CN111258125A - Display panel, preparation method thereof and display device - Google Patents
Display panel, preparation method thereof and display device Download PDFInfo
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- CN111258125A CN111258125A CN202010105103.XA CN202010105103A CN111258125A CN 111258125 A CN111258125 A CN 111258125A CN 202010105103 A CN202010105103 A CN 202010105103A CN 111258125 A CN111258125 A CN 111258125A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 153
- 238000004132 cross linking Methods 0.000 claims abstract description 27
- 239000003292 glue Substances 0.000 claims abstract description 19
- 238000007789 sealing Methods 0.000 claims abstract description 19
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000001301 oxygen Substances 0.000 claims abstract description 12
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 242
- 239000011241 protective layer Substances 0.000 claims description 53
- 238000009832 plasma treatment Methods 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 10
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 4
- 229910052734 helium Inorganic materials 0.000 claims description 4
- 239000001307 helium Substances 0.000 claims description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000000565 sealant Substances 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 239000007789 gas Substances 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 7
- 239000010409 thin film Substances 0.000 description 18
- 239000004973 liquid crystal related substance Substances 0.000 description 12
- 239000012945 sealing adhesive Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
Abstract
The embodiment of the invention provides a display panel, a preparation method thereof and a display device, relates to the technical field of display, and can avoid display faults of the display panel caused by gas generated by an organic insulating layer; and the influence of water vapor and oxygen on the display effect of the display panel can be avoided. A display panel has a display area; the display panel comprises an array substrate, a box aligning substrate and frame sealing glue, wherein the array substrate and the box aligning substrate are mutually abutted, and the frame sealing glue is arranged between the array substrate and the box aligning substrate; the array substrate comprises a flat layer; the array substrate comprises a flat layer, a first inorganic insulating layer, an organic insulating layer, a second inorganic insulating layer and a cross-linking pattern, wherein the flat layer comprises the first inorganic insulating layer, the organic insulating layer and the second inorganic insulating layer which are sequentially stacked in the direction that the array substrate points to the box-aligning substrate; the cross-linking pattern is positioned on one side of the frame sealing glue departing from the display area.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel, a preparation method of the display panel and a display device.
Background
The display device comprises an array substrate, wherein the array substrate comprises a substrate and a thin film transistor arranged on the substrate, the transistor has a certain pattern, and the array substrate needs to be subjected to planarization treatment by using a planarization layer.
In the prior art, since organic materials have the characteristics of low dielectric constant, high thickness and planarization, organic insulating materials are generally used as materials of planarization layers.
Disclosure of Invention
The embodiment of the invention provides a display panel, a preparation method thereof and a display device, which can avoid display faults of the display panel caused by gas generated by an organic insulating layer; and the influence of water vapor and oxygen on the display effect of the display panel can be avoided.
In order to achieve the above purpose, the embodiment of the invention adopts the following technical scheme:
in a first aspect, a display panel is provided, having a display area; the display panel comprises an array substrate, a box aligning substrate and frame sealing glue, wherein the array substrate and the box aligning substrate are mutually abutted, and the frame sealing glue is arranged between the array substrate and the box aligning substrate; the array substrate comprises a flat layer; the array substrate comprises a box substrate, a flat layer and a plurality of groups of organic insulating layers, wherein the flat layer comprises a first inorganic insulating layer, an organic insulating layer and a second inorganic insulating layer which are sequentially stacked in the direction of pointing to the box substrate along the array substrate, and the array substrate further comprises a cross-linking pattern arranged between the organic insulating layer and the second inorganic insulating layer; the cross-linking pattern is positioned on one side of the frame sealing glue departing from the display area.
Optionally, the array substrate further includes a protective layer disposed between the cross-linked pattern and the second inorganic insulating layer, and an orthogonal projection of the protective layer on the paired box substrates completely overlaps an orthogonal projection of the cross-linked pattern on the paired box substrates.
Optionally, edges of the first inorganic insulating layer and the second inorganic insulating layer exceed edges of the organic insulating layer; the crosslinked pattern covers a side surface of the organic insulating layer and a surface close to the pair of cartridge substrates.
Optionally, the organic insulating layer includes a trench, and an orthographic projection of the trench on the pair of box substrates overlaps with an orthographic projection of the frame sealing glue on the pair of box substrates.
