CN111259693A - Sensor module and mobile terminal - Google Patents
Sensor module and mobile terminal Download PDFInfo
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- CN111259693A CN111259693A CN201811458169.6A CN201811458169A CN111259693A CN 111259693 A CN111259693 A CN 111259693A CN 201811458169 A CN201811458169 A CN 201811458169A CN 111259693 A CN111259693 A CN 111259693A
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- 239000005304 optical glass Substances 0.000 claims abstract description 65
- 238000004806 packaging method and process Methods 0.000 claims abstract description 40
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- 239000011521 glass Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 3
- 230000008719 thickening Effects 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 description 25
- 230000001070 adhesive effect Effects 0.000 description 25
- 238000010586 diagram Methods 0.000 description 8
- 239000003292 glue Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
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Abstract
The utility model discloses a sensor module and mobile terminal belongs to the mobile terminal field. This sensor module includes: the optical collimator comprises a shell, an optical collimator, an optical glass cover plate, an optical-based sensor chip and a flexible circuit board; the shell is provided with an accommodating cavity, and the accommodating cavity is internally provided with an optical collimator, an optical glass cover plate and a sensor chip from top to bottom; the sensor chip and the first end of the flexible circuit board are packaged in a COF packaging mode, and the second end of the flexible circuit board is located outside the shell. The first end through sensor chip and flexible circuit board adopts COF packaging mode to encapsulate, has realized the electrical connection between sensor chip and the flexible circuit board for the thickness of sensor module reduces, under the condition of the whole thickness of not thickening mobile terminal, has enlarged the space of battery.
Description
Technical Field
The disclosure relates to the field of mobile terminals, in particular to a sensor module and a mobile terminal.
Background
A full screen mobile terminal refers to a terminal with a screen ratio close to 100%. At present, the comprehensive screen mobile terminal is in proportion to the screen, and the sensor module is arranged below the display screen module, for example, the optical fingerprint module is arranged below the display screen module, so that the fingerprint identification function is realized under the comprehensive screen, the mobile terminal is not required to be opened on the front side or the back side, and the shell integrity of the mobile terminal is ensured.
In the related art, the sensor module arranged below the display screen module of the mobile terminal is packaged by a Chip On Board (COB), the COB is used for adhering the sensor chip to the rigid-flex Board, and then the sensor chip and the rigid-flex Board are subjected to lead bonding through gold wires, so that the electrical connection between the sensor chip and the rigid-flex Board is realized. The rigid-flex board is an electronic device formed by pressing a flexible circuit board onto a rigid circuit board.
However, when stacking the mobile terminal, the thickness of the sensor module using the COB package is too large, and the space of the battery is compressed without thickening the entire thickness of the mobile terminal.
Disclosure of Invention
The embodiment of the disclosure provides a sensor module and a mobile terminal, which can solve the problem that the thickness of the sensor module packaged by a COB is too large, and the space of a battery is compressed under the condition that the whole thickness of the mobile terminal is not thickened. The technical scheme is as follows:
according to an aspect of the embodiments of the present disclosure, there is provided a sensor module including: the optical collimator comprises a shell, an optical collimator, an optical glass cover plate, an optical-based sensor chip and a flexible circuit board;
the housing is provided with an accommodating cavity, and the optical collimator, the optical glass cover plate and the sensor chip are accommodated in the accommodating cavity from top to bottom;
the sensor Chip and the first end of the flexible circuit board are packaged in a Chip On Film (or, Chip On Flex, COF) packaging mode, and the second end of the flexible circuit board is located outside the shell.
Optionally, one side of the sensor chip is formed with an upward connection terminal;
the connecting terminal with the first end electrical property of flexible circuit board links to each other, the first end of flexible circuit board is located the top of connecting terminal.
Optionally, the lower edge of the housing comprises: a first edge portion and a second edge portion;
a first edge portion of the housing is bonded to the other side of the sensor chip;
the second edge portion of the housing is bonded to a peripheral side position of the first end of the flexible circuit board.
Optionally, the sensor module further comprises: an integrated device located within the housing;
the integrated device is located over the first end of the flexible circuit board;
the sensor chip is electrically connected with the integrated device; the integrated device is electrically connected with the flexible circuit board.
