CN111272691A - Terahertz wave detection test block and detection method - Google Patents
Terahertz wave detection test block and detection method Download PDFInfo
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- CN111272691A CN111272691A CN202010121556.1A CN202010121556A CN111272691A CN 111272691 A CN111272691 A CN 111272691A CN 202010121556 A CN202010121556 A CN 202010121556A CN 111272691 A CN111272691 A CN 111272691A
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- 238000001514 detection method Methods 0.000 title claims abstract description 85
- 238000012360 testing method Methods 0.000 title claims abstract description 82
- 230000007547 defect Effects 0.000 claims abstract description 59
- 238000001028 reflection method Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 10
- 238000005516 engineering process Methods 0.000 abstract description 11
- 239000000463 material Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000009659 non-destructive testing Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
- G01N21/3581—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light using far infrared light; using Terahertz radiation
Abstract
One or more embodiments of the present specification provide a terahertz wave detection test block and a detection method, including: a main body plate; the main body plate is provided with at least one longitudinal flat bottom hole, and the hole opening direction of the longitudinal flat bottom hole is vertical to the plate surface; at least one lateral flat-bottom hole is arranged on at least one lateral surface of the main body plate, and the opening direction of the lateral flat-bottom hole is perpendicular to the lateral surface. One or more embodiments of the present disclosure integrate a plurality of flat-bottom holes with different apertures, different hole depths, different depths from the plate surface, and different positions and directions, simulate a hole defect and a crack defect, and can characterize the signal detection characteristics of the hole defect and the crack defect in terahertz wave detection, thereby providing a useful detection test piece for the terahertz wave detection technology.
Description
Technical Field
One or more embodiments of the present disclosure relate to the field of terahertz nondestructive testing, and in particular, to a terahertz test block and a detection method.
Background
The terahertz wave detection technology is one of the technologies in the nondestructive testing industry. The nondestructive detection is to detect whether a defect or non-uniformity exists in an object to be detected by using the characteristics of sound, light, magnetism, electricity and the like of a substance on the premise of not damaging or influencing the use performance of the object to be detected, and give information such as the size, position, property, quantity and the like of the defect.
For the existing nondestructive detection technology, such as infrared thermal wave detection, it is difficult to detect the defects deeply buried in the thermal insulation material, and in this case, the terahertz wave detection technology is a relatively effective detection means. Compared with the original nondestructive detection technology, the application of the terahertz wave detection technology is just started, and related detection test pieces are relatively lacked.
Disclosure of Invention
In view of the above, an object of one or more embodiments of the present disclosure is to provide a terahertz wave detection test block, which provides a useful detection test piece for terahertz wave detection technology.
In view of the above object, one or more embodiments of the present specification provide a terahertz wave detecting test block including: the main body plate is provided with at least one longitudinal flat bottom hole, and the hole opening direction of the longitudinal flat bottom hole is vertical to the plate surface; at least one lateral flat-bottom hole is arranged on at least one lateral surface of the main body plate, and the opening direction of the lateral flat-bottom hole is perpendicular to the lateral surface.
Based on the same inventive concept, one or more embodiments of the present specification provide a detection method of detecting a test block using a terahertz wave, including: the method comprises the steps of placing a workpiece to be detected and a test block on a test platform, scanning and detecting the workpiece to be detected and the test block by using a terahertz wave through a defect reflection method or a bottom reflection method, respectively obtaining a detection result of the workpiece to be detected and a detection result of the test block, comparing the signal intensity of the detection result of the workpiece to be detected and the signal intensity of the detection result of the test block, and judging whether defects corresponding to longitudinal flat-bottom holes and/or transverse flat-bottom holes arranged on the test block exist on the workpiece to be detected.
As can be seen from the above, the terahertz wave detection test block and the detection method provided in one or more embodiments of the present disclosure integrate a plurality of flat-bottom holes with different apertures, different hole depths, different depths from a plate surface, and different positions and directions, simulate a hole defect and a crack defect, and can characterize signal detection characteristics of the hole defect and the crack defect in the terahertz wave detection, thereby providing a useful detection test piece for the terahertz wave detection technology.
