CN111230724B - Whole-disc frequency compensation and whole-disc dispersion statistical method for resonance frequency of quartz wafer - Google Patents
Whole-disc frequency compensation and whole-disc dispersion statistical method for resonance frequency of quartz wafer Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R23/00—Arrangements for measuring frequencies; Arrangements for analysing frequency spectra
- G01R23/02—Arrangements for measuring frequency, e.g. pulse repetition rate; Arrangements for measuring period of current or voltage
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Abstract
The invention discloses a whole-disc frequency compensation and whole-disc dispersion statistical method for quartz wafer resonant frequency, which comprises the following steps: starting the process, judging whether the frequency sweep sampling is finished or not, if so, entering a wafer distinguishing and data processing process, and after finishing, entering a continuous ring rotating speed stabilizing judging process; if not, entering a continuous ring rotating speed stable judging process; judging whether the rotating speed of the continuous ring is stable, if so, further judging whether the timing time of the section in the ring is up; if not, judging the number of turns; judging whether the timing time of the current period in the circle is up or not, and if so, performing a data processing flow from the timing time of the current period in the circle; if not, judging the number of turns; judging whether the number of turns enters, if so, entering a stable rotation speed judging process and a current turn data ending processing process, and then entering a real-time frequency processing process; if not, directly entering a real-time frequency processing flow; and judging whether the machine needs to be stopped, if so, stopping the grinding machine, and ending the process.
Description
The patent application is application number 201910240598.4 filed on 27/03/2019, entitled divisional application of quartz wafer resonance frequency and dispersion statistical method based on wafer differentiation.
Technical Field
The invention belongs to the technical field of online frequency measurement of wafer grinding, and particularly relates to a whole-disc frequency compensation and whole-disc dispersion statistical method for quartz wafer resonant frequency.
Background
In the prior art, a resonant frequency and variance statistical mechanism and an automatic search method are as follows: (1) the resonance frequency instantaneous value storage array is used for storing the instantaneous resonance frequency of the wafer measured each time, the average value of all data in the array is used for being compared with a target frequency, and when the number of times of reaching the target frequency exceeds a set value, the grinding machine is shut down; (2) the size of a storage array of instantaneous values of the resonance frequency for solving the real-time resonance frequency (average value of the resonance frequency) is a fixed value, and the data storage adopts a stack first-in first-out mode; (3) after all instantaneous resonant frequencies within one circle are subjected to kicking-off of the maximum value, filtering by using standard deviation, and then obtaining an extreme value as the dispersion difference of the wafer; (4) at present, the resonant frequency is searched in a full-band subsection mode through automatic search, and the number of the searched resonant frequency in the appointed time exceeds a set value, namely the search is considered to be successful.
The prior art has the following problems: for example, in the automatic search process, the automatic search is considered to be successful by the current automatic search method when the number of times of the resonant frequency measured at the specified time is greater than a set value, if there are many interference signals in the automatic search process, a wrong resonant frequency can be automatically searched, and when the target frequency is close to, a wrong resonant frequency can be automatically searched, so that the over-frequency phenomenon is easily caused. For another example, in the statistical process of the resonant frequency and the dispersion, the following problems exist: (1) due to the influence of interference signals, after each instantaneous resonant frequency is obtained by a waveform matching method, the instantaneous resonant frequency is regarded as an effective signal through simple constraint, the signal is not further processed, and the signal is possibly obtained by misdetection of the interference signals, and the misdetected resonant frequency can cause deviation of the average frequency of the whole wafer from an actual value, and finally cause inaccurate shutdown; (2) due to the grinding amount compensation, when the resonant frequency is counted, the frequency grinding amount compensation is not carried out on the data entering in the array firstly, so that a certain deviation exists between the actual value and the average value of the array; the data entered first has a time difference relative to the newly entered data, and the time corresponds to a section of grinding distance, so that the grinding amount compensation needs to be carried out on the data entered first; and the deviation will vary according to the polishing rate; (3) because the size of the instantaneous value storage array of the resonant frequency is fixed, the times of the resonant frequency measured in each circle in the process of grinding the wafer are different, and because the size of the instantaneous value storage array of the resonant frequency is fixed, the data of the array cannot represent the frequency information in one circle of a disc material, and the average of the array cannot accurately represent the average frequency of the whole disc of the wafer; (4) the resonance frequency instantaneous value storage array stores the resonance frequency instantaneous value measured each time, and wafers are not distinguished, so that the weight of each wafer in the array is different due to different measurement times, and the shutdown accuracy is influenced; (5) the misleading statistical data does not kick out the misleading signals by a wafer distinguishing method, so that the misleading statistics can be inconsistent with the actual situation if the misleading signals participate in the statistics of the misleading values; (6) the original data of the variance statistics is not compensated by the grinding amount, and the variance statistics will not conform to the actual situation.
Disclosure of Invention
The invention provides a whole-disc frequency compensation and whole-disc dispersion statistical method for quartz wafer resonant frequency, which enables the whole average frequency of a disc material, namely the average value of the average frequency of each sheet material, to be equal to the set target frequency when the grinding of the disc material is finished through a wafer distinguishing method and a resonant frequency statistical method.
