CN111212930A - Support device for supporting a carrier or component in a vacuum chamber, use of a support device for supporting a carrier or component in a vacuum chamber, apparatus for processing a carrier in a vacuum chamber, and vacuum deposition system - Google Patents

Support device for supporting a carrier or component in a vacuum chamber, use of a support device for supporting a carrier or component in a vacuum chamber, apparatus for processing a carrier in a vacuum chamber, and vacuum deposition system Download PDF

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Publication number
CN111212930A
CN111212930A CN201880040345.6A CN201880040345A CN111212930A CN 111212930 A CN111212930 A CN 111212930A CN 201880040345 A CN201880040345 A CN 201880040345A CN 111212930 A CN111212930 A CN 111212930A
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China
Prior art keywords
carrier
vacuum chamber
support
support device
housing
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Pending
Application number
CN201880040345.6A
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Chinese (zh)
Inventor
马蒂亚斯·赫曼尼斯
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J21/00—Chambers provided with manipulation devices
    • B25J21/005—Clean rooms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/023—Cartesian coordinate type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/1005—Programme-controlled manipulators characterised by positioning means for manipulator elements comprising adjusting means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0608—Gripping heads and other end effectors with vacuum or magnetic holding means with magnetic holding means

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  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract

A support device (100) for supporting a carrier or component in a vacuum chamber (101) is described. The support device (100) comprises one or more electrically controllable support elements (111); a housing (112) for at least partially accommodating the one or more electrically controllable support elements (111), the housing having an accommodating portion (113) for the one or more electrically controllable support elements (111); a seal (114) for providing a gas-tight seal between the housing and the one or more electrically controllable support elements (111) arranged in the accommodation (113); and a gas-tight connection (115) for electrical supply lines for the one or more electrically controllable support elements (111). Furthermore, a method of manufacturing a support device, an apparatus for processing a carrier in a vacuum chamber, and a vacuum deposition system are described.

Description

Support device for supporting a carrier or component in a vacuum chamber, use of a support device for supporting a carrier or component in a vacuum chamber, apparatus for processing a carrier in a vacuum chamber, and vacuum deposition system
Technical Field
Embodiments of the present disclosure relate to support devices for supporting a carrier or a part under vacuum, methods of manufacturing the support devices, apparatuses for processing the carrier, and vacuum deposition systems. In particular, several embodiments of the present disclosure relate to support devices and apparatuses configured for supporting, moving, or aligning a carrier in a vacuum chamber. Furthermore, embodiments of the present disclosure relate in particular to vacuum deposition systems for depositing material on a substrate carried by a carrier, wherein the substrate is aligned with respect to a mask prior to deposition. Several embodiments of the support device, the apparatus for processing the carrier, and the vacuum deposition system are particularly configured to be used under vacuum conditions, such as for manufacturing organic light-emitting diode (OLED) devices.
Background
Several techniques for depositing layers on a substrate include thermal evaporation, Physical Vapor Deposition (PVD), and Chemical Vapor Deposition (CVD). The coated substrate can be used in several applications and in several technical fields. For example, the coated substrate may be used in the field of Organic Light Emitting Diode (OLED) devices. OLEDs may be used to manufacture television screens, computer screens, mobile phones, other handheld devices, and the like, for example, to display information. OLED devices, such as OLED displays, may include one or more layers of organic material. The one or more layers of organic material are located between two electrodes deposited on the substrate.
During deposition of the coating material on the substrate, the substrate may be supported by a substrate carrier, and the mask may be supported in front of the substrate by a mask carrier. The material pattern corresponding to the opening pattern of the mask may for example be deposited on the substrate by evaporation of the material. The material pattern is exemplified by a plurality of pixels.
The function of an OLED device generally depends on the accuracy of the coating pattern and the thickness of the organic material, which should be in a predetermined range. In order to achieve high resolution OLED devices, the technical challenges related to the deposition of evaporated materials must be mastered. In particular, it is challenging to accurately and smoothly transfer a substrate carrier carrying a substrate and/or a mask carrier carrying a mask through a vacuum chamber. Further, for example for the manufacture of high resolution OLED devices, accurate processing of the substrate carrier relative to the mask carrier under vacuum conditions is critical to achieve high quality deposition results.
Accordingly, there is a continuing need for improved support devices for supporting a carrier or part under vacuum conditions, improved methods of making support devices suitable for use in vacuum, improved apparatus for processing a carrier in a vacuum environment, and improved vacuum deposition systems.
Disclosure of Invention
In view of the above, a support device for supporting a carrier or a component in a vacuum chamber and a method of manufacturing a support device for supporting a carrier in a vacuum chamber are proposed according to the independent claims. Furthermore, an apparatus for processing a carrier in a vacuum chamber is proposed, which apparatus comprises a support device according to several embodiments described herein. Furthermore, a vacuum deposition system is proposed, which comprises an apparatus for processing a carrier according to several embodiments described herein. Other aspects, advantages and features are apparent from the dependent claims, the description and the drawings.
According to an aspect of the present disclosure, a support device to support a carrier or a component in a vacuum chamber is presented. The support device comprises one or more electrically controllable support elements; and a housing for at least partially housing the one or more electrically controllable support elements. The housing has a receptacle for the one or more electrically controllable support elements. Furthermore, the support device comprises a seal for providing a gas-tight seal between the housing and the one or more electrically controllable support elements arranged in the receptacle. Furthermore, the support device comprises an airtight connection for electrical supply lines for the one or more electrically controllable support elements.
According to other aspects of the present disclosure, use of a support apparatus according to any of the other embodiments described herein to support a carrier or a component in a vacuum processing system is proposed.
According to another aspect of the present disclosure, a method of manufacturing a support device for supporting a carrier in a vacuum chamber is presented. The method includes providing a housing for at least partially housing one or more electrically controllable support elements; providing a housing having a receptacle for the one or more electrically controllable support elements; providing a housing having an airtight connection for electrical supply lines of the one or more electrically controllable support elements; placing the one or more electrically controllable support elements into the receptacle; and providing a hermetic seal between the housing and the one or more electrically controllable support elements disposed in the receptacle.
According to other aspects of the present disclosure, an apparatus to process a carrier in a vacuum chamber is presented. The apparatus includes a vacuum chamber having a wall with an opening. Further, the apparatus includes a first drive unit disposed outside of the vacuum chamber and configured to move a first driven member extending through the opening into the vacuum chamber. Furthermore, the apparatus comprises a first support device attached to a first driven member in the vacuum chamber, the first driven member providing a first supply channel for supplying power and/or control signals to the first support device. The first support means is a support means according to any embodiment described herein.
According to yet other aspects of the present disclosure, a vacuum deposition system is presented. The vacuum deposition system comprises an apparatus according to any embodiment described herein for processing a carrier in a vacuum chamber. Furthermore, the vacuum deposition system includes a deposition source disposed in a deposition region in the vacuum chamber. The first support device of the apparatus for processing a carrier in a vacuum chamber is configured for supporting or moving the carrier in a deposition area.
Several embodiments also relate to apparatus for performing the disclosed methods and include apparatus components for performing the described method aspects. Such method aspects may be performed by hardware components, a computer programmed by suitable software, any combination of the two, or in any other manner. Furthermore, several embodiments according to the present disclosure also relate to methods for operating the apparatus. Such methods to operate the apparatus include method aspects to perform the functions of the apparatus.
Drawings
So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description, briefly summarized above, may be had by reference to several embodiments. The accompanying drawings are directed to several embodiments of the disclosure and are described below:
FIG. 1 depicts a schematic perspective view of a support device according to several embodiments described herein;
FIG. 2 depicts a schematic side view of a support device according to several embodiments described herein;
FIG. 3 depicts a schematic perspective view of a support device according to other embodiments described herein;
FIG. 4 depicts a schematic cross-sectional view of an apparatus for processing a carrier according to several embodiments described herein;
FIG. 5 shows a schematic cross-sectional view of an apparatus for processing a carrier according to other embodiments described herein;
FIG. 6 depicts a schematic cross-sectional view of a vacuum deposition system including an apparatus for processing a carrier in a first position, according to several embodiments described herein;
FIG. 7A is a schematic view of the apparatus for processing a carrier of FIG. 6 in a second position;
FIG. 7B shows a schematic view of the apparatus for processing carriers of FIG. 6 in a third position;
FIG. 8 shows a schematic cross-sectional view of an apparatus for processing a carrier according to several embodiments described herein;
FIG. 9 illustrates a cross-sectional view of the apparatus for processing a carrier of FIG. 8;
FIG. 10 illustrates a perspective view of the apparatus for processing a carrier of FIG. 8; and
FIG. 11 depicts a flow diagram of a method of manufacturing a support device for supporting a carrier in a vacuum chamber according to several embodiments described herein.
