JP7363787B2 - Resin compositions, heat storage materials, and articles - Google Patents

Description

The present invention relates to a resin composition, a heat storage material, and an article.

A heat storage material is a material that can extract stored energy as heat as needed. This heat storage material is used in applications such as air conditioning equipment, floor heating equipment, refrigerators, electronic parts such as IC chips, automobile interior and exterior materials, automobile parts such as canisters, and heat insulation containers.

As a heat storage method, latent heat storage using phase change of substances is widely used because of its large amount of heat. Water-ice is well known as a latent heat storage material. Although water-ice is a substance with a large amount of heat, its phase change temperature is limited to 0° C. in the atmosphere, which limits its range of application. Therefore, paraffin is used as a latent heat storage material having a phase change temperature higher than 0°C and lower than 100°C. However, when paraffin undergoes a phase change when heated, it becomes a liquid, which poses the risk of ignition and ignition. Therefore, in order to use paraffin as a heat storage material, it is necessary to prevent the paraffin from leaking from the heat storage material by storing it in an airtight container such as a bag, which limits the field of application.

As a method for improving a heat storage material containing paraffin, for example, Patent Document 1 discloses a method using a gelling agent. The gel produced by this method can maintain its gel-like shape even after the paraffin undergoes a phase change. However, with this method, when used as a heat storage material, liquid leakage, volatilization of the heat storage material, etc. may occur.

Further, as another improvement method, for example, Patent Document 2 discloses a method using a hydrogenated conjugated diene copolymer. In this method, it is possible to maintain the shape near the melting or solidification temperature of the hydrocarbon compound, but at higher temperatures, phase separation occurs due to low compatibility, resulting in leakage of the hydrocarbon compound.

Further, as another improvement method, for example, Patent Document 3 discloses a method of microcapsulating a heat storage material. In this method, since the heat storage material is encapsulated, the handling property is good regardless of the phase change, but there is a concern that the heat storage material may ooze out from the capsule in a high temperature range.

Japanese Patent Application Publication No. 2000-109787 JP 2014-95023 Publication Japanese Patent Application Publication No. 2005-23229

In one aspect, the present invention aims to provide a resin composition suitably used for a heat storage material. Another aspect of the present invention is to provide a heat storage material that has an excellent heat storage amount.

［式中、Ｒ^１は水素原子又はメチル基を表し、Ｒ^２は炭素数１２～３０のアルキル基を表す。］
［２］ 下記式（２）で表される第１の構造単位と、水と反応可能な反応性基を有する第２の構造単位とを含むアクリル樹脂を含有する、樹脂組成物。

［式中、Ｒ^３は水素原子又はメチル基を表し、Ｒ^４は炭素数１２～３０のアルキル基を表す。］
［３］ 反応性基がアルコキシシリル基又はイソシアネート基である、［１］又は［２］に記載の樹脂組成物。
［４］ 第１のモノマーの含有量が、モノマー成分１００質量部に対して６０質量部以上である、［１］に記載の樹脂組成物。
［５］ 第２のモノマーの含有量が、モノマー成分１００質量部に対して２５質量部以下である、［１］又は［４］に記載の樹脂組成物。
［６］ 第１の構造単位の含有量が、アクリル樹脂を構成する全構造単位１００質量部に対して６０質量部以上である、［２］に記載の樹脂組成物。
［７］ 第２の構造単位の含有量が、アクリル樹脂を構成する全構造単位１００質量部に対して２５質量部以下である、［２］又は［６］に記載の樹脂組成物。
［８］ アクリル樹脂の含有量が、樹脂組成物１００質量部に対して５０質量部以上である、［１］～［７］のいずれかに記載の樹脂組成物。
［９］ 蓄熱材の形成に用いられる、［１］～［８］のいずれかに記載の樹脂組成物。
［１０］ ［１］～［９］のいずれかに記載の樹脂組成物の硬化物を含む、蓄熱材。
［１１］ 熱源と、熱源と熱的に接触するように設けられた、［１］～［９］のいずれかに記載の樹脂組成物の硬化物と、を備える、物品。As a result of intensive research, the present inventors have found that a resin composition containing a specific component can be suitably used as a heat storage material, that is, a heat storage material formed from the resin composition has an excellent heat storage amount. They discovered this and completed the present invention. In some aspects, the present invention provides the following [1] to [11].
[1] Polymerizing a monomer component containing a first monomer represented by the following formula (1) and a second monomer that is copolymerizable with the first monomer and has a reactive group that can react with water. A resin composition containing an acrylic resin.

[In the formula, R ¹ represents a hydrogen atom or a methyl group, and R ² represents an alkyl group having 12 to 30 carbon atoms. ]
[2] A resin composition containing an acrylic resin including a first structural unit represented by the following formula (2) and a second structural unit having a reactive group capable of reacting with water.

[In the formula, R ³ represents a hydrogen atom or a methyl group, and R ⁴ represents an alkyl group having 12 to 30 carbon atoms. ]
[3] The resin composition according to [1] or [2], wherein the reactive group is an alkoxysilyl group or an isocyanate group.
[4] The resin composition according to [1], wherein the content of the first monomer is 60 parts by mass or more based on 100 parts by mass of the monomer components.
[5] The resin composition according to [1] or [4], wherein the content of the second monomer is 25 parts by mass or less based on 100 parts by mass of the monomer components.
[6] The resin composition according to [2], wherein the content of the first structural unit is 60 parts by mass or more based on 100 parts by mass of all structural units constituting the acrylic resin.
[7] The resin composition according to [2] or [6], wherein the content of the second structural unit is 25 parts by mass or less based on 100 parts by mass of all structural units constituting the acrylic resin.
[8] The resin composition according to any one of [1] to [7], wherein the content of the acrylic resin is 50 parts by mass or more based on 100 parts by mass of the resin composition.
[9] The resin composition according to any one of [1] to [8], which is used for forming a heat storage material.
[10] A heat storage material comprising a cured product of the resin composition according to any one of [1] to [9].
[11] An article comprising a heat source and a cured product of the resin composition according to any one of [1] to [9], which is provided in thermal contact with the heat source.

According to one aspect of the present invention, a resin composition suitable for use in a heat storage material can be provided. In addition, with the resin composition according to one aspect of the present invention, a cured product of the resin composition can be easily obtained at room temperature (for example, 25° C.) without using a curing agent. According to another aspect of the present invention, it is possible to provide a heat storage material that has an excellent amount of heat storage. In addition, the heat storage material according to one aspect of the present invention can suppress liquid leakage above the phase change temperature of the heat storage material and has excellent heat resistance.

