CN111253752A - Silica gel insulating gasket and preparation method thereof - Google Patents
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Abstract
The invention provides a silica gel insulating gasket and a preparation method thereof, wherein the silica gel insulating gasket comprises a heat-conducting silica gel base layer and graphene dispersion liquid, wherein the top surface and the bottom surface of the heat-conducting silica gel base layer are respectively coated with the graphene dispersion liquid; the heat-conducting silica gel base layer comprises silica gel and modified fillers, and the modified fillers comprise heat-conducting fillers, enhanced heat-conducting fillers, absolute ethyl alcohol, silane and polysiloxane; the graphene dispersion liquid comprises a silicon rubber matrix and modified graphene powder. The invention has the beneficial effects that: according to the invention, the graphene dispersion liquid is coated on two sides of the heat-conducting silica gel base layer, the characteristic of poor toughness of the traditional heat-conducting silica gel base body is made up by utilizing the ultra-strong hardness and the special physical properties of graphene, the bending strength of the system is increased, the heat-conducting and heat-dissipating capabilities of the system are enhanced by combining the ultra-high heat conductivity coefficient and the excellent heat-radiating capability of the graphene, one more heat-radiating capability is added in the traditional heat-conducting silica gel system, and the two heat-radiating capabilities are combined, so that more heat can be dissipated in time.
Description
Technical Field
The invention relates to the field of heat-conducting interface materials, in particular to a silica gel insulating gasket and a preparation method thereof.
Background
At present conventional silica gel conducting strip itself except having the heat conductivity, generally do not contain or few high temperature thermal radiation nature, only act as a heat conduction effect interface bridge alone, and can not obtain effectual transmission and giveaway more heats, strictly speaking only has the conduction, can not carry out the thermal radiation effect, the heat conductivity that leads to the silica gel gasket is low on the low side, silica gel gasket intensity is low simultaneously, can not be fine satisfy the practical application demand, traditional silica gel conducting strip, the heat conductivity is low, do not have the thermal radiation effect, material strength is not enough.
Disclosure of Invention
The invention provides a silica gel insulating gasket, which comprises a heat-conducting silica gel base layer and graphene dispersion liquid, wherein the top surface and the bottom surface of the heat-conducting silica gel base layer 1 are respectively coated with the graphene dispersion liquid; the heat-conducting silica gel base layer comprises silica gel and modified filler, wherein the modified filler comprises heat-conducting filler, enhanced heat-conducting filler, absolute ethyl alcohol, silane and polysiloxane; the graphene dispersion liquid comprises a silicon rubber matrix and modified graphene powder.
As a further improvement of the invention, the silica gel adopts bi-component liquid silica gel, and the viscosity is 50-2000 cP; the dosage of the silica gel is 3-20% of the dosage of the heat-conducting silica gel base layer, wherein 3-20% is the mass percentage;
the silane is one or two compounds of vinyl trimethoxy silane, vinyl triethoxy silane, vinyl tri (β -methoxyethoxy) silane, vinyl tri-tert-butoxy silane, vinyl triacetoxy silane and 3- (methacryloxy) propyl trimethoxy silane, the dosage of the silane is 0.2-5% of the modified filler, wherein 0.2-5% of the silane is mass percent, the polysiloxane is one or two compounds of methyl vinyl polysiloxane, phenyl vinyl polysiloxane and epoxy polysiloxane, and the dosage of the polysiloxane is 0.5-5% of the dosage of the modified filler.
As a further improvement of the invention, the heat-conducting filler is one or composite powder of alumina, aluminum nitride 1-40 um and metal powder, the particle size of the alumina is 2-150 um, the particle size of the metal powder is 1-5 um, and the using amount of the heat-conducting filler is 70-90%;
the reinforced heat-conducting filler is one or composite powder of tetrapod-like zinc oxide whiskers, titanium oxide nanowires and silicon carbide whiskers, the diameter of the titanium oxide nanowires is 20-80 nm, the length of the titanium oxide nanowires is 2-10 microns, the diameter of the silicon carbide whiskers is 20-80 nm, the length of the silicon carbide whiskers is 2-10 microns, and the using amount of the reinforced heat-conducting filler is 0.05-5%, wherein 0.5-5% is mass percent.
