CN111322590A

CN111322590A - Heat sink device

Info

Publication number: CN111322590A
Application number: CN201811539094.4A
Authority: CN
Inventors: 郑怀文; 杨华; 伊晓燕; 王军喜; 李晋闽
Original assignee: Institute of Semiconductors of CAS
Current assignee: Institute of Semiconductors of CAS
Priority date: 2018-12-14
Filing date: 2018-12-14
Publication date: 2020-06-23

Abstract

The invention discloses a heat dissipation device, which comprises the following structures: the blowing device blows gas to dissipate heat dissipated by the object to be cooled; the air extracting device is used for extracting heat emitted by the object to be cooled and air blown out by the air blowing device; the base is used for fixing the blowing device and the air exhaust device. The heat dissipation device provided by the invention effectively solves the problem of poor heat dissipation of the conventional high-power-density LED light source module, and particularly solves the problem of heat dissipation of the front side of the light source.

Description

Heat sink device

Technical Field

The invention relates to the field of heat dissipation, in particular to a heat dissipation device.

Background

The construction of national economic projects has urgent need for high-power illuminating lamps, the traditional high-power lamps have the advantages of high energy consumption, low lighting effect and short service life, and the high-power-density LED lamps are urgently needed to replace traditional illuminating products, so that the requirements of national economic construction and social development are met. However, only 15-30% of the input power of the LED chip is converted into light energy at present, the rest is converted into heat, and the junction temperature of the LED chip is increased due to the accumulation of high calorific value, so that the light emitting spectral line is shifted, the light efficiency is reduced, and the service life is shortened. Heat dissipation is therefore a key bottleneck problem in the design and manufacture of high power, high power density LED devices. With the increasing of the luminous efficiency of LEDs, white LED light sources have been widely used in general lighting and liquid crystal display televisions (LED LCD TVs) to replace traditional light sources. The common LED in the market generally has the problems that when the LED works for a long time, the LED generates a large amount of heat, so that the reliability of the LED is reduced, the quality of the LED is seriously influenced, and the requirement of a client or a standard is difficult to meet. In the passive heat dissipation technology of the existing LED lamp, most of the heat natural convection is not sufficiently utilized, or a good passage is not formed in the direction of the heat convection, so that the heat dissipation effect is influenced, particularly, the LED light source only dissipates heat through the back, and the front side does not have a heat dissipation channel, so that the heat accumulation of the front side is intensified.

Disclosure of Invention

Accordingly, the present invention is directed to an LED heat dissipation device to at least partially solve the above problems.

The technical scheme adopted by the invention is as follows:

a heat dissipation device, comprising:

and the blowing device blows air to dissipate heat dissipated by the object to be cooled.

Further, the blowing device comprises a blowing pipeline connected with the blowing device to form high-pressure gas;

or the blowing device comprises a blowing pipeline connected with a gas cooling device to form cooling gas;

or the blowing device comprises a blowing pipeline which is simultaneously connected with the blowing device and the gas cooling device to generate high-pressure cooling gas.

And the air extractor is used for extracting the heat emitted by the object to be cooled and the air blown out by the air blowing device.

Further, the air extractor comprises an air extracting pipeline connected with the air extractor, and the heat emitted by the object to be cooled is extracted.

Furthermore, the blowing device and the air suction device are arranged opposite to each other, and a blank middle zone is reserved.

The base is used for fixing the blowing device or the air extracting device.

Furthermore, an object to be cooled is placed in the blank middle zone.

The base of the heat dissipation device is connected with the object to be dissipated through the conductive device.

On one hand, the base is connected with an external power supply to supply power for the air blowing device, the air exhaust device and the object to be cooled.

On the other hand, the base is connected with an electrified object to be radiated to supply power for the air blowing device and the air extracting device.

The invention provides a heat dissipation device, which solves the problem of poor heat dissipation of the conventional high-power-density LED light source module, and particularly solves the problem of heat dissipation of the front side of a light source.

Drawings

FIG. 1 is a front view of an apparatus according to an embodiment of the present invention;

FIG. 2 is a diagram of the evacuation lines and evacuation devices of an embodiment of the apparatus of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. An embodiment of the present invention provides a heat dissipation apparatus, including:

the blowing device blows gas to dissipate heat dissipated by the object to be cooled;

the invention provides a first embodiment, wherein the blowing device comprises a blowing pipeline connected with the blowing device to form high-pressure gas;

the invention also provides a second embodiment, wherein the blowing device comprises a blowing pipeline connected with the gas cooling device to form cooling gas;

the present invention further provides a third embodiment, which is described in fig. 1, wherein the blowing device comprises a blowing pipe 1 which simultaneously connects the blowing device 2 and the gas cooling device 3 to form a high-pressure cooling gas.

The heat sink provided by the invention further comprises:

the air extractor is used for extracting the heat emitted by the object to be radiated and the air blown out by the air blowing device;

in some embodiments, the air extractor includes an air extraction pipeline connected to the air extractor for extracting heat dissipated by the object to be cooled.

