CN111234724A - High heat conduction adhesive tape - Google Patents
High heat conduction adhesive tape Download PDFInfo
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- CN111234724A CN111234724A CN202010162204.0A CN202010162204A CN111234724A CN 111234724 A CN111234724 A CN 111234724A CN 202010162204 A CN202010162204 A CN 202010162204A CN 111234724 A CN111234724 A CN 111234724A
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- parts
- adhesive tape
- thermally conductive
- conductive adhesive
- allyl alcohol
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
- C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
- C08K7/26—Silicon- containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/10—Presence of homo or copolymers of propene
- C09J2423/106—Presence of homo or copolymers of propene in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/006—Presence of halogenated polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a high-thermal-conductivity adhesive tape, which comprises a base material and an adhesive coated on the base material, wherein the adhesive comprises the following components in formula: 40-70 parts of isooctyl acrylate, 10-20 parts of allyl alcohol complex, 1-10 parts of fumed silica, 10-20 parts of 1-hydroxycyclohexyl phenyl ketone, 5-15 parts of dodecyl mercaptan, 5-10 parts of boron nitride, 1-2 parts of carbon nano tubes, 1-5 parts of 2-ethyl anthraquinone and 10-20 parts of triphenyl phosphate. The adhesive tape is prepared at a non-high temperature, only needs to be heated to 50-80 ℃, is easy to obtain formula raw materials, simple in processing mode, simple and convenient to operate, more energy-saving and environment-friendly in production, and has excellent heat-conducting property and flame retardant property.
Description
Technical Field
The invention belongs to the technical field of adhesives, and relates to a high-thermal-conductivity adhesive tape.
Background
The adhesive tape is widely applied to various fields of packaging, automobiles, transportation, communication, electric appliances, building materials, machinery, aviation, light industry, sanitation and the like. With the development of electronic technology, the heat dissipation of thinner and thinner smart phones and tablet computers becomes a problem to be solved urgently, and in addition, the heat dissipation of communication base stations, LED lighting equipment, power electronic equipment, automobile electronic equipment and new energy power batteries also becomes one of the obstacles in the progress process.
Most adhesive tapes do not have a heat conduction function or have poor heat conduction performance, and have certain influence on the service life of electronic products, so that research and development personnel of our department develop an adhesive tape with a high heat conduction function.
Disclosure of Invention
The invention aims to provide a high-thermal-conductivity adhesive tape, aiming at the problem that the adhesive tape in the prior art has poor thermal conductivity.
In order to achieve the purposes, the specific scheme is as follows:
the high-thermal-conductivity adhesive tape comprises a base material and an adhesive coated on the base material, wherein the adhesive comprises the following components in formula: 40-70 parts of isooctyl acrylate, 10-20 parts of allyl alcohol complex, 1-10 parts of fumed silica, 10-20 parts of 1-hydroxycyclohexyl phenyl ketone, 5-15 parts of dodecyl mercaptan, 5-10 parts of boron nitride, 1-2 parts of carbon nano tubes, 1-5 parts of 2-ethyl anthraquinone and 10-20 parts of triphenyl phosphate.
Preferably, the substrate is one of polyethylene, polyvinyl chloride, polypropylene and polyimide film with the thickness of 10-140 μm.
Preferably, the adhesive formula component further comprises 8-18 parts by weight of a compound I, and the structural formula of the compound I is as follows:
preferably, the preparation method of the allyl alcohol complex comprises the following steps: firstly, the polyoxypropylene alcohol is vacuumized and dehydrated for 30min at the temperature of 120 ℃. And then, under the protection of nitrogen, dropwise adding polyoxypropylene alcohol into excessive diisocyanate while stirring (the molar ratio of (-NCO to-OH groups is 2:1), adding a small amount of catalyst dibutyltin dilaurate, controlling the reaction temperature at 90-100 ℃, stopping heating after 1h of reaction, cooling and discharging to obtain the allyl alcohol complex.
Preferably, the weight part ratio of the boron nitride to the carbon nano tube is 2: 1.
preferably, the hollow glass beads have a particle size of 5 to 12 μm and a thermal conductivity of 0.05 to 0.1W/m.k.
Preferably, the weight part ratio of the allyl alcohol complex to the fumed silica is 2-4: 1.
preferably, the weight part ratio of the isooctyl acrylate to the propenol complex is 5: 1; the weight part ratio of the allyl alcohol complex to the compound I is 1-2: 1.
a preparation method of a high-thermal-conductivity adhesive tape comprises the following steps: adding isooctyl acrylate, an allyl alcohol complex, fumed silica, 1-hydroxycyclohexyl phenyl ketone, dodecyl mercaptan, boron nitride, a carbon nano tube, 2-ethyl anthraquinone, triphenyl phosphate and a compound I into a container, uniformly stirring, heating to 50-80 ℃, stirring at a constant temperature for 20-50min, stirring at a speed of 45 revolutions per minute, standing and cooling to normal temperature to prepare an adhesive, putting the adhesive into coating equipment, and coating the double sides or the single sides of a base material to prepare the high-thermal-conductivity adhesive tape.
