CN111315174A

CN111315174A - Sealing connection structure for flexible circuit board and terminal equipment

Info

Publication number: CN111315174A
Application number: CN202010134808.4A
Authority: CN
Inventors: 程二亭; 姚秀军; 桂晨光; 韩久琦; 吴韦志
Original assignee: Beijing Haiyi Tongzhan Information Technology Co Ltd
Current assignee: Jingdong Shuke Haiyi Information Technology Co Ltd; Jingdong Technology Information Technology Co Ltd
Priority date: 2020-03-02
Filing date: 2020-03-02
Publication date: 2020-06-19
Anticipated expiration: 2040-03-02
Also published as: CN111315174B

Abstract

The embodiment of the disclosure discloses a sealing connection structure for a flexible circuit board and a terminal device. One embodiment of the sealing connection structure comprises: the side surface of the lower shell is provided with an opening, and the lower shell is provided with a first connecting part used for being connected with the coating part; the lower bottom surface of the upper shell is provided with a second connecting part used for being connected with the lower shell and the cladding part; the cladding part comprises a cladding material and a flexible circuit board which is wrapped by the cladding material, the cladding part is provided with a boss extending towards the inner part of the lower shell, the boss is tightly matched with the opening of the lower shell to form a sealing structure, and the flexible circuit board in the cladding part extends out of the boss to enter the inner part of the lower shell. This embodiment realizes a waterproof and dustproof sealing structure that forms a seal between the upper and lower cases for placing the electronic module and the cover.

Description

Sealing connection structure for flexible circuit board and terminal equipment

Technical Field

The embodiment of the present disclosure relates to the field of electronic device sealing, and in particular, to a sealing connection structure for a Flexible Printed Circuit (FPC) and a terminal device including the same.

Background

With the rapid development of information technology, the application of sensors is also more and more extensive.

In intelligent wearing equipment like electronic products such as intelligent bracelet, intelligent wrist-watch, body sense armlet, often need a plurality of sensors and/or electronic module. A related approach is typically to wrap the FPC with a flexible organic material between multiple sensors and/or electronic modules for connection. When connecting, it is usually necessary to design a threading hole or a threading groove on the module outer housing so that the FPC passes through the outer housing to connect with the circuit inside the housing.

Disclosure of Invention

The embodiment of the disclosure provides a sealing connection structure for a flexible circuit board and a terminal device.

In a first aspect, embodiments of the present disclosure provide a sealing connection structure for a flexible circuit board, the sealing connection structure including: the side surface of the lower shell is provided with an opening, and the lower shell is provided with a first connecting part; the upper shell corresponds to the lower shell, wherein a second connecting part is arranged on the lower bottom surface of the upper shell, the second connecting part comprises a first sub-connecting part and a second sub-connecting part, and the upper shell is connected with the lower shell through the first sub-connecting part; the cladding portion, wherein, the cladding portion includes cladding material and the FPC by the cladding of cladding material, the lateral surface of casing under the cladding portion at least partly surrounds, the cladding portion is provided with the boss of the inside extension of casing down, the boss closely cooperates with the opening of casing down and forms seal structure, FPC in the cladding portion stretches out from the boss of cladding portion and gets into inside the casing down, the cladding portion is provided with the third connecting portion, the third connecting portion is including setting up in the third sub-connecting portion of the last bottom surface of cladding portion and the fourth sub-connecting portion that corresponds with first connecting portion, the cladding portion with go up the casing and pass through third sub-connecting portion and second sub-connecting portion and be connected, the cladding portion passes through fourth sub-connecting portion and first connecting portion with lower casing and is connected.

In some embodiments, the lower bottom of the lower shell extends to the outside of the shell to form an extension part facing the side where the opening is located and the side opposite to the side where the opening is located, and the first connecting part is arranged on the upper bottom surface of the extension part; and the fourth sub-connecting part is arranged on the lower bottom surface of the coating part.

In some embodiments, the first connecting portion includes a first latch, and the second sub-connecting portion includes a second latch.

In some embodiments, a sealing step is disposed between the boss and the lower housing, so that the lower housing and the cladding portion are tightly fitted to form a sealing structure.

In some embodiments, a sealing step is provided between the boss and the upper housing, so that the upper housing and the boss are tightly matched to form a sealing structure.

In some embodiments, a sealing portion is disposed between the upper case and the lower case.

In some embodiments, the sealing portion includes a sealing ring, and the sealing ring passes over a boss closely fitted to the opening of the lower housing, so that the sealing ring is pressed against the boss when the upper housing is connected to the lower housing.

