CN111295036A

CN111295036A - SSPC board card structure and box comprising same

Info

Publication number: CN111295036A
Application number: CN201811498032.3A
Authority: CN
Inventors: 万波
Original assignee: Shanghai Aviation Electric Co Ltd
Current assignee: Shanghai Aviation Electric Co Ltd
Priority date: 2018-12-07
Filing date: 2018-12-07
Publication date: 2020-06-16
Anticipated expiration: 2038-12-07
Also published as: CN111295036B

Abstract

The invention discloses an SSPC board card structure, which comprises a first SSPC board card, a second SSPC board card and a third SSPC board card, wherein the first SSPC board card comprises a first metal-based PCB board; a second SSPC board comprising a second metal-based PCB opposite to the first metal-based PCB, wherein the metal-based side of the first metal-based PCB is opposite to the metal-based side of the second metal-based PCB; and the liquid cooling pipeline is positioned between the metal base side surface of the first metal base PCB and the metal base side surface of the second metal base PCB, and is used for radiating the first metal base PCB and the second metal base PCB. The invention has the beneficial effects that: a metal-based PCB is adopted as a primary heat conduction path of the MOS tube. A liquid cooling pipeline is adopted to be tightly attached to the metal base PCB, so that heat is taken away.

Description

SSPC board card structure and box comprising same

Technical Field

The invention relates to an SSPC board card structure body and a box body comprising the same.

Background

A Solid State Power Controller (SSPC) obtains a channel control instruction from an external bus based on a Power electronic technology and a communication technology, and performs on/off control of a load. In abnormal situations (such as overload or short circuit), the SSPC can cut off the load and protect the aircraft distribution network. The SSPC has both the protection function of the conventional circuit breaker and the load on/off function of the contactor/relay, and can feed back the channel state in real time, so that the SSPC is widely applied to modern airplanes (a 380, B787, a350, C919, and the like).

At present, SSPC is limited to small current specification applications, for example, at B787, the maximum throughput of a single board is only 50A, i.e. only 50A of power input can be accepted at maximum. There are two main reasons for this situation:

the traditional SSPC based on the separated power MOS parallel technology has large volume and low power density when processing large current.

Without good heat dissipation measures, the power dissipation of the power MOS during normal operation cannot be effectively taken away.

For devices that cannot be installed in a distribution box, but are distributed throughout the aircraft in the form of RPDUs, to handle large currents, approaches to the problem are being re-conceived, including both power dissipation and power input.

Disclosure of Invention

The invention aims to solve the technical problem of heat dissipation of large-current SSPC and provides a novel SSPC board card structure body and a box body comprising the same.

In order to achieve the purpose, the technical scheme of the invention is as follows: the SSPC board card structure comprises a plurality of SSPC board card structures,

a first SSPC board card comprising a first metal-based PCB board;

a second SSPC board comprising a second metal-based PCB opposite to the first metal-based PCB, wherein the metal-based side of the first metal-based PCB is opposite to the metal-based side of the second metal-based PCB; and the number of the first and second groups,

and the liquid cooling pipeline is positioned between the metal base side surface of the first metal base PCB and the metal base side surface of the second metal base PCB, and is used for radiating the first metal base PCB and the second metal base PCB.

As a preferred embodiment of the SSPC board structure, a first groove is formed on a metal-based side surface of the first metal-based PCB, a second groove corresponding to the first groove is formed on a metal-based side surface of the second metal-based PCB, the first groove and the second groove fix the liquid cooling pipeline together, and the liquid cooling pipeline is in surface contact with the first groove and the second groove respectively.

The preferred embodiments of the SSPC board structure further include,

the fixed inserted block is provided with a first vertical part, a second vertical part and a third vertical part which are sequentially arranged, the first vertical part and the second vertical part are fixed with the first metal-based PCB, and the second vertical part and the third vertical part are fixed with the second metal-based PCB. Further, the fixed insert also has a transverse portion, and the transverse portion is respectively connected with the first vertical portion, the second vertical portion and the third vertical portion.

As a preferable scheme of the SSPC board structure, a first fixing through hole is formed in the first vertical portion, and a first fastening member is used to penetrate through the first fixing through hole to fasten the first metal-based PCB; and a second transverse fixing through hole is formed on the second vertical part, and a second fastener penetrates through the second fixing through hole to fasten the second metal-based PCB.

