CN111259693B - Sensor module and mobile terminal - Google Patents
Sensor module and mobile terminal Download PDFInfo
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- CN111259693B CN111259693B CN201811458169.6A CN201811458169A CN111259693B CN 111259693 B CN111259693 B CN 111259693B CN 201811458169 A CN201811458169 A CN 201811458169A CN 111259693 B CN111259693 B CN 111259693B
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- 230000003287 optical effect Effects 0.000 claims abstract description 121
- 239000005304 optical glass Substances 0.000 claims abstract description 65
- 238000004806 packaging method and process Methods 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims description 20
- 239000011521 glass Substances 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims description 4
- 230000004308 accommodation Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 description 18
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 239000012939 laminating adhesive Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Image Input (AREA)
Abstract
The disclosure discloses a sensor module and a mobile terminal, and belongs to the field of mobile terminals. The sensor module includes: the optical collimator comprises a shell, an optical collimator, an optical glass cover plate, an optical-based sensor chip and a flexible circuit board; the shell is provided with an accommodating cavity, and an optical collimator, an optical glass cover plate and a sensor chip are accommodated in the accommodating cavity in sequence from top to bottom; the sensor chip and the first end of the flexible circuit board are packaged in a COF packaging mode, and the second end of the flexible circuit board is located outside the shell. The first ends of the sensor chip and the flexible circuit board are packaged in a COF packaging mode, so that the electrical connection between the sensor chip and the flexible circuit board is realized, the thickness of the sensor module is reduced, and the space of the battery is enlarged under the condition that the whole thickness of the mobile terminal is not thickened.
Description
Technical Field
The disclosure relates to the field of mobile terminals, and in particular relates to a sensor module and a mobile terminal.
Background
A full screen mobile terminal refers to a terminal with a screen ratio close to 100%. At present, for improving the screen occupation ratio of a full-screen mobile terminal, a sensor module is arranged below a display screen module, such as an optical fingerprint module is arranged below the display screen module, and a fingerprint identification function is realized under the full-screen, so that the mobile terminal is not provided with holes on the front side or the back side, and the integrity of a shell of the mobile terminal is ensured.
In the related art, a Chip On Board (COB) package is adopted for a sensor module set below a display screen module of a mobile terminal, the COB package is to adhere a sensor chip to a soft and hard combined Board by using an adhesive, and then wire bonding is performed on the sensor chip and the soft and hard combined Board by using a gold wire, so that electrical connection between the sensor chip and the soft and hard combined Board is realized. The flexible-rigid board is an electronic device formed by crimping a flexible circuit board to a rigid circuit board.
However, when stacking the mobile terminal, the thickness of the sensor module packaged with the COB is excessively large, and the space of the battery is compressed without thickening the entire thickness of the mobile terminal.
Disclosure of Invention
The embodiment of the disclosure provides a sensor module and a mobile terminal, which can solve the problem that the thickness of the sensor module packaged by COB is too large, and the space of a battery is compressed under the condition that the whole thickness of the mobile terminal is not thickened. The technical scheme is as follows:
according to an aspect of the embodiments of the present disclosure, there is provided a sensor module including: the optical collimator comprises a shell, an optical collimator, an optical glass cover plate, an optical-based sensor chip and a flexible circuit board;
the housing is provided with an accommodating cavity, and the optical collimator, the optical glass cover plate and the sensor chip are accommodated in the accommodating cavity in sequence from top to bottom;
the sensor Chip and the first end of the flexible circuit board are packaged in a Chip On Film (or Chip On Flex, COF) packaging mode, and the second end of the flexible circuit board is located outside the shell.
Optionally, an upward connection terminal is formed on one side of the sensor chip;
the connecting terminal is electrically connected with the first end of the flexible circuit board, and the first end of the flexible circuit board is located above the connecting terminal.
Optionally, the lower edge of the housing comprises: a first edge portion and a second edge portion;
a first edge portion of the housing is bonded to the other side of the sensor chip;
a second edge portion of the housing is bonded to a peripheral side position of the first end of the flexible circuit board.
Optionally, the sensor module further comprises: an integrated device located within the housing;
the integrated device is located over the first end of the flexible circuit board;
the sensor chip is electrically connected with the integrated device; the integrated device is electrically connected with the flexible circuit board.
