CN111276633A - Composite flexible substrate, manufacturing method thereof and electronic device - Google Patents
Composite flexible substrate, manufacturing method thereof and electronic device Download PDFInfo
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- CN111276633A CN111276633A CN202010104734.XA CN202010104734A CN111276633A CN 111276633 A CN111276633 A CN 111276633A CN 202010104734 A CN202010104734 A CN 202010104734A CN 111276633 A CN111276633 A CN 111276633A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application provides a composite flexible substrate, a manufacturing method thereof and an electronic device. The composite flexible substrate includes: the display device comprises a first flexible substrate, a second flexible substrate and a display unit, wherein the first flexible substrate is divided into a window area and non-window areas distributed around the window area; a first inorganic barrier layer disposed on one surface of the first flexible substrate and covering only the window region; the second flexible substrate is arranged on the surface, far away from the first flexible substrate, of the first inorganic barrier layer and covers the surface, not covered by the first inorganic barrier layer, of the first flexible substrate. Because the first inorganic barrier layer is only arranged in the window area, when external force is applied to the non-window area in the subsequent manufacturing of the OLED display screen, the bad phenomenon that the inorganic barrier layer and the flexible substrate are split can not occur, and the structural stability of the composite flexible substrate in the subsequent manufacturing of the OLED display screen is further ensured, so that the yield and the reliability of products are greatly improved.
Description
Technical Field
The application relates to the technical field of display, in particular to a composite flexible substrate, a manufacturing method thereof and electronic equipment.
Background
In a flexible OLED display, a substrate bearing an OLED device is a PI (polyimide) substrate, and the PI substrate is a double-layer PI structure at present. The PI is an organic material and can permeate water vapor and oxygen, and the inorganic layer can block the water vapor and the oxygen and can prevent the water vapor and the oxygen from spreading to the OLED device. However, the PI substrate with the above structure still has some problems, which affect the display performance of the OLED device.
Therefore, research on flexible substrates is awaited.
Disclosure of Invention
The present application is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, an object of the present application is to provide a composite flexible substrate having good structural stability and being not easily cracked by an external force.
In one aspect of the present application, a composite flexible substrate is provided. According to an embodiment of the present application, the composite flexible substrate includes: the display device comprises a first flexible substrate, a second flexible substrate and a display unit, wherein the first flexible substrate is divided into a window area and non-window areas distributed around the window area; a first inorganic barrier layer disposed on one surface of the first flexible substrate and covering only the window region; the second flexible substrate is arranged on the surface, far away from the first flexible substrate, of the first inorganic barrier layer and covers the surface, not covered by the first inorganic barrier layer, of the first flexible substrate. Because the first inorganic barrier layer is only arranged in the window area, when external force is applied to the non-window area in the subsequent manufacturing of the OLED display screen, the bad phenomenon that the inorganic barrier layer and the flexible substrate are split can not occur, and the structural stability of the composite flexible substrate in the subsequent manufacturing of the OLED display screen is further ensured, so that the yield and the reliability of products are greatly improved.
In another aspect of the present application, a method of fabricating a composite flexible substrate is provided. According to an embodiment of the present application, a method of fabricating a composite flexible substrate includes: providing a first flexible substrate, and dividing the first flexible substrate into a window area and non-window areas distributed around the window area; forming a first inorganic barrier layer on one surface of the first flexible substrate, wherein the first inorganic barrier layer only covers the window area; and forming a second flexible substrate on the surface of the first inorganic barrier layer far away from the first flexible substrate, wherein the second flexible substrate covers the surface of the first flexible substrate which is not covered by the first inorganic barrier layer. In the manufacturing method, the first inorganic blocking layer is only arranged in the window area, so that when external force is applied to the non-window area in the subsequent manufacturing of the OLED display screen, the bad phenomenon that the inorganic blocking layer and the flexible substrate are split can not occur, and the structural stability of the composite flexible substrate in the subsequent manufacturing of the OLED display screen is further ensured, so that the yield and the reliability of products are greatly improved; moreover, the manufacturing method is simple and easy to implement, is suitable for edge industrial production, and is low in cost.
In another aspect of the present application, an electronic device is provided. According to an embodiment of the application, the electronic device comprises the composite flexible substrate described above. Therefore, the electronic equipment has better structural stability, and the production yield of the electronic equipment is greatly improved. Those skilled in the art will appreciate that the electronic device has all of the features and advantages of the composite flexible substrate described above and will not be redundantly described here.