As a further improvement of the invention, the silicon rubber matrix adopts two-component silicon rubber, and the viscosity is 50-300 cps.
As a further improvement of the invention, the modified graphene powder comprises graphene and aluminum oxide, and the aluminum oxide is electrostatically adsorbed on the surface of the graphene, so that the graphene composite particles coated by the aluminum oxide are prepared.
As a further improvement of the invention, the graphene dispersion has a coating thickness of 6 to 10 um.
The invention also discloses a preparation method of the silica gel insulating gasket,
as a further improvement of the invention, the graphene dispersion liquid is coated on the top surface of the heat-conducting silica gel base layer, and after the heat-conducting silica gel base layer is completely cured, the graphene dispersion liquid is continuously coated on the bottom surface of the heat-conducting silica gel base layer.
As a further improvement of the invention, aluminum oxide is electrostatically adsorbed on the surface of graphene to prepare modified graphene powder, the modified graphene powder is uniformly dispersed in a silicon rubber matrix to form graphene dispersion liquid, and the stirring is carried out for 1-2 hours at the stirring speed of 500R/Min.
As a further improvement of the invention, a mixed solution of silane and absolute ethyl alcohol is added into the heat-conducting filler, the volume ratio of the silane to the absolute ethyl alcohol is 1:1, high-speed mixing modification is carried out, then polysiloxane and reinforced heat-conducting filler are added, high-speed mixing modification is carried out, and the modified filler is subjected to heat treatment at 80-200 ℃ for 2 hours to obtain the modified filler.
As a further improvement of the invention, the silicone gel adopts two-component liquid silicone gel, and the two components of the liquid silicone gel are mixed according to the weight ratio of 1:1, sequentially dispersing the modified filler according to the proportion that the amount of the modified filler is 70-90% of the amount of the heat-conducting silica gel base layer by adopting a principle of difficult dispersion and first addition, gradually adding the modified filler into the silica gel in batches, uniformly stirring, defoaming at a vacuum pressure of 1MPa for 10min, and vulcanizing at a high temperature of 120 ℃ for 10-20min to complete curing to form the heat-conducting silica gel base layer, wherein 70-90% is in percentage by mass.
The invention has the beneficial effects that: according to the invention, the graphene dispersion liquid is coated on two sides of the heat-conducting silica gel base layer, the characteristic of poor toughness of the traditional heat-conducting silica gel base body is made up by utilizing the ultra-strong hardness and the special physical properties of graphene, the bending strength of the system is increased, the heat conducting and heat dissipating capabilities of the system are enhanced by combining the ultra-high heat conductivity coefficient and the excellent heat radiating capability of the graphene, one more heat radiating capability is added in the traditional heat-conducting silica gel system, and the two heat radiating capabilities are combined, so that more heat can be timely dissipated, the normal service life of electronic components is maintained, and the heat-conducting silica gel base layer is suitable for a component heat-dissipating scheme in.
Drawings
Fig. 1 is a structural view of a silicone insulation gasket of the present invention.
Detailed Description
As shown in fig. 1, the invention discloses a silica gel insulating gasket, which comprises a heat-conducting silica gel base layer 1 and graphene dispersion liquid 2, wherein the top surface and the bottom surface of the heat-conducting silica gel base layer 1 are respectively coated with the graphene dispersion liquid 2; the heat-conducting silica gel base layer 1 comprises silica gel and modified fillers, wherein the modified fillers comprise heat-conducting fillers, enhanced heat-conducting fillers, absolute ethyl alcohol, silane and polysiloxane; the graphene dispersion liquid 2 comprises a silicon rubber matrix and modified graphene powder.
