CN111215757A - Laser etching device and laser etching process - Google Patents

Laser etching device and laser etching process Download PDF

Info

Publication number
CN111215757A
CN111215757A CN202010095583.6A CN202010095583A CN111215757A CN 111215757 A CN111215757 A CN 111215757A CN 202010095583 A CN202010095583 A CN 202010095583A CN 111215757 A CN111215757 A CN 111215757A
Authority
CN
China
Prior art keywords
laser
workpiece
clamping
rotating arm
laser head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010095583.6A
Other languages
Chinese (zh)
Inventor
李荣辉
梁梅新
陈裕华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Evenwin Precision Technology Co Ltd
Original Assignee
Guangdong Evenwin Precision Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Evenwin Precision Technology Co Ltd filed Critical Guangdong Evenwin Precision Technology Co Ltd
Priority to CN202010095583.6A priority Critical patent/CN111215757A/en
Publication of CN111215757A publication Critical patent/CN111215757A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B23K26/0861Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0426Fixtures for other work
    • B23K37/0435Clamps

Abstract

The invention relates to a laser etching device, which is used for processing a workpiece and comprises: the engraving mechanism comprises a fixed seat and a laser head, wherein the laser head is arranged on the fixed seat and used for emitting laser for processing workpieces. The camera shooting mechanism comprises a mounting seat and an image collector, and the image collector is arranged on the mounting seat and used for determining the coordinate position of the workpiece. The clamping mechanism comprises a clamping arm and a driving assembly, and the clamping arm is rotatably connected with the driving assembly and is used for fixing the workpiece. And the control mechanism is used for receiving the coordinate position data transmitted by the image collector, and can control the driving assembly to drive the clamping arm to rotate so as to enable the laser of the laser head to irradiate different processing positions on the workpiece. The workpiece is always positioned on the same clamping arm, so that the number of clamps and the clamping times are reduced, the manufacturing cost of the laser etching device is reduced, and the processing efficiency and the processing precision of the laser etching device are improved.