FIG. 1 is a schematic cross-sectional view showing an embodiment of an article including a heat storage material.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as appropriate. Note that the present invention is not limited to the following embodiments.

In the present specification, "(meth)acrylate" means "acrylate" and its corresponding "methacrylate", and "(meth)acryloyl" means "acryloyl" and its corresponding "methacryloyl".

The weight average molecular weight (Mw) and number average molecular weight (Mn) in this specification mean values determined using gel permeation chromatography (GPC) under the following conditions and using polystyrene as a standard substance.
・Measuring equipment: HLC-8320GPC (product name, manufactured by Tosoh Corporation)
・Analytical column: TSKgel SuperMultipore HZ-H (3 columns connected) (product name, manufactured by Tosoh Corporation)
・Guard column: TSKguardcolumn SuperMP (HZ)-H (product name, manufactured by Tosoh Corporation)
・Eluent: THF
・Measurement temperature: 25℃

As used herein, "excellent heat resistance" means that the 1% weight loss temperature in TG-DTA measurement is 280° C. or higher.

A resin composition according to one embodiment contains an acrylic resin. Acrylic resin is a polymer obtained by polymerizing monomer components including a first monomer and a second monomer.

式中、Ｒ^１は水素原子又はメチル基を表し、Ｒ^２は炭素数１２～３０のアルキル基を表す。The first monomer is represented by the following formula (1).

In the formula, R ¹ represents a hydrogen atom or a methyl group, and R ² represents an alkyl group having 12 to 30 carbon atoms.

The alkyl group represented by R ² may be linear or branched. The alkyl group represented by R ² preferably has 12 to 28 carbon atoms, more preferably 12 to 26 carbon atoms, still more preferably 12 to 24 carbon atoms, and particularly preferably 12 to 22 carbon atoms.

In other words, the first monomer is an alkyl (meth)acrylate having a linear or branched alkyl group having 12 to 30 carbon atoms at the end of an ester group. Examples of the first monomer include dodecyl (meth)acrylate (lauryl (meth)acrylate, tetradecyl (meth)acrylate, hexadecyl (meth)acrylate, octadecyl (meth)acrylate (stearyl (meth)acrylate), docosyl (meth)acrylate, Examples include acrylate (behenyl (meth)acrylate), tetracosyl (meth)acrylate, hexacosyl (meth)acrylate, octacosyl (meth)acrylate, etc.These first monomers may be used alone or in combination of two or more. The first monomer is preferably dodecyl (meth)acrylate (lauryl (meth)acrylate), tetradecyl (meth)acrylate, octadecyl (meth)acrylate (stearyl (meth)acrylate), and docosyl (meth)acrylate. (Behenyl (meth)acrylate).

The content of the first monomer is preferably 60 parts by mass or more, more preferably 80 parts by mass or more, based on 100 parts by mass of the monomer components, from the viewpoint of obtaining a sufficient amount of heat storage when forming the heat storage material. For example, the amount may be 98 parts by mass or less.

The second monomer is a monomer (reactive monomer) that is copolymerizable with the first monomer and has a reactive group that can react with water. The second monomer contains a group having an ethylenically unsaturated bond (ethylenically unsaturated group) so as to be copolymerizable with the first monomer. Examples of the ethylenically unsaturated group include a (meth)acryloyl group, a vinyl group, and an allyl group. The second monomer is preferably a monomer having a reactive group capable of reacting with water and a (meth)acryloyl group.

The reactive group on the second monomer can react with water at room temperature (eg 25°C). Water may be, for example, moisture contained in the air. The reactive group in the second monomer is, for example, an alkoxysilyl group or an isocyanate group. That is, the second monomer is, for example, an alkoxysilyl group-containing monomer or an isocyanate group-containing monomer. Since the second monomer has a reactive group having the above-mentioned properties, it can also be referred to as a moisture-curable or room-temperature-curable monomer. The reactive group in the second monomer may be a monomer that can also react with the curing agent described below.

式中、Ｒ^５は水素原子又はメチル基を表し、Ｒ^６は、上述した水と反応可能な反応性基を有する１価の有機基を表し、好ましくは、アルコキシシリル基又はイソシアネート基を有する１価の有機基を表す。The second monomer is preferably a monomer represented by the following formula (3).

In the formula, R ⁵ represents a hydrogen atom or a methyl group, and R ⁶ represents a monovalent organic group having a reactive group capable of reacting with water, preferably an alkoxysilyl group or an isocyanate group. represents a valent organic group.

式中、Ｒ^７はアルキレン基を表し、Ｒ^８、Ｒ^９及びＲ^１０は、それぞれ独立にアルコキシ基又はアルキル基を表し、＊は結合手を表す。Ｒ^８、Ｒ^９及びＲ^１０のうち少なくとも１つは、アルコキシ基である。Ｒ^８、Ｒ^９及びＲ^１０の全てがアルコキシ基であってよく、Ｒ^８、Ｒ^９及びＲ^１０のうち１つがアルキル基であり２つがアルコキシ基であってもよい。When R ⁶ is a monovalent organic group having an alkoxysilyl group, R ⁶ is represented by the following formula (4), for example.

In the formula, R ⁷ represents an alkylene group, R ⁸ , R ⁹ and R ¹⁰ each independently represent an alkoxy group or an alkyl group, and * represents a bond. At least one of R ⁸ , R ⁹ and R ¹⁰ is an alkoxy group. All of R ⁸ , R ⁹ and R ¹⁰ may be an alkoxy group, or one of R ⁸ , R ⁹ and R ¹⁰ may be an alkyl group and two may be an alkoxy group.

The alkylene group represented by R ⁷ may be linear or branched. The alkylene group represented by R ⁷ may have, for example, 1 to 10, 1 to 8, 1 to 6, or 1 to 4 carbon atoms.

The alkoxy groups represented by R ⁸ , R ⁹ or R ¹⁰ may each independently be linear or branched. The number of carbon atoms in each alkoxy group may be independently, for example, from 1 to 10, from 1 to 8, from 1 to 6, from 1 to 4, or from 1 to 2. The alkoxy group is preferably a methoxy group.

When any one of R ⁸ , R ⁹ and R ¹⁰ is an alkyl group, the alkyl group may each independently be linear or branched. The number of carbon atoms in each alkyl group may be independently, for example, from 1 to 10, from 1 to 8, from 1 to 6, from 1 to 4, or from 1 to 2. The alkyl group is preferably a methyl group.

