CN111321410B - System and method for detecting and automatically correcting thickness of substrate - Google Patents
System and method for detecting and automatically correcting thickness of substrate Download PDFInfo
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- CN111321410B CN111321410B CN201811539603.3A CN201811539603A CN111321410B CN 111321410 B CN111321410 B CN 111321410B CN 201811539603 A CN201811539603 A CN 201811539603A CN 111321410 B CN111321410 B CN 111321410B
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- substrate
- thickness
- copper plating
- radio frequency
- etching
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- 239000000758 substrate Substances 0.000 title claims abstract description 168
- 238000000034 method Methods 0.000 title claims abstract description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 151
- 229910052802 copper Inorganic materials 0.000 claims abstract description 146
- 239000010949 copper Substances 0.000 claims abstract description 146
- 238000005530 etching Methods 0.000 claims abstract description 101
- 238000007747 plating Methods 0.000 claims abstract description 93
- 238000001514 detection method Methods 0.000 claims abstract description 23
- 230000002159 abnormal effect Effects 0.000 claims abstract description 13
- 238000005507 spraying Methods 0.000 claims abstract description 6
- 238000012937 correction Methods 0.000 claims description 24
- 238000004458 analytical method Methods 0.000 claims description 7
- 239000002699 waste material Substances 0.000 abstract description 5
- 238000004364 calculation method Methods 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
- G01B7/063—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using piezoelectric resonators
- G01B7/066—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using piezoelectric resonators for measuring thickness of coating
Abstract
The invention relates to an etching process system and method, comprising a radio frequency copper measuring instrument and a pre-etching device. The radio frequency copper detector comprises a plurality of sensors; each sensor is capable of emitting and receiving radio frequencies, and the coverage ranges of the radio frequencies of the plurality of sensors overlap each other and are sufficient to span across both ends of the substrate for etching. After the radio frequency copper measuring instrument scans the substrate, data are transmitted to the pre-etching device for compensation spraying, so that abnormal positions of thickness and uniformity can be corrected. Therefore, the invention can scan all the surfaces of each substrate one by one and completely, the obtained thickness of the surface copper plating or the uniformity of the thickness of the surface copper plating is very accurate, the required detection time is short, and the pre-etching can be performed in real time to correct after the data are obtained, thereby greatly reducing the waste of resources and cost.
Description
Technical Field
The invention relates to an etching process system and an etching process method.
Background
Etching processes are one of the processes commonly used in the modern high-tech industry for manufacturing electronic devices such as chips. The etching process generally operates by physically or chemically reflecting the desired shape etched into the substrate surface. Generally, the substrate is a multi-layer board with copper foil plated on the surface, and the etching process in the prior art sprays chemical solvents having corrosiveness to the copper foil on the surface of the copper foil to achieve the etching purpose. Therefore, the thickness of the copper foil plated on the surface of the substrate and the uniformity of the thickness of the copper foil become important factors affecting the yield of the etching process.
Therefore, in the prior art, an operator of the etching process must first measure the thickness of the copper plating on the surface of the substrate to be used as the etching material or the uniformity of the thickness of the copper plating on the surface by using a contact copper meter, and determine whether the thickness is within the error range, and then send the substrate into the etching process apparatus.
Referring to fig. 7 and 8, an operator needs to hold the sensor 91 of the copper meter to contact the substrate 92 during measurement, and repeat the operation at different positions on the surface of the substrate 92 to confirm the uniformity of the copper plating thickness and the copper plating thickness on the surface of the substrate 92.
However, this approach is relatively time consuming and therefore can only be sampled and not inspected for all of the substrates 92, so that the results obtained are less accurate. As shown in fig. 8, the contact sensor 91 detects the detection points 921 on the substrate 92 as much as possible, so that all surfaces of the substrate 92 cannot be detected reliably, and an undetected gap 922 is generated, which also makes the detection result inaccurate. Both of these disadvantages will lead to a reduction in the yield of the overall etching process.
