CN111199678A

CN111199678A - Label, manufacturing method thereof, packing method and package judging method

Info

Publication number: CN111199678A
Application number: CN202010138150.4A
Authority: CN
Inventors: 樊宇; 朱飞; 曾丹
Original assignee: Beijing Jingdong Shangke Information Technology Co Ltd
Current assignee: Beijing Jingdong Shangke Information Technology Co Ltd
Priority date: 2020-03-03
Filing date: 2020-03-03
Publication date: 2020-05-26
Anticipated expiration: 2040-03-03
Also published as: CN111199678B

Abstract

The disclosure relates to the technical field of logistics, and provides a label, a manufacturing method, a packaging method and a packaging judgment method thereof. The tag comprises a body, a conductive body and a conductive contact, wherein the body is provided with an accommodating cavity which comprises a first end part and a second end part; the electric conductor is arranged in the accommodating cavity; the conductive contacts are arranged in pairs, and the two paired conductive contacts are respectively arranged at the first end part and the second end part and are connected with the conductive body; wherein, the electric conductor is conductive liquid. This disclosed label is provided with conductive liquid through the intracavity that holds at the body, and two electrically conductive contact shutoff in pairs are at the first end and the second end that hold the chamber, and electrically conductive contact is connected with the electric conductor, when the label pastes the goods packing opening part of box, if to it unseal handle then the resistivity between two electrically conductive contact will change relatively original resistivity to can accurately judge whether the packing is opened.

Description

Label, manufacturing method thereof, packing method and package judging method

Technical Field

The disclosure relates to the technical field of logistics, in particular to a label, a manufacturing method, a packaging method and a packaging judgment method thereof.

Background

The existing logistics label is usually a printed bar code or a two-dimensional code, and the packaging material is mainly adhesive tape, and the label and the adhesive tape are usually attached to the outer package of goods.

The existing scheme is easy to replace goods in the package under the condition of not damaging the adhesive tape and the label; or by counterfeiting the form of packaging, tape and labels, giving the user the illusion of not being unsealed.

Disclosure of Invention

It is a primary object of the present disclosure to overcome at least one of the above-mentioned drawbacks of the prior art, and to provide a label, a method of manufacturing the label, a packing method, and a method of determining a package.

According to a first aspect of the present invention there is provided a tag comprising:

the body is provided with a containing cavity, and the containing cavity comprises a first end part and a second end part;

the electric conductor is arranged in the accommodating cavity;

the conductive contacts are arranged in pairs, and the two paired conductive contacts are respectively arranged at the first end part and the second end part and are connected with the conductor;

wherein, the electric conductor is conductive liquid.

In one embodiment of the invention, the body comprises:

the tie coat, the tie coat has and holds the chamber, and first end and second end are the opening.

In one embodiment of the present invention, the adhesive layer comprises:

a first bonding layer segment;

and the first bonding layer section is overlapped with the second bonding layer section, and a containing cavity is formed between the first bonding layer section and the second bonding layer section.

In one embodiment of the invention, the body further comprises:

and the base material layer is superposed with the bonding layer.

In one embodiment of the invention, the body further comprises:

the release coating is superposed with the base material layer, and the base material layer is clamped between the release coating and the bonding layer.

In one embodiment of the invention, the accommodating cavities are multiple, the accommodating cavities are arranged at intervals, and the accommodating cavities are internally provided with the electric conductors and correspond to the two paired electric conduction contacts.

In one embodiment of the invention, the conductive liquid is a colored liquid.

According to a second aspect of the present invention, there is provided a label making method comprising:

forming a containing cavity on the body;

injecting a conductive liquid into the accommodating cavity to form a conductive body;

conductive contacts are provided at the first end and the second end of the receiving chamber, respectively, and a pair of two conductive contacts are connected to the conductive body.

In one embodiment of the present invention, a receiving cavity is formed on the body, including:

providing a linear mold;

forming the linear mold in the body;

the linear mold and the body are separated to form a receiving cavity within the body.