Drawings
FIG. 1 is a schematic diagram of a prior art flexible substrate;
FIG. 2 is a schematic top plan view of a composite flexible substrate in one embodiment of the present application;
FIG. 3 is an interface view along AA' of FIG. 2;
FIG. 4 is a schematic view of another embodiment of the present application showing the structure of a composite flexible substrate;
FIG. 5 is a schematic diagram of a structure for fabricating a composite flexible substrate in yet another embodiment of the present application;
FIG. 6 is a schematic diagram of a structure for fabricating a composite flexible substrate in yet another embodiment of the present application;
FIG. 7 is a schematic structural view of a composite flexible substrate made in yet another embodiment of the present application;
FIG. 8 is a schematic diagram of a composite flexible substrate fabricated in yet another embodiment of the present application.
Detailed Description
Embodiments of the present application are described in detail below. The following description of the embodiments is merely exemplary in nature and is in no way intended to limit the present disclosure. The examples, where specific techniques or conditions are not indicated, are to be construed according to the techniques or conditions described in the literature in the art or according to the product specifications. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products commercially available.
The present application has been completed based on the following recognition and findings of the inventors:
aiming at a flexible OLED display screen, in order to prevent water vapor and oxygen flexible substrates from spreading to luminescent materials in OLED devices, the flexible substrates are of a composite structure and comprise a PI substrate 1, an inorganic layer 2 and a PI substrate 1 which are sequentially stacked, but the inventor finds that when the composite flexible substrate needs to be subjected to a process (such as a binding process) under the action of an external force, the PI substrate 1 and the inorganic layer 2 are easily separated, as shown in FIG. 1, because the applied external force is transmitted to an interface between the PI substrate 1 and the inorganic layer 2 on the inorganic layer, the PI substrate 1 and the inorganic layer 2 are subjected to a separating force, the force of the interface is connected through inorganic and organic molecular bonds, the force ratio is small (generally less than or equal to 20N), and the force transmitted during binding is likely to be larger than the value, so that the phenomenon of the right diagram in FIG. 1 occurs, and the PI substrate on the upper layer is separated from the inorganic layer, eventually causing the display screen to be destroyed. The inventors of the present invention have made extensive studies and analyses with respect to the above-mentioned problems, and have found that the inorganic layer corresponding to the force application portion region of the non-window region can be removed or partially removed, and the above-mentioned problem of separation of the PI substrate from the inorganic layer can be effectively solved.
In view of this, in one aspect of the present application, a composite flexible substrate is provided. Referring to fig. 2 (the inside of the dashed box in fig. 3 represents the window area and the outside of the dashed box represents the non-window area) and fig. 3 (fig. 3 is an interface view along AA' in fig. 2), the composite flexible substrate includes: a first flexible substrate 10, the first flexible substrate 10 divided into a window area and non-window areas distributed around the window area; a first inorganic barrier layer 20, the first inorganic barrier layer 20 being disposed on one surface of the first flexible substrate 10 and covering only the window region; and a second flexible substrate 30, wherein the second flexible substrate 30 is disposed on a surface of the first inorganic barrier layer 20 away from the first flexible substrate 10, and covers a surface of the first flexible substrate 10 not covered by the first inorganic barrier layer 20. Because the first inorganic blocking layer is only arranged in the window area, when external force is applied to the non-window area of the composite flexible substrate in the subsequent manufacturing of the OLED display screen, the bad phenomenon that the inorganic blocking layer and the flexible substrate are split can not occur, and the structural stability of the composite flexible substrate in the subsequent manufacturing of the OLED display screen is further ensured, so that the yield and the reliability of products are greatly improved.
The first flexible substrate and the second flexible substrate are made of Polyimide (PI) respectively; the thicknesses of the first substrate and the second substrate are 6-10 micrometers respectively. Therefore, the bending performance requirement of the flexible display screen can be met.
Further, referring to fig. 4, the composite flexible substrate further includes: second inorganic barrier layer 40, second inorganic barrier layer 40 is around setting up at the outer border of first inorganic barrier layer 20, and the edge that first inorganic barrier layer 20 was kept away from to second inorganic barrier layer 40 does not surpass the outer border of non-window area (i.e. non-window area keeps away from the edge of window area), that is to say: the second inorganic barrier layer 40 is inside the non-window area. Therefore, the second inorganic barrier layer 40 can further prevent moisture and oxygen from spreading into the OLED device from the edge of the window area, and the second inorganic barrier layer is located inside the non-window area, so the second inorganic barrier layer does not cause the second flexible substrate 30 to be separated from the inorganic barrier layer (including the first inorganic barrier layer and the second inorganic barrier layer).