In addition, after inspection, the substrate 92 is eliminated from the batch if the uniformity of the copper plating thickness and the copper plating thickness does not meet the tolerance range acceptable for the etching process, which is a considerable waste of resources and costs.
Disclosure of Invention
In view of the foregoing drawbacks and disadvantages of the prior art, an object of the present invention is to provide a radio frequency copper measuring apparatus and a substrate thickness detecting and auto-correcting system and a substrate thickness detecting and auto-correcting method, which can scan all surfaces of each substrate one by one and completely by using a contactless radio frequency detection, and is accurate and time-saving. In addition, the pre-etching correction is performed in real time by accurate data after scanning, so that the waste of resources and cost can be greatly reduced.
In order to achieve the above object, the present invention provides a system for detecting and automatically correcting a thickness of a substrate, which is characterized in that the system is used for scanning, detecting and correcting a thickness of a copper plating on a surface of the substrate or uniformity of the thickness of the copper plating on the surface, the system comprises:
a radio frequency copper meter, comprising:
a fixing seat;
the sensors are arranged on the fixing seat, can emit radio frequency towards the substrate and can receive the radio frequency transmitted back from the substrate; the plurality of sensors are arranged in a mode that coverage ranges of radio frequencies on the substrate can be overlapped with each other, and the coverage ranges of the plurality of sensors after radio frequency overlapping cross two ends of the substrate;
the operation unit is electrically connected with the radio frequency copper measuring instrument; the operation unit receives the data obtained after the scanning of the radio frequency copper measuring instrument, and calculates and judges the data obtained after the scanning of the radio frequency copper measuring instrument;
a pre-etching device electrically connected to the operation unit; the pre-etching device receives the instruction of the operation unit and selectively etches the surface of the substrate;
a conveying track, which comprises a detection area, a judging area, a correction area and an etching area which are connected in sequence; the radio frequency copper measuring instrument is arranged in the detection area, and the pre-etching device is arranged in the correction area; the conveying track is used for conveying the substrate and enabling the substrate to sequentially pass through the detection area, the distinguishing area, the correction area and the etching area;
a eliminating rail connected to the discriminating region of the transporting rail;
the eliminating device is arranged in the distinguishing area of the conveying track and is electrically connected to the operation unit; the eliminating device receives the instruction of the operation unit and selectively sends the substrate into the eliminating track from the distinguishing area of the conveying track;
a main etching device arranged in the etching area; the main etching device is used for etching the substrate.
In order to achieve the above-mentioned purpose, the present invention adopts the technical means of designing a method for detecting and automatically correcting the thickness of a substrate, which is characterized by comprising the following steps:
and (3) detection: scanning a substrate by using a radio frequency copper measuring instrument; the radio frequency copper measuring instrument comprises a plurality of sensors and a fixed seat, wherein each sensor is arranged on the fixed seat, can emit radio frequency towards the substrate, and can receive the radio frequency transmitted back from the substrate; the plurality of sensors are arranged in a mode that coverage ranges of radio frequencies on the substrate can be overlapped with each other, and the coverage ranges of the plurality of sensors after radio frequency overlapping cross two ends of the substrate; relatively moving the substrate and the radio frequency copper measuring instrument; in the process, continuously emitting and receiving radio frequency towards the substrate by the plurality of sensors, and enabling the radio frequency copper measuring instrument to completely scan the surface of the substrate; and further receiving the data obtained by the scanning of the radio frequency copper measuring instrument by an operation unit, and operating and analyzing the data obtained by the scanning of the radio frequency copper measuring instrument by the operation unit;
and (3) judging: after the detection step, firstly judging the result after operation analysis by the operation unit, and entering the following corresponding steps according to the result judged by the operation unit;
and (3) correction: if the arithmetic unit judges that the thickness of the surface copper plating of the substrate or the uniformity of the thickness of the surface copper plating is within the error range capable of being corrected, the arithmetic unit sends instructions and data to a pre-etching device and drives the pre-etching device to correct the thickness of the surface copper plating of the substrate or the uniformity of the thickness of the surface copper plating; when in correction, the pre-etching device performs compensation spraying and etching correction on abnormal positions of the copper plating thickness on the surface of the substrate or the uniformity of the copper plating thickness on the surface according to the result of the operation analysis of the operation unit;
eliminating: if the arithmetic unit judges that the thickness of the surface copper plating of the substrate or the uniformity of the thickness of the surface copper plating is within an error range which cannot be corrected, the arithmetic unit sends a command to a eliminating device and drives the eliminating device to send the substrate into an eliminating track;
etching: if the arithmetic unit judges that the thickness of the surface copper plating of the substrate or the uniformity of the thickness of the surface copper plating is within the standard range, or after the correction step, the substrate enters a main etching device, and the main etching device is used for etching the substrate.