Optionally, the accommodating cavity comprises: the first accommodating cavity is positioned at the upper part of the shell, and the second accommodating cavity is positioned at the lower part of the shell;
the first accommodating cavity and the second accommodating cavity are separated by an annular supporting part;
the optical collimator is positioned in the first accommodating cavity;
the optical glass cover plate and the sensor chip are positioned in the second accommodating cavity;
the optical collimator, the hollow part of the annular supporting part and the optical glass cover plate form an incident light path of the sensor chip from top to bottom.
Optionally, the flexible circuit board is a COF flexible circuit board.
Optionally, an air gap exists between the optical collimator and the optical glass cover plate.
Optionally, the sensor chip is any one of an optical fingerprint sensor chip, a distance sensing sensor chip, and an ambient light sensing sensor chip.
According to another aspect of the embodiments of the present disclosure, there is provided a mobile terminal, including: the display screen module comprises a sensor module and a display screen module;
the display screen module includes: the self-luminous display device comprises a glass cover plate, a self-luminous display layer and a shading layer;
one side surface of the self-luminous display layer is attached to the light shielding layer; the other side surface of the self-luminous display layer is attached to the glass cover plate;
an opening area is formed on the shading layer, and the sensor module is positioned below the opening area of the display screen module;
wherein the sensor module is a module as described above.
According to another aspect of the embodiments of the present disclosure, there is provided a method for packaging a sensor module, the method being used for manufacturing the sensor module as described above, the method including:
packaging the sensor chip and the first end of the flexible circuit board in a COF packaging mode;
after the optical glass cover plate is attached to the sensor chip, fixing the optical glass cover plate and the sensor chip in the shell with the accommodating cavity;
and fixing the optical collimator in the accommodating cavity of the shell, wherein the optical collimator is positioned above the optical glass cover plate.
Optionally, one side of the sensor chip is formed with an upward connection terminal; and electrically connecting the connecting terminal of the sensor chip with the first end of the flexible circuit board, wherein the first end of the flexible circuit board is positioned above the connecting terminal.
Optionally, the accommodating cavity comprises: the first accommodating cavity is positioned at the upper part of the shell, and the second accommodating cavity is positioned at the lower part of the shell; fixing the optical glass cover plate and the sensor chip in the second accommodating cavity in an up-down sequence; and fixing the optical collimator in the first accommodating cavity.
Optionally, the lower edge of the housing comprises: a first edge portion and a second edge portion; installing the attached optical glass cover plate and the attached sensor chip into the second accommodating cavity; bonding a first edge portion of the case to the other side of the sensor chip; and adhering a second edge part of the shell to the peripheral side position of the first end of the flexible circuit board.
Optionally, soldering the integrated device over the first end of the flexible circuit board; electrically connecting the sensor chip with the integrated device; and electrically connecting the integrated device with the flexible circuit board.
The technical scheme provided by the embodiment of the disclosure at least comprises the following beneficial effects:
adopt COF packaging mode to encapsulate through sensor chip and flexible circuit board's first end, realized the electrical connection between sensor chip and the flexible circuit board, compare with the sensor module that adopts COB packaging mode among the correlation technique, the sensor module that adopts COF packaging mode has reduced the thickness of a soft or hard combination board for the thickness of sensor module reduces, under the condition of the whole thickness of not thickening mobile terminal, has enlarged the space of battery.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
Fig. 1 is a schematic structural diagram of an optical fingerprint module packaged by a COB in the related art;
fig. 2 is a schematic structural diagram of a sensor module according to an exemplary embodiment of the present disclosure;
FIG. 3 is a schematic diagram of an optical fingerprint module according to another exemplary embodiment of the present application;
fig. 4 is a schematic structural diagram of a mobile terminal according to an exemplary embodiment of the present application;
FIG. 5 is a flow chart of a method for packaging a sensor module according to an exemplary embodiment of the present disclosure;
FIG. 6 is a flow chart of a method for bonding an optical glass cover plate and a sensor chip in a second receiving cavity according to an exemplary embodiment of the present disclosure;
the reference numbers in the figures are respectively:
10. a mobile terminal; 100. a sensor module; 110. a housing; 111. a first edge portion; 112. a second edge portion; 113. an annular support portion; 120. an optical collimator; 130. an optical glass cover plate; 140. a sensor chip; 150. a flexible circuit board; 151. a first end of a flexible circuit board; 152. a second end of the flexible circuit board; 160. a rigid-flex board; 170. an integrated device; 180. gold thread; 200. a display module; 210. a glass cover plate; 220. a self-luminous display layer; 230. a light-shielding layer; 300. the user's finger.