Description

Laser etching device and laser etching process
Technical Field
The invention relates to the technical field of mechanical tools, in particular to a laser etching device and a laser etching process formed by applying the laser etching device.
Background
Laser carving is a forming process which uses numerical control technology as a basis, uses laser processing as a processing medium, and instantly melts and gasifies a processing material under laser irradiation. The laser etching is not in contact with the surface of the material and is not influenced by mechanical motion, the surface of the processed object cannot deform, and the processed object cannot generate cutting force in the laser etching process, so that the clamping requirement on the processed object is relatively low, and the damage of the cutting force to the processed object is also avoided. Meanwhile, the laser etching has strong processing applicability, is not influenced by the elasticity and flexibility of materials, and can process brittle materials and flexible materials. The laser etching processing has the advantages of high precision and high speed, and the application field of the laser etching processing is very wide.
In electronic equipment technical field, adopt radium carving device to process the inner chamber of intelligent wrist-watch shell usually, because the inner chamber of shell has a plurality of processing positions, to traditional processing mode, each processing position of shell inner chamber all need adopt a special radium carving device, in other words, after adopting a radium carving device to finish to one of them processing position, must change another new radium carving device and process another one. Therefore, the number of the laser etching devices can be increased, the manufacturing cost is increased, positioning errors can be generated in the process of clamping the shell for multiple times, and the clamping time of the shell is also increased.
Disclosure of Invention
The invention solves the technical problem of how to reduce the manufacturing cost of the laser etching device and improve the processing efficiency and precision.
A laser etching apparatus for processing a workpiece, the laser etching apparatus comprising:
the engraving mechanism comprises a fixed seat and a laser head, and the laser head is arranged on the fixed seat and is used for emitting laser for processing the workpiece;
the camera shooting mechanism comprises a mounting seat and an image collector, the image collector is arranged on the mounting seat and is used for determining the coordinate position of the workpiece,
the clamping mechanism comprises a clamping arm and a driving assembly, and the clamping arm is rotatably connected with the driving assembly and is used for fixing the workpiece; and
and the control mechanism is used for receiving the coordinate position data transmitted by the image collector, and can control the driving assembly to drive the clamping arm to rotate so as to enable the laser of the laser head to irradiate different processing positions on the workpiece.
In one embodiment, the laser head is rotatably connected with the fixed seat, and the laser head comprises a continuous laser and a pulse laser.
In one embodiment, the laser head is rotatably connected with the fixed seat, and the laser head comprises a continuous laser and a pulse laser.
In one embodiment, the fixing seat comprises a longitudinal beam and a cross beam which are connected with each other, the extending direction of the cross beam and the extending direction of the longitudinal beam form a set included angle, the cross beam is connected with the end part or the middle part of the longitudinal beam, and the laser head is arranged at one end, far away from the total amount, of the cross beam.
In one embodiment, the image collector comprises a charge coupled scanning camera.
In one embodiment, the engraving mechanism and the camera mechanism are located on one side of the control mechanism, and the clamping mechanism is located on the other side of the control mechanism.
In one embodiment, the control mechanism comprises a host and a display screen, the display screen is arranged on the host, and the camera shooting mechanism and the clamping mechanism are both in wired or wireless connection with the host.
In one of them embodiment, drive assembly includes base, first swinging boom, second swinging boom and third swinging boom, first swinging boom with the base rotates to be connected, the centre gripping arm with the third swinging boom rotates to be connected, the both ends of second swinging boom respectively with the tip of first swinging boom with the third swinging boom rotates to be connected, the rotatory central axis that winds of first swinging boom is perpendicular to the central axis that the second swinging boom rotates around, the rotatory central axis that winds of third swinging boom is perpendicular to the central axis that the second swinging boom rotates around, the rotatory central axis that winds of centre gripping arm is perpendicular to the central axis that the third swinging boom rotates around.
A laser etching process is used for processing a workpiece, and comprises the following steps:
clamping the workpiece on a clamping arm;
collecting the coordinate position of the workpiece, and conveying the coordinate position to a control mechanism;