The invention has the advantages that the radio frequency copper measuring instrument scans all the surfaces of each substrate one by one and completely, and transmits the data to the operation unit for operation analysis. The arithmetic unit can send instructions and data to the pre-etching device and drive the pre-etching device to correct the thickness of the surface copper plating of the substrate or the uniformity of the thickness of the surface copper plating. After receiving the instruction and the data, the pre-etching device performs compensation spraying on the specific position of the substrate (namely, the abnormal position of the thickness of the copper plating on the upper surface of the substrate or the uniformity of the thickness of the copper plating on the surface after the analysis of the operation unit), so as to correct the abnormal position of the thickness of the copper plating on the surface or the uniformity of the thickness of the copper plating on the surface. By means of the device matching and the steps, all surfaces of each substrate can be scanned one by one and completely, the obtained thickness of the surface copper plating or the uniformity of the thickness of the surface copper plating is very accurate, the required detection time is greatly shortened compared with that of manual detection by a contact sensor, and the data can be obtained and then corrected by pre-etching in real time, so that the waste of resources and cost can be greatly reduced.
Preferably, the method for detecting and automatically correcting the thickness of the substrate is characterized in that the step of determining further comprises the steps of: first discrimination: judging whether the thickness of the surface copper plating of the substrate or the uniformity of the thickness of the surface copper plating is within a standard range or not by using the operation unit; if yes, directly entering the etching step; and (3) second discrimination: after the first discrimination, if the operation unit judges that the thickness of the surface copper plating of the substrate or the uniformity of the thickness of the surface copper plating is not in the standard range, the operation unit judges whether the thickness of the surface copper plating of the substrate or the uniformity of the thickness of the surface copper plating is in the error range which can be corrected; if yes, entering the correction step; if not, the step of eliminating is carried out.
The invention will now be described in more detail with reference to the drawings and specific examples, which are not intended to limit the invention thereto.
Drawings
FIG. 1 is a schematic illustration of the present invention;
FIG. 2 is a schematic diagram of the RF coverage of the emitted and received RF copper meter of the present invention covering a substrate;
FIGS. 3, 4 and 5 are schematic top views of the RF copper meter of the present invention scanning a substrate;
FIG. 6 is a flow chart of the steps of the present invention;
FIG. 7 is a schematic representation of the use of a prior art contact copper meter;
fig. 8 is a schematic diagram of a prior art contact copper meter for inspecting a substrate for gaps.
Wherein reference numerals are used to refer to
A substrate 10 conveying rail
11. Detection zone 12 discrimination zone
13. Correction region 14 etching region
20. Radio frequency copper measuring instrument for eliminating rail 30
31. Sensor 32 fixing seat
40. Operation unit 50 eliminating device
60. Pre-etching device 70 main etching device
91. Sensor 92 substrate
921. Detection point 922 gap
S1 first step S2 second step
S3 third step S4' fourth step
S4 fourth two steps S5 fifth step
Detailed Description
The technical means adopted by the invention to achieve the preset creation purpose are further described below by combining the attached drawings and the preferred embodiments of the invention.