Optionally, the accommodating cavity includes: a first accommodating cavity positioned at the upper part of the shell, and a second accommodating cavity positioned at the lower part of the shell;
the first accommodating cavity and the second accommodating cavity are separated by an annular supporting part;
the optical collimator is positioned in the first accommodating cavity;
the optical glass cover plate and the sensor chip are positioned in the second accommodating cavity;
the optical collimator, the hollow part of the annular supporting part and the optical glass cover plate form an incident light path of the sensor chip in sequence from top to bottom.
Optionally, the flexible circuit board is a COF flexible circuit board.
Optionally, an air gap exists between the optical collimator and the optical glass cover plate.
Optionally, the sensor chip is any one of an optical fingerprint sensor chip, a distance sensing sensor chip and an ambient light sensing sensor chip.
According to another aspect of the embodiments of the present disclosure, there is provided a mobile terminal including: the sensor module and the display screen module;
the display screen module includes: the display device comprises a glass cover plate, a self-luminous display layer and a shading layer;
one side surface of the self-luminous display layer is attached to the shading layer; the other side surface of the self-luminous display layer is attached to the glass cover plate;
an open pore area is formed on the shading layer, and the sensor module is positioned below the open pore area of the display screen module;
wherein the sensor module is a module as described above.
According to another aspect of the embodiments of the present disclosure, there is provided a packaging method of a sensor module for manufacturing the sensor module as described above, the method comprising:
packaging the sensor chip and the first end of the flexible circuit board in the COF packaging mode;
after the optical glass cover plate is attached to the sensor chip, fixing the optical glass cover plate and the sensor chip in the shell with the accommodating cavity;
and fixing the optical collimator in the accommodating cavity of the shell, wherein the optical collimator is positioned above the optical glass cover plate.
Optionally, an upward connection terminal is formed on one side of the sensor chip; and electrically connecting the connecting terminal of the sensor chip with the first end of the flexible circuit board, wherein the first end of the flexible circuit board is positioned above the connecting terminal.
Optionally, the accommodating cavity includes: a first accommodating cavity positioned at the upper part of the shell, and a second accommodating cavity positioned at the lower part of the shell; fixing the optical glass cover plate and the sensor chip in the second accommodating cavity in the sequence from top to bottom; the optical collimator is fixed in the first accommodating cavity.
Optionally, the lower edge of the housing comprises: a first edge portion and a second edge portion; mounting the attached optical glass cover plate and the sensor chip into the second accommodating cavity; bonding a first edge portion of the housing to the other side of the sensor chip; and bonding a second edge portion of the housing to a peripheral side position of the first end of the flexible circuit board.
Optionally, soldering the integrated device over the first end of the flexible circuit board; electrically connecting the sensor chip with the integrated device; and electrically connecting the integrated device with the flexible circuit board.
The technical scheme provided by the embodiment of the disclosure at least comprises the following beneficial effects:
the first ends of the sensor chip and the flexible circuit board are packaged in a COF packaging mode, so that electric connection between the sensor chip and the flexible circuit board is realized, and compared with a sensor module adopting a COB packaging mode in the related art, the sensor module adopting the COF packaging mode reduces the thickness of a soft and hard combined board, so that the thickness of the sensor module is reduced, and the space of a battery is enlarged under the condition that the whole thickness of the mobile terminal is not thickened.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.
FIG. 1 is a schematic diagram of an optical fingerprint module packaged by COB in the related art;
FIG. 2 is a schematic diagram of a sensor module according to an exemplary embodiment of the present disclosure;
FIG. 3 is a schematic diagram of an optical fingerprint module according to another exemplary embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a mobile terminal according to an exemplary embodiment of the present application;
FIG. 5 is a flow chart of a method of packaging a sensor module provided in one illustrative embodiment of the present application;
FIG. 6 is a flow chart of a method for bonding an optical glass cover plate and a sensor chip in a second receiving cavity provided in an exemplary embodiment of the present application;
the labels in the drawings are respectively:
10. a mobile terminal; 100. a sensor module; 110. a housing; 111. a first edge portion; 112. a second edge portion; 113. an annular support portion; 120. an optical collimator; 130. an optical glass cover plate; 140. a sensor chip; 150. a flexible circuit board; 151. a first end of the flexible circuit board; 152. a second end of the flexible circuit board; 160. a rigid-flex board; 170. an integrated device; 180. gold wires; 200. a display module; 210. a glass cover plate; 220. a self-luminous display layer; 230. a light shielding layer; 300. the user's finger.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present disclosure more apparent, the embodiments of the present application will be described in further detail below with reference to the accompanying drawings.
