CN111187703B - Chip clamping device and nucleic acid detection system - Google Patents

Chip clamping device and nucleic acid detection system Download PDF

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Publication number
CN111187703B
CN111187703B CN202010108161.8A CN202010108161A CN111187703B CN 111187703 B CN111187703 B CN 111187703B CN 202010108161 A CN202010108161 A CN 202010108161A CN 111187703 B CN111187703 B CN 111187703B
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chip
cover plate
lifting
holding device
assembly
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CN111187703A (en
Inventor
张师音
黄绍磊
纪军豪
张剑滨
曾俊添
陈杨辉
翁祖星
宋浏伟
张东旭
葛胜祥
张军
夏宁邵
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Xiamen Innodx Biotech Co ltd
Xiamen University
Beijing WanTai Biological Pharmacy Enterprise Co Ltd
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Xiamen Innodx Biotechnology Co ltd
Xiamen University
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    • CCHEMISTRY; METALLURGY
    • C12BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
    • C12QMEASURING OR TESTING PROCESSES INVOLVING ENZYMES, NUCLEIC ACIDS OR MICROORGANISMS; COMPOSITIONS OR TEST PAPERS THEREFOR; PROCESSES OF PREPARING SUCH COMPOSITIONS; CONDITION-RESPONSIVE CONTROL IN MICROBIOLOGICAL OR ENZYMOLOGICAL PROCESSES
    • C12Q1/00Measuring or testing processes involving enzymes, nucleic acids or microorganisms; Compositions therefor; Processes of preparing such compositions
    • C12Q1/68Measuring or testing processes involving enzymes, nucleic acids or microorganisms; Compositions therefor; Processes of preparing such compositions involving nucleic acids

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  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
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  • Wood Science & Technology (AREA)
  • Proteomics, Peptides & Aminoacids (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microbiology (AREA)
  • Immunology (AREA)
  • Physics & Mathematics (AREA)
  • Molecular Biology (AREA)
  • Biotechnology (AREA)
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  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Genetics & Genomics (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)

Abstract

The invention discloses a chip clamping device and a nucleic acid detection system, and relates to the field of microbiology equipment. The chip clamping device comprises a mounting seat, a lifting mechanism and a bearing component. The lifting mechanism comprises a fixing part and a lifting part, the fixing part is installed on the installation seat, and the lifting part is installed on the fixing part in a lifting mode. The bearing part is provided with a mounting groove for mounting the chip and is fixedly connected with the lifting part. Above-mentioned technical scheme conveniently realizes centre gripping, the lift of chip to make chip and follow-up operation subassembly mutually support.