Optionally, the array substrate further includes a first electrode disposed between the organic insulating layer and the second inorganic insulating layer; the first electrode is at least positioned in the display area, and the first electrode and the protective layer are made of the same layer and the same material.
In a second aspect, a display device is provided, which includes the display panel of the first aspect.
In a third aspect, a method for manufacturing a display panel having a display area is provided, including: respectively forming an array substrate and a box aligning substrate, and aligning the array substrate and the box aligning substrate by using frame sealing glue; forming the array substrate, including: sequentially forming a first inorganic insulating layer and an organic insulating layer on a substrate; forming a cross-linking pattern and a protective layer on one side, away from the substrate, of the organic insulating layer, wherein the protective layer is located on one side, away from the substrate, of the cross-linking pattern; the cross-linking pattern and the protective layer are positioned on one side of the frame sealing glue, which is far away from the display area, and the orthographic projections of the cross-linking pattern and the protective layer on the substrate are completely overlapped; and forming a second inorganic insulating layer on one side of the organic insulating layer, which is far away from the substrate, wherein the first inorganic insulating layer, the organic insulating layer and the second inorganic insulating layer form a flat layer.
Optionally, the forming a crosslinked pattern and a protective layer on a side of the organic insulating layer facing away from the substrate includes: performing plasma treatment on the organic insulating layer to form a crosslinked layer; forming a protective layer on one side of the crosslinking layer, which is far away from the substrate; and carrying out plasma treatment on the crosslinking layer by taking the protective layer as a mask to form the crosslinking pattern.
Optionally, performing plasma treatment on the organic insulating layer to form a crosslinked layer, including: performing plasma treatment on the surface of the organic insulating layer, which is far away from the substrate, by using one of helium or argon; treating the crosslinked layer to form the crosslinked pattern, comprising: performing plasma treatment on the cross-linked layer using one of nitrogen, oxygen, and hydrogen to form the cross-linked pattern; and carrying out plasma treatment on the surface of the organic insulating layer, which is far away from the substrate, and carrying out plasma treatment on the crosslinking layer for the same time and power.
Optionally, the surface of the organic insulating layer away from the substrate is subjected to plasma treatment, the time range of the plasma treatment on the crosslinked layer is 10-30 s, and the power range is 8-24 kw.
Optionally, the array substrate further includes a first electrode located in the display region; the protective layer and the first electrode are formed through the same composition process.
The embodiment of the invention provides a display panel, a preparation method thereof and a display device. Therefore, on the one hand, during high-temperature, high-humidity and high-reliability evaluation, gas released by the organic insulating layer does not penetrate through the cross-linked pattern and enter the interface between the first inorganic insulating layer and the second inorganic insulating layer, so that the first inorganic insulating layer and the second inorganic insulating layer are floated, and the display failure of the display panel is caused; on the other hand, although the cross-linking pattern is arranged on the side of the frame sealing glue departing from the display area, the connection between the cross-linking pattern and the protective layer is not firm, water vapor and oxygen are blocked by the frame sealing glue after entering the interface, and cannot further enter the display area, so that an LC bubble cannot be formed in the display area, and the display effect of the display panel is not influenced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic top view of a display panel according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view taken along line A-A1 of FIG. 1;
FIG. 3 is a schematic diagram of a process for forming a cross-linked pattern according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a display panel provided in the prior art;
fig. 5 is a schematic structural diagram of a display panel provided in the prior art;
fig. 6 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
fig. 7 is a flowchart illustrating a process of manufacturing a display panel according to an embodiment of the invention;
fig. 8 is a schematic diagram of a process of forming a cross-linked pattern according to an embodiment of the present invention.
Reference numerals:
10-an array substrate; 11-a substrate; 121 — a first inorganic insulating layer; 122 — an organic insulating layer; 123-a second inorganic insulating layer; 13-a thin film transistor; 14-a cross-linking pattern; 141-a crosslinked layer; 15-a protective layer; 16-a first electrode; 17-a second electrode; 20-pair of cassette substrates; 30-frame sealing glue; 41-an orientation layer; 51-liquid crystal bubbles; 60-liquid crystal layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
An embodiment of the present invention provides a display panel, as shown in fig. 1 and 2, having a display area; the display panel comprises an array substrate 10 and a box-aligning substrate 20 which are mutually matched, and frame sealing glue 30 arranged between the array substrate 10 and the box-aligning substrate 20; the array substrate 10 includes a planarization layer; along the direction in which the array substrate 10 points to the opposite-box substrate 20, the planarization layer includes a first inorganic insulating layer 121, an organic insulating layer 122, and a second inorganic insulating layer 123, which are sequentially stacked, and the array substrate 10 further includes a cross-linked pattern 14 disposed between the organic insulating layer 122 and the second inorganic insulating layer 123; the cross-linking pattern 14 is located on a side of the frame sealing adhesive 30 away from the display region.
