CN111164738B - Sheet for processing workpiece and method for manufacturing processed workpiece - Google Patents
Sheet for processing workpiece and method for manufacturing processed workpiece Download PDFInfo
- Publication number
- CN111164738B CN111164738B CN201880063343.9A CN201880063343A CN111164738B CN 111164738 B CN111164738 B CN 111164738B CN 201880063343 A CN201880063343 A CN 201880063343A CN 111164738 B CN111164738 B CN 111164738B
- Authority
- CN
- China
- Prior art keywords
- sheet
- workpiece
- adhesive
- processing
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Abstract
The present invention is a work processing sheet comprising a base material and an adhesive agent layer, wherein the adhesive agent layer is composed of an active energy ray-curable adhesive, the water contact angle of the adhesive agent layer is 50 DEG to 80 DEG, the adhesive force F1 of the work processing sheet to a silicon wafer, and the adhesive force F2 of the work processing sheet to the silicon wafer after the work processing sheet is immersed in distilled water at 23 ℃ for 12 hours and further dried at 23 ℃ for 24 hours have a reduction rate of the adhesive force calculated by (%) { (F1-F2)/F1 }. Times 100 of 20% to 50%. The sheet for processing a workpiece can prevent water from penetrating into the interface between the sheet for processing a workpiece and a cut object or a chip obtained thereby, and can well remove an adhesive derived from an adhesive layer, which is attached to the cut object such as a semiconductor wafer when the cut object is processed, from the cut object by flowing water.
Description
Technical Field
The present invention relates to a workpiece processing sheet suitably used for dicing and a method for manufacturing a processed workpiece using the workpiece processing sheet.
Background
Semiconductor wafers such as silicon and gallium arsenide and various packages (hereinafter, these may be collectively referred to as "objects to be cut") are manufactured in a large-diameter state, cut (diced) into small device pieces (hereinafter, may be referred to as "chips") and separated (picked up) respectively, and then transferred to a mounting (mount) step which is a subsequent step. At this time, the object to be cut, such as a semiconductor wafer, is subjected to various steps, such as dicing, cleaning, drying, expanding (expanding), picking up, and mounting, in a state of being stuck to a work piece processing sheet provided with a base material and an adhesive agent layer.
In the cutting step, the cutting blade, the object to be cut, and the workpiece processing sheet are heated by frictional heat generated between the rotating cutting blade and the object to be cut or the workpiece processing sheet. In addition, in the cutting step, there is a case where a cut piece is generated in the object to be cut and the workpiece processing piece, and the cut piece adheres to the object to be cut.
Therefore, in the dicing step, the generated cut pieces are generally removed from the object to be diced while cooling the dicing blade or the like by supplying flowing water to the dicing portion.
Patent document 1 discloses a work processing sheet in which for the purpose of promoting the removal of such cutting blades by flowing water, the contact angle of the adhesive layer before ultraviolet irradiation to pure water on the side opposite to the base material is 82 ° to 114 °, the contact angle to diiodomethane is 44 ° to 64 °, and the peak value of the probe tack test (probe tack test) of the adhesive layer before ultraviolet irradiation is 294 to 578kPa.
Documents of the prior art
Patent document
Patent document 1: japanese patent No. 5019657
Disclosure of Invention
Technical problem to be solved by the invention
However, when the dicing step is performed using the conventional work processing sheet disclosed in patent document 1, it is not possible to sufficiently remove the adhesive derived from the adhesive layer of the work processing sheet from the object to be cut.
In addition, generally, due to the supply of running water during dicing, water may infiltrate into the interface between the workpiece processing sheet and the object to be cut or the interface between the workpiece processing sheet and the obtained chip. If such water infiltration occurs, the chips may scatter or the chips may be broken.
The present invention has been made in view of the above circumstances, and an object thereof is to provide a workpiece processing sheet capable of satisfactorily removing an adhesive derived from an adhesive layer, which adheres to a work piece such as a semiconductor wafer when the work piece is processed, from the work piece by flowing water while suppressing water from penetrating into an interface between the workpiece processing sheet and the work piece or an interface between the workpiece processing sheet and an obtained chip, and a method for manufacturing a processed workpiece using the workpiece processing sheet.