Detailed Description
To make the objects, technical solutions and advantages of the present disclosure more apparent, embodiments of the present disclosure will be described in further detail below with reference to the accompanying drawings.
The mobile terminal adopts a mode of stacking the sensor modules under the screen, so that the screen occupation ratio of the full-screen mobile terminal is enlarged. At present, the sensor module that the below of mobile terminal's display screen module set up adopts the COB encapsulation, and the COB encapsulation is with for the adhesive adhesion of sensor chip on the board that combines soft or hard, then carries out the lead bonding with sensor chip and soft or hard board through the gold thread, realizes the electrical connection between sensor chip and the soft or hard board that combines soft or hard.
Use the sensor module to be the optics fingerprint module as an example, the mode of fingerprint identification under the screen is adopted to mobile terminal for mobile terminal's front and back need not leave the opening for the optics fingerprint module, have enlarged comprehensive screen mobile terminal's screen and have occupied the ratio, and have guaranteed the integrality of mobile terminal's complete machine. This optical fingerprint module is used for gathering the fingerprint of touching user's finger on the mobile terminal screen. The screen matched with the optical fingerprint module is an Organic Light-Emitting Diode (OLED) screen, the mobile terminal sends incident Light through a self-luminous source of the OLED screen, detects a user finger touching the screen of the full-screen mobile terminal, receives reflected Light reflected by the user finger through the OLED screen, and compares the fingerprint brought back by the reflected Light with the stored fingerprint, so as to determine whether the fingerprint is correct.
In the correlation technique, the optical fingerprint module adopts COB encapsulation. Referring to fig. 1, a schematic structural diagram of an optical fingerprint module 100 adopting COB packaging is shown. The optical fingerprint module 100 of fig. 1 includes: the optical fingerprint sensor comprises a shell 110, an optical collimator 120, an optical glass cover plate 130, an optical fingerprint chip 140, a flexible circuit board 150, a soft and hard combination board 160, an integrated device 170 and gold wires 180.
The housing 110 is formed with a receiving cavity, and the housing 110 is adhered to the rigid-flex board 160. The optical collimator 120, the optical glass 130 and the optical fingerprint chip 140 are accommodated in the accommodating cavity from top to bottom. The optical fingerprint chip 140 and the rigid-flex board 160 are packaged in a COB packaging manner, and the optical fingerprint chip 140 and the rigid-flex board 160 are electrically connected through a gold wire 180. The first end 151 of the flexible circuit board 150 is press-connected to the rigid-flex board 160, the rigid-flex board 160 is electrically connected to the flexible circuit board 150, and the second end 152 of the flexible circuit board 150 is located outside the housing 110. The integrated device 170 is electrically connected to the rigid-flex board 160. The accommodating chamber of the housing 110 includes: a first receiving chamber located at an upper portion of the housing 110, and a second receiving chamber located at a lower portion of the housing 110. The optical glass cover 130 is attached to the optical fingerprint chip 140 and located in the second accommodating cavity of the housing 110. The optical collimator 120 is located in the second receiving cavity.
In the example that is the optics fingerprint module from the sensor module, can see out that the sensor module adopts the COB encapsulation for the thickness of sensor module is too big, under the condition of the whole thickness of not thickening mobile terminal, has compressed the space of battery.
The embodiment of the application provides a sensor module and a mobile terminal, the sensor module adopts Chip On Film (or, Chip On Flex, COF) package, and the problem that the thickness of the sensor module adopting COB package in the related art is too large, so that the battery space is compressed can be solved.
Fig. 2 shows a schematic structural diagram of a sensor module 100 according to an exemplary embodiment of the present application, where the sensor module 100 includes: housing 110, optical collimator 120, optical glass cover 130, optical-based sensor chip 140, and flexible circuit board 150.
The housing 110 is formed with a receiving cavity, and the bottom of the receiving cavity is hollow. Optionally, the housing 110 is made of a material with good light shielding performance and electrical insulation performance, so that stray light can be prevented from entering the surface of the sensor chip 140 from the side edge to affect the normal operation of the sensor module 100.
