CN111278213B - Flexible printed circuit board - Google Patents
Flexible printed circuit board Download PDFInfo
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- CN111278213B CN111278213B CN202010084949.XA CN202010084949A CN111278213B CN 111278213 B CN111278213 B CN 111278213B CN 202010084949 A CN202010084949 A CN 202010084949A CN 111278213 B CN111278213 B CN 111278213B
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- Prior art keywords
- layer
- flexible
- printed circuit
- copper foil
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a flexible printed circuit board, and relates to the technical field of printed circuit boards. This flexible printed circuit board, including insulating substrate, insulating substrate's upper surface is provided with the bonding connection layer, the upper surface of bonding connection layer is provided with the copper foil layer, insulating substrate runs through jointly with the surface on copper foil layer and has seted up the conducting hole, the inside of conducting hole is provided with electronic components, the upper surface on copper foil layer is provided with conducting layer and solder mask ink layer, the conducting layer is provided with a flexible insulating layer with the upper surface of solder mask ink layer, the conducting layer extends to the inside of conducting hole. According to the invention, through the mutual matching of the arranged rubber protective sleeve, the rubber column, the insulation protection resin, the flexible insulation gasket and the like, the stability between the electronic component and the conducting layer is effectively ensured, the condition that the connecting pin is broken can be greatly reduced, and the stable use of the flexible printed circuit board is ensured.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a flexible printed circuit board.
Background
Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. Its development has been over 100 years old; the design of the method is mainly layout design; the circuit board has the main advantages of greatly reducing errors of wiring and assembly, and improving the automation level and the production labor rate.
At present, printed circuit boards are developed from single-layer boards to double-sided boards, multi-layer boards and flexible boards, and are continuously developed toward high precision, high density and high reliability. The size is constantly reduced, the cost is reduced, the performance is improved, so that the printed circuit board still keeps strong vitality in the development process of future electronic products, however, pins between electronic components and a conducting layer in the existing flexible printed circuit board are easy to break, the use of the whole circuit board is caused to have faults, and meanwhile, the existing flexible printed circuit board is poor in protection effect and short in service life.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides the flexible printed circuit board, which solves the problems that the pins between the electronic components and the conducting layer in the flexible printed circuit board in the prior art are easy to break, so that the whole circuit board is in failure in use, and meanwhile, the prior flexible printed circuit board has poor protection effect and short service life.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: the flexible printed circuit board comprises an insulating substrate, wherein the upper surface of the insulating substrate is provided with a bonding connection layer, the upper surface of the bonding connection layer is provided with a copper foil layer, the surfaces of the insulating substrate and the copper foil layer are jointly penetrated and provided with a via hole, an electronic component is arranged inside the via hole, the upper surface of the copper foil layer is provided with a conductive layer and a solder mask ink layer, the upper surfaces of the conductive layer and the solder mask ink layer are provided with a first flexible insulating layer, the conductive layer extends into the via hole, the surface of the electronic component is fixedly connected with a rubber protective sleeve, one end of the rubber protective sleeve, which is far away from the electronic component, is fixedly connected with the conductive layer, the inside of the rubber protective sleeve is provided with a connecting pin, one end of the connecting pin is electrically connected with the electronic component, and the other end of the connecting pin is electrically connected with the conductive layer, and a second flexible insulating layer is arranged on the lower surface of the insulating substrate.
Preferably, the number of the rubber protective sleeves is two, and rubber columns are fixedly connected between the two groups of rubber protective sleeves.
Preferably, the lower surface of the first flexible insulating layer and the positions close to the two ends are fixedly connected with resin laminating columns, and the resin laminating columns sequentially penetrate through the copper foil layer and the bonding connection layer.
Preferably, the upper surface of the second flexible insulating layer is fixedly connected with a plurality of pressing bumps, the lower surface of the insulating substrate is provided with grooves corresponding to the pressing bumps, the upper surface of the second flexible insulating layer is fixedly connected with a flexible insulating gasket close to the middle position, and the flexible insulating gasket is attached to the electronic component.
Preferably, a first transparent thin film layer is arranged on the upper surface of the first flexible insulating layer, and a second transparent thin film layer is arranged on the lower surface of the second flexible insulating layer.
Preferably, an insulating protective resin is arranged inside the via hole, and a third flexible insulating layer is arranged at the end portions of the first flexible insulating layer and the second flexible insulating layer.
Preferably, the insulating substrate is made of polyimide, the thickness of the insulating substrate is 5-15 μm, and the thickness of the copper foil layer is 3-10 μm.
