CN111261557A - Sealing door in semiconductor heat treatment equipment and semiconductor heat treatment equipment - Google Patents
Sealing door in semiconductor heat treatment equipment and semiconductor heat treatment equipment Download PDFInfo
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- CN111261557A CN111261557A CN202010072226.8A CN202010072226A CN111261557A CN 111261557 A CN111261557 A CN 111261557A CN 202010072226 A CN202010072226 A CN 202010072226A CN 111261557 A CN111261557 A CN 111261557A
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- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67098—Apparatus for thermal treatment
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Abstract
The application relates to a sealing door in a semiconductor heat treatment device and the semiconductor heat treatment device. This sealing door includes door frame, diaphragm cylinder, door plant, slide rail, sealing washer, wherein: the door frame is arranged on a wall plate of a chamber in the semiconductor heat treatment equipment; the door plate is arranged on the wall plate through the sliding rail and is positioned between the wall plate and the door frame; the diaphragm cylinder is arranged on the back surface of the door frame and is positioned between the door frame and the door plate; the sealing ring is embedded on the wall plate and is arranged corresponding to the edge area of the door panel; when the diaphragm cylinder ventilates, the diaphragm cylinder exerts pressure to the door plant, makes the door plant compress tightly the sealing washer. According to the sealing door of this application, have good leakproofness to adopt pneumatic element to guarantee sealed, the automated processing of being convenient for, and pneumatic element's operational safety is higher than electric element, in addition, still has the advantage that occupation space is little, compact structure, with low costs.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a sealing door in semiconductor heat treatment equipment and the semiconductor heat treatment equipment comprising the sealing door.
Background
When a furnace door of a semiconductor heat treatment apparatus for treating materials such as SiC (silicon carbide) process pieces is opened, radiation to the environment is strong, and the materials need to be cooled in a clean environment filled with inert gas such as nitrogen during tapping, so that a sealable loading and unloading chamber needs to be provided on the furnace door side of a semiconductor heat treatment chamber.
Before the material subjected to high-temperature heat treatment is conveyed into a loading and unloading cavity from the high-temperature heat treatment cavity, the air in the loading and unloading cavity needs to be replaced by inert gas, so that the process piece is in an inert gas atmosphere in the process of blowing in the furnace; when the temperature of the material in the loading and unloading cavity is reduced to below the allowable temperature, air is required to replace the gas in the loading and unloading cavity, and the oxygen content can be required to open the cavity door to take the sheet. During this period, it is necessary to ensure that the loading and unloading chamber is sealed to isolate the loading and unloading chamber from outside air flow. In addition, when the high-temperature heat treatment chamber is opened, the heat radiation to the environment is very strong, the heat radiation leakage may cause injury to operators, and the door structure connecting the loading and unloading chamber and the outside is required to have very reliable sealing performance.
Disclosure of Invention
An object of the present application is to provide a door structure that can provide good sealing, and to provide a semiconductor heat treatment apparatus including the door structure.
The application provides a sealing door among semiconductor thermal treatment equipment on the one hand, including door frame, diaphragm cylinder, door plant, slide rail, sealing washer, wherein:
the door frame is arranged on a wall plate of a chamber in the semiconductor heat treatment equipment;
the door plate is arranged on the wall plate through the sliding rail and is positioned between the wall plate and the door frame;
the diaphragm cylinder is arranged on the back surface of the door frame and is positioned between the door frame and the door plate;
the sealing ring is embedded on the wall plate and is arranged corresponding to the edge area of the door panel;
when the diaphragm cylinder is ventilated, the diaphragm cylinder applies pressure to the door plate to enable the door plate to press the sealing ring.
Preferably, the sealing door comprises a plurality of membrane cylinders, the membrane cylinders are uniformly distributed along the door frame, and the membrane cylinders are synchronously ventilated.