Referring to fig. 1 and 2, the system for detecting and automatically correcting the thickness of a substrate a according to the present invention is used for detecting and correcting the thickness of copper plating on the surface of a substrate a or the uniformity of the thickness of copper plating on the surface. The substrate thickness detecting and automatic correcting system comprises a conveying track 10, a eliminating track 20, a radio frequency copper measuring instrument 30, an operation unit 40, an eliminating device 50, a pre-etching device 60 and a main etching device 70.
The transport track 10 includes a detection area 11, a determination area 12, a correction area 13 and an etching area 14 connected in sequence. The transporting rail 10 is used for transporting the substrate a, and the substrate a sequentially passes through the rf copper meter 30, the strip removing device 50 and the pre-etching device 60, and finally enters the main etching device 70.
The eliminating rail 20 is connected to the discriminating region 12 of the transporting rail 10 for transporting the eliminated substrate a for centralized processing. However, the rail 20 may not be eliminated; this allows the operator to directly remove and concentrate the substrates a to be removed from the conveyor track 10.
Referring to fig. 2 to 5, the rf copper meter 30 is disposed in the detection area 11 of the conveying track 10 and includes a plurality of sensors 31 and a fixing base 32. Each sensor 31 is provided on the fixed base 32 and can emit radio frequency toward the conveying rail 10 and can receive radio frequency returned from the conveying rail 10; specifically, the radio frequency is emitted toward and received by the substrate a transported by the transport rail 10 through the radio frequency copper meter 30. The plurality of sensors 31 are arranged in such a way that coverage ranges of the radio frequencies on the substrate a can overlap each other, and the coverage ranges of the plurality of sensors 31 after the radio frequencies overlap (i.e., the sum of the radio frequency coverage ranges of all the sensors 31) span across both ends of the substrate a. Further, coverage ranges of the radio frequencies emitted and received by the plurality of sensors 31 overlap each other in the width direction of the conveying rail 10 and span across both ends of the cover substrate a in the width direction of the conveying rail 10. That is, the sensor 31 forms a scanning area across both sides of the transporting rail 10 on the path along which the substrate a moves along the transporting rail 10, so that when the substrate a passes through the scanning area formed by the plurality of sensors 31 of the rf copper meter 30 along with the transporting rail 10, the coverage of the rf of all the sensors 31 spans both ends of the substrate, and thus the surface of the substrate a is completely scanned by the sensors 31.
The operation unit 40 is electrically connected to the rf copper meter 30. The operation unit 40 is used for receiving the data obtained after the scanning by the radio frequency copper meter 30, and is used for calculating and distinguishing the data obtained after the scanning by the radio frequency copper meter 30. The arithmetic unit 40 may be a computer or may be a program; and it may have a display to display the calculated analog image, or may not have a display and not display the analog image, but directly operate with data.
The eliminating device 50 is disposed in the distinguishing area 12 of the transporting rail 10 and is electrically connected to the computing unit 40. The eliminating device 50 receives the instruction of the arithmetic unit 40 and selectively sends the substrate a into the eliminating rail 20 from the discriminating region 12 of the transporting rail 10. Specifically, the eliminating device 50 may be a movable member or a rotating arm, and directly pushes the substrate a, which does not meet the standard after the inspection, into the eliminating rail 20; alternatively, the eliminating device 50 may be a switching device, and selectively switch whether the discriminating area 12 is connected to the correcting area 13 or the eliminating rail 20. However, the present invention is not limited thereto, and the eliminating device 50 may be omitted, so that the substrate a not meeting the standard is eliminated manually, that is, the operator directly removes the substrate a to be eliminated from the transporting rail 10.