In order to solve the technical problems, the invention adopts the following technical scheme:
a whole-disc frequency compensation and whole-disc dispersion statistical method for a quartz wafer resonant frequency comprises the following steps:
starting the process, judging whether the frequency sweep sampling is finished or not, if so, entering a wafer distinguishing and data processing process, and after finishing, entering a continuous ring rotating speed stabilizing judging process; if not, entering a continuous ring rotating speed stable judging process;
judging whether the rotating speed of the continuous ring is stable, if so, further judging whether the time of the current period in the ring is up; if not, judging the number of turns;
judging whether the timing time in the circle arrives, if so, performing the data processing flow from the timing time in the circle to the data processing flow; if not, judging the number of turns;
judging whether the number of turns enters, if so, entering a stable rotation speed judging process and a current turn data ending processing process, and then entering a real-time frequency processing process; if not, directly entering a real-time frequency processing flow;
judging whether the grinder needs to be stopped, if so, stopping the grinder, and ending the process; if not, judging whether the data sending timing time is up, if so, sending the average value of the resonant frequency to a touch screen for display, and entering a new process; if not, directly entering a new process.
Preferably, the wafer differentiation and data processing flow is as follows:
the process is started, and the resonant frequency is solved based on a waveform matching method;
judging whether the resonant frequency is detected or not, if not, continuously judging whether the number of times Y of the continuously undetected resonant frequency is greater than a set threshold value N of the number of times of the continuously detected resonant frequency, if so, continuously judging whether the number of times X of the continuously detected resonant frequency is greater than a set threshold value M of the number of times of the continuously detected resonant frequency, if so, continuously increasing the number of times Y 'of the continuously undetected resonant frequency after the continuously detected resonant frequency, continuously judging whether the number of times Y' of the continuously undetected resonant frequency after the continuously detected resonant frequency does not reach the set threshold value of the number of times of the continuously detected resonant frequency, and if so: (a) carrying out a single wafer resonance frequency processing method; performing a stack processing method for measuring the resonant frequency; (b) the number of the wafers measured in 1 cycle is + 1; measuring the number of resonance frequencies + X in 1 circle; calculating the dispersion difference in the chip; (c) ending the processing flow after X is equal to 0, Y is equal to Y ', and Y' is equal to 0; in the judging process, if Y is not more than N and X is not more than M, the following settings are carried out: x ═ 0, Y + +, Y' ═ 0; if Y' is not greater than N, ending the processing flow;
if the resonant frequency is detected, continuously judging whether the number of times of the continuous undetected resonant frequency is greater than a set threshold value of the number of times of the undetected resonant frequency, if so, performing the following steps: storing the instantaneous value of the resonance frequency, and recording the time point of the resonance frequency, wherein X + +, Y' ═ 0; if not, the following steps are carried out: x ═ 0, Y + +, Y ═ 0.
Preferably, the method for processing the resonance frequency of the monolithic wafer specifically comprises the following steps:
averaging all resonant frequencies of a single wafer;
sorting the single instantaneous resonant frequency arrays by adopting a bubble sorting method;
judging whether the number of the data is larger than a set value, if so, performing the following steps: calculating a standard deviation, filtering data according to the standard deviation and a set coefficient, averaging the rest data to be used as a frequency value of the slice, and using a difference value between a maximum value and a minimum value after data filtering as a single-slice dispersion difference; if not, taking the average value of all data as the frequency value of the slice, and taking the difference value between the maximum value and the minimum value of the original data as the single-slice dispersion difference.
Preferably, the processing method of the stack of measured resonant frequencies is as follows:
setting the stable rotating speed in the number of turns, and judging a flag bit TurnsStableFlag of a result, wherein the flag bit is judged and set when the number of turns enters;
a) the turnssstableflag is 0, and the rotation speed is unstable.
b) The turnssstableflag is 1, and the rotating speed is stable.
c) Turning StableFlag is 2, and the rotating speed enters a stable first circle from instability;
when the rotating speed is unstable, the single ring is not divided into timing sections, and the single ring is directly treated by taking the ring as a unit; when the rotating speed is stable, the rotating speed is processed in a timed and segmented mode in each circle.
Preferably, the flow of determining the stable rotation speed is as follows:
the flow starts, whether the number of turns enters is judged, if yes, whether the number of turns is smaller than 2 is judged, and if yes, the last rotating speed1 is calculated according to the number of turns and time; if not, calculating the current rotating Speed2 according to the number of turns and time, judging whether the Speed1-Speed 2/Speed 1 is smaller than a rotating Speed comparison Threshold value Threshold, and if so, setting continuous stable number of turns + +; speed1-Speed2, Speed 2-0; if not, setting the continuous stable turn number to be 0, Speed1 to be Speed2 and Speed2 to be 0;
continuously judging whether the number of continuous stable turns is larger than or equal to a turn set value Turnset after setting the number of continuous stable turns + +, if so, judging whether TurnsStableFlag is 0, if so, setting TurnsStableFlag to 2, and if not, setting TurnsStableFlag to 1;
and according to the set number of the division sections, time division is carried out on a single circle.
