CN111299189B - Chip type oxygen sensor ceramic chip automatic detection machine - Google Patents
Chip type oxygen sensor ceramic chip automatic detection machine Download PDFInfo
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- CN111299189B CN111299189B CN202010135161.7A CN202010135161A CN111299189B CN 111299189 B CN111299189 B CN 111299189B CN 202010135161 A CN202010135161 A CN 202010135161A CN 111299189 B CN111299189 B CN 111299189B
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- 239000000919 ceramic Substances 0.000 title claims abstract description 131
- 238000001514 detection method Methods 0.000 title claims abstract description 54
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 title claims abstract description 25
- 229910052760 oxygen Inorganic materials 0.000 title claims abstract description 25
- 239000001301 oxygen Substances 0.000 title claims abstract description 25
- 230000007246 mechanism Effects 0.000 claims abstract description 61
- 238000010438 heat treatment Methods 0.000 claims abstract description 34
- 230000007306 turnover Effects 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims 1
- 238000012216 screening Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 description 4
- 208000003464 asthenopia Diseases 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses an automatic chip detection machine for a chip type oxygen sensor, which comprises a machine body, a feeding identification mechanism, a linear moving mechanism, a rotating mechanism, a turnover mechanism, a heating detection system and a material receiving box. The feeding identification mechanism is used for feeding ceramic chips and identifying the placing state of the ceramic chips. The rotating mechanism is used for adjusting the front end position and the rear end position of the ceramic chip. The turnover mechanism is used for turning over the front side and the back side of the ceramic chip. The heating detection system heats the rear end of the ceramic chip, the front end of the ceramic chip is connected to the detection instrument to detect the resistance value of the ceramic chip in real time, whether the ceramic chip is qualified or not is judged according to the detected resistance value of the ceramic chip, and the ceramic chip is sent to the corresponding material receiving box. The ceramic chip resistance parameter detection device is simple in structure, reasonable in design and convenient to operate, automatic feeding, position identification and adjustment and resistance parameter detection and screening of ceramic chips are achieved, labor intensity of workers is reduced, and resistance parameter detection efficiency of the ceramic chips is improved.
Description
Technical Field
The invention relates to the technical field of ceramic chip detection, in particular to an automatic detection machine for a chip type oxygen sensor ceramic chip.
Background
With the continuous development of the automobile industry and increasingly stringent exhaust emission standards, the value of the oxygen sensor is gradually highlighted and the demand is increased as a key component for detecting the oxygen content in the automobile exhaust and controlling the fuel combustion ratio of the engine. The oxygen sensor can be roughly divided into a tube type and a sheet type, and compared with the oxygen sensor, the sheet type oxygen sensor becomes a mainstream product in the current market due to the advantages of faster effect, smaller heating power, shorter response time and the like.
The core technology of the chip type oxygen sensor is a ceramic chip technology, and the quality of the performance of the ceramic chip directly relates to the overall performance of the sensor, so that the detection of the ceramic chip is an important process in the production process of the oxygen sensor. At present, domestic enterprises stop in manual operation detection mostly, need the workman to collect the arrangement one by one with ceramic chip, put one by one according to the appointed state of putting and detect on detection device, select qualified ceramic chip according to the resistance parameter that detects by the workman to reject the defective products. The ceramic chip is in a strip sheet structure, is required to be placed according to a specified placement state when detecting resistance parameters, and is easy to cause eyestrain and errors by manually identifying the front side and the back side, and the front end and the back end, so that the efficiency is low; when the ceramic chip is detected, the rear end of the ceramic chip needs to be heated, and certain safety problems, time and labor are caused in manual operation. In order to improve the detection speed and accuracy of the oxygen sensor ceramic chip and effectively avoid misoperation caused by repeated operation and visual fatigue of workers, automatic detection equipment for the chip oxygen sensor ceramic chip is urgently needed.
Disclosure of Invention
The purpose of the invention is as follows: in order to solve the defects of the prior art, the invention provides the automatic detection machine for the chip type oxygen sensor ceramic chip, which has the advantages of simple structure, reasonable design and convenient use, can realize the automatic feeding, position identification adjustment and resistance parameter detection and screening of the chip type oxygen sensor ceramic chip, reduces the labor intensity of workers and improves the detection efficiency of the ceramic chip.