In some embodiments, the array substrate 10 further includes a substrate 11 and a thin film transistor 13 disposed between the substrate 11 and the planarization layer.
Since the thin film transistor 13 has a certain pattern, the surface of the array substrate 10 is uneven, and therefore, a flat layer can be disposed on the side of the thin film transistor 13 away from the substrate 11.
The thin film transistor 13 may be at least one of a bottom gate type thin film transistor, a top gate type thin film transistor, or a double gate type thin film transistor.
In some embodiments, the display panel further includes a color filter layer, a black matrix, and an alignment layer 41. The color filter layer and the black matrix may be provided on the array substrate 10 or may be provided on the opposing substrate 20. The alignment layer 41 is provided on both the array substrate 10 and the opposing cassette substrate 20.
In some embodiments, compared to an inorganic insulating material, the organic insulating material can reduce the parasitic capacitance of the display panel, thereby facilitating the circuit board to drive the display panel to display.
It is considered that moisture and oxygen easily enter the display area through the organic insulating layer 122, which affects the overall display effect of the display panel. Therefore, in the embodiment of the invention, the first inorganic insulating layer 121 is disposed on the organic insulating layer 122 close to the substrate 11, and the second inorganic insulating layer 123 is disposed on the organic insulating layer 122 away from the substrate 11.
In some embodiments, the display panel further includes a non-display region located at a periphery of the display region. The frame sealing glue 30 and the cross-linked pattern 14 are both located in the non-display region.
The first inorganic insulating layer 121, the organic insulating layer 122, and the second inorganic insulating layer 123 in the planarization layer are located in both the display region and the non-display region.
In some embodiments, the material of the first inorganic insulating layer 121 and the second inorganic insulating layer 123 may be, for example, silicon nitride (SiN)x) Or silicon oxide (SiO)y) Etc. transparent inorganic insulating materials. The material of the first inorganic insulating layer 121 and the material of the second inorganic insulating layer 123 may be the same or different.
The material of the organic insulating layer 122 may be, for example, a transparent organic insulating material such as resin.
In some embodiments, the crosslinked pattern 14 may be obtained by processing the organic insulating layer 122.
Specifically, as shown in fig. 3, the organic insulating layer 122 may be plasma-treated using one of helium (He) or argon (Ar) to obtain the crosslinked layer 141. The crosslinking layer 141 covers the side of the organic insulating layer 122 and the surface facing away from the substrate 11.
Then, a protective layer 15 is formed on the side of the crosslinked layer 141 opposite to the substrate 11, and nitrogen (N) gas is used with the protective layer 15 as a mask2) Oxygen (O)2) Hydrogen (H)2) The cross-linked layer 141 is subjected to plasma treatment to form the cross-linked pattern 14.
Here, the orthogonal projection of the crosslinked pattern 14 on the substrate 11, which is obtained using the protective layer 15 as a mask, completely overlaps the orthogonal projection of the crosslinked pattern 14 on the substrate 11.
In some embodiments, after forming the cross-linked pattern 14, the protective layer 15 may be removed, and the protective layer 15 may also remain.
Alternatively, the protective layer 15 may be left to reduce the process of peeling off the protective layer 15, thereby simplifying the manufacturing process of the array substrate 10.
In some embodiments, the material of the protective layer 15 is not limited as long as the pattern of the protective layer 15 is not affected during the formation of the cross-linked pattern 14 from the cross-linked layer 141.
In the related art, since the surface of the organic insulating layer 122 is rough, when the display panel is evaluated to have high reliability under high temperature and high humidity, the high temperature may force the organic insulating layer 122 to release gas into the interface between the first inorganic insulating layer 121 and the second inorganic insulating layer 123, which may cause the first inorganic insulating layer 121 and the second inorganic insulating layer 123 to float (fig. 4), thereby causing display failure of the display panel.
