CN111306875A

CN111306875A - Heat conducting device

Info

Publication number: CN111306875A
Application number: CN201811523134.6A
Authority: CN
Inventors: 袁建永; 田勇; 刘春丽
Original assignee: Bo Xihua Electric Jiangsu Co Ltd; BSH Hausgeraete GmbH
Current assignee: BSH Electrical Appliances Jiangsu Co Ltd; Bo Xihua Electric Jiangsu Co Ltd; BSH Hausgeraete GmbH
Priority date: 2018-12-12
Filing date: 2018-12-12
Publication date: 2020-06-19

Abstract

A thermally conductive apparatus (100), comprising: a heat conducting tray (20) for placing an item, a base (10) for supporting the heat conducting tray (20), and an air supply device (30), wherein: the air supply device (30) is positioned in the base (10) to force air to flow to the heat conducting plate (20). By adopting the scheme, the heat exchange efficiency is improved.

Description

Heat conducting device

Technical Field

The embodiment of the invention relates to the technical field of household appliances, in particular to a heat conduction device.

Background

To extend the shelf life of food, a user may freeze the food using a refrigerator, freezer, or the like. Before consumption, it is often necessary to thaw the frozen food.

Disclosure of Invention

An object of an embodiment of the present invention is to provide a heat transfer device that contributes to an improvement in heat exchange efficiency.

An embodiment of the present invention provides a heat conduction device, including: the heat conduction dish that is used for placing the article, a base and the air feed device that are used for supporting the heat conduction dish, wherein: the air supply device is positioned in the base to force air to flow to the heat conducting plate.

Compared with the prior art, the technical scheme of the embodiment of the invention has the following beneficial effects:

an air supply device is arranged between the heat conducting disc of the heat conducting device and the base, and the air supply device can force air to flow to the heat conducting disc so as to accelerate the heat exchange between the heat conducting disc and the air, thereby being beneficial to accelerating the heat exchange speed between the heat conducting disc and the food placed on the heat conducting disc.

The thermally conductive device may be used to thaw or rapidly chill or rapidly freeze food. When the heat conduction device is used for thawing, it can shorten the time period required for thawing the food. When the heat transfer device is used to rapidly cool/freeze food, cooling/freezing efficiency may also be improved.

Optionally, the base comprises: the heat conducting plate is supported on the side wall.

Optionally, the bottom wall and the side wall enclose an accommodating cavity, and the air supply device is located in the accommodating cavity.

Optionally, the heat conducting device further comprises: the limiting part is connected with the bottom wall, and the air supply device is located in an area defined by the limiting part. Spacing portion can be fixed air supply device, avoids air supply device to take place to rock in the use.

Optionally, the air supply device comprises: the fan and with the power of fan connection.

Optionally, the base includes an upper wall, the upper wall is located between the air supply device and the heat conducting plate, an air duct is provided between the upper wall and the heat conducting plate, and the air supply device is configured to force air to flow through the air duct. The upper wall can isolate the air supply device, so that the air supply device is prevented from being exposed to users, and the use safety of the heat conduction device is improved.

Optionally, the base includes a support portion vertically higher than the upper wall, and the heat conductive plate is supported by the support portion.

Optionally, the heat conducting device further comprises a cold storage device located within the base.

Optionally, the cold storage device is removably accommodated in the base, so that the flexibility of use of the heat conduction device can be improved, and the heat conduction device can have both a defrosting function and a function of maintaining the temperature of the article low.

Optionally, a diversion trench is arranged on the heat conduction disc to prevent water generated by the articles from accumulating on the heat conduction disc.

Optionally, the plane of the base for placing the heat conducting disc is at a preset angle with the horizontal plane, so that water generated by the article can be guided to flow out of the heat conducting disc, and the water is prevented from accumulating on the heat conducting disc.

Optionally, the base includes a plurality of connecting portions, and when the heat conduction dish is connected with different connecting portions, the contained angle between the heat conduction dish and the base is different to can be according to the type difference of placing the article on the heat conduction dish, adjust the relative position of heat conduction dish and base in a flexible way.