Preferably, sealing door includes two the slide rail, two the slide rail is arranged parallelly the top and the below of door plant, every be provided with two at least sliders on the slide rail, sealing door still includes top shoe connecting plate, lower slider connecting plate, the upper portion of door plant is passed through top shoe connecting plate with be located the door plant top the slider of slide rail is connected, the lower part of door plant is passed through lower slider connecting plate with be located the door plant below the slider of slide rail is connected, the slider can drive top shoe connecting plate the lower slider connecting plate with the door plant is followed the slide rail removes.
Preferably, the sealing door further includes a spring guide mechanism, the door panel is connected to the upper slider connecting plate and the lower slider connecting plate through the spring guide mechanism, wherein the spring guide mechanism includes a spring stopper, a compression spring, a linear guide shaft, and a bushing, wherein: the bushing is embedded in a through hole formed in the upper sliding block connecting plate or the lower sliding block connecting plate; one end of the linear guide shaft is connected with the spring stop block, and the other end of the linear guide shaft penetrates through the bushing and is connected with the door panel; the compression spring is sleeved on the linear guide shaft and clamped between the spring stop block and the bushing.
Preferably, the sealing door further comprises a rodless cylinder and a cylinder connection block, wherein: the rodless cylinder is arranged on the wall plate and is arranged below the lower sliding block connecting plate or above the upper sliding block connecting plate; the sliding block of the rodless cylinder is connected with the lower sliding block connecting plate or the upper sliding block connecting plate through the cylinder connecting block, and the rodless cylinder can drive the cylinder connecting block to move so as to drive the upper sliding block connecting plate, the lower sliding block connecting plate and the door panel to move along the sliding rail.
Preferably, a speed control valve is arranged on the rodless cylinder and used for adjusting the moving speed of a sliding block of the rodless cylinder.
Preferably, the sealing door further comprises a position switch, the position switch is mounted on the wall plate, when the door plate moves to the door closing position through the sliding rail, the lower slider connecting plate or the upper slider connecting plate triggers the position switch, and the position switch sends out a predetermined signal after being triggered.
Preferably, the sealing door further includes a stopper and a buffer, the stopper and the buffer being provided on the door frame, the stopper being used to adjust a position at which the door panel stops when the door is closed, and the buffer being used to buffer the door panel before the door panel touches the stopper.
Preferably, a dovetail groove is formed in the wall plate, the sealing ring is an O-shaped sealing ring, and the sealing ring is embedded in the dovetail groove.
The application further provides a semiconductor heat treatment device, which comprises a loading and unloading cavity and the sealing door, wherein the sealing door is installed on the loading and unloading port of the loading and unloading cavity.
The beneficial effect of this application lies in:
1. according to the sealing door, sealing can be achieved through the diaphragm cylinder, and the sealing door has good sealing performance;
2. according to the sealing door, the pneumatic element is adopted to ensure good sealing, the automatic treatment is convenient, and the operation safety of the pneumatic element is higher than that of the electric element;
3. according to the utility model provides a sealing door adopts the diaphragm cylinder to realize sealed, has that occupation space is little, compact structure, advantage with low costs.
Drawings
The foregoing and other objects, features and advantages of the application will be apparent from the following more particular descriptions of exemplary embodiments of the application, as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts throughout the exemplary embodiments of the application.
Fig. 1(a), 1(b) and 1(c) are schematic structural views showing a sealing door in a semiconductor heat treatment apparatus according to an embodiment of the present application;
fig. 2 is a schematic structural view of a sealing door according to an embodiment of the present application, as viewed from the back of a doorframe;
fig. 3 shows a gas path schematic diagram of a sealing door according to an embodiment of the present application.
Fig. 4(a) and 4(b) are schematic views showing the shapes of a gasket and a groove thereof for sealing a door according to an embodiment of the present application.
Fig. 5(a) and 5(b) show schematic structural views of a semiconductor heat treatment apparatus according to an embodiment of the present application.