The optical collimator 120, the optical glass cover plate 130 and the sensor chip 140 are accommodated in the accommodating cavity from top to bottom according to a path through which the optical path passes in sequence. The optical collimator 120 is used to adjust the angle of the light entering the sensor module 100, so that the light passing through the optical collimator 120 can be directed toward the optical glass cover plate 130 straightly. The optical glass cover 130 is used for filtering the emitted light, so as to improve the quality of the light emitted to the sensor chip 140.
Optionally, an air gap exists between the optical collimator 120 and the optical glass cover plate 130, and the optical glass cover plate 130 is attached to the front surface of the sensor chip 140. Optionally, the optical glass cover plate 130 and the sensor chip 140 are bonded by an optical bonding adhesive, the optical bonding adhesive is a colorless and transparent adhesive that satisfies optical characteristics and has a light transmittance of greater than 90%, and there is no bubble after the optical glass cover plate 130 and the sensor chip 140 are bonded.
The sensor chip 140 and the first end 151 of the flexible circuit board 150 are packaged in a COF package, and the second end 152 of the flexible circuit board 150 is located outside the housing 110.
Alternatively, one side of the sensor chip 140 is formed with an upward connection terminal. In the COF package, the connection terminal is electrically connected to the first end of the flexible circuit board 150 through a conductive adhesive, so that the sensor chip 140 is electrically connected to the flexible circuit board 150. Wherein the first end 151 of the flexible circuit board 150 is located above the connection terminal.
Optionally, the sensor chip provided by the present embodiment is any one of an optical fingerprint sensor chip, a distance sensing sensor chip, and an ambient light sensing sensor chip. Optionally, the sensor module is an off-screen sensor module.
To sum up, in the sensor module that this embodiment provided, the first end of sensor chip and flexible circuit board adopts COF packaging mode to encapsulate, has realized the electrical connection between sensor chip and the flexible circuit board, compares with the sensor module that adopts COB packaging mode among the correlation technique, and the sensor module that adopts COF packaging mode has reduced the thickness of a soft or hard combination board for the thickness of sensor module reduces, under the condition of the whole thickness of mobile terminal that does not thicken, has enlarged the space of battery.
The embodiment of the application takes the optical fingerprint module as an example of the sensor module, and the schematic description adopts the structure of the optical fingerprint module in a COF packaging mode.
Fig. 3 shows a schematic structural diagram of an optical fingerprint module 100 according to an exemplary embodiment of the present application, where the optical fingerprint module 100 includes: the optical collimator comprises a shell 110, an optical collimator 120, an optical glass cover plate 130, an optical fingerprint chip 140 and a flexible circuit board 150.
The housing 110 is formed with a receiving cavity, and the bottom of the receiving cavity is hollow, that is, there is no material with the housing 110 at the bottom of the receiving cavity. Optionally, the housing 110 is made of a material with good light-shielding property and electrical insulation property, so that stray light can be prevented from entering the surface of the optical fingerprint chip 140 from the side edge to affect the normal operation of the optical fingerprint module 100.
The optical collimator 120, the optical glass cover plate 130 and the optical fingerprint chip 140 are accommodated in the accommodating cavity from top to bottom according to a path through which the optical path passes in sequence. The optical collimator 120 is used to adjust the angle of the light entering the optical fingerprint module 100, so that the light passing through the optical collimator 120 can be directed to the optical glass cover 130 straightly. The optical glass cover plate 130 is used for filtering the emitted light, and the quality of the light emitted to the optical fingerprint chip 140 is improved. The optical fingerprint chip 140 is used for receiving the light from the optical glass cover 130, comparing the fingerprint carried by the light with the stored fingerprint, and determining whether the fingerprint is correct.
Optionally, an air gap exists between the optical collimator 120 and the optical glass cover plate 130, and the optical glass cover plate 130 is attached to the front surface of the optical fingerprint chip 140. Optionally, the optical glass cover plate 130 and the optical fingerprint chip 140 are bonded by an optical bonding adhesive, the optical bonding adhesive is a colorless and transparent adhesive with a light transmittance of more than 90% and satisfies optical characteristics, and no air bubbles are generated after the optical glass cover plate 130 and the optical fingerprint chip 140 are bonded.