Detailed Description
Reference will now be made in detail to several embodiments of the disclosure, one or more examples of which are illustrated in the drawings. In the description below of the figures, like reference numerals refer to like parts. Only the differences with respect to the individual embodiments are described. Each example is provided by way of illustration of the present disclosure and is not meant as a limitation of the present disclosure. Furthermore, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the present description include such modifications and variations.
Referring exemplarily to fig. 1 to 3, a support device 100 for supporting a carrier or a component in a vacuum chamber according to the present disclosure is illustrated. According to several embodiments, which can be combined with any of the other embodiments described herein, the support device 100 comprises one or more electrically controllable support elements 111. In addition, the support device 100 comprises a housing 112 for at least partially accommodating the one or more electrically controllable support elements 111. The housing has a receptacle 113, the receptacle 113 being used for the one or more electrically controllable support elements 111. Furthermore, the support device 100 comprises a sealing member 114 for providing a gas tight seal between the housing and the one or more electrically controllable support elements 111 arranged in the accommodation 113. Furthermore, the support device 100 comprises an airtight connection 115, the airtight connection 115 being used for the electrical supply line 125, the electrical supply line 125 being used for the one or more electrically controllable support elements 111. The electrical supply line 125 may be configured for supplying power and/or control signals to the one or more electrically controllable support elements 111. Furthermore, the electrical supply line may be configured as a sensor cable.
Thus, several embodiments of the support apparatus described herein are improved over conventional support apparatus, particularly when used in a vacuum environment. In particular, several embodiments of the support device described herein have the advantage that non-vacuum compatible electrically controllable support elements (electro-permanent magnets (EPM) and/or actuators for carrier alignment) can be applied in the support device.
Before explaining several other embodiments of the disclosure in more detail, some aspects are explained with respect to some names used herein.
In the present disclosure, "a support device for supporting a carrier" may be understood as a device configured to support a carrier, such as a substrate carrier or a mask carrier, used during processing of a substrate. "support means to support the component" is understood to mean a means configured for supporting the component used during the vacuum treatment, the component being exemplified by a component of a mask or a carrier. Generally, the support device is configured for use in a vacuum environment, such as in a vacuum chamber of a vacuum processing system, in particular a vacuum deposition system.
In the present disclosure, a "vacuum chamber" may be understood as a chamber configured for providing vacuum conditions inside the chamber. The designation "vacuum" is understood to mean a technical vacuum having a vacuum pressure of less than, for example, 10 mbar. Generally, the pressure in the vacuum chamber as described herein may be 10-5mbar and about 10-8mbar, especially 10-5mbar and 10- 7Between mbar, and even more particularly about 10-6mbar and about 10-7mbar.
According to some embodiments, the pressure in the vacuum chamber may be considered as the partial or total pressure of evaporated material in the vacuum chamber (which may be about the same when only evaporated material is present in the vacuum chamber as the component to be deposited). In some embodiments, the total pressure in the vacuum chamber may be from about 10-4mbar to about 10-7mbar, especially in case a second component other than the evaporated material is present in the vacuum chamber (e.g. a gas or the like). Thus, the vacuum chamber may be a "vacuum deposition chamber," that is, a vacuum chamber configured for vacuum deposition.
In the present disclosure, the "carrier" that may be supported by the support device may be a substrate carrier or a mask carrier. By "substrate carrier" is understood a carrier configured for carrying substrates in a vacuum chamber, in particular a carrier carrying large area substrates. A "mask carrier" is understood to be a carrier configured for carrying a mask, such as an edge exclusion mask or a shadow mask, in a vacuum chamber.
In the present disclosure, the term "substrate" may particularly comprise a substantially non-flexible substrate, such as a wafer, a transparent crystal plate, such as sapphire or the like, or a glass plate. However, the present disclosure is not so limited, and the name "substrate" may also include flexible substrates, such as a web or foil. The designation "substantially inflexible" is understood to distinguish it from "flexible". In particular, the substantially inflexible substrate may have a certain degree of flexibility, for example a glass plate having a thickness of 0.9mm or less, for example a glass plate having a thickness of 0.5mm or less, wherein the flexibility of the substantially inflexible substrate is less than the flexibility of the flexible substrate.
According to several embodiments described herein, the substrate may be made of any material suitable for material deposition. For example, the substrate may be made of a material selected from the group consisting of glass (e.g., soda-lime glass, borosilicate glass, etc.), metal, polymer, ceramic, compound material, carbon fiber material, or any other material or combination of materials that can be coated by a deposition process.
In the present disclosure, the term "large area substrate" is meant to have a thickness of 0.5m2Or larger area of the main surface, especially 1m2Or a larger area of the major surface. In some embodiments, the large area substrate may be a generation 4.5, generation 5, generation 7.5, generation 8.5, or even generation 10. Generation 4.5 corresponds to about 0.67m2Substrate (0.73m x0.92m), generation 5 corresponds to about 1.4m2Substrate (1.1m x 1.3.3 m), generation 7.5 corresponds to about 4.29m2Substrate (1.95m x 2.2.2 m), generation 8.5 corresponds to about 5.7m2Substrate (2.2m x 2.5.5 m), generation 10 corresponds to about 8.7m2The substrate (2.85 m.times.3.05 m). Even higher generations, such as 11 th and 12 th generations, and corresponding substrate areas may be applied in a similar manner. Half the size of these generations may also be provided in OLED display manufacturing. Furthermore, the substrate thickness may be from 0.1 to 1.8mm, in particular about 0.9mm or less, for example 0.7mm or 0.5 mm.
In the present disclosure, "one or more electrically controllable support elements" may be understood as one or more elements configured for providing a supporting force for supporting the carrier. A supporting force is understood to be a force acting on the carrier described herein, in particular an attractive magnetic force acting on the carrier described herein. Furthermore, some or all of the one or more electrically controllable support elements may additionally or alternatively be configured to move the carrier as described herein, in particular to perform alignment of the carrier. That is, support elements configured to move the carrier may be used to align the carrier. The term "electrically controllable" is understood to mean that the support element is controllable, for example activated or deactivated, by the use of electrical power or an electrical control signal. For example, one or more of the one or more electrically controllable support elements may be magnetic mounts configured to support a carrier, particularly magnetic mounts having EPMs. According to another example, one or more of the one or more electrically controllable support elements may be an alignment device, in particular a piezo-electric actuator, configured to move the carrier in at least one alignment direction.
In the present disclosure, "a housing for at least partially accommodating the one or more electrically controllable support elements" may be understood as a housing configured such that, in an assembled state of the support device, a first portion of the one or more electrically controllable support elements is partially arranged inside the housing and a second portion of the one or more electrically controllable support elements extends away from the housing, for example through a receptacle or opening provided in the housing.
In the present disclosure, "a receptacle for the one or more electrically controllable support elements" may be understood as an opening provided in the housing, wherein the opening is sized and configured for receiving the one or more electrically controllable support elements.
In the present disclosure, "a seal for providing a gas-tight seal" may be understood as one or more sealing elements arranged between the housing and the one or more electrically controllable support elements, wherein the interface between the housing and the one or more electrically controllable support elements, and the interface between the one or more sealing elements and the one or more electrically controllable support elements are sealed in a gas-tight manner.
In the present disclosure, "gas-tight connection for an electrical supply line" is understood to mean a part or element of a support device, configured such that the electrical supply line can be connected to the support device in a gas-tight manner. Herein, the designation "airtight" and the designation "vacuum tight" may be used interchangeably.
Referring to fig. 2 for example, according to some embodiments, which can be combined with other embodiments described herein, the one or more electrically controllable support elements 111 are arranged in the accommodating portion 113 such that the first side 111A of the one or more electrically controllable support elements 111 faces the inner space 116 of the housing. As exemplarily shown in fig. 2, the second side 111B of the one or more electrically controllable support elements 111 faces the outer space 112E of the housing 112. Generally, the interior space 116 is a hermetically sealed space. Thus, when the support device is used in a vacuum environment, the atmosphere in the interior space 116 of the housing 112 may advantageously be maintained, i.e. the atmosphere in the interior space 116 of the housing 112 has a pressure of about 1 bar. As exemplarily shown in fig. 2, a portion of the one or more electrically controllable support elements 111 generally extends away from the housing 112. In particular, the second side 111B of the one or more electrically controllable support elements 111 comprises one or more poles (active poles) of an electropermanent magnet (EPM), such as the active poles of Roy Alloy (die steel). In the exemplary embodiment illustrated in fig. 1, 2 and 3, two electrically controllable support elements 111 configured as EPMs are illustrated.