In one embodiment of the present invention, molding a linear mold into a body includes:

providing a substrate layer;

adding the linear die when the adhesive is adhered on the substrate layer so as to shape part of the linear die in the adhesive;

and after the linear die is separated from the adhesive, a first bonding layer section is formed on the substrate layer, and the first bonding layer section is provided with a groove.

In one embodiment of the present invention, after forming the first adhesive layer segment, the label-making process further comprises:

forming a second bonding layer segment on the first bonding layer segment such that the second bonding layer segment closes the notch of the groove and forms a containment cavity between the first bonding layer segment and the second bonding layer segment.

In one embodiment of the present invention, the label making method further comprises:

bonding the release coating on the substrate layer;

wherein, the adhesive bonds in the substrate layer and deviates from the one side of leaving the type coating, and the body includes first bonding layer section, second bonding layer section, substrate layer and leaves the type coating.

According to a third aspect of the present invention, there is provided a packing method, using the above tag, the packing method comprising:

attaching a label to the opening of the goods package;

obtaining the resistivity between pairs of conductive contacts;

an adhesive tape is arranged on the label.

According to a fourth aspect of the present invention, there is provided a package determining method for determining whether the label is opened from a package opening of a goods, the package determining method comprising:

cutting the adhesive tape arranged on the label to expose the conductive contact;

and acquiring the resistivity between the paired conductive contacts, and comparing the resistivity with the preset resistivity of the conductive contacts to judge whether the label is opened from the opening of the goods package.

According to the label, the conductive liquid is arranged in the containing cavity of the body, the two paired conductive contacts are plugged at the first end part and the second end part of the containing cavity and are connected with the conductive body, and when the label is pasted to the goods packaging opening of the box body, if the label is unpacked, the resistivity between the two conductive contacts is changed relative to the original resistivity, so that whether the package is opened or not can be accurately judged.

Drawings

Various objects, features and advantages of the present disclosure will become more apparent from the following detailed description of preferred embodiments thereof, when considered in conjunction with the accompanying drawings. The drawings are merely exemplary illustrations of the disclosure and are not necessarily drawn to scale. In the drawings, like reference characters designate the same or similar parts throughout the different views. Wherein:

FIG. 1 is a schematic diagram of a structure of a tag according to an exemplary embodiment;

FIG. 2 is a schematic diagram illustrating a partial structure of a label according to an exemplary embodiment;

FIG. 3 is a schematic representation of a bonding of a linear mold and a first adhesive layer segment of a label making process according to an exemplary embodiment;

FIG. 4 is a schematic flow diagram illustrating a method of labeling according to an exemplary embodiment;

FIG. 5 is a schematic flow chart diagram illustrating a method of labeling according to another exemplary embodiment;

FIG. 6 is a flow diagram illustrating a packing method according to an exemplary embodiment;

FIG. 7 is a schematic flow chart diagram illustrating a method of determining packaging according to an exemplary embodiment;

FIG. 8 is a schematic flow diagram illustrating a body molding process according to an exemplary embodiment.

The reference numerals are explained below:

10. a body; 11. an accommodating chamber; 111. a first end portion; 112. a second end portion; 20. an electrical conductor; 30. a conductive contact; 40. a bonding layer; 41. a first bonding layer segment; 42. a second bonding layer segment; 50. a substrate layer; 60. a release coating; 70. a linear mold; 80. and (4) a box body.

Detailed Description

Exemplary embodiments that embody features and advantages of the present disclosure are described in detail below in the specification. It is to be understood that the disclosure is capable of various modifications in various embodiments without departing from the scope of the disclosure, and that the description and drawings are to be regarded as illustrative in nature, and not as restrictive.

In the following description of various exemplary embodiments of the disclosure, reference is made to the accompanying drawings, which form a part hereof, and in which are shown by way of illustration various exemplary structures, systems, and steps in which aspects of the disclosure may be practiced. It is to be understood that other specific arrangements of parts, structures, example devices, systems, and steps may be utilized and structural and functional modifications may be made without departing from the scope of the present disclosure. Moreover, although the terms "over," "between," "within," and the like may be used in this specification to describe various example features and elements of the disclosure, these terms are used herein for convenience only, e.g., in accordance with the orientation of the examples in the figures. Nothing in this specification should be construed as requiring a specific three dimensional orientation of structures in order to fall within the scope of this disclosure.