Description of reference numerals:
the device comprises a loading and unloading chamber 1, an upper sliding block connecting plate 2, an upper support 3, a linear sliding rail 4, a door frame 5, 6 glass, a lower sliding block connecting plate 7, a lower support 8, a rodless cylinder 9, a cylinder sliding block 10, a speed control valve 11, a position switch 12, a pin 13, a stop bolt 14, a buffer 15, a sealing ring 16, a spring stop block 17, a countersunk screw 18, a compression spring 19, a linear guide shaft 20, an oil-free bushing 21, a frame 22, a diaphragm cylinder 23 and a cylinder connecting block 24;
the device comprises a P1 high-temperature heating chamber, a P2 loading and unloading chamber, a P3 sealing door, a P4 material rest, a P5 air inlet and a P6 air outlet.
Detailed Description
The present application will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
The application provides a sealing door among semiconductor thermal treatment equipment on the one hand, including door frame, diaphragm cylinder, door plant, slide rail, sealing washer, wherein:
the door frame is arranged on a wall plate of a chamber in the semiconductor heat treatment equipment;
the door plate is arranged on the wall plate through a sliding rail and is positioned between the wall plate and the door frame;
the diaphragm cylinder is arranged on the back surface of the door frame and is positioned between the door frame and the door plate;
the sealing ring is embedded on the wall plate and is arranged corresponding to the edge area of the door panel;
when the diaphragm cylinder ventilates, the diaphragm cylinder exerts pressure to the door plant, makes the door plant compress tightly the sealing washer.
In a semiconductor heat treatment apparatus, before a material subjected to high-temperature heat treatment is fed from a high-temperature heat treatment chamber to a loading and unloading chamber, air in the loading and unloading chamber needs to be replaced with inert gas so that the material is in an inert gas atmosphere during a furnace opening process. According to the sealing door of this application can realize good sealing performance to effective isolated loading and unloading material cavity and external circulation of gas guarantee the inert gas atmosphere in the cavity, and can keep apart when high temperature thermal treatment cavity blow-in outwards give off huge heat radiation, avoid the operation personnel that burn. Moreover, in the above embodiments, the pneumatic element is used to ensure good sealing, facilitate automated handling, and the pneumatic element is more safe to operate than the electric element. The diaphragm cylinder that this application adopted still has that occupation space is little, compact structure, advantage with low costs.
In one example, the sealing door comprises a plurality of membrane cylinders, the membrane cylinders are uniformly distributed along the door frame, and each membrane cylinder is synchronously ventilated. When sealing, ventilate for each diaphragm cylinder simultaneously, its diaphragm jack-up simultaneously with the door plant contact in order to exert pressure in step to each angle of door plant for the door plant compresses tightly the sealing washer, thereby ensures that the sealing washer atress is even, makes sealed more reliable. For example, the door frame may be square, and the diaphragm cylinders may be provided at each corner of the square.
In one example, the sealing door comprises two sliding rails, the two sliding rails are arranged above and below the door plate in parallel, and each sliding rail is provided with at least two sliding blocks; the sealing door further comprises an upper sliding block connecting plate and a lower sliding block connecting plate, the upper portion of the door plate is connected with a sliding block of a sliding rail located above the door plate through the upper sliding block connecting plate, the lower portion of the door plate is connected with a sliding block of the sliding rail located below the door plate through the lower sliding block connecting plate, and the sliding block can drive the upper sliding block connecting plate, the lower sliding block connecting plate and the door plate to move along the sliding rail. The bilinear slide rail enables the door plate to move more stably so as to achieve the purpose of stably opening/closing the door, and the multi-slide block structure on each linear slide rail further improves the stability of the door plate in moving.
