CN111174704A - Method for measuring height of tin ball by gray image - Google Patents
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- CN111174704A CN111174704A CN201911172034.8A CN201911172034A CN111174704A CN 111174704 A CN111174704 A CN 111174704A CN 201911172034 A CN201911172034 A CN 201911172034A CN 111174704 A CN111174704 A CN 111174704A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
- G06T7/11—Region-based segmentation
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/60—Analysis of geometric attributes
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Abstract
The invention discloses a method for measuring the height of a solder ball through a gray image, which comprises the steps of acquiring height data of the surface of a PCB (printed circuit board) through an active three-dimensional sensor, and converting the acquired height data into a gray value to obtain a gray image; extracting the area of the solder ball from the gray image by using a threshold segmentation method; and then determining the centroid coordinate of the solder ball, and reversely deducing the height data of the solder ball according to the centroid coordinate of the solder ball. The height data are converted into the gray level images, so that the difficulty of analyzing and processing the data is reduced, the height data are visually represented in the form of the images, and the efficiency of measuring the height data of the solder balls is greatly improved; the height measurement method can be applied to objects with irregular surfaces, is not influenced by noise interference, and is higher in detection precision.
Description
Technical Field
The invention belongs to the technical field of machine vision detection, and particularly relates to a method for measuring the height of a solder ball through a gray image.
Background
The height measuring method of the object can be broadly divided into a contact type and a non-contact type, and the traditional contact type measuring method has been developed for decades, and the mechanical structure and the electronic system thereof are quite mature. A three-coordinate measuring machine and a contact type rough contourgraph are typical representatives of contact type three-dimensional measurement, and the principle of the three-coordinate measuring machine and the contact type rough contourgraph is that a probe of a sampling head is used for contacting a model surface, adjacent contour point data are collected, and finally a wire frame model of the whole surface is constructed. The contact measurement method has higher accuracy and reliability, but also has the following defects:
(1) when in measurement, the measuring head has contact pressure with the measured object, which is not suitable for measuring flexible objects and has no good measuring effect on the surface which can not be touched by the measuring head; in addition, the surface of the measured object, especially the high-precision surface, is easy to be damaged by improper operation, and the measuring head is worn;
(2) the radius of the measuring head and the local deformation of the measured object extruded by the measuring head during contact measurement can influence the measurement precision;
(3) the contact measurement is performed in a point-by-point scanning mode, so that the measurement speed is slow, and particularly, the time is consumed when a large object is measured;
(4) the measuring machine has complex mechanical structure and high requirements on working environment, and has the requirements of shock resistance, dust resistance, constant temperature and the like, so that the application range of the measuring machine is limited.
The non-contact measurement method is mainly referred to as an optical measurement method. With the development of optoelectronic technology and microelectronic technology, various new devices are continuously emerging, such as charge coupled devices, digital projectors, and the like. Non-contact optical measurement techniques are rapidly developing and are beginning to find widespread use in several fields. The non-contact optical measurement method is recognized as the most promising three-dimensional surface shape measurement due to the advantages of high sensitivity, high speed, no damage, much acquired data and the like.
Currently, the types of optical three-dimensional vision measurement methods are mainly divided into: photogrammetry, time-of-flight methods, triangulation, projected fringe methods, imaging surface positioning methods, interferometry, and the like. The basic methods for acquiring three-dimensional information of a macroscopic object can be divided into two categories, passive three-dimensional sensing and active three-dimensional sensing:
the passive three-dimensional sensing adopts an unstructured light (natural light) illumination mode, and forms three-dimensional surface shape data from distance information determined in two-dimensional images acquired by one or more camera systems. Passive three-dimensional sensing requires a large number of correlation matching operations, which become very complex and difficult when the structural information of the target to be measured is too simple or too complex, or the reflectivity of each point on the object to be measured is not significantly different.
The active three-dimensional sensing starts a structured light illumination mode, and the three-dimensional surface data can be obtained by modulating the space or time of the structured light field by the three-dimensional surface of the object, demodulating the deformed light field which contains the information of the three-dimensional surface shape of the object and observing the deformed light field. The active three-dimensional sensing has the advantages of non-contact, high automation, high sensitivity, high precision and the like, so most systems aiming at measuring three-dimensional fine surface shapes adopt an active three-dimensional measuring mode.
Although the active three-dimensional sensing effectively solves the problem of object height measurement, the method cannot be completely adapted to assembly line operation in industrial production, most active three-dimensional sensing still adopts an off-line operation mode for on-line measurement because no effective measurement means is available, the on-line measurement means that only selective inspection can be carried out, the method wastes manpower, cannot ensure the product quality, and simultaneously reduces the production efficiency.