Preferably, the flow of the timing to stack processing in this period is as follows:
the flow begins, whether the rotation speed of the continuous ring is stable for the first circle is judged, if yes, whether the current timing segment value is smaller than a set value is judged, if yes, the current timing segment value is set to be + +, and if not, the current timing segment value is set to be the set value;
if the rotation speed of the continuous ring is not the first stable rotation speed, continuously judging whether the stack is stored for the first time, if so, judging whether the current timing segment value is smaller than a set value, if so, setting the current timing segment value + +, and if not, setting the current timing segment value as the set value;
if not, continuing to judge whether the section is the last section of the circle, if not, continuing to judge whether the number of the wafers detected by the section is 1, and if the number of the wafers detected by the section is less than 1, carrying out inertial navigation mechanism processing; if the number of the wafers detected in the segment is greater than 1, continuously judging whether the number of the wafers detected in the segment is less than the number of the wafers detected in the corresponding segment of the previous circle, and if the number of the wafers detected in the segment is less than 1, performing the following settings: kicking off data which are not kicked off in the corresponding section of the previous circle in the resonant frequency storage stack array; and storing data which is not kicked off in the corresponding section of the previous circle in the array at the time point of the resonant frequency.
Preferably, the inertial navigation mechanism processes as follows: last round corresponds section frequency mean value and adds the wafer frequency of present grinding rate as this section, kicks the round in the storage array of resonant frequency mean value and corresponds the section and do not kick the data that remove, and this section wafer frequency is added to the stack end, kicks the round in the storage array of resonant frequency time point and corresponds the section and do not kick the data that remove, and this section time point is added to the stack end.
Preferably, the shutdown judgment process specifically includes:
the process is started, whether new data enter a stack is judged, if yes, the average value of the resonance frequency is calculated, whether the real-time resonance frequency reaches the target frequency is judged, if yes, the number of times of reaching the target frequency is added with 1, then whether the number of times of reaching the target frequency is larger than a set value is continuously judged, and if yes, all statistical parameters are reset to stop the grinder; and if no new data enters the stack and the real-time resonant frequency does not reach the target frequency, judging whether the real-time resonant frequency reaches the target frequency.
The invention has the following beneficial effects:
(1) adding a wafer distinguishing method after single frequency measurement is completed, and carrying out real-time frequency statistics after each wafer is distinguished;
(2) the standard deviation filtering is carried out on the instantaneous resonance frequency data measured by each wafer, so that the resonance frequency of the single wafer is more accurate;
(3) the automatic searching process judges whether the searching is successful or not based on a wafer distinguishing method, and the searching is considered to be successful if the specified number of wafers are searched within the specified time, so that the condition of mistaken searching when the interference signal is large is prevented;
(4) tracking the frequency measurement process, wherein the average frequency of each wafer is stored in a resonant frequency average value storage array, the array size is the number of wafers in one circle, and the array size is adaptively adjusted according to the number of wafers detected in each circle;
(5) the rotating speed of the grinder is constant, each circle is segmented and subdivided, which is equivalent to that a plurality of circle sensors are additionally arranged, so that the statistics is more accurate;
(6) grinding amount compensation is carried out on the average frequency of each wafer in the stack, so that the wafers which enter the array firstly can truly reflect the current resonant frequency;
(7) the dispersion statistics are based on a wafer discrimination method while the instantaneous resonant frequency is compensated for the amount of lapping according to the lapping rate.
Drawings
FIG. 1 is a flowchart illustrating the steps of a method for frequency compensation and dispersion statistics of a quartz wafer according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of 3 kinds of resonance signals of a detection signal;
FIG. 3 is a schematic diagram of a wafer partitioning and data processing flow in accordance with an embodiment of the present invention;
FIG. 4 is a schematic diagram of a method for processing a single wafer according to an embodiment of the present invention;
FIG. 5 is a diagram illustrating a stack processing method for measuring resonant frequencies according to an embodiment of the present invention;
FIG. 6 is a schematic diagram illustrating a flow of determining a stable rotation speed according to an embodiment of the present invention;
FIG. 7 is a flowchart illustrating the timing-to-stack processing according to the present embodiment of the invention;
FIG. 8 is a flowchart illustrating a method for processing a stack of turns detected according to an embodiment of the present invention;
FIG. 9 is a flowchart illustrating shutdown determination according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a flow chart of steps of a method for compensating the whole-wafer frequency of the resonant frequency of a quartz wafer and counting the whole-wafer dispersion according to an embodiment of the present invention is shown, which includes the following steps:
starting the process, judging whether the frequency sweep sampling is finished or not, if so, entering a wafer distinguishing and data processing process, and after finishing, entering a continuous ring rotating speed stabilizing judging process; if not, entering a continuous ring rotating speed stable judging process;
judging whether the rotating speed of the continuous ring is stable, if so, further judging whether the time of the current period in the ring is up; if not, judging the number of turns;
judging whether the timing time in the circle arrives, if so, performing the data processing flow from the timing time in the circle to the data processing flow; if not, judging the number of turns;
judging whether the number of turns enters, if so, entering a stable rotation speed judging process and a current turn data ending processing process, and then entering a real-time frequency processing process; if not, directly entering a real-time frequency processing flow;
judging whether the grinder needs to be stopped, if so, stopping the grinder, and ending the process; if not, judging whether the data sending timing time is up, if so, sending the average value of the resonant frequency to a touch screen for display, and entering a new process; if not, directly entering a new process.