The pre-etching device 60 is disposed in the correction area 13 of the transporting track 10 and electrically connected to the computing unit 40. The pre-etching device 60 receives the instruction of the operation unit 40 and selectively etches the surface of the substrate a using the data obtained after scanning by the rf copper meter 30. Specifically, the pre-etching device 60 has a plurality of sprayers (not shown) in the present embodiment; when the substrate a passes through the pre-etching device 60, the pre-etching device 60 activates the sprinklers whose positions correspond to the abnormal positions of the thickness of the surface copper plating or the uniformity of the copper plating thickness according to the data provided by the computing unit 40 or the analyzed simulated imaging chart, so as to correct the abnormal positions (specifically, the "abnormal positions" is a specific point or a specific block that the computing unit 40 determines to be corrected on the surface of the substrate a). That is, the sprinklers need only be aligned in the width direction of the conveying rail 10 and cross the conveying rail 10, whereby it is only necessary to intermittently activate the sprinklers while the conveying rail 10 is moving so as to completely correspond to the abnormal thickness of the copper plating on all surfaces or uniformity of the copper plating thickness on the surface of the substrate a. However, the pre-etching device 60 may be a movable sprayer, and actively moves to the abnormal position of the copper plating thickness on the surface of the substrate a or the uniformity of the copper plating thickness on the surface to perform compensation spraying to correct the abnormal position.
The main etching device 70 is provided in the etching region 14 of the carrying rail 10. The main etching device 70 is used for etching the substrate A; that is, the substrate a, which may or may not be corrected, enters the main etching device 70 along with the transfer rail 10, and the main etching device 70 performs the etching process on the substrate a in the final product. However, the present invention is not limited thereto, and in other embodiments, the main etching device 70 may be omitted; this is only used to detect and correct the substrate a.
In addition, the present invention may also be without the pre-etching device 60; this is only used to rapidly and individually inspect the substrate a, and eliminates the discomfort. In other words, the present invention may be a detecting device or a detecting device with a correcting function.
In the present embodiment, the substrate a is directly carried and transported by the transporting rail 10, but in other embodiments, the substrate a may be transported by not only using the transporting rail 10, but also a robot. In this way, a plurality of mechanical arms are electrically connected to the operation unit 40 and respectively disposed among the rf copper meter 30, the pre-etching device 60 and the main etching device 70 for transporting the substrate a; thus, the plurality of robots can sequentially feed the substrate A into the RF copper meter 30, the pre-etching device 60 and the main etching device 70. The plurality of robots can also selectively feed the substrate a into the eliminating rail 20 at the same time, that is, drive the robots to eliminate the substrate a when the operation unit 40 determines that the substrate a does not meet the standard.
Referring to fig. 6, the method for detecting and automatically correcting the thickness of a substrate according to the present invention sequentially comprises the following steps:
a first step S1: and (5) detecting. In operation, the substrate a (or robot arm) is transported by the transport rail 10, and scanned and inspected by the rf copper meter 30. During scanning, the substrate A and the radio frequency copper measuring instrument 30 are moved relatively; specifically, in the present embodiment, the substrate a passes through the rf copper meter 30 via the conveying track 10, but not limited thereto, the substrate a may be fixed, and the rf copper meter 30 may move over the substrate a and scan the substrate a. In the process of moving the substrate a and the rf copper meter 30 relatively, the plurality of sensors 31 continuously emit and receive the rf toward the substrate a, so that the rf emitted and received by the plurality of sensors 31 of the rf copper meter 30 completely scans the surface of the substrate a (i.e. the coverage area of all the sensors 31 after rf overlapping completely scans the surface of the substrate a). After scanning, the data obtained by the scanning of the radio frequency copper measuring instrument 40 is further received by the operation unit 40, and the data obtained by the scanning of the radio frequency copper measuring instrument 30 is operated and analyzed by the operation unit 40.