enabling the control mechanism to control the clamping arm to rotate according to the coordinate position so as to enable the clamping arm to be switched among different processing stations; and
and processing the workpieces positioned at different processing stations by adopting laser emitted by a laser head.
In one embodiment, the control mechanism controls the laser head and the clamping arm to rotate simultaneously or sequentially.
One technical effect of one embodiment of the invention is that: the workpiece is clamped on the same clamping arm, and the control mechanism controls the driving assembly to drive the clamping arm to rotate, so that laser of the laser head irradiates different processing positions on the workpiece, and processing of all processing positions of the workpiece is achieved. In the process of machining different positions of the workpiece, the workpiece is always positioned on the same clamping arm, so that the number of clamps and the machining cost are reduced. Meanwhile, the workpieces can be machined at a plurality of machining positions only by clamping the workpieces on the clamping arms once, so that the time for clamping the workpieces for a plurality of times is saved, and the machining efficiency of the workpieces is improved. And the positioning error generated in the process of multiple clamping is reduced, so that the machining precision of the workpiece is improved.
Drawings
Fig. 1 is a schematic perspective view illustrating a laser etching apparatus according to an embodiment;
FIG. 2 is a schematic perspective view of the laser etching apparatus shown in FIG. 1 for determining a coordinate position of a workpiece;
FIG. 3 is a schematic perspective view of the laser etching apparatus shown in FIG. 1 during processing;
fig. 4 is a schematic perspective view of a workpiece, which is illustrated by a smart watch case.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "inner", "outer", "left", "right" and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Referring to fig. 1 to 4, a laser etching apparatus 10 according to a first embodiment of the present invention is used for processing a workpiece 20 of an electronic device, where the workpiece 20 is, for example, a smart watch case, and the smart watch case generally involves processing a plurality of different processing positions in an inner cavity, for example, five different processing positions, and when all the five processing positions are processed, the inner cavity of the smart watch case is processed. The laser engraving apparatus 10 includes an engraving mechanism 100, a camera mechanism 200, a clamping mechanism 300, and a control mechanism 400.
Referring to fig. 1, in some examples, engraving mechanism 100 includes a holder 110 and a laser head 120. The number of engraving mechanism 100 may be one. The fixed seat 110 includes a longitudinal beam and a transverse beam, the transverse beam is denoted as a first transverse beam 112, and the longitudinal beam is denoted as a first longitudinal beam 111. The first cross member 112 and the first longitudinal member 111 are connected to each other, and may be substantially straight rod-shaped structures, and the cross section of the first cross member 112 and the first longitudinal member 111 may be rectangular, regular polygonal, or circular. The first cross member 112 and the first longitudinal member 111 may be made of metal or alloy material, and the metal or alloy material may be stainless steel or aluminum alloy material. The first longitudinal beam 111 is vertically arranged, that is, the first longitudinal beam 111 extends in the vertical direction; the first cross member 112 is disposed horizontally, that is, the first cross member 112 extends along a horizontal direction, and an extending direction of the first longitudinal member 111 and an extending direction of the first cross member 112 form an angle, for example, a ninety degree angle, and at this time, the first longitudinal member 111 and the first cross member 112 are perpendicular to each other.
The first cross member 112 has a first end and a second end, and the second end of the first cross member 112 is farther from the first longitudinal member 111 than the first end. The first end of the first cross member 112 is connected to the end of the first longitudinal member 111, for example, the first cross member 112 is connected to the upper end of the first longitudinal member 111, but the first end of the first cross member 112 may also be connected to the middle of the first longitudinal member 111. The second end of the first beam 112 is a free end. A laser head 120 is disposed at a second end of the first beam 112.
The laser head 120 is used to generate laser light, and when the laser light is emitted to any one of the processing positions of the workpiece 20, the laser light will melt or vaporize the material at the processing position to process and shape the workpiece. The laser head 120 may be a continuous laser having a stable operating state, in which the number of particles at each energy level and the intra-cavity radiation field have a stable distribution. The excitation of the working substance, and the corresponding laser output, may be continued in a continuous manner over a longer period of time. The laser head 120 may also be a pulsed laser, where the pulse width of a single pulse generated by the pulsed laser is less than a certain value, for example less than 0.25 seconds, and the pulsed laser operates every short time, and the pulsed laser has a large output power. The laser head 120 may be selected to be a continuous laser or a pulsed laser, as the case may be, for example, for the workpiece 20, some of the processing locations of the workpiece 20 are processed with a continuous laser and some other processing locations are processed with a pulsed laser.