An embodiment of the present invention provides a tag, please refer to fig. 1 and 2, the tag includes: a body 10, the body 10 having a receiving cavity 11, the receiving cavity 11 including a first end 111 and a second end 112; the conductive body 20, the conductive body 20 is set up in the accommodating cavity 11; conductive contacts 30, the conductive contacts 30 are arranged in pairs, and the two conductive contacts 30 in the pair are respectively arranged at the first end part 111 and the second end part 112 and are connected with the conductive body 20; the conductive body 20 is a conductive liquid.

According to the tag of the embodiment of the invention, the conductive liquid is arranged in the accommodating cavity 11 of the body 10, the two paired conductive contacts 30 are blocked at the first end part 111 and the second end part 112 of the accommodating cavity 11, and the conductive contacts 30 are connected with the conductive body 20, so that when the tag is pasted on the opening of the goods package of the box body 80, if the tag is unpacked, the resistivity between the two conductive contacts 30 is changed relative to the original resistivity, and thus whether the package is opened or not can be accurately judged.

In one embodiment, the conductive body 20 in the accommodating cavity 11 is sealed by two conductive contacts 30 in pair, and whether the conductive liquid in the accommodating cavity 11 is changed or not is determined by measuring the resistivity between the two conductive contacts 30, for example, if the tag is removed by melting the tag at a high temperature, the resistivity between the two conductive contacts 30 is changed relative to the original resistivity. In this case, the electrical conductor 20 is connected to the electrical contact 30, i.e. is electrically conductively connected to it.

In one embodiment, the body 10 includes: the adhesive layer 40, the adhesive layer 40 having a receiving cavity 11, the first end 111 and the second end 112 being open. The adhesive layer 40 can be used to be adhered to the opening of the goods package of the box 80, and the accommodating cavity 11 in the adhesive layer 40 is a storage space with openings at two ends, and the two conductive contacts 30 are blocked at the two openings of the accommodating cavity 11, so as to prevent the liquid in the accommodating cavity 11 from leaking.

In one embodiment, the conductive contact 30 may be directly connected to the open port, or may be filled in the accommodating cavity 11, which is not limited herein, as long as it can perform a plugging function and can be easily measured.

In one embodiment, the adhesive layer 40 is an adhesive layer, i.e. it is prepared from an adhesive (i.e. glue), the adhesive layer 40 being the core of the label. The adhesive is mainly natural rubber, synthetic rubber, acrylate, etc., and special adhesive such as silica gel and EVA (ethylene-vinyl acetate) can be used. The adhesive layer 40 is selected to include a particular adhesive for a particular application depending on the surface material and application requirements. The resistivity between the two conductive contacts 30 changes due to the deformation of the adhesive layer 40 in a predetermined temperature range, i.e., the change in the shape of the receiving cavity 11.

In one embodiment, as shown in fig. 1, the adhesive layer 40 includes: a first bonding layer segment 41; a second bonded layer segment 42, the first bonded layer segment 41 overlapping the second bonded layer segment 42, the first bonded layer segment 41 and the second bonded layer segment 42 forming the containment cavity 11 therebetween.

In one embodiment, a groove is provided on any one of the first bonding layer segment 41 and the second bonding layer segment 42, and after the first bonding layer segment 41 and the second bonding layer segment 42 are overlapped, the groove with the closed notch is the accommodation cavity 11.

In one embodiment, the first bonding layer segment 41 and the second bonding layer segment 42 are made of an isomorphic adhesive material, or the first bonding layer segment 41 and the second bonding layer segment 42 are made of different materials.

