CN111211100B - Semiconductor integrated circuit device - Google Patents
Semiconductor integrated circuit device Download PDFInfo
- Publication number
- CN111211100B CN111211100B CN202010029352.5A CN202010029352A CN111211100B CN 111211100 B CN111211100 B CN 111211100B CN 202010029352 A CN202010029352 A CN 202010029352A CN 111211100 B CN111211100 B CN 111211100B
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- CN
- China
- Prior art keywords
- integrated circuit
- circuit board
- board main
- circuit chip
- fixedly connected
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a semiconductor integrated circuit device, which comprises a circuit board main body, an integrated circuit chip and a LOGO mark, wherein the front surface of the circuit board main body is provided with a mounting groove, two sides of an inner cavity of the mounting groove are communicated with each other, and two movable grooves are internally and slidably connected with a baffle plate. This semiconductor integrated circuit device, through setting up the mounting groove, install integrated circuit chip in the mounting groove, compare and fix on the surface of circuit board main part, set up the stack thickness of integrated circuit chip and circuit board main part like this effectually, make the circuit board main part install in the less equipment in space more easily, the pin embedding is in the card hole simultaneously, avoided the pin to detain at the surface of circuit board main part, occupy the space on circuit board main part surface, set up spout, slide and first spring, make the length of metal connecting rod adjustable, be convenient for on the integrated circuit chip installation circuit board main part.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a semiconductor integrated circuit device.
Background
Semiconductor devices are electronic devices that have electrical conductivity between good electrical conductors and insulators, and that utilize the specific electrical characteristics of semiconductor materials to perform specific functions, and can be used to generate, control, receive, transform, amplify signals, and perform energy conversion. The semiconductor material of the semiconductor device is silicon, germanium or gallium arsenide, and can be used as equipment such as rectifiers, oscillators, light emitters, amplifiers, photometers and the like. To distinguish from integrated circuits, they are sometimes referred to as discrete devices. The basic structure of most two-terminal devices (i.e., transistor diodes) is a PN junction. Semiconductor devices have generally been developed using different semiconductor materials and using different processes and geometries to produce a wide variety of different types of diodes with varying functional applications, ranging in frequency coverage from low frequency, high frequency, microwave, millimeter wave, infrared to light wave. Three terminal devices are generally active devices, typically representing various transistors (also known as transistors). Transistors can be further divided into bipolar transistors and field effect transistors. The transistors may be classified into power transistor microwave transistors and low noise transistors according to the purpose. Besides the general transistors for amplifying, oscillating and switching, there are special purpose transistors such as phototransistors, magneto-dependent transistors, field effect sensors and the like. These devices can both convert information of some environmental factors into electrical signals and amplify the same with common transistors to obtain larger output signals.
In the existing semiconductor integrated circuit device, an integrated circuit chip cannot be reduced limitlessly, the accommodating space of an integrated circuit board main body is limited, the integrated circuit chip is generally directly fixed on a panel of the integrated circuit board main body through pins, the thickness of the integrated circuit board main body is increased, and the integrated circuit board main body is inconvenient to install on precision equipment with smaller volume.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a semiconductor integrated circuit device, which solves the problems that the prior semiconductor integrated circuit device has unlimited reduction of an integrated circuit chip, limited accommodating space of an integrated circuit board main body and inconvenient installation on small precision equipment.
In order to achieve the above purpose, the invention is realized by the following technical scheme: the utility model provides a semiconductor integrated circuit device, includes circuit board main part, integrated circuit chip and LOGO sign, the mounting groove has been seted up in the front of circuit board main part, the removal groove has all been seted up to the both sides of mounting groove inner chamber intercommunication, two the equal sliding connection in inside in removal groove has the baffle, the inner chamber intercommunication in removal groove has been seted up the cross slot, the inside swing joint in cross slot has the screw rod, first recess and second recess have been seted up to integrated circuit chip, the cavity has been seted up to integrated circuit chip's inside, the spout has all been seted up to the top and the bottom of cavity, two symmetrical sliding connection has the slide between the spout, two fixedly connected with first spring between the slide, two one side fixedly connected with metal connecting rod that the slide is separated, the one end fixedly connected with pin of metal connecting rod.
Preferably, the connecting cylinder is slidably connected in the transverse groove, one side of the connecting cylinder is fixedly connected with the second spring, one end of the second spring is fixedly connected with one side of the baffle, the screw is connected with the inner thread on one side of the connecting cylinder, one end of the screw penetrates through the transverse groove and extends to the outside of the circuit board main body, and one end of the screw is fixedly connected with the rotating block.