In one example, the sealing door further comprises a spring guide mechanism, the door panel is connected with the upper slider connecting plate and the lower slider connecting plate through the spring guide mechanism, wherein the spring guide mechanism comprises a spring stopper, a compression spring, a linear guide shaft and a bushing, wherein: the bushing is embedded in a through hole formed in the upper sliding block connecting plate or the lower sliding block connecting plate; one end of the linear guide shaft is connected with the spring stop block, and the other end of the linear guide shaft passes through the bushing and is connected with the door panel; the compression spring is sleeved on the linear guide shaft and clamped between the spring stop block and the bushing.
When the diaphragm cylinder is ventilated, the diaphragm jacks up to apply pressure to the door plate, the door plate is pressed to move towards the wall plate so as to compress the sealing ring, the linear guide shaft with one end connected with the door plate is driven to move towards the wall plate, and the spring stop block connected to the other end of the linear guide shaft synchronously moves towards the wall plate. As described above, the compression springs are captured between the corresponding spring stops and the bushing, with the bushing stationary and the spring stops moving, causing the springs to be further compressed.
When the diaphragm cylinder is cut off gas and is reset, the diaphragm does not apply pressure to the door plate any more, and the door plate can be reset rapidly under the action of the compression spring.
In one example, the sealing door further comprises a rodless cylinder and a cylinder connection block, wherein: the rodless cylinder is arranged on the wall plate and is arranged below the lower sliding block connecting plate or above the upper sliding block connecting plate; the slide block of rodless cylinder passes through the cylinder connecting block and is connected with lower sliding block connecting plate or top shoe connecting plate, and rodless cylinder can drive the cylinder connecting block and remove to drive top shoe connecting plate, lower sliding block connecting plate and door plant and remove along the slide rail. As described above, the rodless cylinder may be disposed below the lower slider connecting plate, and at this time, the slider connecting plate adjacent to the cylinder connecting block is the lower slider connecting plate; the rodless cylinder can also be arranged above the upper sliding block connecting plate, and at the moment, the sliding block connecting plate close to the cylinder connecting block is the upper sliding block connecting plate. In particular, how to arrange, the overall spatial arrangement may be considered.
When the door is closed, the rodless cylinder is ventilated, so that the door plate moves to the door closing position; when the door is opened, the rodless cylinder reversely ventilates to enable the door plate to leave the door frame. And the rodless cylinder is adopted for driving, so that the whole sliding part has a compact structure, and the occupied space is greatly saved. Furthermore, pneumatic components, such as rodless cylinders, are safer for the operator than electric components.
In one example, a speed control valve is arranged on the rodless cylinder and used for adjusting the moving speed of a sliding block of the rodless cylinder.
In one example, the sealing door further comprises a pin, one end of the pin is embedded into the sliding block connecting plate adjacent to the cylinder connecting block, the other end of the pin is inserted into the long round hole of the cylinder connecting block, the length direction of the long round hole is perpendicular to the moving direction of the lower linear sliding rail, and the width direction of the pin is matched with the pin. The connection mode between the cylinder connecting block and the sliding block connecting plate can avoid the movement retardation caused by the non-parallel of the cylinder acting force and the sliding rail movement direction due to the manufacturing or assembling error.
In one example, the sealing door further comprises a position switch, the position switch is installed on the wall plate, when the door plate moves to the door closing position through the sliding rail, the lower sliding block connecting plate or the upper sliding block connecting plate triggers the position switch, and the position switch sends out a preset signal after being triggered. The control system may, upon receiving the signal, issue a command instructing the diaphragm cylinder to be vented.
In one example, the sealing door further includes a stopper and a buffer, the stopper and the buffer being provided on the door frame, the stopper being used to adjust a position at which the door panel stops when the door is closed, and the buffer being used to buffer the door panel before the door panel touches the stopper.
