CN111304654B - 一种钢带表面镀铂方法 - Google Patents
一种钢带表面镀铂方法 Download PDFInfo
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- 238000007747 plating Methods 0.000 title claims abstract description 88
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title claims abstract description 75
- 238000000034 method Methods 0.000 title claims abstract description 44
- 229910000831 Steel Inorganic materials 0.000 title claims abstract description 36
- 239000010959 steel Substances 0.000 title claims abstract description 36
- 229910052697 platinum Inorganic materials 0.000 title claims abstract description 14
- 229910002696 Ag-Au Inorganic materials 0.000 claims abstract description 27
- 229910018054 Ni-Cu Inorganic materials 0.000 claims abstract description 21
- 229910018481 Ni—Cu Inorganic materials 0.000 claims abstract description 21
- 238000000137 annealing Methods 0.000 claims abstract description 9
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 9
- 239000001257 hydrogen Substances 0.000 claims abstract description 9
- 239000010960 cold rolled steel Substances 0.000 claims abstract description 8
- 238000001035 drying Methods 0.000 claims abstract description 7
- 238000005406 washing Methods 0.000 claims abstract description 7
- 239000002994 raw material Substances 0.000 claims abstract description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 4
- 238000001816 cooling Methods 0.000 claims abstract description 4
- 230000001681 protective effect Effects 0.000 claims abstract description 4
- 239000000956 alloy Substances 0.000 claims description 46
- 229910045601 alloy Inorganic materials 0.000 claims description 46
- 230000008569 process Effects 0.000 claims description 29
- 238000009713 electroplating Methods 0.000 claims description 26
- 238000005240 physical vapour deposition Methods 0.000 claims description 23
- 238000000151 deposition Methods 0.000 claims description 18
- 230000008021 deposition Effects 0.000 claims description 16
- 229910052709 silver Inorganic materials 0.000 claims description 14
- 229910052737 gold Inorganic materials 0.000 claims description 11
- 238000002513 implantation Methods 0.000 claims description 10