Means for solving the problems
In order to achieve the above object, the present invention provides a work processing sheet comprising a base material and an adhesive agent layer laminated on one surface side of the base material, wherein the adhesive agent layer is composed of an active energy ray-curable adhesive, a water contact angle of a surface of the adhesive agent layer opposite to the base material is 50 ° or more and 80 ° or less, an adhesive force of the work processing sheet to a silicon wafer is F1, a decrease rate of the adhesive force calculated by the following formula (1) is 20% or more and 50% or less when an adhesive force of the work processing sheet to a silicon wafer after the work processing sheet is immersed in distilled water at 23 ℃ for 12 hours and further dried at 23 ℃ for 24 hours is F2,
a reduction rate (%) of the adhesive force { (F1-F2)/F1 } x 100. Cndot. (1) (invention 1).
In the work piece processing sheet of the invention (invention 1), by setting the water contact angle to the above range and setting the reduction rate of the adhesive force to the above range, water can be inhibited from penetrating into the interface between the work piece processing sheet and the object to be cut or the interface between the work piece processing sheet and the obtained chip. Further, by setting the water contact angle to the above range, the adhesive constituting the adhesive layer has a predetermined affinity for water, and by setting the reduction rate of the adhesive force to the above range, the adhesive force of the adhesive adhering to the object to be cut is appropriately reduced by the contact with water, and the adhesive adhering to the object to be cut can be removed well by flowing water.
In the above invention (invention 1), the above-mentioned adhesive force F1 is preferably 1000mN/25mm or more and 10000mN/25mm or less (invention 2).
In the above inventions (inventions 1 and 2), the adhesive force F2 is preferably 900mN/25mm or more and 8000mN/25mm or less (invention 3).
In the above inventions (inventions 1 to 3), it is preferable that: the active energy ray-curable adhesive is an adhesive formed from an adhesive composition containing an acrylic copolymer containing at least one selected from the group consisting of methyl acrylate, 2-methoxyethyl (meth) acrylate, ethylcarbitol (meth) acrylate, and methoxyethylene glycol (meth) acrylate as a monomer unit constituting a polymer (invention 4).
In the above inventions (inventions 1 to 4), the work processing sheet is preferably a dicing sheet (invention 5).
A second aspect of the present invention provides a method for manufacturing a machined workpiece, including: a bonding step of bonding a surface of the adhesive layer of the sheet for processing a workpiece (inventions 1 to 5) opposite to the base material to a workpiece; a machining step of machining the workpiece on the workpiece machining sheet to obtain a machined workpiece stacked on the workpiece machining sheet; an irradiation step of irradiating the adhesive layer with an active energy ray to cure the adhesive layer, thereby reducing the adhesion of the work processing sheet to the processed work; and a separation step of separating the processed workpiece from the workpiece processing sheet irradiated with the active energy ray (invention 6).
Effects of the invention
The present invention provides a sheet for processing a workpiece, which can prevent water from penetrating into an interface between the sheet for processing a workpiece and a cut object or an interface between the sheet for processing a workpiece and an obtained chip, and can well remove an adhesive derived from an adhesive layer, which is attached to a cut object such as a semiconductor wafer when the cut object is processed, from the cut object by flowing water. Further, according to the method for manufacturing a processed workpiece of the present invention, the processed workpiece can be efficiently manufactured.
Detailed Description
Hereinafter, embodiments of the present invention will be described.
[ sheet for processing work ]
The work processing sheet of the present embodiment includes a base material and an adhesive layer laminated on one surface side of the base material.
1. Physical Properties of sheet for processing workpiece
In the work processing sheet of the present embodiment, the surface of the adhesive layer opposite to the substrate (hereinafter, sometimes referred to as "adhesive surface") has a water contact angle of 50 ° or more and 80 ° or less. When the water contact angle is within the above range, the adhesive layer exhibits an appropriate affinity for water, and when the work processing sheet is used for cutting an object to be cut, the adhesive derived from the adhesive layer and adhering to the object to be cut can be removed satisfactorily with flowing water while preventing water from penetrating into the interface between the work processing sheet and the object to be cut or the interface between the work processing sheet and the obtained chip. In the present specification, the water contact angle is a value measured before the workpiece-processing sheet is irradiated with the active energy ray.
On the other hand, if the water contact angle is less than 50 °, the adhesive layer exhibits excessive affinity for water, and water penetration cannot be suppressed, whereby chip scattering or chip chipping occurs during dicing. Further, if the water contact angle is greater than 80 °, the affinity of the adhesive constituting the adhesive layer for water is insufficient, and the adhesive adhering to the object to be cut cannot be sufficiently removed by running water.
From the above viewpoint, the water contact angle is preferably 55 ° or more, and particularly preferably 60 ° or more. The water contact angle is preferably 75 ° or less, and particularly preferably 70 ° or less. The details of the method for measuring the water contact angle are shown in the test examples described below.