Referring exemplarily to fig. 1 and 3, according to some embodiments, which can be combined with other embodiments described herein, the seal 114 comprises a flap member 117. The sheet element 117 has one or more receiving openings 118 for the one or more electrically controllable support elements 111. Generally, the sheet element is made of a non-ferromagnetic metal, in particular stainless steel. The sheet element 117 may have a thickness T of 0.5mm T4 mm, particularly 0.8mm T3 mm, more particularly 1mm T2.5 mm. For example, the thickness T of the sheet element 117 may be T ═ 1mm ± 0.05mm or T ═ 2mm ± 0.05. In general, the planarity P of the sheet element 117 is P.ltoreq.100. mu.m, in particular P.ltoreq.50 μm.
According to some embodiments, which may be combined with other embodiments described herein, the receiving portion 113 of the housing is prepared for welding the tab member to a side edge of the receiving portion 113, in particular the side edge of the receiving portion 113 is prepared for welding the tab member to a side edge of the receiving portion 113, in particular laser welding. Thus, the flap member 117 may be connected to the housing by a gas-tight connection. For example, the gas-tight connection may be a welded joint, in particular a laser welded joint. Generally, in the assembled state, the outer surface of the flap member is coplanar with the outer surface of the housing.
Referring exemplarily to fig. 3, according to some embodiments, which may be combined with other embodiments described herein, the hole 118B may be provided in an outer surface of the one or more electrically controllable support elements 111, in particular in an outer surface of the one or more active poles of the one or more electrically controllable support elements 111 configured as an electropermanent magnet. The side edges of the hole 118B may be prepared for welding, in particular laser welding, of other sheet elements 117F to the side inner edges of the hole 118B. This other sheet member 117F may be a separate sheet member or part of sheet member 117. Thus, the thickness and/or planarity and/or material of this other sheet element 117F may correspond to the thickness and/or planarity and/or material of the sheet element 117.
According to some embodiments, which can be combined with other embodiments described herein, the one or more electrically controllable elements comprise at least one element selected from the group consisting of a magnetic mount configured to support a carrier and an alignment device. For example, the magnetic fixture may comprise an electropermanent magnet. Generally, the alignment device is configured to move the carrier in at least one alignment direction. For example, the alignment device may be a piezoelectric actuator.
Referring to fig. 2 for example, according to some embodiments, which may be combined with other embodiments described herein, a connection pin 111C or a connection bolt may be provided at the housing 112 for connecting the supporting device to the driven part. This driven part is exemplified by the first driven part 143 or the second driven part 146 of the apparatus for processing a carrier in a vacuum chamber, which is exemplarily described with reference to fig. 4 and 5. Referring exemplarily to fig. 3, according to some embodiments, which may be combined with other embodiments described herein, the housing 112 of the support device 100 may additionally or alternatively further comprise a vacuum compatible connection 119 for connecting the support device to a driven part of an apparatus for processing a carrier in a vacuum chamber.
In view of the above, it will be appreciated that the support device according to several embodiments described herein is particularly well suited for use in a vacuum environment. Thus, the use of a support arrangement to support a carrier in a vacuum processing system according to any of the embodiments described herein may advantageously be provided.
Referring exemplarily to fig. 4, an apparatus 200 for processing a carrier in a vacuum chamber 101 according to the present disclosure is illustrated. According to several embodiments, which can be combined with other embodiments described herein, the apparatus 200 comprises a vacuum chamber 101, the vacuum chamber 101 having a wall 102, the wall 102 having an opening 106. The vacuum chamber 101 is adapted to maintain a vacuum in the volume of the vacuum chamber. The atmospheric environment 180 is exemplified by an atmospheric environment having an atmospheric pressure of about 1bar, and may surround the vacuum chamber 101.
Further, the apparatus 200 comprises a first drive unit 142 arranged outside the vacuum chamber 101. For example, the first driving unit 142 may include a linear actuator. The first driving unit 142 is configured to move the first driven member 143. For example, the linear movement may be transmitted to the first driven part 143 through the first driving unit 142. The first driving unit 142 may be a linear Z actuator configured to move the first driven part 143 in the second direction Z. The first driven member 143 extends through the opening 106 into the vacuum chamber 101. That is, the first driven member 143 passes through the wall 102 of the vacuum chamber 101 from the outside of the vacuum chamber, for example, from the atmosphere. Thus, the first driven member 143 extending through the wall 102 is driven from outside the vacuum chamber 101 by the first driving unit 142. By driving the first driven member 143 from the outside of the vacuum chamber 101, maintenance and handling of the driving unit can be facilitated and flexibility of the apparatus can be increased.
As exemplarily shown in fig. 4, the opening 106 may be sealed with a flexible element 107, in particular with an axially steerable element, for example a vacuum bellows (bellow), while providing an axial movement of the first driven part 143. In particular, a portion of the first driven member 143 may be connected to the wall 102 of the vacuum chamber via a flexible element such that an opening in the wall 102 through which the first driven member 143 extends is sealed in a vacuum tight manner.
When the first driving unit 142 to drive the first driven member 143 may be disposed outside the vacuum chamber, that is, in the atmospheric environment 180 at atmospheric pressure, a non-vacuum compatible driving unit may be used. Non-vacuum compatible drive units are generally more cost effective and easier to operate than vacuum compatible drive units. Furthermore, any form of first driving unit 142 may be provided, including, for example, an electric motor or a stepper motor. The generation of particles inside the vacuum chamber by the drive unit, which may comprise mechanical bearings, is avoided. Therefore, maintenance of the drive unit can be advantageously facilitated.
Further, the apparatus 200 includes a first supporting device 100A, the first supporting device 100A being attached to the first driven part 143 in the vacuum chamber 101, particularly, to an end of the first driven part 143. Thus, the first support device 100A is arranged in the inner volume of the vacuum chamber 101, i.e. in a vacuum environment of the vacuum chamber volume. For example, the first supporting device 100A may be attached to the first driven part 143 by one or more connecting elements. In some embodiments, the first supporting device 100A is directly attached to the first driven part 143. Generally, the first support device 100A is a support device 100 according to any of the embodiments described herein, for example as described with reference to fig. 1-3.
Thus, it will be understood that the first support apparatus 100A is configured to support or move the carrier 30. For example, the first support device 100A may support the carrier 30 during deposition of the coating material on the substrate 11. In some embodiments, the first support apparatus 100A may be configured to support a mask carrier configured to carry a mask. In another example, the first supporting device 100A can move the carrier in at least one direction, in particular in at least one alignment direction. The at least one alignment direction may be a direction used to align the carrier prior to the deposition process.
When the first supporting device 100A is attached to the first driven part 143, the first supporting device 100A may move together with the first driven part 143 by the first driving unit 142. When the first supporting device 100A to support or move the carrier 30 is moved by the driving unit provided outside the vacuum chamber 101, maintenance or service of the respective components easily accessible from the outside can be facilitated.
As exemplarily shown in fig. 4, the first driven part 143 provides a first supply channel 147 for providing power and/or control signals to the first supporting apparatus 100A. In particular, the first supply passage 147 may be disposed in an interior volume of the first driven member 143. Accordingly, the first supply passage 147 may be formed through the inner volume of the first driven part 143. For example, the first supply passage 147 may extend from a first end of the first driven member 143 to a second end of the first driven member 143. The second end of the first driven member 143 may be opposite the first end. Generally, one or more cables may extend from outside of the vacuum chamber through the first supply channel 147 to the first support device 100A, such that the first support device 100A may be connected to a power source and/or controller disposed outside of the vacuum chamber.
Thus, the first support device 100A is advantageously movable in the second direction Z by the first drive unit 142, and power and/or signals may be provided to the first support device 100A. For example, the first support device 100A may comprise an alignment device and/or a magnetic clamp (e.g., an electropermanent magnet) to which power may be provided from outside the vacuum chamber via the first driven member 143.