A second step S2: and (5) first discrimination. After the detection step of the first step S1, the arithmetic unit 40 judges whether the thickness of the copper plating on the surface of the substrate a or the uniformity of the thickness of the copper plating on the surface is within a standard range; specifically, the substrate a required for different etching process products has different standard ranges, and the standard ranges can be preset and adjusted in the operation unit 40. For example, a specific value may be preset, and a standard range of plus or minus 10% of the specific value is used as a standard range, but not limited thereto, depending on the etching process to be performed. In the first determination, if the computing unit 40 determines that the thickness of the copper plating on the surface of the substrate a or the uniformity of the thickness of the copper plating on the surface is within the preset standard range, the substrate a directly enters the main etching device 70 along with the conveying rail 10 without any processing; if not, the next step is entered.
Third step S3: and (5) judging for the second time. If the calculation unit 40 determines that the thickness of the surface copper plating of the substrate a or the uniformity of the thickness of the surface copper plating is not within the standard range in the second step S2, the calculation unit 40 determines whether the thickness of the surface copper plating of the substrate a or the uniformity of the thickness of the surface copper plating is within the error range capable of being corrected; specifically, the "error range that can be corrected" also varies depending on the substrate a required for different etching process products or depending on different correction devices and modes. For example, the standard value may be between plus or minus 10% to 15%, or may be within two specific values, but is not limited thereto. If the computing unit 40 determines that the thickness of the surface copper plating of the substrate a or the uniformity of the thickness of the surface copper plating is within the correctable error range, the process proceeds to the fourth two steps S4; if not (i.e., if the calculation unit 40 determines that the error is not within the error range that can be corrected, for example, if the error exceeds the standard value of plus or minus 15%), the fourth step S4' is performed. However, the third step S3 is not necessarily performed, and if the arithmetic unit 40 determines in the second step S2 that the thickness of the surface copper plating of the substrate a or the uniformity of the thickness of the surface copper plating is within a predetermined standard range, the third step S3 is skipped.
Fourth step S4': and (5) eliminating. If in the third step S3, the computing unit 40 determines that the thickness of the surface copper plating of the substrate a or the uniformity of the thickness of the surface copper plating is within the error range which cannot be corrected, that is, exceeds the standard value of the foregoing example by plus or minus 15%, the computing unit 40 sends a command to the eliminating device 50, and drives the eliminating device 50 to send the substrate a into the eliminating track 20, so as to eliminate the substrate a which is not within the standard range and is not within the error range which can be corrected in the whole etching process, thereby improving the yield. However, the third step S3 is not necessarily performed, and the fourth step S4' is skipped if the calculation unit 40 determines that the thickness of the surface copper plating or the uniformity of the thickness of the surface copper plating of the substrate a is within a predetermined standard range in the second step S2 or if the calculation unit 40 determines that the thickness of the surface copper plating or the uniformity of the thickness of the surface copper plating of the substrate a is within a range capable of correcting errors in the third step S3.
Fourth two steps S4: and (5) correcting. If the arithmetic unit 40 judges that the thickness of the surface copper plating of the substrate a or the uniformity of the thickness of the surface copper plating is within the correctable error range, the arithmetic unit 40 sends instructions and data to the pre-etching device 60, and drives the pre-etching device 60 to correct the thickness of the surface copper plating of the substrate a or the uniformity of the thickness of the surface copper plating; in the correction, the pre-etching device 60 performs compensation spraying and etching correction of the abnormal portion of the copper plating thickness on the surface of the substrate a according to the result of the calculation and analysis by the calculation unit 40. Specifically, the "abnormal portion" is a specific point or a specific block where the arithmetic unit 40 determines that the thickness of the surface copper plating or the uniformity of the thickness of the surface copper plating on the surface of the substrate a falls within a correctable error range. However, the present invention is not limited thereto, and if the arithmetic unit 40 determines that the thickness of the surface copper plating of the substrate a or the uniformity of the thickness of the surface copper plating is within a predetermined standard range in the second step S2, the fourth two steps S4 are skipped.