In one example, the air path of the diaphragm cylinder is provided with a pressure reducing valve and a pressure switch, wherein the pressure reducing valve is used for regulating the pressure of the air path, and the pressure switch is used for detecting the pressure of the air path. When the diaphragm cylinder ventilates and pressurizes for the door plant, if pressure switch detects that gas circuit pressure exceeds predetermined threshold value, accessible relief valve adjusts gas circuit pressure to avoid the too big door plant of leading to of air current to rock by a wide margin, ensure that the diaphragm cylinder evenly stably applys appropriate pressure to the door plant. When the diaphragm cylinder is disconnected with gas and reset, if the pressure switch detects that the pressure of the gas path is lower than the set pressure, the reset can be considered to be completed, and subsequent operation is executed, for example, the rodless cylinder moves reversely to drive the door plate to leave the door frame, so that the automatic door opening is realized.
In one example, a dovetail groove is formed in the wall plate, and the sealing ring is an O-shaped sealing ring embedded in the dovetail groove. The dovetail groove is adopted to avoid the ejection of the sealing ring.
In another aspect of the application, the semiconductor heat treatment equipment comprises a loading and unloading chamber and the sealing door, wherein the sealing door is installed on the loading and unloading port of the loading and unloading chamber.
The technical solution provided by the present invention is explained by specific preferred embodiments.
3 fig. 3 1 3 ( 3 a 3) 3, 3 1 3 ( 3 b 3) 3 and 3 1 3 ( 3 c 3) 3 show 3 schematic 3 structural 3 views 3 of 3 a 3 sealing 3 door 3 according 3 to 3 an 3 embodiment 3 of 3 the 3 present 3 application 3, 3 wherein 3 fig. 3 1 3 ( 3 b 3) 3 is 3 a 3 sectional 3 view 3 taken 3 along 3 a 3- 3 a 3 section 3 in 3 fig. 3 1 3 ( 3 a 3) 3, 3 and 3 wherein 3 fig. 3 1 3 ( 3 c 3) 3 is 3 a 3 sectional 3 view 3 taken 3 along 3 b 3- 3 b 3 section 3 in 3 fig. 3 1 3 ( 3 a 3) 3. 3 The sealing door according to the present embodiment is located on the wall 1 of the loading and unloading chamber. As shown in the figure, the door frame 5 is fixed on the chamber wall plate 1 through the upper support 3 and the lower support 8 in a screw mode, the diaphragm air cylinders 23 are installed at four corners of the back face of the door frame 5, and the frame 22 used for pressing the door plate is used for achieving sealing when the door is closed. The stroke of the diaphragm cylinder 23 is 5mm, and the clearance between the diaphragm and the frame 22 is about 1 mm. The diaphragm cylinder 23 is a single-acting cylinder, and the diaphragm is jacked up when the air is ventilated, and the diaphragm is reset after the air is cut off. The door plate also comprises door glass 6, and the door glass 6 is embedded in the frame 22 and is firmly adhered through glue or fixed through screwing.
3 as 3 shown 3 in 3 a 3- 3 a 3 sectional 3 view 3, 3 the 3 upper 3 and 3 lower 3 portions 3 of 3 the 3 frame 3 22 3 are 3 connected 3 to 3 the 3 upper 3 and 3 lower 3 slider 3 connecting 3 plates 3 2 3 and 3 7 3, 3 respectively 3, 3 through 3 four 3 spring 3 guide 3 mechanisms 3 including 3 spring 3 stoppers 3 17 3, 3 countersunk 3 screws 3 18 3, 3 compression 3 springs 3 19 3, 3 linear 3 guide 3 shafts 3 20 3, 3 and 3 oilless 3 bushes 3 21 3. 3 The spring stop 17 is fixed to the end of the linear guide shaft 20 by a countersunk screw 18 and catches the compression spring 19. The linear guide shaft 20 is passed through the oilless bushing 21 and fixed to the frame 22 by a screw coupling. Oilless bushings 21 are respectively embedded in the upper and lower slider connecting plates 2 and 7 and bear against the compression spring 19. Thus, the door plate can move back and forth smoothly through the four spring guide mechanisms, and the pressing and loosening actions are realized under the combined action of the diaphragm air cylinder 23 and the compression spring 19.