Preferably, the top and the bottom of the integrated circuit chip are provided with heat dissipation holes, the heat dissipation holes are provided with a plurality of heat dissipation holes, the first grooves and the second grooves are symmetrically arranged, and the heat dissipation holes are respectively positioned below the first grooves and the second grooves.
Preferably, two opposite sides of the baffle are provided with clamping holes, two clamping holes are provided with a plurality of clamping holes, and one end of the outer surface of the pin is matched with the inner surface of the clamping hole.
Preferably, the two sides of the integrated circuit chip are provided with through holes, the inner surfaces of the through holes are matched with the outer surfaces of the metal connecting rods, a plurality of through holes are formed in the through holes, and a plurality of metal connecting rods are arranged.
Preferably, the inner cavity of the transverse groove is square, the outer surface of the connecting cylinder is square, and the first springs are provided with a plurality of springs.
Preferably, the front surface of the circuit board main body is provided with a fixing hole, and the front surface of the fixing hole is fixedly connected with a protection pad.
Advantageous effects
The invention provides a semiconductor integrated circuit device. Compared with the prior art, the method has the following beneficial effects:
(1) This semiconductor integrated circuit device, the mounting groove has been seted up through the front at the circuit board main part, the movable groove has all been seted up in the both sides of mounting groove inner chamber intercommunication, the equal sliding connection in inside of two movable grooves has the baffle, the inner chamber intercommunication of movable groove has been seted up the cross slot, the inside swing joint of cross slot has the screw rod, first recess and second recess have been seted up to the integrated circuit chip's of seting up, the cavity has been seted up in the inside of integrated circuit chip, the spout has all been seted up at the top and the bottom of cavity, symmetrical sliding connection has the slide between two spouts, fixedly connected with first spring between two slides, one side fixedly connected with metal connecting rod that two slides are separated, the one end fixedly connected with pin of metal connecting rod, through setting up the mounting groove, install the integrated circuit chip in the mounting groove, compare and fix on the surface of circuit board main part, the stack thickness of integrated circuit chip and circuit board main part has been set up like this effectually, make the circuit board main part install in the less equipment in the space, the pin is in the card hole simultaneously, the space at the circuit board main part has been avoided the pin to detain, occupy the surface of circuit board main part, set up spout, first spring and first connecting rod can adjust the circuit board length.
(2) This semiconductor integrated circuit device, through sliding connection in the cross slot has the connecting cylinder, one side fixed connection second spring of connecting cylinder, one side fixed connection of second spring and baffle, the inside threaded connection of connecting cylinder one side has the screw rod, the outside of cross slot and extending to the circuit board main part is run through to the one end of screw rod, the one end fixedly connected with dwang of screw rod, through setting up the dwang, the screw rod, the cross slot, connecting cylinder and second spring, when rotating the dwang, adjust the deformation degree of second spring, be convenient for install the integrated circuit chip in the circuit board main part, help carrying out the chucking to the integrated circuit chip simultaneously firmly.
(3) This semiconductor integrated circuit device, through all having seted up the louvre in integrated circuit chip's top and bottom, the louvre is provided with a plurality of, first recess and second recess symmetry set up, the louvre is located the below of first recess and second recess respectively, the fixed orifices has been seted up in the front of circuit board main part, the front fixedly connected with protection pad of fixed orifices, when the inside integrated circuit chip of semiconductor integrated circuit device produced heat, give off the external world through the louvre, be favorable to realizing the heat dissipation of the inside integrated circuit chip of integrated circuit semiconductor device, set up the protection pad, the mounting causes the damage to the circuit board main part when preventing the fixed circuit board main part.
Drawings
FIG. 1 is a front view of an external structure of the present invention;
FIG. 2 is a front view of the internal structure of an integrated circuit chip according to the present invention;
FIG. 3 is a partial cross-sectional view of a circuit board body of the present invention;
FIG. 4 is an enlarged view of a portion of the invention at A in FIG. 1;
FIG. 5 is a partial side view of an external structure of an integrated circuit chip of the present invention;
FIG. 6 is a partial side view of the outer structure of the baffle of the present invention;
fig. 7 is a top view of an integrated circuit chip of the present invention.