In this first embodiment, the laser head 120 is fixedly disposed on the first beam 112. That is, the laser head 120 cannot move relative to the first beam 112, so that the laser generated by the laser head 120 is always emitted in a specific direction.
Referring to fig. 1, in some examples, the camera mechanism 200 includes a mount 210 and an image collector 220, and the number of the camera mechanisms 200 may be one. The mounting seat 210 includes a second cross beam 212 and a second longitudinal beam 211, the second cross beam 212 and the second longitudinal beam 211 are connected to each other and may be substantially in a straight rod-shaped structure, and the cross section of the second cross beam 212 and the second longitudinal beam 211 may be rectangular, regular polygonal, circular, or the like. The second cross member 212 and the second longitudinal member 211 may be made of metal or alloy material, and the metal or alloy material may be stainless steel or aluminum alloy material. The second longitudinal beam 211 is vertically arranged, that is, the second longitudinal beam 211 extends in a vertical direction; the second cross beam 212 is horizontally disposed, that is, the second cross beam 212 extends along a horizontal direction, and the extending direction of the second longitudinal beam 211 and the extending direction of the second cross beam 212 form an angle, for example, a ninety-degree angle, in this case, the second longitudinal beam 211 and the second cross beam 212 are perpendicular to each other.
The second cross member 212 has a first end and a second end, the second end of the second cross member 212 being further from the second longitudinal member 211 than the first end. The first end of the second cross member 212 is connected to an end of the second longitudinal member 211, for example, the second cross member 212 is connected to an upper end of the second longitudinal member 211, but the first end of the second cross member 212 may also be connected to a middle portion of the second longitudinal member 211. The second end of the second beam 212 is a free end. An image collector 220 is disposed at a second end of the second beam 212.
The image collector 220 may be a charge coupled scanning (CCD) camera. The image collector 220 can convert the optical image into a digital signal, a tiny photosensitive substance is implanted in the image collector 220 as a pixel, and the more the pixels are, the higher the resolution of the image provided by the image collector 220 is. The image collector 220 has a plurality of capacitors arranged in a matrix form, and the capacitors are used for sensing light and converting the image signal into a digital signal. The image collector 220 may be fixedly disposed on the second beam 212, and at this time, the image collector 220 can only collect images from a specific direction. Of course, the image collector 220 can move relative to the second beam 212, and at this time, the image collector 220 can collect images from a plurality of different directions.
In some examples, the engraving mechanism 100 and the camera mechanism 200 are spaced apart with a spacing between the engraving mechanism 100 and the camera mechanism 200, although the first cross member 112 of the engraving mechanism 100 can be parallel to the second cross member 212 of the camera mechanism 200 and the first longitudinal member 111 of the engraving mechanism 100 can be parallel to the second longitudinal member 211 of the camera mechanism 200. For example, the first cross member 112 extends in the horizontal direction toward the front side of the first longitudinal member 111 so that the laser head 120 is located on the front side of the first longitudinal member 111; the second cross member 212 also extends horizontally toward the front side of the second longitudinal member 211 so that the image pickup device 220 is located on the front side of the second longitudinal member 211.
The engraving mechanism 100 and the camera mechanism 200 are located on the same side of the control mechanism 400, and the engraving mechanism 100 is further away from the control mechanism 400 than the camera mechanism 200, for example, both are located on the left side of the control mechanism 400; the gripper mechanism 300 is located on the other side of the control mechanism 400, e.g., the gripping mechanism is located on the right side of the control mechanism 400. Through the arrangement, the carving mechanism 100, the camera shooting mechanism 200, the control mechanism 400 and the clamping mechanism 300 can be reasonably arranged, so that the operation of each mechanism is not interfered with each other, and the workpiece 20 is processed smoothly.