Disclosure of Invention
The invention aims to solve the problems in the prior art, and provides a method for converting height data acquired by active three-dimensional sensing into a gray image to measure the height of a solder ball, wherein the gray image conversion has the advantage that the data is expressed in an image mode.
In order to achieve the purpose, the invention adopts the technical scheme that:
a method for measuring the height of a solder ball through a gray image comprises the following steps:
s1, acquiring height data of the surface of the PCB by the active three-dimensional sensor;
s2, converting the acquired height data into a gray image;
s3, extracting solder ball areas from the gray level image;
s4, determining the gray scale centroid coordinate of each solder ball;
and S5, reversely deducing the height data corresponding to each gray scale centroid coordinate according to the conversion rule of the height data and the gray scale image to obtain the height data of each solder ball.
Specifically, in step S1, the active three-dimensional sensor includes: the device comprises a coaxial white light confocal sensor, a three-dimensional displacement platform and an adapter plate; the white light confocal sensor is arranged on the three-dimensional displacement platform through the adapter plate; the white light confocal sensor is line scanning laser, each line has m light spots, and the m light spots correspond to the Y axis of the three-dimensional displacement platform; the number of the lateral sampling of the white light confocal sensor is n, and the n sampling points correspond to the X axis of the three-dimensional displacement platform, namely the white light confocal sensor scans once to obtain mn sampling points, and a height data table of the mn sampling points is established.
Specifically, in step S2, the method of converting the acquired height data into a grayscale image is: traversing the maximum value H from the altitude data acquired in step S1MaxAnd a minimum value HMinTaking the difference H between the maximum value and the minimum valueMax-HMinAnd as the measuring range, dividing the measuring range into 255 gray levels in an equal proportion, converting the height value of each sampling point on the PCB into a gray value according to the gray levels, establishing a gray data table, and converting the height data into a gray image according to the gray value.
Because the height data can not be directly processed and analyzed, which height data are solder balls and which data are PCB or electric appliance elements can not be known from the data; according to the method, different height data of the surface of the PCB are distributed to 0-255 gray levels, in the field of computers, each pixel of a gray digital image only has an image with a sampling color, the image is displayed as gray from darkest black to brightest white, 0 represents darkest pure black, 255 represents brightest pure white, the brightness of the gray image is determined by the height of each device on the PCB, and the part with the higher height is brighter on the image; distinguishing the object under test from the image is much easier than finding the target from the data.
Specifically, in step S3, the method for extracting the solder ball region from the grayscale image includes: the rough position of the solder ball in the image is obtained through initial positioning, then the area of the solder ball is extracted from the image by using a threshold segmentation method, and the gray value of the area of the solder ball is recorded.
Specifically, in step S4, the method for determining the gray centroid coordinate of each solder ball includes: each solder ball is used as an independent light spot, and the mass center of the light spot is a point of the solder ball area in the image, which has a trend of changing from dark to bright and has the most concentrated brightness; and determining the coordinate value of the centroid in the gray data table according to the coordinate of the centroid in the image.
Specifically, in step S5, the method for obtaining the height data of each solder ball includes: according to the centroid coordinate obtained in step S4, the height data of the sampling point corresponding to the coordinate is looked up in the height data table, and the height data of the sampling point is the height data of the corresponding solder ball.
Compared with the prior art, the invention has the beneficial effects that: (1) the height data are converted into the gray level images, so that the difficulty of analyzing and processing the data is reduced, the height data are visually represented in the form of the images, and the efficiency of measuring the height data of the solder balls is greatly improved; (2) the height measurement process is converted into the image processing process, the time-consuming height measurement process is simplified, the original time-consuming process can be directly operated on a production line, and the product detection efficiency is improved; (3) the height measurement method can be applied to objects with irregular surfaces, is not influenced by noise interference, and is higher in detection precision.