In the figure: 1-circuit board main body, 2-integrated circuit chip, 3-mounting groove, 4-movable groove, 5-baffle, 6-horizontal groove, 7-screw, 8-first groove, 9-second groove, 10-cavity, 11-chute, 12-slide, 13-first spring, 14-metal connecting rod, 15-pin, 16-connecting cylinder, 17-second spring, 18-rotating block, 19-heat dissipation hole, 20-card hole, 21-fixed hole, 22-protection pad, 23-LOGO mark, 24-perforation.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-7, the present invention provides a technical solution: the semiconductor integrated circuit device comprises a circuit board main body 1, an integrated circuit chip 2 and LOGO marks 23, wherein a fixing hole 21 is formed in the front surface of the circuit board main body 1, a protection pad 22 is fixedly connected to the front surface of the fixing hole 21, the protection pad 22 is arranged to prevent damage to the circuit board main body 1 caused by fixing parts when the circuit board main body 1 is fixed, through holes 24 are formed in two sides of the integrated circuit chip 2, the inner surfaces of the through holes 24 are matched with the outer surfaces of metal connecting rods 14, a plurality of through holes 24 are formed, a plurality of metal connecting rods 14 are formed, heat dissipation holes 19 are formed in the top and bottom of the integrated circuit chip 2, a plurality of heat dissipation holes 19 are formed in the top and bottom of the integrated circuit chip 2, a first groove 8 and a second groove 9 are symmetrically arranged, the heat dissipation holes 19 are respectively positioned below the first groove 8 and the second groove 9, and when the integrated circuit chip 2 in the semiconductor integrated circuit device generates heat, the heat dissipation of the integrated circuit chip 2 inside the integrated circuit semiconductor device is facilitated to be realized by the dissipation of the heat dissipation holes 19 to the outside, the front surface of the circuit board main body 1 is provided with the mounting groove 3, both sides of the inner cavity of the mounting groove 3 are respectively communicated with the moving grooves 4, the interiors of the two moving grooves 4 are respectively connected with the baffle plates 5 in a sliding way, the opposite sides of the two baffle plates 5 are respectively provided with the clamping holes 20, the two clamping holes 20 are respectively provided with a plurality of the clamping holes, one end of the outer surface of the pin 15 is matched with the inner surface of the clamping hole 20, the inner cavity of the moving groove 4 is communicated with the transverse groove 6, the transverse groove 6 is vertically symmetrically provided with two, the inner cavity of the transverse groove 6 is square, the outer surface of the connecting cylinder 16 is square, the first spring 13 is provided with a plurality of the inner cavity of the transverse groove 6 and the outer surface of the connecting cylinder 16 are square, through the matching between the two, when the screw rod 7 is rotated, the connecting cylinder 16 can be effectively prevented from rotating along with the screw rod 7, the influence on the installation of the integrated circuit chip 2 in the circuit board main body 1 is avoided, the clamping firmness of the integrated circuit chip 2 is facilitated, the connecting cylinder 16 is slidably connected in the transverse groove 6, one side of the connecting cylinder 16 is fixedly connected with the second spring 17, one end of the second spring 17 is fixedly connected with one side of the baffle plate, the screw rod 7 is connected with the internal thread on one side of the connecting cylinder 16, one end of the screw rod 7 penetrates through the transverse groove 6 and extends to the outside of the circuit board main body 1, one end of the screw rod 7 is fixedly connected with the rotating block 18, when the rotating block 18 is rotated, the deformation degree of the second spring 17 is regulated, the installation of the integrated circuit chip 2 in the circuit board main body 1 is facilitated, the clamping firmness of the integrated circuit chip 2 is facilitated, the screw rod 7 is movably connected in the transverse groove 6, the first groove 8 and the second groove 9 are formed in the integrated circuit chip 2, when the integrated circuit chip 2 is installed on the circuit board main body 1 by arranging the first groove 8 and the second groove 9, the first groove 8 and the second groove 9 are clamped by using a clamp, the installation is convenient, the cavity 10 is formed in the integrated circuit chip 2, the sliding grooves 11 are formed in the top and the bottom of the cavity 10, the sliding plates 12 are symmetrically and slidingly connected between the two sliding grooves 11, the first spring 13 is fixedly connected between the two sliding plates 12, the metal connecting rod 14 is fixedly connected to the separated side of the two sliding plates 12, the pin 15 is fixedly connected to one end of the metal connecting rod 14, the integrated circuit chip 2 is installed in the installation groove 3 by arranging the installation groove 3, compared with the integrated circuit chip 2 which is fixed on the surface of the circuit board main body 1, the thickness of stacking of integrated circuit chip 2 and circuit board main part 1 has been effectually reduced like this for circuit board main part 1 installs in the less equipment in space more easily, and pin 15 embedding has avoided pin 15 to detain on the surface of circuit board main part 1 simultaneously in card hole 20, occupies the space on circuit board main part 1 surface, sets up spout 11, slide 12 and first spring 13, makes the length of metal connecting rod 14 adjustable, is convenient for integrated circuit chip 2 installs on circuit board main part 1.