Preferably, the flexible printed circuit board comprises the following manufacturing steps:
s1, preparing an insulating substrate, uniformly arranging a bonding connection layer on the upper surface of the insulating substrate, and bonding the copper foil layer on the surface of the insulating substrate through the bonding connection layer;
s2, punching a via hole in the middle of the insulating substrate and the copper foil layer, then carrying out photoresist, exposure and development treatment on the surface of the copper foil layer, arranging a conductive layer in a printing area on the surface of the copper foil layer, and arranging a solder resist ink layer in an unprinted area on the surface of the copper foil layer;
s3, arranging an electronic component in the via hole, arranging a connecting pin at the conductive position of the electronic component, arranging a rubber protective sleeve on the outer surface of the connecting pin, connecting the rubber protective sleeve and the connecting pin with the conductive layer, and finally filling insulating protective resin in the via hole;
s4, laminating a first flexible insulating layer on the upper surfaces of the conducting layer and the solder resist ink layer, laminating a second flexible insulating layer on the lower surface of the insulating substrate, and laminating a third flexible insulating layer on the end parts of the first flexible insulating layer and the second flexible insulating layer;
s5, arranging a first transparent thin film layer on the upper surface of the first flexible insulating layer, and arranging a second transparent thin film layer on the lower surface of the second flexible insulating layer.
(III) advantageous effects
The invention provides a flexible printed circuit board. The method has the following beneficial effects:
1. according to the invention, through the mutual matching of the arranged rubber protective sleeve, the rubber column, the insulation protection resin, the flexible insulation gasket and the like, the stability between the electronic component and the conducting layer is effectively ensured, the condition that the connecting pin is broken can be greatly reduced, and the stable use of the flexible printed circuit board is ensured.
2. According to the invention, through the mutual matching among the first flexible insulating layer, the second flexible insulating layer, the third flexible insulating layer and the like, the whole flexible printed circuit board is effectively protected, so that the flexible printed circuit board has good buffering performance, and the service life of the flexible printed circuit board can be effectively prolonged.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Wherein, 1, an insulating substrate; 2. bonding the connecting layer; 3. a copper foil layer; 4. a via hole; 5. an electronic component; 6. a conductive layer; 7. a solder resist ink layer; 8. a first flexible insulating layer; 9. a rubber protective sleeve; 10. connecting pins; 11. a rubber column; 12. a resin compression column; 13. a first transparent thin film layer; 14. a second flexible insulating layer; 15. pressing the bumps; 16. a flexible insulating spacer; 17. an insulating protective resin; 18. a second transparent thin film layer; 19. a third flexible insulating layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example (b):
as shown in fig. 1, an embodiment of the present invention provides a flexible printed circuit board, which includes an insulating substrate 1, an adhesive connection layer 2 is disposed on an upper surface of the insulating substrate 1, a copper foil layer 3 is disposed on an upper surface of the adhesive connection layer 2, a via hole 4 is formed through surfaces of the insulating substrate 1 and the copper foil layer 3, an electronic component 5 is disposed inside the via hole 4, a conductive layer 6 and a solder resist ink layer 7 are disposed on an upper surface of the copper foil layer 3, a first flexible insulating layer 8 is disposed on upper surfaces of the conductive layer 6 and the solder resist ink layer 7, the conductive layer 6 extends into the via hole 4, a rubber protection cover 9 is fixedly connected to a surface of the electronic component 5, one end of the rubber protection cover 9, which is far away from the electronic component 5, is fixedly connected to the conductive layer 6, a connection pin 10 is disposed inside the rubber protection cover 9, and one end of the connection pin 10 is electrically connected to the electronic component 5, the other end of the connecting pin 10 is electrically connected to the conductive layer 6, and a second flexible insulating layer 14 is disposed on the lower surface of the insulating substrate 1.
The quantity of rubber protective sheath 9 is two sets of, and fixedly connected with rubber column 11 between two sets of rubber protective sheaths 9, and the rubber column 11 of setting can have good shock-absorbing capacity to between two sets of rubber protective sheaths 9 for pin 10 can be connected in effectual protection to rubber protective sheath 9.
The lower surface of first flexible insulation layer 8 just is close to the equal fixedly connected with resin laminating post 12 in both ends position, and the resin laminating post 12 of setting can improve the adhesion of first flexible insulation layer 8, and resin laminating post 12 runs through copper foil layer 3 and bonding connection layer 2 in proper order.