In this embodiment, referring to the connection mode shown in fig. 2, the air-extracting device includes an air-extracting pipeline 4 connected to an air-extracting device 5 for extracting heat dissipated by the object to be cooled.

In some embodiments, the blowing device is positioned opposite the suction device, leaving a blank intermediate zone.

In view of the above-mentioned embodiments, there may be one or more blowing devices and air-extracting devices, and the embodiments include four implementations of one blowing device and one air-extracting device, one blowing device and multiple air-extracting devices, multiple blowing devices and one air-extracting device, and multiple blowing devices and multiple air-extracting devices. When the air blowing device and the air extracting device are one, the air blowing device and the air extracting device are oppositely fixed on the same base, and an air blowing opening and an air extracting opening of the air blowing device and the air extracting device are aligned to an object to be cooled; when the air blowing device and the air exhaust device are provided with a plurality of air blowing devices and air exhaust devices, the air blowing devices and the air exhaust devices are simultaneously fixed on the same base, and air blowing ports of the air blowing devices and air exhaust ports of the air exhaust devices are simultaneously aligned with an object to be cooled, so that heat dissipation is realized.

The heat dissipation device further comprises a base, and the blowing device and the air extraction device are fixed.

Furthermore, an object to be cooled is placed in the blank middle zone.

In an embodiment, the blowing device of the present invention includes a blowing pipe 1 connected to a blowing device 2 and a gas cooling device 3, and the air extracting device includes an air extracting pipe 4 connected to an air extracting device 5, which is oppositely disposed on the same base, and a blank region is left in the middle for placing an object to be cooled, as shown in fig. 1.

In the embodiments provided by the present invention, the object to be cooled includes, but is not limited to, an LED light source, a CPU, a semiconductor integrated circuit, and a power electronic device.

In some embodiments, the base is connected to the object to be heat-dissipated through a conductive device.

On one hand, an object to be radiated is fixed in the blank middle area of the base, the base is connected with an external power supply, the air blowing device 2 and/or the gas cooling device 3 which are connected with the air blowing pipeline 1, the air exhaust device 5 which is connected with the air exhaust pipeline 4 and the object to be radiated are powered, and the heat radiation is realized.

On the other hand, the object to be radiated is electrified and fixed in the blank middle zone of the base, the air blowing device 2 and/or the gas cooling device 3 connected with the air blowing pipeline 1 and the air exhaust device 5 connected with the air exhaust pipeline 4 are powered, and the heat radiation is realized.

In another embodiment of the present invention, the heat dissipation device of the present invention is further explained based on LED heat dissipation, and with reference to fig. 1, the heat dissipation device includes: the device comprises an air blowing pipeline 1, an air blowing device 2 is arranged in the air blowing pipeline, the air blowing pipeline 1 is hermetically connected with the air blowing device 2 and can form high-pressure air, and a gas cooling device 3 is arranged and can form cooling gas; an air exhaust device 5 is arranged in the air exhaust pipeline 4, and the air exhaust pipeline 4 is connected with the air exhaust device 5 in a sealing mode. The air blowing pipeline and the air exhaust pipeline are fixed on the base and are oppositely arranged, so that strong convection is formed in the middle zone (an arrow in figure 1), the size of the middle zone is close to that of the LED light source 6, the LED light source is placed in the middle zone with the strong convection for heat dissipation, in the embodiment, the heat dissipation device is at a certain distance away from the object with the heat dissipation, the area of the object to be cooled is cooling air, and heat dissipation of the LED light source is finally achieved.

The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat dissipating device, comprising:

the air extracting device is used for extracting heat emitted by the object to be cooled and air blown out by the air blowing device;

the base is used for fixing the blowing device and the air exhaust device.

2. The heat dissipating device of claim 1, wherein said blowing means is disposed opposite said air extracting means, leaving a blank intermediate zone.

3. The heat sink of claim 1, wherein the blowing device comprises a blowing pipe connected to the blowing device to form a high pressure gas.

4. The heat sink of claim 1, wherein the blowing means comprises a blowing duct connected to a gas cooling means to form a cooling gas.

5. The heat sink of claim 1, wherein the blowing device comprises a blowing duct connecting the blowing device and the gas cooling device to generate high pressure cooling gas.

6. The heat dissipation device as claimed in claim 1, wherein the air pumping device comprises an air pumping pipeline connected to an air pumping device for pumping the air blown by the air blowing device.

7. The heat dissipating device of claim 2, wherein the blank intermediate region is used to place an object to be dissipated.

8. The heat dissipating device of claim 1, wherein the base is connected to the object to be dissipated by an electrically conductive device.

9. The heat dissipating device of claim 1, wherein the base is connected to an external power source for supplying power to the blowing device, the pumping device, and the object to be dissipated.

10. The heat dissipation device as claimed in claim 1, wherein the base is connected to the object to be dissipated, and supplies power to the blowing device and the air-extracting device.