Although the inorganic barrier layer is not disposed in a partial region of the non-window area near the outer edge (i.e., a region of the second inorganic barrier layer 40 on a side away from the first inorganic barrier layer 30), the inventors have found that the first inorganic barrier layer and the second inorganic barrier layer can still well block the spread of moisture and oxygen, and protect the light-emitting material in the OLED device from moisture and oxygen.
Further, the width D of the second inorganic barrier layer 40 is greater than or equal to 1.2 mm and less than or equal to 5 mm, such as 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, 1.6 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, or 5 mm. Therefore, within the width range, water vapor and oxygen can be effectively prevented from spreading to the OLED device, and the bad phenomenon that the second flexible substrate is separated from the inorganic barrier layer can be ensured when force is applied to the non-window area; if the width D of the second inorganic barrier layer 40 is less than 1.2 mm, the moisture and oxygen prevention effect is relatively poor; if the width D of the second inorganic barrier layer 40 is greater than 5 mm, the second flexible substrate and the inorganic barrier layer are relatively easily separated when a force is applied to the non-viewing area.
Further, the thickness of the first inorganic barrier layer and the second inorganic barrier layer is 100 nm, 400 nm, such as 100 nm, 150 nm, 200 nm, 250 nm, 300 nm, 350 nm or 400 nm, respectively. Therefore, the effect of preventing water vapor and oxygen is better. In some embodiments, the first inorganic barrier layer and the second inorganic barrier layer are prepared by a same process, so that the first inorganic barrier layer and the second inorganic barrier layer are of an integrated structure, and the thicknesses of the first inorganic barrier layer and the second inorganic barrier layer are equal.
Wherein the materials forming the first inorganic barrier layer and the second inorganic barrier layer are respectively selected from at least one of silicon nitride, silicon oxide and amorphous silicon. Therefore, the effect of preventing water vapor and oxygen is better. In some embodiments, the first inorganic barrier layer and the second inorganic barrier layer are a single-layer structure or a multi-layer structure, for example, the first inorganic barrier layer and the second inorganic barrier layer are a single-layer structure of silicon nitride, silicon oxide or amorphous silicon, or a double-layer structure of silicon nitride and silicon oxide, or a double-layer structure of silicon nitride and amorphous silicon, or a double-layer structure of silicon oxide and amorphous silicon, and those skilled in the art can flexibly select the first inorganic barrier layer and the second inorganic barrier layer according to actual design requirements.
In another aspect of the present application, a method of fabricating a composite flexible substrate is provided. According to an embodiment of the present application, a method of fabricating a composite flexible substrate includes:
s100: a first flexible substrate 10 is provided, and the first flexible substrate 10 is divided into a window area and non-window areas distributed around the window area.
S200: a first inorganic barrier layer 20 is formed on one surface of the first flexible substrate 10, and the first inorganic barrier layer 20 only covers the window area, and the structural schematic diagram refers to fig. 5. The first inorganic barrier layer 20 is only arranged in the window area, so that when external force is applied to the non-window area in the subsequent manufacturing of the OLED display screen, the bad phenomenon that the inorganic barrier layer and the flexible substrate are split can not occur, and the structural stability of the composite flexible substrate in the subsequent manufacturing of the OLED display screen is further ensured.
Further, the method for manufacturing the composite flexible substrate further includes S210: a second inorganic barrier layer 40 is formed on the outer edge of the first inorganic barrier layer 20, and the edge of the second inorganic barrier layer 40 far from the first inorganic barrier layer 20 does not exceed the outer edge of the non-window area, which is shown in fig. 6. Therefore, the second inorganic barrier layer 40 can further prevent moisture and oxygen from spreading into the OLED device from the edge of the window area, and the second inorganic barrier layer is located inside the non-window area, so the second inorganic barrier layer does not cause the second flexible substrate 30 to be separated from the inorganic barrier layer (including the first inorganic barrier layer and the second inorganic barrier layer).
Wherein the first inorganic barrier layer 20 and the second inorganic barrier layer 40 are formed through a simultaneous process (i.e., the same step). Therefore, the process flow can be saved, and no gap exists between the first inorganic barrier layer 20 and the second inorganic barrier layer 40, so that the spreading of water vapor and oxygen can be effectively blocked.