The upper surface of the second flexible insulating layer 14 is fixedly connected with a plurality of pressing bumps 15, the lower surface of the insulating substrate 1 is provided with grooves corresponding to the pressing bumps 15, the plurality of pressing bumps 15 can improve the adhesiveness of the second flexible insulating layer 14, the upper surface of the second flexible insulating layer 14 is fixedly connected with a flexible insulating gasket 16 close to the middle position, the flexible insulating gasket 16 is attached to the electronic component 5, and the flexible insulating gasket 16 is used for supporting the electronic component 5 and protecting the electronic component 5.
The upper surface of the first flexible insulating layer 8 is provided with a first transparent thin film layer 13, the lower surface of the second flexible insulating layer 14 is provided with a second transparent thin film layer 18, and the first transparent thin film layer 13 and the second transparent thin film layer 18 are respectively used for protecting the first flexible insulating layer 8 and the second flexible insulating layer 14.
The inside of the via hole 4 is provided with an insulating protective resin 17, and the end portions of the first flexible insulating layer 8 and the second flexible insulating layer 14 are provided with a third flexible insulating layer 19 in common, and the third flexible insulating layer 19 is used for protecting the side surface of the flexible printed circuit board.
The insulating substrate 1 is made of polyimide, the thickness of the insulating substrate 1 is 5-15 μm, and the thickness of the copper foil layer 3 is 3-10 μm.
In the invention, the flexible printed circuit board comprises the following manufacturing steps:
s1, preparing an insulating substrate 1, uniformly arranging a bonding connection layer 2 on the upper surface of the insulating substrate 1, and bonding a copper foil layer 3 on the surface of the insulating substrate 1 through the bonding connection layer 2;
s2, punching a via hole 4 between the insulating substrate 1 and the copper foil layer 3, then carrying out photoresist, exposure and development treatment on the surface of the copper foil layer 3, arranging a conductive layer 6 in a printing area on the surface of the copper foil layer 3, and arranging a solder resist ink layer 7 in an unprinted area on the surface of the copper foil layer 3;
s3, arranging the electronic component 5 in the through hole 4, arranging the connecting pin 10 at the conductive position of the electronic component 5, arranging the rubber protective sleeve 9 on the outer surface of the connecting pin 10, connecting the rubber protective sleeve 9 and the connecting pin 10 with the conductive layer 6, and finally filling the insulating protective resin 17 in the through hole 4;
s4, laminating a first flexible insulating layer 8 on the upper surfaces of the conducting layer 6 and the solder resist ink layer 7, laminating a second flexible insulating layer 14 on the lower surface of the insulating substrate 1, and laminating a third flexible insulating layer 19 on the end parts of the first flexible insulating layer 8 and the second flexible insulating layer 14;
s5, the first transparent film layer 13 is disposed on the upper surface of the first flexible insulation layer 8, and the second transparent film layer 18 is disposed on the lower surface of the second flexible insulation layer 14.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. Flexible printed circuit board, including insulating substrate (1), its characterized in that: the upper surface of the insulating substrate (1) is provided with a bonding connection layer (2), the upper surface of the bonding connection layer (2) is provided with a copper foil layer (3), the insulating substrate (1) and the surface of the copper foil layer (3) jointly run through and are provided with a via hole (4), an electronic component (5) is arranged inside the via hole (4), the upper surface of the copper foil layer (3) is provided with a conducting layer (6) and a resistance welding ink layer (7), the conducting layer (6) and the upper surface of the resistance welding ink layer (7) are provided with a first flexible insulating layer (8), the conducting layer (6) extends to the inside of the via hole (4), the surface of the electronic component (5) is fixedly connected with a rubber protection sleeve (9), one end of the rubber protection sleeve (9), which is far away from the electronic component (5), is fixedly connected with the conducting layer (6), and a connection pin (10) is arranged inside the rubber protection sleeve (9), one end of the connecting pin (10) is electrically connected with the electronic component (5), the other end of the connecting pin (10) is electrically connected with the conducting layer (6), and a second flexible insulating layer (14) is arranged on the lower surface of the insulating substrate (1).
2. The flexible printed circuit board according to claim 1, wherein: the quantity of rubber protective sheath (9) is two sets of, and fixedly connected with rubber column (11) between two sets of rubber protective sheath (9).
3. The flexible printed circuit board according to claim 1, wherein: the lower surface of first flexible insulation layer (8) just is close to equal fixedly connected with resin laminating post (12) in both ends position, resin laminating post (12) run through copper foil layer (3) and bonding connection layer (2) in proper order.