Optionally, the accommodating cavity of the housing 110 includes: a first receiving chamber located at an upper portion of the housing 110, and a second receiving chamber located at a lower portion of the housing 110.
The housing 110 further includes an annular support portion 113, and the annular support portion 113 is a portion of the housing 110 extending toward the central direction along the inner wall of the accommodating chamber. The first receiving chamber and the second receiving chamber are separated by an annular support portion 113.
The optical collimator 120 is located in the first accommodating cavity, and the optical collimator 120 is placed on the annular support portion 113.
The optical glass cover plate 130 and the optical fingerprint chip 140 are located in the second accommodating cavity, and the optical glass cover plate 130 and the optical collimator 120 are opposite in position, so that the optical glass cover plate 130 is ensured to receive light passing through the optical collimator 120.
The optical collimator 120, the hollow portion of the annular support portion 113, and the optical glass cover plate 130 form an incident light path of the optical fingerprint chip 140 in order from top to bottom. Here, the hollow portion of the annular support portion 113 refers to a spacing portion between the optical collimator 120 and the optical glass cover plate 130.
The optical fingerprint chip 140 and the first end 151 of the flexible circuit board 150 are packaged in a COF package manner, and the second end 152 of the flexible circuit board 150 is located outside the housing 110.
Optionally, one side of the optical fingerprint chip 140 is formed with upward connection terminals. In the COF package, the connection terminal is electrically connected to the first end of the flexible circuit board 150 through a conductive adhesive, so that the optical fingerprint chip 140 is electrically connected to the flexible circuit board 150. Wherein the first end 151 of the flexible circuit board 150 is located above the connection terminal.
Alternatively, the flexible circuit board 150 is a COF flexible circuit board, and the COF flexible circuit board is a package type flexible circuit board on which a chip and a component can be mounted.
Optionally, the optical fingerprint module 100 further includes: an integrated device 170 located within the housing 110.
The integrated device 170 is located over the first end 151 of the flexible circuit board 150.
The optical fingerprint chip 140 is electrically connected to the integrated device 170 through the flexible circuit board 150, and the integrated device 170 is electrically connected to the flexible circuit board 150 through a soldering method.
Optionally, the integrated device 170 is a collection of components such as resistors, capacitors, and the like.
Optionally, the lower edge of the housing 110 comprises: a first edge portion 111 and a second edge portion 112.
The first edge portion 111 of the housing 110 is adhered to the other side of the optical fingerprint chip 140 by adhesive, and the second edge portion of the housing 110 is adhered to the circumferential side position of the first end 151 of the flexible circuit board 150 by adhesive.
Alternatively, the adhesive may be an adhesive that satisfies the flatness requirement of the bonded portion, such as a dry adhesive or a structural adhesive.
In an illustrative example, the thickness of the optical fingerprint module adopting the COF packaging method is 1.175 cm, while the thickness of the optical fingerprint module adopting the COB packaging method is 1.415 cm, and the thickness of the optical fingerprint module adopting the COF packaging method is reduced by 0.34 cm.
To sum up, in the sensor module that this embodiment provided, the first end of sensor chip and flexible circuit board adopts COF packaging mode to encapsulate, has realized the electrical connection between sensor chip and the flexible circuit board, compares with the sensor module that adopts COB packaging mode among the correlation technique, and the sensor module that adopts COF packaging mode has reduced the thickness of a soft or hard combination board for the thickness of sensor module reduces, under the condition of the whole thickness of mobile terminal that does not thicken, has enlarged the space of battery.
In the sensor module that this embodiment provided, optical collimator, optical glass apron and sensor chip have been held according to the order by last to lower in the holding intracavity that the casing formed, have guaranteed that the light that sensor chip received is concentrated for the result degree of accuracy that sensor chip obtained is high.
In the sensor module that this embodiment provided, one side of sensor chip is formed with ascending connecting terminal, and the flexible circuit board is COF flexible circuit board, has realized that this connecting terminal links to each other with the first end electrical property of flexible circuit board, has realized the electrical connection between sensor chip and the flexible circuit board for the sensor module has reduced the thickness of a soft or hard combination board.