Description

Chip clamping device and nucleic acid detection system
Technical Field
The invention relates to the field of microbiology equipment, in particular to a chip clamping device and a nucleic acid detection system.
Background
The nucleic acid detection technology is a technology for directly detecting genetic materials of a living body, such as DNA and RNA. The nucleic acid detection technology has extremely high specificity and sensitivity, short window period and multiple detection capability. However, the nucleic acid detection process is very complex, the steps are many, and the requirements on detection environment, laboratory conditions and personnel skill level are very high. Therefore, the development trend of nucleic acid detection is immediate detection and random detection. In the field of in vitro diagnosis, such small-sized, portable, fast and simple, and instant-to-place detection means are called Point-of-care Test (POCT), which are also called bedside detection, field detection, and the like.
Disclosure of Invention
The invention provides a chip clamping device and a nucleic acid detection system.
Some embodiments of the present invention provide a chip holding apparatus, including:
a mounting seat;
the lifting mechanism comprises a fixing part and a lifting part, the fixing part is mounted on the mounting seat, and the lifting part is mounted on the fixing part in a lifting manner; and
and the bearing part is provided with a mounting groove for mounting the chip, and the bearing part is fixedly connected with the lifting part.
In some embodiments, the load bearing member comprises:
a base plate attached to the lifting unit; the bottom plate is provided with a first concave part; and
the cover plate is detachably connected with the bottom plate; the cover plate is provided with a second concave part; the first inner concave part and the second inner concave part jointly form the mounting groove, and the top of the mounting groove is open.
In some embodiments, the load bearing member further comprises:
the first clamping component is arranged on the bottom plate or the cover plate; and
the second clamping component is arranged on the cover plate or the bottom plate;
wherein the first and second retaining assemblies are configured to cooperate together to retain the chip in a first direction that intersects a lifting direction of the lifting portion.
In some embodiments, the first retaining assembly comprises:
the first elastic mechanism extends and retracts along the first direction.
In some embodiments, the first resilient mechanism comprises a wave ball screw.
In some embodiments, the bead screws are arranged in a dispersed manner.
In some embodiments, the second retaining assembly comprises:
the second elastic mechanism is arranged on the cover plate; and
the propping piece is contacted or connected with the second elastic mechanism;
the abutting piece and the first elastic mechanism clamp the chip together in a first direction.
In some embodiments, the extending and retracting direction of the second elastic mechanism is a second direction, and the second direction is perpendicular to the first direction and intersects with the lifting direction of the lifting portion.
In some embodiments, the cover plate is provided with a third inner concave portion, the second elastic mechanism is fixed or placed in the third inner concave portion, the abutting part is partially located in the third inner concave portion, and the abutting part is in contact with the second elastic mechanism.
In some embodiments, the load bearing member further comprises:
a third clamping assembly mounted to the base plate, the third clamping assembly configured to clamp the chip in a second orientation in common with the cover plate; alternatively, the third clamping assembly is mounted to the cover plate, the third clamping assembly being configured to clamp the chip in a second direction in common with the base plate; wherein the second direction is perpendicular to the first direction and intersects with a lifting direction of the lifting part.
In some embodiments, the third clamping component comprises a wave ball screw.
In some embodiments, the cover plate is provided with a first through hole configured to correspond to a suction port of the chip.
In some embodiments, the cover plate is provided with a second through hole configured to correspond to a rotary valve of the chip.
In some embodiments, the fixed portion comprises a lead screw, and the lifting portion comprises a slide, the slide being in threaded engagement with the lead screw; wherein, the bearing part is fixed on the sliding table.
In some embodiments, the chip holding device further comprises:
a position detection assembly configured to detect a position of the carrier.
In some embodiments, the position detection component comprises:
a position detection sensor mounted on the fixed portion; and
the detection piece is fixed on the bearing component or the lifting part and comprises a detection part which is used for extending into the detection area of the position detection sensor.
In some embodiments, the position detection assembly further comprises:
the sensor mounting seat is fixedly connected with the fixing part;
wherein the position detection sensor mounting position is adjustably mounted to the sensor mount.
In some embodiments, the first concave portion includes a first receiving groove and a second receiving groove that are in communication; the depth of the first accommodating groove is greater than that of the second accommodating groove.
In some embodiments, the cover plate is provided with a guide table provided with a first guide surface configured to guide the chip inserted into the mounting groove.
In some embodiments, the guide table is provided with a second guide surface configured to guide the chip away from the mounting slot.
In some embodiments, the cover plate is provided with a support table configured to support a bottom surface of the reservoir of the chip.
Some embodiments of the present invention further provide a nucleic acid detecting system, including a chip and the chip holding device provided by any one of the technical solutions of the present invention, wherein the chip is mounted in the mounting groove.
According to the chip clamping device provided by the technical scheme, the lifting mechanism is matched with the bearing part, so that the chip is conveniently clamped and lifted, the chip is matched with the subsequent operation assembly, and the subsequent detection operation is further completed.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention. In the drawings:
FIG. 1 is a perspective view of a chip holding device according to some embodiments of the present invention;
FIG. 2 is a perspective view of a lifting mechanism of a chip holding device according to some embodiments of the present invention;
FIG. 3 is a schematic diagram of a chip held by the chip holding apparatus according to some embodiments of the present invention;
FIG. 4 is a perspective view of a carrier of a chip holding device according to some embodiments of the invention;
FIG. 5 is a schematic structural diagram of a partial structure of a bottom plate, a chip and a cover plate of a carrier of a chip holding apparatus according to some embodiments of the present invention;
FIG. 6 is a schematic front view of a carrier base plate of a chip holding apparatus according to some embodiments of the present invention;
FIG. 7 is a schematic view of a carrier substrate and a chip configuration of a chip holding apparatus according to some embodiments of the present invention;
FIG. 8 is a schematic view of a first retaining mechanism of a chip holding apparatus according to some embodiments of the present invention;
FIG. 9 is a perspective view of a carrier cover plate of a chip holding apparatus according to some embodiments of the present invention;
FIG. 10 is a perspective view of a carrier cover plate of a chip holding device without a second retaining assembly according to some embodiments of the present invention;
FIG. 11 is a schematic front view of a carrier cover plate of a chip holding device without a second retaining assembly according to some embodiments of the present invention;
FIG. 12 is a schematic cross-sectional view of a second retaining assembly of the carrier cover of the chip holding device according to some embodiments of the invention;
FIG. 13 is a schematic front view of a chip holding device according to some embodiments of the present invention;
FIG. 14 is a perspective view of a chip holding device according to another embodiment of the present invention;