- 229910021592 Copper(II) chloride Inorganic materials 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 238000005238 degreasing Methods 0.000 claims description 6
- 239000000243 solution Substances 0.000 claims description 5
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 4
- 239000003513 alkali Substances 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 238000005468 ion implantation Methods 0.000 claims description 3
- 238000000576 coating method Methods 0.000 abstract description 53
- 239000011248 coating agent Substances 0.000 abstract description 49
- 239000002131 composite material Substances 0.000 abstract description 19
- 238000010301 surface-oxidation reaction Methods 0.000 abstract description 8
- 238000002310 reflectometry Methods 0.000 abstract description 6
- 230000003746 surface roughness Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 73
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 15
- 239000010949 copper Substances 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
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- 229910000640 Fe alloy Inorganic materials 0.000 description 5
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- 238000005260 corrosion Methods 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229910052763 palladium Inorganic materials 0.000 description 5
- 229910020630 Co Ni Inorganic materials 0.000 description 4
- 229910002440 Co–Ni Inorganic materials 0.000 description 4
- 239000010953 base metal Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 230000005291 magnetic effect Effects 0.000 description 4
- 229910000510 noble metal Inorganic materials 0.000 description 4
- 230000005622 photoelectricity Effects 0.000 description 4
- 239000006104 solid solution Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000005275 alloying Methods 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
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- 150000002500 ions Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
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- 239000011148 porous material Substances 0.000 description 2