In the sensor module that this embodiment provided, integrated device in the casing is located the first end top of flexible circuit board, and sensor chip passes through flexible circuit board and integrated device electric connection, and integrated device and flexible circuit board electric connection have realized the electric connection between sensor chip, integrated device, the flexible circuit board three.
In the sensor module that this embodiment provided, the thickness of the sensor module that adopts COF packaging mode on the one hand has compared the thickness of the sensor module that adopts COB packaging in the correlation technique and has reduced 40%, battery thickness space can be enlarged, on the other hand the sensor module that adopts COF packaging mode has alleviateed the weight of a rigid-flex board, the holistic weight of mobile terminal has been reduced, effectively improve the holistic reliability of mobile terminal, and reduce the optical property influence of sensor module to the mobile terminal screen, and improve the laminating firmness of sensor module self.
The embodiment of the application schematically illustrates a structure of a sensor module in a COF packaging manner in a mobile terminal.
Fig. 4 shows a schematic structural diagram of a mobile terminal 10 according to an exemplary embodiment of the present application, where a sensor module in the mobile terminal 10 is the sensor module shown in fig. 2 or fig. 3, the mobile terminal 10 includes: sensor module 100 and display screen module 200.
The display screen module 200 includes: a glass cover plate 210, a self-luminous display layer 220, and a light-shielding layer 230.
One side surface of the self-light emitting display layer 220 is attached to the light shielding layer 230, and the other side surface of the self-light emitting display layer 220 is attached to the glass cover 210.
The light-shielding layer 230 has an opening area 231 formed thereon, and the sensor module 100 is located below the opening area 231 of the display module 200.
Optionally, the self-luminous display layer 220 is an OLED screen. The OLED screen includes a self-light source, the mobile terminal 10 emits incident light 240 to the glass cover 210 through the light shielding layer 230, the incident light 240 is reflected by the user's finger 300 to become reflected light 250, the reflected light 250 is emitted from the opening region 231 of the light shielding layer 230 to the sensor module 100 located below the opening region 231, and the reflected light 250 is received by the sensor module 100.
Optionally, when sensor module 100 is the optics fingerprint module, optics fingerprint module 100 is used for detecting whether the fingerprint of touching user's finger 300 on glass apron 210 matches with the fingerprint of storage, and when the fingerprint matches, mobile terminal 10 unblanked.
In the mobile terminal provided by this embodiment, by using the sensor module adopting COF package provided by the above embodiment, the space of the battery is enlarged and the cruising ability of the mobile terminal is ensured without thickening the whole thickness of the mobile terminal.
The embodiment of the application schematically illustrates a packaging method of a sensor module adopting a COF packaging mode.
Fig. 5 is a flowchart illustrating a packaging method of a sensor module provided in an exemplary embodiment of the present application, the method being used for manufacturing the sensor module provided in the above embodiment, the method including:
One side of the sensor chip is formed with upward connection terminals. The first ends of the connecting terminal and the flexible circuit board are electrically connected through conductive adhesive, and the first end of the flexible circuit board is located above the connecting terminal. The second end of the flexible circuit board is located outside the housing. COF packaging is to carry out the electrical connection with the first end of connecting terminal and flexible circuit board through the conducting resin, realizes the electrical connection between optics fingerprint chip and the flexible circuit board.
Optionally, the flexible circuit board is a COF flexible circuit board, and the COF flexible circuit board is a package type flexible circuit board on which a chip and a component can be mounted.
The integrated device is welded above the first end of the flexible circuit board in a welding mode, and the integrated device is electrically connected with the flexible circuit board.
And electrically connecting the sensor chip with the integrated device through the flexible circuit board.
Optionally, the integrated device is a set of components such as resistors, capacitors, and the like.
The casing still includes annular supporting part, and annular supporting part is the part that the casing extends to the central direction along the inner wall of holding chamber. The first accommodating cavity and the second accommodating cavity are separated by an annular supporting part. The accommodating cavity formed by the shell comprises a first accommodating cavity positioned at the upper part of the shell and a second accommodating cavity positioned at the lower part of the shell.
The optical glass cover plate is bonded with the sensor chip through the optical bonding glue, and the bonded optical glass cover plate, the sensor chip and the integrated device are fixed in the second accommodating cavity of the shell.