As a preferred embodiment of the SSPC board structure, the first SSPC board has a plurality of first power channels formed on the first metal-based PCB and arranged along a first direction, the liquid cooling pipe extends in a serpentine shape along the first direction, and the liquid cooling pipe sequentially passes through each of the first power channels; the second SSPC board card has a plurality of second power channels formed on the second metal-based PCB board and the second power channels correspond to the first power channels.

The invention also provides a box body containing the SSPC board card structural body, which is distributed on the airplane in an RPDU form and comprises,

a box body having a body wall surface on which a box bus bar is formed; and the number of the first and second groups,

the plurality of SSPC board card structural bodies are accommodated in the box body;

each SSPC board card structure is powered by the box bus bar.

As a preferable scheme of the box body including the SSPC board structures, the plurality of SSPC board structures are arranged along a second direction, the box body bus bar extends in a serpentine shape along the second direction, and the box body bus bar sequentially passes through each of the SSPC board structures.

As a preferable scheme of the box body including the SSPC board structure, the SSPC board structure is detachably fixed to the wall surface of the body.

Compared with the prior art, the invention has the beneficial effects that: (1) a metal-based PCB is adopted as a primary heat conduction path of the MOS tube; (2) a liquid cooling pipeline is adopted to be tightly attached to the metal base PCB, so that heat is taken away; (3) the power density is improved by adopting the structural design that two SSPCs multiplex the same liquid cooling pipeline back to back; (4) the box bus bar can conduct current to the SSPC, has a structure fixing effect, and supports online plugging of the SSPC board card.

In addition to the technical problems addressed by the present invention, the technical features constituting the technical solutions, and the advantageous effects brought by the technical features of the technical solutions described above, other technical problems solved by the present invention, other technical features included in the technical solutions, and advantageous effects brought by the technical features will be described in further detail with reference to the accompanying drawings.

Drawings

Fig. 1 is a schematic structural diagram of an SSPC board structure.

Fig. 2 is a front layout view of the SSPC board card structure.

Fig. 3 is a reverse layout view of the SSPC board card structure.

Fig. 4 is an enlarged view of a portion of the liquid cooling ducts in the SSPC board card structure.

Fig. 5 is a schematic structural diagram of an SSPC board structure (with a fixing insert).

Fig. 6 is a schematic structural diagram of a box containing an SSPC board structure.

Fig. 7 is a schematic structural view of a box bus bar in a box including an SSPC board card structure.

Fig. 8 is a schematic structural diagram of an SSPC board structure in a box including the SSPC board structure.

Detailed Description

The present invention will be described in further detail below with reference to specific embodiments and drawings. Here, the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

Referring to fig. 1 to 5, an SSPC board structure is shown. The SSPC board card structure body mainly comprises a first SSPC board card 1, a second SSPC board card 2, a liquid cooling pipeline 3, a fixed embedded block 4 and the like.

The first SSPC board 1 includes a first metal-based PCB 10.

The second SSPC board 2 includes a second metal-based PCB 20 opposite the first metal-based PCB 10. The metal-based side of the first metal-based PCB 10 faces the metal-based side of the second metal-based PCB 20.

The liquid cooling pipe 3 is internally filled with cooling liquid, flows in from the rear part of the case and flows out from the panel side of the case. The liquid cooling pipeline 3 is used for radiating the first metal-based PCB 10 and the second metal-based PCB 20. The liquid cooling pipeline 3 is located between the metal base side of the first metal base PCB 10 and the metal base side of the second metal base PCB 20. In this embodiment, a first groove is formed on the metal-based side surface of the first metal-based PCB 10. The metal-based side of the second metal-based PCB panel 20 is formed with a second groove corresponding to the first groove. The first groove and the second groove are jointly used for fixing the liquid cooling pipeline 3, and the liquid cooling pipeline 3 is in surface contact with the first groove and the second groove respectively. The purpose is, increase the area of contact of the liquid cooling pipeline 3 with the first metal base PCB board 10 and the second metal base PCB board 20.

The metal-based side surface is a heat conduction path and a flow guide path.

The fixed insert 4 has a first vertical portion, a second vertical portion and a third vertical portion which are arranged in sequence. The fixed insert 4 further has a transverse portion that connects the first vertical portion, the second vertical portion, and the third vertical portion, respectively. The whole body is in a structure like a Chinese character 'shan'. The first metal-based PCB 10 is fixed between the first vertical portion and the second vertical portion. The second metal-based PCB 20 is fixed between the second vertical portion and the third vertical portion.