Two parallel linear sliding rails 4 are arranged above and below the door plate, and the linear sliding rails 4 are fixed on the chamber wall plate through screws. Each linear slide 4 has two sliders which are screwed together on the slider connecting plates 2 and 7. Thus, the door panel can be moved smoothly right and left by the linear guide 4. The lower sliding block connecting plate 7 is in floating connection with the cylinder connecting block 24, as shown in a sectional view B-B, the lower side of the lower sliding block connecting plate 7 is embedded into two pins 13 to be tightly matched, and the other sides of the pins 13 are inserted into the long round holes of the cylinder connecting block 24. The length direction of the long round hole of the cylinder connecting block 24 is perpendicular to the moving direction of the linear sliding rail 4, and the width direction of the long round hole is tightly matched with the pin, so that the motion retardation caused by the fact that the acting force of the cylinder is not parallel to the moving direction of the sliding rail due to manufacturing or assembling errors can be avoided. The cylinder connecting block 24 is screwed on the sliding block of the rodless cylinder 9, and the speed control valve 11 is arranged at the inlet and the outlet of the rodless cylinder 9 and can adjust the action speed of the cylinder. The left side of the rodless cylinder 9 is provided with a position switch 12, when the door is closed, the lower slide connecting plate 7 touches the position switch 12, the position switch 12 is triggered, and when the position switch is triggered, a preset signal is sent out. After receiving the control signal, the control system considers that the door plate has moved to the door closing position, and controls the air path system to ventilate the diaphragm cylinder 23, so as to realize the compressing action of the door plate.
Fig. 2 shows a schematic structural view of the sealing door according to the embodiment as seen from the back of the door frame. The diaphragm cylinders 23 are screwed and fixed at four corners of the door frame 5. The area indicated by the two-dot chain line in the figure is the contour of the door panel in the closed position, within which the end face of the diaphragm cylinder 23 should be located. A stop bolt 14 and a buffer 15 are provided at one side of the door frame 5. The stop bolt 14 can be used to adjust the stop position of the door panel when the door is closed, and the buffer 15 can make the door panel buffer before the door panel touches the stop bolt 14.
Fig. 3 shows a gas path schematic diagram of the sealing door according to this embodiment. The air path lengths of the four diaphragm cylinders in this embodiment should be substantially the same, so that the four diaphragm cylinders can act simultaneously during ventilation. The air passage of the diaphragm cylinder 23 is provided with a pressure reducing valve and a pressure switch, the pressure of the air passage is regulated through the pressure reducing valve, and the pressure of the air passage is detected through the pressure switch, so that the pre-compression force of the sealing ring is ensured, and the door plate is prevented from shaking violently. The inlet and outlet of the rodless cylinder 9 are provided with speed control valves 11, and the speed control valves 11 are exhaust throttle valves, so that the door plate can act stably.
Fig. 4(a) and 4(b) are schematic views showing shapes of a gasket and a groove thereof for sealing a door according to an embodiment of the present application, wherein fig. 4(b) is a sectional view taken along a section C-C in fig. 4 (a). The sealing ring 16 is an O-shaped sealing ring, and the sealing groove is a dovetail groove to prevent the sealing ring from popping up. The two-dot chain line in the figure is the outline of the door glass 6 at the closed door position, and the gasket 16 is within the range of the two-dot chain line.
When the door is closed, the rodless cylinder 9 is ventilated, so that the door panel (comprising the frame 22 and the door glass 6) moves to the door closing position, the position switch 12 detects that the door panel is in place, and a preset signal is generated. The control system receives this signal and vents the four diaphragm cylinders 23, pushing the door panel to press the door glass 6 against the gasket 16. When the pressure switch of the air passage of the diaphragm air cylinder 23 detects that the pressure reaches the set pressure, the sealing ring finishes prepressing, and the automatic locking and sealing are realized. When the door is opened, the diaphragm cylinder 23 is cut off and reset, the door plate is reset rapidly under the action of the compression spring 19, and the door glass 6 leaves the sealing ring 16. When the pressure switch of the air passage of the diaphragm air cylinder 23 detects that the pressure is lower than the set pressure, the rodless air cylinder 9 conducts reverse movement to drive the door plate to leave the door frame 5, and therefore automatic door opening is achieved.