Compared with the prior art, the invention has the following technical effects:
1. the adhesive tape is prepared at a non-high temperature, only needs to be heated to 50-80 ℃, is easy to obtain formula raw materials, simple in processing mode, simple and convenient to operate, more energy-saving and environment-friendly in production, and has excellent heat-conducting property and flame retardant property.
2. The adhesive on the base material has unexpected technical effect in the aspect of viscosity through the specially processed allyl alcohol complex, and compared with the existing adhesive, the adhesive has higher viscosity at normal temperature, and the heat-conducting property of the adhesive tape is improved by matching with an ether compound.
3. The adhesive coated on the adhesive tape disclosed by the invention adopts an ether compound with a special structure and is matched with an allyl alcohol complex, so that the adhesive is high in viscosity and good in heat conductivity.
4. The ether compound is matched with triphenyl phosphate, so that the flame retardant effect of triphenyl phosphate is improved, and the safety performance of the adhesive tape is also improved.
Detailed Description
The technical solution of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a high-thermal-conductivity adhesive tape, which comprises a base material and an adhesive, wherein the adhesive comprises the following components in parts by weight: isooctyl acrylate, an allyl alcohol complex, fumed silica, 1-hydroxycyclohexyl phenyl ketone, dodecyl mercaptan, boron nitride, carbon nanotubes, 2-ethylanthraquinone, triphenyl phosphate and compound I.
The preparation method of the allyl alcohol complex comprises the following steps: firstly, the polyoxypropylene alcohol is vacuumized and dehydrated for 30min at the temperature of 120 ℃. And then, under the protection of nitrogen, dropwise adding polyoxypropylene alcohol into excessive diisocyanate while stirring (the molar ratio of (-NCO to-OH groups is 2:1), adding a small amount of catalyst dibutyltin dilaurate, controlling the reaction temperature at 90-100 ℃, stopping heating after 1h of reaction, cooling and discharging to obtain the allyl alcohol complex.
The highly thermally conductive adhesive tapes of examples 1 to 12 were prepared by preparing adhesives according to the formulations shown in the following tables and then coating them on a substrate. The adhesive formulation of the specific example is as follows:
adding isooctyl acrylate, an allyl alcohol complex, fumed silica, 1-hydroxycyclohexyl phenyl ketone, dodecyl mercaptan, boron nitride, a carbon nano tube, 2-ethyl anthraquinone, triphenyl phosphate and a compound I into a container, uniformly stirring, heating to 50-80 ℃, stirring at a constant temperature for 20-50min, stirring at a speed of 45 revolutions per minute, standing and cooling to normal temperature to prepare an adhesive, putting the adhesive into coating equipment, and coating the double surfaces or the single surfaces of a base material to prepare the high-thermal-conductivity adhesive tape. .
The high thermal conductive adhesive tape of the embodiments 1, 3 and 5 is coated in a strip-shaped manner, and the coating area is 30-80% of the area of the common adhesive.
The high thermal conductive adhesive tapes of examples 2, 4 and 6 were coated in a grid pattern, and the coating area was 30-80% of the area of the conventional adhesive tape.
The high thermal conductive adhesive tapes of examples 7, 8, and 9 were coated in a grid pattern, and the coating area was 30% to 80% of the area of the conventional adhesive tape.
The high thermal conductive adhesive tapes of examples 10 and 11 were coated in a dot-like manner, and the coating area was 30-80% of the area of the conventional adhesive.
The high thermal conductive adhesive tape of example 12 is coated in a full-coverage manner, and the coating area is 100% of the area of the common adhesive.
The formulations of comparative examples 1-12 are as follows:
the following test tests were conducted on the high thermal conductive adhesive tapes of the 12 examples and the 12 comparative examples,
the test results are given in the following table:
comparative example test data are as follows:
as can be seen from the above examples, examples 1 to 12 are superior to comparative examples in viscosity at room temperature, tensile strength and flexural strength, and thermal conductivity and electrical conductivity to examples 1 to 12, particularly examples 4 and 8, compared to comparative examples 1 to 12.
In addition, in examples 1 to 11, incomplete coating was performed, which not only saves materials, but also does not degrade the performance of the adhesive tape.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (9)
1. The utility model provides a high heat conduction sticky tape, includes the substrate, the gluing agent of coating on the substrate which characterized in that: the adhesive comprises the following components: 40-70 parts of isooctyl acrylate, 10-20 parts of allyl alcohol complex, 1-10 parts of fumed silica, 10-20 parts of 1-hydroxycyclohexyl phenyl ketone, 5-15 parts of dodecyl mercaptan, 5-10 parts of boron nitride, 1-2 parts of carbon nano tubes, 1-5 parts of 2-ethyl anthraquinone and 10-20 parts of triphenyl phosphate.