Through the quartz wafer resonant frequency and dispersion statistical method based on the wafer partition, the following technical effects can be realized: (1) through frequency display in the grinding process, when each wafer is ground, real-time resonance frequency display accords with the actual frequency condition of the whole wafer, namely the average frequency of all wafers under current grinding; (2) when each disk of wafers is ground to the target frequency and stops working, the average frequency of all wafers in the disk is equal to the target frequency, namely the wafers are stopped to the target frequency just after the working is stopped; (3) the variation display corresponds to the actual variation of the wafer. The dispersion difference in the grinding process is displayed and is used for judging the wafer dispersion condition of the whole material disc, and is an important statistic; (4) the current resonant frequency can be accurately searched in the automatic searching process, and the over-frequency risk existing in the automatic searching error searching is reduced.
In one embodiment, the wafer sorting method determines that a wafer is valid if the number of times the resonant frequency is continuously measured exceeds a predetermined number.
The existing operation process is as follows:
(1) in the grinding process, the frequency measuring instrument has a fast frequency sweeping speed which can reach 250 times/S, and a certain time is needed for a probe to pass through a wafer, so that generally, more than 10 times of frequency sweeping can be completed through one wafer, and when the frequency of the wafer is in a frequency sweeping range, more than 10 times of resonant frequency can be continuously measured.
(2) The very short transit time for a wafer must be passed from the corner, for which case the resonant frequency of the corner, although not a misdetected resonant frequency, does not accurately represent the resonant frequency of the entire wafer, and is therefore discarded.
(3) In the case where an interference signal occurs, the resonance frequency cannot be measured a plurality of times in succession, and therefore the influence of the interference signal can be eliminated by the wafer sorting method.
During the test, the probe has 2 pins, so the contact condition between the probe and the wafer is divided into 3, two pins are on the wafer respectively, and two pins are on the wafer respectively, so that 3 signals exist in the resonance signal as shown in fig. 2. 3 variables are defined as follows: (1) continuously measuring the number Y of times of the resonant frequency; (2) continuously measuring the times X of the resonant frequency; (3) the number of times Y' of the resonance frequency is continuously measured after the resonance frequency is continuously measured.
There are two systematically-set thresholds and associated constraints: (1) continuously measuring the threshold N of the number of times of the resonant frequency, and ensuring that Y is equal to N and Y 'is equal to N when a valid wafer is measured, so that when Y is less than N, X is equal to 0 and Y' is equal to 0; (2) when the threshold value M of the number of times of the resonant frequency is continuously measured and a valid wafer is measured, X is guaranteed to be M, so that when X is less than M, Y' is set to 0.
Further, referring to fig. 3, a schematic diagram of a wafer differentiation and data processing flow is shown, which includes the following steps:
the process is started, and the resonant frequency is solved based on a waveform matching method;
judging whether the resonant frequency is detected or not, if not, continuously judging whether the number Y of the continuous undetected resonant frequency is greater than a set threshold N of the number of the continuous undetected resonant frequency, if so, continuously judging whether the number X of the continuous detected resonant frequency is greater than a set threshold M of the number of the continuous detected resonant frequency, if so, continuously judging whether the number of the continuous undetected resonant frequency is increased after the continuous detected resonant frequency, continuously judging whether the number Y' of the continuous undetected resonant frequency after the continuous detected resonant frequency is not greater than the set threshold of the number of the continuous detected resonant frequency, and if so, performing the following steps: (a) carrying out a single wafer resonance frequency processing method; performing a stack processing method for measuring the resonant frequency; (b) the number of the wafers measured in 1 cycle is + 1; measuring the number of resonance frequencies + X in 1 circle; calculating the dispersion difference in the chip; (c) ending the processing flow after X is equal to 0, Y is equal to Y ', and Y' is equal to 0; in the judging process, if Y is not more than N and X is not more than M, the following settings are carried out: x ═ 0, Y + +, Y' ═ 0; if Y' is not greater than N, ending the processing flow;
if the resonant frequency is detected, continuously judging whether the number of times of the continuous undetected resonant frequency is greater than a set threshold value of the number of times of the undetected resonant frequency, if so, performing the following steps: storing the instantaneous value of the resonance frequency, and recording the time point of the resonance frequency, wherein X + +, Y' ═ 0; if not, the following steps are carried out: x ═ 0, Y + +, Y ═ 0.
The current frequency measurement result is processed by a wafer distinguishing method, and the frequency measurement result is divided into two conditions of not measuring the resonant frequency and measuring the resonant frequency.
No resonance frequency was measured:
(1) y is more than N, X is more than M, and Y' is more than N; is an active wafer.
And (3) treatment: a. single-chip resonance frequency processing method (averaging represents the chip frequency); a resonant frequency stack processing method is detected (one-circle intra-frequency statistic array size self-adaption); b. the number of the wafers measured in 1 cycle is + 1; measuring the number of resonance frequencies + X in 1 circle; calculating the dispersion difference in the chip; c. y ═ Y', X ═ 0, and Y ═ 0.
(2)Y＜＝N；
And (3) treatment: x ═ 0, Y + +, Y ═ 0.
(3) Y is more than N, and X is less than M; the measured resonance frequency is a false detection signal.
And (3) treatment: x ═ 0, Y + +, Y ═ 0.
(4)Y＞N，X＞M，Y’＜N；
And (3) treatment: y' + +, one active wafer collection.
The measured resonant frequency is:
(1) y is more than N; one active wafer acquisition.
And (3) treatment: and X + +, Y' ═ 0, and storing the instantaneous value of the single-chip resonance frequency.
(2) Y is N; when the resonance frequency is detected, the signal is a false detection signal, and the processing is carried out when the resonance frequency is not detected.
And (3) treatment: y + +, X ═ 0, and Y ═ 0.