Drawings
In order to more clearly illustrate one or more embodiments or prior art solutions of the present specification, the drawings that are needed in the description of the embodiments or prior art will be briefly described below, and it is obvious that the drawings in the following description are only one or more embodiments of the present specification, and that other drawings may be obtained by those skilled in the art without inventive effort from these drawings.
Fig. 1 is a schematic view of a first structure of a terahertz wave detection test block provided in one or more embodiments of the present specification;
fig. 2 is a schematic view of a second structure of a terahertz wave detecting block provided in one or more embodiments of the present disclosure;
fig. 3 is a schematic flow chart of a terahertz wave detection test block detection method provided in one or more embodiments of the present specification.
Detailed Description
For the purpose of promoting a better understanding of the objects, aspects and advantages of the present disclosure, reference is made to the following detailed description taken in conjunction with the accompanying drawings.
It is to be noted that unless otherwise defined, technical or scientific terms used in one or more embodiments of the present specification should have the ordinary meaning as understood by those of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in one or more embodiments of the specification is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
In order to achieve the above object, one or more embodiments of the present specification provide a terahertz wave detection block and a detection method, and first, a detailed description is given below of the terahertz wave detection block.
Fig. 1 is a schematic view of a first structure of a terahertz wave detecting block provided in one or more embodiments of the present specification, where the terahertz wave detecting block includes:
the main part board, for long 150mm, wide 150mm, high 60 mm's cuboid, wherein, the cuboid includes first face, second face, first side and fourth side.
The second plate surface is provided with twelve longitudinal flat-bottom holes, the orifices of the longitudinal flat-bottom holes are positioned on the second plate surface, the hole opening direction is perpendicular to the second plate surface and extends inwards, and the twelve longitudinal flat-bottom holes are arranged in an array of three rows and four columns.
The aperture of the first row of longitudinal flat bottom holes is 1mm, and the hole depths are respectively 4mm, 3mm, 2mm and 1mm in sequence.
The aperture of the second row of longitudinal flat bottom holes is 2mm, and the hole depths are respectively 4mm, 3mm, 2mm and 1mm in sequence.
The aperture of the third row of longitudinal flat bottom holes is 3mm, and the hole depths are respectively 4mm, 3mm, 2mm and 1mm in sequence.
The distance between the axes of any two adjacent rows of longitudinal flat-bottom holes is 15 mm.
The distance between the axes of the longitudinal flat-bottom holes of any two adjacent columns is 15 mm.
The distance from the axis of the first row of longitudinal flat-bottom holes to the fourth side face is 60 mm.
The distance from the axis of the first row of longitudinal flat-bottom holes to the first side face is 60 mm.
Six transverse flat-bottom holes are arranged on the first side face, the openings of the transverse flat-bottom holes are located in the first side face, and the opening direction is perpendicular to the first side face and extends inwards.
The horizontal distance between the axes of any two adjacent transverse flat bottom holes is 15mm, and the distances from the six transverse flat bottom holes to the first plate surface are respectively 5mm, 15mm, 25mm, 35mm, 45mm and 55mm in sequence.
The aperture of each transverse flat bottom hole is 3mm, and the depth of each transverse flat bottom hole is 15 mm.
The axis of the transverse flat-bottom hole closest to the fourth side is 20mm from the fourth side.
The terahertz wave detection test block provided by the embodiment further comprises:
the positioning hole is arranged on the first plate surface, an opening of the positioning hole is located in the first plate surface, the opening direction is perpendicular to the first plate surface and extends inwards, and the distances from the axis of the positioning hole to the third side surface and the fourth side surface are both 20 mm.
The aperture of the positioning hole is 5mm, and the depth of the hole is 20 mm.
The embodiment integrates the flat-bottom holes with various different apertures, different hole depths, different distance from the plate surface depths and different position directions, simulates the hole defects and the crack defects, can represent the signal detection characteristics of the hole defects and the crack defects in the terahertz wave detection, and provides an available detection test piece for the terahertz wave detection technology.