Optionally, the thermally conductive disc comprises a plurality of heat exchange channels.

Optionally, the heat exchange channels are arranged along the length direction or the width direction of the heat conduction plate, and the heat exchange efficiency can be further improved by the arranged heat exchange channels.

Drawings

FIG. 1 is a schematic structural diagram of a heat conducting device according to an embodiment of the present invention;

FIG. 2 is an exploded view of a thermally conductive assembly according to an embodiment of the present invention;

FIG. 3 is a schematic structural diagram of another heat conducting apparatus according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a heat conducting disc according to an embodiment of the present invention.

Detailed Description

In order to make the aforementioned objects, features and advantages of the embodiments of the present invention comprehensible, specific embodiments accompanied with figures are described in detail below.

Referring to fig. 1, a schematic structural diagram of a heat conducting device according to an embodiment of the present invention is shown. Referring to fig. 2, an exploded view of a thermally conductive assembly according to an embodiment of the present invention is shown. Referring to fig. 3, a schematic structural diagram of another heat conducting device according to an embodiment of the present invention is shown. The structure of the heat conduction device 100 will be described in detail with reference to fig. 1 and 3.

In a specific implementation, the heat conducting device 100 includes: heat-conducting plate 20, base 10 and air supply device 30. The thermally conductive plate 20 may be used to place an item, and the thermally conductive plate 20 is supported on the base 10. The air supply device 30 is located in the base 10 and can force air to flow to the heat conducting plate 20.

The air supply device 30 can accelerate the air flow in the base 10 during operation, thereby accelerating the heat exchange rate between the air and the heat conductive plate 20, and further facilitating the heat exchange rate between the heat conductive plate 20 and the food placed thereon.

When the articles placed on the heat conducting plate 20 are frozen food and the heat conducting device 100 is used for thawing, the thawing of the frozen food can be accelerated, the time required for thawing the food can be effectively shortened, and the thawing efficiency can be improved.

When the heat transfer device 100 is used to rapidly cool or freeze food, cooling or freezing efficiency may also be improved.

In an embodiment of the present invention, the base 10 may include a bottom wall 11 and a side wall 12. The side wall 12 is connected to the bottom wall 11, and the side wall 12 is used for supporting the heat conducting plate 20.

In a specific implementation, the surface connecting the bottom wall 11 and the side wall 12 may be a quadrangle, a triangle, or a circle. It will be understood that the face of the bottom wall 11 that joins the side wall 12 may also be provided in other regular or irregular polygons, depending on the type and shape of the article to be placed.

When the connecting surface between the bottom wall 11 and the side walls 12 is a quadrilateral, the side walls 12 may be respectively disposed around the bottom wall 11, 2 side walls 12 may be oppositely disposed on the bottom wall 11, and 3 side walls 12 may be disposed on the bottom wall 11. The bottom wall 11 and the side wall 12 may enclose an accommodating cavity, and the air supply device 30 is located in the accommodating cavity.

In one embodiment, notches may be provided in the side walls 12 of the base 10 to facilitate the installation and removal of the thermal disk 20.

In an embodiment of the invention, the heat conducting device 100 further includes a limiting portion 50. The limiting part 50 is connected with the bottom wall 11, the limiting part 50 and the bottom wall 11 can enclose an area, and the air supply device 30 is located in the area enclosed by the limiting part 50 and the bottom wall 11. The limiting part 50 can fix the air supply device 30, and the air supply device 30 is prevented from shaking in the using process.

The air supply device 30 may include a fan 31 and a power source 32 connected to the fan 31. In practical applications, the wind supply device 30 may also be other devices capable of outputting wind power.

Referring to fig. 3, in a specific implementation, the base 10 may further include an upper wall 13, and the upper wall 13 is located between the air supply device 30 and the heat conductive plate 20. The upper wall 13 can prevent the air supply device 30 from being exposed to users during the use process of the heat conduction device 100, and the use safety of the air supply device 30 is improved.