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- 238000004381 surface treatment Methods 0.000 description 2
- 238000007751 thermal spraying Methods 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- 229910002710 Au-Pd Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000711 cancerogenic effect Effects 0.000 description 1
- 231100000315 carcinogenic Toxicity 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/26—Methods of annealing
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/74—Methods of treatment in inert gas, controlled atmosphere, vacuum or pulverulent material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/48—Ion implantation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
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- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
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- C25D7/00—Electroplating characterised by the article coated
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Abstract
一种钢带表面镀铂方法:以普通低碳冷轧钢带为原料并脱脂除油;水洗并烘干;在全氢保护气氛下退火;镀覆;自然冷却至室温。本发明在钢带表面生成2~3µm的Ni‑Cu/Ag‑Au/Pd/Pt复合镀层,硬度50~60 HV,表面粗糙度0.01~0.025µm,孔隙率不超过2个/cm2,镜面反射率99.85~99.99%;电阻率为0.04~0.08µΩ∙cm,热导率为370~380 W/m∙K;在常温下连续放置5000d后,表面氧化面积不超过0.02%,失光率不超过0.03%;在350~400℃下连续放置5000 h后,表面氧化面积不超过0.04%,失光率不超过0.05%;在100 KHz超声波下连续放置5000 h后,镀层厚度无变化,也未出现脱落和裂纹,镀层稳定性高,完全满足钟表、珠宝、精密仪表等行业需要。
Description
技术领域
本发明涉及材料表面处理方法,确切地属于一种钢带表面镀铂的方法,广泛用于光电、通信、钟表、珠宝、精密仪表、医疗器械等行业。
背景技术
铂(Pt)是一种重要的贵金属,具有良好的延展性能、表面性能、导电性能、导热性能、抗氧化性能等,广泛用于光电、通信、钟表、珠宝、精密仪表、医疗器械等行业。但是,由于Pt属于地壳中稀缺元素,价格昂贵,其应用受到较大限制。为降低成本,节约用量,业内目前通行的做法是采用镀Pt钢带来替代纯金属Pt,通过Pt镀层来实现某些使用性能。
就传统的钢带镀Pt工艺来说,其一般是在冷轧钢带表面连续分段电镀Cu、Ni、Ag、Pt等单金属,形成Cu/Ni/Ag/Pt复合镀层。其存在如下不足:
第一,该镀层以Cu为内镀层,其容易发生氧化,导致镀层的稳定性下降。此外,一旦腐蚀介质通过Pt镀层的裂纹和针孔,穿过Ag、Ni和Cu的孔隙到达Fe基体,由于Fe基体是腐蚀电偶的阳极,很快就会腐蚀而出现锈点,从而造成整个复合镀层的稳定性大大降低。
第二,在电镀Ni的过程中,容易析出H2,而Ni恰好又是一种吸H2的金属,H2渗透到镀层里容易引起氢脆,导致镀层产生裂纹。
第三,在电镀Ag的过程中,需要使用剧毒的氰化物做电镀液,这会严重污染环境。此外,作为中间层的Ag镀层在空气中极易氧化,且容易受到硫化物的腐蚀。如果后续镀Pt工序无法及时跟进,将会导致Ag镀层表面产生较多缺陷,极大影响Pt镀层的稳定性,使整个复合镀层的镜面反射率和光泽度大幅下降,严重影响使用性能。虽然有文献报道可通过热喷涂的方式镀Ag,但一方面,所得Ag镀层厚度往往较大,一般可达几十个微米,甚至更高,原料浪费太大,性价比过低。另一方面,热喷涂过程中,由于加热温度不低于Ag的熔点,表面炽热的Ag镀层在空气中更容易氧化,表面缺陷更多,更不利于后续的镀Pt。