On the other hand, if the smooth and dense crosslinked layer 141 is formed, the gas released from the organic insulating layer 122 cannot enter the interface between the first inorganic insulating layer 121 and the second inorganic insulating layer 123 during the evaluation of the reliability under high temperature, high humidity and high pressure. However, the smooth cross-linked layer 141 may affect the fixed connection between the organic insulating layer 122 and the second inorganic insulating layer 123, and moisture and oxygen easily enter the display area of the display panel from the interface between the organic insulating layer 122 and the second inorganic insulating layer 123 to form liquid crystal bubbles (LC bubbles) 51 as shown in fig. 5, which may affect the display effect of the display panel.
Accordingly, the embodiment of the invention provides a display panel, which includes a cross-linked pattern 14 disposed between an organic insulating layer 122 and a second inorganic insulating layer 123, and the cross-linked pattern 14 is only located on a side of the frame sealing adhesive 30 departing from the display area. As described above, in the high-temperature, high-humidity and high-reliability evaluation, on the other hand, the gas released from the organic insulating layer 122 does not penetrate through the cross-linked pattern 14 and enter the interface between the first inorganic insulating layer 121 and the second inorganic insulating layer 123, and the first inorganic insulating layer 121 and the second inorganic insulating layer 123 float, thereby causing display failure of the display panel; on the other hand, although the cross-linked pattern 14 is disposed on the side of the frame sealing adhesive 30 away from the display area, which results in the connection between the cross-linked pattern 14 and the protective layer 15 being insecure, after water vapor and oxygen enter the interface, they are blocked by the frame sealing adhesive 30 and cannot further enter the display area, and therefore, LC bubbles are not formed in the display area, which affects the display effect of the display panel.
Alternatively, as shown in fig. 2, edges of the first inorganic insulating layer 121 and the second inorganic insulating layer 123 exceed edges of the organic insulating layer 122; the crosslinked pattern 14 and the protective layer 15 cover the side of the organic insulating layer 122 and the surface facing away from the substrate 11.
In the embodiment of the present invention, the edges of the first inorganic insulating layer 121 and the second inorganic insulating layer 123 exceed the edge of the organic insulating layer 122, so that water vapor and oxygen can be prevented from entering the organic insulating layer 122 from the side surface of the organic insulating layer 122, and further entering the display panel. Meanwhile, the crosslinked pattern 14 covers the side surface of the organic insulating layer 122 and the surface facing away from the substrate 11, and thus, gas generated in the organic insulating layer 122 can be effectively prevented from being released to the outside of the display panel from the side surface of the organic insulating layer 122 and the surface facing away from the substrate 11.
Optionally, as shown in fig. 2, the organic insulating layer 122 includes a trench, and an orthogonal projection of the trench on the substrate 11 overlaps an orthogonal projection of the sealant 30 on the substrate 11.
In some embodiments, the depth of the trench may be less than or equal to the thickness of the organic insulating layer 122.
When the depth of the trench is equal to the thickness of the organic insulating layer 122, the trench penetrates through the organic insulating layer 122.
In the embodiment of the present invention, the grooves are disposed in the organic insulating layer 122, and the orthographic projection of the grooves on the substrate 11 is overlapped with the orthographic projection of the frame sealing adhesive 30 on the substrate 11, so that the organic insulating layer 122 is more firmly disposed between the array substrate 10 and the box aligning substrate 20, thereby improving the water blocking performance of the frame sealing adhesive 30.
Optionally, as shown in fig. 6, the array substrate 10 further includes a first electrode 16 disposed between the organic insulating layer 122 and the second inorganic insulating layer 123; the first electrode 16 is at least located in the display region, and the first electrode 16 and the protective layer 15 are made of the same material in the same layer.
On this basis, the array substrate 10 further includes a second electrode 17 disposed on a side of the second inorganic insulating layer 123 away from the substrate 11; the display panel further includes a liquid crystal layer 60 disposed between the array substrate 10 and the opposite-to-cell substrate 20; the second electrode 17 and the liquid crystal layer 60 are located at least in the display region; the first electrode 16 and the second electrode 17 are used for driving the liquid crystal in the liquid crystal layer 60 to deflect.
In some embodiments, the first electrode 16 is a pixel electrode, and the second electrode 17 is a common electrode; alternatively, the first electrode 16 is a common electrode, and the second electrode 17 is a pixel electrode.