The silicone gel is a bi-component liquid silicone gel, and the viscosity is 50-2000 cP; the amount of the silica gel is 3-20% of that of the heat-conducting silica gel base layer, wherein 3-20% is in percentage by mass.
The heat-conducting filler is made of one or a composite powder of aluminum oxide, 1-40 um aluminum nitride and metal powder, the particle size of the aluminum oxide is 2-150 um, the particle size of the metal powder is 1-5 um, the using amount of the modified filler is 70-90% of that of the heat-conducting silica gel base layer, and 70-90% of the modified filler is in percentage by mass.
The reinforced heat-conducting filler is one or composite powder of tetrapod-like zinc oxide whiskers, titanium oxide nanowires and silicon carbide whiskers, the diameter of the titanium oxide nanowires is 20-80 nm, the length of the titanium oxide nanowires is 2-10 microns, the diameter of the silicon carbide whiskers is 20-80 nm, the length of the silicon carbide whiskers is 2-10 microns, the amount of the modified filler is 70-90% of the amount of the heat-conducting silica gel base layer, and 70-90% of the modified filler is mass percent.
The silane is one or two compounds of vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (β -methoxyethoxy) silane, vinyltri-tert-butoxysilane, vinyltri-tert-butylperoxysilane, vinyltriacetoxysilane and 3- (methacryloyloxy) propyltrimethoxysilane, and the amount of the silane is 0.2-5% of the modified filler, wherein 0.2-5% of the modified filler is mass percent.
The polysiloxane is one or two compounds of methyl vinyl polysiloxane, phenyl vinyl polysiloxane and epoxy polysiloxane, and the dosage of the polysiloxane is 0.5-5% of that of the modified filler, wherein 0.5-5% is in percentage by mass.
The silicon rubber substrate adopts two-component silicon rubber, and the viscosity is 50-300 cps.
The modified graphene powder comprises graphene and aluminum oxide, the aluminum oxide is electrostatically adsorbed on the surface of the graphene by adopting an electrostatic self-assembly technology, so that the graphene composite particles coated with the aluminum oxide are prepared, the electrical insulation property of the graphene composite particles is enhanced, and the system resistivity is 10 under the condition that the weight fraction of the filler is 38 percent14Ω。
The coating thickness of the graphene dispersion liquid is 6-10 um, and the disadvantages and performance display of the graphene dispersion liquid when the graphene dispersion liquid is too thick and too thin are avoided.
Graphene is one of the materials with the highest known strength, the theoretical thermal conductivity coefficient is about 5000W/mK, the graphene also has extremely high thermal radiation capacity, the thermal radiation coefficient is 1 at the highest, the graphene is about 0.98, the graphene also has good toughness and can be bent, the theoretical Young modulus of the graphene reaches 1.0TPa, and the inherent tensile strength is 130 GPa.
The invention also discloses a preparation method of the silica gel insulating gasket, wherein the graphene dispersion liquid 2 is coated on the top surface of the heat-conducting silica gel base layer 1, after the heat-conducting silica gel base layer is completely solidified, the graphene dispersion liquid 2 is continuously coated on the bottom surface of the heat-conducting silica gel base layer 1, and a three-layer body similar to a hamburger structure is formed, so that the silica gel insulating gasket with high heat conductivity and high heat radiation performance is obtained.
And (3) electrostatically adsorbing aluminum oxide on the surface of the graphene to obtain the modified graphene powder. Modified graphene powder with the thickness of about 20-50nm is prepared by an ultrasonic stripping method, the modified graphene powder is uniformly dispersed in a silicon rubber matrix by utilizing the chemical action and physical acting force between the surface group of the graphene and the functional group of the mixed resin, graphene dispersion liquid is formed by the action of ultrasonic wave and physical mechanical stirring, the stirring process is firstly carried out at a low speed, then the stirring process is carried out at a high speed, the stirring is carried out for 1-2 hours, and the stirring speed is 500R/Min.