In some embodiments, the seal ring comprises at least one of: o-shaped ring, sealing gasket, and stepped sealing ring.

In some embodiments, the lower housing includes at least one opening for protruding an electrode of a sensor placed in a space formed by the upper and lower housings, the opening sized to mate with the electrode to form a sealed structure.

In a second aspect, an embodiment of the present disclosure provides a terminal device, including: one or more sensors; the hermetically sealed connection structure for a flexible circuit board according to any one of the first aspect in accordance with the number of the one or more sensors; wherein, the sensor arranged in the sealed space formed by the upper and lower shells of the sealed connecting structure is electrically connected with the FPC entering the lower shell.

According to the sealing connection structure for the flexible circuit board and the terminal device, the boss extending towards the inner part of the lower shell is arranged on the cladding part formed by the cladding material and the flexible circuit board cladded by the cladding material, and the boss is tightly matched with the opening arranged on the side surface of the lower shell to form a sealing structure, so that the flexible circuit board in the cladding part extends out of the boss and enters the inner part of the lower shell; and the lower shell is connected with the first connecting part and the fourth sub-connecting part of the cladding part, the upper shell is connected with the lower shell through the first sub-connecting part, and the upper shell is connected with the cladding part through the second sub-connecting part and the third sub-connecting part. Thereby, a waterproof and dustproof sealing structure for sealing between the upper and lower cases for placing the electronic module and the covering part is realized. And moreover, the FPC directly enters the sealing structure from the boss of the cladding material to be connected with the circuit board, so that the waterproof and dustproof effects are realized while the communication between the multiple electronic modules is ensured.

Drawings

Other features, objects and advantages of the disclosure will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

FIG. 1 is an exemplary system architecture diagram in which one embodiment of the present disclosure may be applied;

FIG. 2a is a schematic view of one embodiment of a hermetically sealed connection structure for a flexible circuit board according to the present disclosure;

FIG. 2b is a schematic view of a lower housing of one embodiment of a sealed connection structure for a flexible circuit board according to the present disclosure;

FIG. 2c is a schematic view of an upper housing of one embodiment of a sealed connection structure for a flexible circuit board according to the present disclosure;

FIG. 3 is a schematic diagram of one application scenario of a sealed connection structure for a flexible circuit board according to an embodiment of the present disclosure;

FIG. 4 is a schematic view of yet another embodiment of a hermetically sealed connection structure for a flexible circuit board according to the present disclosure;

FIG. 5a is a partial schematic view of another embodiment of a hermetic connection structure for a flexible circuit board according to the present disclosure;

FIG. 5b is a schematic view of yet another embodiment of a hermetic connection structure for a flexible circuit board according to the present disclosure;

FIG. 5c is a schematic view of the lower case, the cover, and the sealing part assembled according to one embodiment of the hermetic connecting structure for the flexible circuit board shown in FIG. 5b of the present disclosure;

fig. 6 is a schematic structural diagram of a terminal device suitable for use in implementing embodiments of the present disclosure.

Detailed Description

The present disclosure is described in further detail below with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the related invention are shown in the drawings.

It should be noted that, in the present disclosure, the embodiments and features of the embodiments may be combined with each other without conflict. The present disclosure will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Fig. 1 illustrates an exemplary architecture 100 for a sealed connection structure for a flexible circuit board to which the present disclosure may be applied.

As shown in fig. 1, the system architecture 100 may include a cladding 11, a housing 12, and a sensor assembly (not shown) disposed in the housing 12. The housing 12 may include an upper housing (not shown) and a lower housing (not shown). The cover 11 may include a cover material (not shown) and an FPC (not shown) covered with the cover material. The coating material may be used to coat the FPC to protect the internal circuitry thereof. The coating material may generally comprise various flexible organic materials. It may include, but is not limited to, at least one of the following: rubber, silica gel. The housing 12 may be made of various materials having a certain strength and a predetermined molding effect, such as plastic.

The cover 11 and the housing 12 are tightly fitted to form a sealed space inside the housing 12 to house the sensor assembly. The sensor module is electrically connected to the FPC in which the covering portion 11 extends into the closed space in the housing, and communicates with other electronic devices such as the sensor module through the FPC in the covering portion 11.

It should be understood that the number of wraps 11, housings 12, and sensor assemblies (not shown) disposed in housings 12 in fig. 1 are merely illustrative. There may be any number of wraps 11, housings 12, and sensor assemblies disposed in the housings 12, as desired for the implementation.

With continued reference to fig. 2a, a schematic diagram of one embodiment of a sealed connection structure for a flexible circuit board according to the present disclosure is shown. This sealing connection structure includes: a lower case 21, an upper case 22 corresponding to the lower case 21, and a cover 23.