The mobile terminal adopts a mode of stacking the sensor modules under the screen, so that the screen occupation ratio of the full-screen mobile terminal is enlarged. Currently, a sensor module arranged below a display screen module of a mobile terminal adopts COB packaging, the COB packaging is to adhere a sensor chip to a soft and hard combined plate by using glue, and then wire bonding is carried out on the sensor chip and the soft and hard combined plate through gold wires, so that electrical connection between the sensor chip and the soft and hard combined plate is realized.
Taking the sensor module as an example, the mobile terminal adopts an under-screen fingerprint identification mode, so that openings are not required to be reserved on the front surface and the back surface of the mobile terminal for the optical fingerprint module, the screen occupation ratio of the full-screen mobile terminal is enlarged, and the integrity of the whole mobile terminal is ensured. The optical fingerprint module is used for collecting fingerprints of user fingers touching the mobile terminal screen. The screen matched with the optical fingerprint module is an Organic Light-Emitting Diode (OLED) screen, the mobile terminal sends incident Light through the OLED screen through a self-luminous source of the OLED screen, a user finger touching the screen of the full-screen mobile terminal is detected, then the optical fingerprint module receives reflected Light reflected by the user finger, and the mobile terminal compares the fingerprint carried by the reflected Light with the stored fingerprint, so that whether the fingerprint is correct or not is determined.
In the related art, the optical fingerprint module employs COB package. Referring to fig. 1, a schematic diagram of an optical fingerprint module 100 employing COB packaging is shown. The optical fingerprint module 100 in fig. 1 includes: the optical fingerprint device comprises a shell 110, an optical collimator 120, an optical glass cover plate 130, an optical fingerprint chip 140, a flexible circuit board 150, a rigid-flex board 160, an integrated device 170 and gold wires 180.
The housing 110 is formed with a receiving cavity, and the housing 110 is bonded to the rigid-flex board 160. The optical collimator 120, the optical glass 130 and the optical fingerprint chip 140 are accommodated in the accommodating cavity in the order from top to bottom. The optical fingerprint chip 140 and the soft and hard combination board 160 are packaged in a COB packaging mode, and the optical fingerprint chip 140 and the soft and hard combination board 160 are electrically connected through a gold wire 180. The first end 151 of the flexible circuit board 150 is crimped on the rigid-flex board 160, the rigid-flex board 160 is electrically connected to the flexible circuit board 150, and the second end 152 of the flexible circuit board 150 is located outside the housing 110. The integrated device 170 is electrically connected to the rigid-flex board 160. The receiving chamber of the housing 110 includes: a first receiving chamber at an upper portion of the housing 110, and a second receiving chamber at a lower portion of the housing 110. The optical glass cover plate 130 is attached to the optical fingerprint chip 140 and is located in the second accommodating cavity of the housing 110. The optical collimator 120 is located in the second accommodating chamber.
In the example that the sensor module is the optical fingerprint module, it can be seen that the sensor module adopts COB encapsulation for the thickness of sensor module is too big, under the condition that does not thicken mobile terminal's whole thickness, has compressed the space of battery.
The embodiment of the application provides a sensor module and a mobile terminal, wherein the sensor module adopts Chip On Film (or Chip On Flex (COF)) packaging, and the problem that the thickness of the sensor module adopting COB packaging in the related technology is overlarge, so that the battery space is compressed can be solved.
Fig. 2 shows a schematic structural diagram of a sensor module 100 according to an exemplary embodiment of the present application, where the sensor module 100 includes: a housing 110, an optical collimator 120, an optical glass cover 130, an optical-based sensor chip 140, and a flexible circuit board 150.