FIG. 15 is a schematic front view of a chip holding device according to another embodiment of the present invention;
FIG. 16 is a perspective view of a carrier of a chip holding apparatus according to another embodiment of the invention;
FIG. 17 is a perspective view of a carrier substrate of a chip holding apparatus according to another embodiment of the invention;
FIG. 18 is a schematic view of the bottom plate of the carrier of the chip holding apparatus according to another embodiment of the present invention engaging with a chip;
FIG. 19 is a schematic view of the cover plate and chip engaging portion of the carrier of a chip holding apparatus according to another embodiment of the present invention;
FIG. 20 is a perspective view of a cover plate of a chip holding device according to another embodiment of the present invention;
FIG. 21 is another perspective view of a cover plate of a chip holding device according to another embodiment of the present invention;
fig. 22 is a side cross-sectional view of a chip holding device according to another embodiment of the invention in a use state.
Detailed Description
The technical solution provided by the present invention will be explained in more detail with reference to fig. 1 to 22.
In order to realize the rapid detection of nucleic acid, the micro-fluidic technology integrates the fussy nucleic acid detection flow on the chip 80 which is provided with micro-sized flow channels and cavities and arranged in a certain rule, different biological reagents are released according to a certain sequence and flow to the designated cavity through different flow channels to finish various biochemical reactions, and finally the rapid and accurate detection of nucleic acid is realized. Thanks to the realization form, the nucleic acid detection based on the microfluidic technology has the advantages of full automation, high integration, simplicity, rapidness, small cross contamination, independent use in various environments, no need of highly specialized personnel and the like, and accords with the concept and the requirement of rapid detection.
Referring to fig. 1 to 13, some embodiments of the present invention provide a chip holding apparatus including a mounting base 21, a lifting mechanism 22, and a bearing member 23. The lifting mechanism 22 includes a fixing portion 221 and a lifting portion 222, the fixing portion 221 is attached to the mounting base 21, and the lifting portion 222 is attached to the fixing portion 221 so as to be capable of lifting. The carrier member 23 is provided with a mounting groove 230 for mounting the chip 80, and the carrier member 23 is fixedly connected to the elevating portion 222.
The mounting seat 21 is formed by a vertical plate or by a vertical plate and a flat plate. In some embodiments, mount 21 employs a riser. The vertical plate is adopted to facilitate installation of the lifting mechanism 22, and the installation points of the vertical plate and the lifting mechanism 22 can be more, so that the structural stability of the chip clamping device is enhanced.
The fixing portion 221 includes a screw, the lifting portion 222 includes a sliding table, the sliding table is provided with a threaded through hole, the screw passes through the threaded through hole, and the sliding table and the screw form a thread clearance fit. Wherein the carrier member 23 is fixed to the slide table.
When the sliding table needs to be lifted, the motor drives the screw rod to rotate, and the sliding table connected with the screw rod moves up and down relative to the screw rod, so that the bearing part 23 fixed with the sliding table is driven to lift up and down synchronously. When the carrier 23 is raised to a set position, the operator inserts the chip 80 into the mounting groove 230 of the carrier 23. After the chip 80 is installed in place, the slide table drives the bearing part 23 and the chip 80 to descend to a set position, so that the chip 80 is matched with other modules of the whole nucleic acid detection system, and the whole nucleic acid detection operation is completed. The lead screw is matched with the sliding table, so that the accurate control of the lifting stroke of the bearing part 23 is realized.
Alternatively, the fixing unit 221 may be a motor-driven slide rail, and the elevating unit 222 may be a slider. The slider is arranged inside the electric slide rail in a sliding manner, and the bearing part 23 is lifted and descended by driving the slider to move horizontally relative to the electric slide rail.
Referring to fig. 1 and 2, in some embodiments, the chip holding apparatus further includes a position detection assembly 24, and the position detection assembly 24 is configured to detect the position of the carrier 23. The position of the carrier 23 is related to the position of the chip 80. After the chip 80 reaches the set position, subsequent operations such as rotating the valve position of the rotary valve 803 of the chip 80, puncturing the seals at the upper and lower ends of the reservoir chamber of the chip 80, and the like are performed.
Referring to fig. 2, in some embodiments, the position detection assembly 24 includes a position detection sensor 241 and a detection piece 242. The position detection sensor 241 is attached to the fixing portion 221. The detecting member 242 is fixed to the supporting member 23 or the elevating portion 222, and the detecting member 242 includes a detecting portion extending into a detection area of the position detecting sensor 241.
As shown in fig. 2, position detection sensors 241 are attached to both ends of the fixing portion 221, and detect the extreme position at which the elevating portion 222 ascends and the extreme position at which it descends, respectively. The detecting member 242 ascends and descends in synchronization with the ascending and descending portion 222, and the detecting member 242 is configured in a bent plate shape. When the detecting piece 242 ascends to the detection area of the position detecting sensor 241 located at the upper portion along with the ascending and descending portion 222, the free end of the detecting piece 242 is located in the detection opening of the upper position detecting sensor 241. When the detecting member 242 descends to the detection area of the position detecting sensor 241 located at the lower portion along with the ascending and descending portion 222, the free end of the detecting member 242 is located in the detection opening of the lower position detecting sensor 241.
Referring to fig. 2, in some embodiments, the position detecting assembly 24 further includes a sensor mount 243, and the sensor mount 243 is fixedly connected to the fixing portion 221. A separate bracket-mounted sensor mount 243 may be provided or the sensor mount 243 may be directly fixedly coupled to the fixing portion 221. The position detection sensor 241 is mounted to the sensor mount 243 in an adjustable position.
Further, the position detecting assembly 24 further includes a mounting rail 244, the sensor mounting base 243 is mounted on the mounting rail 244, and the mounting rail 244 is fixedly connected to the fixing portion 221. Wherein the position of the position detecting sensor 241 is adjustably mounted on the mounting rail 244 with the sensor mount 243.
Once installed, the sensor mount 243 is fixed in position relative to the fixed portion 221. In the process of detecting the position of the carrier member 23, since the position detection sensor 241 is fixed on the sensor mount 243, the mounting position of the position detection sensor 241 is not changed. However, when initially attaching the sensor mount 243, the attachment position of the sensor mount 243 to the fixing portion 221 may be set as necessary. The installation guide 244 is provided to facilitate more convenient adjustment of the initial installation position of the sensor mount 243.
Referring to fig. 2, the fixing part 221 is provided with a first stopper 223 and a second stopper 224. The first stopper member 223 is used to limit the limit position at which the carrier member 23 ascends, and the second stopper member 224 is used to limit the limit position at which the carrier member 23 descends. According to the chip holding device provided by the above technical scheme, the bearing part 23 is lifted to the set position, and the mounting groove 230 is far away from other parts of the nucleic acid detection system, so that the chip 80 can be conveniently loaded through the opening at the top of the mounting groove 230. After the chip 80 is mounted in place, the carrier 23 is lowered to a predetermined position to cooperate with a nucleic acid extracting device of a nucleic acid detecting system to perform subsequent operations such as nucleic acid extraction and analysis.