In the case of having the first supply passage 147 provided by the first driven member 143, the first support device 100A disposed inside the vacuum chamber can be fed from outside the vacuum chamber. When the first supporting device 100A is attached to the first driven part 143, the first supporting device 100A may also move together with the first driven part 143 through the first driving unit 142. Thus, the first driven member 143 may be used to feed and move the first supporting device 100A. Thus, feeding a separate cable in the vacuum chamber wall to supply the first support device 100A may be omitted. This can reduce the cost of equipment used to process the carrier.
According to some embodiments, which can be combined with several of the embodiments described herein, the first driven member comprises a hollow shaft configured to supply at least one of a power cable, a signal cable, and a sensor cable from outside the vacuum chamber to the first support device 100A. For illustrative purposes, fig. 4 depicts cable 161, and cable 161 may be at least one of a power cable and a signal cable. For example, the cable 161 may be connected to the first support device 100A via the airtight connection 115 described herein, for example, the airtight connection 115 may be configured as a connection socket. For example, the airtight connection may be provided to the housing 112 of the first support device 100A. In some embodiments, the airtight connection socket may be disposed inside the housing of the first support device 100A. As shown in fig. 4, the cable 161 may extend into the interior volume of the first support device 100A.
According to the present disclosure, a "process carrier" may be exemplified as comprising several operations, such as moving the carrier, supporting the carrier, or aligning the carrier. In several embodiments of the present disclosure, the carrier described herein may be a substrate carrier configured to carry a substrate, or may be a mask carrier configured to carry a mask or a shield. Fig. 4 schematically shows a carrier 30 as a substrate carrier for carrying the substrate 11.
Generally, the carrier described herein may be a substrate carrier or a mask carrier. Hereinafter, the term "first carrier" especially means that the carrier is a substrate carrier, configured to carry a substrate. The designation "second carrier" means in particular that the carrier is a mask carrier, configured to carry a mask. It will be understood that the first carrier may alternatively be a mask carrier, configured to carry a mask or shield.
Generally, the carrier may be movable along the transport path by a carrier transport system. In some embodiments, the carrier may be supported contactlessly during transport, such as by a magnetic levitation system. In particular, the carrier transport system may be a magnetic levitation system configured to contactlessly transport the carrier along the transport path in the vacuum chamber. The carrier transport system may be configured to transport a carrier into a deposition area of the vacuum chamber, the alignment system and the deposition source being disposed in the deposition area.
"substrate carrier" relates to a carrier device configured to carry a substrate 11 in a vacuum chamber 101. For example, the substrate carrier may be configured to carry a substrate along a first transport path in a first direction. The substrate carrier may support the substrate 11 during deposition of the coating material on the substrate 11. In some embodiments, the substrate 11 may be supported on the substrate carrier in a non-horizontal orientation, particularly in an essentially vertical orientation, for example, while the carrier is moved, transported along a transport path, aligned, and/or during a deposition process. In the embodiment shown in fig. 4, the substrate 11 is supported in a substantially vertical orientation on a carrier 30. For example, the angle between the substrate surface and the gravity vector may be less than 10 degrees, in particular less than 5 degrees.
For example, the substrate 11 may be supported on a support surface of a carrier during transport through the vacuum chamber 101. The carrier may include a carrier body having a support surface. The support surface is configured to support the substrate 11, particularly to support the substrate 11 in a non-horizontal orientation, and more particularly to support the substrate 11 in an essentially vertical orientation. In particular, the substrate 11 may be supported on a carrier by a clamping device, such as an electrostatic chuck (ESC) or by a magnetic clamp. The holding device may be integrated in the carrier, for example in an atmospheric housing provided in the carrier.
As used herein, "mask carrier" relates to a carrier device configured to carry a mask for transport along a mask transport path in a vacuum chamber. The mask carrier may carry the mask during transport, during alignment, and/or during deposition through the mask onto the substrate. In some embodiments, the mask may support the mask carrier in a non-horizontal orientation, particularly in an essentially vertical orientation, during transfer and/or alignment. The mask may be supported on the mask carrier by a clamping device, such as a mechanical clamp, e.g. a clamp, an electrostatic chuck or a magnetic clamp. Other forms of clamping means may be used which may be connected to the mask carrier or integrated in the mask carrier.
For example, the mask may be an edge exclusion mask or a shadow mask. The edge exclusion mask is a mask configured for masking one or more edge regions of the substrate such that no material is deposited on such one or more edge regions during coating of the substrate. A shadow mask is a mask configured for masking a plurality of features to be deposited on a substrate. For example, the shadow mask can include a plurality of small openings, such as an opening pattern having 10,000 or more openings, particularly an opening pattern having 1,000,000 or more openings.
As used herein, "essentially vertically oriented" is understood to mean an orientation having a deviation of 10 degrees or less, in particular a deviation of 5 degrees or less, from a vertical orientation. From a vertical orientation, i.e. from the gravity vector. For example, the angle between the major surface of the substrate (or mask) and the gravity vector may be between +10 degrees and-10 degrees, particularly between 0 degrees and-5 degrees. In some embodiments, the orientation of the substrate (or mask) may not be exactly vertical during transport and/or during deposition, but is slightly tilted with respect to the vertical axis, for example by a tilt angle between 0 degrees and-5 degrees, in particular a tilt angle between-1 degree and-5 degrees.
Negative angle means the orientation of the substrate (or mask) in which the substrate (or mask) is tilted downward. Deviations in substrate orientation from the gravity vector during deposition may be advantageous and may result in a more stable deposition process, or a face-down deposition process may be suitable for reducing particles on the substrate during deposition. However, an exact vertical orientation (+/-1 degree) is also possible during transport and/or during deposition. In other embodiments, the substrate and mask may be transferred in a non-vertical orientation, and/or the substrate may be coated in a non-vertical orientation, such as in a substantially horizontal orientation.
According to some embodiments, which can be combined with other embodiments described herein, the first supply channel 147 provides a fluid connection between the inner volume of the first support device 100A and the atmosphere 180 outside the vacuum chamber. For example, a fluid connection may be provided between the interior volume of the housing 112 of the first support device 100A and the atmospheric environment.
When the internal volume of the first support apparatus 100A is suitable for operation in an atmospheric environment, the first support apparatus 100A may be fed via the first supply channel 147. For example, an electronic device or electromagnetic unit may not be suitable for operating under vacuum conditions. In this case, the electromagnetic unit would be disposed in the atmospheric housing of the first support device 100A inside the vacuum chamber to operate properly, particularly in a vacuum tight housing. Accordingly, an atmospheric environment may be provided inside the first supporting device 100A through the first supply passage 147. In this case, a non-vacuum compatible device, such as a non-vacuum compatible electrical cable, may be provided to the first support apparatus 100A. Thus, acquisition costs and/or maintenance costs may advantageously be reduced. Furthermore, particle generation in the vacuum chamber may be reduced because the electrical cables, such as cable 161, are not exposed to the vacuum environment inside the vacuum chamber 101. Further, for example, when the electronic device arranged in the first support device 100A is not vacuum compatible, contamination of the vacuum environment in the vacuum chamber may be reduced or avoided by feeding the first support device 100A through the first supply channel.
With exemplary reference to fig. 1, it will be appreciated that a flexible element, in particular an axially expandable element, through which the first driven member 143 passes through the opening 106 of the wall 102 may be provided in a vacuum tight manner to the opening 106 of the wall 102. The longitudinal axis of the axially expandable element may extend in the second direction Z. For example, an axially expandable element, such as a bellows element, may connect a portion of the first driven member to the wall 102 such that an opening in the wall 102 through which the first driven member 143 extends is closed in a vacuum tight manner.
In several embodiments of the present disclosure, which can be combined with several embodiments described herein, the first driving unit can move the first driven member in the second direction Z. The second direction may be substantially perpendicular to a wall of the vacuum chamber, such as a sidewall, and/or may be substantially perpendicular to a transport path of the carrier transport system.
According to some embodiments, which can be combined with several embodiments described herein, the first support device 100A can comprise a fixture, in particular a magnetic fixture configured to support a carrier. The magnetic fixing member supports the carrier by applying an attractive magnetic force to the carrier. For example, the magnetic fixture may be an electropermanent magnet. The cable 161 may be a power cable and/or a signal cable and/or a sensor cable. The power cable supplies power to the electromagnet of the mount. The signal cable is configured to control the magnetic mount. The electromagnet may be disposed at atmospheric pressure inside the housing of the first support device 100A.