Here, the first electrode 16 is taken as an example of a pixel electrode, and the pixel electrode is electrically connected to the drain of the thin film transistor 13. A via hole may be formed in the organic insulating layer 122, so that the pixel electrode is electrically connected to the drain electrode of the thin film transistor 13, and the pixel electrode and other signal lines are prevented from being arranged in the same layer and being affected by each other; meanwhile, the width of the black matrix can be reduced, and the aperture opening ratio of the display panel is improved.
In some embodiments, the first electrode 16 and the protection layer 15 are made of the same material in the same layer, that is, the first electrode 16 and the protection layer 15 are formed through the same patterning process, so that the manufacturing process of the array substrate 10 can be simplified.
Here, the material of the first electrode 16 and the protective layer 15 may be a transparent conductive material such as Indium Tin Oxide (ITO).
An embodiment of the present invention further provides a display device, including the display panel according to any one of the foregoing embodiments.
In some embodiments, the use of the display device is not limited, and the display device may be used, for example, as a computer, a tablet computer, a mobile phone, a watch, and the like.
In some embodiments, the display device may further include a backlight module disposed on a side of the array substrate 10 facing away from the opposite-box substrate 20 for providing a light source for the display panel.
Here, the backlight module may be a side-in type backlight module or a direct type backlight module.
Embodiments of the present invention provide a display device having the same technical effects as those of the display panel, and are not described herein again.
The embodiment of the invention also provides a preparation method of the display panel, the display panel is provided with a display area, and the preparation method of the display panel comprises the following steps: the array substrate 10 and the opposing substrate 20 are formed separately, and the array substrate 10 and the opposing substrate 20 are aligned by the sealant 30.
As shown in fig. 7, the formation of the array substrate 10 can be achieved by the following steps:
s11, the first inorganic insulating layer 121 and the organic insulating layer 122 are sequentially formed on the substrate 11.
In some embodiments, before forming the first inorganic insulating layer 121, the method for preparing the array substrate 10 further includes: the thin film transistor 13 is formed.
The thin film transistor 13 may be at least one of a bottom gate type thin film transistor, a top gate type thin film transistor, or a double gate type thin film transistor.
In some embodiments, the organic insulating layer 122 may be formed using a photolithography process.
If the material of the organic insulating layer 122 includes a photosensitive material, coating, exposing, and developing processes may be performed to obtain the organic insulating layer 122.
If the material of the organic insulating layer 122 does not include a photosensitive material, an organic insulating film and a photoresist may be sequentially formed on the substrate 11, the photoresist is exposed and developed to form a photoresist pattern, the organic insulating film is etched to form the organic insulating layer 122, and finally the photoresist pattern is removed.
S12, forming a cross-linked pattern 14 and a protective layer 15 on the side, away from the substrate 11, of the organic insulating layer 122, wherein the protective layer 15 is positioned on the side, away from the substrate 11, of the cross-linked pattern 14; the cross-linked pattern 14 and the protective layer 15 are located on the side of the frame sealing adhesive 30 away from the display area, and orthographic projections of the cross-linked pattern 14 and the protective layer 15 on the substrate 11 are completely overlapped.
Here, as shown in fig. 4, the organic insulating layer 122 may be subjected to plasma treatment to form a crosslinked layer 141; thereafter, as shown in fig. 8, the protective layer 15 is formed on the side of the crosslinked layer 141 facing away from the substrate 11; the crosslinked layer 141 is subjected to plasma treatment using the protective layer 15 as a mask, thereby forming a crosslinked pattern 14 as shown in fig. 2.
Here, the organic insulating layer 122 may be subjected to plasma treatment using, for example, one of He or Ar to obtain the crosslinked layer 141.
For example, N can be used2、O2、H2Is performed plasma to the cross-linked layer 141And bulk processed to form a crosslinked pattern 14.
In some embodiments, after forming the cross-linked pattern 14, the protective layer 15 may be removed, and the protective layer 15 may also remain.
Alternatively, the protective layer 15 may be left to reduce the process of peeling off the protective layer 15, thereby simplifying the manufacturing process of the array substrate 10.
In some embodiments, the material of the protective layer 15 is not limited as long as the pattern of the protective layer 15 is not affected during the formation of the cross-linked pattern 14 from the cross-linked layer 141.
S13, forming a second inorganic insulating layer 123 on the side of the organic insulating layer 122 away from the substrate 11, wherein the first inorganic insulating layer 121, the organic insulating layer 122, and the second inorganic insulating layer 123 form a flat layer.