The housing 110 is formed with a receiving cavity, the bottom of which is hollow. Optionally, the housing 110 is made of a material with good light shielding property and electrical insulation property, so that stray light can be prevented from entering the surface of the sensor chip 140 from the side edge, and the normal operation of the sensor module 100 is prevented from being affected.
The optical collimator 120, the optical glass cover plate 130 and the sensor chip 140 are accommodated in the accommodating cavity in the order from top to bottom according to the paths which the optical paths pass through successively. The optical collimator 120 is used to adjust the angle of the light entering the sensor module 100 so that the light passing through the optical collimator 120 can be directed straight toward the optical glass cover 130. The optical glass cover 130 is used for filtering the incident light, and improving the quality of the light emitted to the sensor chip 140.
Optionally, an air gap exists between the optical collimator 120 and the optical glass cover plate 130, and the optical glass cover plate 130 is attached to the front surface of the sensor chip 140. Optionally, the optical glass cover plate 130 and the sensor chip 140 are bonded by an optical adhesive, the optical adhesive is colorless and transparent, the light transmittance is more than 90% and meets the optical characteristics, and no bubbles exist after the optical glass cover plate 130 and the sensor chip 140 are bonded.
The sensor chip 140 and the first end 151 of the flexible circuit board 150 are packaged in a COF package, and the second end 152 of the flexible circuit board 150 is located outside the housing 110.
Alternatively, one side of the sensor chip 140 is formed with an upward connection terminal. The COF package is to electrically connect the connection terminal and the first end of the flexible circuit board 150 through conductive adhesive, so as to realize the electrical connection between the sensor chip 140 and the flexible circuit board 150. Wherein the first end 151 of the flexible circuit board 150 is located above the connection terminals.
Optionally, the sensor chip schematically provided in this embodiment is any one of an optical fingerprint sensor chip, a distance sensing sensor chip, and an ambient light sensing sensor chip. Optionally, the sensor module is an off-screen sensor module.
In summary, in the sensor module provided in this embodiment, the first ends of the sensor chip and the flexible circuit board are packaged by adopting the COF packaging mode, so that the electrical connection between the sensor chip and the flexible circuit board is realized.
In this embodiment, the sensor module is an optical fingerprint module, and the structure of the optical fingerprint module adopting the COF packaging mode is schematically illustrated.
Fig. 3 is a schematic structural diagram of an optical fingerprint module 100 according to an exemplary embodiment of the present application, where the optical fingerprint module 100 includes: a housing 110, an optical collimator 120, an optical glass cover 130, an optical fingerprint chip 140, and a flexible circuit board 150.
The housing 110 is formed with a receiving cavity, the bottom of which is hollow, i.e., the bottom of the receiving cavity is free of material with the housing 110. Optionally, the housing 110 is made of a material with good light shielding property and electrical insulation property, so that stray light can be prevented from entering the surface of the optical fingerprint chip 140 from the side edge, and the normal operation of the optical fingerprint module 100 is prevented from being affected.
The optical collimator 120, the optical glass cover plate 130 and the optical fingerprint chip 140 are accommodated in the accommodating cavity according to the paths which the optical paths sequentially pass through from top to bottom. The optical collimator 120 is used for adjusting the angle of the light entering the optical fingerprint module 100, so that the light passing through the optical collimator 120 can be directly emitted to the optical glass cover 130. The optical glass cover 130 is used for filtering the incident light, and improving the quality of the light emitted to the optical fingerprint chip 140. The optical fingerprint chip 140 is configured to receive light from the optical glass cover 130, compare a fingerprint carried by the light with a stored fingerprint, and determine whether the fingerprint is correct.
Optionally, an air gap exists between the optical collimator 120 and the optical glass cover plate 130, and the optical glass cover plate 130 is attached to the front surface of the optical fingerprint chip 140. Optionally, the optical glass cover plate 130 and the optical fingerprint chip 140 are bonded by an optical bonding adhesive, the optical bonding adhesive is colorless and transparent, the light transmittance is more than 90% and meets the optical characteristics, and no bubbles exist after the optical glass cover plate 130 and the optical fingerprint chip 140 are bonded.
Optionally, the accommodating cavity of the housing 110 includes: a first receiving chamber at an upper portion of the housing 110, and a second receiving chamber at a lower portion of the housing 110.