In the present embodiment, the side surface of the lower case 21 may be provided with an opening 211. The lower case may be further provided with a first connection part (not shown). The first connecting portion may be used to connect to the covering portion 23. As an example, the first connection portion may include a region for adhesive connection. The area for adhesive bonding may be located on the outer side surface of the lower case 21, for example.

In some optional implementations of the present embodiment, the first connection portion may include a first latch. The tenon may include a part connected in a snap or tenon connection manner.

In the present embodiment, the lower bottom surface of the upper case 22 corresponding to the lower case 21 may be provided with a second coupling portion (not shown in the drawings). The second connection portion may include a first sub-connection portion and a second sub-connection portion. The upper case may be coupled with the lower case by the first sub-coupling part. As an example, the first sub-connection portion may include an area for adhesive connection. As yet another example, the first sub-connecting portion may include a bolt connection. Optionally, the bolt may further include a dust-proof bolt.

In this embodiment, the covering portion 23 may include a covering material 231 and an FPC (not shown) covered by the covering material. The covering portion 23 generally surrounds at least half of the outer surface of the lower case 21. The inner side of the covering portion 23 may be closely attached to the outer side surface of the lower case 21. The cover 23 may be provided with a boss 232 extending into the lower case 21. The boss 232 may be closely fitted with the opening 211 of the lower housing 21 to form a sealing structure. The FPC233 in the cover 23 may protrude from the boss 232 of the cover 23 to enter the lower case 21 to connect an electronic device (e.g., a circuit of a sensor module) placed inside the case. The covering portion 23 may be provided with a third connecting portion (not shown). The third connection portion may include a third sub-connection portion provided on an upper bottom surface of the covering portion 23 and a fourth sub-connection portion corresponding to the first connection portion. The cover 23 may be connected to the upper case 22 by the third sub-connecting portion and the second sub-connecting portion. The cover 23 may be connected to the lower case 21 through the fourth sub-connecting portion and the first connecting portion. Wherein the third sub-connection portion is generally matched with the second sub-connection portion. The fourth sub-connecting portion is generally matched with the first connecting portion.

In some alternative implementations of this embodiment, see the lower housing 21 shown in fig. 2 b. The lower bottom surface of the lower case 21 may extend to the outside of the case to form an extension 212 toward the side where the opening is located and the side opposite to the side where the opening is located. The first connection portion 213 may be disposed on an upper bottom surface of the extension portion. Accordingly, the fourth sub-connecting portion may be disposed on a lower bottom surface of the covering portion 23.

Alternatively, based on the above alternative implementation, the first connection portion 213 disposed on the upper bottom surface of the extension portion 21 may include a tenon.

In some alternative implementations of the present embodiment, see the upper housing 22 shown in fig. 2 c. The second sub-connecting portion 221 may include a second latch.

Based on the above alternative implementation, the covering part 10, the lower shell 21 and the upper shell 22 are connected through the tenon without punching. In addition, because the tenon possesses concave-convex structure, can also play the dustproof and waterproof effect of certain degree, promoted whole seal structure's leakproofness.

In some optional implementations of this embodiment, a sealing step may be disposed between the boss and the upper housing, so that the upper housing and the boss are tightly fitted to form a sealing structure. Wherein the above-mentioned sealing step can be used to indicate a stepped sealing structure.

In some optional implementations of the present embodiment, by bending the covering 10, it is possible to connect the plurality of lower housings 21 through the covering 10, so that a plurality of electronic devices (e.g., sensor assemblies) are respectively placed in the sealed space formed by the lower housing 21 and the upper housing 22, and communication is performed through the FPC in the covering.

With continued reference to fig. 3, fig. 3 is a schematic diagram of an application scenario of a sealed connection structure for a flexible circuit board according to an embodiment of the present disclosure. In the application scenario of fig. 3, the boss 332 of the cladding 33 mates with the lower housing opening 311. The inner side of the covering 33 is closely attached to the outer side surface of the lower case 31. Alternatively, the inside of the covering 33 may be bonded to the outside of the lower case 31. The upper case 32 is connected with the covering 33 and the lower case 31 to form a sealing structure. The FPC331 covered in the covering portion 33 is inserted into the lower case 31 through the bosses 332.

At present, one of the prior art is design through wires hole or through wires groove on the module shell body usually to make FPC pass the shell body and be connected with casing internal circuit, lead to through wires hole or through wires groove department can't effectively seal. And above-mentioned sealing connection structure that this above-mentioned embodiment of this disclosure provided, through the boss and the lower casing trompil of cladding part closely cooperate, realized being used for placing the waterproof dustproof seal structure of sealed formation between electronic module's upper and lower casing and cladding part. And moreover, the FPC directly enters the sealing structure from the boss of the cladding material to be connected with the circuit board, so that the waterproof and dustproof effects are realized while the communication between the multiple electronic modules is ensured.