The technical scheme is as follows: an automatic detection machine for a chip type oxygen sensor ceramic chip comprises a machine body, a feeding identification mechanism, a linear moving mechanism, a rotating mechanism, a turnover mechanism, a heating detection system, a qualified product receiving box and an unqualified product receiving box;
the machine body is used for supporting and fixing the feeding identification mechanism, the linear moving mechanism, the rotating mechanism, the turnover mechanism, the heating detection system, the qualified product collecting box and the unqualified product collecting box;
the feeding identification mechanism is arranged on the machine body and used for feeding the ceramic chips and identifying the placing states of the ceramic chips; the feeding identification mechanism comprises a mounting plate support, a mounting plate, a connecting plate, a guide rail, a sliding block assembly, a feeding plate, a feeding barrel, an image identification sensor and a three-position cylinder; the mounting plate is supported and mounted on the machine body through a mounting plate, and a guide rail, a sliding block assembly, a charging barrel and an image recognition sensor are mounted on the mounting plate; the guide rail and the sliding block component are arranged on the mounting plate; the bottom surface of the feeding plate is connected with the guide rail and the sliding block of the sliding block component, the side surface of the feeding plate is connected with the connecting plate, a square groove is formed in the feeding plate, the length and width of the square groove are the same as the size of the ceramic chip, and the depth of the square groove is slightly smaller than the thickness of the ceramic chip, so that only one ceramic chip is carried to the next station each time; the feeding plate is connected with the three-position cylinder through a connecting plate, and the control system controls the three-position cylinder to drive the feeding plate to move left and right, so that the switching of three stations of the feeding plate is realized; the three stations comprise an initial feeding station, a middle recognition station and a suction station. The method comprises the following steps that (1) a feeding station is started, a square groove of a feeding plate is located right below an upper feeding barrel, and a ceramic chip in the upper feeding barrel falls into the square groove of the feeding plate to finish feeding; the ceramic chip is carried by the square groove of the feeding plate and is positioned right below the image recognition sensor, and the ceramic chip placement state is recognized; a suction station, wherein the square groove of the feeding plate carries the ceramic chip to be positioned above the rotating mechanism;
the linear moving mechanism is used for realizing the transmission of the ceramic chip among various procedures; the linear moving mechanism comprises a linear module, a module support, a module connecting plate, a cylinder mounting plate, an up-and-down pushing cylinder, a sucker support and a sucker; the linear module is arranged on the machine body through the module support; the module connecting plate is arranged on the linear module; the cylinder mounting plate is connected with the module connecting plate; the upper pushing cylinder and the lower pushing cylinder are arranged on the cylinder mounting plate; the sucker is arranged on the sucker bracket and is used for sucking the ceramic chip; the sucker support is connected with the upper pushing cylinder and the lower pushing cylinder; the control system controls the up-and-down pushing cylinder to drive the sucker to move up and down, so that the ceramic chip is sucked; the control system controls the linear module to drive the vertical pushing cylinder to move left and right, so that the ceramic chips are transferred between the working procedures;
the rotating mechanism is arranged on the machine body and used for realizing the adjustment of the front end position and the rear end position of the ceramic chip; the rotating mechanism comprises an arched base, a swing cylinder and a square material placing table; the arched base is fixed on the machine body and used for mounting the swing cylinder; the square material placing table is arranged on the swing cylinder; the square material placing table is provided with a square groove for placing a ceramic chip; the control system controls the swing cylinder to drive the square material placing table to rotate 180 degrees, so that the front end position and the rear end position of the ceramic chip are adjusted;
the turnover mechanism is arranged on the machine body and used for turning over the front side and the back side of the ceramic chip; the turnover mechanism comprises a pneumatic sliding table, a rack mounting plate, a rack, a gear shaft, a bearing seat and a turnover plate; the pneumatic sliding table is arranged on the machine body; the rack mounting plate is fixed on the pneumatic sliding table; the rack is arranged on the rack mounting plate; the gears are arranged at two ends of the gear shaft and meshed with the racks; the gear shaft is arranged on the bearing block; the turnover plate is fixed on the gear shaft and used for placing a ceramic chip; the control system controls the pneumatic sliding table to move to drive the rack mounting plate to move leftwards, and the gear and the rack are meshed for transmission to drive the turnover plate to rotate clockwise, so that the front and the back of the ceramic chip are turned over;
the heating detection system is arranged on the machine body and used for carrying out resistance detection on the ceramic chip; the heating detection system comprises a loop-shaped material placing table, a heating device, a pushing cylinder, a cylinder support, a connector and a limiting plate; the clip-shaped material placing table is fixed on the machine body and used for placing the ceramic chip; the heating device is arranged on the machine body and used for heating the rear end of the ceramic chip; the pushing cylinder is arranged on a cylinder support, and the cylinder support is arranged on the machine body; the connector is connected with the pushing cylinder, the heating device heats the rear end of the ceramic chip, the control system controls the pushing cylinder to push the connector to the front end of the ceramic chip, the connector is connected with the front end of the ceramic chip, and the resistance detection of the ceramic chip is realized through the detection instrument; the limiting plate is installed on the heating device.