The upper wall 13 is provided with a plurality of ventilation holes 131, and the air supply device 30 can force air to enter the air duct 60 between the upper wall 13 and the heat conducting plate 20 through the ventilation holes 131 and force the air to flow through the air duct 60, thereby improving the heat exchange efficiency of the heat conducting device 100 and the articles placed thereon. The number of the vent holes 131 may be set according to an actual application scenario.

In some embodiments of the present invention, the base 10 may include a support portion 132 vertically higher than the upper wall 13, and the heat conductive plate 20 is supported on the support portion 132.

In practical applications, some articles may also have a need to maintain low temperatures. In order to maintain the object in a low temperature state, in an embodiment of the present invention, in combination with fig. 2, the heat conducting apparatus 100 may further include: a cold storage device 40. The cold storage device 40 is a device capable of continuously emitting cold for a period of time, such as dry ice, blue ice, ice cubes, and the like. The cold energy emitted from the cold accumulation device 40 can exchange heat with the heat conductive plate 20 to maintain the low temperature of the heat conductive plate 20, and the heat conductive plate 20 continuously exchanges heat with the object placed thereon, so that the low temperature of the object placed on the heat conductive device 100 can be maintained.

In particular, depending on the application, some articles may need to be thawed and some articles may need to be maintained at a low temperature. In order to flexibly adapt to different application scenes, the air supply device 30 can be opened or closed according to actual needs, and the cold accumulation device 40 can be placed in the base 10 or removed from the base 10 according to actual application needs.

For example, when it is necessary to thaw the goods, the air supply device 30 is opened, and the cold storage device 40 is removed from the inside of the base 10. For example, when the temperature of the article needs to be maintained at a low temperature, the air supply device 30 is closed, and the cold storage device 40 is placed in the base 10.

In the embodiment of the present invention, an opening is disposed at the center of the cold storage device 40, and the limiting portion 50 and the air supply device 30 are located in the opening. In other words, when the heat conduction device 100 is provided with both the air supply device 30 and the cold storage device 40, the air supply device 30 is located inside the cold storage device 40.

When thawing or maintaining the temperature of the product at a low temperature, the product may produce water, which may be thawing water or water produced by the product itself.

In specific implementation, the phenomenon of water accumulation on the heat conducting plate 20 of the heat conducting apparatus 100 can be effectively avoided, the influence of the water accumulation on the electronic devices in the heat conducting apparatus 100 can be avoided, and the use safety of the heat conducting apparatus 100 can be improved.

In some embodiments of the present invention, a flow guiding groove (not shown) may be disposed on the heat conducting plate 20, and the flow guiding groove may guide the accumulated water and discharge the accumulated water from the heat conducting plate 20.

In other embodiments of the present invention, the plane of the base 10 on which the heat conducting plate 20 is placed is at a predetermined angle with respect to the horizontal plane, and after the heat conducting plate 20 is placed on the base 10, the heat conducting plate 20 is at an angle with respect to the horizontal plane, so that water generated from the object can be drained along the inclined heat conducting plate 20. The specific value of the included angle may be set according to the type of the article to be placed on the heat conducting plate 20 or the smoothness of the heat conducting plate 20, and is not limited herein.

In still other embodiments of the present invention, the base 10 includes a plurality of connection portions (not shown) for connecting the thermal conductive plate 20. The connecting portions may be distributed in the vertical direction with the base 10. When the heat conducting plate 20 is connected to different connecting parts, the included angle between the heat conducting plate 20 and the base 10 is different, so that water generated by an article can be prevented from accumulating on the heat conducting plate 20, and the relative position between the heat conducting plate 20 and the base 10 can be flexibly adjusted according to the type of the article to be placed.

In a specific implementation, the thermally conductive disk 20 may be a metal disk. For example, the metal plate is an aluminum plate, an iron plate, a copper plate, a stainless steel plate, or the like.