第四,在电镀Pt的过程中,其主要问题在于:一是由于镀液主成分仍然是P盐(Pt(NH3)2(NO2)2),电镀时,溶液中容易产生大量的致癌物质亚硝酸盐,这会对严重污染环境。并且电镀时需要在100℃左右进行,高温电镀进一步加剧了污染。二是由于电流效率很难达到100%,电镀过程中会产生较多的废液,造成Pt的浪费。一般要通过繁琐的后续处理才能加以回收,而这会增加额外的生产成本。三是由于长时间连续分段电镀,不仅能耗高,且镀层表面极易产生钝化效应,导致Pt镀层的表面质量往往不佳,孔隙多、应力大、光泽度低。此外,由于电镀过程中容易产生H2,而Pt恰好对H2具有较强的吸收能力,容易使其渗透到整个镀层内部,导致镀层产生裂纹。
因此,通过连续分段电镀形成Pt镀层的传统工艺存在较多问题,其既不符合国家节能环保政策的要求,镀层性能也难以满足行业日益严苛的使用标准。
经检索:
中国专利公开号为CN105887085A的文献,其公开了《一种镀贵金属极薄钢带的生产方法》。该文献以普通的DC01冷轧钢板为基底,通过“电镀Zn-Fe合金+物理气相沉积Co-Ni合金+物理气相沉积Pt”工艺进行生产,钢带表面生成了一层厚度为10~15μm的Zn-Fe/Co-Ni/Pt复合镀层,表面粗糙度为0.03~0.06μm,孔隙率不超过5个/cm2,镜面反射率为99.5~99.9%,镀层表面质量良好。此外,在50KHz超声波环境下连续放置2400h后,镀层厚度没有明显变化,表面也没有产生裂纹,镀层稳定性高,但其存在:第一,除Pt外,复合镀层中其它金属为Zn、Fe、Co和Ni,它们的导电性能和导热性能比Cu、Ag及Au要差很多,整个复合镀层的导电性能和导热性能自然也不会太好;第二,Zn、Fe、Co和Ni均为贱金属,其性能与贵金属有着显著差别。为节省成本,虽然镀Pt钢带允许使用少量的贱金属,但该文献中内镀层和中间镀层均为贱金属,造成整个复合镀层成色不足,在要求严苛的行业中仍然存在产品性能不达标的可能;第三,作为内镀层的Zn-Fe合金,硬度高,延展性差,加工性能不好,在冲压制件时,会出现镀层与基板之间变形不协调,容易导致粉化脱落,稳定性不高,且Zn-Fe合金中,无论是Zn,还是Fe,都是活泼金属,合金自身也是一种原电池,其耐蚀性能不足。至少在酸性环境中,很容易被腐蚀,一样会造成内镀层不稳定;第四,作为中间镀层的Co-Ni合金属于硬质合金,硬度很大,延展性很差,与Zn-Fe合金类似,冲压制件时,镀层也很容易脱落;第五,文献所构建的复合镀层是基于Zn-Fe合金、Co-Ni合金、金属Pt三者之间的磁性相互作用,借助外部电磁场来加强相互之间的结合,而不是通过内部更牢固、更自然的金属键或化学键,一旦外部磁场消失,各镀层之间的相互作用力势必减弱。更重要的是,所采用物理气相沉积属于高温下真空镀膜模式,温度远远超过铁磁性材料的磁性转变点(居里温度)。作为中间镀层的Co-Ni合金,其磁性将会彻底消失。成膜后仅仅通过外部微弱的电磁场,很难起到连接和稳定内外镀层的作用。因此,通过这种方式所构建的复合镀层的稳定性依然不足,产品性能仍有待提高。
发明内容
本发明的目的在于克服现有技术存在的污染环境重、原料浪费大、镀层质量差且稳定性不佳等不足,提供一种在钢带表面生成一层厚度为2~3μm的Ni-Cu/Ag-Au/Pd/Pt复合镀层,硬度为50~60HV,表面粗糙度为0.01~0.025μm,孔隙率不超过2个/cm2,镜面反射率为99.85~99.99%;电阻率为0.04~0.08μΩ·cm,热导率为370~380W/m·K;在常温25~35℃下连续放置5000d后,表面氧化面积不超过0.02%,失光率不超过0.03%;在高温350~400℃下连续放置5000h后,表面氧化面积不超过0.04%,失光率不超过0.05%;在100KHz超声波环境下连续放置5000h后,镀层厚度没有明显变化,也没有出现脱落和裂纹,镀层稳定性高的钢带表面镀铂的方法。
实现上述目的的措施:
一种钢带表面镀铂方法,其步骤:
1)以普通低碳冷轧钢带作为原料,进行常规的碱液脱脂除油;
2)常规水洗并烘干至钢带表面无水分;
3)在全氢保护气氛下进行退火,控制退火温度为620~640℃,并在此温度下保温5~10min;
4)进行镀覆:
A、电镀Ni-Cu合金,镀液为NiCl2+CuCl2酸性水溶液,控制NiCl2与CuCl2的摩尔浓度比例为4:0.50~0.85,电流密度为1.2~1.7A/dm2,电镀时间为5~8min;
B、常规水洗并烘干至钢带表面无水分;
C、物理气相沉积Ag-Au合金,控制Ag的质量百分比为65~75%,Au的质量百分比为35~25%,控制沉积速率为0.05~0.08μm/min,沉积时间为1~3min;
D、物理气相沉积Pd,控制沉积速率为0.02~0.04μm/min,沉积时间为4~6min;
E、离子注入Pt,控制注入能量为150~160KeV,Pt的注入剂量为(7~9)×1019/cm2;
F、自然冷却至室温。
优选地:电镀Ni-Cu过程中,NiCl2与CuCl2的摩尔浓度比例为4:0.58~0.80,电流密度为1.35~1.65A/dm2。
优选地:物理气相沉积Ag-Au合金过程中,Ag的质量百分比为68~73%,Au的质量百分比为32~27%,沉积速率为0.060~0.075μm/min。