With further reference to fig. 4, a schematic diagram of yet another embodiment of a hermetically sealed connection structure for a flexible circuit board is shown. This sealing connection structure includes: a lower case 41, an upper case 42 corresponding to the lower case, and a covering portion 43.

The lower housing 41, the upper housing 42 corresponding to the lower housing 41, and the covering portion 43 may be respectively consistent with the lower housing 21, the upper housing 22 corresponding to the lower housing 21, and the covering portion 23 in the foregoing embodiments, and the above description of the lower housing 21, the upper housing 22 corresponding to the lower housing 21, the covering portion 23, and the optional implementation manner thereof is also applicable to the lower housing 41, the upper housing 42 corresponding to the lower housing, and the covering portion 43, and is not repeated here.

In this embodiment, the bosses 432 may be provided with sealing

steps

411 and 431 with the lower housing 41, so that the lower housing 41 and the covering portion 43 are tightly fitted to form a sealing structure. Wherein the above-mentioned sealing step can be used to indicate a stepped sealing structure. Alternatively, the first connection portion 413 of the lower housing 41 may be a latch.

In some optional implementations of this embodiment, a sealing step may also be disposed between the boss and the upper housing, so that the boss and the openings of the upper housing and the lower housing are both tightly fitted to form a sealing structure.

As can be seen from fig. 4, the sealing connection structure for the flexible circuit board in the present embodiment embodies a structure of a sealing step. Therefore, the scheme described in the embodiment can provide a dustproof and waterproof barrier for the opening of the lower shell through the sealing step, so that the sealing effect is improved.

With further reference to fig. 5a, a schematic diagram of yet another embodiment of a hermetically sealed connection structure for a flexible circuit board is shown. This sealing connection structure includes: a lower case 51, an upper case 52 corresponding to the lower case, and a covering portion 53.

The lower shell 51, the upper shell 52 corresponding to the lower shell 51, and the cladding 53 may be respectively identical to the lower shell 21, the upper shell 22, the cladding 23, or the lower shell 41 corresponding to the lower shell 21, and the upper shell 42, the cladding 43 corresponding to the lower shell 41 in the foregoing embodiments, and the above descriptions for the lower shell 21, the upper shell 22, the cladding 23, or the lower shell 41 corresponding to the lower shell 21, the upper shell 42, the cladding 43 corresponding to the lower shell 41, and their optional implementation manners are also applicable to the lower shell 51, the upper shell 52, and the cladding 53 corresponding to the lower shell, and are not repeated herein.

In the present embodiment, a sealing portion 54 may be provided between the upper case 52 and the lower case 51. The FPC531 and the boss 532 of the cover 53 protruding into the housing may be the same as those described in the foregoing description of the FPC233 and the boss 232 of the cover. Optionally, the upper housing 52 may further include a sealing step 521. Optionally, the covering 53 may further include a sealing step 533.

In some alternative implementations of the present embodiment, the sealing portion 54 may include a sealing ring. The sealing ring may pass over the boss 532 that is tightly fitted to the opening of the lower case, so that the sealing ring is pressed against the boss 532 when the upper case 52 is coupled to the lower case.

In some optional implementations of the present embodiment, based on the optional implementations, the sealing ring may include at least one of: o-shaped ring, sealing gasket, and stepped sealing ring.

In some alternative implementations of this embodiment, referring to fig. 5b, the lower housing 51 may include at least one opening 511. The opening 511 may be used to protrude an electrode of a sensor placed in a space formed by the upper case and the lower case 51. The opening 511 is sized to mate with the electrode to form a sealed structure. The opening 511 may be further sealed by a conventional sealing method after the electrodes are usually placed. Optionally, the lower housing 51 may further include an extension 512. The extension 512 may further include a first connection part 513. The first connecting portion 513 may be a latch. Optionally, the upper case 52 may further include a second sub-connecting portion 521. The second sub-connecting portion 521 may be a latch. Optionally, the covering 53 may further include a sealing step 533. Optionally, a sealing ring 54 may be further included between the lower housing 51 and the upper housing 52. Fig. 5c shows the effect of the lower housing 51, the covering part 53 and the gasket 54 after assembly.

As can be seen from fig. 5, the sealing connection structure for a flexible circuit board in the present embodiment embodies the structure of the sealing portion. Therefore, the solution described in this embodiment can further enhance the sealing performance between the upper and lower shells and the covering part by the arrangement of the sealing part.