According to some embodiments, which can be combined with several embodiments described herein, the first support device 100A comprises an alignment device. In particular, the alignment device may comprise a piezoelectric actuator configured to move the carrier in at least one alignment direction. In some embodiments, the piezoelectric actuator may be further configured to move the carrier in a second alignment direction transverse to the first alignment direction and/or a third alignment direction transverse to the first and second alignment directions.
The name "aligned" means that the positioning of the carrier is exactly in a predetermined position in the vacuum chamber, in particular at a predetermined position relative to the second carrier. The carrier may be aligned in at least one alignment direction, in particular in two or three alignment directions which may be essentially perpendicular to each other.
Referring exemplarily to fig. 5, according to some embodiments, which can be combined with several embodiments described herein, an apparatus 200 for processing a carrier in a vacuum chamber 101 can include a second driving unit 145, the second driving unit 145 being arranged outside the vacuum chamber. The second driving unit 145 may be configured to move the second driven member 146. The second driven member 146 extends through the other opening 106B into the vacuum chamber. The apparatus 200 may further comprise a second supporting device 100B for supporting or moving the carrier. Generally, the second support apparatus 100B is affixed to the second driven member 146 in the vacuum chamber. In particular, the second driven member 146 may provide a second supply channel 149 for supplying the second support device 100B.
As exemplarily depicted in fig. 5, according to some embodiments, which can be combined with other embodiments described herein, the apparatus 200 comprises a first supporting device 100A for supporting or moving the first carrier 10 and a second supporting device 100B for supporting or moving the second carrier 20. The first supporting device 100A is configured to support or move the first carrier 10. The second support means are configured for supporting or moving the second carrier 20.
As can be seen from a comparison of fig. 5 and 4, the apparatus shown in fig. 5 includes features and elements similar to those of the apparatus shown in fig. 4, such that references to similar features and elements are made to the above description without repetition.
Hereinafter, the assembly including the first driving unit 142 and the first driven member 143 is sometimes referred to as a "first transfer device". Similarly, the assembly comprising the second driving unit 145 and the second driven member 146 is sometimes referred to as a "second transfer device". A system configured to align the first carrier 10 is sometimes referred to hereinafter as an "alignment system", in particular a system configured to align the first carrier 10 relative to the second carrier 20 is sometimes referred to hereinafter as an "alignment system". The alignment system 130 includes a first driving unit 142 and a first driven member 143, wherein a first supporting device 100A for supporting or moving the first carrier is disposed on the first driven member 143. The alignment system 130 may further include a second driving unit 145 and a second driven member 146, and a second supporting device 100B disposed on the second driven member 146 for supporting or moving the second carrier.
In fig. 5, the second supporting device 100B is attached to the second driven part 146. Similar to the first driven part 143, the second driven part 146 may provide a supply channel, i.e., a second supply channel 149 as shown in fig. 5, for supplying the second supporting device 100B, particularly at least one of power and a signal to the second supporting device 100B.
In some embodiments, the second driven member 146 is configured to feed a supply element, e.g. a cable, to a support device arranged inside the vacuum chamber, e.g. to an end of the second driven member 146 provided inside the vacuum chamber. For example, power may be supplied from the outside of the vacuum chamber to the second supporting device 100B to support and move the second carrier 20 via the second driven member 146.
In several embodiments, the second driven member 146 comprises a hollow shaft configured to feed at least one of a power cable, a signal cable, and a sensor cable from outside the vacuum chamber 101 to the second supporting device 100B.
According to some embodiments of the present disclosure, which can be combined with several embodiments described herein, apparatus 200 can include a vacuum feedthrough 170 positioned in first supply channel 147. The vacuum feedthrough 170 may be configured to separate a vacuum environment in the interior volume of the first support apparatus 100A from an atmospheric environment 180 outside of the vacuum chamber 101.
According to some embodiments of the present disclosure, which can be combined with several embodiments described herein, the inner volume of the first support means can be configured for a vacuum environment and the vacuum feedthrough is disposed in the first supply channel. The interior volume of the second support means is additionally or alternatively configured for an atmospheric environment, and the second supply channel provides a fluid connection between the interior volume of the second support means and the atmospheric environment outside the vacuum chamber.
According to some embodiments, which can be combined with several embodiments described herein, the first support device 100A can be an alignment device configured to move the first carrier in at least one alignment direction, and the second support device 100B can be a magnetic fixture configured to support the second carrier adjacent to the first carrier. In particular, the first support device 100A may comprise one or more piezoelectric actuators for aligning the first carrier 10 in one or more alignment directions, and the second support device 100B may comprise mounts, in particular magnetic mounts, configured for supporting the second carrier 20 on the second support device 100B. The one or more piezoelectric actuators may be provided with one or more cables extending through the first supply channel 147, and the magnetic mount for supporting the second carrier may be provided with one or more cables extending through the second supply channel 149.
According to some embodiments, which can be combined with several embodiments described herein, the apparatus 200 can further include a third supporting device 100C for supporting or moving the carrier. In fig. 5, the third supporting device 100C is configured to support the first carrier 10 on the first supporting device 100A. In particular, the third supporting device 100C may be a magnetic fixing member configured to support the first carrier 10 on the first supporting device 100A including the alignment device. In particular, the first support device 100A may be an alignment device configured to align the first carrier 10, and the third support device 100C may be configured to support the first carrier 10 on the alignment device.
As exemplarily shown in fig. 5, the apparatus 200 may comprise a cable feedthrough 109 located in the wall 102 of the vacuum chamber 101 for supplying the third support device 100C. The first driven member 143 and the second driven member 146 may extend through the same opening provided in the side wall of the vacuum chamber. This opening may be vacuum sealed by a flexible element, in particular a bellows element.
Fig. 6 illustrates a schematic cross-sectional view of a vacuum deposition system 300 according to several embodiments described herein. The vacuum deposition system comprises an apparatus 200 according to several embodiments described herein, the apparatus 200 being used to process a carrier in a vacuum chamber 101.
As can be seen from a comparison of fig. 6 with fig. 4 and 5, the apparatus shown in fig. 6 includes similar features and elements of the apparatus described with reference to fig. 4 and 5, such that references to similar features and elements can be made to the above description without repetition and with only differences being described below.
In fig. 6, the first supporting device 100A is an alignment device, in particular an alignment device comprising at least one piezoelectric actuator. The second supporting device 100B is a magnetic fixing member configured to support the second carrier 20. The magnetic mount includes an atmospheric housing, such as housing 112 described herein. In particular, the housing of the second support apparatus 100B is fluidly connected to the atmospheric environment 180 via the second supply passage 149. Thus, the second support device 100B can be fed from outside the vacuum chamber while maintaining atmospheric conditions in the interior volume of the second support device 100B.
As shown in fig. 6, cable 163, which may be a power cable, a signal cable, or a sensor cable, passes from outside the vacuum chamber through second supply channel 149 to the interior volume of second support device 100B.
According to some embodiments, which can be combined with other embodiments described herein, the alignment device may be adapted to operate under vacuum conditions, i.e. the alignment device may be vacuum compatible. As exemplarily shown in fig. 6, a vacuum feedthrough 170 in the first supply channel 147 may be provided, particularly when the first support device 100A is an alignment device. Thus, the vacuum environment in the internal volume of the alignment device may be separated from the atmospheric environment 180 outside of the vacuum chamber. Thus, the alignment device may be fed from the outside through power and/or signal and/or sensor cables, while the vacuum environment in the inner volume of the first support device comprising the alignment device may be maintained at the same time.
In several embodiments, the apparatus for processing a carrier may include a third supporting device 100C for supporting or moving the first carrier. In fig. 6, the third supporting device 100C is a magnetic fixing member, and may be similar to the second supporting device including the magnetic fixing member as described above.
Generally, the third support device 100C is configured to support the first carrier 10. In particular, the third supporting device 100C may be configured to support the first carrier 10 on the first supporting device 100A including the alignment device. More particularly, the third support 100C is connected to the first support 100A. Accordingly, the third supporting device 100C may move together with the first supporting device 100A by the first driving unit 142. Generally, the interior volume of the third support apparatus 100C is sealed in a vacuum tight manner to maintain atmospheric pressure in the interior volume of the third support apparatus 100C.