The housing 110 further includes an annular supporting portion 113, the annular supporting portion 113 being a portion of the housing 110 extending in the central direction along the inner wall of the accommodating chamber. The first accommodation chamber and the second accommodation chamber are separated by an annular supporting portion 113.
The optical collimator 120 is located in the first accommodating chamber, and the optical collimator 120 is placed on the annular support 113.
The optical glass cover plate 130 and the optical fingerprint chip 140 are located in the second accommodating cavity, and the positions of the optical glass cover plate 130 and the optical collimator 120 are opposite, so that the optical glass cover plate 130 receives light passing through the optical collimator 120.
The optical collimator 120, the hollow portion of the annular supporting portion 113, and the optical glass cover plate 130 form an incident light path of the optical fingerprint chip 140 in order from top to bottom. The hollow portion of the annular support 113 refers to a space portion between the optical collimator 120 and the optical glass cover plate 130.
The optical fingerprint chip 140 and the first end 151 of the flexible circuit board 150 are packaged in a COF package, and the second end 152 of the flexible circuit board 150 is located outside the housing 110.
Alternatively, one side of the optical fingerprint chip 140 is formed with an upward connection terminal. The COF package is to electrically connect the connection terminal and the first end of the flexible circuit board 150 through conductive adhesive, so as to realize the electrical connection between the optical fingerprint chip 140 and the flexible circuit board 150. Wherein the first end 151 of the flexible circuit board 150 is located above the connection terminals.
Alternatively, the flexible circuit board 150 is a COF flexible circuit board, which is a package type flexible circuit board on which chips and components can be mounted.
Optionally, the optical fingerprint module 100 further includes: an integrated device 170 located within the housing 110.
The integrated device 170 is located over the first end 151 of the flexible circuit board 150.
The optical fingerprint chip 140 is electrically connected with the integrated device 170 through the flexible circuit board 150, and the integrated device 170 is electrically connected with the flexible circuit board 150 through a welding mode.
Optionally, the integrated device 170 is a collection of resistive, capacitive, etc. components.
Optionally, the lower edge of the housing 110 includes: a first edge portion 111 and a second edge portion 112.
The first edge portion 111 of the case 110 is adhered to the other side of the optical fingerprint chip 140 by a glue, and the second edge portion of the case 110 is adhered to the peripheral side of the first end 151 of the flexible circuit board 150 by a glue.
Alternatively, the glue may be a glue that meets the flatness requirements of the adhesive portion, such as a dry glue or a structural glue.
In one illustrative example, the thickness of the optical fingerprint module using the COF package is 1.175 cm, and the thickness of the optical fingerprint module using the COB package is 1.415 cm, and the thickness of the optical fingerprint module using the COF package is reduced by 0.34 cm.
In summary, in the sensor module provided in this embodiment, the first ends of the sensor chip and the flexible circuit board are packaged by adopting the COF packaging mode, so that the electrical connection between the sensor chip and the flexible circuit board is realized.
In the sensor module provided by the embodiment, the optical collimator, the optical glass cover plate and the sensor chip are accommodated in the accommodating cavity formed by the shell in the sequence from top to bottom, so that the light concentration received by the sensor chip is ensured, and the accuracy of the result obtained by the sensor chip is high.
In the sensor module provided by the embodiment, one side of the sensor chip is provided with the upward connecting terminal, the flexible circuit board is a COF flexible circuit board, the electrical connection between the connecting terminal and the first end of the flexible circuit board is realized, the electrical connection between the sensor chip and the flexible circuit board is realized, and the thickness of the flexible-rigid combined board is reduced by the sensor module.
In the sensor module provided in this embodiment, the integrated device in the housing is located above the first end of the flexible circuit board, the sensor chip is electrically connected to the integrated device through the flexible circuit board, and the integrated device is electrically connected to the flexible circuit board, so that the electrical connection among the sensor chip, the integrated device and the flexible circuit board is realized.
In the sensor module provided in this embodiment, on the one hand, the thickness of the sensor module adopting the COF packaging mode is reduced by 40% compared with the thickness of the sensor module adopting the COB packaging mode in the related art, the battery thickness space is enlarged, and on the other hand, the sensor module adopting the COF packaging mode lightens the weight of a rigid-flex board, reduces the overall weight of the mobile terminal, effectively improves the overall reliability of the mobile terminal, reduces the influence of the sensor module on the optical performance of the mobile terminal screen, and improves the bonding firmness of the sensor module.