More specifically, the alkoxysilyl group in the alkoxysilyl group-containing monomer may be a trimethoxysilyl group, a triethoxysilyl group, a methyldimethoxysilyl group, a methyldiethoxysilyl group, or the like.

Examples of the alkoxysilyl group-containing monomer represented by formula (3) include 3-methacryloxypropyltrimethoxysilane, 8-methacryloxyoctyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, and 3-methacryloxypropylmethyldimethoxysilane. Examples include ethoxysilane and 3-acryloxypropyltrimethoxysilane.

式中、Ｒ^１１はアルキレン基を表し、＊は結合手を表す。When R ⁶ is a monovalent organic group having an isocyanate group, R ⁶ is represented by the following formula (5), for example.

In the formula, R ¹¹ represents an alkylene group, and * represents a bond.

The alkylene group represented by R ¹¹ may be the same as the alkylene group represented by R ⁷ described above.

Examples of the isocyanate group-containing monomer represented by formula (3) include 2-methacryloyloxyethyl isocyanate and 2-acryloyloxyethyl isocyanate.

These second monomers may be used alone or in combination of two or more. From the viewpoint of facilitating curing at room temperature, the second monomer is preferably an alkoxysilyl group-containing monomer having an alkoxysilyl group as a reactive group, more preferably a trimethoxysilyl group-containing monomer, More preferred is a trimethoxysilyl group-containing (meth)acrylic monomer. The second monomer can also be said to be a silane compound having a (meth)acryloyl group.

From the viewpoint of improving the heat storage amount of the heat storage material, the content of the second monomer is 2 parts by mass or more, 3 parts by mass or more, 5 parts by mass or more, 7 parts by mass or more, or 8 parts by mass or more, based on 100 parts by mass of the monomer component. The amount may be at least 25 parts by weight, preferably at most 20 parts by weight, more preferably at most 15 parts by weight, even more preferably at most 13 parts by weight, particularly preferably at most 10 parts by weight.

In addition to the first monomer and the second monomer, the monomer component can further contain other monomers as necessary. Other monomers include, for example, methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, etc., which have an alkyl group with less than 12 carbon atoms (1 to 11 carbon atoms) as an ester group. Examples include alkyl (meth)acrylates having a terminal end; cycloalkyl (meth)acrylates having a cyclic hydrocarbon group such as isobornyl (meth)acrylate and dicyclopentanyl (meth)acrylate at the end of an ester group; and the like. Other monomers may be used alone or in combination of two or more.

In one embodiment, the monomer components include a first monomer, a second monomer, and, if necessary, an alkyl (meth)acrylate and a cyclic hydrocarbon having an alkyl group having 1 to 11 carbon atoms at the end of the ester group. It contains only at least one third monomer selected from the group consisting of cycloalkyl (meth)acrylates having a group at the end of the ester group. In other words, in one embodiment, the monomer component does not contain monomers other than the first monomer, the second monomer, and the third monomer (for example, a (meth)acrylic monomer having a siloxane skeleton). In one embodiment, the monomer component may contain only the first monomer and the second monomer, and in another embodiment, the monomer component may contain only the first monomer, the second monomer, and the third monomer. It's fine.

The acrylic resin is obtained by polymerizing monomer components including a first monomer, a second monomer, and other monomers used as necessary. The polymerization method can be appropriately selected from known polymerization methods such as various radical polymerizations, and may be, for example, a suspension polymerization method, a solution polymerization method, a bulk polymerization method, or the like. As the polymerization method, suspension polymerization is preferably used when the weight average molecular weight of the acrylic resin is increased (e.g., 200,000 or more), and suspension polymerization is preferably used when the weight average molecular weight of the acrylic resin is decreased (e.g., 100,000 or less). Preferably, a solution polymerization method is used.

When using the suspension polymerization method, a dispersion liquid is prepared by mixing a monomer component serving as a raw material, a polymerization initiator, a chain transfer agent added as necessary, water, a suspending agent, and a reducing agent.

Examples of the suspending agent include water-soluble polymers such as polyvinyl alcohol, methylcellulose, and polyacrylamide, and sparingly soluble inorganic substances such as calcium phosphate and magnesium pyrophosphate. Among these, water-soluble polymers such as polyvinyl alcohol are preferably used.

The amount of the suspending agent blended is preferably 0.005 to 1 part by weight, more preferably 0.01 to 0.07 part by weight, based on 100 parts by weight of the total amount of monomer components as raw materials. When using the suspension polymerization method, a molecular weight regulator such as a mercaptan compound, thioglycol, carbon tetrachloride, α-methylstyrene dimer, etc. may be further added as necessary. The polymerization temperature is preferably 0 to 200°C, more preferably 40 to 120°C, even more preferably 50 to 110°C.

When using the solution polymerization method, examples of solvents used include aromatic solvents such as toluene and xylene, ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone, ester solvents such as ethyl acetate and butyl acetate, and carbon tetrachloride. Examples include chlorine-based solvents such as 2-propanol, alcohol-based solvents such as 2-butanol, and the like. The solid content concentration in the solution at the start of solution polymerization is preferably 40 to 70% by mass, more preferably 50 to 60% by mass from the viewpoint of polymerizability of the acrylic resin obtained. The polymerization temperature is preferably 0 to 200°C, more preferably 40 to 120°C, even more preferably 50 to 110°C.

The polymerization initiator used in each polymerization method can be used without particular limitation as long as it is a radical polymerization initiator. Examples of the radical polymerization initiator include benzoyl peroxide, lauroyl peroxide, di-t-butylperoxyhexahydroterephthalate, t-butylperoxy-2-ethylhexanoate, 1,1-t-butylperoxy - Organic peroxides such as 3,3,5-trimethylcyclohexane, t-butylperoxyisopropyl carbonate, azobisisobutyronitrile, azobis-4-methoxy-2,4-dimethylvaleronitrile, azobiscyclohexanone-1- Examples include azo compounds such as carbonitrile and azodibenzoyl.

From the viewpoint of sufficiently polymerizing the monomers, the amount of the polymerization initiator is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, and even more preferably 0. .1 part by mass or more. The blending amount of the polymerization initiator is determined from the viewpoint of keeping the molecular weight of the acrylic resin in a suitable range, suppressing decomposition products, and obtaining suitable adhesive strength when used as a heat storage material. The amount is preferably 10 parts by weight or less, more preferably 5 parts by weight or less, even more preferably 3 parts by weight or less.