As described herein, the second support device 100B may be fed through the second supply channel 149. In several embodiments, the third support device 100C is supplied by power and/or signal cables 165 and/or sensor cables via cable feeders 109. Power and/or signal cables 165 and/or sensor cables can be fed into the interior volume of the vacuum chamber 101 via the cable feed-in 109. The power and/or signal cables 165 and/or sensor cables may be supplied to the third support apparatus 100C via a connection box, such as the hermetic connection 115 or vacuum compatible connection 119 described herein. The third support device 100C and in particular the connection box is generally configured to seal the interior volume of the third support device 100C such that power and/or signal cables 165 and/or sensor cables can be connected from the vacuum environment in the vacuum chamber 101 to the interior volume of the third support device 100C while maintaining atmospheric pressure in the interior volume of the third support device 100C.
According to some embodiments, which can be combined with several embodiments described herein, the power and/or signal cables 165 and/or the sensor cables are electrical cables having materials used in a vacuum environment. For example, the power and/or signal cables 165 and/or the sensor cables may be vacuum cables (in-vacuum cables), such as copper wires with vacuum compatible isolation. In particular, the power and/or signal cables 165 and/or sensor cables may be electrical cables having a low outgassing rate.
Generally, the vacuum deposition system 300 is configured to deposit one or more materials on substrates carried by the first carrier 10. Generally, the first support apparatus 100A is configured for supporting or moving a carrier in a deposition area. The deposition source 105 can be disposed in the vacuum chamber 101, and in particular, a vapor source configured to vaporize organic material can be disposed in the vacuum chamber 101. The deposition source 105 may be arranged such that material may be directed from the deposition source 105 towards the first carrier 10, the first carrier 10 being fixed to the third support 100C. More particularly, the vacuum deposition system 300 includes a deposition source 105, the deposition source 105 being disposed in a deposition region of the vacuum chamber 101. The deposition source may alternatively or additionally comprise a rotatable distribution pipe provided with a vapour outlet. The distribution pipe may extend essentially in a vertical direction and may be rotatable around an essentially vertical rotation axis. The deposition material may be evaporated in a crucible of an evaporation source and may be directed toward the substrate through a vapor outlet. The steam outlet is provided in the distribution pipe.
In particular, the deposition source 105 may be arranged as a line source extending in an essentially vertical direction. The height of the deposition source 105 in the vertical direction may be adapted to the height of a vertically oriented substrate such that the substrate may be coated by moving the deposition source 105 through the substrate in the first direction X.
In fig. 6, the first carrier 10 is a substrate carrier carrying a substrate 11 to be coated, and the second carrier 20 is a mask carrier carrying a mask 21 arranged in front of the substrate 11 during deposition. The first and second carriers 10 and 20 may be aligned with respect to each other using the first transfer device 141 so that the evaporated material may be accurately deposited in a predetermined pattern on the substrate as defined by the mask.
In particular, the second carrier 20 fixed to the second supporting means 100B can be moved to a predetermined position in the second direction Z by means of the second transferring means 144. The first carrier 10 can be moved in the second direction Z to a predetermined position adjacent to the second carrier 20 by means of the first transfer device 141. The first carrier 10 may then be aligned in an alignment direction to the first support means comprising the alignment means, in particular in the second direction Z, and/or optionally in one or more other alignment directions.
In some embodiments, which can be combined with other embodiments described herein, the alignment system 130 extends through the wall 102 of the vacuum chamber 101, in particular through the side wall of the vacuum chamber 101, and is resiliently connected to the side wall via a vibration isolation member 103 for providing vibration isolation between the alignment system 130 and the side wall. The vibration isolation member may be an axially expandable member, such as a bellows member.
According to some embodiments, which can be combined with several embodiments described herein, an apparatus for processing a carrier can comprise a carrier transport system. The carrier transport system is configured to transport carriers in a vacuum chamber in a first direction X. The first drive unit may be configured to move the first driven member in the second direction Z. The second direction Z is transverse to the first direction. By way of example, the apparatus 200 shown in fig. 6 comprises a first carrier transport system 120. The first carrier transport system 120 is configured to transport a first carrier along a first transport path in a first direction X. The second direction Z may be substantially perpendicular to the first direction X along which the first carrier is transported by the first carrier transport system 120. After transferring the first carrier in the first direction X, the first carrier may be fixed to the third support device 100C and moved away from the first transfer path in the second direction Z, e.g. towards the deposition source 105 or towards the second carrier 20 carrying the mask.
The first carrier transport system 120 may comprise a magnetic levitation system. The magnetic levitation system has at least one magnet unit 121, in particular at least one actively controlled magnet unit, configured to support the first carrier 10 in a non-contact manner on the guiding structure.
In some embodiments, the at least one alignment direction may substantially correspond to the second direction Z. Thus, the first carrier can be moved in the second direction Z by the first transfer means 141 and by the first support means comprising the alignment means. The first transfer device 141 may be configured to perform a coarse positioning of the first carrier in the second direction Z, and the first support device comprising the alignment device may be configured to perform a fine alignment of the first carrier in the second direction Z.
In some embodiments, a first support device including an alignment device is configured to move the second support device 100B in the second direction Z and to selectively move the second support device 100B in at least one of the first direction X and a third direction Y transverse to the first and second directions. The third direction Y may be an essentially vertical direction. Thus, the first carrier can be accurately positioned in the first direction X, the second direction Z and/or the third direction Y by the first support means comprising the alignment means. In other embodiments, the first supporting device including the alignment device can move the third supporting device 100C in only two directions, such as the second direction Z and the third direction Y. In other embodiments, the first support device comprising the alignment device may move the third support device 100C in only one direction, in particular the second direction Z.
The first and third supporting devices 100A and 100C may be fixed to the driven part 143 of the first transfer device 141 such that the first and third supporting devices 100A and 100C may be moved in the second direction Z by the first transfer device 141. The first transfer device 141 includes a first driving unit 142 and a first driven member 143, and the first driven member 143 is movable in the second direction Z by the first driving unit 142. The first supporting device 100A and the third supporting device 100C may be provided together to the driven part 143, for example, at a front end of the driven part 143, to be movable together with the driven part 143 in the second direction Z. The driven member 143 may include a linearly extending rod or arm, and may be moved by the first driving unit 142. A linearly extending rod or arm extends in the second direction Z from outside the vacuum chamber into the vacuum chamber.
In some embodiments, which can be combined with other embodiments described herein, the first driving unit 142 of the first transfer device 141 can comprise a linear actuator configured to move the driven member 143a distance of 10mm or more, in particular a distance of 20mm or more, more in particular a distance of 30 mm or more, in the second direction Z. For example, the first drive unit 142 may include a mechanical actuator, an electric actuator such as a stepper motor, an electric motor, a hydraulic actuator, and/or a pneumatic actuator configured to move the driven member 14310 mm or more in the second direction Z.
In some embodiments, which can be combined with other embodiments described herein, the first support means can comprise at least one precision actuator, such as at least one piezoelectric actuator, for providing movement in at least one alignment direction. In particular, the first support means may comprise two or three piezoelectric actuators configured for providing movement in two or three alignment directions. For example, the piezoelectric actuator of the first support device may be configured to move the third support device 100C in the second direction Z, and selectively move the third support device 100C in the first direction X and/or the third direction Y. The first support means may comprise alignment means configured for fine positioning (or fine alignment) of the third support means 100C with the first carrier 10 mounted on the third support means 100C in this at least one alignment direction. For example, the alignment device may be configured for positioning the first carrier with sub-5 micrometer (sub-5- μm) accuracy, in particular with sub-micrometer (sub- μm) accuracy. Accordingly, by having the first supporting device including the aligning device and the third supporting device 100C to be provided together to the driven part 143 of the first transfer device, the coarse positioning of the first fixture may be performed by the first transfer device 141, and the fine positioning may be provided by the aligning device of the first supporting device.
In some embodiments, which can be combined with other embodiments described herein, the third supporting device 100C includes a magnetic clamping member configured to magnetically support the first carrier 10 on the third supporting device 100C. For example, the third support apparatus 100C may comprise an electropermanent magnet apparatus configured to magnetically support the first carrier. The electropermanent magnet device is switchable between a supporting state and a releasing state by applying an electrical pulse to a coil of the electropermanent magnet device. In particular, the magnetization of at least one magnet of the electropermanent magnet arrangement can be changed by applying an electrical pulse.
The alignment system 130 shown in fig. 6 may be (rigidly) fixed to the support 110. The support 110 is disposed in the vacuum chamber, for example affixed to a top wall of the vacuum chamber. In some embodiments, which can be combined with other embodiments described herein, the support 110 extends in the first direction X and carries or supports the at least one magnet unit 121 of the first carrier transport system 120. Thus, both the at least one magnet unit 121 and the alignment system 130 are fixed to the same mechanical support inside the vacuum chamber, so that vibrations or other movements of the vacuum chamber are transferred to the alignment system 130 and to the levitation magnets of the magnetic levitation system to the same extent. Alignment accuracy can be improved more and carrier transport can be facilitated.