Optionally, the optical bonding adhesive is colorless and transparent, has a light transmittance of greater than 90%, and satisfies optical characteristics, and the optical glass cover plate is bonded to the optical fingerprint chip without bubbles.
In the second accommodating cavity, the optical glass cover plate and the sensor chip are bonded in the second accommodating cavity through the colloid from top to bottom. Referring to fig. 6, a method for gluing the optical glass cover plate and the sensor chip in the second accommodating cavity by using glue is shown, and the method comprises the following steps:
the lower edge of the housing comprises: a first edge portion and a second edge portion.
Alternatively, the adhesive may be an adhesive that satisfies the flatness requirement of the bonded portion, such as a dry adhesive or a structural adhesive.
Optionally, the shell is made of a material with good light-shielding performance and electrical insulation performance, so that stray light can be prevented from entering the surface of the optical fingerprint chip from the side edge to affect the normal operation of the optical fingerprint module, and the manufacturing material of the shell is not specifically limited in the embodiment.
And an optical collimator is arranged in the first accommodating cavity and is positioned above the optical glass cover plate.
Optionally, the optical collimator is fixed on the annular support portion by glue. When the optical collimator is fixed, the optical glass cover plate and the optical collimator are opposite in position, the optical glass cover plate is ensured to receive light passing through the optical collimator, and the optical collimator, the hollow part of the annular supporting part and the optical glass cover plate form an incident light path of the optical fingerprint chip from top to bottom. Wherein, the hollow part of the annular support part refers to a spacing part between the optical collimator and the optical glass cover plate.
Alternatively, the adhesive may be an adhesive that satisfies the flatness requirement of the bonded portion, such as a dry adhesive or a structural adhesive.
It should be noted that the sensor chip provided in this embodiment is any one of an optical fingerprint sensor chip, a distance-sensitive sensor chip, and an ambient light-sensitive sensor chip
In summary, in the method provided in this embodiment, the sensor chip and the first end of the flexible circuit board are packaged in a COF packaging manner, and compared with the COB packaging manner in the related art, the thickness of the sensor module packaged in the COF is reduced, so that the space of the battery is enlarged.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (14)
1. A sensor module, characterized in that the sensor module includes: the optical collimator comprises a shell, an optical collimator, an optical glass cover plate, an optical-based sensor chip and a flexible circuit board;
the housing is provided with an accommodating cavity, and the optical collimator, the optical glass cover plate and the sensor chip are accommodated in the accommodating cavity from top to bottom;
the sensor chip and the first end of the flexible circuit board are packaged in a Chip On Film (COF) packaging mode, and the second end of the flexible circuit board is located outside the shell.
2. The sensor module according to claim 1, wherein one side of the sensor chip is formed with an upward connection terminal;
the connecting terminal with the first end electrical property of flexible circuit board links to each other, the first end of flexible circuit board is located the top of connecting terminal.
3. The sensor module of claim 2, wherein the lower edge of the housing comprises: a first edge portion and a second edge portion;
a first edge portion of the housing is bonded to the other side of the sensor chip;
the second edge portion of the housing is bonded to a peripheral side position of the first end of the flexible circuit board.
4. The sensor module of claim 2, further comprising: an integrated device located within the housing;
the integrated device is located over the first end of the flexible circuit board;
the sensor chip is electrically connected with the integrated device; the integrated device is electrically connected with the flexible circuit board.
5. The sensor module of any one of claims 1 to 4, wherein the receiving cavity comprises: the first accommodating cavity is positioned at the upper part of the shell, and the second accommodating cavity is positioned at the lower part of the shell;
the first accommodating cavity and the second accommodating cavity are separated by an annular supporting part;
the optical collimator is positioned in the first accommodating cavity;
the optical glass cover plate and the sensor chip are positioned in the second accommodating cavity;
the optical collimator, the hollow part of the annular supporting part and the optical glass cover plate form an incident light path of the sensor chip from top to bottom.
6. The sensor module according to any one of claims 1 to 4, wherein the flexible circuit board is a COF flexible circuit board.
7. A sensor module according to any one of claims 1 to 4, wherein an air gap is present between the optical collimator and the optical glass cover plate.
8. The sensor module according to any one of claims 1 to 4, wherein the sensor chip is any one of an optical fingerprint sensor chip, a distance-sensitive sensor chip, and an ambient light-sensitive sensor chip.