In one embodiment, the cross-section of the receiving cavity 11 is polygonal, circular, semicircular or elliptical. When the cross section of the accommodating cavity 11 is semicircular, a groove is formed on the first bonding layer section 41, the groove is semicircular, and the semicircular groove can be easily formed.

In one embodiment, the body 10 further comprises: and a substrate layer 50, the substrate layer 50 being superposed with the adhesive layer 40. The substrate layer 50 is a thin layer of material, and the adhesive (glue) forming the bonding layer 40 is coated on the surface of the substrate layer 50. Substrate layer 50 has many types, like paper, plastic film, bubble cotton, non-woven fabrics, fabric, aluminium foil etc. compares other sticky tapes, and substrate layer 50 has certain heat-insulating properties, avoids the direct sunlight under the sunshine to lead to the adhesive of substrate layer 50 below to take place to melt, also has certain resistance to the seamless disassembly of high temperature of sticky tape simultaneously.

In one embodiment, the body 10 further comprises: the release coating 60 is superposed with the substrate layer 50, and the substrate layer 50 is clamped between the release coating 60 and the bonding layer 40. The release coating 60 is prepared from a release agent, and the outer layer of the substrate layer 50 is attached to a coating layer, so that the label can be stably uncoiled/separated in the using process, and the problem that the glue layer (bonding layer 40) of the previous circle/previous sheet of the label sticks to the surface of the next circle/next sheet of the label is solved.

In one embodiment, the label is composed of a substrate layer 50, a release coating 60, and an adhesive layer 40, wherein the label may be of a tape-like construction, i.e., it is wound on a roll and used section by section during use. Or, every label is exactly the structure that is just similar to a woundplast, all is independent use, so the label can also include other layers that cover tie coat 40, directly tear off other layers when using can, other layers can be like the type coating 60 that leaves like above, leave type coating 60 and tie coat 40 and laminate mutually, will tear off from type coating 60 during the use.

In one embodiment, the accommodating cavities 11 are multiple, the accommodating cavities 11 are arranged at intervals, and the electric conductors 20 are arranged in the accommodating cavities 11 and correspond to the two paired electric contacts 30. The plurality of cavities 11 are arranged to obtain the resistivity of the plurality of sets of electrical conductors 20, thereby facilitating subsequent resistivity comparison.

In one embodiment, the conductive liquid is a colored liquid. The conductive liquid may be an aqueous solution of an acid-base salt substance, such as an aluminum chloride solution, an aluminum nitrate solution, a sodium chloride solution (a salt solution), a silver nitrate solution, an iron chloride solution, a copper nitrate solution, a ferrous chloride solution, a sodium carbonate solution, a sodium nitrate solution, a sodium sulfate solution, a potassium sulfate solution, and a potassium carbonate solution, and by dissolving a colored liquid in the conductive liquid, if the label is unsealed, that is, when the accommodating cavity 11 is broken, a user can more obviously see whether the label is broken.

An embodiment of the present invention further provides a label manufacturing method, please refer to fig. 4, where the label manufacturing method includes: a housing cavity 11 is formed on the body 10; injecting a conductive liquid into the accommodating cavity 11 to form a conductive body 20; the conductive contacts 30 are provided at the first end 111 and the second end 112 of the accommodation chamber 11, respectively, and the paired two conductive contacts 30 are connected to the conductive body 20.

In one embodiment, a receiving cavity 11 is formed on the body 10, including: providing a linear mold 70; molding the linear mold 70 in the body 10; the linear mold 70 and the body 10 are separated to form the accommodation chamber 11 in the body 10. The linear mold 70 is used for forming the accommodating cavity 11 filled with the conductive liquid in the body 10, and the specific structure thereof may be determined according to the shape requirement of the accommodating cavity 11.