In some embodiments, the deposition source 105 may include a distribution pipe. The distribution pipe has a plurality of vapor openings or nozzles for directing coating material into the deposition area. Further, the deposition source may comprise a crucible. The crucible is configured for heating and evaporating the coating material. The crucible may be connected to the distribution pipe to be in fluid communication with the distribution pipe.
In some embodiments, which can be combined with other embodiments described herein, the deposition source can be rotatable. For example, the deposition source may be rotatable from a first orientation to a second orientation. The vapor opening of the deposition source is directed toward the deposition area in a first orientation. The vapor openings are directed toward the second deposition area in a second orientation. The deposition area and the second deposition area may be located on opposite sides of the deposition source, and the deposition source may be rotatable by an angle of about 180 degrees between the deposition area and the second deposition area.
The first carrier transport system 120 can be configured for non-contact transport of the first carrier 10 in the vacuum chamber 101. For example, the first carrier transport system 120 may support and transport the first carrier 10 by magnetic force. In particular, the first carrier transport system 120 may include a magnetic levitation system.
In the example embodiment of fig. 6, the first carrier transport system 120 includes at least one magnet unit 121, at least partially disposed above the first carrier 10 and configured to carry at least a portion of the weight of the first carrier 10. The at least one magnet unit 121 may include an active control magnet unit configured to support the first carrier 10 in a non-contact manner. The first carrier transport system 120 may further include a driving device configured to contactlessly move the first carrier 10 in the first direction X. In some embodiments, the drive means may be arranged at least partially below the first carrier 10. The driving device may include a driver, such as a linear motor, configured to move the first carrier (not shown) by applying a magnetic force to the first carrier.
Referring exemplarily to fig. 6, according to some embodiments, which can be combined with other embodiments described herein, the alignment system 130 includes a body 131 fixed to a support 110 disposed inside the vacuum chamber. The first driving unit 142 of the first transfer device 141 and the second driving unit 145 of the second transfer device 144 may be fixed to the body 131 of the alignment system 130. The body 131 of the alignment system 130 may provide a feed-through the wall 102, a driven member 143 for the first transfer device and a second driven member 146 for the second transfer device. The body 131 of the alignment system 130 may be resiliently connected to the wall 102 of the vacuum chamber 101 via the vibration isolation member 103.
The body 131 of the alignment system 130 may be secured to the support 110. The support 110 may be fixed (directly or indirectly) to the top wall of the vacuum chamber and/or may be provided as a support rail or support beam which may extend in the first direction X. The top wall of the vacuum chamber is generally stronger and less movable than the vertically extending side walls.
In some embodiments, which can be combined with other embodiments described herein, the first carrier transport system 120 can be arranged for transporting a first carrier along a first transport path in a first direction X, and the second carrier transport system 122 can be arranged for transporting a second carrier 20 along a second transport path parallel to the first transport path in the first direction X. First carrier transport system 120 and/or second carrier transport system 122 may be configured as a magnetic levitation system for non-contact carrier transport. In particular, the first carrier transport system 120 may comprise at least one magnet unit 121, in particular an active control magnet unit, for supporting the first carrier 10 in a non-contact manner. The second carrier transport system 122 may comprise at least one second magnet unit 123, in particular an active control magnet unit, for supporting the second carrier 20 in a non-contact manner. In general, each magnetic levitation system comprises a plurality of active control magnet units, which may be arranged at substantially equal intervals along the first direction X. For example, the active control magnet unit may be fixed to the support 110.
In fig. 6, the first and second carriers 10 and 20 are contactlessly supported by the actively controlled magnet units of the first and second carrier transport systems 120 and 122. The third support means 100C are arranged at a distance from the first carrier 10 in the second direction Z, and the second support means 100B are arranged at a distance from the second carrier 20 in the second direction Z.
Fig. 7A shows a schematic diagram of the apparatus 200 of fig. 6 in a second position. The second carrier 20 has been fixed to the second supporting device 100B by moving the second supporting device 100B to the second carrier 20 in the second direction Z and magnetically attracting the second carrier 20 to the second supporting device 100B. The second carrier 20 is then moved by the second transfer device 144 in the second direction Z to a predetermined position, for example a distance of 20mm or more. In particular, the mask 21 carried by the second carrier 20 is positioned at a predetermined position facing the deposition source 105.
As further shown in fig. 7A, the first carrier 10 carrying the substrate 11 is transferred into the deposition area by the first carrier transfer system 120, and the third support device 100C is fixed to the first carrier by moving the third support device 100C to the first carrier 10 by the first transfer device 141.
As schematically shown in fig. 7B, the first carrier 10 is then moved in the second direction Z towards the second carrier 20 by the first transfer device 141 until the substrate 11 is positioned close to the mask 21. Subsequently, the first carrier 10 is aligned in at least one alignment direction, in particular in the second direction Z, using first supporting means comprising alignment means. The first carrier 10 may be accurately positioned in a predetermined position by alignment means of the first support means, which alignment means for example comprise one or more piezoelectric actuators.
Thus, the deposition described herein is advantageously configured such that one or more materials passing through the deposition source 105 may be deposited on the substrate 11 through the openings of the mask 21, resulting in an accurate pattern of material being deposited on the substrate.
Referring to fig. 8, 9 and 10, some other selected aspects of the alignment system of the present disclosure are illustrated.
Fig. 8 illustrates a cross-sectional view of an apparatus 200 for processing a carrier according to several embodiments described herein. Fig. 9 depicts a cross-sectional view of the alignment system 130 of the apparatus 200 of fig. 8. Fig. 10 depicts a perspective view of the alignment system 130 of the apparatus 200 of fig. 8.
As exemplarily shown in fig. 8, a first driving unit 142 (e.g., a first Z actuator) and a second driving unit 145 (e.g., a second Z actuator) are disposed outside the vacuum chamber 101. The first and second driving units are fixed to the body 131. In some embodiments, the body 131 is, for example, a support (not shown in fig. 8) rigidly fixed to the inside of the vacuum chamber via screws or bolts 108 (shown in fig. 9), and resiliently connected to the wall 102.
The first driving unit 142 is configured to move the first driven member 143, the first driven member 143 extending through the main body 131 into the vacuum chamber in the second direction Z, and the second driving unit 145 is configured to move the second driven member 146, the second driven member 146 extending through the main body 131 into the vacuum chamber in the second direction Z. A second supporting device 100B for fixing the first carrier to the alignment system is disposed at the front end of the first driven member 143, and a third supporting device 100C for fixing the second carrier to the alignment system is disposed at the front end of the second driven member 146. Thus, the second support device 100B and the third support device 100C are movable independently of each other in the second direction Z by respective transfer devices to position the first and second carriers at respective predetermined positions in the second direction Z.
As exemplarily shown in fig. 8, the second driven member 146 may protrude into the vacuum chamber more than the first driven member 143 so that the first and second carriers may be supported adjacent to each other on the third and second supporting devices 100C and 100B. The third supporting device 100C and the second supporting device 100B are provided at the front end of the driven member.
The third support 100C is connected to the first driven member 143 via a first support 100A, the first support 100A generally comprising at least one piezoelectric actuator. Accordingly, by accurately positioning the third support apparatus 100C at a predetermined position using the alignment apparatus of the first support apparatus 100A, fine adjustment (or fine alignment) of the first carrier with respect to the second carrier can be performed.
Referring exemplarily to fig. 10, according to some embodiments, which can be combined with other embodiments described herein, a small gap can be provided between the body 131 of the alignment system 130 and the wall 102 of the vacuum chamber, such that the body 131 does not move with the wall 102, e.g. when the side wall is vibrating or when the side wall is moved due to pressure changes inside the vacuum chamber.
In some embodiments, the apparatus includes two or more alignment systems located in the deposition region. The two or more alignment systems are spaced apart from each other in the first direction X. Each alignment system may be constructed in accordance with alignment system 130 according to several embodiments described herein. For example, the second mount of the first alignment system may be configured to support the upper front portion of the first carrier, and the first mount of the second alignment system may be configured to support the upper rear portion of the first carrier. Each alignment system may extend through a sidewall of the vacuum chamber such that the respective drive unit of the respective transfer device is positioned outside of the vacuum chamber. Furthermore, each alignment system may be resiliently connected to the side wall of the vacuum chamber via a respective vibration isolation member. In some embodiments, each alignment system is mechanically fixed to the same support that is provided inside the vacuum chamber, for example to the top wall of the vacuum chamber.