2. The highly thermally conductive adhesive tape according to claim 1, wherein: the base material is one of polyethylene, polyvinyl chloride, polypropylene and polyimide films with the thickness of 10-140 mu m.
3. The highly thermally conductive adhesive tape according to claim 1, wherein: the adhesive formula component also comprises 8-18 parts by weight of a compound I, and the structural formula of the compound I is as follows:
4. the highly thermally conductive adhesive tape according to claim 3, wherein: the preparation method of the propenol complex comprises the following steps: firstly, the polyoxypropylene alcohol is vacuumized and dehydrated for 30min at the temperature of 120 ℃. And then, under the protection of nitrogen, dropwise adding polyoxypropylene alcohol into excessive diisocyanate while stirring (the molar ratio of (-NCO to-OH groups is 2:1), adding a small amount of catalyst dibutyltin dilaurate, controlling the reaction temperature at 90-100 ℃, stopping heating after 1h of reaction, cooling and discharging to obtain the allyl alcohol complex.
5. The highly thermally conductive adhesive tape according to claim 3, wherein: the weight portion ratio of the boron nitride to the carbon nano tube is 2: 1.
6. the highly thermally conductive adhesive tape according to claim 3, wherein: the particle size of the hollow glass bead is 5-12 μm, and the heat conductivity coefficient is 0.05-0.1W/m.k.
7. The highly thermally conductive adhesive tape according to claim 3, wherein: the weight part ratio of the allyl alcohol complex to the fumed silica is 2-4: 1.
8. the highly thermally conductive adhesive tape according to claim 3, wherein: the weight part ratio of the isooctyl acrylate to the propenol complex is 5: 1; the weight part ratio of the allyl alcohol complex to the compound I is 1-2: 1.
9. a preparation method of a high-thermal-conductivity adhesive tape comprises the following steps: adding isooctyl acrylate, an allyl alcohol complex, fumed silica, 1-hydroxycyclohexyl phenyl ketone, dodecyl mercaptan, boron nitride, a carbon nano tube, 2-ethyl anthraquinone, triphenyl phosphate and a compound A into a container, uniformly stirring, heating to 50-80 ℃, stirring at a constant temperature for 20-50min, stirring at a speed of 45 rpm, standing and cooling to normal temperature to prepare an adhesive, putting the adhesive into coating equipment, and coating the double sides or the single side of a base material to prepare the high-thermal-conductivity adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010162204.0A CN111234724A (en) | 2020-03-10 | 2020-03-10 | High heat conduction adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010162204.0A CN111234724A (en) | 2020-03-10 | 2020-03-10 | High heat conduction adhesive tape |
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| Publication Number | Publication Date |
|---|---|
| CN111234724A true CN111234724A (en) | 2020-06-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010162204.0A Pending CN111234724A (en) | 2020-03-10 | 2020-03-10 | High heat conduction adhesive tape |
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| CN (1) | CN111234724A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101627077A (en) * | 2006-12-01 | 2010-01-13 | 莫门蒂夫性能材料股份有限公司 | Silicone adhesive composition and method for preparing the same |
| CN102702991A (en) * | 2012-06-12 | 2012-10-03 | 安徽省郎溪县阿拉法胶粘制品有限公司 | Acrylic double-faced adhesive tape and preparation method thereof |
| CN102703001A (en) * | 2012-06-12 | 2012-10-03 | 安徽省郎溪县阿拉法胶粘制品有限公司 | Iso-octyl acrylate adhesive and preparation method thereof |
| CN106476390A (en) * | 2017-01-03 | 2017-03-08 | 山东金宝科创股份有限公司 | A kind of preparation method of paper-based copper-coated board |
| CN107603544A (en) * | 2017-09-06 | 2018-01-19 | 深圳市峰泳科技有限公司 | A kind of fexible film capacitor high dielectric substance electronics adhesive and preparation method thereof |
-
2020
- 2020-03-10 CN CN202010162204.0A patent/CN111234724A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101627077A (en) * | 2006-12-01 | 2010-01-13 | 莫门蒂夫性能材料股份有限公司 | Silicone adhesive composition and method for preparing the same |
| CN102702991A (en) * | 2012-06-12 | 2012-10-03 | 安徽省郎溪县阿拉法胶粘制品有限公司 | Acrylic double-faced adhesive tape and preparation method thereof |
| CN102703001A (en) * | 2012-06-12 | 2012-10-03 | 安徽省郎溪县阿拉法胶粘制品有限公司 | Iso-octyl acrylate adhesive and preparation method thereof |
| CN106476390A (en) * | 2017-01-03 | 2017-03-08 | 山东金宝科创股份有限公司 | A kind of preparation method of paper-based copper-coated board |
| CN107603544A (en) * | 2017-09-06 | 2018-01-19 | 深圳市峰泳科技有限公司 | A kind of fexible film capacitor high dielectric substance electronics adhesive and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 谢惠波: "《有机化合物及其鉴别》", 30 July 2000, 化学工业出版社 * |
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