Fifth step S5: etching. If the judgment operation unit 40 judges that the thickness of the surface copper plating of the substrate a or the uniformity of the thickness of the surface copper plating is within the standard range in the first judgment step, or after the correction in the fourth two steps S4, the substrate a enters the main etching device 70 through the conveying track 10, and the main etching device 70 starts to etch the substrate a in the finished product pattern; that is, the thickness of the copper plating on the surface of the substrate a or the uniformity of the thickness of the copper plating on the surface has already met the standard of the etching process, and then the main etching process is formally entered to make the substrate a into a finished product.
By means of the device matching and the steps, all surfaces of each substrate can be scanned one by one and completely, the obtained thickness of the surface copper plating or the uniformity of the thickness of the surface copper plating is very accurate, the required detection time is greatly shortened compared with that of manual detection by a contact sensor, and the data can be obtained and then corrected by pre-etching in real time, so that the waste of resources and cost can be greatly reduced.
In addition, in other embodiments, the second step S2 and the third step S3 may be integrated in one step. In other words, the arithmetic unit 40 directly determines whether the data of the substrate a is within the standard range, the correctable error range or the uncorrectable error range, and then the eliminating step, the correcting step or the etching step is continued according to the situation.
Of course, the present invention is capable of other various embodiments and its several details are capable of modification and variation in light of the present invention, as will be apparent to those skilled in the art, without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (3)
1. A system for detecting and automatically correcting the thickness of a substrate, the system for scanning and detecting and correcting the thickness of copper plating on the surface of a substrate or the uniformity of the thickness of copper plating on the surface of a substrate, the system comprising:
a radio frequency copper meter, comprising:
a fixing seat;
the sensors are arranged on the fixing seat, can emit radio frequency towards the substrate and can receive the radio frequency transmitted back from the substrate; the plurality of sensors are arranged in a mode that coverage ranges of radio frequencies on the substrate can be overlapped with each other, and the coverage ranges of the plurality of sensors after radio frequency overlapping cross two ends of the substrate;
the operation unit is electrically connected with the radio frequency copper measuring instrument; the operation unit receives the data obtained after the scanning of the radio frequency copper measuring instrument, and calculates and judges the data obtained after the scanning of the radio frequency copper measuring instrument;
a pre-etching device electrically connected to the operation unit; the pre-etching device receives the instruction of the operation unit and selectively etches the surface of the substrate;
a conveying track, which comprises a detection area, a judging area, a correction area and an etching area which are connected in sequence; the radio frequency copper measuring instrument is arranged in the detection area, and the pre-etching device is arranged in the correction area; the conveying track is used for conveying the substrate and enabling the substrate to sequentially pass through the detection area, the distinguishing area, the correction area and the etching area;
a eliminating rail connected to the discriminating region of the transporting rail;
the eliminating device is arranged in the distinguishing area of the conveying track and is electrically connected to the operation unit; the eliminating device receives the instruction of the operation unit and selectively sends the substrate into the eliminating track from the distinguishing area of the conveying track;
a main etching device arranged in the etching area; the main etching device is used for etching the substrate.