Before describing the implementation of the carrier 23, the specific structure of the chip 80 will be described.
Referring to fig. 3, the chip 80 includes a chip body 801 and an amplification part 802 fixedly connected or integrated with the chip body 801. The chip 80 is provided with a plurality of cavities and flow channels therein. The cavity comprises a liquid storage cavity, a reaction cavity and a waste liquid cavity. The amplification section 802 is provided with an amplification chamber. Specifically, a reservoir is provided at the top of the chip 80, and the reservoir includes a plurality of independent sub-chambers, each for storing a fluid. The fluid includes a sample and a reagent. These sub-chambers are each in communication with the rotary valve 803 via separate flow passages. The amplification cavity and the reaction cavity are respectively positioned at two sides of the chip body 801. The waste liquid cavity is located below the reaction cavity and at the bottom of the chip body 801.
The rotary valve 803 is used to control two of the liquid storage chamber, the reaction chamber, the amplification chamber and the waste liquid chamber to be in a conducting state. For example, any sub-cavity of the liquid storage cavity is controlled to be communicated with the reaction cavity, the amplification cavity is controlled to be communicated with the reaction cavity, and the reaction cavity is controlled to be communicated with the waste liquid cavity.
The valve position of the rotary valve 803 is switched by an external driving part to control the communication state of the different chambers inside the chip 80. If the reagent in the liquid storage cavity needs to be drained to the reaction cavity, the rotary valve 803 is rotated to the valve position where the liquid storage cavity is communicated with the reaction cavity, and the reagent flows to the rotary valve 803 from the liquid storage cavity under the action of the self gravity of the reagent or the action force of the suction part, and then flows to the reaction cavity through the rotary valve 803. If the reagent in the reaction chamber needs to be drained to the waste liquid chamber, the rotary valve 803 is rotated to a valve position where the reaction chamber is communicated with the waste liquid chamber, and the reagent in the reaction chamber can be pumped to the rotary valve 803 by means of a syringe pump and then pumped to the waste liquid chamber. If it is necessary to drain the reagent in the amplification chamber to the waste liquid chamber, the rotary valve 803 is rotated to a valve position where the amplification chamber communicates with the waste liquid chamber, and the reagent in the amplification chamber can be pumped to the rotary valve 803 by means of a syringe pump and then to the waste liquid chamber.
Referring to fig. 1 to 12, the bearing member 23 includes a bottom plate 231 and a cover plate 232. The base plate 231 is attached to the elevating unit 222 and ascends and descends in synchronization with the elevating unit 222. The cover plate 232 is detachably connected to the base plate 231, such as a snap connection or a screw connection. As shown in fig. 5, the left and right edges of the base plate 231 and the cover plate 232 are provided with screw holes 236, and the base plate 231 and the cover plate 232 are provided with four screw holes 236, respectively. The positions of the screw holes 236 of the bottom plate 231 and the cover plate 232 correspond to each other. The base plate 231 and the cover plate 232 are detachably coupled together by bolts through the screw holes 236.
The base plate 231 is provided with a first inner recess 2311. The cover plate 232 is provided with a second inner recess 2321. The first and second concave portions 2311 and 2321 are arranged at positions, shapes, and sizes that match each other. The first and second inner recesses 2311 and 2321 together form the mounting groove 230. The mounting slot 230 is used to receive a majority of the chip 80. As shown in fig. 5, the top of the chip 80 may be exposed to the mounting groove 230 for facilitating subsequent puncturing operations. The top of the mounting groove 230 is open so that the chip 80 can be easily inserted into the mounting groove 230 through the opening at the top of the loading groove 230.
As shown in fig. 4 to 6, the bottom plate 231 has a substantially 7-shaped configuration. The first concave portion 2311 of the bottom plate 231 is located at the top of the bottom plate 231, and the thickness of the bottom and left sides of the bottom plate 231 is larger, and the first concave portion 2311 is not provided. The left side edge of the base plate 231 is provided with two screw holes 236, and the right side edge of the base plate 231 is also provided with two screw holes 236.
Referring to fig. 4 to 6, the bottom plate 231 is provided with an arc-shaped guide structure 2312 at the lower right corner, and the arc-shaped guide structure 2312 enables the chip 80 to be quickly and accurately inserted into the bottom of the bearing part 23.
With continued reference to fig. 6, the bottom of the bottom plate 231 is provided with four connecting holes 237, and the bottom plate 231 and the sliding table of the lifting mechanism 22 are fixed together through the connecting holes 237, so as to realize that the bearing component 23 is lifted synchronously along with the sliding table.
In some embodiments, the carrier 23 further includes a first catch assembly 233 and a second catch assembly 234. The first chucking assembly 233 is mounted to the base plate 231 or the cover plate 232. The second retaining assembly 234 is mounted to the cover plate 232 or the base plate 231. The first and second retaining members 233, 234 may be mounted to the base 231, to the cover 232, or to different parts of both the base 231 and the cover 232. Wherein the first and second chucking assemblies 233 and 234 are configured to cooperate together to chuck the chip 80 in the first direction X. The first direction X intersects with the lifting direction of the lifting unit. In some embodiments, the first direction X is perpendicular to the lifting direction of the lifting part 222, i.e., the insertion and extraction direction of the chip 80. The first direction X is specifically a horizontal direction, see the left-right direction illustrated in fig. 3.
Referring to fig. 3 to 6, the first clamping member 233 abuts against the side a of the reaction chamber of the chip 80, the second clamping member 234 abuts against the side B of the amplification part 802 of the chip 80, and the second clamping member 234 abuts against the middle part of the chip body 801 instead of the amplification part 802. Taking the orientation shown in fig. 3 as an example, the first clamping member 233 abuts against the chip 80 on the left side, and the second clamping member 234 abuts against the chip 80 on the right side. The opposing force exerted by the first and second chucking members 233 and 234 on the chip 80 is in opposite directions, thereby functioning to chuck the chip 80 in the first direction X.
Referring to fig. 1 to 4, a plurality of first catching assemblies 233 may be provided, and the plurality of first catching assemblies 233 are arranged at intervals in a vertical direction of the base plate 231 or the cover plate 232, i.e., in a lifting direction Y of the lifting part 222. The number of the second holding members 234 may also be plural, and a plurality of the second holding members 234 are also arranged at intervals in the above-mentioned lifting direction Y. The number of first catch members 233 and second catch members 234 may be equal or unequal. The height and the distance between the first and second retaining members 233 and 234 can be set in various ways, and are not limited herein.
As shown in FIG. 6, the bottom plate 231 is substantially 7-shaped. In order to simplify the installation position of the first catching member 233, the first catching member 233 may be installed at the left side wall of the installation groove 230. First clip assembly 233 is configured to apply a force to chip 80 in a right direction.
Referring to fig. 6 to 8, in some embodiments, the first catch assembly 233 includes a first elastic mechanism 2331, and the extension and retraction direction of the first elastic mechanism 2331 is along a first direction X.