Drawings
FIG. 1 is a schematic flow chart of a method for measuring the height of a solder ball by a gray image according to the present invention;
FIG. 2 is a gray scale diagram of PCB board surface height data transformation in an embodiment of the present invention;
FIG. 3 is a schematic view of an installation structure of the active three-dimensional sensor according to the present invention;
in the figure: 1. a white light confocal sensor; 2. an adapter plate; 3. an X axis; 4. a Y axis; 5. a Z axis; 6. and (7) a PCB board.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in the figure, the embodiment provides a method for measuring the height of a solder ball through a gray image, which comprises the following steps:
s1, acquiring height data of the surface of the PCB 6 through the active three-dimensional sensor;
specifically, as shown in fig. 3, the active three-dimensional sensor includes: the device comprises a coaxial white light confocal sensor 1, a three-dimensional displacement platform and an adapter plate 2; the white light confocal sensor 1 is arranged on the three-dimensional displacement platform through the adapter plate 2; the white light confocal sensor 1 is line scanning laser, 192 light spots are arranged on each line in total, and the 192 light spots correspond to the Y axis 4 of the three-dimensional displacement platform; the number of the lateral samples of the white light confocal sensor 1 is 1200, and the 1200 sampling points correspond to the X axis 3 of the three-dimensional displacement platform, that is, the white light confocal sensor 1 scans once to obtain 230400 sampling points, and establishes a height data table of the sampling points, wherein the height data table has 192 rows and 1200 columns, that is, the height data table corresponds to the coordinate position of each sampling point.
The white light confocal sensor 1 adopted by the embodiment can measure transparent, non-transparent, diffuse reflection and reflection materials, and due to the coaxial structure, the measurement angle can be 45 degrees, the general three-dimensional sensing adopts a laser triangulation method, the measurement angle is only +/-2 degrees, for tin balls which are objects with mirror reflection and spherical surfaces, the stability of the white light confocal sensor 1 is better, the height of the tin balls is about 2-3 mm, and the measuring range of the sensing lens is preferably 4 mm.
The three-dimensional displacement platform in the embodiment comprises three motion axes of an X axis 3, a Y axis 4 and a Z axis 5, wherein the X axis 3 can control the scanning distance, the Y axis 4 can control the scanning width, and the Z axis 5 can adjust the distance from a sensor lens to a PCB panel according to the height of the 6 surfaces of the PCB; the white light confocal sensor 1 is fixedly arranged on a Z shaft 5 through an adapter plate 2; the white light confocal sensor 1 belongs to a line scanning sensor, a PCB (printed circuit board) 6 is kept still in the scanning process, and the sensor is driven to move transversely when the X-axis 3 moves; the sensor is also connected with an encoder of the X shaft 3 during scanning, and the encoder is used for receiving the motion pulse so as to acquire the position information of the sensor in real time; setting an initial acquisition signal and a final acquisition signal of the sensor according to the position information, and adjusting the scanning distance of the sensor; in the embodiment, the sampling interval is set to 30 pulses to trigger the primary sensor to acquire data; in the present embodiment, the line length of the sensor is 4.7mm, 192 light spots are on the line, which corresponds to the width of the image, the length of the image is determined by the scanning distance of the sensor and the sampling interval, and the longer the scanning distance and the shorter the sampling interval, the longer the scanned image. The pixel precision of the Y-axis direction 4 is 4.7/192 ≈ 0.024mm, the sensor acquisition frequency is 5000Hz, the X-axis 3 moving speed is 4mm/s, 30 pulse interval touch acquisition is set once, the pixel precision of the X-axis direction 3 is 4/(5000/30) ═ 0.024, the XY precision is just the same, otherwise, the gray image has transverse or longitudinal stretching phenomenon to distort the image. In this embodiment, the number of X-axis 3 samples is 1200, and there are 230400 sample points in a single scan, as shown in table 1 below:
TABLE 1 height datasheet (Unit-um) collected by white light confocal sensor 1
S2, converting the acquired height data into a gray image;
specifically, the method of converting the acquired height data into a grayscale image is: traversing a maximum value 3710.171um and a minimum value 1375.466um from the height data acquired in the step S1, taking a difference value 2334.705um between the maximum value and the minimum value as a measuring range, dividing the measuring range into 255 gray levels in an equal proportion, converting the height value of each sampling point on the PCB 6 into a gray value according to the gray levels, and establishing a gray data table which has 192 rows and 1200 columns in total, wherein the gray value of each sampling point in the table 2 corresponds to the height data with the same coordinate in the table 1; as shown in table 2 below, the height data is converted into a gray image according to the gray value, and as shown in fig. 2, the coordinate of each sampling point in the gray image corresponds to the gray value with the same coordinate in table 2.
Table 2 table for converting height data into gray value
Because the height data can not be directly processed and analyzed, which height data are solder balls and which data are of the PCB 6 or electrical components can not be known from the data; according to the method, different height data of the surface of the PCB 6 are distributed to 0-255 gray levels, in the field of computers, each pixel of a gray digital image only has an image with a sampling color, the image is displayed as gray from darkest black to brightest white, 0 represents darkest pure black, 255 represents brightest pure white, the brightness of the gray image is determined by the height of each device on the PCB 6, and the part with the higher height is brighter on the image; distinguishing the object under test from the image is much easier than finding the target from the data.