In the related art, since the surface of the organic insulating layer 122 is rough, when the display panel is evaluated to have high reliability under high temperature and high humidity, the high temperature may force the organic insulating layer 122 to release gas into the interface between the first inorganic insulating layer 121 and the second inorganic insulating layer 123, which may cause the first inorganic insulating layer 121 and the second inorganic insulating layer 123 to float (fig. 4), thereby causing display failure of the display panel.
On the other hand, if the smooth and dense crosslinked layer 141 is formed, the gas released from the organic insulating layer 122 cannot enter the interface between the first inorganic insulating layer 121 and the second inorganic insulating layer 123 during the evaluation of the reliability under high temperature, high humidity and high pressure. However, the smooth cross-linked layer 141 may affect the fixed connection between the organic insulating layer 122 and the second inorganic insulating layer 123, and moisture and oxygen easily enter the display area of the display panel from the interface between the organic insulating layer 122 and the second inorganic insulating layer 123 to form liquid crystal bubbles (LC bubbles) 51 as shown in fig. 5, which may affect the display effect of the display panel.
Accordingly, the embodiment of the invention provides a method for manufacturing a display panel, which includes an array substrate 10 and a box-aligning substrate 20. The array substrate includes a cross-linked pattern 14 disposed between the organic insulating layer 122 and the second inorganic insulating layer 123, and the cross-linked pattern 14 is only located on a side of the frame sealing adhesive 30 away from the display region. As described above, in the high-temperature, high-humidity and high-reliability evaluation, on the other hand, the gas released from the organic insulating layer 122 does not penetrate through the cross-linked pattern 14 and enter the interface between the first inorganic insulating layer 121 and the second inorganic insulating layer 123, and the first inorganic insulating layer 121 and the second inorganic insulating layer 123 float, thereby causing display failure of the display panel; on the other hand, although the cross-linked pattern 14 is disposed on the side of the frame sealing adhesive 30 away from the display area, which results in the connection between the cross-linked pattern 14 and the protective layer 15 being insecure, after water vapor and oxygen enter the interface, they are blocked by the frame sealing adhesive 30 and cannot further enter the display area, and therefore, LC bubbles are not formed in the display area, which affects the display effect of the display panel.
Alternatively, the surface of the organic insulating layer 122 facing away from the substrate 11 is subjected to plasma treatment for the same time and power as those for the plasma treatment of the crosslinked layer 141.
Here, the surface of the organic insulating layer 122 facing away from the substrate 11 is plasma-treated, and the cross-linked layer 141 is plasma-treated for a time ranging from 10 to 30 seconds and at a power ranging from 8 to 24 kw.
In the embodiment of the invention, on one hand, it is avoided that the part of the cross-linked layer 141 except the cross-linked pattern 14 is not completely removed due to the fact that the time and/or power for performing the plasma treatment on the cross-linked layer 141 is too small; on the other hand, it is also possible to prevent the organic insulating layer 122 located under the crosslinked layer 141 from being affected by an excessive plasma treatment time and/or power applied to the crosslinked layer 141.
Optionally, as shown in fig. 6, the array substrate 10 further includes a first electrode 16 located in the display region; the protective layer 15 and the first electrode 16 are formed by the same patterning process.
Here, the material of the first electrode 16 and the protective layer 15 may be, for example, a transparent conductive material such as ITO.
On this basis, the array substrate 10 further includes a second electrode 17 disposed on a side of the second inorganic insulating layer 123 away from the substrate 11; the display panel further includes a liquid crystal layer 60 disposed between the array substrate 10 and the opposite-to-cell substrate 20; the second electrode 17 and the liquid crystal layer 60 are located at least in the display region; the first electrode 16 and the second electrode 17 are used for driving the liquid crystal in the liquid crystal layer 60 to deflect.
In some embodiments, the first electrode 16 is a pixel electrode, and the second electrode 17 is a common electrode; alternatively, the first electrode 16 is a common electrode, and the second electrode 17 is a pixel electrode.
Here, the first electrode 16 is taken as an example of a pixel electrode, and the pixel electrode is electrically connected to a drain electrode of the thin film transistor. A via hole may be formed in the organic insulating layer 122, so that the pixel electrode is electrically connected to the drain electrode of the thin film transistor, and the pixel electrode and other signal lines are prevented from being arranged in the same layer and being affected by each other; meanwhile, the width of the black matrix can be reduced, and the aperture opening ratio of the display panel is improved.