It is to be understood that, in the terahertz wave detecting test block provided in one or more embodiments of the present disclosure, the main body plate may be a cylindrical plate or a prismatic plate, the flat-bottom hole provided in the main body plate may include one or more of the embodiments, and the size of the flat-bottom hole may be appropriately adjusted, which is not specifically limited by the present disclosure.
Fig. 2 is a schematic view of a second structure of a terahertz wave detecting block provided in one or more embodiments of the present specification, where the terahertz wave detecting block includes:
the main part board, for long 150mm, wide 150mm, high 60 mm's cuboid, wherein, the cuboid includes first face, second face, first side, second side, third side and fourth side.
The second plate surface is provided with twelve longitudinal flat-bottom holes, the orifices of the longitudinal flat-bottom holes are positioned on the second plate surface, the hole opening direction is perpendicular to the second plate surface and extends inwards, and the twelve longitudinal flat-bottom holes are arranged in an array of three rows and four columns.
The aperture of the first row of longitudinal flat bottom holes is 1mm, and the hole depths are respectively 4mm, 3mm, 2mm and 1mm in sequence.
The aperture of the second row of longitudinal flat bottom holes is 2mm, and the hole depths are respectively 4mm, 3mm, 2mm and 1mm in sequence.
The aperture of the third row of longitudinal flat bottom holes is 3mm, and the hole depths are respectively 4mm, 3mm, 2mm and 1mm in sequence.
The distance between the axes of any two adjacent rows of longitudinal flat-bottom holes is 15 mm.
The distance between the axes of the longitudinal flat-bottom holes of any two adjacent columns is 15 mm.
The distance from the axis of the first row of longitudinal flat-bottom holes to the fourth side face is 60 mm.
The distance from the axis of the first row of longitudinal flat-bottom holes to the first side face is 60 mm.
Six transverse flat-bottom holes are arranged on the first side face, the openings of the transverse flat-bottom holes are located in the first side face, and the opening direction is perpendicular to the first side face and extends inwards.
The horizontal distance between the axes of any two adjacent transverse flat bottom holes is 15mm, and the distances from the six transverse flat bottom holes to the first plate surface are respectively 5mm, 15mm, 25mm, 35mm, 45mm and 55mm in sequence.
The aperture of each transverse flat bottom hole is 3mm, and the depth of each transverse flat bottom hole is 15 mm.
The axis of the transverse flat-bottom hole closest to the fourth side is 20mm from the fourth side.
Six transverse flat-bottom holes are arranged on the second side face, the openings of the transverse flat-bottom holes are located in the second side face, and the opening direction is perpendicular to the second side face and extends inwards.
The horizontal distance between the axes of any two adjacent transverse flat bottom holes is 15mm, and the distances from the transverse flat bottom holes to the first plate surface are respectively 5mm, 15mm, 25mm, 35mm, 45mm and 55mm in sequence.
The aperture of each transverse flat bottom hole is 2mm, and the depth of each transverse flat bottom hole is 15 mm.
The axis of the transverse flat-bottom hole closest to the first side face is 20mm from the first side face.
Six transverse flat-bottom holes are arranged on the third side face, the orifices of the transverse flat-bottom holes are located on the third side face, and the hole opening direction is perpendicular to the third side face and extends inwards.
The horizontal distance between the axes of any two adjacent transverse flat bottom holes is 15mm, and the distances from the transverse flat bottom holes to the first plate surface are respectively 5mm, 15mm, 25mm, 35mm, 45mm and 55mm in sequence.
The aperture of the horizontal flat bottom hole is 1mm, and the depth of the hole is 8 mm.
The axis of the transverse flat-bottom hole closest to the second side face is 20mm away from the second side face.
The terahertz wave detection test block provided by the embodiment further comprises:
the positioning hole is arranged on the first plate surface, an opening of the positioning hole is located in the first plate surface, the opening direction is perpendicular to the first plate surface and extends inwards, and the distances from the axis of the positioning hole to the third side surface and the fourth side surface are both 20 mm.
The aperture of the positioning hole is 5mm, and the depth of the hole is 20 mm.