The alignment means of the first alignment system may be configured to align the first carrier in the first direction X, the second direction Z, and the third direction Y, and the alignment means of the second alignment system may be configured to align the first carrier in the first direction X and in the third direction Y. Other alignment systems with other alignment means may be provided. Thus, a first carrier, which is a three-dimensional object, can be accurately positioned and rotated to a predetermined translational and rotational position in the deposition area relative to a second carrier.
Referring exemplarily to the flowchart shown in fig. 11, a method of manufacturing a supporting device 100 for supporting a carrier in a vacuum chamber according to the present disclosure is explained. According to several embodiments, which can be combined with any of the other embodiments described herein, the method 400 comprises providing a housing 112 (represented by block 410 in fig. 11) for at least partially accommodating one or more electrically controllable support elements 111. In addition, the method 400 includes providing the housing 112 (represented by block 420 in fig. 11) with the receiving portion 113, the receiving portion 113 being for the one or more electrically controllable support elements 111. Furthermore, the method 400 includes providing the housing 112 with the airtight connection 115 (represented by block 430 in fig. 11), the airtight connection 115 being for an electrical supply line for the one or more electrically controllable support elements 111. Further, the method 400 includes placing the one or more electrically controllable support elements 111 into the receptacle 113 (represented by block 440 in fig. 11). Further, the method 400 includes providing a hermetic seal between the housing and the one or more electrically controllable support elements 111 disposed in the receptacle 113 (represented by block 450 in fig. 11).
According to some embodiments, which can be combined with other embodiments described herein, providing a gas-tight seal between the housing 112 and the one or more electrically controllable support elements 111 comprises welding the sheet element 117 to the housing 112, in particular laser welding the sheet element 117 to the housing 112.
According to some embodiments, which can be combined with other embodiments described herein, providing the housing 112 with the airtight connection 115 comprises providing a guiding hole for airtight guiding the electrical supply line in the housing 112. Providing the housing 112 with the airtight connection 115 may additionally or alternatively include providing a vacuum compatible connection 119 for airtight connection of the support means to the driven part of the apparatus for processing the carrier in the vacuum chamber. In particular, the driven part of the apparatus for processing a carrier may be a driven part of the apparatus 200 for processing a carrier according to any embodiment described herein.
According to some embodiments, which can be combined with other embodiments described herein, the method 400 further comprises closing one or more tooling holes provided in the housing by one or more sealing plugs. More particularly, all of the one or more tooling holes provided during the manufacture of the support device may be generally closed by a sealing plug.
In view of the foregoing, it will be appreciated that several embodiments described herein are improved over the prior art, particularly for fabricating OLED devices in an Ultra Clean Vacuum (UCV) environment.
While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims (17)

1. A support device (100) for supporting a carrier or a component in a vacuum chamber, the support device comprising:
one or more electrically controllable support elements (111);
a housing (112) for at least partially accommodating the one or more electrically controllable support elements (111), the housing having an accommodation portion (113) for the one or more electrically controllable support elements (111);
a seal (114) to provide a gas-tight seal between the housing and the one or more electrically controllable support elements (111) arranged in the receptacle (113); and
-a gas-tight connection (115) for electrical supply lines for the one or more electrically controllable support elements (111).
2. The support device (100) of claim 1, wherein the one or more electrically controllable elements (111) are arranged in the receptacle (113) such that a first side (111A) of the one or more electrically controllable elements (111) faces an inner space (116) of the housing and a second side (111B) of the one or more electrically controllable elements (111) faces an outer space (112E) of the housing, wherein the inner space is hermetically sealed.
3. The support device (100) of claim 1 or 2, wherein the seal (114) comprises a sheet element (117) having one or more receiving openings (118), the one or more receiving openings (118) for the one or more electrically controllable elements (111), the sheet element (117) being connected to the housing by a gas-tight connection.
4. The support device (100) of claim 3, the gas-tight connection being a welded joint, in particular a laser welded joint.
5. The support device (100) of any of claims 1 to 4, the one or more electrically controllable support elements (111) comprising at least one element selected from the group consisting of a magnetic fixture, in particular a magnetic fixture with an electropermanent magnet, configured to support the carrier or the component, and an alignment device, in particular a piezo-electric actuator, configured to move the carrier in at least one alignment direction.
6. The support device (100) of any of claims 1 to 5, the housing (112) further comprising a vacuum compatible connection (119) for connecting the support device to a driven part of an apparatus for processing a carrier in a vacuum chamber or to a part of the support device in the vacuum chamber.
7. Use of a support device (100) according to any of claims 1 to 6 for supporting a carrier or a component in a vacuum processing system.
8. A method of manufacturing a support device (100) for supporting a carrier or a component in a vacuum chamber (101), the method comprising:
providing a housing (112) for at least partially accommodating one or more electrically controllable support elements (111);
providing the housing (112) with receptacles (113) for the one or more electrically controllable support elements (111);
-providing the housing (112) with an airtight connection (115) for electrical supply lines for the one or more electrically controllable support elements (111);
-placing the one or more electrically controllable support elements (111) into the receptacle (113); and
providing a gas-tight seal between the housing and the one or more electrically controllable support elements (111) arranged in the accommodation portion (113).
9. The method of claim 8, wherein providing the gas-tight seal between the housing (112) and the one or more electrically controllable support elements (111) comprises welding a sheet element (117) to the housing (112), in particular laser welding a sheet element (117) to the housing (112).
10. The method according to claim 8 or 9, wherein providing the housing (112) with the airtight connection (115) comprises providing a guiding hole and/or providing a vacuum compatible connection (119), providing the guiding hole for airtight guiding the electrical supply line in the housing, providing the vacuum compatible connection (119) for airtight connecting the supporting device to a driven part of an apparatus for processing a carrier in a vacuum chamber, or for airtight connecting the supporting device to a part in a vacuum chamber.
11. The method of any one of claims 8 to 10, further comprising closing one or more tooling holes provided in the housing by one or more sealing bolts.
12. An apparatus (200) for processing carriers in a vacuum chamber (101), comprising:
a vacuum chamber (101) having a wall (102) with an opening (106);
a first drive unit (142) arranged outside the vacuum chamber (101) and configured to move a first driven member (143) extending through the opening (106) into the vacuum chamber (101); and
-a first support device (100A) attached to the first driven part (143) in the vacuum chamber (101), the first driven part (143) providing a first supply channel (147) for supplying power and/or control signals to the first support device (100A), the first support device (100A) being the support device (100) according to any of claims 1 to 6.
13. The apparatus (200) of claim 12, further comprising:
a second drive unit (145) arranged outside the vacuum chamber (101) and configured to move a second driven member (146) extending through the opening (106) into the vacuum chamber (101); and
-a second support device (100B) affixed to the second driven part (146) in the vacuum chamber (101), the second driven part (146) providing a second supply channel (149) for supplying the power and/or the control signal to the second support device (100B), the second support device (100B) being the support device (100) of any of claims 1 to 6.
14. The apparatus (200) of claim 13, wherein the first support device (100A) is an alignment device (151) configured to move the first carrier (10) in at least one alignment direction, and the second support device (100B) is a magnetic mount (152) configured to support the second carrier (20) adjacent to the first carrier (10).
15. The apparatus (200) of claim 14, further comprising a third support device (100C), wherein the third support device (100C) is configured to support the first carrier on the alignment device, the third support device (100C) being the support device (100) of any of claims 1 to 6.
16. The apparatus according to any one of claims 12 to 15, further comprising a carrier transport system (120) configured to transport the carrier in a first direction in the vacuum chamber, wherein the first drive unit (142) is configured to move the first driven member (143) in a second direction, the second direction being transverse to the first direction.
17. A vacuum deposition system (300), comprising:
the device (200) of any of claims 12 to 16; and
a deposition source (105) disposed in a deposition area in the vacuum chamber (101), wherein the first support apparatus (100A) is configured for supporting or moving the carrier in the deposition area.
CN201880040345.6A 2018-07-26 2018-07-26 Support device for supporting a carrier or component in a vacuum chamber, use of a support device for supporting a carrier or component in a vacuum chamber, apparatus for processing a carrier in a vacuum chamber, and vacuum deposition system Pending CN111212930A (en)

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