In the embodiment of the invention, the protective layer 15 and the first electrode 16 are obtained through the same patterning process, so that the preparation process of the array substrate 10 can be simplified.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (11)
1. A display panel is characterized by having a display area;
the display panel comprises an array substrate, a box aligning substrate and frame sealing glue, wherein the array substrate and the box aligning substrate are mutually abutted, and the frame sealing glue is arranged between the array substrate and the box aligning substrate;
the array substrate comprises a flat layer; the array substrate comprises a box substrate, a flat layer and a plurality of groups of organic insulating layers, wherein the flat layer comprises a first inorganic insulating layer, an organic insulating layer and a second inorganic insulating layer which are sequentially stacked in the direction of pointing to the box substrate along the array substrate, and the array substrate further comprises a cross-linking pattern arranged between the organic insulating layer and the second inorganic insulating layer;
the cross-linking pattern is positioned on one side of the frame sealing glue departing from the display area.
2. The display panel according to claim 1, wherein the array substrate further comprises a protective layer disposed between the cross-linked pattern and the second inorganic insulating layer, and an orthogonal projection of the protective layer on the pair of cell substrates completely overlaps an orthogonal projection of the cross-linked pattern on the pair of cells.
3. The display panel according to claim 1 or 2, wherein edges of the first inorganic insulating layer and the second inorganic insulating layer exceed edges of the organic insulating layer;
the crosslinked pattern covers a side surface of the organic insulating layer and a surface close to the pair of cartridge substrates.
4. The display panel according to claim 1 or 2, wherein the organic insulating layer includes a trench, and an orthogonal projection of the trench on the pair of substrates overlaps an orthogonal projection of the sealant on the pair of substrates.
5. The display panel according to claim 2, wherein the array substrate further comprises a first electrode disposed between the organic insulating layer and the second inorganic insulating layer;
the first electrode is at least positioned in the display area, and the first electrode and the protective layer are made of the same layer and the same material.
6. A display device characterized by comprising the display panel according to any one of claims 1 to 5.
7. A preparation method of a display panel is characterized in that the display panel is provided with a display area, and the preparation method of the display panel comprises the following steps:
respectively forming an array substrate and a box aligning substrate, and aligning the array substrate and the box aligning substrate by using frame sealing glue;
forming the array substrate, including:
sequentially forming a first inorganic insulating layer and an organic insulating layer on a substrate;
forming a cross-linking pattern and a protective layer on one side, away from the substrate, of the organic insulating layer, wherein the protective layer is located on one side, away from the substrate, of the cross-linking pattern; the cross-linking pattern and the protective layer are positioned on one side of the frame sealing glue, which is far away from the display area, and the orthographic projections of the cross-linking pattern and the protective layer on the substrate are completely overlapped;
and forming a second inorganic insulating layer on one side of the organic insulating layer, which is far away from the substrate, wherein the first inorganic insulating layer, the organic insulating layer and the second inorganic insulating layer form a flat layer.
8. The method for manufacturing a display panel according to claim 7, wherein the forming of the crosslinked pattern and the protective layer on the side of the organic insulating layer facing away from the substrate comprises:
performing plasma treatment on the organic insulating layer to form a crosslinked layer;
forming a protective layer on one side of the crosslinking layer, which is far away from the substrate;
and carrying out plasma treatment on the crosslinking layer by taking the protective layer as a mask to form the crosslinking pattern.
9. The method for manufacturing a display panel according to claim 8,
performing plasma treatment on the organic insulating layer to form a crosslinked layer, including:
performing plasma treatment on the surface of the organic insulating layer, which is far away from the substrate, by using one of helium or argon;
treating the crosslinked layer to form the crosslinked pattern, comprising:
performing plasma treatment on the cross-linked layer using one of nitrogen, oxygen, and hydrogen to form the cross-linked pattern;
and carrying out plasma treatment on the surface of the organic insulating layer, which is far away from the substrate, and carrying out plasma treatment on the crosslinking layer for the same time and power.
10. The method for manufacturing a display panel according to claim 9, wherein a surface of the organic insulating layer facing away from the substrate is subjected to plasma treatment, and wherein a time period of the plasma treatment is 10 to 30 seconds and a power range is 8 to 24 kw.
11. The method for manufacturing a display panel according to any one of claims 7 to 10, wherein the array substrate further includes a first electrode located in the display region; the protective layer and the first electrode are formed through the same composition process.
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