirrer, thermometer, nitrogen inlet pipe, discharge pipe and heating jacket as a reactor. Add 117.4g of toluene as a solvent into the reactor and stir at room temperature (25°C) at a stirring speed of 200 times/minute. Stir and circulate nitrogen at 100 mL/min for 30 minutes. Thereafter, the temperature was raised to 110° C. over 30 minutes. After the temperature rise was completed, 170 g of stearyl acrylate, 20 g of butyl acrylate, and 2-isocyanate methacrylate as monomers were added dropwise over 2 hours and 30 minutes. A mixture of 10 g of ethyl ester and 2 g of azobisisobutyronitrile as a starting agent. Thereafter, the reaction was carried out for 1 hour while stirring at an internal temperature of 110°C in the reactor. Thereafter, a solution obtained by dissolving 0.05 g of azobisisobutyronitrile in 2 mL of toluene was added to the reactor, and the reaction was continued for 2 hours. Thereafter, the solvent is removed and dried to obtain acrylic resin 2G.

Acrylic resin 2H to acrylic resin 2K were synthesized by the same method as the synthesis example of acrylic resin 2G, except that the monomer components were changed to those shown in Table 3. Table 3 shows the melting point of each acrylic resin obtained.

The melting point of acrylic resin is measured as follows.

Using a differential scanning calorimeter (PerkinElmer) Make, model DSC8500), heat up to 100℃ at 20℃/min, hold at 100℃ for 3 minutes, cool down to -30℃ at 10℃/min, then keep at -30℃ for 3 minutes, then The temperature was again raised to 100°C at a rate of 10°C/min, whereby the thermal behavior of the acrylic resin was measured, and the melting peak was calculated as the melting point of the acrylic resin.

[Table 2]

In addition, lauryl acrylate is manufactured by Osaka Organic Chemical Industry Co., Ltd., myristyl acrylate is manufactured by Tokyo Chemical Industry Co., Ltd., butyl acrylate is manufactured by Wako Pure Chemical Industries, Ltd., stearyl acrylate, acrylic acid Behenate is manufactured by NOF Co., Ltd., 3-methacryloxypropyltrimethoxysilane and 8-methacryloxyoctyltrimethoxysilane are manufactured by Shin-Etsu Chemical Industry Co., Ltd. 2-Isocyanatoethyl acrylate was manufactured by Showa Denko Co., Ltd.

[Production of heat storage materials]

(Example 1-1)

Mix 15g of acrylic resin 1A, 0.015g of bis(ethyl acetyl acetate)(2,4-pentanedioate)aluminum (concentration 76%, 2-propanol solution) as a catalyst, and methylethyl as a solvent. 20 g of ketone were mixed to prepare a resin composition. The resin composition is coated on a polyethylene terephthalate (PET) film, heated and dried at 80°C for 30 minutes, and then cured at room temperature for 24 hours, and then the PET film is removed. A film-like heat storage material with a thickness of 100 μm was obtained.

(Example 1-2~Example 1-6)

A heat storage material was produced in the same manner as in Example 1-1 except that the composition of the resin composition was changed as shown in Table 4.

(Example 2-1)

15 g of acrylic resin 2A and 0.015 g of bis(ethyl acetate acetate)(2,4-pentanedioate)aluminum (concentration 76%, 2-propanol solution) as a catalyst were mixed to obtain a resin composition. The viscosity of the resin composition at 90°C was measured based on JIS Z 8803 using an E-type viscometer (PE-80L manufactured by Toki Sangyo Co., Ltd.). The results are shown in Table 5.

Then, the resin composition was filled into a 10 cm×10 cm×1 mm mold frame (stainless steel (SUS) plate) and cured at room temperature for 24 hours, thereby obtaining a sheet-shaped heat storage material with a thickness of 1 mm.

(Example 2-2~Example 2-6)

Except for changing the composition of the resin composition as shown in Table 5, the viscosity measurement of the resin composition and the production of the heat storage material were carried out in the same manner as in Example 2-1. do. The results are shown in Table 5.

(Example 2-7)

15 g of acrylic resin 2G and 0.015 g of dibutyltin dilaurate as a catalyst were mixed to obtain a resin composition. The viscosity of the resin composition at 90°C was measured based on JIS Z 8803 using an E-type viscometer (PE-80L manufactured by Toki Sangyo Co., Ltd.). The results are shown in Table 6.

Then, the resin composition was filled into a 10 cm×10 cm×1 mm mold frame (stainless steel (SUS) plate) and cured at room temperature for 24 hours, thereby obtaining a sheet-shaped heat storage material with a thickness of 1 mm.

(Example 2-8~Example 2-11)

Except that the composition of the resin composition was changed as shown in Table 6, the viscosity measurement of the resin composition and the production of the heat storage material were carried out in the same manner as in Example 2-7. The results are shown in Table 6.

[Evaluation of melting point and heat storage]

Each heat storage material produced in the Example was measured using a differential scanning calorimeter (model DSC8500 manufactured by PerkinElmer), and the melting point and heat storage amount were calculated. Specifically, the temperature was raised to 100°C at a rate of 20°C/min, maintained at 100°C for 3 minutes, then cooled to -30°C at a rate of 10°C/min, and then maintained at -30°C for 3 minutes, then at 10°C. The temperature was again raised to 100°C at a rate of /min and the thermal behavior was measured. Let the melting peak be the melting point of the heat storage material and the area be the heat storage heat. The results are shown in Tables 4 to 6. Furthermore, if the heat storage amount is 30 J/g or more, it can be said that the heat storage amount is excellent.

[Evaluation of liquid leakage and volatility]

For each heat storage material produced in the Example, the weight change before and after it was left standing for 1000 hours in an atmospheric environment at a temperature of 80° C. was measured, and the weight reduction rate (%) was measured. The results are shown in Tables 4 to 6.