By processing the wafer distinguishing method, all the resonant frequencies of the probe passing through the single wafer can be collected, and discrete misdetection signals and resonant signals of the probe only passing through corners are kicked off. All instantaneous resonant frequencies of the individual wafers can then be processed (single wafer resonant frequency processing method).
In a further specific application example, the average resonance frequency of the single wafer is obtained by a single wafer resonance frequency processing method, the frequency of the wafer is represented by the average frequency, the average frequency is stored in a circle of single wafer resonance frequency average value storage array, the average frequency of the whole wafer can be further calculated, and the frequency is compared with a target frequency to be used as a basis for stopping the wafer. When the number of the data exceeds a set value, a standard deviation filtering method is adopted for data processing, and discrete data are kicked out; when the number of the data is less than the set value, the data is not kicked. Through data filtering, the average frequency of a single wafer can be more accurate.
The specific flow of the single-chip wafer resonant frequency processing method is shown in fig. 4, and the flow is as follows:
averaging all resonant frequencies of a single wafer;
sorting the single instantaneous resonant frequency arrays by adopting a bubble sorting method;
judging whether the number of the data is larger than a set value, if so, performing the following steps: calculating a standard deviation, filtering data according to the standard deviation and a set coefficient, averaging the rest data to be used as a frequency value of the slice, and using a difference value between a maximum value and a minimum value after data filtering as a single-slice dispersion difference; if not, taking the average value of all data as the frequency value of the slice, and taking the difference value between the maximum value and the minimum value of the original data as the single-slice dispersion difference.
In the single chip wafer resonant frequency processing method, the bubble sorting method is mainly used for data filtering and solving single chip dispersion. And acquiring the average value of the single-chip resonance frequency as the resonance frequency of the chip by a single-chip wafer resonance frequency processing method, and simultaneously acquiring the single-chip dispersion. The plate resonant frequency value is then stored and processed based on the number of wafers measured by the speed and timing segments.
In a further specific application example, after the resonant frequency is measured, the single-chip resonant frequency average value needs to be stored in a circle of single-chip resonant frequency average value storage array, and the array is used as a basis for solving the real-time frequency of the whole wafer.
In the storage process, the following influence factors are as follows:
1. whether the rotating speed of the continuous ring is stable or not.
2. And under the condition of stable rotating speed of the continuous ring, whether a circle of single-chip resonance frequency average value storage array is stored for the first time or not needs to be considered.
One variable is defined for the mill speed: TurnsStableFlag, and the variable is a flag bit of the judgment result of the stable rotating speed of the continuous ring.
1. Turnssstableflag ═ 2: and (4) continuously winding the first winding with stable rotation speed, processing the average value of the resonant frequency by taking the winding as a unit, and recording the time point as the initial record.
2. Turnssstableflag ═ 1: the rotating speed of the continuous ring stably exceeds one circle, the number of the wafers in the current section of the ring and the number of the wafers in the corresponding section of the previous circle are compared when the average value of the resonant frequency is processed, the processing is carried out according to the comparison result, the time point is recorded as the record of the second circle, and the time of the previous circle needs to be added.
3. Turnssstableflag ═ 0: the rotating speed of the continuous ring is unstable, and the single ring is not subjected to timing segmentation at the moment and is directly treated by taking the ring as a unit.
A specific flowchart of the processing method for stack processing with resonant frequency measurement is shown in fig. 5, which includes the following steps:
the process starts, whether TurnsStableFlag is equal to 2 or not is judged, if yes, the number of the wafers measured in the current segment in the timing segment is +1, whether the number of the wafers in the current circle is less than or equal to the number of the wafers in the previous circle is further judged, and if yes, the following stacking processing is carried out: removing the first data in the resonant frequency storage stack, adding the measured wafer data, and keeping the stack size unchanged; kicking off a wafer time point data of a circle of corresponding section, adding the wafer time point data measured this time, keeping the stack size unchanged, and ending the processing flow; if the number of the wafers in the circle is larger than that of the wafers in the previous circle, the following stacking treatment is carried out: adding the current wafer resonant frequency and the stack size +1 at the end of the stack; and adding the data of the wafer time point measured this time to the end of the stack, and ending the processing flow, wherein the stack size is + 1.
If the turnsStableFlag is not equal to 2, continuously judging whether the turnsStableFlag is equal to 1, if not, judging whether the number of the wafers in the circle is less than or equal to the number of the wafers in the previous section after the number of the wafers in the circle is plus 1, and if so, performing the following stacking treatment: removing the first wafer data of the previous circle, adding the wafer data measured this time, and keeping the stack size unchanged; if the number of the wafers in the circle is larger than that of the wafers in the previous section, the following stacking treatment is carried out: adding the wafer data measured this time, stack size +1, and ending the process flow.
If the turnssableflag is equal to 1 and the number of the wafers in the current segment is +1, judging whether the number of the wafers in the current segment is less than or equal to the number of the wafers in the previous segment, if so, performing the following stacking treatment: kicking off a wafer data of the corresponding section of the previous circle, adding the wafer data measured this time, and keeping the stack size unchanged; kicking off a wafer time point data of a circle of corresponding section, adding the wafer time point data measured this time, keeping the stack size unchanged, and ending the processing flow; if the number of the wafers in the section is larger than that of the wafers in the previous circle, the following stacking treatment is carried out: adding the wafer data measured this time to the end of the stack, wherein the stack size is + 1; and adding the data of the wafer time point measured this time to the end of the stack, and ending the processing flow, wherein the stack size is + 1.