Fig. 5(a) and 5(b) show schematic structural views of a semiconductor heat treatment apparatus according to an embodiment of the present application, in which fig. 5(a) is a schematic front structural view and fig. 5(b) is a side sectional view. As shown in the figure, the semiconductor heat treatment equipment comprises a high-temperature heating chamber P1, a loading and unloading chamber P2 and a sealing door P3 as described above, wherein the sealing door P3 is arranged on a loading and unloading port of the loading and unloading chamber P2. The semiconductor heat treatment equipment also comprises a material rack P4, a gas inlet P4, a gas outlet P5 and other structures.
The operation of the semiconductor heat treatment apparatus is as follows.
The sealing door P3 is opened, materials (such as SiC process chips and the like) enter the loading and unloading chamber P2 through the loading and unloading port and are placed in the material rack P4, and the material unloading process can be completed manually. The sealing door P3 then closes and seals the loading and unloading opening. After the material is lifted into the high temperature heating chamber P1 by a lifting mechanism (not shown), the door of the high temperature heating chamber P1 is closed. The high-temperature heating chamber P1 is used for carrying out high-temperature heating and other processes on the materials.
After the process is completed, the loading and unloading chamber P2 is filled with inert gas and exhausted of air through the gas inlet P5 and the gas outlet P6. When the oxygen content in the loading and unloading chamber P2 is below a target value, the furnace door of the high-temperature heating chamber P1 is opened, the material rack P4 is lowered through the lifting mechanism, moved out of the high-temperature heating chamber P1 and sent back to the loading and unloading chamber P2. At this time, the inert gas is continuously introduced to cool the materials in the material rack P4.
When the temperature of the material drops below the allowable temperature, the introduction of the inert gas is stopped, the introduction of the air is started, and the loading and unloading chamber P2 is communicated with the outside atmosphere. When the oxygen content in the material loading and unloading chamber P2 reaches the air standard content, the sealing door P3 is opened, the material is taken out, and the next material is unloaded.
In the exemplary embodiment, the four diaphragm cylinders are adopted to synchronously act, and the four corners of the door plate are simultaneously pushed, so that the stress of the sealing ring is ensured, and the sealing reliability is ensured; the automatic opening and closing and sealing of the door are realized by adopting the air cylinder, the automatic processing is convenient, and the pneumatic element is safer for operators than the electric element; the sealing groove adopts a dovetail groove, so that the sealing ring can be prevented from sliding off; the door plate is more stable in movement by adopting double linear slide rails, and each linear slide rail is provided with at least two slide blocks; the rodless cylinder and the diaphragm cylinder are adopted, so that the structure is compact, and the occupied space is saved; in addition, floating connection is adopted between the rodless cylinder and the sliding block connecting plate in the embodiment, so that movement retardation can be prevented.
Having described embodiments of the present application, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments.
Claims (10)
1. The utility model provides a sealing door among semiconductor heat treatment device which characterized in that, includes door frame, diaphragm cylinder, door plant, slide rail, sealing washer, wherein:
the door frame is arranged on a wall plate of a chamber in the semiconductor heat treatment equipment;
the door plate is arranged on the wall plate through the sliding rail and is positioned between the wall plate and the door frame;
the diaphragm cylinder is arranged on the back surface of the door frame and is positioned between the door frame and the door plate;
the sealing ring is embedded on the wall plate and is arranged corresponding to the edge area of the door panel;
when the diaphragm cylinder is ventilated, the diaphragm cylinder applies pressure to the door plate to enable the door plate to press the sealing ring.