The embodiment of the application schematically illustrates the structure of the sensor module in the mobile terminal in a COF package mode.
Fig. 4 is a schematic structural diagram of a mobile terminal 10 according to an exemplary embodiment of the present application, where the sensor module in the mobile terminal 10 is a sensor module as shown in fig. 2 or fig. 3, and the mobile terminal 10 includes: a sensor module 100 and a display module 200.
The display module 200 includes: a glass cover plate 210, a self-luminous display layer 220, and a light shielding layer 230.
One side surface of the self-luminous display layer 220 is bonded to the light shielding layer 230, and the other side surface of the self-luminous display layer 220 is bonded to the glass cover plate 210.
The light shielding layer 230 is formed with an opening area 231, and the sensor module 100 is located below the opening area 231 of the display module 200.
Alternatively, the self-luminous display layer 220 is an OLED screen. The OLED screen is provided with a self-light-emitting source, and the mobile terminal 10 makes the self-light-emitting source of the OLED screen emit incident light 240 to the glass cover 210 through the light shielding layer 230, the incident light 240 becomes reflected light 250 after being reflected by the finger 300 of the user, the reflected light 250 is directed from the open hole region 231 of the light shielding layer 230 to the sensor module 100 located below the open hole region 231, and the reflected light 250 is received by the sensor module 100.
Optionally, when the sensor module 100 is an optical fingerprint module, the optical fingerprint module 100 is configured to detect whether a fingerprint of the user's finger 300 touching the glass cover 210 matches a stored fingerprint, and when the fingerprints match, the mobile terminal 10 is unlocked.
In the mobile terminal provided by the embodiment, by using the sensor module adopting COF package provided by the embodiment, the space of the battery is enlarged and the cruising ability of the mobile terminal is ensured under the condition that the whole thickness of the mobile terminal is not thickened.
The embodiment of the application schematically illustrates a packaging method of a sensor module adopting a COF packaging mode.
Fig. 5 shows a flowchart of a method for packaging a sensor module according to an exemplary embodiment of the present application, where the method is used to manufacture the sensor module according to the foregoing embodiment, and the method includes:
in step 501, the sensor chip and the first end of the flexible circuit board are encapsulated by COF encapsulation.
An upward connection terminal is formed at one side of the sensor chip. The connecting terminal is electrically connected with the first end of the flexible circuit board through conductive adhesive, and the first end of the flexible circuit board is positioned above the connecting terminal. The second end of the flexible circuit board is located outside the housing. The COF package is to electrically connect the connection terminal with the first end of the flexible circuit board through conductive adhesive, so as to realize the electrical connection between the optical fingerprint chip and the flexible circuit board.
Alternatively, the flexible circuit board is a COF flexible circuit board, and the COF flexible circuit board is a package-type flexible circuit board on which chips and components can be mounted.
Step 502, an integrated device is soldered over a first end of a flexible circuit board.
And the integrated device is welded above the first end of the flexible circuit board in a welding mode, and is electrically connected with the flexible circuit board.
The sensor chip is electrically connected with the integrated device through the flexible circuit board.
Optionally, the integrated device is a set of components such as a resistor, a capacitor, and the like.
In step 503, after the optical glass cover plate is attached to the sensor chip, the optical glass cover plate and the sensor chip are fixed in the housing with the accommodating cavity formed therein.
The housing further includes an annular supporting portion, which is a portion of the housing extending in a central direction along an inner wall of the accommodating chamber. The first accommodating cavity and the second accommodating cavity are separated by the annular supporting part. The housing forms a receiving cavity including a first receiving cavity at an upper portion of the housing and a second receiving cavity at a lower portion of the housing.
And (3) bonding the optical glass cover plate and the sensor chip through optical bonding glue, and fixing the bonded optical glass cover plate, the bonded sensor chip and the bonded integrated device in a second accommodating cavity of the shell.
Optionally, the optical laminating adhesive is colorless and transparent, has light transmittance of more than 90% and meets the optical characteristics, and the optical glass cover plate and the optical fingerprint chip are bonded without bubbles.