2. The method for detecting and automatically correcting the thickness of the substrate is characterized by comprising the following steps:
and (3) detection: scanning a substrate by using a radio frequency copper measuring instrument; the radio frequency copper measuring instrument comprises a plurality of sensors and a fixed seat, wherein each sensor is arranged on the fixed seat, can emit radio frequency towards the substrate, and can receive the radio frequency transmitted back from the substrate; the plurality of sensors are arranged in a mode that coverage ranges of radio frequencies on the substrate can be overlapped with each other, and the coverage ranges of the plurality of sensors after radio frequency overlapping cross two ends of the substrate; relatively moving the substrate and the radio frequency copper measuring instrument; in the process, continuously emitting and receiving radio frequency towards the substrate by the plurality of sensors, and enabling the radio frequency copper measuring instrument to completely scan the surface of the substrate; and further receiving the data obtained by the scanning of the radio frequency copper measuring instrument by an operation unit, and operating and analyzing the data obtained by the scanning of the radio frequency copper measuring instrument by the operation unit;
and (3) judging: after the detection step, firstly judging the result after operation analysis by the operation unit, and entering the following corresponding steps according to the result judged by the operation unit;
and (3) correction: if the arithmetic unit judges that the thickness of the surface copper plating of the substrate or the uniformity of the thickness of the surface copper plating is within the error range capable of being corrected, the arithmetic unit sends instructions and data to a pre-etching device and drives the pre-etching device to correct the thickness of the surface copper plating of the substrate or the uniformity of the thickness of the surface copper plating; when in correction, the pre-etching device performs compensation spraying and etching correction on abnormal positions of the copper plating thickness on the surface of the substrate or the uniformity of the copper plating thickness on the surface according to the result of the operation analysis of the operation unit;
eliminating: if the arithmetic unit judges that the thickness of the surface copper plating of the substrate or the uniformity of the thickness of the surface copper plating is within an error range which cannot be corrected, the arithmetic unit sends a command to a eliminating device and drives the eliminating device to send the substrate into an eliminating track;
etching: if the arithmetic unit judges that the thickness of the surface copper plating of the substrate or the uniformity of the thickness of the surface copper plating is within the standard range, or after the correction step, the substrate enters a main etching device, and the main etching device is used for etching the substrate.
3. The method for detecting and automatically correcting the thickness of a substrate according to claim 2, further comprising the steps of:
first discrimination: judging whether the thickness of the surface copper plating of the substrate or the uniformity of the thickness of the surface copper plating is within a standard range or not by using the operation unit; if yes, directly entering the etching step;
and (3) second discrimination: after the first discrimination, if the operation unit judges that the thickness of the surface copper plating of the substrate or the uniformity of the thickness of the surface copper plating is not in the standard range, the operation unit judges whether the thickness of the surface copper plating of the substrate or the uniformity of the thickness of the surface copper plating is in the error range which can be corrected; if yes, entering the correction step; if not, the step of eliminating is carried out.
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| CN1922463A (en) * | 2003-12-30 | 2007-02-28 | 兰姆研究有限公司 | Method and apparatus for measuring film thickness by means of coupled eddy sensors |
| CN101197255A (en) * | 2006-12-08 | 2008-06-11 | Lg.菲利浦Lcd株式会社 | Apparatus for etching substrate and fabrication line for fabricating liquid crystal display using the same |
| CN108828014A (en) * | 2018-05-09 | 2018-11-16 | 上海交通大学 | Sensor chip, marker detection device and detection method |
| CN209923434U (en) * | 2018-12-17 | 2020-01-10 | 扬博科技股份有限公司 | Radio frequency type copper measuring instrument and substrate thickness detection and automatic correction system |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020023715A1 (en) * | 2000-05-26 | 2002-02-28 | Norio Kimura | Substrate polishing apparatus and substrate polishing mehod |
| KR102326730B1 (en) * | 2014-03-12 | 2021-11-17 | 가부시키가이샤 에바라 세이사꾸쇼 | Correction method of film thickness measurement value, film thickness corrector and eddy current sensor |
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|---|---|---|---|---|
| CN1922463A (en) * | 2003-12-30 | 2007-02-28 | 兰姆研究有限公司 | Method and apparatus for measuring film thickness by means of coupled eddy sensors |
| CN101197255A (en) * | 2006-12-08 | 2008-06-11 | Lg.菲利浦Lcd株式会社 | Apparatus for etching substrate and fabrication line for fabricating liquid crystal display using the same |
| CN108828014A (en) * | 2018-05-09 | 2018-11-16 | 上海交通大学 | Sensor chip, marker detection device and detection method |
| CN209923434U (en) * | 2018-12-17 | 2020-01-10 | 扬博科技股份有限公司 | Radio frequency type copper measuring instrument and substrate thickness detection and automatic correction system |
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