In the work piece of the present embodiment, when the adhesive force of the work piece to a silicon wafer is F1, the adhesive force of the work piece to a silicon wafer after the work piece is immersed in distilled water at 23 ℃ for 12 hours and further dried at 23 ℃ for 24 hours is F2, the reduction rate of the adhesive force calculated by the following formula (1) is 20% or more and 50% or less. When the rate of decrease in the adhesive force is within the above range, the adhesive agent layer exhibits an appropriate adhesive force to the object to be cut when the adhesive agent layer is exposed to the flowing water supplied to the cut portion in the dicing step, and the adhesive agent derived from the adhesive agent layer and adhering to the object to be cut can be satisfactorily removed by the flowing water while suppressing water from penetrating into the interface between the work processing sheet and the object to be cut or the interface between the work processing sheet and the obtained chip. In the present specification, the adhesive force F1 and the adhesive force F2 are both adhesive forces measured before the sheet for processing a work is irradiated with an active energy ray,
the rate of decrease in adhesive force (%) = { (F1-F2)/F1 } × 100 · (1).
On the other hand, if the reduction rate of the adhesive force is less than 20%, the adhesive force of the adhesive derived from the adhesive layer to the object to be cut is maintained even after the adhesive is exposed to running water, and the adhesive adhering to the object to be cut cannot be sufficiently removed by the running water. If the reduction rate of the adhesive force is more than 50%, the adhesive force of the adhesive agent layer to the object to be cut is excessively reduced, and the object to be cut or the obtained chip cannot be satisfactorily held by the adhesive agent layer, and peeling of the object to be cut, or chip scattering and chip chipping occur during dicing.
From such a viewpoint, the reduction rate of the adhesive force is preferably 23% or more. The reduction rate of the adhesive force is preferably 40% or less.
The sheet for processing a work of the present embodiment has a tack force F1 of preferably 1000mN/25mm or more, particularly preferably 2000mN/25mm or more, and more preferably 3000mN/25mm or more. The adhesive force F1 is preferably 10000mN/25mm or less, particularly 7000mN/25mm or less.
In the sheet for processing a work of the present embodiment, the above-mentioned adhesive force F2 is preferably 900mN/25mm or more, particularly preferably 1500mN/25mm or more, and further preferably 2000mN/25mm or more. The adhesive force F2 is preferably 8000mN/25mm or less, particularly preferably 5000mN/25mm or less.
By setting the adhesive force F1 and the adhesive force F2 to the above ranges, the rate of decrease in the adhesive force can be easily adjusted to the above ranges. The details of the method for measuring the adhesive force F1 and the adhesive force F2 are shown in the description of the test examples described below.
2. Component member of sheet for processing work
(1) Substrate material
In the work processing sheet of the present embodiment, the base material is not particularly limited as long as it exhibits a desired function in the use step of the work processing sheet, and preferably exhibits good transmittance to active energy rays irradiated for curing the adhesive agent layer.
For example, the base material is preferably a resin film mainly made of a resin-based material, and specific examples thereof include an ethylene-vinyl acetate copolymer film; ethylene copolymer films such as ethylene- (meth) acrylic acid copolymer films, ethylene- (meth) acrylic acid methyl ester copolymer films, and other ethylene- (meth) acrylic acid ester copolymer films; polyolefin films such as polyethylene films, polypropylene films, polybutylene films, polybutadiene films, polymethylpentene films, ethylene-norbornene copolymer films, and norbornene resin films; polyvinyl chloride films such as polyvinyl chloride films and vinyl chloride copolymer films; polyester-based films such as polyethylene terephthalate films, polybutylene terephthalate films, and polyethylene naphthalate films; a (meth) acrylate copolymer film; a polyurethane film; a polyimide film; a polystyrene film; a polycarbonate film; fluororesin films, and the like. Examples of the polyethylene film include a Low Density Polyethylene (LDPE) film, a Linear Low Density Polyethylene (LLDPE) film, and a High Density Polyethylene (HDPE) film. Further, a modified film such as a crosslinked film or an ionomer film of the above-described film may also be used. The substrate may be a laminated film obtained by laminating a plurality of the above-described films. In this laminated film, the materials constituting each layer may be the same type or different types. Among the above films, an ethylene-methyl methacrylate copolymer film is preferably used as the substrate from the viewpoint of excellent flexibility. In the present specification, "(meth) acrylic" refers to acrylic and methacrylic. Other similar terms are also the same.