In some examples, the control mechanism 400 includes a host 410 and a display 420, and the display 420 is disposed on the host 410, for example, the display 420 may be rotatably connected to the host 410, and when the control mechanism 400 stops working, the display 420 is rotated relative to the host 410, so that the display surface of the display 420 is covered by the host 410, thereby protecting the display 420. The image collector 220 of the camera mechanism 200 can be connected with the host 410 of the control mechanism 400 through a data line, that is, wired connection is realized, so that a signal of the image collector 220 is transmitted to the host 410 through the data line and displayed through the display screen 420; of course, the image collector 220 of the camera mechanism 200 may be wirelessly connected with the host 410 of the control mechanism 400 through wifi, so that the signal of the image collector 220 is transmitted to the host 410 through wireless transmission and displayed through the display screen 420. Similarly, the host 410 of the control mechanism 400 may be in wired connection with the clamping mechanism 300 through a data line so as to control the movement of the clamping mechanism 300 through a wired connection, and the host 410 of the control mechanism 400 may also control the movement of the clamping mechanism 300 through a wifi wireless connection.
When the image acquirer 220 and the host 410 perform data transmission, the coordinate position data of the workpiece 20 is mainly used, that is, the image acquirer 220 photographs the workpiece 20 to obtain the coordinate position data of the workpiece 20, and the coordinate position data is transmitted to the host 410, so that the host 410 controls subsequent actions of the clamping mechanism 300 according to the coordinate position data.
Referring to fig. 1, 2 and 3, in some examples, the clamping mechanism 300 includes a clamping arm 340 and a driving assembly 360, the clamping mechanism 300 may be a robot, and the clamping arm 340 and the driving assembly 360 are different constituent structures of the robot. The clamp arm 340 may function as a clamp, i.e., the clamp arm 340 is used for clamping the workpiece 20 to be processed for fixing. The driving assembly 360 includes a base 350, a first rotating arm 310, a second rotating arm 320, and a third rotating arm 330. The base 350 is substantially a disk-shaped structure, the base 350 is placed on the supporting platform, and the first rotating arm 310, the second rotating arm 320 and the third rotating arm 330 are substantially a long rod-shaped structure. The first rotating arm 310 is rotatably connected with the base 350, a central axis wound when the first rotating arm 310 rotates extends along a vertical direction, the top end of the first rotating arm 310 comprises two first lugs 311 arranged at intervals, a first rotating shaft is further arranged on the first rotating arm 310 and located in an interval space between the two first lugs 311, two ends of the first rotating shaft are rotatably connected with the two first lugs 311, and the central axis of the first rotating shaft extends along a horizontal direction. The second rotating arm 320 is connected to the first rotating shaft, that is, the second rotating arm 320 is connected to the first rotating arm 310 through the first rotating shaft in a rotating manner, at this time, the central axis of the first rotating shaft is the central axis around which the second rotating arm 320 rotates, and since the central axis of the first rotating shaft is perpendicular to the central axis around which the first rotating arm 310 rotates, the central axis around which the second rotating arm 320 rotates is perpendicular to the central axis around which the first rotating arm 310 rotates.
The end of the second rotating arm 320 far from the first rotating arm 310 includes two second lugs 321 arranged at intervals, a second rotating shaft is further arranged on the second rotating arm 320, the second rotating shaft is located in the space between the two second lugs 321, both ends of the second rotating shaft are rotatably connected with the two second lugs 321, the central axis of the second rotating shaft is perpendicular to the central axis of the first rotating shaft, and the third rotating arm 330 is connected with the second rotating shaft, i.e. the third rotating arm 330 is rotatably connected with the second rotating arm 320 through the second rotating shaft. At this time, the central axis of the second rotating shaft is the central axis around which the third rotating arm 330 rotates, so the central axis around which the third rotating arm 330 rotates is perpendicular to the central axis around which the second rotating arm 320 rotates.
The end of the third rotating arm 330 far from the second rotating arm 320 includes two third lugs 331 arranged at intervals, a third rotating shaft is further arranged on the third rotating arm 330, the third rotating shaft is located in the space between the two third lugs 331, two ends of the third rotating shaft are rotatably connected with the two third lugs 331, the central axis of the third rotating shaft is perpendicular to the central axis of the second rotating shaft, the clamping arm 340 is connected with the third rotating shaft, namely, the clamping arm 340 is rotatably connected with the third rotating arm 330 through the third rotating shaft. At this time, the central axis of the third rotating shaft is the central axis around which the holding arm 340 rotates, so the central axis around which the holding arm 340 rotates is perpendicular to the central axis around which the third rotating arm 330 rotates.