The acrylic resin obtained as described above has a structural unit derived from the first monomer and a structural unit derived from the second monomer. That is, the resin composition according to one embodiment is an acrylic resin composition containing a first structural unit (a structural unit derived from a first monomer) and a second structural unit (a structural unit derived from a second monomer). Contains resin.

式中、Ｒ^３は水素原子又はメチル基を表し、Ｒ^４は炭素数１２～３０のアルキル基を表す。The first structural unit is represented by the following formula (2).

In the formula, R ³ represents a hydrogen atom or a methyl group, and R ⁴ represents an alkyl group having 12 to 30 carbon atoms.

The alkyl group represented by R ⁴ may be linear or branched. The alkyl group represented by R ⁴ preferably has 12 to 28 carbon atoms, more preferably 12 to 26 carbon atoms, still more preferably 12 to 24 carbon atoms, and particularly preferably 12 to 22 carbon atoms. Examples of the alkyl group represented by R ⁴ include dodecyl group (lauryl group), tetradecyl group, hexadecyl group, octadecyl group (stearyl group), docosyl group (behenyl group), tetracosyl group, hexacosyl group, octacosyl group, etc. Can be mentioned. The alkyl group represented by R ⁴ is preferably at least one selected from the group consisting of dodecyl group (lauryl group), tetradecyl group, octadecyl group (stearyl group), and docosyl group (behenyl group). The acrylic resin contains one or more of these first structural units.

The content of the first structural unit is preferably 60 parts by mass or more, more preferably 80 parts by mass or more, based on 100 parts by mass of all structural units constituting the acrylic resin, from the viewpoint of improving the heat storage amount of the heat storage material. For example, the amount may be 98 parts by mass or less.

The second structural unit has a reactive group capable of reacting with water. The reactive group is, for example, at least one group selected from the group consisting of an alkoxysilyl group or an isocyanate group. The second structural unit is, for example, a structural unit derived from the alkoxysilyl group-containing monomer or isocyanate group-containing monomer described above. The acrylic resin contains one or more of these second structural units.

式中、Ｒ^１２は水素原子又はメチル基を表し、Ｒ^１３は上述した水と反応可能な反応性基を有する１価の有機基を表す。Ｒ^１３で表される有機基に含まれる反応性基は、上述した反応性基であってよく、好ましくはアルコキシシリル基又はイソシアネート基であり、より好ましくはアルコキシシリル基である。The second structural unit is preferably a structural unit represented by the following formula (6).

In the formula, R ¹² represents a hydrogen atom or a methyl group, and R ¹³ represents the above-mentioned monovalent organic group having a reactive group capable of reacting with water. The reactive group contained in the organic group represented by R ¹³ may be the above-mentioned reactive group, preferably an alkoxysilyl group or an isocyanate group, and more preferably an alkoxysilyl group.

式中、Ｒ^１２は水素原子又はメチル基を表し、Ｒ^１４はアルキレン基を表し、Ｒ^１５、Ｒ^１６及びＲ^１７は、それぞれ独立に、アルコキシ基又はアルキル基を表す。Ｒ^１５、Ｒ^１６及びＲ^１７のうち少なくとも１つは、アルコキシ基である。Ｒ^１５、Ｒ^１６及びＲ^１７の全てがアルコキシ基であってよく、Ｒ^１５、Ｒ^１６及びＲ^１７のうち１つがアルキル基であり２つがアルコキシ基であってもよい。When the reactive group contained in the organic group represented by R ¹³ is an alkoxysilyl group, the second structural unit is preferably represented by the following formula (7).

In the formula, R ¹² represents a hydrogen atom or a methyl group, R ¹⁴ represents an alkylene group, and R ¹⁵ , R ¹⁶ and R ¹⁷ each independently represent an alkoxy group or an alkyl group. At least one of R ¹⁵ , R ¹⁶ and R ¹⁷ is an alkoxy group. All of R ¹⁵ , R ¹⁶ and R ¹⁷ may be an alkoxy group, or one of R ¹⁵ , R ¹⁶ and R ¹⁷ may be an alkyl group and two of them may be an alkoxy group.

The alkylene group represented by R ¹⁴ may be linear or branched. The alkylene group represented by R ¹⁴ may have, for example, 1 to 10, 1 to 8, 1 to 6, or 1 to 4 carbon atoms.

The alkoxy groups represented by R ¹⁵ , R ¹⁶ or R ¹⁷ may each independently be linear or branched. The number of carbon atoms in each alkoxy group may be independently, for example, from 1 to 10, from 1 to 8, from 1 to 6, from 1 to 4, or from 1 to 2. The alkoxy group is preferably a methoxy group.

When any one of R ¹⁵ , R ¹⁶ and R ¹⁷ is an alkyl group, the alkyl group may each independently be linear or branched. The number of carbon atoms in each alkyl group may be independently, for example, from 1 to 10, from 1 to 8, from 1 to 6, from 1 to 4, or from 1 to 2. The alkyl group is preferably a methyl group.

式中、Ｒ^１２は水素原子又はメチル基を表し、Ｒ^１８はアルキレン基を表す。When the reactive group contained in the organic group represented by R ¹³ is an isocyanate group, the second structural unit is preferably represented by the following formula (8).

In the formula, R ¹² represents a hydrogen atom or a methyl group, and R ¹⁸ represents an alkylene group.

The alkylene group represented by R ¹⁸ may be the same as the alkylene group represented by R ¹⁴ described above.

The content of the second structural unit is 2 parts by mass or more and 3 parts by mass based on 100 parts by mass of all structural units constituting the acrylic resin, from the viewpoint of obtaining a sufficient amount of heat storage when forming the heat storage material. The amount may be 5 parts by mass or more, 7 parts by mass or more, or 8 parts by mass or more, and may be 25 parts by mass or less, preferably 20 parts by mass or less, more preferably 15 parts by mass or less, and still more preferably 13 parts by mass or less. It is not more than 10 parts by weight, particularly preferably not more than 10 parts by weight.

In addition to the first structural unit and the second structural unit, the acrylic resin may further contain other structural units as necessary. Other structural units may be structural units derived from other monomers mentioned above.