Has the advantages that: the ceramic chip resistance parameter detection device is simple in structure, reasonable in design and convenient to operate, automatic feeding, position identification and adjustment and resistance parameter detection and screening of ceramic chips are achieved, labor intensity of workers is reduced, and resistance parameter detection efficiency of the ceramic chips is improved.
Drawings
FIG. 1 is a schematic diagram of the external structure of a chip-type oxygen sensor ceramic chip;
FIG. 2 is a schematic view of the overall structure of an automatic detection machine for a ceramic chip of a chip oxygen sensor;
FIG. 3 is a schematic structural view of a feeding identification mechanism and a rotation mechanism;
FIG. 4 is a schematic structural view of a linear moving mechanism;
FIG. 5 is a schematic structural view of the turnover mechanism and the heating detection system;
fig. 6 is a schematic view of the ceramic chip in a heating detection state.
Detailed description of the invention
The technical solutions in the embodiments of the present invention are clearly and completely described below to enable those skilled in the art to better understand the advantages and features of the present invention, so as to define the protection scope of the present invention more clearly. The embodiments described herein are only a few embodiments of the present invention, rather than all embodiments, and all other embodiments that can be derived by one of ordinary skill in the art without making any creative effort based on the embodiments of the present invention belong to the protection content of the present invention.
Examples
The core technology of the chip type oxygen sensor is a ceramic chip technology, the performance of the ceramic chip directly influences the overall performance of the oxygen sensor, and therefore the ceramic chip needs to be subjected to qualified detection before the ceramic chip is assembled, and unqualified products are removed. FIG. 1 is a schematic diagram of the external structure of a chip type oxygen sensor. When detecting the piece formula oxygen sensor ceramic chip, require it openly up, ceramic chip's rear end is located the heating position, and ceramic chip's front end is connected to instrumentation and carries out resistance detection to ceramic chip response part, judges ceramic chip qualified according to the resistance value that detects among the ceramic chip heating process.
As shown in fig. 2 to 6, the automatic detection machine for the chip type oxygen sensor ceramic chip of the present invention comprises a machine body 1, a feeding identification mechanism 2, a linear moving mechanism 3, a rotating mechanism 4, a turnover mechanism 5, a heating detection system 6, a qualified product receiving box 7, and an unqualified product receiving box 8;
the machine body 1 is used for supporting and fixing a feeding identification mechanism 2, a linear moving mechanism 3, a rotating mechanism 4, a turnover mechanism 5, a heating detection system 6, a qualified product receiving box 7 and an unqualified product receiving box 8;
the feeding identification mechanism 2 is arranged on the machine body 1 and is used for feeding ceramic chips and identifying the placing states of the ceramic chips; the feeding identification mechanism 2 comprises a mounting plate support 201, a mounting plate 202, a connecting plate 203, a guide rail and slide block assembly 204, a feeding plate 205, a feeding barrel 206, an image identification sensor 207 and a three-position air cylinder 208; the mounting plate 202 is mounted on the machine body 1 through a mounting plate support 201, and the mounting plate 202 is provided with a guide rail and slide block assembly 204, an upper charging barrel 206 and an image recognition sensor 207; the guide and slide assembly 204 is mounted on the mounting plate 202; the bottom surface of the feeding plate 205 is connected with the slide block of the guide rail and slide block assembly 204, the side surface of the feeding plate is connected with the connecting plate 203, a square groove is formed in the feeding plate 205, the length and width of the square groove are the same as the size of the ceramic chip, the depth of the square groove is slightly smaller than the thickness of the ceramic chip, and the feeding plate is enabled to carry only one ceramic chip to the next station each time; the feeding plate 205 is connected with the three-position air cylinder 208 through the connecting plate 203, and the control system controls the three-position air cylinder 208 to drive the feeding plate 205 to move left and right, so that the three stations of the feeding plate 205 are switched; the three stations comprise an initial feeding station, a middle recognition station and a suction station. At the initial feeding station, the square groove of the feeding plate 205 is positioned right below the upper charging barrel 206, and the ceramic chip in the upper charging barrel 206 falls into the square groove of the feeding plate 205 to finish feeding; in the intermediate recognition station, the ceramic chip carried by the square groove of the feeding plate 205 is positioned right below the image recognition sensor 207, so that the ceramic chip placement state is recognized; a suction station, wherein the square groove of the feeding plate 205 carries the ceramic chip to be positioned above the rotating mechanism 4;