In one embodiment, molding the line mold 70 into the body 10 includes: providing a substrate layer 50; adding the linear mold 70 when the adhesive is adhered on the substrate layer 50 so as to shape part of the linear mold 70 in the adhesive; after the linear mold 70 is separated by the adhesive, the first bonding layer segment 41 is formed on the substrate layer 50, and the first bonding layer segment 41 has a groove. The bonding of the substrate layer 50 and the adhesive is mainly achieved by treating the adhesive at a high temperature, and the linear mold 70 on the adhesive is wrapped by the adhesive, so as to form the groove on the first bonding layer segment 41. The first bonding layer segment 41 is an adhesive layer, i.e. it is prepared from an adhesive (i.e. glue). The adhesive is mainly natural rubber, synthetic rubber, acrylate, etc., and special adhesive such as silica gel and EVA (ethylene-vinyl acetate) can be used. Substrate layer 50 has many types, like paper, plastic film, bubble cotton, non-woven fabrics, fabric, aluminium foil etc. compares other sticky tapes, and substrate layer 50 has certain heat-insulating properties, avoids the direct sunlight under the sunshine to lead to the adhesive of substrate layer 50 below to take place to melt, also has certain resistance to the seamless disassembly of high temperature of sticky tape simultaneously.

In one embodiment, as shown in fig. 3, the first bonding layer segment 41 is formed by positioning the linear mold 70 inside the first bonding layer segment 41 during the molding process, and forming a groove on one surface of the linear mold 70 after separating the linear mold 70.

In one embodiment, after forming the first adhesive layer segment 41, the label making method further comprises: the second bond layer segment 42 is formed on the first bond layer segment 41 such that the second bond layer segment 42 closes the notch of the groove and forms the containment cavity 11 between the first bond layer segment 41 and the second bond layer segment 42. The second adhesive layer segment 42 is used to close the notch of the groove and is used to adhere to the opening of the cargo package of the carton 80. The second bonding layer segment 42 is an adhesive layer, i.e. it is prepared from an adhesive (i.e. glue). The adhesive is mainly natural rubber, synthetic rubber, acrylate, etc., and special adhesive such as silica gel and EVA (ethylene-vinyl acetate) can be used.

In one embodiment, the label making method further comprises: the release coating 60 is bonded to the substrate layer 50; wherein, the adhesive bonds in the substrate layer 50 and deviates from the one side of leaving from the coating 60, and the body 10 includes first bonding layer section 41, second bonding layer section 42, substrate layer 50 and leaves from the coating 60. The release coating 60 may be provided on the substrate layer 50 before the first adhesive layer segment 41 is formed, or may be provided on the substrate layer 50 after any one of the first adhesive layer segment 41 and the second adhesive layer segment 42 is formed. The release coating 60 is prepared from a release agent, and the outer layer of the substrate layer 50 is attached to a coating layer, so that the label can be stably uncoiled/separated in the using process, and the problem that the glue layer (bonding layer 40) of the previous circle/previous sheet of the label sticks to the surface of the next circle/next sheet of the label is solved.

In one embodiment, as shown in fig. 5, the label making method includes:

providing a substrate layer 50;

the release coating 60 is bonded to the substrate layer 50;

adding the linear die 70 when the adhesive is adhered on the substrate layer 50;

after the linear mold 70 is separated by the adhesive, a first bonding layer segment 41 is formed on the substrate layer 50;

forming a second bonding layer segment 42 on the first bonding layer segment 41;

injecting a conductive liquid into the accommodating cavity 11 to form a conductive body 20;

the conductive contacts 30 are provided at the first end 111 and the second end 112 of the accommodation chamber 11, respectively, and the paired two conductive contacts 30 are connected to the conductive body 20.

In one embodiment, the first bonding layer segment 41 and the line mold 70 are highly shaped before the line mold 70 is separated by the adhesive. Namely, the first bonding layer segment 41 and the linear mold 70 are separated after the linear mold 70 is set.

In one embodiment, the first bonding layer segment 41 and the second bonding layer segment 42 are bonded at a low temperature (which can stabilize the bonding of the first bonding layer segment 41 and the second bonding layer segment 42 without deforming the recess, resulting in the adhesive entering the receiving cavity 11).