In one embodiment, the acrylic resin includes a first structural unit, a second structural unit, and optionally an alkyl (meth)acrylate and a cyclic alkyl group having an alkyl group having 1 to 11 carbon atoms at the end of the ester group. It contains only the third structural unit derived from at least one monomer selected from the group consisting of cycloalkyl (meth)acrylates having a hydrocarbon group at the end of the ester group. In other words, in one embodiment, the acrylic resin includes structural units other than the first structural unit, the second structural unit, and the third structural unit (for example, a structural unit derived from a (meth)acrylic monomer having a siloxane skeleton). Contains no. In one embodiment, the acrylic resin may contain only the first structural unit and the second structural unit, and in another embodiment, the acrylic resin may contain the first structural unit, the second structural unit, and the third structural unit. May contain only units.

The acrylic resin may be a random copolymer, a block copolymer, or a graft copolymer.

The content of the acrylic resin is preferably 50 parts by mass or more, more preferably 70 parts by mass or more, and even more preferably 80 parts by mass or more, based on 100 parts by mass of the resin composition, from the viewpoint of improving the heat storage amount of the heat storage material. be. The content of the acrylic resin may be 100 parts by mass or less, 99.5 parts by mass or less, or 99.3 parts by mass or less based on 100 parts by mass of the resin composition.

The resin composition may further contain a catalyst from the viewpoint of facilitating curing at room temperature (curing due to moisture). Examples of the catalyst include catalysts containing aluminum or tin. Examples of the aluminum-containing catalyst include aluminum complexes such as bis(ethylacetoacetato)(2,4-pentanedionato)aluminum. Examples of the tin-containing catalyst include dibutyltin dilaurate. As the catalyst, bis(ethylacetoacetato)(2,4-pentanedionato)aluminum is preferably used when the above-mentioned reactive group is an alkoxysilyl group, and when the reactive group is an isocyanate group, , dibutyltin dilaurate is preferably used.

When used to form a heat storage material, the resin composition may further contain a curing agent from the viewpoint of further suppressing leakage and volatilization of the heat storage material and further improving heat resistance. The curing agent is a curing agent that can react with a reactive group contained in the second monomer (second structural unit). Examples of the curing agent include isocyanate curing agents, phenol curing agents, amine curing agents, imidazole curing agents, acid anhydride curing agents, and carboxylic acid curing agents. These curing agents may be used alone or in combination of two or more.

Examples of the isocyanate curing agent include tolylene diisocyanate (2,4- or 2,6-tolylene diisocyanate, or a mixture thereof) (TDI), phenylene diisocyanate (m- or p-phenylene diisocyanate, or a mixture thereof), 4,4'-diphenyl diisocyanate, 1,5-naphthalene diisocyanate (NDI), diphenylmethane diisocyanate (4,4'-, 2,4'- or 2,2'-diphenylmethane diisocyanate, or mixtures thereof) (MDI), 4 , 4'-toluidine diisocyanate (TODI), aromatic diisocyanates such as 4,4'-diphenyl ether diisocyanate, xylylene diisocyanate (1,3- or 1,4-xylylene diisocyanate, or a mixture thereof) (XDI), tetramethyl Examples include xylylene diisocyanate (1,3- or 1,4-tetramethylxylylene diisocyanate, or a mixture thereof) (TMXDI), ω,ω'-diisocyanate-1,4-diethylbenzene, and the like. Examples of the isocyanate curing agent include trimethylene diisocyanate, 1,2-propylene diisocyanate, butylene diisocyanate (tetramethylene diisocyanate, 1,2-butylene diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate), 1,5 - Aliphatic diisocyanates such as pentamethylene diisocyanate (PDI), 1,6-hexamethylene diisocyanate (HDI), 2,4,4- or 2,2,4-trimethylhexamethylene diisocyanate, 2,6-diisocyanate methyl capate , 1,3-cyclopentane diisocyanate, 1,3-cyclopentene diisocyanate, cyclohexane diisocyanate (1,4-cyclohexane diisocyanate, 1,3-cyclohexane diisocyanate), 3-isocyanatomethyl-3,5,5-trimethylcyclohexyl isocyanate ( isophorone diisocyanate) (IPDI), methylene bis(cyclohexyl isocyanate) (4,4'-, 2,4'- or 2,2'-methylene bis(cyclohexyl isocyanate), trans, trans-form, trans, cis-form, cis, cis-isomers, or mixtures thereof) (H12MDI), methylcyclohexane diisocyanate (methyl-2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate), norbornane diisocyanate (various isomers or mixtures thereof) (NBDI) and alicyclic diisocyanates such as bis(isocyanatomethyl)cyclohexane (1,3- or 1,4-bis(isocyanatomethyl)cyclohexane or a mixture thereof) (H6XDI).

Examples of the phenolic curing agent include bisphenol A, bisphenol F, bisphenol S, 4,4'-biphenylphenol, tetramethylbisphenol A, dimethylbisphenol A, tetramethylbisphenol F, dimethylbisphenol F, tetramethylbisphenol S, and dimethyl. Bisphenol S, tetramethyl-4,4'-biphenol, dimethyl-4,4'-biphenylphenol, 1-(4-hydroxyphenyl)-2-[4-(1,1-bis-(4-hydroxyphenyl)) ethyl)phenyl]propane, 2,2'-methylene-bis(4-methyl-6-tert-butylphenol), 4,4'-butylidene-bis(3-methyl-6-tert-butylphenol), trishydroxyphenylmethane , resorcinol, hydroquinone, pyrogallol, phenols having a diisopropylidene skeleton; phenols having a fluorene skeleton such as 1,1-di-4-hydroxyphenylfluorene; cresols; ethylphenols; butylphenols; octylphenols; bisphenols Novolak resins made from various phenols such as A, bisphenol F, bisphenol S, and naphthols, phenol novolak resins containing xylylene skeletons, phenol novolak resins containing dicyclopentadiene skeletons, phenol novolak resins containing biphenyl skeletons, and phenol novolak resins containing fluorene skeletons. , various novolak resins such as furan skeleton-containing phenol novolak resins.

Examples of the amine curing agent include aromatic curing agents such as diaminodiphenylmethane, diaminodiphenylsulfone, diaminodiphenyl ether, p-phenylenediamine, m-phenylenediamine, o-phenylenediamine, 1,5-diaminonaphthalene, and m-xylylenediamine. Aliphatic amines such as amine, ethylenediamine, diethylenediamine, isophoronediamine, bis(4-amino-3-methyldicyclohexyl)methane, polyetherdiamine; guanidines such as dicyandiamide, 1-(o-tolyl) biguanide, etc. It will be done.