the linear moving mechanism 3 is used for realizing the transmission of the ceramic chip among various processes; the linear moving mechanism 3 comprises a linear module 301, a module support 302, a module connecting plate 303, an air cylinder mounting plate 304, an up-down pushing air cylinder 305, a sucker support 306 and a sucker 307; the linear module 301 is mounted on the machine body 1 through a module support 302; the module connecting plate 303 is installed on the linear module 301; the cylinder mounting plate 304 is connected with the module connecting plate 303; the upper and lower pushing cylinders 305 are arranged on the cylinder mounting plate 304; the suction cup 307 is mounted on the suction cup support 306 and is used for sucking the ceramic chip; the sucker bracket 306 is connected with an upper pushing cylinder 305 and a lower pushing cylinder 305; the control system controls the up-and-down pushing cylinder 305 to drive the sucker 307 to move up and down, so that the ceramic chip is sucked; the control system controls the linear module 301 to drive the up-and-down pushing cylinder 305 to move left and right, so that the ceramic chips are transferred among the working procedures;
the rotating mechanism 4 is arranged on the machine body 1 and used for realizing the adjustment of the front end position and the rear end position of the ceramic chip; the rotating mechanism 4 comprises an arched base 401, a swing cylinder 402 and a square material placing table 403; the arched base 401 is fixed on the machine body 1 and used for installing a swing cylinder 402; the square material placing table 403 is arranged on the swing cylinder 402; the square material placing table 403 is provided with a square groove for placing a ceramic chip; the control system controls the swing cylinder 402 to drive the square material placing table 403 to rotate 180 degrees, so that the front end position and the rear end position of the ceramic chip are adjusted;
the turnover mechanism 5 is arranged on the machine body 1 and used for turning over the front side and the back side of the ceramic chip; the turnover mechanism 5 comprises a pneumatic sliding table 501, a rack mounting plate 502, a rack 503, a gear 504, a gear shaft 505, a bearing seat 506 and a turnover plate 507; the pneumatic sliding table 501 is mounted on the machine body 1; the rack mounting plate 502 is fixed on the pneumatic sliding table 501; the rack 503 is mounted on the rack mounting plate 502; the gears 504 are arranged at two ends of a gear shaft 505, and the gears 504 are meshed with the racks 503; the gear shaft 505 is mounted on a bearing seat 506; the turning plate 507 is fixed on the gear shaft 505 and used for placing a ceramic chip; the control system controls the pneumatic sliding table 501 to move to drive the rack mounting plate 502 to move leftwards, the gear 504 and the rack 503 are meshed for transmission to drive the turnover plate 507 to rotate clockwise, and the front and the back of the ceramic chip are turned over;
the heating detection system 6 is arranged on the machine body 1 and used for carrying out resistance detection on the ceramic chip; the heating detection system 6 comprises a clip-shaped material placing table 601, a heating device 602, a pushing cylinder 603, a cylinder support 604, a connector 605 and a limiting plate 606; the clip-shaped material placing table 601 is fixed on the machine body 1 and used for placing a ceramic chip; the heating device 602 is installed on the machine body 1 and used for heating the rear end of the ceramic chip; the pushing cylinder 603 is arranged on a cylinder support 604, and the cylinder support 604 is arranged on the machine body 1; the connector 605 is connected with the pushing cylinder 603, the heating device 602 heats the rear end of the ceramic chip, the control system controls the pushing cylinder 603 to push the connector 605 to the front end of the ceramic chip, the connector 605 is connected with the front end of the ceramic chip, and the detection of the resistance parameters of the ceramic chip is realized through the detection instrument; the limiting plate 606 is mounted on the heating device 602;
the qualified product collecting box 7 is placed at a designated position of the machine body 1 and is used for collecting qualified ceramic chips;
the unqualified product collecting box 8 is placed at the designated position of the machine body 1 and used for collecting unqualified ceramic chips.