With the above arrangement, the degree of freedom of the clamp arm 340 can be improved. When the control mechanism 400 controls the driving assembly 360 to rotate the holding arm 340, the holding arm 340 can be moved to different processing stations, so that the workpiece 20 arrives at different processing stations, and the laser head 120 can process the workpiece 20. For example, when the workpiece 20 moves to one of the processing stations following the holding arm 340, the workpiece 20 forms a first angle with respect to a supporting surface of the supporting platform supporting the base 350, and the laser emitted by the laser head 120 can process one of the processing positions of the workpiece 20. When the workpiece 20 moves to another processing station following the holding arm 340, the workpiece 20 forms a second angle with respect to the supporting surface, and the laser emitted by the laser head 120 can process another processing position of the workpiece 20. And so on.
Therefore, by fixing the workpiece 20 to the clamp arm 340 of the clamp mechanism 300 at all times, when different machining positions of the workpiece 20 are machined, the workpiece 20 does not need to be unloaded and re-clamped, which reduces the number of clamps and the machining cost. The workpiece 20 can be machined at a plurality of machining positions only by clamping once, so that the time for clamping for a plurality of times is saved, and the machining efficiency of the workpiece 20 is improved. And the positioning error generated in the process of multiple clamping is reduced, so that the machining precision of the workpiece 20 is improved.
The laser head 120 of the laser etching apparatus 10 of the first embodiment is fixed on the first beam 112, so that the laser generated by the laser head 120 always emits along a specific direction. Since the clamping arm 340 can drive the workpiece 20 to move to different processing positions, the relative position of the workpiece 20 and the laser is changed, and finally the laser can process different processing positions of the workpiece 20.
When the laser etching device 10 of the first embodiment works, firstly, the workpiece 20 is clamped on the clamping arm 340; then, the image acquirer 220 photographs the workpiece 20 to determine the coordinate position thereof, and the image acquirer 220 transmits the coordinate position to the control mechanism 400; then, the control mechanism 400 controls the clamping arm 340 to drive the workpiece 20 to move to different processing stations corresponding to different coordinate positions, so that the laser emitted by the laser head 120 along a specific direction can smoothly process different processing positions of the workpiece 20.
The laser etching apparatus 10 provided in the first embodiment can form the laser etching process of the first embodiment, which mainly includes the following steps:
in the first step, the workpiece 20 is clamped on the clamping arm 340, so that the positioning and fixing of the workpiece 20 are realized.
In the second step, the coordinate position of the workpiece 20 is captured by the image capturing unit 220 and is transferred to the control mechanism 400.
Thirdly, the control mechanism 400 controls the clamping arm 340 to rotate according to the coordinate position, so that the clamping arm 340 drives the workpiece 20 to switch between different processing stations corresponding to different coordinate positions.
Fourthly, the laser head 120 emits laser along a fixed direction, so that the laser emitted by the laser head 120 accurately falls on different processing positions corresponding to different processing stations on the workpiece 20, and thus, all the processing positions of the workpiece 20 are processed.
The present invention also provides a laser etching apparatus 10 of the second embodiment, and the main differences between the laser etching apparatus 10 provided by the first embodiment and the laser etching apparatus 10 provided by the first embodiment are as follows: the laser head 120 of the engraving mechanism 100 is rotatably disposed on the first beam 112, that is, the laser head 120 can rotate relative to the first beam 112, so that the laser generated by the laser head 120 can be emitted in different directions. Otherwise, reference is made to the description relating to the first embodiment. Of course, the laser head 120 may be rotated manually, or the control mechanism 400 may drive the laser head 120 to rotate automatically. When the workpiece 20 is machined, the control mechanism 400 controls the clamping arm 340 and the laser head 120 to rotate according to the coordinate position signal provided by the image collector 220, namely, the emission direction of the laser and the machining station of the workpiece 20 are changed, so that the position of the laser relative to the workpiece 20 can be quickly adjusted, and the laser emitted by the laser head 120 in different directions can smoothly machine different machining positions of the workpiece 20. According to the requirement of actual conditions, the control mechanism 400 can control the laser head 120 and the clamping arm 340 to rotate simultaneously, and can also control the laser head 120 and the clamping arm 340 to rotate successively, as long as the laser can be accurately positioned at different processing positions of the workpiece 20.
The laser etching apparatus 10 provided in the second embodiment can form a laser etching process of the second embodiment, which mainly includes the following steps:
in the first step, the workpiece 20 is clamped on the clamping arm 340, so that the positioning and fixing of the workpiece 20 are realized.
