CN111254410A - 一种纳米晶金刚石粒子增强银基电接触涂层 - Google Patents

一种纳米晶金刚石粒子增强银基电接触涂层 Download PDF

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Publication number
CN111254410A
CN111254410A CN201910965719.1A CN201910965719A CN111254410A CN 111254410 A CN111254410 A CN 111254410A CN 201910965719 A CN201910965719 A CN 201910965719A CN 111254410 A CN111254410 A CN 111254410A
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silver
coating
electric contact
nanocrystalline diamond
diamond particle
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CN201910965719.1A
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吴泽
刘磊
邢佑强
鲍航
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Southeast University
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Southeast University
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Contacts (AREA)

Abstract

本发明属于功能涂层制造技术领域，涉及一种纳米晶金刚石粒子增强银基电接触涂层。本发明提供的电接触涂层以铜及其合金为基体材料，涂层材料的主体是金属银，在银基涂层上弥散分布纳米晶金刚石粒子。本发明提供的电接触涂层具有导电性能优良、高耐磨、抑制接触冷粘的特点。本发明提供的纳米晶金刚石粒子增强银基电接触涂层可广泛应用于重要工业生产的电接触环境，可有效提高机电接触组件的整体使用可靠性。

Description

一种纳米晶金刚石粒子增强银基电接触涂层
技术领域
本发明涉及一种纳米晶金刚石粒子增强银基电接触涂层，属于功能涂层制造技术领域。
背景技术
电器产品被广泛应用于现代社会的各个领域，电器产品的可靠性是产品质量的重要部分，直接决定着整个产品的可靠性。由于电器元件的小型化和自动化系统功能的复杂化，系统内组成电器元件数量剧增，仅仅一个元件发生失效即能导致整个系统功能失效，因此，电器元件的可靠性研究是至关重要的。继电器、连接器等机电组件的主要失效原因有接触电阻过大，金属材料的冷粘与熔焊，介电击穿等等。随着对电器开关和微机电系统的性能及寿命要求的提高，触点材料性质、表面形貌状态、气氛环境条件等因素已逐渐成为研究领域关注的重点。对于电器开关，冷粘现象有着决定性的重要意义。在微纳尺度的接触表面上，范德华力、表面水膜产生的毛细力等毫牛级或微牛级的作用力不容忽视，在没有电流影响下触点接触表面间也可能出现粘接现象，这种粘接现象称为即称为冷粘。冷粘力的大小直接受到触点材料表面性质的影响。为此，开发一种抗冷粘、高耐磨的新型电接触涂层，提高电接触组件的可靠性，对机电装备整体可靠性提升将具有重要意义。
发明内容
本发明的目的在于克服现有技术的不足，提供一种纳米晶金刚石粒子增强银基电接触涂层，提高机电接触组件的抗冷粘能力。
本发明的一种纳米晶金刚石粒子增强银基电接触涂层，涂层沉积在铜及其合金的基体材料上，涂层材料的主体是金属银，在银基涂层上弥散分布纳米晶金刚石粒子。银基涂层厚度为5～10μm，金刚石粒子的平均粒径为10～50nm。涂层化学成分按原子百分比计，金刚石粒子占5～10at.％，其余为金属银。该涂层是通过化学气象沉积的方法制备的。
本发明的银基涂层具有优异的导电性能，在抗冷粘方面，相比之前的金镀层能够减少综合成本。本发明的纳米晶金刚石粒子具有两个突出优势，一方面，纳米尺度的金刚石颗粒弥散分布在银基涂层内部和表面，在表面的均匀纳尺度凸起可有效抑制机电接触组件的冷粘现象；另一方面，金刚石粒子质地坚硬，可极大提高接触涂层的等效硬度，提高涂层的抗磨损能力。总的来说，本发明的一种纳米晶金刚石粒子增强银基电接触涂层具有抗冷粘、耐磨损、导电性能优异的综合优点。本发明的一种纳米晶金刚石粒子增强银基电接触涂层可广泛应用于机电接触组件的电接触表面，能够有效提高电接触器件的接触工作可靠性，从而提升机电装备整体工作可靠性。
具体实施方式
下面通过具体实施例对本发明作进一步详述，以下实施例只是描述性的，不是限定性的，不能以此限定本发明的保护范围。
一种纳米晶金刚石粒子增强银基电接触涂层，涂层沉积在材料为Cu-Ni合金的电连接器触点基体上，涂层材料的主体是金属银，在银基涂层上弥散分布纳米晶金刚石粒子。银基涂层厚度为8μm，金刚石粒子的平均粒径为20nm。涂层化学成分按原子百分比计，金刚石粒子占5at.％，其余为金属银。该涂层是通过化学气象沉积的方法制备的。

Claims (3)

1.一种纳米晶金刚石粒子增强银基电接触涂层，涂层沉积在铜及其合金的基体材料上，涂层材料的主体是金属银，在银基涂层上弥散分布纳米晶金刚石粒子。
2.根据权利要求1所述的一种纳米晶金刚石粒子增强银基电接触涂层，特别地，银基涂层厚度为5～10μm，金刚石粒子的平均粒径为10～50nm。
3.根据权利要求1和权利要求2所述的一种纳米晶金刚石粒子增强银基电接触涂层，该涂层是通过化学气象沉积的方法制备的。
CN201910965719.1A 2019-10-10 2019-10-10 一种纳米晶金刚石粒子增强银基电接触涂层 Pending CN111254410A (zh)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101197215A (zh) * 2008-01-02 2008-06-11 陕西艺林实业有限责任公司 纳米金刚石掺杂银基触头材料及其加工方法
CN102290260A (zh) * 2011-07-29 2011-12-21 广州市德百顺电气科技有限公司 一种电触头及其制备方法
US20150083974A1 (en) * 2012-03-30 2015-03-26 Schneider Electric Industries Sas Method for preparing silver-based electrical contact material

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101197215A (zh) * 2008-01-02 2008-06-11 陕西艺林实业有限责任公司 纳米金刚石掺杂银基触头材料及其加工方法
CN102290260A (zh) * 2011-07-29 2011-12-21 广州市德百顺电气科技有限公司 一种电触头及其制备方法
US20150083974A1 (en) * 2012-03-30 2015-03-26 Schneider Electric Industries Sas Method for preparing silver-based electrical contact material

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
吴元康等: "纳米晶金刚石织构粒子增强银基电接触复合镀层的研究", 《电镀与涂饰》 *
蒋鹏等: "纳米复合银-金刚石电接触材料的制备及性能", 《稀有金属材料与工程》 *

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Application publication date: 20200609