优选地:物理气相沉积Pd过程中,沉积速率为0.025~0.035μm/min。
优选地:离子注入Pt过程中,注入能量为150~157KeV,Pt的注入剂量为(7.4~8.6)×1019/cm2。
本发明中主要工艺的机理及作用:
本发明之所以采用采用“碱液脱脂除油+全氢退火+电镀Ni-Cu合金+物理气相沉积Ag-Au合金+物理气相沉积Pd+离子注入Pt”工艺进行表面处理,是因为:
第一,冷轧钢带在进行镀覆处理前,必须保证其表面是洁净的,要进行适当的前处理。其中,脱脂主要用来除去钢带表面的油污,而全氢退火有三个作用:一是将钢带表面残存的极少量油脂全部高温挥发掉;二是在还原性氢气气氛下,将钢带表面少量的氧化物全部去除;三是适当软化钢带,降低钢带的内应力,减少产生裂纹的概率,提高复合镀层的稳定性。
第二,冷轧钢带在完成前处理后,在钢带表面电镀一层Ni-Cu合金作为内镀层。与传统工艺中“电镀Cu→电镀Ni”分段电镀所形成的Cu/Ni双镀层相比,合金中Ni和Cu之间亲和性好,彼此可以无限固溶,形成连续固溶体,即单相合金。在稳定性方面,Ni-Cu合金镀层明显要优于处于两相的Cu/Ni双镀层。此外,与单纯的Cu镀层相比,Ni-Cu合金镀层由于存在Ni元素,耐蚀性能大幅提高,增强了内镀层的稳定性。与单纯的Ni镀层相比,Ni-Cu合金镀层由于存在Cu元素,可以增强内镀层的导电性能和导热性能。因此,Ni-Cu合金镀层兼有Cu镀层和Ni镀层各自的优点,是理想的内镀层。再者,选择电镀Ni-Cu合金,将先前两个单独的电镀工序合并为一个,有利于缩短工艺流程、降低能耗和生产成本、减少废液排放。
第三,电镀Ni-Cu合金完成后,继续物理气相沉积一层Ag-Au合金作为中间镀层。这里选用物理气相沉积Ag-Au合金来代替电镀Ag,有四个原因:一是因为物理气相沉积无需使用剧毒的氰化物,极大地保护了环境。还可以做到镀层厚度精确控制,减少浪费,其稳定性和致密性得到大幅提高。二是由于是在真空条件下沉积合金,没有空气、水和其它杂质的存在,保证了合金的纯净度。同时,由于加入适量惰性的Au作为合金元素,形成Ag-Au合金,其抗氧化性能大大强于单纯的Ag镀层,减少了表面缺陷,提高了整个镀层的稳定性。三是Ag和Au彼此可以无限互溶,形成连续固溶体,即Ag-Au单相合金,其具有优良的导电性能、导热性能和延展性能,可以替代纯金属Ag。四是由于Cu、Ag、Au同属铜族元素,彼此具有高度的亲和性,在Ag-Au合金沉积在Ni-Cu合金上的过程中,两相界面的Ag、Au和Cu原子会发生合金化反应,增强了镀层之间的结合力,大幅提高整个镀层的稳定性。
第四,物理气相沉积Ag-Au合金完成后,继续物理气相沉积一层金属Pd作为Pt的预镀层。这里有两个原因:一是虽然Ag-Au合金的抗氧化性能很强,却很容易和硫化物发生反应,导致镀层变色,但Pd则不会。因此,在Ag-Au合金上再沉积一层Pd,将Ag-Au合金镀层彻底覆盖,保护Ag-Au镀层。二是Pt与Ag-Au合金中的主要成分Ag彼此之间只能有限互溶,相互间亲和性不强。如果直接在Ag-Au合金镀层上镀Pt,整个复合镀层的稳定性不会太高。但Pd则不同,其可以和Ag或Au互相无限互溶,形成连续固溶体。在物理气相沉积Pd的过程中,金属Pd在Ag-Au镀层界面将会发生Ag-Pd和Au-Pd的合金化反应。由于Pd和Pt同属铂族元素,它们之间部分化学性质相似,亲和性较强,用Pd镀层作为Pt的预镀层,既可以承担部分Pt的功能,又对提高整个复合镀层的稳定性十分有利。这里,之所以采用物理气相沉积Pd,而不是电镀Pd,主要是因为电镀Pd过程中,容易析出H2,而Pd恰好又是一种吸H2的金属,H2渗透到镀层里容易引起氢脆,导致镀层产生裂纹。此外,由于是在真空条件下沉积金属,没有空气、水和其它杂质的存在,保证了金属的纯净度。
第五,物理气相沉积Pd完成后,再继续离子注入Pt,形成最终的Pt镀层(外镀层)。Pd和Pt同属铂族元素,储量稀少,价格昂贵。鉴于钢带表面已经沉积了一层Pd镀层,如果再继续电镀或物理气相沉积一层较厚的Pt,其成本无疑会大幅增加,因此只能选择恰当的镀覆方式。这里采用离子注入Pt,在真空中将大量Pt原子掺杂渗透到Pd镀层的外部边界,最终在Pd镀层表面形成一极薄的、均匀性好、性能合格的Pt镀层。由于Pt和Pd同属铂族元素,亲和性好,因而Pt镀层可以完全地、牢固地附着在Pd镀层上。
总体来看,本发明所构建的Ni-Cu/Ag-Au/Pd/Pt复合镀层,具有如下优点:
一是除内镀层Ni-Cu合金外,其余元素Ag、Au、Pd和Pt均为贵金属,整体上保留了贵金属优良的理化性能,成色足,可以作为合适的Pt镀层;
二是所采用的Ni-Cu合金、Ag-Au合金及Pd,都是软合金或软金属,形成的镀层硬度适中,附着力强,有着良好的延展性和可塑性,加工性能好,保证了冲压制件时,不会出现脱落和裂纹,整个复合镀层的稳定性极高;
三是各个镀层中的合金元素彼此无限互溶,形成连续固溶体,呈现单相合金的性质,性能均匀性好。且各镀层之间的金属元素彼此亲和性强,容易在界面发生合金化反应。这说明整个复合镀层的构建是基于很强的金属原子内部作用力,而不是较弱的外部环境,因而就保证了整个镀层具有很高的稳定性。