9. A mobile terminal, characterized in that the mobile terminal comprises: the display screen module comprises a sensor module and a display screen module;
the display screen module includes: the self-luminous display device comprises a glass cover plate, a self-luminous display layer and a shading layer;
one side surface of the self-luminous display layer is attached to the light shielding layer; the other side surface of the self-luminous display layer is attached to the glass cover plate;
an opening area is formed on the shading layer, and the sensor module is positioned below the opening area of the display screen module;
wherein the sensor module is a module as claimed in any one of claims 1 to 8 above.
10. A method of packaging a sensor module, the method being used to manufacture a sensor module according to any one of claims 1 to 8, the method comprising:
packaging the sensor chip and the first end of the flexible circuit board in a COF packaging mode;
after the optical glass cover plate is attached to the sensor chip, fixing the optical glass cover plate and the sensor chip in the shell with the accommodating cavity;
and fixing the optical collimator in the accommodating cavity of the shell, wherein the optical collimator is positioned above the optical glass cover plate.
11. The method of claim 10, wherein one side of the sensor chip is formed with upward connection terminals;
the packaging the sensor chip and the first end of the flexible circuit board by the COF packaging mode comprises:
and electrically connecting the connecting terminal of the sensor chip with the first end of the flexible circuit board, wherein the first end of the flexible circuit board is positioned above the connecting terminal.
12. The method of claim 10, wherein the housing chamber comprises: the first accommodating cavity is positioned at the upper part of the shell, and the second accommodating cavity is positioned at the lower part of the shell;
the will optical glass apron with the sensor chip is fixed in and is formed with in the casing of holding chamber, include:
fixing the optical glass cover plate and the sensor chip in the second accommodating cavity in an up-down sequence;
the fixing the optical collimator in the accommodating cavity of the housing includes:
and fixing the optical collimator in the first accommodating cavity.
13. The method of any of claims 10 to 12, wherein the lower edge of the housing comprises: a first edge portion and a second edge portion;
the will optical glass apron with the sensor chip is fixed in the second holding intracavity includes:
installing the attached optical glass cover plate and the attached sensor chip into the second accommodating cavity;
bonding a first edge portion of the case to the other side of the sensor chip;
and adhering a second edge part of the shell to the peripheral side position of the first end of the flexible circuit board.
14. The method of any of claims 10 to 12, further comprising:
soldering the integrated device over the first end of the flexible circuit board;
electrically connecting the sensor chip with the integrated device; and electrically connecting the integrated device with the flexible circuit board.
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| CN201811458169.6A CN111259693B (en) | 2018-11-30 | 2018-11-30 | Sensor module and mobile terminal |
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| CN201811458169.6A CN111259693B (en) | 2018-11-30 | 2018-11-30 | Sensor module and mobile terminal |
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| US20170092689A1 (en) * | 2014-05-20 | 2017-03-30 | Galaxycore Shanghai Limited Corporation | Image Sensor Structure and Packaging Method Thereof |
| CN207182353U (en) * | 2017-09-15 | 2018-04-03 | 南昌欧菲生物识别技术有限公司 | Optical finger print recognizer component and electronic installation |
| CN107958237A (en) * | 2017-12-29 | 2018-04-24 | 维沃移动通信有限公司 | A kind of fingerprint recognition module and electronic equipment |
| CN108132563A (en) * | 2018-01-18 | 2018-06-08 | 广东欧珀移动通信有限公司 | Backlight module, display screen and electronic equipment |
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| US20170092689A1 (en) * | 2014-05-20 | 2017-03-30 | Galaxycore Shanghai Limited Corporation | Image Sensor Structure and Packaging Method Thereof |
| CN207182353U (en) * | 2017-09-15 | 2018-04-03 | 南昌欧菲生物识别技术有限公司 | Optical finger print recognizer component and electronic installation |
| CN107958237A (en) * | 2017-12-29 | 2018-04-24 | 维沃移动通信有限公司 | A kind of fingerprint recognition module and electronic equipment |
| CN108132563A (en) * | 2018-01-18 | 2018-06-08 | 广东欧珀移动通信有限公司 | Backlight module, display screen and electronic equipment |
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| CN111259693B (en) | 2024-02-09 |
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