Referring to fig. 6 and 7, in some embodiments, the first resilient mechanism 2331 comprises a wave ball screw. The bobble-ball screw includes a body 2331a, a spring 2331b, and a bead 2331 c. The body 2331a is provided with a catch 2331d, a spring 2331b is mounted inside the catch 2331d, and a bead 2331c abuts against the spring 2331 b. A portion of beads 2331c are positioned outside of pocket 2331d and the exposed portion is in abutting contact with the sidewalls of chip 80, thereby applying a rightward abutting force to the sides of chip 80.
Referring to fig. 6 to 8, in some embodiments, a plurality of wave ball screws are arranged in a dispersed manner. The left edge of the first inner recess 2311 of the bottom plate 231 is disposed with three first elastic mechanisms 2331, and the three first elastic mechanisms 2331 are spaced apart to apply rightward force to different positions of the left edge of the chip 80. Since there are a plurality of force applying positions of the first elastic mechanism 2331 to the left edge of the chip 80, and the force applying positions are distributed, the force applied to the chip 80 is more uniform.
In some embodiments, there are 3 screw holes on the bottom plate 231 and the cover plate 232, and the screw holes are used for mounting bead screws. The wave ball screws on the side walls of the base plate 231 make the left and right sides of the chip 80 closely contact with the inner wall of the base plate 231, and the wave ball screws mounted on the cover plate 232 make the front and rear sides of the chip 80 closely contact with the inner wall of the base plate 231.
An implementation of the second catch assembly 234 is described below.
As shown in FIG. 3, the amplification part 802 where the amplification chamber is located is shown as protruding from the other region of the chip body 801 as a whole. Therefore, when holding the chip 80, the chip body 801 is mainly held in the region other than the region where the amplification part 802 is located. When the chip 80 is mounted and the chip 80 is taken out from the carrier 23, the carrier 23 needs to have the corresponding second clamping component 234, on one hand, when the chip 80 is taken out, the amplification cavity area of the chip 80 can be avoided; on the other hand, when the chip 80 is placed in the proper position on the carrier 23, the second chucking assembly 234 can also play a certain role in limiting the chip 80 to be separated from the carrier 23 from the opposite direction of the mounting direction. Specifically, if the chip 80 is inserted into the carrier 23 from above, the second chucking assembly 234 functions to prevent the chip 80 from easily falling out of the upper opening.
In order to enable the chip 80 to be firmly fixed in the mounting groove 230, the second clamping component 234 does not abut against the amplification part 802, but abuts against the chip 80 located on the chip body 801. It is desirable to avoid interference of the augment 802 with the second catch assembly 234 during installation of the second catch assembly 234.
Referring to fig. 5 and 12, in various embodiments of the present invention, the second catch assembly 234 is provided in a structure that is movable within a certain range. When the chip 80 is mounted, the amplification part 802 of the chip 80 abuts against the second chucking member 234, moves it and moves it away from the bottom plate 231, so that the gap between the bottom plate 231 and the cover plate 232 allows the chip 80 to be normally mounted. When the amplification part 802 of the chip 80 is continuously inserted downward to a position away from the second holding member 234, the second holding member 234 is reset, and the second holding member 234 can push against the side B of the chip 80 above the amplification part 802 along the first direction X.
Referring to fig. 5 to 12, in some embodiments, the second latching assembly 234 includes a second elastic mechanism 2341 and a resisting member 2342. The second elastic mechanism 2341 is installed on the cover plate 232; the propping member 2342 contacts or is connected with the second elastic mechanism 2341. The propping member 2342 and the first elastic mechanism 2331 hold the chip 80 in the first direction X. The upper side surface of the abutting member 2342 is configured as an inclined surface 2342 a. The inclined surface 2342a serves as a guide for the inserted chip 80.
In the initial state, the side of the abutting member 2342 departing from the second elastic mechanism 2341 abuts against the bottom surface of the first concave portion 2311 of the bottom plate 231. In the mounting process of the chip 80, the outer edge of the amplification part 802 contacts the abutting part 2342 first, in the process that the chip 80 is mounted further downwards, the abutting part 2342 is abutted by the outer edge of the amplification cavity, and the second elastic mechanism 2341 contacting with the abutting part 2342 is compressed and deformed, so that the abutting part 2342 is far away from the bottom surface of the first inner concave part 2311 of the bottom plate 231, and the chip 80 can be smoothly inserted into the mounting groove 230.
Referring to fig. 5 and 12, in some embodiments, the extending and retracting direction of the second elastic mechanism 2341 is a second direction Z, which is perpendicular to the first direction X and also intersects with the lifting direction Y of the lifting portion 222. The second elastic means 2341 extends and contracts in a thickness direction through the base plate 231 and the cover plate 232. The first direction X is a horizontal direction, i.e., a width direction of the chip 80. The mounting direction of the chip 80 is perpendicular to both the first direction X and the second direction Z, i.e., the mounting direction of the chip 80 is the up-down direction.
The second elastic mechanism 2341 is, for example, a compression spring, and after the second elastic mechanism 2341 is installed in place, the compression spring is always in a compressed state. When pressed by the amplification part 802 of the chip 80, it is further compressed. When the amplification part 802 of the chip 80 is disengaged from the second elastic mechanism 2341, the second elastic mechanism 2341 is reset to enable the propping member 2342 to prop against the bottom plate 231.
Referring to fig. 9 to 12, in some embodiments, the cover plate 232 is provided with a third concave portion 2322, the second elastic mechanism 2341 is fixed or placed in the third concave portion 2322, the propping member 2342 is partially located in the third concave portion 2322, and the propping member 2342 contacts the second elastic mechanism 2341. The propping member 2342 is partially located inside the third concave portion 2322 and partially protrudes out of the third concave portion 2322. When the propping member 2342 is located in the third concave portion 2322 completely or mostly, the gap between the side of the propping member 2342 far from the second elastic mechanism 2341 and the bottom plate 231 is enough for the enlarged portion 802 to pass through. After the amplification part 802 passes through, the abutting member 2342 is restored to abut against the bottom surface of the first concave part 2311 of the bottom plate 231 by the elastic force of the second elastic mechanism 2341.
In the above technical solution, the second elastic mechanism 2341 and the supporting member 2342 are placed in the groove structure of the cover plate 232, as shown in fig. 12, the second elastic mechanism 2341 is in a compressed state in a free state, and the supporting member 2342 supports against the inner wall of the bottom plate 231. When the chip 80 is inserted from above, the chip 80 applies pressure to the second elastic mechanism 2341 through the abutting member 2342, the second elastic mechanism 2341 is further compressed, the abutting member 2342 is separated from the inner wall of the bottom plate 231, and the chip 80 is inserted. Since the second elastic mechanism 2341 is compressed, the propping element 2342 can prevent the chip 80 from tilting due to too small contact area between the bottom right corner of the chip 80 and the bottom plate 231.
Referring to fig. 1 to 4, in order to more firmly fix the chip 80, in some embodiments, the carrier 23 further includes a third clamping assembly 235, the third clamping assembly 235 is mounted to the bottom plate 231, and the third clamping assembly 235 is configured to clamp the chip 80 in the second direction Z together with the cover plate 232. Alternatively, a third clamping assembly 235 is mounted to the cover plate 232, the third clamping assembly 235 being configured to clamp the chip 80 in the second direction Z in common with the base plate 231. The second direction Z is perpendicular to the first direction X and intersects with the lifting direction Y of the lifting unit 222.