The embodiment integrates the flat-bottom holes with various different apertures, different hole depths, different distance from the plate surface depths and different position directions, simulates the hole defects and the crack defects, can represent the signal detection characteristics of the hole defects and the crack defects in the terahertz wave detection, and provides an available detection test piece for the terahertz wave detection technology.
One or more embodiments of the present specification provide a method for detecting a terahertz wave detection test block provided by one or more embodiments, and fig. 3 is a first schematic flow chart of the method for detecting a terahertz wave detection test block provided by one or more embodiments of the present specification, where the method for detecting a terahertz wave detection test block includes:
s301, placing the tested workpiece and the test block on a test platform.
In one embodiment, S301 may include:
and placing the tested workpiece and the test block on an object stage of the test platform.
The test platform and the scanner are firmly connected through bolts or other reliable means.
The scanner is used for transmitting terahertz waves and scanning a tested workpiece and a test block.
When the object stage is adjusted up and down, the object stage does not incline or warp, and the whole process of adjusting the height up and down is always kept horizontal.
The object carrying surface of the object stage which directly contacts with the measured workpiece adopts a smooth and flat metal mirror surface.
S302, scanning and detecting the workpiece to be detected and the test block by using a terahertz wave by using a defect reflection method or a bottom reflection method to respectively obtain a detection result of the workpiece to be detected and a detection result of the test block.
In one embodiment, S302 may include:
when the defect reflection method is used, a light source with a short focal length can be selected for the terahertz waves, the depth of a focusing position is adjusted according to the thickness of a workpiece to be detected, the depth of the focusing position is generally 5mm from the lower surface, scanning is started from the depth of the focusing position, after the scanning is completed, the depth of the focusing position moves upwards by 10mm and is scanned again, and finally all detected areas are covered.
When the terahertz waves are transmitted in the workpiece and the test block to be detected and meet the section of the workpiece and the test block to be detected, which is generated due to the discontinuity of materials, corresponding reflection occurs, and when the terahertz waves are focused at the defect position, the receiver can receive a strong defect echo signal caused by a certain magnitude of defect, so that the internal quality of the workpiece and the test block to be detected can be analyzed and evaluated according to the signal.
In one embodiment, S302 may include:
when the bottom reflection method is used, a light source with the focal length of 40-60 mm can be selected for the terahertz waves of the tested workpiece and the test block with the thickness of less than or equal to 20mm, and a light source with the focal length of 90-120 mm can be selected for the terahertz waves of the tested workpiece and the test block with the thickness of more than 20 mm.
Preferably, when the requirement on the definition of the detection result is high, or the requirement on the detection precision reaches the detection task of a phi 2mm equivalent transverse hole defect, when the thicknesses of the workpiece to be detected and the test block are less than or equal to 20mm, the terahertz wave can be a light source with the focal length of 40 mm-60 mm, the focusing depth is d-0.5 t, wherein t is the thickness of the workpiece to be detected and the test block, d is the focusing depth, and the workpiece to be detected and the test block are required to be overturned and scanned twice to remove the influence caused by the blind area; when the thickness of the workpiece to be detected and the test block is larger than 20mm, the terahertz wave can adopt a light source with the focal length of 90 mm-120 mm, and the terahertz wave does not need to be turned over during scanning.
In one case, the terahertz wave detection test block shown in fig. 1 is used, and the thickness is 60mm, a light source with a focal length of 90 mm-120 mm can be selected for the corresponding terahertz wave, and in this case, the test block does not need to be turned over during scanning.
The terahertz wave detection method is characterized in that a workpiece to be detected and a test block are placed on a smooth metal plate to carry out a terahertz wave detection process, the terahertz wave is transmitted through the inside of the workpiece to be detected and the test block to reach the bottom metal plate and then reflected, and reflected waves return along an original path and are finally received by a receiving end. The whole process can be influenced by the material distribution density of the tested workpiece and the test block in the thickness direction, and the distribution of defects such as the internal density, holes and the like of the tested workpiece and the test block is analyzed through the strength of the echo signal of the bottom surface.
S303, comparing the signal intensity of the detection result of the detected workpiece with the signal intensity of the detection result of the test block, and judging whether the detected workpiece has defects corresponding to the longitudinal flat-bottom hole and/or the transverse flat-bottom hole arranged on the test block.