The base material may contain various additives such as flame retardants, plasticizers, antistatic agents, lubricants, antioxidants, colorants, infrared absorbers, ultraviolet absorbers, and ion scavengers. The content of these additives is not particularly limited, but is preferably set in a range in which the base material performs a desired function.
In order to improve the adhesion to the adhesive layer, the surface of the laminated adhesive layer of the substrate may be subjected to surface treatment such as primer treatment, corona treatment, plasma treatment, or the like.
The thickness of the base material can be appropriately set according to the method of using the workpiece processing sheet, but is usually preferably 20 μm or more, and particularly preferably 25 μm or more. The thickness is preferably 450 μm or less, and more preferably 300 μm or less.
(2) Adhesive layer
In the work processing sheet of the present embodiment, the adhesive layer is not particularly limited as long as it is composed of an active energy ray-curable adhesive and exhibits a desired adhesive force to the cut object and the work processing sheet can achieve the above-described water contact angle and reduction rate of the adhesive force. When the adhesive layer is made of an active energy ray-curable adhesive, the adhesive layer can be cured by irradiation with an active energy ray when the object to be cut attached to the adhesive surface of the adhesive layer is separated from the adhesive surface, thereby reducing the adhesive force of the work processing sheet to the object to be cut. This facilitates separation of the adhesive surface of the adhesive layer from the object to be cut.
The active energy ray-curable adhesive constituting the adhesive layer may contain, as a main component, a polymer having active energy ray-curability, or may contain, as a main component, a mixture of a non-active energy ray-curable polymer (a polymer having no active energy ray-curability) and a monomer and/or oligomer having at least one or more active energy ray-curable groups. Further, a mixture of a polymer curable with active energy rays and a polymer curable with inactive energy rays may be used. Further, the curable composition may be a mixture of a polymer having active energy ray curability and a monomer and/or oligomer having at least one active energy ray curable group. Further, the curable composition may be a mixture of a polymer curable with active energy rays, a polymer curable with inactive energy rays, and a monomer and/or oligomer having at least one active energy ray-curable group.
First, the following description will discuss an active energy ray-curable adhesive containing, as a main component, a polymer curable with an active energy ray.
The active energy ray-curable polymer is preferably a (meth) acrylate (co) polymer (a) having an active energy ray-curable functional group (active energy ray-curable group) introduced into a side chain thereof (hereinafter, sometimes referred to as "active energy ray-curable polymer (a)"). The active energy ray-curable polymer (a) is preferably obtained by reacting an acrylic copolymer (a 1) with an unsaturated group-containing compound (a 2), the acrylic copolymer (a 1) having a functional group-containing monomer unit, and the unsaturated group-containing compound (a 2) having a functional group bonded to the functional group of (a 1).
The acrylic copolymer (a 1) preferably contains a monomer for adjusting the hydrophilicity of the acrylic copolymer (a 1) (hereinafter, may be referred to as "hydrophilicity-adjusting monomer") as a monomer unit constituting the polymer, and particularly, as a specific example thereof, at least one selected from the group consisting of methyl acrylate, 2-methoxyethyl (meth) acrylate, ethylcarbitol (meth) acrylate, ethoxyethoxyethyl (meth) acrylate, and methoxyethylene glycol (meth) acrylate is preferably contained. These monomers can increase the hydrophilicity of the acrylic copolymer (a 1), and thus the water contact angle and the reduction rate of the adhesive force of the formed adhesive agent layer can be easily adjusted to the above ranges. From the viewpoint of easily obtaining such an effect, it is preferable that the acrylic copolymer (a 1) contains at least one of methyl acrylate, 2-methoxyethyl acrylate, and methoxyethyl acrylate among the above monomers as a monomer unit constituting the polymer.
When the acrylic copolymer (a 1) contains methyl acrylate as a monomer unit constituting the polymer, the content of methyl acrylate is preferably 10% by mass or more, particularly preferably 20% by mass or more, and further preferably 30% by mass or more. The content of methyl acrylate is preferably 85 mass% or less. By setting the content of methyl acrylate to the above content, the water contact angle and the reduction rate of the adhesive force of the formed adhesive agent layer can be more easily adjusted to the above ranges. In the present specification, the content (mass%) of methyl acrylate refers to the content of all monomers constituting the acrylic copolymer (a 1). The content (mass%) of other monomer described later also means the content with respect to all monomers constituting the acrylic copolymer (a 1).