And in the second accommodating cavity, the optical glass cover plate and the sensor chip are adhered in the second accommodating cavity through colloid according to the sequence from top to bottom. Referring to fig. 6, a method of adhesively bonding an optical glass cover plate and a sensor chip in a second accommodating cavity is shown, the method comprising the steps of:
the lower edge of the housing includes: a first edge portion and a second edge portion.
In step 5031, the attached optical glass cover plate and the sensor chip are mounted in the second accommodating cavity.
Step 5032, adhering the first edge portion of the housing to the other side of the sensor chip by glue.
In step 5033, the second edge portion of the case is glued to the peripheral side of the first end of the flexible circuit board.
Alternatively, the glue may be a glue that meets the flatness requirements of the adhesive portion, such as a dry glue or a structural glue.
Optionally, the shell is made of a material with good light shielding property and electrical insulation property, so that stray light can be prevented from entering the surface of the optical fingerprint chip from the side edge, and normal operation of the optical fingerprint module is prevented from being influenced.
At step 504, the optical collimator is secured within the receiving cavity of the housing.
An optical collimator is arranged in the first accommodating cavity and is positioned above the optical glass cover plate.
Optionally, the optical collimator is fixed to the annular support by means of a glue. When the optical collimator is fixed, the positions of the optical glass cover plate and the optical collimator are opposite, so that the optical glass cover plate is ensured to receive light passing through the optical collimator, and the optical collimator, the hollow part of the annular supporting part and the optical glass cover plate form an incident light path of the optical fingerprint chip according to the sequence from top to bottom. Wherein, the hollow part of the annular supporting part refers to a spacing part between the optical collimator and the optical glass cover plate.
Alternatively, the glue may be a glue that meets the flatness requirements of the adhesive portion, such as a dry glue or a structural glue.
It should be noted that the sensor chip schematically provided in this embodiment is any one of an optical fingerprint sensor chip, a distance sensor chip, and an ambient light sensor chip
In summary, in the method provided in this embodiment, the first ends of the sensor chip and the flexible circuit board are encapsulated by the COF encapsulation method, so that the thickness of the sensor module encapsulated by the COF is reduced compared with the COB encapsulation method in the related art, and the space of the battery is enlarged.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (12)
1. A sensor module, the sensor module comprising: the optical collimator comprises a shell, an optical collimator, an optical glass cover plate, an optical-based sensor chip and a flexible circuit board;
the housing is provided with an accommodating cavity, and the optical collimator, the optical glass cover plate and the sensor chip are accommodated in the accommodating cavity in sequence from top to bottom;
the accommodation chamber includes: a first accommodating cavity positioned at the upper part of the shell, and a second accommodating cavity positioned at the lower part of the shell;
the first accommodating cavity and the second accommodating cavity are separated by an annular supporting part;
the optical collimator is positioned in the first accommodating cavity;
the optical glass cover plate and the sensor chip are positioned in the second accommodating cavity;
the optical collimator, the hollow part of the annular supporting part and the optical glass cover plate form an incident light path of the sensor chip in sequence from top to bottom;
the sensor chip and the first end of the flexible circuit board are packaged in a COF (chip on film) packaging mode, and the second end of the flexible circuit board is positioned outside the shell.
2. The sensor module of claim 1, wherein one side of the sensor chip is formed with an upward connection terminal;
the connecting terminal is electrically connected with the first end of the flexible circuit board, and the first end of the flexible circuit board is located above the connecting terminal.
3. The sensor module of claim 2, wherein the lower edge of the housing comprises: a first edge portion and a second edge portion;
a first edge portion of the housing is bonded to the other side of the sensor chip;
a second edge portion of the housing is bonded to a peripheral side position of the first end of the flexible circuit board.
4. The sensor module of claim 2, further comprising: an integrated device located within the housing;
the integrated device is located over the first end of the flexible circuit board;
the sensor chip is electrically connected with the integrated device; the integrated device is electrically connected with the flexible circuit board.
5. The sensor module of any one of claims 1 to 4, wherein the flexible circuit board is a COF flexible circuit board.
6. The sensor module of any one of claims 1 to 4, wherein an air gap exists between the optical collimator and the optical glass cover plate.