Examples of imidazole curing agents include 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenyl-4-methylimidazole, 1 -Benzyl-2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 2,3-dihydro -1H-pyrrolo-[1,2-a]benzimidazole, 2,4-diamino-6(2'-methylimidazole(1'))ethyl-s-triazine, 2,4-diamino-6(2'- undecylimidazole (1')) ethyl-s-triazine, 2,4-diamino-6 (2'-ethyl-4-methylimidazole (1')) ethyl-s-triazine, 2,4-diamino-6 ( 2'-Methylimidazole (1')) Ethyl-s-triazine/isocyanuric acid adduct, 2-methylimidazole isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-3,5-dihydroxymethylimidazole , 2-phenyl-4-methyl-5-hydroxymethylimidazole, 1-cyanoethyl-2-phenyl-3,5-dicyanoethoxymethylimidazole, and the like.

Examples of acid anhydride curing agents include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, ethylene glycol trimellitic anhydride, biphenyltetracarboxylic anhydride, etc. Aromatic carboxylic acid anhydrides; anhydrides of aliphatic carboxylic acids such as azelaic acid, sebacic acid, dodecanedioic acid, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, nadic acid anhydride, het acid anhydride, Examples include alicyclic carboxylic acid anhydrides such as Himic acid anhydride.

Examples of the carboxylic acid curing agent include succinic acid, glutaric acid, adipic acid, sebacic acid, phthalic acid, isophthalic acid, and terephthalic acid.

The content of the curing agent may be 0.01 parts by mass or more and 10 parts by mass or less based on 100 parts by mass of the resin composition.

The resin composition does not need to contain a curing agent. Even in this case, since the second structural unit in the acrylic resin has a reactive group that can react with water, the acrylic resin cannot be cured by reacting with, for example, moisture contained in the air. I can do it. In other words, the resin composition can be said to be a moisture-curable (moisture-curable) resin composition.

The resin composition can further contain other additives, if necessary. Other additives include, for example, curing accelerators, antioxidants, colorants, fillers, crystal nucleating agents, thermal stabilizers, thermal conductive materials, plasticizers, foaming agents, flame retardants, vibration damping agents, etc. . Other additives may be used alone or in combination of two or more.

The resin composition may be solid or liquid at 90°C.

When the resin composition is liquid, the viscosity of the resin composition at 90° C. is preferably 100 Pa·s or less, more preferably 50 Pa·s or less, and even more preferably 20 Pa·s, from the viewpoint of excellent fluidity and handling properties. It is particularly preferably 10 Pa·s or less. From the same viewpoint, the resin composition preferably has a viscosity of 100 Pa·s or less, more preferably 50 Pa·s or less, even more preferably 20 Pa·s or less, particularly preferably 10 Pa·s, at +20°C, the melting point of the acrylic resin. It has the following viscosity: The viscosity of the resin composition at 90°C or the viscosity at +20°C of the melting point of the acrylic resin may be, for example, 0.5 Pa·s or more.

The viscosity of the resin composition means a value measured based on JIS Z 8803, specifically, a value measured with an E-type viscometer (manufactured by Toki Sangyo Co., Ltd., PE-80L). do. Note that the viscometer can be calibrated based on JIS Z 8809-JS14000. Moreover, the melting point of the acrylic resin means a value measured by the method described in Examples.

The resin composition described above is suitably used as a heat storage material by curing the resin composition (suitable as a resin composition for a heat storage material). The resin composition can be cured at room temperature (for example, 25°C). That is, the heat storage material according to one embodiment includes the cured product of the resin composition described above. In this heat storage material, the cured acrylic resin functions as a component having heat storage properties, so in one embodiment, the heat storage material (resin composition) includes a latent heat storage material such as that used in conventional heat storage materials. Even in this case, an excellent amount of heat storage can be obtained.

The heat storage material (cured product of the resin composition described above) can be utilized in various fields. Heat storage materials are used, for example, in air conditioning equipment in automobiles, buildings, public facilities, underground malls, etc. (improving the efficiency of air conditioning equipment), piping in factories, etc. (heat storage in piping), automobile engines (insulating heat around the engine), and electronic components. (to prevent temperature rise in electronic parts), used in underwear fibers, etc.

In each of these applications, the heat storage material (cured product of the resin composition described above) stores the heat of the heat source by being placed in thermal contact with the heat source that generates heat in each application. be able to. That is, one embodiment of the present invention is an article that includes a heat source and a heat storage material (cured product of the resin composition described above) provided so as to be in thermal contact with the heat source.

FIG. 1 is a schematic cross-sectional view showing one embodiment of an article including a heat storage material. As shown in FIG. 1, the article 1 includes a heat source 2 and a heat storage material 3 provided so as to be in thermal contact with the heat source 2. The heat storage material 3 only needs to be placed so as to be in thermal contact with at least a portion of the heat source 2, and a portion of the heat source 2 may be exposed as shown in FIG. It may be arranged so that the entire area is covered. As long as the heat storage material 3 is in thermal contact with the heat source 2, the heat source 2 and the heat storage material 3 may be in direct contact, or there may be other members (for example, thermally conductive) between the heat source 2 and the heat storage material 3. (a member having such a structure) may be arranged.

For example, when the heat storage material 3 is used with air conditioning equipment (or parts thereof), piping, or an automobile engine as the heat source 2, the heat storage material 3 is in thermal contact with these heat sources 2, so that the heat source The heat storage material 3 stores the heat generated from the heat source 2, and the heat source 2 is easily kept at a temperature above a certain level (heat-retained). When the heat storage material 3 is used as a fiber for underwear, the heat storage material 3 stores heat generated from the human body as the heat source 2, so that the user can feel warm for a long time.

For example, when the heat storage material 3 is used together with an electronic component as the heat source 2, heat generated by the electronic component can be stored by being placed in thermal contact with the electronic component. In this case, for example, if the heat storage material is placed in further thermal contact with the heat dissipation member, the heat stored in the heat storage material can be gradually released, and the heat generated in the electronic components can be rapidly released to the outside. Emission (localized high temperature near electronic components) can be suppressed.

The heat storage material 3 may be placed in the heat source 2 after forming a cured material into a sheet shape (film shape). When the resin composition is solid at 90° C., the sheet-like heat storage material 3 can be obtained, for example, by heating and melting the resin composition and molding it. That is, in one embodiment, the method for manufacturing the heat storage material 3 includes a step of heating and melting a resin composition to shape it (molding step). The molding in the molding process may be injection molding, compression molding or transfer molding. In this case, the heat storage material 3 does not require a casing, and the heat storage material 3 alone can be attached to the object to be attached, wrapped around it, or attached in various states.