In the actual grinding process, after the grinder rotates for a certain number of turns, the rotating speed of the grinder is kept constant, so that a method for subdividing each turn is introduced, and frequency statistics of each turn after subdivision is more accurate. After the single chip wafer detects the resonant frequency and stores the resonant frequency in the array, the whole array representing the frequency condition of the whole wafer needs to be averaged to judge whether the target frequency is reached. And processing the storage array of the resonant frequency average value of the wafer in one circle after the time is timed in segments and the number of circles is entered. Whether the rotating speed of the continuous ring is stable or not needs to be judged based on the condition that the rotating speed of the continuous ring is stable.
In a further embodiment, the rotational speed is calculated by counting the time required for a revolution of the mill. Therefore, whether the rotating speed of two continuous circles is stable can be judged by only comparing the rotating speeds of the upper circle and the lower circle.
Referring to fig. 6, the flow of determining the stable rotation speed is as follows:
the flow starts, whether the number of turns enters is judged, if yes, whether the number of turns is smaller than 2 is judged, and if yes, the last rotating speed1 is calculated according to the number of turns and time; if not, calculating the current rotating Speed2 according to the number of turns and time, judging whether the Speed1-Speed 2/Speed 1 is smaller than a rotating Speed comparison Threshold value Threshold, and if so, setting continuous stable number of turns + +; speed1-Speed2, Speed 2-0; if not, setting the continuous stable turn number to be 0, Speed1 to be Speed2 and Speed2 to be 0;
continuously judging whether the number of continuous stable turns is larger than or equal to a turn set value Turnset after setting the number of continuous stable turns + +, if so, judging whether TurnsStableFlag is 0, if so, setting TurnsStableFlag to 2, and if not, setting TurnsStableFlag to 1;
and according to the set number of the division sections, time division is carried out on a single circle.
Furthermore, as the grinding machine rotates at a constant speed during the grinding process of the wafer, one circle is periodically segmented. Storing the wafer data measured each time in a segmented time; and processing the data when the segmentation time is up, wherein the processing is mainly performed on the resonant frequency average value storage array and the resonant frequency average value time point storage array. Meanwhile, if a wafer is not detected in the segmented time, an inertial navigation mechanism is introduced, and the average value of the frequency of the corresponding segment of the previous circle plus the grinding rate of the previous circle is used as the resonant frequency of the wafer in the segment.
By segmenting the circle, the number of turns is subdivided equivalently, and the frequency statistics of the whole circle can be more real-time and accurate.
In a specific application example, referring to fig. 7, the processing flow from the timing time to the stack in this period is as follows:
the flow begins, whether the rotation speed of the continuous ring is stable for the first circle is judged, if yes, whether the current timing segment value is smaller than a set value is judged, if yes, the current timing segment value is set to be + +, and if not, the current timing segment value is set to be the set value;
if the rotation speed of the continuous ring is not the first stable rotation speed, continuously judging whether the stack is stored for the first time, if so, judging whether the current timing segment value is smaller than a set value, if so, setting the current timing segment value + +, and if not, setting the current timing segment value as the set value;
if not, continuing to judge whether the section is the last section of the circle, if not, continuing to judge whether the number of the wafers detected by the section is 1, and if the number of the wafers detected by the section is less than 1, carrying out inertial navigation mechanism processing; if the number of the wafers detected in the segment is greater than 1, continuously judging whether the number of the wafers detected in the segment is less than the number of the wafers detected in the corresponding segment of the previous circle, and if the number of the wafers detected in the segment is less than 1, performing the following settings: kicking off data which are not kicked off in the corresponding section of the previous circle in the resonant frequency storage stack array; and storing data which is not kicked off in the corresponding section of the previous circle in the array at the time point of the resonant frequency.
Further, the inertial navigation mechanism processes as follows: last round corresponds section frequency mean value and adds the wafer frequency of present grinding rate as this section, kicks the round in the storage array of resonant frequency mean value and corresponds the section and do not kick the data that remove, and this section wafer frequency is added to the stack end, kicks the round in the storage array of resonant frequency time point and corresponds the section and do not kick the data that remove, and this section time point is added to the stack end.
When the turn number signal is detected in the online frequency measurement process, the resonant frequency average value storage array and the resonant frequency time point storage array need to be processed according to the rotating speed condition. Referring to fig. 8, a flow chart of a detected turn stack processing method is shown. Firstly, judging whether the rotating speed of the continuous ring is stable or not, if the rotating speed is stable and the stack needs to be processed in a segmented mode, otherwise, judging whether the single-chip resonant frequency average value storage array is stored for the first time or not under the condition that the rotating speed of the continuous ring is stable according to the number of turns: (1) primary storage: and whether the number of the wafers in the timing segmentation is 0 or not is judged, and if yes, the number of the wafers needs to be supplemented. (2) Non-primary storage: a. the data of the last segment in the timing segment is processed. b. If the current section is not the last section, the last sections of data need to be supplemented.