In one embodiment, when the conductive liquid is filled into the accommodating cavity 11, the ports (the first end 111 and the second end 112) of the accommodating cavity 11 are vertically upward, the liquid flows into one port under the action of gravity, and after the accommodating cavity is filled with the conductive liquid, the excess liquid flows out from the other port, so that whether the accommodating cavity is filled with the conductive liquid can be judged. Wherein, the conductive liquid is colored liquid.

In one embodiment, the conductive contacts 30 are used for connecting an external detection device for testing the resistivity of the conductive liquid, the resistivity between every two adjacent conductive contacts 30 is fixed and is determined by the length and the sectional area of the interlayer set when the digital label is shipped and the resistance of the built-in liquid. The interlayer (the accommodating cavity 11) is a superfine semicircular interlayer (the semicircle is convenient for the generation of a mold during production, and the upper and lower adhesive layers are fused into a whole, so that a specific factory can be authorized to process the digital label only, and the counterfeiting is prevented). When the digital label is melted at high temperature, the original liquid interlayer structure can be damaged, so that the resistivity of the digital label is changed, or the conductive liquid of the interlayer is lost, so that the resistivity is infinite. And when the difference between the plurality of groups of contacts and the preset resistivity is extremely large, the digital label is considered to be fused and damaged. The conductive liquid is colored liquid, and when the interlayer is damaged, a user can obviously see whether the interlayer is damaged or not.

In one embodiment, as shown in fig. 8, the flow of stacking the first bonding layer segment 41, the second bonding layer segment 42, the substrate layer 50, and the release coating 60 of the body 10, the release coating 60 is stacked on the substrate layer 50, the first bonding layer segment 41 is stacked on the substrate layer 50, and finally the second bonding layer segment 42 is stacked on the first bonding layer segment 41.

An embodiment of the present invention further provides a packing method, using the above tag, please refer to fig. 6, where the packing method includes: attaching a label to the opening of the goods package; obtaining the resistivity between pairs of conductive contacts 30; an adhesive tape is arranged on the label.

In one embodiment, the package is packaged by first attaching a digital label to the opening of the package of goods. And connecting the contacts of the digital label by using an external detection device to obtain a plurality of groups of resistivity (ohm) of the digital label. And storing the obtained multiple groups of resistivity into a linear table, and uploading the linear table to a background system (the resistivity of each group of the tags is different). The adhesive tape is placed on the digital label, so that the digital label is prevented from being maliciously taken down or lost, meanwhile, the contact of the digital label can be protected, and the packaging process is completed. The above process is repeated if the bottom of the cargo has an opening.

An embodiment of the present invention further provides a package determining method, configured to determine whether the label is opened from the opening of the package of the goods, and referring to fig. 7, the package determining method includes: cutting the tape disposed on the label to expose the conductive contacts 30; the resistivity between the pairs of conductive contacts 30 is obtained and compared with the preset resistivity of the conductive contacts 30 to determine whether the label is opened from the opening of the cargo package.

In one embodiment, the preset resistivity is the resistivity (ohms) of the digital label obtained when packaged.

In one embodiment, the consignee and terminal dispenser would cut the tape location where the conductive contacts 30 are located when receiving the item, leaving the conductive contacts 30 of the digital label exposed. The conductive contacts 30 of the digital label are connected by an external detection device to obtain a plurality of groups of resistivity (ohm meters) of the digital label. And storing the obtained multiple groups of resistivity into a linear table, and uploading the linear table to a background system. The background system compares the two sets of linear tables when packaging and when receiving goods. The background system uses a linear table of cosine similarity versus resistivity (which results in a difference in resistivity because the ambient temperature at the time of packaging and receipt may be different). If the similarity is less than the predetermined threshold, the digital label is considered to be damaged, otherwise, the digital label is intact.

Cosine similarity formula:

wherein x is_nFor multiple sets of resistivity, y, in the case of packaging_nMultiple sets of resistivities at the time of shipment.

In one embodiment, the consignee and the terminal delivery personnel may visually observe whether the digital label of the box 80 is damaged, and if so, ignore the steps.

Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and exemplary embodiments be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.