When the acrylic copolymer (a 1) contains 2-methoxyethyl acrylate as a monomer unit constituting the polymer, the content of 2-methoxyethyl acrylate is preferably 10% by mass or more, particularly preferably 20% by mass or more, and more preferably 30% by mass or more. The content of 2-methoxyethyl acrylate is preferably 85% by mass or less, particularly preferably 80% by mass or less, and more preferably 70% by mass or less. By setting the content of 2-methoxyethyl acrylate to the above content, the water contact angle and the reduction rate of the adhesive force of the formed adhesive agent layer can be more easily adjusted to the above ranges.
When the acrylic copolymer (a 1) contains methyl acrylate and 2-methoxyethyl acrylate as monomer units constituting the polymer, the total content of methyl acrylate and 2-methoxyethyl acrylate is preferably 10% by mass or more, particularly preferably 30% by mass or more, and more preferably 50% by mass or more. The total value is preferably 90% by mass or less, and particularly preferably 85% by mass or less. When the total value is in the above range, the reduction rate of the water contact angle and the adhesive force of the formed adhesive agent layer can be more easily adjusted to the above ranges.
Further, when the acrylic copolymer (a 1) contains methoxyethylene glycol acrylate as a monomer unit constituting the polymer, the content of methoxyethylene glycol acrylate is preferably 10% by mass or more, and particularly preferably 30% by mass or more. The content of methoxyethylene glycol acrylate is preferably 85 mass% or less, and particularly preferably 80 mass% or less. By setting the content of methoxyethylene glycol acrylate to the above content, the water contact angle and the reduction rate of the adhesive force of the formed adhesive agent layer can be more easily adjusted to the above ranges.
In addition to the hydrophilicity-regulating monomer, the acrylic copolymer (a 1) preferably contains a structural unit derived from a functional group-containing monomer and a structural unit derived from a (meth) acrylate monomer or a derivative thereof.
The functional group-containing monomer as a constituent unit of the acrylic copolymer (a 1) is preferably a monomer having a polymerizable double bond and a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, an epoxy group, or the like in the molecule.
Examples of the hydroxyl group-containing monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxybutyl (meth) acrylate, and 4-hydroxybutyl (meth) acrylate, and these hydroxyl group-containing monomers may be used alone or in combination of two or more.
Examples of the carboxyl group-containing monomer include ethylenically unsaturated carboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, maleic acid, itaconic acid, and citraconic acid. These carboxyl group-containing monomers may be used alone or in combination of two or more.
Examples of the amino group-containing monomer or substituted amino group-containing monomer include aminoethyl (meth) acrylate, n-butylaminoethyl (meth) acrylate, and the like. These amino group-containing monomers or substituted amino group-containing monomers may be used alone, or two or more thereof may be used in combination.
The acrylic copolymer (a 1) preferably contains 1% by mass or more, particularly preferably contains 5% by mass or more, and further preferably contains 10% by mass or more of the structural unit derived from the functional group-containing monomer. The acrylic copolymer (a 1) preferably contains not more than 35% by mass, particularly preferably not more than 30% by mass of a structural unit derived from the functional group-containing monomer.
As the (meth) acrylic ester monomer constituting the acrylic copolymer (a 1), for example, a monomer having an alicyclic structure in the molecule (alicyclic structure-containing monomer) is preferably used in addition to the alkyl (meth) acrylate having an alkyl group of 1 to 20 carbon atoms.
The alkyl (meth) acrylate used is particularly preferably an alkyl (meth) acrylate having 1 to 18 carbon atoms in the alkyl group, for example, methyl methacrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and the like. These alkyl (meth) acrylates may be used singly or in combination of two or more.
As the alicyclic structure-containing monomer, for example, cyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, adamantyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, and the like are preferably used. These alicyclic structure-containing monomers may be used singly or in combination of two or more.
Further, the acrylic copolymer (a 1) preferably contains 50% by mass or more, particularly preferably 60% by mass or more, and further preferably 70% by mass or more of a structural unit derived from a (meth) acrylate monomer or a derivative thereof. The acrylic copolymer (a 1) preferably contains 99% by mass or less, particularly preferably 95% by mass or less, and further preferably 90% by mass or less of a structural unit derived from a (meth) acrylate monomer or a derivative thereof.
The acrylic copolymer (a 1) is preferably obtained by copolymerizing the hydrophilicity-regulating monomer, the functional group-containing monomer, the (meth) acrylic acid ester monomer or a derivative thereof by a conventional method, but dimethylacrylamide, vinyl formate, vinyl acetate, styrene, or the like may be copolymerized in addition to these monomers.