The process flow of FIG. 8 is described in further detail below:
the process is started, whether the rotating speed continuous ring is stable is judged, if yes, whether the resonant frequency is stored for the first time is judged, and if the resonant frequency is stored for the first time, the following processing is carried out: resetting the initial storage flag bit of the stack, judging whether the undetected frequency exists in the timing segmentation, and if so, supplementing the undetected frequency; continuing to update the previous circle of the resonant frequency storage wafer number array into the current circle of the resonant frequency storage wafer number array, setting the number of the wafers detected in the previous circle as the number of the wafers currently detected, resetting the number of the wafers detected in the current circle, and ending the flow; if not, continuously judging whether the rotating speed of the continuous ring is stable and has passed one circle or not, if so, continuously judging whether the rotating speed of the continuous ring is the last section of the continuous ring, if so, continuously judging whether the number of the wafers detected by the section is more than or equal to 1, if so, continuously judging whether the number of the wafers detected by the section is less than the number of the wafers detected by the corresponding section of the previous circle, and if so, setting as follows: kicking off the data which are not kicked and removed by the corresponding section of the previous circle in the resonant frequency storage stack array, kicking off the data which are not kicked and removed by the corresponding section of the previous circle in the resonant frequency time point storage array, updating the single-chip resonant frequency time point, and then updating the resonant frequency storage chip number array of the previous circle into the resonant frequency chip number storage array of the current circle; setting the number of the wafers measured in the previous circle as the number of the wafers measured currently; the circle detects the setting of zero clearing of the number of the wafers. If the number of the wafers measured in the section is not less than the number of the wafers measured in the corresponding section of the previous circle, or if the rotating speed of the continuous circle is not stable and the continuous circle passes one circle, or the number of the wafers measured in the section is not less than the number of the wafers measured in the corresponding section of the previous circle, the following settings are carried out: updating the previous circle of resonant frequency storage wafer number array into the current circle of resonant frequency wafer number storage array; setting the number of the wafers measured in the previous circle as the number of the wafers measured currently; the number of the wafers measured by the circle is reset.
If the number of the wafers detected in the section is less than 1, the following settings are carried out: calculating the average value of the frequency of the previous circle of the corresponding section of the wafer and the current grinding rate to be used as the frequency of the section; kicking off the frequency of the corresponding section of the previous circle which is not kicked off; recording the time point of the current frequency; updating the single-chip resonant frequency time point; then updating the previous circle of resonant frequency storage wafer number array into the current circle of resonant frequency wafer number storage array; setting the number of the wafers measured in the previous circle as the number of the wafers measured currently; the number of the wafers measured by the circle is reset.
If the current circle is not the last section, the following settings are carried out: calculating the average value of the frequency of the previous circle of the corresponding section of the wafer and the current grinding rate as the frequency of the section which is not detected; kicking off the frequency of the corresponding section of the previous circle which is not kicked off; recording the time point of the current frequency; and updating the time point of the single-chip resonance frequency.
Referring to fig. 9, in a specific application example, the shutdown determination process is specifically as follows:
the process is started, whether new data enter a stack is judged, if yes, the average value of the resonance frequency is calculated, whether the real-time resonance frequency reaches the target frequency is judged, if yes, the number of times of reaching the target frequency is added with 1, then whether the number of times of reaching the target frequency is larger than a set value is continuously judged, and if yes, all statistical parameters are reset to stop the grinder; and if no new data enters the stack and the real-time resonant frequency does not reach the target frequency, judging whether the real-time resonant frequency reaches the target frequency.
It is to be understood that the exemplary embodiments described herein are illustrative and not restrictive. Although one or more embodiments of the present invention have been described with reference to the accompanying drawings, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims.
Claims (3)
1. A whole-disc frequency compensation and whole-disc dispersion statistical method for a quartz wafer resonant frequency is characterized by comprising the following steps:
starting the process, judging whether the frequency sweep sampling is finished or not, if so, entering a wafer distinguishing and data processing process, and after finishing, entering a continuous ring rotating speed stabilizing judging process; if not, entering a continuous ring rotating speed stable judging process;
judging whether the rotating speed of the continuous ring is stable, if so, further judging whether the timing time of the section in the ring is up; if not, judging the number of turns;
judging whether the timing time in the circle arrives, if so, performing the data processing flow from the timing time in the circle to the data processing flow; if not, judging the number of turns;
judging whether the number of turns enters, if so, entering a stable rotation speed judging process and a current turn data ending processing process, and then entering a real-time frequency processing process; if not, directly entering a real-time frequency processing flow;
judging whether the grinder needs to be stopped, if so, stopping the grinder, and ending the process; if not, judging whether the data sending timing time is up, if so, sending the average value of the resonant frequency to a touch screen for display, and entering a new process; if not, directly entering a new process,
the wafer differentiation and data processing flow is as follows:
the process is started, and the resonant frequency is solved based on a waveform matching method;