During operation, the four rotating blocks 18 are respectively rotated so as to respectively rotate the screw rods 7 connected with the rotating blocks, the inner cavity of the transverse groove 6 is square, the outer surface of the connecting cylinder 16 is square, the connecting cylinder 16 can be effectively prevented from rotating along with the screw rods 7 through the cooperation between the two rotating blocks and the screw rods 7 when the screw rods 7 are rotated, the screw rods 7 are further moved out of the connecting cylinder 16, the deformation degree of the second springs 17 is further changed, the integrated circuit chip 2 is conveniently mounted in the circuit board main body 1, meanwhile, the clamping of the integrated circuit chip 2 is facilitated to be firm, the baffle plate 5 can be further moved towards the inner side of the moving groove 4 through the connection of the connecting cylinder 16 and the second springs 17 through the moving of the screw rods 7, the integrated circuit chip 2 is mounted in the mounting groove 3, compared with the structure fixed on the surface of the circuit board main body 1, the structure effectively reduces the superposition thickness of the integrated circuit chip 2 and the circuit board main body 1, ensures that the circuit board main body 1 is easier to be installed in equipment with smaller space, aligns the pins 15 with the clamping holes 20, avoids the pins 15 to be buckled on the surface of the circuit board main body 1 and occupy the space on the surface of the circuit board main body 1, when in installation, the pins 15 on two sides squeeze the metal connecting rod 14, further ensure that the two sliding plates 12 slide on the sliding groove 11 in opposite directions, further ensure that the first spring 13 is compressed, ensure that the metal connecting rod 14 moves towards the inside of the cavity 10, ensure that the length of the metal connecting rod 14 can be adjusted, facilitate the installation of the integrated circuit chip 2 on the circuit board main body 1, and then respectively rotate the four rotating blocks 18 with the screws 7 connected with the rotating blocks, change the deformation degree of the second spring 17, and then carry out the chucking to integrated circuit chip 2 through baffle 5, be convenient for install integrated circuit chip 2 in circuit board main part 1, help carrying out the chucking to integrated circuit chip 2 firm simultaneously.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A semiconductor integrated circuit device comprising a circuit board body (1), an integrated circuit chip (2) and a LOGO (23), characterized in that: the front of circuit board main part (1) has seted up mounting groove (3), movable groove (4) have all been seted up in the both sides of mounting groove (3) inner chamber intercommunication, two the inside of movable groove (4) is all sliding connection has baffle (5), the inner chamber intercommunication of movable groove (4) has seted up cross slot (6), the inside swing joint of cross slot (6) has screw rod (7), first recess (8) and second recess (9) have been seted up to integrated circuit chip (2), cavity (10) have been seted up in the inside of integrated circuit chip (2), spout (11) have all been seted up at the top and the bottom of cavity (10), two symmetrical sliding connection has slide (12) between slide (11), two fixedly connected with first spring (13) between slide (12), two one side that slide (12) are separated fixedly connected with metal connecting rod (14), one end fixedly connected with pin (15) of metal connecting rod (14);
the connecting device is characterized in that a connecting cylinder (16) is slidably connected in the transverse groove (6), one side of the connecting cylinder (16) is fixedly connected with a second spring (17), one end of the second spring (17) is fixedly connected with one side of the baffle, one side of the connecting cylinder (16) is internally connected with a screw rod (7) in a threaded manner, one end of the screw rod (7) penetrates through the transverse groove (6) and extends to the outside of the circuit board main body (1), and one end of the screw rod (7) is fixedly connected with a rotating block (18).
2. A semiconductor integrated circuit device according to claim 1, wherein: the top and the bottom of integrated circuit chip (2) have all seted up louvre (19), louvre (19) are provided with a plurality of, first recess (8) and second recess (9) symmetry set up, louvre (19) are located the below of first recess (8) and second recess (9) respectively.