[Heat resistance test (TG-DTA)]

The weight loss of each heat storage material produced in the Example was measured using a thermogravimetric balance TG-DTA6300 (Hitachi High-Tech Scientific Co., Ltd.). Read the temperature (℃) at which the weight decreases by 1% from the initial weight, and set it to the value of the temperature at which the weight decreases by 1%. The results are shown in Tables 4 to 6.

[table 5]

In Tables 4 to 6, the Al complex represents bis(ethyl acetate acetate) (2,4-pentanedioneate) aluminum (76% concentration, 2-propanol solution) (manufactured by Wako Pure Chemical Industries, Ltd. ), and the tin catalyst represents dibutyltin dilaurate (manufactured by Wako Pure Chemical Industries, Ltd.).

The heat storage material of the Example has excellent heat storage capacity and excellent heat resistance. Different, can inhibit leakage and volatilization. In particular, the heat storage materials of Examples 2-1 to 2-11 can be obtained by hardening a liquid resin composition, and therefore are advantageous in that they can be applied to members having complex shapes.

1: Items

2:Heat source

3: Heat storage material

Claims (11)

A use of a resin composition for heat storage materials, the resin composition containing an acrylic resin, the acrylic resin is obtained by polymerizing a monomer component, and the monomer component includes a third compound represented by the following formula (1) 1 monomer, a 2nd monomer that is copolymerizable with the 1st monomer and has a reactive group capable of reacting with water, and a 3rd monomer, the 3rd monomer having a carbon number at the end of the ester group Alkyl (meth)acrylate of 1 to 11 alkyl groups; and the reactive group is an alkoxysilyl group or an isocyanate group;

In the formula, R ¹ represents a hydrogen atom or a methyl group, and R ² represents an alkyl group having 12 to 30 carbon atoms. Use of a resin composition for heat storage materials, the resin composition containing an acrylic resin containing a first structural unit represented by the following formula (2) and a reactive group capable of reacting with water. The second structural unit and the third structural unit, the third structural unit is derived from an alkyl (meth)acrylate having an alkyl group with a carbon number of 1 to 11 at the end of the ester group; and the reactive group is Alkoxysilyl or isocyanate group;

In the formula, R ³ represents a hydrogen atom or a methyl group, and R ⁴ represents an alkyl group having 12 to 30 carbon atoms. The use of the resin composition as described in Item 1 of the patent application for heat storage materials, wherein the content of the first monomer is 60 parts by mass or more relative to 100 parts by mass of the monomer component. The use of the resin composition as described in Item 1 or Item 3 of the patent application for heat storage materials, wherein the content of the second monomer is less than 25 parts by mass relative to 100 parts by mass of the monomer component. . The use of the resin composition as described in item 2 of the patent application for heat storage materials, wherein the content of the first structural unit is 60 parts by mass or more relative to 100 parts by mass of all structural units constituting the acrylic resin. . If the resin composition described in item 2 or 5 of the patent application is used for heat storage materials, the content of the second structural unit relative to 100 parts by mass of all structural units constituting the acrylic resin is 25 parts by mass or less. The resin composition described in Item 1 or 2 of the patent application is used for heat storage materials, wherein the content of the acrylic resin is 50 parts by mass or more relative to 100 parts by mass of the resin composition. A heat storage material including a cured product of a resin composition containing an acrylic resin obtained by polymerizing a monomer component represented by the following formula (1) A first monomer, a second monomer that is copolymerizable with the first monomer and has a reactive group capable of reacting with water, and a third monomer, the third monomer having a carbon at the end of the ester group Alkyl (meth)acrylate of an alkyl group with numbers 1 to 11; and the reactive group is an alkoxysilyl group or an isocyanate group;

In the formula, R ¹ represents a hydrogen atom or a methyl group, and R ² represents an alkyl group having 12 to 30 carbon atoms. A heat storage material including a cured product of a resin composition containing an acrylic resin containing a first structural unit represented by the following formula (2) and having a reactive group capable of reacting with water The second structural unit and the third structural unit, the third structural unit is derived from an alkyl (meth)acrylate having an alkyl group with a carbon number of 1 to 11 at the end of the ester group; and the reactive group It is an alkoxysilyl group or an isocyanate group;

In the formula, R ³ represents a hydrogen atom or a methyl group, and R ⁴ represents an alkyl group having 12 to 30 carbon atoms. An article including a heat storage material, including: a heat source; and a hardened product of a resin composition provided in thermal contact with the heat source, the resin composition containing an acrylic resin polymerized monomer components The monomer component includes a first monomer represented by the following formula (1), a second monomer that can be copolymerized with the first monomer and has a reactive group that can react with water, and a 3 monomers, the third monomer is an alkyl (meth)acrylate having an alkyl group with a carbon number of 1 to 11 at the end of the ester group; and the reactive group is an alkoxysilyl group or an isocyanate group ;

In the formula, R ¹ represents a hydrogen atom or a methyl group, and R ² represents an alkyl group having 12 to 30 carbon atoms. An article including a heat storage material, including: a heat source; and a hardened product of a resin composition provided in thermal contact with the heat source, the resin composition containing an acrylic resin, and the acrylic resin contains the following formula (2 ), a second structural unit having a reactive group capable of reacting with water, and a third structural unit derived from an ester group having a carbon number of 1 to 11 at its end. Alkyl (meth)acrylate alkyl ester; and the reactive group is an alkoxysilyl group or an isocyanate group;

In the formula, R ³ represents a hydrogen atom or a methyl group, and R ⁴ represents an alkyl group having 12 to 30 carbon atoms.