Adding a mixed solution of silane and absolute ethyl alcohol into a heat-conducting filler, wherein the volume ratio of the silane to the absolute ethyl alcohol is 1:1, carrying out high-speed mixing modification, then adding polysiloxane and a reinforced heat-conducting filler, carrying out high-speed mixing modification, and carrying out heat treatment on the modified filler at 80-200 ℃ for 2 hours to obtain the modified filler.
The silicone gel adopts bi-component liquid silicone gel, and the two components of the liquid silicone gel are mixed according to the weight ratio of 1:1, sequentially dispersing the modified filler according to the proportion that the amount of the modified filler is 70-90% of the amount of the heat-conducting silica gel base layer by adopting a principle of difficult dispersion and first addition, gradually adding the modified filler into the silica gel in batches, uniformly stirring, defoaming at a vacuum pressure of 1MPa for 10min, and vulcanizing at a high temperature of 120 ℃ for 10-20min to complete curing to form the heat-conducting silica gel base layer 1, wherein 70-90% is in percentage by mass.
According to the invention, the graphene dispersion liquid 2 is coated on two sides of the heat-conducting silica gel base layer 1, the characteristic of poor toughness of the traditional heat-conducting silica gel base body is made up by utilizing the ultra-strong hardness and the special physical properties of graphene, the bending strength of the system is increased, the heat conducting and heat dissipating capabilities of the system are enhanced by combining the ultra-high heat conductivity coefficient and the excellent heat radiation capability of graphene, one heat radiation capability is added in the traditional heat-conducting silica gel system, and the two heat radiation capabilities are combined, so that more heat can be dissipated in time, the normal working life of electronic components is maintained, and the heat-conducting silica gel base layer is suitable for a component heat-dissipating scheme in the.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (10)
1. A silica gel insulating gasket is characterized by comprising a heat-conducting silica gel base layer and graphene dispersion liquid, wherein the top surface and the bottom surface of the heat-conducting silica gel base layer are respectively coated with the graphene dispersion liquid; the heat-conducting silica gel base layer comprises silica gel and modified filler, wherein the modified filler comprises heat-conducting filler, enhanced heat-conducting filler, absolute ethyl alcohol, silane and polysiloxane; the graphene dispersion liquid comprises a silicon rubber matrix and modified graphene powder.
2. The silicone insulating gasket of claim 1, wherein: the silicone gel is a bi-component liquid silicone gel, and the viscosity is 50-2000 cP; the dosage of the silica gel is 3-20% of the dosage of the heat-conducting silica gel base layer, wherein 3-20% is the mass percentage;
the silane is one or two compounds of vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (β -methoxyethoxy) silane, vinyltri-tert-butoxysilane, vinyltri-tert-butylperoxysilane, vinyltriacetoxysilane and 3- (methacryloyloxy) propyltrimethoxysilane, the amount of the silane is 0.2-5% of the modified filler, wherein 0.2-5% of the silane is in percentage by mass, the polysiloxane is one or two compounds of methylvinylpolysiloxane, phenylvinylpolysiloxane and epoxy polysiloxane, and the amount of the polysiloxane is 0.5-5% of the amount of the modified filler, wherein 0.5-5% of the polysiloxane is in percentage by mass.
3. The silicone insulating gasket of claim 1, wherein:
the heat-conducting filler is one or composite powder of aluminum oxide, 1-40 um aluminum nitride and metal powder, the particle size of the aluminum oxide is 2-150 um, the particle size of the metal powder is 1-5 um, the dosage of the modified filler is 70-90% of the dosage of the heat-conducting silica gel base layer, and 70-90% of the modified filler is mass percentage;
the reinforced heat-conducting filler is one or composite powder of tetrapod-like zinc oxide whiskers, titanium oxide nanowires and silicon carbide whiskers, the diameter of the titanium oxide nanowires is 20-80 nm, the length of the titanium oxide nanowires is 2-10 um, the diameter of the silicon carbide whiskers is 20-80 nm, the length of the silicon carbide whiskers is 2-10 um, the using amount of the reinforced heat-conducting filler is 0.05-5% of that of the heat-conducting silica gel base layer, and 0.05-5% of the reinforced heat-conducting filler is mass percent.