The active energy ray-curable polymer (a) can be obtained by reacting the acrylic copolymer (a 1) having a functional group-containing monomer unit with the unsaturated group-containing compound (a 2) having a functional group bonded to the functional group of (a 1).
The functional group of the unsaturated group-containing compound (a 2) can be appropriately selected depending on the kind of the functional group-containing monomer unit of the acrylic copolymer (a 1). For example, when the functional group of the acrylic copolymer (a 1) is a hydroxyl group, an amino group or a substituted amino group, the functional group of the unsaturated group-containing compound (a 2) is preferably an isocyanate group or an epoxy group, and when the functional group of the acrylic copolymer (a 1) is an epoxy group, the functional group of the unsaturated group-containing compound (a 2) is preferably an amino group, a carboxyl group or an aziridine group.
The unsaturated group-containing compound (a 2) preferably contains at least 1, preferably 1 to 6, and more preferably 1 to 4 active energy ray-polymerizable carbon-carbon double bonds in one molecule. Specific examples of such unsaturated group-containing compounds (a 2) include 2-methacryloyloxyethyl isocyanate, m-isopropenyl- α, α -dimethylbenzyl isocyanate, methacryloyl isocyanate, allyl isocyanate, 1,1- (bisacryloxymethyl) ethyl isocyanate; an acryloyl monoisocyanate compound obtained by the reaction of a diisocyanate compound or a polyisocyanate compound with hydroxyethyl (meth) acrylate; an acryloyl group monoisocyanate compound obtained by the reaction of a diisocyanate compound or a polyisocyanate compound with a polyol compound and hydroxyethyl (meth) acrylate; glycidyl (meth) acrylate; (meth) acrylic acid, 2- (1-aziridinyl) ethyl (meth) acrylate, 2-vinyl-2-oxazoline, 2-isopropenyl-2-oxazoline, and the like.
The unsaturated group-containing compound (a 2) is used in a proportion of preferably 50 mol% or more, particularly preferably 60 mol% or more, and further preferably 70 mol% or more, based on the number of moles of the functional group-containing monomer in the acrylic copolymer (a 1). The unsaturated group-containing compound (a 2) is used in a proportion of preferably 95 mol% or less, particularly preferably 93 mol% or less, and further preferably 90 mol% or less, based on the number of moles of the functional group-containing monomer in the acrylic copolymer (a 1).
In the reaction of the acrylic copolymer (a 1) and the unsaturated group-containing compound (a 2), the reaction temperature, pressure, solvent, time, presence or absence of a catalyst, and the type of a catalyst may be appropriately selected depending on the combination of the functional group of the acrylic copolymer (a 1) and the functional group of the unsaturated group-containing compound (a 2). In this way, the functional group present in the acrylic copolymer (a 1) is reacted with the functional group in the unsaturated group-containing compound (a 2), and an unsaturated group is introduced into the side chain of the acrylic copolymer (a 1), thereby obtaining an active energy ray-curable polymer (a).
The weight average molecular weight (Mw) of the active energy ray-curable polymer (a) obtained in this manner is preferably 1 ten thousand or more, particularly preferably 15 ten thousand or more, and further preferably 20 ten thousand or more. The weight average molecular weight (Mw) is preferably 150 ten thousand or less, and particularly preferably 100 ten thousand or less. The weight average molecular weight (Mw) in the present specification is a value in terms of standard polystyrene measured by Gel Permeation Chromatography (GPC).
The active energy ray-curable adhesive may further contain an active energy ray-curable monomer and/or oligomer (B), even when the active energy ray-curable adhesive contains, as a main component, a polymer having an active energy ray-curable property such as the active energy ray-curable polymer (a).
As the active energy ray-curable monomer and/or oligomer (B), for example, an ester of a polyhydric alcohol and (meth) acrylic acid or the like can be used.
Examples of the active energy ray-curable monomer and/or oligomer (B) include monofunctional acrylates such as cyclohexyl (meth) acrylate and isobornyl (meth) acrylate; polyfunctional acrylates such as trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, polyethylene glycol di (meth) acrylate, and dimethylol tricyclodecane di (meth) acrylate; polyester oligo (meth) acrylates, urethane oligo (meth) acrylates, and the like.
When the active energy ray-curable monomer and/or oligomer (B) is blended with the active energy ray-curable polymer (a), the content of the active energy ray-curable monomer and/or oligomer (B) in the active energy ray-curable adhesive is preferably more than 0 part by mass, and particularly preferably 60 parts by mass or more, per 100 parts by mass of the active energy ray-curable polymer (a). The content is preferably 250 parts by mass or less, and particularly preferably 200 parts by mass or less, based on 100 parts by mass of the active energy ray-curable polymer (a).