In the second step, the coordinate position of the workpiece 20 is captured by the image capturing unit 220 and is transferred to the control mechanism 400.
Thirdly, the control mechanism 400 controls the clamping arm 340 to rotate according to the coordinate position, so that the clamping arm 340 drives the workpiece 20 to switch between different processing stations corresponding to different coordinate positions.
Fourthly, the laser head 120 is rotated by the control mechanism 400 to emit laser in different directions, and finally the laser emitted by the laser head 120 is accurately located at different processing positions on the workpiece 20 corresponding to different processing stations, so that all the processing positions of the workpiece 20 are processed. Of course, according to the requirement of actual conditions, the control mechanism 400 can control the laser head 120 and the holding arm 340 to rotate simultaneously, and can also control the laser head 120 and the holding arm 340 to rotate successively, as long as the laser can be accurately located at different processing positions of the workpiece 20.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A laser etching device for processing a workpiece, the laser etching device comprising:
the engraving mechanism comprises a fixed seat and a laser head, and the laser head is arranged on the fixed seat and is used for emitting laser for processing the workpiece;
the camera shooting mechanism comprises a mounting seat and an image collector, the image collector is arranged on the mounting seat and is used for determining the coordinate position of the workpiece,
the clamping mechanism comprises a clamping arm and a driving assembly, and the clamping arm is rotatably connected with the driving assembly and is used for fixing the workpiece; and
and the control mechanism is used for receiving the coordinate position data transmitted by the image collector, and can control the driving assembly to drive the clamping arm to rotate so as to enable the laser of the laser head to irradiate different processing positions on the workpiece.
2. The laser engraving device of claim 1, wherein the laser head is rotatably connected to the holder, and the laser head comprises a continuous laser and a pulse laser.
3. The laser engraving device according to claim 2, wherein the control mechanism controls the laser head to automatically rotate according to coordinate position data transmitted by the image collector.
4. The laser etching device as claimed in claim 1, wherein the fixing base comprises a longitudinal beam and a transverse beam which are connected with each other, an extending direction of the transverse beam and an extending direction of the longitudinal beam form a set included angle, the transverse beam is connected with an end portion or a middle portion of the longitudinal beam, and the laser head is arranged at one end, away from the total amount, of the transverse beam.
5. The laser etching apparatus of claim 1, wherein the image collector comprises a charge-coupled scanning camera.
6. The laser etching apparatus of claim 1, wherein the engraving mechanism and the camera mechanism are located on one side of the control mechanism, and the clamping mechanism is located on the other side of the control mechanism.
7. The laser etching device of claim 1, wherein the control mechanism comprises a host and a display screen, the display screen is disposed on the host, and the camera mechanism and the clamping mechanism are both connected to the host in a wired or wireless manner.
8. The laser etching apparatus according to claim 1, wherein the driving assembly includes a base, a first rotating arm, a second rotating arm, and a third rotating arm, the first rotating arm is rotatably connected to the base, the clamping arm is rotatably connected to the third rotating arm, two ends of the second rotating arm are rotatably connected to ends of the first rotating arm and the third rotating arm, respectively, a central axis around which the first rotating arm rotates is perpendicular to a central axis around which the second rotating arm rotates, a central axis around which the third rotating arm rotates is perpendicular to a central axis around which the second rotating arm rotates, and a central axis around which the clamping arm rotates is perpendicular to a central axis around which the third rotating arm rotates.
9. A laser etching process is used for processing a workpiece and is characterized by comprising the following steps:
clamping the workpiece on a clamping arm;
collecting the coordinate position of the workpiece, and conveying the coordinate position to a control mechanism;
enabling the control mechanism to control the clamping arm to rotate according to the coordinate position so as to enable the clamping arm to be switched among different processing stations; and
and processing the workpieces positioned at different processing stations by adopting laser emitted by a laser head.
10. The laser etching process of claim 9, wherein the control mechanism controls the laser head and the clamping arm to rotate simultaneously or sequentially.
CN202010095583.6A 2020-02-17 2020-02-17 Laser etching device and laser etching process Pending CN111215757A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010095583.6A CN111215757A (en) 2020-02-17 2020-02-17 Laser etching device and laser etching process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010095583.6A CN111215757A (en) 2020-02-17 2020-02-17 Laser etching device and laser etching process