In some embodiments, referring to fig. 7, the step of forming the first inorganic barrier layer 20 and the second inorganic barrier layer 40 includes:
the method comprises the following steps: an inorganic layer 24 is deposited on the surface of the first flexible substrate 10, and the inorganic layer 24 covers the entire surface of the first flexible substrate 10, as shown in fig. 7 (a), wherein the inorganic layer 24 may be fabricated by physical vapor deposition or chemical vapor deposition.
Step two: a patterned photoresist layer 50 is formed on the surface of the inorganic layer 24 far from the first flexible substrate 10, as shown in fig. 7 (b), wherein a photoresist may be coated on the entire surface of the inorganic layer 24 in advance, then the photoresist portion to be remained is shielded by a photomask, then the photoresist portion not shielded by the photomask is irradiated with light, and then removed by a developing solution, so as to obtain the photoresist layer 50 with a desired pattern.
Step three: etching away the inorganic layer 24 portion not covered by the photoresist layer 50 by an etching process, as shown in fig. 7 (c);
step four: the photoresist layer 50 is removed to obtain the first inorganic barrier layer 20 and the second inorganic barrier layer 40, as shown in fig. 7 (d).
The sizes of the first inorganic barrier layer 20 and the second inorganic barrier layer 40 prepared by the method described in fig. 7 have high accuracy, and the accuracy can reach several micrometers.
In other embodiments, referring to fig. 8, the step of forming the first inorganic barrier layer 20 and the second inorganic barrier layer 40 includes:
the method comprises the following steps: a blocking structure 60 is formed at a predetermined region of the first flexible substrate other than the window region, as shown in fig. 8 (a). The predetermined region is a region of the first flexible substrate 10 that does not need to form the second inorganic barrier layer in the non-window region.
Step two: the first inorganic barrier layer 20 and the second inorganic barrier layer 40 are deposited in the window area and the portion of the non-window area where the shielding structure 60 is not disposed, as shown in (b) and (c) of fig. 8.
S300: a second flexible substrate 30 is formed on a surface of the first inorganic barrier layer 20 away from the first flexible substrate 10, and the second flexible substrate 30 covers a surface of the first flexible substrate 10 that is not covered by the first inorganic barrier layer 20, and a schematic structural diagram refers to fig. 3.
When the composite flexible substrate includes the second inorganic barrier layer 40, the second flexible substrate 30 covers the surface of the first inorganic barrier layer 20 away from the first flexible substrate 10, the surface of the second inorganic barrier layer 40 away from the first flexible substrate 10, and the surface of the first flexible substrate 10 not covered by the first inorganic barrier layer 20 and the second inorganic barrier layer 40, and the schematic structural diagram refers to fig. 4.
According to the embodiment of the application, the first inorganic barrier layer is only arranged in the window area in the manufacturing method, so that when external force is applied to the non-window area in the subsequent manufacturing of the OLED display screen, the bad phenomenon that the inorganic barrier layer and the flexible substrate are split does not occur, the structural stability of the composite flexible substrate in the subsequent manufacturing of the OLED display screen is further ensured, and the yield and the reliability of products are greatly improved; moreover, the manufacturing method is simple and easy to implement, is suitable for edge industrial production, and is low in cost.
According to an embodiment of the present application, the method for manufacturing a composite flexible substrate may be used to manufacture the composite flexible substrate described above, wherein all requirements for the first inorganic barrier layer, the second inorganic barrier layer, the first flexible substrate, and the second flexible substrate in the method for manufacturing a composite flexible substrate are consistent with the requirements described above, and are not described herein again.
In another aspect of the present application, an electronic device is provided. According to an embodiment of the application, the electronic device comprises the composite flexible substrate described above. Therefore, the electronic equipment has better structural stability, and the production yield of the electronic equipment is greatly improved. Those skilled in the art will appreciate that the electronic device has all of the features and advantages of the composite flexible substrate described above and will not be redundantly described here.
The electronic device is an OLED electronic device, and the specific type of the electronic device has no special requirement, for example, the specific type of the electronic device includes but is not limited to electronic devices such as a mobile phone, a notebook, a game machine, and the like.
Further, those skilled in the art can understand that the electronic device includes, in addition to the composite flexible substrate described above, necessary structures and components in a conventional electronic device, and taking a mobile phone as an example, further includes a thin film transistor structure, an OLED device, a glass cover plate, a fingerprint module, a voice module, a camera module, a CPU, and other necessary structures and components, which are sequentially disposed on the surface of the composite flexible substrate.