In one embodiment, S303 may include:
in the case of using the defect reflection method, if the signal intensity of the detection result of the workpiece to be tested is higher than or close to that of the detection result of the test block, the existence of defects corresponding to the longitudinal flat-bottom hole and/or the transverse flat-bottom hole arranged on the test block on the workpiece to be tested is judged.
When a defect reflection method is used for detecting a terahertz wave detection test block, terahertz waves are transmitted in a detected workpiece and the test block, when the terahertz waves encounter a section generated by discontinuity of materials in the detected workpiece and the test block, the terahertz waves are focused at a defect position and are correspondingly reflected, a receiver can receive a strong defect echo signal brought by a certain magnitude of defect, and if the signal intensity of the detection result of the detected workpiece is higher than or close to that of the detection result of the test block, the defect corresponding to a longitudinal flat-bottom hole and/or a transverse flat-bottom hole arranged on the test block is judged to exist on the detected workpiece.
Specifically, the longitudinal flat-bottom holes may correspond to hole defects, and the transverse flat-bottom holes may correspond to hole and crack defects. In the case of detecting a crack defect, it is preferable to select a defect reflection method.
In one case, when detecting a crack defect, the terahertz wave propagates in the test block and encounters the flat-bottom hole arranged on the first side surface as shown in fig. 1, and the distance from the axis of the flat-bottom hole to the first plate surface is 5 mm. A material-air interface exists in the flat-bottom hole, when the terahertz waves are focused on the interface, corresponding reflection occurs, and an echo signal is received by a receiver. The echo signal characterizes the crack of the size, direction and position simulated by a transverse flat-bottom hole with a hole diameter of 3mm, a hole depth of 15mm and a hole axis at a distance of 5mm from the first plate surface. When the terahertz wave propagates in the workpiece to be detected, if the received echo signal is the same as or stronger than the echo signal, it is indicated that a crack with a size, a direction and a position close to those of the flat bottom hole exists in the workpiece to be detected.
In one embodiment, S303 may include:
in the case of using the bottom surface reflection method, if the signal intensity of the detection result of the workpiece to be tested is weaker than or close to that of the detection result of the test block, it is determined that there is a defect corresponding to the longitudinal flat-bottom hole and/or the transverse flat-bottom hole provided on the test block in the corresponding longitudinal direction on the workpiece to be tested.
When the bottom reflection method is used for detecting the terahertz wave detection test block, the terahertz wave is transmitted in a detected workpiece and the test block, the terahertz wave can be reflected after reaching the bottom metal plate through the inside of the detected workpiece and the test block, the reflected wave returns along the original path and is finally received by the receiving end, the whole process can be influenced by the material distribution density of the detected workpiece and the test block in the thickness direction, and if the signal intensity of the detection result of the detected workpiece is weaker than or close to that of the detection result of the test block, the defects corresponding to the longitudinal flat bottom hole and/or the transverse flat bottom hole arranged on the test block in the corresponding longitudinal direction on the detected workpiece are judged.
When the bottom reflection method is used for detecting the defects, the specific positions of the defects in the longitudinal direction cannot be located, the defects are the defects, namely the loss of materials, which can cause different attenuation of terahertz waves, and the bottom reflection method is used for analyzing the defects by observing the signal intensity of the terahertz waves on the whole propagation path, so that the bottom reflection method can be used for analyzing whether the defects exist or not by using intensity information and cannot be used for locating the specific depths of the defects.
Specifically, the longitudinal flat-bottom holes may correspond to hole defects, and the transverse flat-bottom holes may correspond to hole and crack defects. In the case of detecting a hole defect, it is preferable to select the bottom reflection method.