本发明与现有技术相比:钢带表面生成了一层厚度为2~3μm的Ni-Cu/Ag-Au/Pd/Pt复合镀层,硬度为50~60HV,表面粗糙度为0.01~0.025μm,孔隙率不超过2个/cm2,镜面反射率为99.85~99.99%,镀层表面质量良好。电阻率为0.04~0.08μΩ·cm,热导率为370~380W/m·K,镀层的导电和导热性能良好。在常温25~35℃下连续放置5000d后,表面氧化面积不超过0.02%,失光率不超过0.03%。在高温350~400℃下连续放置5000h后,表面氧化面积不超过0.04%,失光率不超过0.05%,镀层的抗氧化性能良好。在100KHz超声波环境下连续放置5000h后,镀层厚度没有明显变化,也没有出现脱落和裂纹,镀层稳定性高,完全满足光电、通信、钟表、珠宝、精密仪表、医疗器械等行业的需要。
具体实施方式
下面对本发明予以详细描述:
表1为本发明各实施例及对比例的工艺参数;
表2为本发明各实施例及对比例的镀层性能。
本发明以下各实施例均按如下步骤实施:
1)以普通低碳冷轧钢带作为原料,进行常规的碱液脱脂除油;
2)常规水洗并烘干至钢带表面无水分;
3)在全氢保护气氛下进行退火,控制退火温度为620~640℃,并在此温度下保温5~10min;
4)进行镀覆:
A、电镀Ni-Cu合金,镀液为NiCl2+CuCl2酸性水溶液,控制NiCl2与CuCl2的摩尔浓度比例为4:0.50~0.85,电流密度为1.2~1.7A/dm2,电镀时间为5~8min;
B、常规水洗并烘干至钢带表面无水分;
C、物理气相沉积Ag-Au合金,控制Ag的质量百分比为65~75%,Au的质量百分比为35~25%,控制沉积速率为0.05~0.08μm/min,沉积时间为1~3min;
D、物理气相沉积Pd,控制沉积速率为0.02~0.04μm/min,沉积时间为4~6min;
E、离子注入Pt,控制注入能量为150~160KeV,Pt的注入剂量为(7~9)×1019/cm2;
F、自然冷却至室温。
表1本发明各实施例及对比例的工艺参数
表2本发明各实施例及对比例的镀层性能
从表2可以看到,按照本发明提出的工艺进行镀Pt,钢带表面生成一层厚度为2~3μm的Ni-Cu/Ag-Au/Pd/Pt复合镀层,硬度为50~60HV,表面粗糙度为0.01~0.025μm,孔隙率不超过2个/cm2,镜面反射率为99.85~99.99%,镀层表面质量良好。电阻率为0.04~0.08μΩ·cm,热导率为370~380W/m·K,镀层的导电和导热性能良好。在常温25~35℃下连续放置5000d后,表面氧化面积不超过0.02%,失光率不超过0.03%。在高温350~400℃下连续放置5000h后,表面氧化面积不超过0.04%,失光率不超过0.05%,镀层的抗氧化性能良好。此外,在100KHz超声波环境下连续放置5000h后,镀层厚度没有明显变化,也没有出现脱落和裂纹,镀层稳定性高,完全满足光电、通信、钟表、珠宝、精密仪表、医疗器械等行业的需要。
上述实施例仅为最佳例举,而并非是对本发明实施方式的限定。
Claims (5)
1.一种钢带表面镀铂方法,其步骤:
1)以普通低碳冷轧钢带作为原料,进行常规的碱液脱脂除油;
2)常规水洗并烘干至钢带表面无水分;
3)在全氢保护气氛下进行退火,控制退火温度在623~640℃,并在此温度下保温5~10min;
4)进行镀覆:
A、电镀Ni-Cu合金,镀液为NiCl2+CuCl2酸性水溶液,控制NiCl2与CuCl2的摩尔浓度比例为4:0.50~0.85,电流密度为1.2~1.7 A/dm2,电镀时间为5~8 min;
B、常规水洗并烘干至钢带表面无水分;
C、物理气相沉积Ag-Au合金,控制Ag的质量百分比为65~75%,Au的质量百分比为35~25%,控制沉积速率为0.05~0.08 µm/min,沉积时间为1~3 min;
D、物理气相沉积Pd,控制沉积速率为0.02~0.04 µm/min,沉积时间为4~6 min;
E、离子注入Pt,控制注入能量为150~160 KeV,Pt的注入剂量为(7~9)×1019/cm2;
F、自然冷却至室温。
2.如权利要求1所述的一种钢带表面镀铂方法,其特征在于:电镀Ni-Cu合金过程中,NiCl2与CuCl2的摩尔浓度比例为4:0.58~0.80,电流密度为1.35~1.65 A/dm2。
3.如权利要求1所述的一种钢带表面镀铂方法,其特征在于:物理气相沉积Ag-Au过程中,Ag的质量百分比为68~73%,Au的质量百分比为32~27%,沉积速率为0.060~0.075 µm/min。
4.如权利要求1所述的一种钢带表面镀铂方法,其特征在于:物理气相沉积Pd过程中,沉积速率为0.025~0.035 µm/min。
5.如权利要求1所述的一种钢带表面镀铂方法,其特征在于:离子注入Pt过程中,注入能量为150~157 KeV,Pt的注入剂量为(7.4~8.6)×1019/cm2。
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