3. A semiconductor integrated circuit device according to claim 1, wherein: two opposite sides of the baffle (5) are provided with clamping holes (20), the two clamping holes (20) are provided with a plurality of clamping holes, and one end of the outer surface of the pin (15) is matched with the inner surface of the clamping hole (20).
4. A semiconductor integrated circuit device according to claim 1, wherein: the integrated circuit chip (2) is characterized in that through holes (24) are formed in two sides of the integrated circuit chip (2), the inner surfaces of the through holes (24) are matched with the outer surfaces of the metal connecting rods (14), a plurality of through holes (24) are formed, and a plurality of metal connecting rods (14) are arranged.
5. A semiconductor integrated circuit device according to claim 1, wherein: the inner cavity of the transverse groove (6) is square, the outer surface of the connecting cylinder (16) is square, and a plurality of first springs (13) are arranged.
6. A semiconductor integrated circuit device according to claim 1, wherein: the front of the circuit board main body (1) is provided with a fixing hole (21), and the front of the fixing hole (21) is fixedly connected with a protection pad (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010029352.5A CN111211100B (en) | 2020-01-10 | 2020-01-10 | Semiconductor integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010029352.5A CN111211100B (en) | 2020-01-10 | 2020-01-10 | Semiconductor integrated circuit device |
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| Publication Number | Publication Date |
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| CN111211100A CN111211100A (en) | 2020-05-29 |
| CN111211100B true CN111211100B (en) | 2023-09-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010029352.5A Active CN111211100B (en) | 2020-01-10 | 2020-01-10 | Semiconductor integrated circuit device |
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| Country | Link |
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| CN (1) | CN111211100B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05291739A (en) * | 1992-04-14 | 1993-11-05 | Nippon Steel Corp | Connecting terminal and connecting method for device using same |
| CN105313484A (en) * | 2014-07-30 | 2016-02-10 | 天津宇晗电子科技有限公司 | Novel chip fixing device |
| CN208240656U (en) * | 2018-03-10 | 2018-12-14 | 黄骄虹 | A kind of encapsulating structure of integrated circuit |
| CN209000900U (en) * | 2018-12-20 | 2019-06-18 | 深圳市东方之芯电子有限公司 | A kind of high-voltage linear power management chip IC mounting structure |
| CN209249456U (en) * | 2019-03-06 | 2019-08-13 | 深圳市三联盛科技股份有限公司 | A kind of integrated circuit memory and semiconductor device |
| CN209375249U (en) * | 2019-03-06 | 2019-09-10 | 深圳市蜜蜂电子有限公司 | It is a kind of convenient for fixed wireless charging chip |
| CN214672585U (en) * | 2021-06-10 | 2021-11-09 | 上海北芯集成电路技术有限公司 | Adjustable fixing structure for integrated circuit packaging |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6917525B2 (en) * | 2001-11-27 | 2005-07-12 | Nanonexus, Inc. | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs |
| KR20090129791A (en) * | 2008-06-13 | 2009-12-17 | 가부시키가이샤 교토 소프트웨어 리서치 | Multiple value flash memory |
-
2020
- 2020-01-10 CN CN202010029352.5A patent/CN111211100B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05291739A (en) * | 1992-04-14 | 1993-11-05 | Nippon Steel Corp | Connecting terminal and connecting method for device using same |
| CN105313484A (en) * | 2014-07-30 | 2016-02-10 | 天津宇晗电子科技有限公司 | Novel chip fixing device |
| CN208240656U (en) * | 2018-03-10 | 2018-12-14 | 黄骄虹 | A kind of encapsulating structure of integrated circuit |
| CN209000900U (en) * | 2018-12-20 | 2019-06-18 | 深圳市东方之芯电子有限公司 | A kind of high-voltage linear power management chip IC mounting structure |
| CN209249456U (en) * | 2019-03-06 | 2019-08-13 | 深圳市三联盛科技股份有限公司 | A kind of integrated circuit memory and semiconductor device |
| CN209375249U (en) * | 2019-03-06 | 2019-09-10 | 深圳市蜜蜂电子有限公司 | It is a kind of convenient for fixed wireless charging chip |
| CN214672585U (en) * | 2021-06-10 | 2021-11-09 | 上海北芯集成电路技术有限公司 | Adjustable fixing structure for integrated circuit packaging |
Non-Patent Citations (1)
| Title |
|---|
| 半导体封装形式介绍;梅万余;《电子工业专用设备》;20050515(第05期);全文 * |
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| CN111211100A (en) | 2020-05-29 |
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