The ceramic chip resistance parameter detection device is simple in structure, reasonable in design and convenient to operate, automatic feeding, position identification and adjustment and resistance parameter detection and screening of ceramic chips are achieved, labor intensity of workers is reduced, and resistance parameter detection efficiency of the ceramic chips is improved.
Claims (1)
1. The utility model provides a piece formula oxygen sensor ceramic chip automated inspection machine for piece formula oxygen sensor ceramic chip's resistance parameter detects its characterized in that: the automatic detection machine comprises a machine body (1), a feeding identification mechanism (2), a linear moving mechanism (3), a rotating mechanism (4), a turnover mechanism (5), a heating detection system (6), a qualified product receiving box (7) and an unqualified product receiving box (8);
the machine body (1) is used for supporting and fixing a feeding identification mechanism (2), a linear moving mechanism (3), a rotating mechanism (4), a turnover mechanism (5), a heating detection system (6), a qualified product receiving box (7) and an unqualified product receiving box (8);
the feeding identification mechanism (2) is arranged on the machine body (1) and is used for feeding ceramic chips and identifying the placing states of the ceramic chips; the feeding identification mechanism (2) comprises a mounting plate support (201), a mounting plate (202), a connecting plate (203), a guide rail and sliding block assembly (204), a feeding plate (205), a feeding barrel (206), an image identification sensor (207) and a three-position air cylinder (208); the mounting plate (202) is mounted on the machine body (1) through a mounting plate support (201), and a guide rail and sliding block assembly (204), an upper charging barrel (206) and an image recognition sensor (207) are mounted on the mounting plate (202); the guide rail and slide block assembly (204) is mounted on the mounting plate (202); the bottom surface of the feeding plate (205) is connected with the guide rail and the slide block of the slide block component (204), the side surface of the feeding plate is connected with the connecting plate (203), a square groove is formed in the feeding plate (205), the length and width of the square groove are the same as the size of the ceramic chip, the depth of the square groove is slightly smaller than the thickness of the ceramic chip, and the fact that only one ceramic chip is carried to the next station every time is guaranteed; the feeding plate (205) is connected with the three-position air cylinder (208) through the connecting plate (203), and the control system controls the three-position air cylinder (208) to drive the feeding plate (205) to move left and right, so that the switching of three stations of the feeding plate (205) is realized; the three stations comprise an initial feeding station, a middle recognition station and a suction station;
the linear moving mechanism (3) is used for realizing the transmission of the ceramic chip among various processes; the linear moving mechanism (3) comprises a linear module (301), a module support (302), a module connecting plate (303), an air cylinder mounting plate (304), an up-and-down pushing air cylinder (305), a sucker support (306) and a sucker (307); the linear module (301) is arranged on the machine body (1) through a module support (302); the module connecting plate (303) is arranged on the linear module (301); the cylinder mounting plate (304) is connected with the module connecting plate (303); the upper and lower pushing cylinders (305) are arranged on a cylinder mounting plate (304); the sucker (307) is arranged on the sucker bracket (306) and is used for sucking the ceramic chip; the sucker support (306) is connected with an upper pushing cylinder (305) and a lower pushing cylinder (305); the control system controls the up-down pushing cylinder (305) to drive the sucker (307) to move up and down, so that the ceramic chip is sucked; the control system controls the linear module (301) to drive the up-down pushing cylinder (305) to move left and right, so that the ceramic chip is transferred between the working procedures;
the rotating mechanism (4) is arranged on the machine body (1) and is used for realizing the adjustment of the front end position and the rear end position of the ceramic chip; the rotating mechanism (4) comprises an arched base (401), a swing cylinder (402) and a square material placing table (403); the arched base (401) is fixed on the machine body (1) and is used for installing a swing cylinder (402); the square material placing table (403) is arranged on the swing cylinder (402); the square material placing table (403) is provided with a square groove for placing a ceramic chip; the control system controls the swing cylinder (402) to drive the square material placing table (403) to rotate 180 degrees, so that the front end position and the rear end position of the ceramic chip are adjusted;