Claims

1. A label, comprising:

a body (10), the body (10) having a receiving cavity (11), the receiving cavity (11) comprising a first end (111) and a second end (112);

an electrical conductor (20), the electrical conductor (20) being disposed within the housing cavity (11);

conductive contacts (30), wherein the conductive contacts (30) are arranged in pairs, and the two conductive contacts (30) in a pair are respectively arranged at the first end part (111) and the second end part (112) and are connected with the conductive body (20);

wherein the conductive body (20) is a conductive liquid.

2. The label according to claim 1, characterized in that said body (10) comprises:

an adhesive layer (40), the adhesive layer (40) having the receiving cavity (11), the first end portion (111) and the second end portion (112) being open.

3. The label according to claim 2, characterized in that the adhesive layer (40) comprises:

a first bonding layer segment (41);

a second adhesive layer segment (42), the first adhesive layer segment (41) overlapping the second adhesive layer segment (42), the first adhesive layer segment (41) and the second adhesive layer segment (42) forming the containment cavity (11) therebetween.

4. The tag according to claim 2, characterized in that said body (10) further comprises:

a substrate layer (50), the substrate layer (50) overlying the tie layer (40).

5. The tag according to claim 4, characterized in that said body (10) further comprises:

from type coating (60), from type coating (60) with substrate layer (50) looks superpose, substrate layer (50) press from both sides and locate from type coating (60) with between tie coat (40).

6. The tag according to any one of claims 1 to 5, wherein the accommodating cavities (11) are plural, a plurality of accommodating cavities (11) are arranged at intervals, and the conductive bodies (20) are arranged in the plural accommodating cavities (11) and correspond to the paired two conductive contacts (30).

7. The label of claim 1, wherein the conductive liquid is a colored liquid.

8. A method of making a label, comprising:

a containing cavity (11) is formed on the body (10);

injecting a conductive liquid into the accommodating cavity (11) to form a conductive body (20);

conductive contacts (30) are provided at a first end (111) and a second end (112) of the accommodation chamber (11), respectively, and the conductive contacts (30) are connected to the conductor (20) in pairs.

9. Method for making labels according to claim 8, characterized in that forming a housing (11) on the body (10) comprises:

providing a linear die (70);

-moulding a linear mould (70) within the body (10);

separating the wire-shaped mold (70) and the body (10) to form the housing cavity (11) in the body (10).

10. The method of claim 9, wherein molding a linear mold (70) into the body (10) comprises:

providing a substrate layer (50);

adding the linear mold (70) when an adhesive is bonded on the substrate layer (50) so as to shape part of the linear mold (70) in the adhesive;

after the linear mold (70) is separated from the adhesive, a first bonding layer section (41) is formed on the substrate layer (50), and the first bonding layer section (41) is provided with a groove.

11. The label making method according to claim 10, wherein after forming said first adhesive layer segment (41), said label making method further comprises:

forming a second bonding layer segment (42) on the first bonding layer segment (41) such that the second bonding layer segment (42) closes the notch of the groove and forms the containment cavity (11) between the first bonding layer segment (41) and the second bonding layer segment (42).

12. The method of claim 11, further comprising:

bonding a release coating (60) to the substrate layer (50);

wherein the adhesive is bonded to a side of the substrate layer (50) facing away from the release coating (60), the body (10) comprising the first bonding layer segment (41), the second bonding layer segment (42), the substrate layer (50) and the release coating (60).

13. A packaging method, characterized in that, with the tag of any one of claims 1 to 7, the packaging method comprises:

attaching the label to an opening of a package of goods;

obtaining a resistivity between pairs of said conductive contacts (30);

and arranging an adhesive tape on the label.

14. A package judging method for judging whether the label according to any one of claims 1 to 7 is opened from a package opening of a good, the package judging method comprising:

cutting the adhesive tape disposed on the label to expose the conductive contacts (30);

and acquiring the resistivity between the paired conductive contacts (30), and comparing the resistivity with the preset resistivity of the conductive contacts (30) to judge whether the label is opened from the opening of the goods package.