Referring now to fig. 6, shown is a schematic diagram of an electronic device (e.g., terminal device in fig. 1) 600 suitable for use in implementing embodiments of the present disclosure. The terminal device in the embodiments of the present disclosure may include various smart wearable devices, which may include, but are not limited to, devices such as a smart band, a smart watch, a somatosensory arm ring, and the like. The terminal device shown in fig. 6 is only an example, and should not bring any limitation to the functions and the use range of the embodiments of the present disclosure.

As shown in fig. 6, the wearable device 600 includes a sealed connection structure 601 for a flexible circuit board and a sensor (not shown) placed in the sealed structure described above. The above-mentioned sealing connection structure 601 for the flexible circuit board can be referred to the description of the foregoing embodiments. The shells connected by the coating material can form a wearable device, for example, a circular ring is worn on an arm to measure various information such as pose, heart rate and the like through the arm. Optionally, a circuit board including a Central Processing Unit (CPU) may be further disposed in the sealed structure, and configured to perform operations on information collected by the sensor.

The foregoing description is only exemplary of the preferred embodiments of the disclosure and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the invention in the embodiments of the present disclosure is not limited to the specific combination of the above-mentioned features, but also encompasses other embodiments in which any combination of the above-mentioned features or their equivalents is made without departing from the inventive concept as defined above. For example, the above features and (but not limited to) technical features with similar functions disclosed in the embodiments of the present disclosure are mutually replaced to form the technical solution.

Claims

1. A hermetically sealing connection structure for a flexible circuit board FPC, comprising:

the connector comprises a lower shell, a first connecting part and a second connecting part, wherein an opening is formed in the side surface of the lower shell;

the upper shell corresponds to the lower shell, wherein a second connecting part is arranged on the lower bottom surface of the upper shell, the second connecting part comprises a first sub-connecting part and a second sub-connecting part, and the upper shell is connected with the lower shell through the first sub-connecting part;

cladding portion, wherein, cladding portion includes cladding material and quilt the FPC that cladding material cladding, at least half surrounds of cladding portion the lateral surface of casing down, cladding portion is provided with to the inside boss that extends of casing down, the boss with the opening of casing closely cooperates and forms seal structure down, FPC in the cladding portion follows the cladding portion the boss stretches out the entering down inside the casing, cladding portion is provided with the third connecting portion, the third connecting portion including set up in the third sub-connecting portion of the last bottom surface of cladding portion and with the fourth sub-connecting portion that first connecting portion correspond, cladding portion with last casing passes through the third sub-connecting portion with the second sub-connecting portion are connected, cladding portion with the casing passes through down the fourth sub-connecting portion with first connecting portion are connected.

2. The sealing connection structure according to claim 1, wherein a lower bottom of the lower case extends to an outside of the case to form an extension portion facing a side surface of the opening and an opposite side surface to the side surface of the opening, and the first connection portion is provided on an upper bottom surface of the extension portion; and the fourth sub-connecting part is arranged on the lower bottom surface of the coating part.

3. The sealed connection of claim 1, wherein the first connection portion includes a first tenon and the second sub-connection portion includes a second tenon.

4. The sealing connection structure of claim 1, wherein a sealing step is provided between the boss and the lower housing, so that the lower housing and the cladding are tightly fitted to form a sealing structure.

5. The sealing connection structure of claim 1, wherein a sealing step is provided between the boss and the upper housing, so that the upper housing and the boss are tightly fitted to form a sealing structure.

6. The sealing connection structure according to claim 1, wherein a sealing portion is provided between the upper case and the lower case.

7. The sealingly connecting structure of claim 6, wherein the sealing portion includes a sealing ring which passes over the boss closely fitted to the opening of the lower casing, so that the sealing ring is pressed against the boss when the upper casing is connected to the lower casing.

8. The sealed, connected structure of claim 7, wherein the sealing ring comprises at least one of: o-shaped ring, sealing gasket, and stepped sealing ring.

9. The sealing connection structure of any one of claims 1 to 8, wherein the lower housing comprises at least one opening for protruding an electrode of a sensor placed in a space formed by the upper housing and the lower housing, the opening being sized to mate with the electrode to form a sealed structure.

10. A terminal device, comprising:

one or more sensors;

the hermetic connection structure for a flexible circuit board according to one of claims 1 to 9 in accordance with the number of the one or more sensors;

and the sensor arranged in a sealed space formed by the upper shell and the lower shell of the sealed connecting structure is electrically connected with the FPC entering the lower shell.