The first vertical portion is formed with a first horizontal fixing through hole through which a first fastener is passed to fasten the first metal-based PCB 10. A second fixing through hole is formed in the second vertical portion in a horizontal direction, and a second fastening member is inserted through the second fixing through hole to fasten the second metal-based PCB panel 20.

The first SSPC board 1 has a plurality of first power channels 11 formed on the first metal based PCB board 10 and arranged in a first direction. The liquid cooling pipeline 3 extends in the first direction in a snake shape, and the liquid cooling pipeline 3 sequentially passes through the first power channels 11. The second SSPC board 2 has a plurality of second power channels 21 formed on the second metal-based PCB 20 and the second power channels 21 correspond to the first power channels 11.

Referring to fig. 6 to 8, a box containing SSPC board structures is shown, distributed on an aircraft in the form of RPDUs. The box body mainly comprises a box body 5, a plurality of SSPC board card structural bodies 100 and the like.

The case body 5 has a body wall surface 50. The body wall surface 50 is formed with a box bus bar 6. The plurality of SSPC board structures 100 are accommodated in the box body 5. Each SSPC card structure 100 is powered by the cabinet bus 6.

The plurality of SSPC board structures 100 are arranged along a second direction. The box bus bar extends in the second direction in a snake shape and sequentially passes through the SSPC board card structures. In this embodiment, the vertical portion contacts the SSPC board card to provide power input thereto, and also serves as a fixing function. The transverse part plays a role of connecting a bus bar and keeps the continuity of current. The transverse support at the rightmost side extends out of the box body and is used for being connected with an external bus bar. The transverse support is required to be insulated at the part contacting with the chassis. Meanwhile, the installation surface of the cabinet is also subjected to insulation treatment.

The SSPC board structure 100 is detachably fixed to the wall surface of the body.

The foregoing merely represents embodiments of the present invention, which are described in some detail and detail, and therefore should not be construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

An SSPC board card structure, which is characterized by comprising,

a first SSPC board card comprising a first metal-based PCB board;

a second SSPC board comprising a second metal-based PCB opposite to the first metal-based PCB, wherein the metal-based side of the first metal-based PCB is opposite to the metal-based side of the second metal-based PCB; and the number of the first and second groups,

and the liquid cooling pipeline is positioned between the metal base side surface of the first metal base PCB and the metal base side surface of the second metal base PCB, and is used for radiating the first metal base PCB and the second metal base PCB.
2. The SSPC board card structure of claim 1, wherein a first groove is formed on a metal-based side surface of the first metal-based PCB, a second groove corresponding to the first groove is formed on a metal-based side surface of the second metal-based PCB, the first groove and the second groove jointly fix the liquid cooling pipe, and the liquid cooling pipe is in surface contact with the first groove and the second groove, respectively.
3. The SSPC board structure of claim 2, further comprising,

the fixed inserted block is provided with a first vertical part, a second vertical part and a third vertical part which are sequentially arranged, the first vertical part and the second vertical part are fixed with the first metal-based PCB, and the second vertical part and the third vertical part are fixed with the second metal-based PCB.
4. The SSPC board structure of claim 3, wherein the fixing insert further has a transverse portion connecting the first, second and third vertical portions, respectively.
5. The SSPC board structure of claim 3, wherein the first vertical portion has a first through hole formed therein, and a first fastener is used to pass through the first through hole to fasten the first metal-based PCB; and a second transverse fixing through hole is formed on the second vertical part, and a second fastener penetrates through the second fixing through hole to fasten the second metal-based PCB.
6. The SSPC board structure of claim 2, wherein the first SSPC board has a plurality of first power channels formed on the first metal-based PCB and arranged along a first direction, the liquid cooling conduit extends in a serpentine shape along the first direction and the liquid cooling conduit passes through each of the first power channels in sequence; the second SSPC board card has a plurality of second power channels formed on the second metal-based PCB board and the second power channels correspond to the first power channels.
7. The box body containing the SSPC board card structural body is distributed on the airplane in an RPDU form, and is characterized by comprising,

a box body having a body wall surface on which a box bus bar is formed; and the number of the first and second groups,

a plurality of SSPC board structures of any of claims 1-6 housed within the box body;

each SSPC board card structure is powered by the box bus bar.
8. The cabinet of claim 7, wherein a plurality of the SSPC card structures are arranged in a second direction, the cabinet bus bars extend in a serpentine shape in the second direction and the cabinet bus bars pass over each of the SSPC card structures in sequence.
9. The housing containing an SSPC card structure of claim 7, wherein the SSPC card structure is removably secured to the body wall.