CN111283331A

CN111283331A - Laser etching device

Info

Publication number: CN111283331A
Application number: CN202010130905.6A
Authority: CN
Inventors: 胡平均
Original assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Current assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date: 2020-02-28
Filing date: 2020-02-28
Publication date: 2020-06-16

Abstract

The application discloses a laser etching device, which comprises an installation table, a laser etching head, a protection part and a gas absorption part; the laser etching head and the shield are disposed on a bottom side of the mounting table, the shield being disposed around the laser etching head to form a dust suction cavity; the air suction piece is provided with an air suction pipe, and the air inlet end of the air suction pipe is communicated with the dust suction cavity. The laser etching device is used for carrying out laser etching on the common electrode film layer, the air suction piece is in a working state, particles generated in the etching process and gasified ion powder are sucked into the dust suction cavity by suction force generated by the air suction end of the air suction pipe and then are sucked into the air suction pipe, the particles generated in the etching process are prevented from being left over and polluting the surface of the color film substrate, the appearance and the electrical property yield of a product are improved, and meanwhile, the cleanliness of the interior of the laser etching device can be greatly improved.

Description

Laser etching device

Technical Field

The application relates to the technical field of display panel manufacturing, in particular to the technical field of display panel manufacturing equipment, and specifically relates to a laser etching device.

Background

In the HVA liquid crystal panel process, when the array substrate is used as a contact power-in substrate, the array substrate has the disadvantages of short circuit due to dense flat cables and more crossover wires. Therefore, the new process adopts the LOC (laser patterning On CF) technology, that is, the Color Film (CF) substrate is used as a contact power-in substrate, and only 2 electric signals, namely a high-level signal and a low-level signal, are On the color film substrate.

The LOC technology is to etch the whole common electrode film layer on the color film substrate by using laser and scribe the common electrode in different areas. The principle of laser etching common electrode is as follows: when the common electrode absorbs the energy of the laser, the heat change is generated, so that the common electrode is gasified, and the purpose of etching is achieved; the method mainly comprises two steps: firstly, the high energy of laser enables the surface of the common electrode to be ionized; secondly, a large amount of heat is generated to vaporize the common electrode.

However, in the process of performing laser etching on the common electrode film layer, surface ionization and gasification of the common electrode occur, and the generated particles leave and contaminate the surface of the color film substrate, which affects the appearance and electrical yield of the product.

Disclosure of Invention

The embodiment of the application provides a laser etching device to solve the technical problems that in the process of carrying out laser etching on a common electrode film layer, generated particles can be left on and pollute the surface of a color film substrate, and the appearance and the electrical property yield of a product are affected.

In order to solve the above problems, the technical scheme provided by the invention is as follows:

a laser etching apparatus, comprising:

an installation table;

a laser etching head disposed on a bottom side of the mounting table;

a shield disposed on a bottom side of the mounting table, the shield disposed around the laser etching head to form a dust suction cavity;

the air suction piece is provided with an air suction pipe, and the air inlet end of the air suction pipe is communicated with the dust suction cavity.

In some embodiments, the suction piece is located outside the shield, and the suction duct communicates with the dust suction cavity through the suction piece side wall.

In some embodiments, the air inlet end of the air suction pipe is arranged obliquely in a direction away from the mounting table.

In some embodiments, the shield comprises at least two shield plates arranged in series in a direction away from the laser etching head, the shield plates being disposed around the laser etching head.

In some embodiments, a dustproof diffusion cavity is formed between two adjacent protection plates, and the laser etching device further comprises an air blowing piece, wherein an air outlet pipe is arranged on the air blowing piece, and an air outlet end of the air outlet pipe is communicated with the dustproof diffusion cavity.

In some embodiments, the air blowing member is disposed outside the shielding member, and the air outlet pipe is communicated with the dustproof diffusion chamber through the shielding plate.

In some embodiments, the air outlet end of the air outlet pipe is obliquely arranged in a direction away from the mounting table.

In some embodiments, the air blowing piece is provided with at least two air outlet pipes, and the air outlet ends of all the air outlet pipes are distributed around the peripheral side of the protection plate.

In some embodiments, the opening width of the end of the shield plate proximate to the mounting platform is greater than the opening width of the end of the shield plate distal from the mounting platform.

In some embodiments, the protection plate comprises a body arranged on the mounting table and an air guide piece arranged at one end, far away from the mounting table, of the body, the longitudinal section of the air guide piece is in a round table shape, and the opening width, close to one end of the mounting table, of the air guide piece is larger than that, far away from the mounting table, of the air guide piece.