4. The flexible printed circuit board according to claim 1, wherein: the upper surface of the second flexible insulating layer (14) is fixedly connected with a plurality of pressing bumps (15), the lower surface of the insulating substrate (1) is provided with grooves corresponding to the pressing bumps (15), the upper surface of the second flexible insulating layer (14) is fixedly connected with a flexible insulating gasket (16) close to the middle position, and the flexible insulating gasket (16) is attached to the electronic component (5).
5. The flexible printed circuit board according to claim 1, wherein: the upper surface of the first flexible insulating layer (8) is provided with a first transparent thin film layer (13), and the lower surface of the second flexible insulating layer (14) is provided with a second transparent thin film layer (18).
6. The flexible printed circuit board according to claim 1, wherein: and insulating protective resin (17) is arranged in the through hole (4), and a third flexible insulating layer (19) is arranged at the end parts of the first flexible insulating layer (8) and the second flexible insulating layer (14) together.
7. The flexible printed circuit board according to claim 1, wherein: the insulating substrate (1) is made of polyimide materials, the thickness of the insulating substrate (1) is 5-15 mu m, and the thickness of the copper foil layer (3) is 3-10 mu m.
8. The flexible printed circuit board according to any one of claims 1 to 7, wherein: the method comprises the following manufacturing steps:
s1, preparing an insulating substrate (1), uniformly arranging a bonding connection layer (2) on the upper surface of the insulating substrate (1), and bonding the copper foil layer (3) on the surface of the insulating substrate (1) through the bonding connection layer (2);
s2, punching a through hole (4) in the middle of the insulating substrate (1) and the copper foil layer (3), then carrying out photoresist, exposure and development treatment on the surface of the copper foil layer (3), arranging a conductive layer (6) in a printing area on the surface of the copper foil layer (3), and arranging a solder resist ink layer (7) in an unprinted area on the surface of the copper foil layer (3);
s3, arranging an electronic component (5) in the through hole (4), arranging a connecting pin (10) at the conductive position of the electronic component (5), arranging a rubber protective sleeve (9) on the outer surface of the connecting pin (10), connecting the rubber protective sleeve (9) and the connecting pin (10) with the conductive layer (6), and finally filling insulating protective resin (17) in the through hole (4);
s4, laminating a first flexible insulating layer (8) on the upper surfaces of the conducting layer (6) and the solder resist ink layer (7), laminating a second flexible insulating layer (14) on the lower surface of the insulating substrate (1), and laminating a third flexible insulating layer (19) on the end parts of the first flexible insulating layer (8) and the second flexible insulating layer (14);
s5, arranging a first transparent thin film layer (13) on the upper surface of the first flexible insulating layer (8), and arranging a second transparent thin film layer (18) on the lower surface of the second flexible insulating layer (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010084949.XA CN111278213B (en) | 2020-02-10 | 2020-02-10 | Flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010084949.XA CN111278213B (en) | 2020-02-10 | 2020-02-10 | Flexible printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN111278213A CN111278213A (en) | 2020-06-12 |
| CN111278213B true CN111278213B (en) | 2021-10-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010084949.XA Active CN111278213B (en) | 2020-02-10 | 2020-02-10 | Flexible printed circuit board |
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| CN (1) | CN111278213B (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5008770A (en) * | 1990-02-20 | 1991-04-16 | The United States Of America As Represented By The Secretary Of The Air Force | Filter pin integrated circuit socket kit |
| EP1321980A4 (en) * | 2000-09-25 | 2007-04-04 | Ibiden Co Ltd | Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| JP4339739B2 (en) * | 2004-04-26 | 2009-10-07 | 太陽誘電株式会社 | Multi-layer board with built-in components |
| FR2934110B1 (en) * | 2008-07-16 | 2010-10-22 | Ingenico Sa | DEVICE FOR PROTECTING AN ELECTRONIC COMPONENT. |
| JP5067437B2 (en) * | 2010-03-19 | 2012-11-07 | 株式会社安川電機 | Electronic component mounting structure, power conversion device using the mounting structure, and electronic component mounting method |
| CN108601203B (en) * | 2018-04-26 | 2020-10-09 | 生益电子股份有限公司 | PCB and PCBA |
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| CN111278213A (en) | 2020-06-12 |
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Effective date of registration: 20210915 Address after: 537000 Rongxian Economic Development Zone, Yulin City, Guangxi Zhuang Autonomous Region Applicant after: Guangxi Rongxian Lingtong Jingye Electronics Co.,Ltd. Address before: 434212 No.39, group 5, shilongqiao village, Yanglin Town, Songzi City, Jingzhou City, Hubei Province Applicant before: Wen Baixin |
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