A schematic structural diagram of a heat conducting disc according to an embodiment of the present invention is shown in fig. 4. The thermally conductive disc 20 may comprise a plurality of heat exchanging channels 21. The heat exchange channels 21 may be arranged along the length direction or the width direction of the heat conductive plate 20. The direction of the arrow in fig. 4 indicates the axial direction of the heat exchange passage 21. In order to enhance the heat dissipation efficiency of the heat conductive plate 20, a plurality of heat dissipation ribs are disposed on the heat exchange channel 21. The heat dissipation ribs are formed on the inner wall of the heat exchange channel 21 in a manner of protruding towards the axial direction far away from the heat exchange channel 21 along the radial direction. The heat dissipation ribs may increase the surface area of the heat exchange channels 21, so that the heat dissipation efficiency of the heat conductive plate 20 may be enhanced.

In some embodiments of the present invention, the refrigerant exists in the heat exchange channel 21, and the refrigerant in the heat exchange channel 21 at normal temperature exists in two forms, namely gas and liquid, and can be converted in the two forms. When the heat conductive plate 20 contacts the frozen food, the gaseous refrigerant is liquefied and releases heat to the heat conductive plate 20. The heat conducting plate 20 transfers heat quickly to the frozen food to accelerate thawing. The liquid refrigerant flows to both sides of the heat exchange channel 21 through the heat exchange channel 21, and absorbs heat again to be vaporized, and the gaseous refrigerant floats to the low-pressure region. So far, the internal refrigerant forms self-circulation in the heat exchange channel 21 to continuously unfreeze frozen food.

Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A heat transfer device (100), comprising: a heat conducting tray (20) for placing an item, a base (10) for supporting the heat conducting tray (20), and an air supply device (30), wherein: the air supply device (30) is positioned in the base (10) to force air to flow to the heat conducting plate (20).

2. The heat transfer device (100) according to claim 1, wherein the base (10) comprises: the heat conducting plate comprises a bottom wall (11) and a side wall (12) connected to the bottom wall (11), and the heat conducting plate (20) is supported on the side wall (12).

3. The heat transfer device (100) of claim 2, wherein the bottom wall (11) and the side wall (12) enclose a receiving cavity, and the air supply device (30) is located in the receiving cavity.

4. The heat transfer device (100) of claim 2, further comprising: the limiting part (50), the limiting part (50) is connected with the bottom wall (11), and the air supply device (30) is located in an area defined by the limiting part (50).

5. The heat transfer device (100) of claim 1, wherein the air supply device (30) comprises: a fan (31) and a power supply (32) connected to the fan (31).

6. The heat transfer device (100) of claim 1, wherein the base (10) comprises an upper wall (13), the upper wall (13) is located between the air supply device (30) and the heat transfer plate (20), an air duct (60) is located between the upper wall (13) and the heat transfer plate (20), and the air supply device (30) is configured to force air to flow through the air duct (60).

7. The heat transfer device (100) according to claim 6, wherein the base (10) includes a support portion (132) vertically higher than the upper wall (13), the heat transfer plate (20) being supported on the support portion (132).

8. The heat transfer device (100) of claim 1, further comprising a cold thermal storage device (40) located within the base (10).

9. The heat conducting device (100) according to claim 8, wherein the cold storage device (40) is removably housed within the base (10).

10. The heat transfer device (100) of claim 1, wherein the heat transfer plate (20) is provided with channels.

11. The heat transfer device (100) of claim 1, wherein the plane of the base (10) on which the heat transfer plate (20) is placed is at a predetermined angle to the horizontal.

12. The heat transfer device (100) of claim 1, wherein the base (10) comprises a plurality of connection portions, and wherein the angle between the heat transfer plate (20) and the base (10) is different when the heat transfer plate (20) is connected to different connection portions.

13. The heat conducting device (100) according to claim 1, wherein the heat conducting plate (20) comprises a plurality of heat exchanging channels (21).

14. The heat transfer device (100) of claim 13, wherein the heat exchange channels (21) are arranged along a length direction or a width direction of the heat transfer plate (20).