The terms "first" and "second" are used herein for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.
Claims (10)
1. A composite flexible substrate, comprising:
the display device comprises a first flexible substrate, a second flexible substrate and a display unit, wherein the first flexible substrate is divided into a window area and non-window areas distributed around the window area;
a first inorganic barrier layer disposed on one surface of the first flexible substrate and covering only the window region;
the second flexible substrate is arranged on the surface, far away from the first flexible substrate, of the first inorganic barrier layer and covers the surface, not covered by the first inorganic barrier layer, of the first flexible substrate.
2. The composite flexible substrate of claim 1, further comprising:
a second inorganic barrier layer surrounding the outer edge of the first inorganic barrier layer, and the second inorganic barrier layer is away from the edge of the first inorganic barrier layer not beyond the outer edge of the non-window area.
3. The composite flexible substrate of claim 2 wherein the width of the second inorganic barrier layer is greater than or equal to 1.2 millimeters and less than or equal to 5 millimeters.
4. The composite flexible substrate as claimed in claim 1, wherein the thicknesses of the first inorganic barrier layer and the second inorganic barrier layer are 100-400 nm, respectively, and the materials for forming the first inorganic barrier layer and the second inorganic barrier layer are at least one selected from silicon nitride, silicon oxide and amorphous silicon, respectively.
5. A method of making a composite flexible substrate, comprising:
providing a first flexible substrate, and dividing the first flexible substrate into a window area and non-window areas distributed around the window area;
forming a first inorganic barrier layer on one surface of the first flexible substrate, wherein the first inorganic barrier layer only covers the window area;
forming a second flexible substrate on a surface of the first inorganic barrier layer away from the first flexible substrate, wherein the second flexible substrate covers a surface of the first flexible substrate not covered by the first inorganic barrier layer.
6. The method of claim 5, further comprising:
and forming a second inorganic barrier layer at the outer edge of the first inorganic barrier layer, wherein the edge of the second inorganic barrier layer far away from the first inorganic barrier layer does not exceed the outer edge of the non-window area.
7. The method of claim 5, wherein the first inorganic barrier layer and the second inorganic barrier layer are formed by a simultaneous process.
8. The method of claim 7, wherein the step of forming the first inorganic barrier layer and the second inorganic barrier layer comprises:
depositing an inorganic layer on the surface of the first flexible substrate, wherein the inorganic layer covers the whole surface of the first flexible substrate;
forming a patterned photoresist layer on the surface of the inorganic layer far away from the first flexible substrate;
etching and removing the part of the inorganic layer which is not covered by the photoresist layer by an etching process;
and removing the photoresist layer to obtain the first inorganic barrier layer and the second inorganic barrier layer.
9. The method of claim 7, wherein the step of forming the first inorganic barrier layer and the second inorganic barrier layer comprises:
forming a shielding structure in a predetermined area of the non-window area;
and depositing and forming the first inorganic barrier layer and the second inorganic barrier layer in the window area and a part of non-window area which is not provided with the shielding structure.
10. An electronic device comprising the composite flexible substrate of any one of claims 1-4.
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| CN112582576A (en) * | 2020-12-10 | 2021-03-30 | 深圳市华星光电半导体显示技术有限公司 | Flexible substrate preparation method and display panel |
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| US20160035759A1 (en) * | 2014-07-31 | 2016-02-04 | Lg Display Co., Ltd. | Flexible display device with wire having reinforced portion and manufacturing method for the same |
| CN107394041A (en) * | 2017-07-21 | 2017-11-24 | 武汉天马微电子有限公司 | Flexible substrates and preparation method thereof, flexible display panels and flexible display apparatus |
| US20180197926A1 (en) * | 2016-03-16 | 2018-07-12 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Double sided organic light-emitting display apparatus and its manufacturing method thereof |
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| US20160035759A1 (en) * | 2014-07-31 | 2016-02-04 | Lg Display Co., Ltd. | Flexible display device with wire having reinforced portion and manufacturing method for the same |
| US20180197926A1 (en) * | 2016-03-16 | 2018-07-12 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Double sided organic light-emitting display apparatus and its manufacturing method thereof |
| CN107394041A (en) * | 2017-07-21 | 2017-11-24 | 武汉天马微电子有限公司 | Flexible substrates and preparation method thereof, flexible display panels and flexible display apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112582576A (en) * | 2020-12-10 | 2021-03-30 | 深圳市华星光电半导体显示技术有限公司 | Flexible substrate preparation method and display panel |
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