The third chucking assembly 235 serves to chuck the chip 80 in a thickness direction of the chip 80 to prevent the chip 80 from shaking during the inspection.
In some embodiments, the third clamping component 235 comprises a wave ball screw. For the ball screw, reference is made to the above description of the first elastic mechanism 2331, which is not further described herein.
Referring to fig. 7 to 11, in some embodiments, the cover plate 232 is provided with a first through-hole 2323, and the first through-hole 2323 is configured to correspond to the suction port 804 of the chip 80. The suction port 804 communicates with a syringe pump to suck the internal flow channel of the chip 80 if necessary, so as to realize the fluid flow inside the chip 80 in a set manner.
Referring to fig. 4, 7-11, in some embodiments, the cover plate 232 is provided with a second through-hole 2324, the second through-hole 2324 being configured to correspond to the rotary valve 803 of the chip 80. In use, after the chip 80 is mounted on the carrier 23, the rotary valve 803 of the chip 80 is exposed, so that the valve position of the rotary valve 803 can be changed by an external rotating mechanism, and the communication state of the internal flow channels of the chip 80 can be changed, so as to realize the fluid flow inside the chip 80 to the required chamber.
Referring to fig. 14 to 21, other embodiments of the present invention provide a chip holding apparatus, in which the structure of the carrier member 23 is different.
In these embodiments, the area of the chip 80 enclosed by the carrier member 23 is larger. Comparing fig. 13 and 15, it can be seen that in the embodiments illustrated in fig. 14 to 21, the carrier member 23 surrounds most of the chip body 801 of the chip 80. The upper half of the chip body 801 is a liquid storage cavity, and the lower half is other cavities. The thickness of the upper half area where the liquid storage cavity is located is larger than that of the lower half area where the other cavities are located.
Referring to fig. 14 to 18, the first inner recess 2311 includes a first receiving groove 231a and a second receiving groove 231b that communicate with each other. The depth of the first receiving groove 231a is greater than the depth of the second receiving groove 231 b.
The first receiving groove 231a is used for wrapping the upper half of the chip body 801 where the liquid storage cavity is located. The first receiving groove 231a surrounds most or all of the upper half of the chip body 801. In consideration of the need to remove and place the chip 80, in some embodiments, the first receiving groove 231a and the second concave portion 2321 cooperate to wrap most of the upper half of the chip body 801, and the top of the chip body 801 is exposed out of the mounting groove 230. The second receiving groove 231b and the second inner recess 2321 cooperate to wrap the lower half of the chip body 801.
Referring to fig. 22, the first container 231a supports one side of the bottom surface a of the reservoir in the thickness direction at the bottom wall of the chip 80 in the height direction. The other side in the thickness direction of the bottom surface a of the reservoir chamber is supported by a support 2328 described later.
The first and second concave portions 2311 and 2321 together form the mounting groove 230, the mounting groove 230 more tightly surrounds the chip 80, and a clamping component for clamping the chip 80 may not be additionally provided except for the mounting groove 230.
As shown in fig. 22, the mounting slot 230 has a shape that matches the shape of the portion of the chip 80 that is received. One side of the mounting groove 230 (i.e., the bottom surface of the second inner recess 2321 of the cover plate 232) is planar, and the other side of the mounting groove 230 (i.e., the bottom surface of the first inner recess 2311 of the base plate 231) is stepped.
The first inner concave portion 2311 of the bottom plate 231 provided by the technical scheme adopts two parts with different depths to match the structure of the chip 80, so that the area of the chip 80 wrapped is large enough, and even if the clamping assembly is not arranged in the subsequent testing process, the chip 80 is not easy to shake, unstable and the like, and is not beneficial to testing.
Referring to fig. 19 to 21, the cover plate 232 is provided with a guide table 2325, and the guide table 2325 is provided with a first guide surface 2326 configured to guide the chip 80 inserted into the mounting groove 230. The first guide surface 2326 is a flat surface, for example. The first guide surface 2326 forms an acute angle with the insertion direction of the chip 80. The setup guide 2325 may serve the following functions: the depth of the mounting groove 230 should be as close as possible to the thickness of the chip 80 in consideration of firmly wrapping the chip 80, but facilitating the insertion and separation of the chip 80 into and from the mounting groove 230. However, if the depth of the mounting groove 230 is reduced, the chip 80 is not easy to mount and remove. The guide table 2325 can better balance the requirements of conveniently disassembling and assembling the chip 80 and stably wrapping the chip 80, so that the chip 80 is convenient to install and can be effectively wrapped and supported.
Referring to fig. 19 to 21, the guide table 2325 is provided with a second guide surface 2327 configured to guide the chip 80 away from the mounting slot 230. The second guide surface 2327 forms an acute angle with the removal direction of the chip 80. The second guide surface 2327 is a flat surface, for example.
Referring to fig. 19 to 22, the cover plate 232 is provided with a support table 2328 configured to support a bottom surface of the reservoir chamber of the chip 80. The support 2328 supports the bottom a of the reservoir of the chip 80. The supporting tables 2328 are spaced apart two by two to support two positions of the bottom surface a of the chip 80 together.
In some embodiments, as shown in fig. 22, a plane B on the other side of the chip 80 in the thickness direction may also be supported by the top surface of the bottom plate 231, and the plane B is located outside the mounting groove 230. Bottom surface A, plane B are located the both sides of chip 80 thickness direction to all can both obtain supporting after chip 80 loads to target in place, this also makes chip 80 in the test procedure, and the position is more firm, is difficult for rocking.
It should be noted that, in other embodiments, the support table 2328 may also be disposed to support the bottom surface a of the liquid storage cavity of the chip 80, and at this time, a certain gap may be formed between the bottom surface of the chip 80 and the bottom surface of the mounting groove 230, that is, the bottom surface of the mounting groove 230 does not support the bottom surface of the chip 80.
Some embodiments of the present invention further provide a nucleic acid detecting system, which includes a chip 80 and a chip holding device provided by any of the technical solutions of the present invention, wherein the chip 80 is mounted in the mounting groove 230.
For the description of the chip 80, please refer to the above, and the description is omitted here. After the chip 80 is mounted in place, the height of the carrier member 23 is adjusted to match the subsequent nucleic acid detection operation.
The nucleic acid detection system provided by some embodiments of the invention meets the requirements of full-automatic integration and high integration of nucleic acid detection, bedside detection, instant detection and random detection, is not only suitable for small-sized equipment capable of instant detection and random detection, but also suitable for large-sized equipment with full-automatic integration and high integration. Therefore, the nucleic acid detection system provided by the technical scheme has strong universality and wide application scene.
In the description of the present invention, it is to be understood that the terms "central", "longitudinal", "lateral", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be considered as limiting the scope of the present invention.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: it is to be understood that modifications may be made to the technical solutions described in the foregoing embodiments, or equivalents may be substituted for some of the technical features thereof, but such modifications or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (21)