When ultraviolet rays are used as the active energy rays for curing the active energy ray-curable adhesive, it is preferable to add a photopolymerization initiator (C) and use the photopolymerization initiator (C) can reduce the polymerization curing time and the irradiation amount of light.
Specific examples of the photopolymerization initiator (C) include benzophenone, acetophenone, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, benzoin dimethyl ketal, 2,4-diethylthioxanthone, 1-hydroxycyclohexyl phenyl ketone, benzyl diphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, benzil, butanedione, β -chloroanthraquinone, (2,4,6-trimethylbenzyldiphenyl) phosphine oxide, N-diethyldithiocarbamic acid-2-benzothiazole ester, oligo { 2-hydroxy-2-methyl-1- [4- (1-propenyl) phenyl ] propanone }, 2,2-dimethoxy-1,2-diphenylethan-1-one, and the like. These photopolymerization initiators may be used alone or in combination of two or more.
The photopolymerization initiator (C) is used in an amount of preferably 0.1 part by mass or more, particularly preferably 0.5 part by mass or more, based on 100 parts by mass of the active energy ray-curable polymer (a) (in the case of blending the active energy ray-curable monomer and/or oligomer (B), based on 100 parts by mass of the total amount of the active energy ray-curable polymer (a) and the active energy ray-curable monomer and/or oligomer (B)). Further, the photopolymerization initiator (C) is used in an amount of preferably 10 parts by mass or less, particularly preferably 6 parts by mass or less, based on 100 parts by mass of the active energy ray-curable polymer (a) (in the case of blending the active energy ray-curable monomer and/or oligomer (B), based on 100 parts by mass of the total amount of the active energy ray-curable polymer (a) and the active energy ray-curable monomer and/or oligomer (B)).
In addition to the above components, other components may be appropriately blended in the active energy ray-curable adhesive. Examples of the other components include an actinic-energy-ray-curable polymer component or oligomer component (D), and a crosslinking agent (E).
Examples of the non-active energy ray-curable polymer component or oligomer component (D) include polyacrylates, polyesters, polyurethanes, polycarbonates, and polyolefins, and polymers or oligomers having a weight average molecular weight (Mw) of 3000 to 250 ten thousand are preferable. When the component (D) is blended in the active energy ray-curable adhesive, the adhesiveness and releasability before curing, the strength after curing, the adhesiveness to other layers, the storage stability and the like can be improved. The blending amount of the component (D) is not particularly limited, and may be appropriately determined within a range of more than 0 part by mass and 50 parts by mass or less with respect to 100 parts by mass of the active energy ray-curable polymer (a).
As the crosslinking agent (E), a polyfunctional compound reactive with a functional group of the active energy ray-curable polymer (a) or the like can be used. Examples of such polyfunctional compounds include isocyanate compounds, epoxy compounds, amine compounds, melamine compounds, aziridine compounds, hydrazine compounds, aldehyde compounds, oxazoline compounds, metal alkoxide compounds, metal chelate compounds, metal salts, ammonium salts, and reactive phenol resins.
The blending amount of the crosslinking agent (E) is preferably 0.01 part by mass or more, and particularly preferably 3 parts by mass or more, relative to 100 parts by mass of the active energy ray-curable polymer (a). The amount of the crosslinking agent (E) to be blended is preferably 20 parts by mass or less, and particularly preferably 17 parts by mass or less, per 100 parts by mass of the active energy ray-curable polymer (a).
Next, a case where the active energy ray-curable adhesive contains a mixture of an inactive energy ray-curable polymer component and a monomer and/or oligomer having at least one active energy ray-curable group as a main component will be described below.
As the non-active energy ray-curable polymer component, for example, the same components as those of the acrylic copolymer (a 1) can be used.
The same component as the component (B) can be selected as the monomer and/or oligomer having at least one active energy ray-curable group. Regarding the blending ratio of the non-active energy ray-curable polymer component and the monomer and/or oligomer having at least one active energy ray-curable group, the monomer and/or oligomer having at least one active energy ray-curable group is preferably 1 part by mass or more, and particularly preferably 60 parts by mass or more, per 100 parts by mass of the non-active energy ray-curable polymer component. In addition, regarding the blending ratio, the monomer and/or oligomer having at least one active energy ray-curable group is preferably 200 parts by mass or less, and particularly preferably 160 parts by mass or less, with respect to 100 parts by mass of the inactive energy ray-curable polymer component.