The beneficial effects of the invention application are as follows: use laser etching device to carry out the in-process that laser etching was carried out to common electrode membrane layer, it is in operating condition to inhale gas spare and air-blowing spare, the gas that the end of giving vent to anger of outlet duct forms the air curtain in dustproof diffusion intracavity, prevent granule and the ionic powder of gasification attitude from diffusing outward, the suction that the induction end of breathing pipe produced simultaneously sucks granule and the ionic powder of gasification attitude that produces among the etching process and takes out behind the suction chamber to the breathing pipe, prevent that the granule that produces among the etching process from leaving over and polluting the surface of various membrane base plate, promote the outward appearance and the electrical property yield of product, can improve the inside cleanliness factor of laser etching device greatly simultaneously.

Drawings

The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.

FIG. 1 is a schematic structural diagram of a laser etching apparatus according to an embodiment of the present invention;

fig. 2 is a schematic view illustrating a laser etching apparatus etching a common electrode film layer according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a laser etching apparatus according to another embodiment of the present invention.

Reference numerals:

10. an installation table; 20. a suction member; 21. an air intake duct; 30. a laser etching head; 40. a guard; 41. a body; 42. a gas guide; 50. a common electrode film layer; 60. an air blowing member; 61. an air outlet pipe; 70. a dust suction chamber; 80. dustproof diffusion chamber.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

The invention aims to solve the technical problems that in the process of carrying out laser etching on a common electrode film layer by using the conventional laser etching device, generated particles can be left and pollute the surface of a color film substrate, and the appearance and the electrical yield of a product are influenced. The present invention can solve the above problems.

A laser etching apparatus, as shown in fig. 1, includes a mounting stage 10, and a laser etching head 30 and a shield 40 disposed on a bottom side of the mounting stage 10, the shield 40 being disposed around the laser etching head 30 to form a dust suction chamber 70.

Specifically, the laser etching apparatus further includes a suction member 20, the suction member 20 is provided with a suction pipe 21, and an air inlet end of the suction pipe 21 is communicated with the dust suction chamber 70.

As shown in fig. 1 and 2, in the process of performing laser etching on the common electrode film layer 50 by using the laser etching device, laser emitted by the laser etching head 30 etches the common electrode film layer 50, at this time, the air suction member 20 is in a working state, and due to the suction effect generated by the air suction end of the air suction pipe 21, particles generated in the etching process and gasified ion powder enter the air suction cavity 70 and are sucked by the air suction pipe 21, so that the particles generated in the etching process are prevented from being left and polluting the surface of the color film substrate, the appearance and the electrical yield of a product are improved, and meanwhile, the cleanliness of the interior of the laser etching device can be greatly improved.

It should be noted that the air suction member 20 may be an air suction machine; the laser etching head 30 may be disposed at the center of the bottom side of the mounting stage 10; the vertical distance between the bottom side of the shield 40 and the bottom side of the mounting table 10 is greater than the vertical distance between the head of the laser etching head 30 and the bottom side of the mounting table 10, i.e., the head of the laser etching head 30 is located in the dust suction chamber 70, thereby preventing the particles and ion powder from being diffused outward during the etching process.

In one embodiment, the suction member 20 is located outside the protection member 40, and the suction pipe 21 extends through a sidewall of the suction member 20 to communicate with the dust suction chamber 70.

The air absorbing member 20 may be attached and fixed to the outer side of the protection member 40, and the air absorbing member 20 may be attached and fixed to the mounting table 10, and the attachment position of the air absorbing member 20 may be selected according to the actual size and strength of the protection member 40.

In one embodiment, as shown in fig. 3, the intake end of the intake pipe 21 is inclined in a direction away from the mounting table 10.

The air inlet end of the air suction pipe 21 may be directed vertically downward, and the air inlet end of the air suction pipe 21 may be directed obliquely downward, so as to enhance the effect of extracting particles and ion powder.

One intake end of the intake pipe 21 may be provided, or a plurality of intake ends may be provided around the periphery of the guard 40.

Specifically, the protection member 40 includes at least two protection plates arranged in sequence along a direction away from the laser etching head 30, and the protection plates surround the laser etching head 30 to play a role of multi-layer protection and prevent particles and ion powder generated in the etching process from diffusing outwards.

Further, a dustproof diffusion cavity 80 is formed between every two adjacent protection plates, the laser etching device further comprises an air blowing piece 60, the air blowing piece 60 is provided with an air outlet pipe 61, and the air outlet end of the air outlet pipe 61 is communicated with the dustproof diffusion cavity 80.

It should be noted that the air blowing member 60 may be an air blower, the air blower is in an operating state during the etching process, and the air flow coming out from the air outlet end of the air outlet pipe 61 forms an air curtain in the dustproof diffusion chamber 80, so as to prevent particles and ion powder generated during the etching process from diffusing outwards.