4. The silicone insulating gasket of claim 1, wherein: the silicon rubber substrate adopts two-component silicon rubber, and the viscosity is 50-300 cps.
5. The silicone insulating gasket of claim 1, wherein: the modified graphene powder comprises graphene and aluminum oxide, and the aluminum oxide is electrostatically adsorbed on the surface of the graphene, so that the graphene composite particles coated with the aluminum oxide are prepared.
6. The silicone insulating gasket of claim 1, wherein: the coating thickness of the graphene dispersion is 6 to 10 um.
7. A method for preparing the silica gel insulating spacer of any one of claims 1 to 6, wherein the graphene dispersion is coated on the top surface of the heat-conducting silica gel base layer, and after the graphene dispersion is completely cured, the graphene dispersion is continuously coated on the bottom surface of the heat-conducting silica gel base layer.
8. The method of claim 7, wherein: and (2) electrostatically adsorbing aluminum oxide on the surface of graphene to prepare modified graphene powder, uniformly dispersing the modified graphene powder in a silicon rubber matrix to form graphene dispersion liquid, and stirring for 1-2 hours at the stirring speed of 500R/Min.
9. The preparation method of the heat-conducting filler, according to claim 7, is characterized in that a mixed solution of silane and absolute ethyl alcohol is added into the heat-conducting filler, the silane and absolute ethyl alcohol are mixed and modified at a high speed according to the volume ratio of 1:1, then polysiloxane and the reinforced heat-conducting filler are added, the mixture is mixed and modified at a high speed, and the modified filler is subjected to heat treatment at 80-200 ℃ for 2 hours to obtain the modified filler.
10. The preparation method of claim 7, wherein the silicone gel is a two-component liquid silicone gel, and the two components of the liquid silicone gel are mixed according to a weight ratio of 1:1, sequentially dispersing the modified filler according to the proportion that the amount of the modified filler is 70-90% of the amount of the heat-conducting silica gel base layer by adopting a principle of difficult dispersion and first addition, gradually adding the modified filler into the silica gel in batches, uniformly stirring, defoaming at a vacuum pressure of 1MPa for 10min, and vulcanizing at a high temperature of 120 ℃ for 10-20min to complete curing to form the heat-conducting silica gel base layer, wherein 70-90% is in percentage by mass.
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| CN111944421A (en) * | 2020-08-24 | 2020-11-17 | 江苏科技大学 | Polymethyl siloxane composite coating and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103436027A (en) * | 2013-09-09 | 2013-12-11 | 北京化工大学 | Heat-conducting electric insulation silicon rubber thermal interface material and preparation method thereof |
| CN106433508A (en) * | 2016-10-18 | 2017-02-22 | 德阳烯碳科技有限公司 | Preparation method of graphene heat conduction double-sided adhesive tape |
| CN108819360A (en) * | 2018-04-20 | 2018-11-16 | 哈尔滨理工大学 | A kind of graphene heat conducting film/heat conductive silica gel film composite material of stratiform alternating structure and preparation method thereof |
| CN110157196A (en) * | 2019-03-22 | 2019-08-23 | 中国科学院工程热物理研究所 | A kind of grapheme material oriented alignment and with silicagel pad composite forming method and product |
-
2020
- 2020-03-17 CN CN202010187682.7A patent/CN111253752A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103436027A (en) * | 2013-09-09 | 2013-12-11 | 北京化工大学 | Heat-conducting electric insulation silicon rubber thermal interface material and preparation method thereof |
| CN106433508A (en) * | 2016-10-18 | 2017-02-22 | 德阳烯碳科技有限公司 | Preparation method of graphene heat conduction double-sided adhesive tape |
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