judging whether the resonant frequency is detected or not, if not, continuously judging whether the number Y of the continuous undetected resonant frequency is greater than the number setting threshold N of the continuous undetected resonant frequency, if so, continuously judging whether the number X of the continuous detected resonant frequency is greater than the number setting threshold M of the continuous detected resonant frequency, if so, continuously judging whether the number Y' +1 of the continuous undetected resonant frequency after the continuous detected resonant frequency is greater than the number setting threshold N of the continuous undetected resonant frequency after the continuous detected resonant frequency is continuously judged, and if so, performing the following steps: (a) carrying out a single wafer resonance frequency processing method; performing a stack processing method for measuring the resonant frequency; (b) the number of the wafers measured in 1 cycle is + 1; measuring the number of resonance frequencies + X in 1 circle; calculating the dispersion difference in the chip; (c) ending the processing flow after X is equal to 0, Y is equal to Y ', and Y' is equal to 0; in the determination process, if Y is not greater than N and X is not greater than M, the following settings are performed: x ═ 0, Y + +, Y' ═ 0; if Y' is not greater than N, ending the processing flow;
if the resonant frequency is detected, continuously judging whether the continuous undetected resonant frequency times Y are greater than the undetected resonant frequency times set threshold value N, if so, performing the following steps: storing the instantaneous value of the resonance frequency, and recording the time point of the resonance frequency, wherein X + +, Y' ═ 0; if not, the following steps are carried out: x ═ 0, Y + +, Y ═ 0,
the stable judging process of the rotating speed is as follows:
the flow starts, whether the number of turns enters is judged, if yes, whether the number of turns is smaller than 2 is judged, if yes, the last rotating speed is calculated according to the number of turns and time 1; if the number of turns is not less than 2, calculating the Speed2 according to the number of turns and time, and then judging whether | Speed1-Speed2|/Speed1 is less than a Speed comparison Threshold, if so, setting continuous stable turns + +, Speed1 ═ Speed2, and Speed2 ═ 0; if not, setting the continuous stable turn number to be 0, Speed1 to be Speed2 and Speed2 to be 0;
continuously judging whether the number of continuous stable turns is larger than or equal to a turn set value Turnset after setting the number of continuous stable turns +1, if so, judging whether TurnsStableFlag is 0, if so, setting TurnsStableFlag to 2, and if not, setting TurnsStableFlag to 1;
according to the set number of the division sections, time division is carried out on a single circle;
the processing flow from the timing time to the stack is as follows:
the flow begins, whether the rotation speed of the continuous ring is stable for the first circle is judged, if yes, whether the current timing segment value is smaller than a set value is judged, if yes, the current timing segment value is set to be + +, and if not, the current timing segment value is set to be the set value;
if the rotation speed of the continuous ring is not the first stable rotation speed, continuously judging whether the stack is stored for the first time, if so, judging whether the current timing segment value is smaller than a set value, if so, setting the current timing segment value + +, and if not, setting the current timing segment value as the set value;
if not, continuing to judge whether the section is the last section of the circle, if not, continuing to judge whether the number of the wafers detected by the section is 1, and if the number of the wafers detected by the section is less than 1, carrying out inertial navigation mechanism processing; if the number of the wafers detected in the segment is greater than 1, continuously judging whether the number of the wafers detected in the segment is less than the number of the wafers detected in the corresponding segment of the previous circle, and if the number of the wafers detected in the segment is less than 1, performing the following settings: kicking off data which are not kicked off in the corresponding section of the previous circle in the resonant frequency storage stack array; kicking off data which are not kicked off in the corresponding section of the previous circle in the storage array at the time point of the resonant frequency;
the method for processing the resonance frequency of the single wafer comprises the following steps:
averaging all the resonant frequencies of the single wafer;
sorting the single instantaneous resonant frequency arrays by adopting a bubble sorting method;
judging whether the number of the data is larger than a set value, if so, performing the following steps: calculating standard deviation, filtering data according to the standard deviation and a set coefficient, averaging the rest data to be used as a frequency value of the single chip, and using a difference value between a maximum value and a minimum value after data filtering as a single chip dispersion; if not, taking the average value of all the data as the frequency value of the single chip, and taking the difference value between the maximum value and the minimum value of the original data as the single chip dispersion difference;
the inertial navigation mechanism processing procedure is as follows: last round corresponds section frequency mean value and adds the wafer frequency of present grinding rate as this section, kicks the round in the storage array of resonant frequency mean value and corresponds the section and do not kick the data that remove, and this section wafer frequency is added to the stack end, kicks the round in the storage array of resonant frequency time point and corresponds the section and do not kick the data that remove, and this section time point is added to the stack end.
2. The method for whole-wafer frequency compensation and whole-wafer dispersion statistics of the resonant frequency of a quartz wafer as claimed in claim 1, wherein the stack processing method of the measured resonant frequency is as follows:
setting a flag bit TurnsStableFlag of a stable rotating speed judgment result in the number of turns, and judging and setting the flag bit when the number of turns enters;
a) turnssstableflag is 0, and the rotating speed is unstable;
b) the turnssstableflag is 1, and the rotating speed is stable;
c) turning StableFlag is 2, and the rotating speed enters a stable first circle from instability;
when the rotating speed is unstable, the single ring is not divided into timing sections, and the single ring is directly treated by taking the ring as a unit; when the rotating speed is stable, the rotating speed is processed in a timed and segmented mode in each circle.
3. The method as claimed in claim 1, wherein the shutdown judgment process comprises the following steps:
the process is started, whether new data enter a stack is judged, if yes, the average value of the resonance frequency is calculated, whether the real-time resonance frequency reaches the target frequency is judged, if yes, the number of times of reaching the target frequency is added with 1, then whether the number of times of reaching the target frequency is larger than a set value is continuously judged, and if yes, all statistical parameters are reset to stop the grinder; if no new data is entered into the stack, a new cycle is entered.
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| JP2005026453A (en) * | 2003-07-02 | 2005-01-27 | Ebara Corp | Substrate polishing apparatus and method therefor |
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