S3, extracting solder ball areas from the gray level image;
specifically, the method for extracting the solder ball region from the gray image comprises the following steps: the method comprises the steps of firstly obtaining the approximate positions of 5 solder balls in an image through initial positioning, then extracting the areas of the solder balls from the image by using a threshold segmentation method, and recording the gray value of the areas of the solder balls.
S4, determining the gray scale centroid coordinate of each solder ball;
specifically, the method for determining the gray scale centroid coordinate of each solder ball comprises the following steps: each solder ball is used as an independent light spot, and the mass center of the light spot is a point of the solder ball area in the image, which has a trend of changing from dark to bright and has the most concentrated brightness; determining coordinate values of the mass centers of the 5 solder balls in the table 2 according to the coordinates of the mass centers in the image as follows: (120,359),(129,481),(104,589),(104,693),(123,824).
In order to obtain the height of the solder ball, the common method is to process and analyze the height data, determine the position of the highest point of the solder ball in the data according to the variation trend of the height data, and take the maximum value as the height of the solder ball. However, the height data acquired by the sensor is actually converted by an electric signal, the signal has the influence of noise, and the maximum value acquired possibly is only one noise point; the invention can accurately calculate the height of the solder ball on the premise of not filtering noise.
And S5, reversely deducing the height data corresponding to each gray scale centroid coordinate according to the conversion rule of the height data and the gray scale image to obtain the height data of each solder ball.
Specifically, the method for obtaining the height data of each solder ball comprises the following steps: according to the centroid coordinate obtained in step S4, the height data of the sampling point corresponding to the coordinate is found, that is, the heights found in table 1 according to the centroid coordinates of 5 solder balls are 3549.211um, 3210.845um, 3256.487um, 3244.112um and 3428.531um, and the height values of 5 solder balls are sequentially found from left to right.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A method for measuring the height of a tin ball through a gray image is characterized by comprising the following steps:
s1, acquiring height data of the surface of the PCB by the active three-dimensional sensor;
s2, converting the acquired height data into a gray image;
s3, extracting solder ball areas from the gray level image;
s4, determining the gray scale centroid coordinate of each solder ball;
and S5, reversely deducing the height data corresponding to each gray scale centroid coordinate according to the conversion rule of the height data and the gray scale image to obtain the height data of each solder ball.
2. The method as claimed in claim 1, wherein in step S1, the active three-dimensional sensor comprises: the device comprises a coaxial white light confocal sensor, a three-dimensional displacement platform and an adapter plate; the white light confocal sensor is arranged on the three-dimensional displacement platform through the adapter plate; the white light confocal sensor is line scanning laser, each line has m light spots, and the m light spots correspond to the Y axis of the three-dimensional displacement platform; the number of the lateral sampling of the white light confocal sensor is n, and the n sampling points correspond to the X axis of the three-dimensional displacement platform, namely the white light confocal sensor scans once to obtain mn sampling points.
3. The method of claim 1, wherein the step S2 of converting the height data into a gray image comprises: traversing the maximum value H from the altitude data acquired in step S1MaxAnd a minimum value HMinTaking the difference H between the maximum value and the minimum valueMax-HMinAnd as the measuring range, the measuring range is divided into 255 gray levels in an equal proportion, the height value of each coordinate on the PCB is converted into a gray value according to the gray levels, and the height data is converted into a gray image according to the gray value.
4. The method of claim 1, wherein in step S3, the method for extracting the solder ball region from the gray image comprises: the rough position of the solder ball in the image is obtained through initial positioning, then the area of the solder ball is extracted from the image by using a threshold segmentation method, and the gray value of the area of the solder ball is recorded.
5. The method of claim 1, wherein the step of determining the coordinates of the center of mass of the gray scale of each solder ball in the step of S4 comprises: and (3) taking each solder ball as an independent light spot, wherein the mass center of the light spot is a point of the solder ball area in the image, which has a trend of changing from dark to bright and has the most concentrated brightness, and determining the coordinate of the mass center of the solder ball in the gray scale image.
6. The method of claim 1, wherein the step S5 of obtaining the height data of each solder ball comprises: and searching the height data of the sampling point corresponding to the coordinate according to the centroid coordinate obtained in the step S4, wherein the height data of the sampling point is the height data of the corresponding solder ball.
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