In one embodiment, the air blowing member 60 is disposed outside the shielding member 40, and the air outlet pipe 61 is communicated with the dustproof diffusion chamber 80 through the shielding plate.

The blower may be attached and fixed to the outside of the protection member 40, or the blower may be attached and fixed to the mounting table 10.

In one embodiment, the outlet end of the outlet pipe 61 is inclined away from the mounting table 10, so that the protection of the formed air curtain is better.

Specifically, the air blowing piece 60 is provided with two at least outlet pipes 61, and all the outlet ends of the outlet pipes 61 are wound around the periphery of the protection plate, so that the air curtain at the dustproof diffusion cavity 80 is more uniform, and the protection performance is better.

Specifically, the opening width of the end of the protection plate close to the mounting table 10 is larger than the opening width of the end of the protection plate far away from the mounting table 10.

Specifically, the guard plate including set up in body 41 on the mount table 10 and install in body 41 is kept away from mount table 10 one of the epaxial air guide 42 of mount table 10, air guide 42's longitudinal section is the round platform form, air guide 42 is close to the opening width of the one end of mount table 10 is greater than air guide 42 keeps away from the opening width of the one end of mount table 10.

The opening at the end of the protective plate far away from the mounting table 10 is limited and contracted, and the air guide piece 42 is arranged to guide the air flow, so that the air flow entering the dust suction cavity 70 and the air flow going out of the dust-proof diffusion cavity 80 are stronger, and a better drawing-out effect and a better powder layer diffusion preventing effect are achieved.

The protection member 40 and the body 41 may be integrally formed, or may be assembled and fixed by welding, riveting, or bonding after being separately molded.

It should be noted that, when the laser etching apparatus is used to perform laser etching on the common electrode film 50, a vertical distance between the bottom side of the gas guide 42 and the upper surface of the common electrode film 50 may be 8-15 mm, so as to avoid damage to the common electrode film 50, and simultaneously, better extract generated particles and ion powder.

The invention has the beneficial effects that: in the process of performing laser etching on the common electrode film layer 50 by using the laser etching device, the air suction part 20 and the air blowing part 60 are in working states, air curtain is formed in the dustproof diffusion cavity 80 by air discharged from the air outlet end of the air outlet pipe 61, particles and gasified ion powder are prevented from diffusing outwards, meanwhile, the particles and gasified ion powder generated in the etching process are sucked into the dust suction cavity 70 and then are extracted into the air suction pipe 21 by suction force generated by the air suction end of the air suction pipe 21, the particles generated in the etching process are prevented from being left and polluting the surface of the color film substrate, the appearance and the electrical yield of products are improved, and meanwhile, the inside cleanliness of the laser etching device can be greatly improved.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

The principle and the implementation of the present application are explained by applying specific examples, and the above description of the embodiments is only used to help understanding the technical solution and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.

Claims

1. A laser etching apparatus, characterized in that the laser etching apparatus comprises:

an installation table;

a laser etching head disposed on a bottom side of the mounting table;

2. The laser etching apparatus of claim 1, wherein the suction member is located outside the shielding member, and the suction pipe communicates with the suction chamber through a side wall of the suction member.

3. The laser etching apparatus according to claim 2, wherein the gas inlet end of the gas suction pipe is disposed to be inclined in a direction away from the mounting table.

4. The laser etching apparatus of claim 1, wherein the shielding member comprises at least two shielding plates arranged in sequence in a direction away from the laser etching head, the shielding plates being disposed around the laser etching head.

5. The laser etching device of claim 4, wherein a dustproof diffusion cavity is formed between two adjacent protection plates, the laser etching device further comprises an air blowing piece, an air outlet pipe is arranged on the air blowing piece, and an air outlet end of the air outlet pipe is communicated with the dustproof diffusion cavity.

6. The laser etching apparatus according to claim 5, wherein the air blowing member is provided outside the shielding member, and the air outlet pipe communicates with the dust diffusion chamber through the shielding plate.

7. The laser etching apparatus according to claim 5, wherein the gas outlet end of the gas outlet pipe is disposed obliquely away from the mounting table.

8. The laser etching apparatus according to claim 5, wherein the gas blowing member is provided with at least two gas outlet pipes, and gas outlet ends of all the gas outlet pipes are distributed around the circumferential side of the shield plate.

9. The laser etching apparatus according to claim 4, wherein an opening width of an end of the shielding plate close to the mount table is larger than an opening width of an end of the shielding plate far from the mount table.

10. The laser etching device according to claim 9, wherein the protection plate includes a body disposed on the mounting table and an air guide installed at an end of the body away from the mounting table, a longitudinal section of the air guide is in a shape of a circular truncated cone, and an opening width of an end of the air guide close to the mounting table is larger than an opening width of an end of the air guide away from the mounting table.