1. A chip holding apparatus, comprising:
a mounting seat (21);
a lifting mechanism (22) which comprises a fixing part (221) and a lifting part (222), wherein the fixing part (221) is mounted on the mounting base (21), and the lifting part (222) is mounted on the fixing part (221) in a lifting manner; and
the bearing component (23) is provided with a mounting groove (230) for mounting a chip (80), and the bearing component (23) is fixedly connected with the lifting part (222); the carrier (23) comprises a first chucking assembly (233) and a second chucking assembly (234), the first chucking assembly (233) and the second chucking assembly (234) being configured to cooperate together to chuck the chip (80) in a first direction, the first direction intersecting a lifting direction of the lifting part (222);
wherein the first holding assembly (233) comprises a first elastic mechanism (2331), and the extension and retraction direction of the first elastic mechanism (2331) is along the first direction.
2. The chip holding device according to claim 1, wherein the carrier member (23) further comprises:
a base plate (231) attached to the lifting unit (222); the bottom plate (231) is provided with a first inner concave portion (2311); and
a cover plate (232) detachably connected to the base plate (231); the cover plate (232) is provided with a second inner recess (2321); the first and second inner recesses (2311, 2321) together form the mounting groove (230), and a top of the mounting groove (230) is open.
3. The chip holding device according to claim 2, wherein the first chucking assembly (233) is mounted to the bottom plate (231) or the cover plate (232), and the second chucking assembly (234) is mounted to the cover plate (232) or the bottom plate (231).
4. The chip holding device according to claim 1, wherein the first resilient means (2331) comprises a wave ball screw.
5. The chip holding device according to claim 4, wherein a plurality of said wave ball screws are arranged in a dispersed manner.
6. The chip holding device according to claim 3, wherein the second chucking assembly (234) comprises:
a second elastic means (2341) attached to the cover plate (232); and
the propping piece (2342) is in contact with or connected with the second elastic mechanism (2341);
the propping piece (2342) and the first elastic mechanism (2331) clamp the chip (80) together in a first direction.
7. The chip holding apparatus according to claim 6, wherein the extending/retracting direction of the second elastic means (2341) is a second direction perpendicular to the first direction and intersecting the elevating direction of the elevating portion (222).
8. The chip holding device according to claim 6, wherein the cover plate (232) is provided with a third concave portion (2322), the second elastic mechanism (2341) is fixed or placed in the third concave portion (2322), the abutting member (2342) is partially located in the third concave portion (2322) and the abutting member (2342) is in contact with the second elastic mechanism (2341).
9. The chip holding device according to claim 2, wherein the carrier member (23) further comprises:
a third clamping assembly (235) mounted to the base plate (231), the third clamping assembly (235) configured to clamp the chip (80) in a second orientation in common with the cover plate (232); alternatively, the third clamping assembly (235) is mounted to the cover plate (232), the third clamping assembly (235) being configured to clamp the chip (80) in a second direction in common with the base plate (231); wherein the second direction is perpendicular to the first direction and intersects with a lifting direction of the lifting part (222).
10. The chip holding device according to claim 9, wherein the third holding member (235) comprises a wave ball screw.
11. The chip holding device according to claim 2, wherein the cover plate (232) is provided with a first through hole (2323), the first through hole (2323) being configured to correspond to a suction port (804) of the chip (80).
12. The chip holding device according to claim 2, wherein the cover plate (232) is provided with a second through hole (2324), the second through hole (2324) being configured to correspond to a rotary valve (803) of the chip (80).
13. The chip holding apparatus according to claim 1, wherein the fixing portion (221) includes a lead screw, and the elevating portion (222) includes a slide table that is screw-engaged with the lead screw; wherein the bearing part (23) is fixed on the sliding table.
14. The die holding apparatus of claim 1, further comprising:
a position detection assembly (24) configured to detect a position of the carrier member (23).
15. The chip holding apparatus according to claim 14, wherein the position detection assembly (24) comprises:
a position detection sensor (241) attached to the fixed part (221); and
and a detecting member (242) fixed to the carrying member (23) or the lifting portion (222), wherein the detecting member (242) includes a detecting portion for extending into a detection area of the position detecting sensor (241).
16. The chip holding apparatus according to claim 15, wherein the position detection assembly (24) further comprises:
a sensor mounting base (243) fixedly connected to the fixing portion (221);
wherein the position detection sensor (241) is mounted on the sensor mount (243) in an adjustable manner.
17. The chip holding device according to claim 2, wherein the first inner recess (2311) includes a first receiving groove (231a) and a second receiving groove (231b) communicating with each other; the depth of the first receiving groove (231a) is greater than the depth of the second receiving groove (231 b).
18. The chip holding device according to claim 2, wherein the cover plate (232) is provided with a guide table (2325), and the guide table (2325) is provided with a first guide surface (2326) configured to guide the chip (80) inserted into the mounting groove (230).
19. The die holding apparatus according to claim 18, wherein the guide table (2325) is provided with a second guide surface (2327) configured to guide the die (80) away from the mounting slot (230).
20. The chip holding device according to claim 2, wherein the cover plate (232) is provided with a support table (2328) configured to support a bottom surface of the reservoir chamber of the chip (80).
21. A nucleic acid detecting system comprising a chip (80) and the chip holding apparatus according to any one of claims 1 to 20, wherein the chip (80) is mounted in the mounting groove (230).
CN202010108161.8A 2020-02-21 2020-02-21 Chip clamping device and nucleic acid detection system Active CN111187703B (en)