the turnover mechanism (5) is arranged on the machine body (1) and is used for turning over the front side and the back side of the ceramic chip; the turnover mechanism (5) comprises a pneumatic sliding table (501), a rack mounting plate (502), a rack (503), a gear (504), a gear shaft (505), a bearing seat (506) and a turnover plate (507); the pneumatic sliding table (501) is arranged on the machine body (1); the rack mounting plate (502) is fixed on the pneumatic sliding table (501); the rack (503) is arranged on the rack mounting plate (502); the gears (504) are arranged at two ends of a gear shaft (505), and the gears (504) are meshed with the racks (503); the gear shaft (505) is arranged on a bearing seat (506); the turnover plate (507) is fixed on the gear shaft (505) and used for placing a ceramic chip; the control system controls the pneumatic sliding table (501) to move to drive the rack mounting plate (502) to move leftwards, the gear (504) and the rack (503) are in meshing transmission to drive the turnover plate (507) to rotate clockwise, and the front and the back of the ceramic chip are turned over;
the heating detection system (6) is arranged on the machine body (1) and used for carrying out resistance detection on the ceramic chip; the heating detection system (6) comprises a clip-shaped material placing table (601), a heating device (602), a pushing cylinder (603), a cylinder support (604), a connector (605) and a limiting plate (606); the clip-shaped material placing table (601) is fixed on the machine body (1) and used for placing a ceramic chip; the heating device (602) is arranged on the machine body (1) and is used for heating the rear end of the ceramic chip; the pushing cylinder (603) is arranged on a cylinder support (604), and the cylinder support (604) is arranged on the machine body (1); the connector (605) is connected with the pushing cylinder (603), the heating device (602) heats the rear end of the ceramic chip, the control system controls the pushing cylinder (603) to push the connector (605) to the front end of the ceramic chip, the connector (605) is connected with the front end of the ceramic chip, and the detection of the resistance parameters of the ceramic chip is realized through the detection instrument; the limiting plate (606) is arranged on the heating device (602);
the qualified product collecting box (7) is placed on the machine body (1) and is used for collecting qualified ceramic chips;
the unqualified product collecting box (8) is placed on the machine body (1) and used for collecting unqualified ceramic chips.
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CN202010135161.7A CN111299189B (en) | 2020-03-02 | 2020-03-02 | Chip type oxygen sensor ceramic chip automatic detection machine |
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CN202010135161.7A CN111299189B (en) | 2020-03-02 | 2020-03-02 | Chip type oxygen sensor ceramic chip automatic detection machine |
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CN115775761B (en) * | 2023-02-09 | 2023-09-22 | 深圳市昌富祥智能科技有限公司 | Automatic detection device for wafer chip production |
CN117630555B (en) * | 2023-12-11 | 2024-05-03 | 山东中庆环保科技有限公司 | Detection device for waste storage battery charger |
CN117840070B (en) * | 2024-01-31 | 2024-08-13 | 武汉软件工程职业学院(武汉开放大学) | Optical detection system and method for surface defects of electronic components |
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US4889242A (en) * | 1985-06-04 | 1989-12-26 | Multitest Elektronische Systeme | Device for testing and sorting electronic components, more particularly integrated circuit chips |
JP2000074639A (en) * | 1998-09-03 | 2000-03-14 | Mitsubishi Materials Corp | Automatic visual inspection machine |
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CN106733733A (en) * | 2016-12-30 | 2017-05-31 | 东莞市五鑫自动化科技有限公司 | A kind of sensor automatic detecting machine |
CN106981437B (en) * | 2017-03-09 | 2020-12-08 | 铜陵三佳山田科技股份有限公司 | Sorting detection process and equipment for QFN-BGA semiconductor chip |
CN110329780B (en) * | 2019-08-15 | 2020-11-10 | 姚杭 | Automatic feeding device of ceramic heating plate based on sensor |
CN110694949A (en) * | 2019-10-30 | 2020-01-17 | 贝肯智能科技(苏州)有限公司 | Automatic testing and sorting machine for ceramic heating sheets |
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