In another embodiment, the cured product of the resin composition described above can be used for purposes other than heat storage materials. The cured product is suitably used for forming, for example, a water-repellent material, a frost-proofing material, a refractive index adjusting material, a lubricant, an adsorbent, a thermosetting stress relieving material, or a low dielectric material. The water repellent material, anti-frost material, refractive index adjusting material, lubricant, adsorbent, thermosetting stress relieving material, and low dielectric material may each contain, for example, a cured product of the resin composition described above.

EXAMPLES Hereinafter, the present invention will be explained in more detail with reference to Examples, but the present invention is not limited to the following Examples.

[Synthesis of acrylic resin]
Acrylic resins 1A to 1F used in Examples 1-1 to 1-6 were synthesized by a known suspension polymerization method as follows.

(Synthesis example of acrylic resin 1A)
A 500 mL flask consisting of a stirrer, a thermometer, a nitrogen gas inlet tube, an outlet tube, and a heating jacket was used as a reactor, and nitrogen was flowed into the flask at a rate of 100 mL/min.
Next, 80 g of tetradecyl acrylate, 10 g of butyl acrylate, and 10 g of 3-methacryloxypropyltrimethoxysilane were mixed as monomers, 0.41 g of lauroyl peroxide was used as a polymerization initiator, and 0.0 g of n-octyl mercaptan was used as a chain transfer agent. Another 12 g was added and dissolved to obtain a mixture. Then, to the mixture, 201.3 g of water (200 parts by mass to 100 parts by mass of the mixture) and 0.2 g of polyvinyl alcohol (PVA) (0.02 parts by mass to 100 parts by mass of the mixture) as a suspending agent. part), and 0.1 g of ascorbic acid was added as a reducing agent to prepare a dispersion.
Subsequently, the dispersion liquid was supplied into a flask (reactor) in which the dissolved oxygen was made to be 1 ppm or less by flowing nitrogen, and heated while stirring at a temperature inside the reactor of 50°C and a stirring rotation speed of 250 times/min. Allowed time to react. The polymerization rate was calculated from the specific gravity of the resin produced while sampling during the reaction, and after confirming that the polymerization rate was 80% or more, the temperature was raised to 70° C. and the reaction was continued for an additional 2 hours. Thereafter, the product in the reactor was cooled, taken out, washed with water, dehydrated, and dried to obtain acrylic resin 1A.

Acrylic resins 1B to 1F were synthesized in the same manner as in the synthesis example of acrylic resin 1A, except that the monomer components were changed to those shown in Table 1.

[Synthesis of acrylic resin]
Acrylic resins 2A to 2F used in Examples 2-1 to 2-6 were synthesized by a known solution polymerization method as follows.

(Example of synthesis of acrylic resin 2A)
A 500 mL flask consisting of a stirrer, a thermometer, a nitrogen gas inlet tube, an outlet tube, and a heating jacket was used as a reactor, and monomers were 80 g of tetradecyl acrylate, 10 g of butyl acrylate, 10 g of 3-methacryloxypropyltrimethoxysilane, and a solvent. 81.8 g of 2-propanol was mixed, added to the reactor, and stirred at room temperature (25° C.) at a stirring speed of 250 times/min, and nitrogen was flowed at 100 mL/min for 1 hour. Thereafter, the temperature was raised to 70° C. over 30 minutes, and after completion of the temperature rise, a solution of 0.28 g of azobisisobutyronitrile dissolved in 2 ml of methyl ethyl ketone was added to the reactor to start the reaction. Thereafter, the mixture was stirred at an internal temperature of 70° C. and reacted for 5 hours. Thereafter, a solution of 0.05 g of azobisisobutyronitrile dissolved in 2 mL of methyl ethyl ketone was added to the reactor, the temperature was raised to 90° C. over 15 minutes, and the reaction was further continued for 2 hours. Thereafter, the solvent was removed and dried to obtain acrylic resin 2A.

Acrylic resins 2B to 2F were synthesized in the same manner as in the synthesis example of acrylic resin 2A, except that the monomer components were changed to those shown in Table 2. Table 2 shows the melting points of each of the obtained acrylic resins.

(Example of synthesis of acrylic resin 2G)
A 500 mL flask consisting of a stirrer, a thermometer, a nitrogen gas inlet pipe, an outlet pipe, and a heating jacket was used as a reactor. 117.4 g of toluene was added as a solvent to the reactor, and the mixture was stirred at room temperature (25°C) at a stirring speed of 200. The mixture was stirred once per minute and flushed with nitrogen at 100 mL/min for 30 minutes. Thereafter, the temperature was raised to 110°C over 30 minutes, and after completion of the temperature rise, 170 g of stearyl acrylate, 20 g of butyl acrylate, 10 g of 2-isocyanatoethyl methacrylate, and the initiator azobisisobutylene were added. A mixed solution containing 2 g of lonitrile was added dropwise over 2 hours and 30 minutes. Thereafter, the mixture was stirred at a reactor internal temperature of 110° C. and reacted for 1 hour. Thereafter, a solution of 0.05 g of azobisisobutyronitrile dissolved in 2 mL of toluene was added to the reactor, and the reaction was further continued for 2 hours. Thereafter, the solvent was removed and dried to obtain acrylic resin 2G.

Acrylic resins 2H to 2K were synthesized in the same manner as in the synthesis example of acrylic resin 2G, except that the monomer components were changed to those shown in Table 3. Table 3 shows the melting points of each of the obtained acrylic resins.

The melting point of the acrylic resin was measured as follows.
Using a differential scanning calorimeter (manufactured by PerkinElmer, model number DSC8500), the temperature was raised to 100 °C at a rate of 20 °C/min, held at 100 °C for 3 minutes, and then lowered to -30 °C at a rate of 10 °C/min. The thermal behavior of the acrylic resin was measured by lowering the temperature, then holding at -30 °C for 3 minutes, and then increasing the temperature again to 100 °C at a rate of 10 °C/min, and the melting peak was calculated as the melting point of the acrylic resin. .

Note that lauryl acrylate is manufactured by Osaka Organic Chemical Industry Co., Ltd., tetradecyl acrylate is manufactured by Tokyo Chemical Industry Co., Ltd., butyl acrylate is manufactured by Wako Pure Chemical Industries, Ltd., and stearyl acrylate and behenyl acrylate are manufactured by NOF Corporation. , 3-methacryloxypropyltrimethoxysilane, and 8-methacryloxyoctyltrimethoxysilane were manufactured by Shin-Etsu Chemical Co., Ltd., and 2-isocyanatoethyl methacrylate was manufactured by Showa Denko KK.