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US10308487B2 (en) * 2014-01-17 2019-06-04 Tecsis Gmbh Measurement system for determining support force
CN203965446U (en) * 2014-07-20 2014-11-26 孙长寿 Blood glucose meter proving installation
CN106967600B (en) * 2016-01-13 2020-02-21 深圳华大智造科技有限公司 Chip holder, chip fixing component and sample loading instrument
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CN108642159B (en) * 2018-06-27 2022-07-01 上海宏滩生物科技有限公司 Biochip detection system
CN108971780B (en) * 2018-09-06 2020-03-31 重庆科技学院 Positioning and fixing device of chip fixture
CN209673821U (en) * 2019-03-05 2019-11-22 深圳迎凯生物科技有限公司 Bearing assembly and fluorescence immunoassay tester
CN110646631A (en) * 2019-10-28 2020-01-03 南京晶捷生物科技有限公司 Calibration liquid, sample liquid conveying and heating device and POCT detection equipment

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Effective date of registration: 20240904

Address after: Siming District of Xiamen city in Fujian Province, 361005 South Siming Road No. 422

Patentee after: XIAMEN University

Country or region after: China

Patentee after: BEIJING WANTAI BIOLOGICAL PHARMACY ENTERPRISE Co.,Ltd.

Patentee after: XIAMEN INNODX BIOTECH Co.,Ltd.

Address before: Siming District of Xiamen city in Fujian Province, 361005 South Siming Road No. 422

Patentee before: XIAMEN University

Country or region before: China

Patentee before: XIAMEN INNODX BIOTECH Co.,Ltd.