7. The sensor module of any one of claims 1 to 4, wherein the sensor chip is any one of an optical fingerprint sensor chip, a distance sensing sensor chip, and an ambient light sensing sensor chip.
8. A mobile terminal, the mobile terminal comprising: the sensor module and the display screen module;
the display screen module includes: the display device comprises a glass cover plate, a self-luminous display layer and a shading layer;
one side surface of the self-luminous display layer is attached to the shading layer; the other side surface of the self-luminous display layer is attached to the glass cover plate;
an open pore area is formed on the shading layer, and the sensor module is positioned below the open pore area of the display screen module;
wherein the sensor module is a module according to any of the preceding claims 1 to 7.
9. A method of packaging a sensor module, wherein the method is used to manufacture a sensor module according to any of claims 1 to 7, the sensor module comprising: the optical collimator, optical glass apron, based on optics sensor chip and flexible circuit board, the casing is formed with the holding chamber, the holding intracavity has according to last order from top to bottom the optical collimator optical glass apron with the sensor chip, the holding chamber includes: a first accommodating cavity positioned at the upper part of the shell, and a second accommodating cavity positioned at the lower part of the shell; the first accommodating cavity and the second accommodating cavity are separated by an annular supporting part;
the method comprises the following steps:
packaging the sensor chip and the first end of the flexible circuit board in a COF packaging mode;
fixing the optical glass cover plate and the sensor chip in the second accommodating cavity in the sequence from top to bottom, wherein the optical collimator, the hollow part of the annular supporting part and the optical glass cover plate form an incident light path of the sensor chip in the sequence from top to bottom;
and fixing the optical collimator in the first accommodating cavity, wherein the optical collimator is positioned above the optical glass cover plate.
10. The method of claim 9, wherein one side of the sensor chip is formed with upward connection terminals;
the packaging the sensor chip and the first end of the flexible circuit board in a COF packaging mode comprises the following steps:
and electrically connecting the connecting terminal of the sensor chip with the first end of the flexible circuit board, wherein the first end of the flexible circuit board is positioned above the connecting terminal.
11. The method of claim 9 or 10, wherein the lower edge of the housing comprises: a first edge portion and a second edge portion;
the fixing the optical glass cover plate and the sensor chip in the second accommodating cavity comprises:
mounting the attached optical glass cover plate and the sensor chip into the second accommodating cavity;
bonding a first edge portion of the housing to the other side of the sensor chip;
and bonding a second edge portion of the housing to a peripheral side position of the first end of the flexible circuit board.
12. The method according to claim 9 or 10, characterized in that the method further comprises:
soldering an integrated device over the first end of the flexible circuit board;
electrically connecting the sensor chip with the integrated device; and electrically connecting the integrated device with the flexible circuit board.
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| CN201811458169.6A CN111259693B (en) | 2018-11-30 | 2018-11-30 | Sensor module and mobile terminal |
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| CN201811458169.6A CN111259693B (en) | 2018-11-30 | 2018-11-30 | Sensor module and mobile terminal |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207182353U (en) * | 2017-09-15 | 2018-04-03 | 南昌欧菲生物识别技术有限公司 | Optical finger print recognizer component and electronic installation |
| CN107958237A (en) * | 2017-12-29 | 2018-04-24 | 维沃移动通信有限公司 | A kind of fingerprint recognition module and electronic equipment |
| CN108132563A (en) * | 2018-01-18 | 2018-06-08 | 广东欧珀移动通信有限公司 | Backlight module, display screen and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103996684B (en) * | 2014-05-20 | 2017-06-20 | 格科微电子（上海）有限公司 | Image sensor architecture and its method for packing |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207182353U (en) * | 2017-09-15 | 2018-04-03 | 南昌欧菲生物识别技术有限公司 | Optical finger print recognizer component and electronic installation |
| CN107958237A (en) * | 2017-12-29 | 2018-04-24 | 维沃移动通信有限公司 | A kind of fingerprint recognition module and electronic equipment |
| CN108132563A (en) * | 2018-01-18 | 2018-06-08 | 广东欧珀移动通信有限公司 | Backlight module, display screen and electronic equipment |
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