In one case, when detecting a hole defect, the terahertz wave propagates in the test block and passes through the flat-bottom hole arranged on the first side surface as shown in fig. 1, and the distance from the axis of the flat-bottom hole to the first plate surface is 5 mm. After the terahertz waves reach the bottom metal plate, corresponding reflection occurs, and the receiver receives echo signals. The echo signal characterizes a hole of this size and orientation simulated by a transverse flat-bottom hole having an aperture of 3mm, a hole depth of 15mm and a hole axis at a distance of 5mm from the first plate surface. When the terahertz wave is transmitted in the workpiece to be detected, if the received echo signal is the same as or weaker than the echo signal, the hole with the size and the direction similar to those of the flat-bottom hole exists in the workpiece to be detected.
The foregoing description has been directed to specific embodiments of this disclosure. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims may be performed in a different order than in the embodiments and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing may also be possible or may be advantageous.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, is limited to these examples; within the spirit of the present disclosure, features from the above embodiments or from different embodiments may also be combined, steps may be implemented in any order, and there are many other variations of different aspects of one or more embodiments of the present description as described above, which are not provided in detail for the sake of brevity.
It is intended that the one or more embodiments of the present specification embrace all such alternatives, modifications and variations as fall within the broad scope of the appended claims. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of one or more embodiments of the present disclosure are intended to be included within the scope of the present disclosure.
Claims (10)
1. A terahertz wave detection block, characterized by comprising: a main body plate;
the main body plate is provided with at least one longitudinal flat bottom hole on the plate surface, and the hole opening direction of the longitudinal flat bottom hole is perpendicular to the plate surface;
at least one lateral flat-bottom hole is arranged on at least one side face of the main body plate, and the hole opening direction of the lateral flat-bottom hole is perpendicular to the side face.
2. The terahertz-wave detecting test block according to claim 1, wherein the main body plate is a rectangular parallelepiped, wherein the rectangular parallelepiped includes a first plate surface and a second plate surface that are oppositely disposed, and the longitudinal flat bottom hole is disposed in the second plate surface.
3. The terahertz wave detection test block according to claim 2, wherein a plurality of the longitudinal flat-bottom holes are provided, and the plurality of longitudinal flat-bottom holes are arranged in an array;
for each row of the longitudinal flat-bottom holes, the hole diameters are the same, and the hole depths are gradually reduced;
the hole depth of each column of the longitudinal flat-bottom holes is the same, and the hole diameter is gradually increased.
4. The terahertz wave detecting block according to claim 2, further comprising:
and the positioning hole is arranged at any corner of the first board surface, and the opening direction is vertical to the first board surface.
5. The terahertz-wave detecting block according to claim 2, wherein a plurality of transverse flat-bottom holes are provided on one side surface of the main body plate.
6. The terahertz-wave detecting block according to claim 5, wherein the distance from the transverse flat-bottom hole to the first plate surface gradually increases.
7. The terahertz-wave detecting block according to claim 1, wherein the apertures of the transverse flat-bottom holes provided on different sides of the main body plate are different.
8. The terahertz-wave detecting block according to claim 1, wherein the hole depths of the transverse flat-bottom holes provided on different sides of the body plate are different.
9. A detection method using the terahertz wave detection block as set forth in any one of claims 1 to 8, comprising:
placing a workpiece to be tested and the test block on a test platform;
scanning and detecting the workpiece to be detected and the test block by using a terahertz wave by using a defect reflection method or a bottom reflection method to respectively obtain a detection result of the workpiece to be detected and a detection result of the test block;
and comparing the signal intensity of the detection result of the workpiece to be detected with the signal intensity of the detection result of the test block, and judging whether the workpiece to be detected has defects corresponding to the longitudinal flat-bottom hole and/or the transverse flat-bottom hole arranged on the test block.
10. The method of claim 9, comprising:
in the case of using a defect reflection method, if the signal intensity of the detection result of the workpiece to be detected is higher than or close to the signal intensity of the detection result of the test block, judging that the workpiece to be detected has defects corresponding to the longitudinal flat-bottom hole and/or the transverse flat-bottom hole arranged on the test block;
in the case of using the bottom surface reflection method, if the signal intensity of the detection result of the workpiece to be tested is weaker than or close to the signal intensity of the detection result of the test block, the defect corresponding to the longitudinal flat-bottom hole and/or the transverse flat-bottom hole arranged on the test block in the corresponding longitudinal direction on the workpiece to be tested is judged to exist.
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