2. The sealing door of claim 1, including a plurality of said diaphragm cylinders, said plurality of diaphragm cylinders being evenly distributed along said door frame, each of said diaphragm cylinders being vented simultaneously.
3. The sealing door according to claim 1 or 2, comprising two sliding rails, wherein the two sliding rails are arranged above and below the door panel in parallel, and each sliding rail is provided with at least two sliding blocks;
the sealing door further comprises an upper sliding block connecting plate and a lower sliding block connecting plate, the upper portion of the door plate is connected with a sliding block of the sliding rail, the upper sliding block connecting plate is located above the door plate, the lower portion of the door plate is connected with a sliding block of the sliding rail, the sliding block is capable of driving the upper sliding block connecting plate, the lower sliding block connecting plate and the door plate to move along the sliding rail, and the lower sliding block connecting plate is located below the door plate.
4. The sealing door of claim 3, further comprising a spring guide mechanism by which the door panel is coupled to the upper slider coupling plate and the lower slider coupling plate, wherein,
spring guiding mechanism includes spring dog, compression spring, linear guide axle, bush, wherein:
the bushing is embedded in a through hole formed in the upper sliding block connecting plate or the lower sliding block connecting plate;
one end of the linear guide shaft is connected with the spring stop block, and the other end of the linear guide shaft penetrates through the bushing and is connected with the door panel;
the compression spring is sleeved on the linear guide shaft and clamped between the spring stop block and the bushing.
5. The sealing door of claim 3, further comprising a rodless cylinder and a cylinder connection block, wherein,
the rodless cylinder is arranged on the wall plate and is arranged below the lower sliding block connecting plate or above the upper sliding block connecting plate;
the sliding block of the rodless cylinder is connected with the lower sliding block connecting plate or the upper sliding block connecting plate through the cylinder connecting block, and the rodless cylinder can drive the cylinder connecting block to move so as to drive the upper sliding block connecting plate, the lower sliding block connecting plate and the door panel to move along the sliding rail.
6. The sealing door of claim 5, wherein the rodless cylinder is provided with a speed control valve for adjusting a moving speed of a slider of the rodless cylinder.
7. The sealing door of claim 3, further comprising a position switch mounted on the wall plate, wherein the lower slider link plate or the upper slider link plate activates the position switch when the door panel is moved to the closed door position by the sliding track, and wherein the position switch emits a predetermined signal when activated.
8. The sealing door of claim 3, further comprising a stopper and a bumper provided on the door frame, the stopper for adjusting a position at which the door panel stops when the door is closed, the bumper for buffering the door panel before the door panel touches the stopper.
9. The sealing door of claim 1, wherein the wall plate has a dovetail groove, and the sealing ring is an O-ring, and the sealing ring is embedded in the dovetail groove.
10. A semiconductor thermal processing apparatus, characterized in that the semiconductor thermal processing apparatus comprises a loading and unloading chamber and a sealing door according to any one of claims 1 to 9, the sealing door being mounted on a loading and unloading port of the loading and unloading chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010072226.8A CN111261557B (en) | 2020-01-21 | 2020-01-21 | Sealing door in semiconductor heat treatment equipment and semiconductor heat treatment equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010072226.8A CN111261557B (en) | 2020-01-21 | 2020-01-21 | Sealing door in semiconductor heat treatment equipment and semiconductor heat treatment equipment |
Publications (2)
| Publication Number | Publication Date |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113739946A (en) * | 2021-08-30 | 2021-12-03 | 北京北方华创微电子装备有限公司 | Temperature detection device and semiconductor heat treatment equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113739946A (en) * | 2021-08-30 | 2021-12-03 | 北京北方华创微电子装备有限公司 | Temperature detection device and semiconductor heat treatment equipment |
| CN113739946B (en) * | 2021-08-30 | 2024-03-26 | 北京北方华创微电子装备有限公司 | Temperature detection device and semiconductor heat treatment equipment |
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| CN111261557B (en) | 2022-12-09 |
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