[Preparation of heat storage material]
(Example 1-1)
Mix 15 g of acrylic resin 1A, 0.015 g of bis(ethylacetoacetato)2,4-pentanedionato)aluminum (concentration 76%, 2-propanol solution) as a catalyst, and 20 g of methyl ethyl ketone as a solvent. A resin composition was prepared. The resin composition was applied onto a polyethylene terephthalate (PET) film, heated and dried at 80°C for 30 minutes, and then cured at room temperature for 24 hours before removing the PET film to obtain a 100 μm thick film-like heat storage material. I got it.

(Examples 1-2 to 1-6)
A heat storage material was produced in the same manner as in Example 1-1, except that the composition of the resin composition was changed as shown in Table 4.

(Example 2-1)
A resin composition was obtained by mixing 15 g of acrylic resin 2A and 0.015 g of bis(ethylacetoacetato)(2,4-pentanedionato)aluminum (concentration 76% 2-propanol solution) as a catalyst. . The viscosity of this resin composition at 90° C. was measured based on JIS Z 8803 using an E-type viscometer (manufactured by Toki Sangyo Co., Ltd., PE-80L). The results are shown in Table 5.
Next, the resin composition was filled into a 10 cm x 10 cm x 1 mm mold (SUS board) and cured at room temperature for 24 hours to obtain a sheet-like heat storage material with a thickness of 1 mm.

(Examples 2-2 to 2-6)
The viscosity measurement of the resin composition and the production of the heat storage material were carried out in the same manner as in Example 2-1, except that the composition of the resin composition was changed as shown in Table 5. The results are shown in Table 5.

(Example 2-7)
A resin composition was obtained by mixing 15 g of acrylic resin 2G and 0.015 g of dibutyltin dilaurate as a catalyst. The viscosity of this resin composition at 90° C. was measured based on JIS Z 8803 using an E-type viscometer (manufactured by Toki Sangyo Co., Ltd., PE-80L). The results are shown in Table 6.
Next, the resin composition was filled into a 10 cm x 10 cm x 1 mm mold (SUS board) and cured at room temperature for 24 hours to obtain a sheet-like heat storage material with a thickness of 1 mm.

(Examples 2-8 to 2-11)
The viscosity measurement of the resin composition and the production of the heat storage material were carried out in the same manner as in Example 2-7, except that the composition of the resin composition was changed as shown in Table 6. The results are shown in Table 6.

[Evaluation of melting point and heat storage amount]
Each of the heat storage materials produced in Examples was measured using a differential scanning calorimeter (manufactured by PerkinElmer, model number DSC8500), and the melting point and amount of heat storage were calculated. Specifically, the temperature was raised to 100°C at a rate of 20°C/min, held at 100°C for 3 minutes, then lowered to -30°C at a rate of 10°C/min, and then held at -30°C for 3 minutes. , the temperature was raised again to 100° C. at a rate of 10° C./min and the thermal behavior was measured. The melting peak was taken as the melting point of the heat storage material, and the area was taken as the amount of heat storage. The results are shown in Tables 4-6. Note that if the amount of heat storage is 30 J/g or more, it can be said that the amount of heat storage is excellent.

[Evaluation of liquid leakage and volatility]
The weight change of each of the heat storage materials produced in Examples was measured before and after being left standing in the air at a temperature of 80° C. for 1000 hours, and the weight reduction rate (%) was measured. The results are shown in Tables 4-6.

[Heat resistance test (TG-DTA)]
Using a thermogravimetric balance TG-DTA6300 (Hitachi High-Tech Science Co., Ltd.), the weight loss of each heat storage material produced in Examples was measured. The temperature (°C) at which the weight decreased by 1% from the initial weight was read, and this was taken as the value of the temperature at which the weight decreased by 1%. The results are shown in Tables 4-6.

In Tables 4 to 6, the Al complex is bis(ethylacetoacetate)(2,4-pentanedionato)aluminum (concentration 76% 2-propanol solution) (manufactured by Wako Pure Chemical Industries, Ltd.), and the tin catalyst is dilauric acid. Dibutyltin (manufactured by Wako Pure Chemical Industries, Ltd.) is shown.

The heat storage material of the example has an excellent heat storage amount, and also has excellent heat resistance, and can suppress liquid leakage and volatilization. In particular, the heat storage materials of Examples 2-1 to 2-11 are advantageous in that they can be applied to members having complex shapes because they are obtained by curing liquid resin compositions.

1... Article, 2... Heat source, 3... Heat storage material.

Claims (9)

A first monomer represented by the following formula (1), a second monomer that is copolymerizable with the first monomer and has a reactive group that can react with water, and methyl (meth)acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, and at least one monomer selected from the group consisting of butyl (meth) acrylate.
the reactive group is an alkoxysilyl group or an isocyanate group,
A resin composition used to form a heat storage material.
[In the formula, R ¹ represents a hydrogen atom or a methyl group, and R ² represents an alkyl group having 12 to 30 carbon atoms. ] A first structural unit represented by the following formula (2), a second structural unit having a reactive group capable of reacting with water, and methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate , and a structural unit derived from at least one monomer selected from the group consisting of butyl (meth)acrylate,
the reactive group is an alkoxysilyl group or an isocyanate group,
A resin composition used to form a heat storage material.
[In the formula, R ³ represents a hydrogen atom or a methyl group, and R ⁴ represents an alkyl group having 12 to 30 carbon atoms. ] The resin composition according to claim 1, wherein the content of the first monomer is 60 parts by mass or more based on 100 parts by mass of the monomer component. The resin composition according to claim 1 or 3 , wherein the content of the second monomer is 25 parts by mass or less based on 100 parts by mass of the monomer component. The resin composition according to claim 2, wherein the content of the first structural unit is 60 parts by mass or more based on 100 parts by mass of all structural units constituting the acrylic resin. The resin composition according to claim 2 or 5 , wherein the content of the second structural unit is 25 parts by mass or less based on 100 parts by mass of all structural units constituting the acrylic resin. The resin composition according to any one of claims 1 to 6 , wherein the content of the acrylic resin is 50 parts by mass or more based on 100 parts by mass of the resin composition. A heat storage material comprising a cured product of the resin composition according to any one of claims 1 to 7 . heat source and
An article comprising: a cured product of the resin composition according to any one of claims 1 to 7 , which is provided in thermal contact with the heat source.

Images