Publications (1)

Publication Number Publication Date
CN111215757A true CN111215757A (en) 2020-06-02

Family

ID=70829710

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010095583.6A Pending CN111215757A (en) 2020-02-17 2020-02-17 Laser etching device and laser etching process

Country Status (1)

Country Link
CN (1) CN111215757A (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105458511A (en) * 2015-12-15 2016-04-06 爱彼思(苏州)自动化科技有限公司 Laser etching machine
CN205309577U (en) * 2016-01-29 2016-06-15 兴科电子科技有限公司 Semi -automatic multi -angle radium carving machine
CN206124463U (en) * 2016-09-22 2017-04-26 东莞市秦泰盛实业有限公司 Manipulator formula laser marking machine
CN107552963A (en) * 2017-08-07 2018-01-09 广东长盈精密技术有限公司 Burr removal device
DE102017123877A1 (en) * 2016-10-14 2018-04-19 Engel Austria Gmbh robot system
CN207267114U (en) * 2017-07-03 2018-04-24 大族激光科技产业集团股份有限公司 A kind of ceramic laser cutting machine
CN108611621A (en) * 2018-03-16 2018-10-02 大族激光科技产业集团股份有限公司 A kind of de-plating marking machine
CN110116271A (en) * 2019-05-13 2019-08-13 大族激光科技产业集团股份有限公司 Laser processing device and method
CN209647864U (en) * 2018-12-26 2019-11-19 广东欧美亚智能装备有限公司 A kind of full-automatic laser marking machine

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105458511A (en) * 2015-12-15 2016-04-06 爱彼思(苏州)自动化科技有限公司 Laser etching machine
CN205309577U (en) * 2016-01-29 2016-06-15 兴科电子科技有限公司 Semi -automatic multi -angle radium carving machine
CN206124463U (en) * 2016-09-22 2017-04-26 东莞市秦泰盛实业有限公司 Manipulator formula laser marking machine
DE102017123877A1 (en) * 2016-10-14 2018-04-19 Engel Austria Gmbh robot system
CN207267114U (en) * 2017-07-03 2018-04-24 大族激光科技产业集团股份有限公司 A kind of ceramic laser cutting machine
CN107552963A (en) * 2017-08-07 2018-01-09 广东长盈精密技术有限公司 Burr removal device
CN108611621A (en) * 2018-03-16 2018-10-02 大族激光科技产业集团股份有限公司 A kind of de-plating marking machine
CN209647864U (en) * 2018-12-26 2019-11-19 广东欧美亚智能装备有限公司 A kind of full-automatic laser marking machine
CN110116271A (en) * 2019-05-13 2019-08-13 大族激光科技产业集团股份有限公司 Laser processing device and method

Similar Documents

Publication Publication Date Title
WO2020233273A1 (en) High-precision automatic welding robot and welding method thereof
CN108406091B (en) Laser processing head and laser processing system with imaging device
JP4748728B2 (en) Apparatus for generating a rotating laser beam
CN110238521B (en) Laser precision welding device and method for collimator grid structure
AU2015365363B2 (en) Machine for laser working of tubes and profiled sections with a scanning system for scanning the tube or profiled section to be worked
JP2003154483A (en) Method of automatically repairing fissuring and device for the same
JP2010264562A (en) Method and system for machining
CN115398688A (en) Apparatus for assembling battery cells or battery modules
KR20190034839A (en) The apparatus of smart laser
JP2012256795A (en) Processing device
JP2000317660A (en) Method and device for removing burr by using laser beam
JP2000114787A (en) Electronic part mounter and mounting method
CN110608872A (en) Optical detection equipment and detection method
CN111215757A (en) Laser etching device and laser etching process
KR101669251B1 (en) The apparatus of smart laser
JP5662223B2 (en) Shape measuring device
CN215588138U (en) Calibration device
JP2008045894A (en) Imaging device and measuring device
CN110333186B (en) Adjusting device, adjusting system, adjusting method and adjusting control device
JP2007268557A (en) Laser beam machine and window cell
CN214518485U (en) Welding device with repeated texture welding workpiece based on 3D vision
JPH0413115B2 (en)
CN114406497B (en) Laser processing system
JP3010769B2 (en) Method and apparatus for assembling optical element module
CN217371236U (en) Automatic change equipment

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20200602