In this case, the photopolymerization initiator (C) and the crosslinking agent (E) may be appropriately blended in the same manner as described above.
The thickness of the adhesive layer is preferably 1 μm or more, and more preferably 5 μm or more. The thickness is preferably 50 μm or less, and more preferably 40 μm or less. By setting the thickness of the adhesive agent layer to the above range, the reduction rate of the adhesive force can be easily achieved.
(3) Release sheet
In the work processing sheet of the present embodiment, a release sheet may be laminated on the adhesive surface of the adhesive layer for the purpose of protecting the adhesive surface until the adhesive surface is attached to the object to be cut. The release sheet may be of any configuration, and examples thereof include a release sheet obtained by subjecting a plastic film to a release treatment with a release agent or the like. Specific examples of the plastic film include polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; and polyolefin films such as polypropylene and polyethylene. As the release agent, silicones, fluorines, long chain alkyl groups and the like can be used, and among them, silicones which are inexpensive and can obtain stable performance are preferable. The thickness of the release sheet is not particularly limited, but is usually 20 μm or more and 250 μm or less.
(4) Other structural elements
In the work processing sheet of the present embodiment, a pressure-sensitive adhesive layer may be laminated on the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer. In this case, the work processing sheet of the present embodiment can be used as a dicing die bonding (die bonding) sheet by providing the work processing sheet with an adhesive layer as described above. A cut object is attached to the surface of the pressure-sensitive adhesive layer of the work processing sheet opposite to the pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer is cut together with the cut object, whereby a chip having a singulated (singulated) pressure-sensitive adhesive layer laminated thereon can be obtained. The singulated adhesive layer can be used to easily fix the chip to an object on which the chip is mounted. As a material constituting the pressure-sensitive adhesive layer, a material containing a thermoplastic resin and a low-molecular-weight thermosetting pressure-sensitive adhesive component, a material containing a B-stage (semi-cured) thermosetting pressure-sensitive adhesive component, or the like is preferably used.
In the work processing sheet of the present embodiment, a protective film forming layer may be laminated on the adhesive surface of the adhesive layer. In this case, the work processing sheet of the present embodiment can be used as a protective film forming and cutting sheet. A cut object is attached to the surface of the protective film forming layer of the work processing sheet opposite to the adhesive layer, and the protective film forming layer is cut together with the cut object, whereby a chip having a singulated protective film forming layer stacked thereon can be obtained. In this case, a protective film forming layer is generally laminated on the surface opposite to the surface on which the circuit is formed. By curing the singulated protective film-forming layer at a predetermined time, a protective film having sufficient durability can be formed on the chip. Preferably, the protective film forming layer is formed of an uncured curable adhesive.
In addition, the work processing sheet according to the embodiment of the present application satisfies the reduction rate of the water contact angle and the adhesive force, but when the pressure-sensitive adhesive layer or the protective film forming layer is laminated on the adhesive agent layer, the adhesive agent layer before laminating these layers may satisfy the water contact angle and the adhesive force.
3. Method for manufacturing sheet for processing workpiece
The method for producing the sheet for workpiece processing of the present embodiment is not particularly limited, and the sheet for workpiece processing of the present embodiment is preferably produced by laminating an adhesive layer on one surface side of a base material.
The adhesive layer can be laminated on one surface side of the base material by a known method. For example, the adhesive layer formed on the release sheet is preferably transferred to one side of the substrate. In this case, a coating liquid containing an adhesive composition constituting the adhesive layer and, if necessary, a solvent or a dispersion medium can be prepared, and the coating liquid is applied to the surface of the release sheet subjected to the release treatment (hereinafter, sometimes referred to as "release surface") by a die coater, a curtain coater, a spray coater, a slit coater, a blade coater, or the like to form a coating film, and the coating film is dried to form the adhesive layer. The coating liquid is not particularly limited as long as it can be applied, and may contain a component for forming the adhesive layer as a solute or a component for forming the adhesive layer as a dispersion medium. The release sheet in the laminate can be released as a process material, and can also be used to protect the adhesive surface of the adhesive layer until the work processing sheet is attached to the object to be cut.
When the coating liquid for forming the adhesive layer contains a crosslinking agent, the active energy ray-curable polymer (a) or the non-active energy ray-curable polymer in the coating film may be subjected to a crosslinking reaction with the crosslinking agent by changing the above-mentioned drying conditions (temperature, time, etc.) or by separately providing a heating treatment, so that a crosslinked structure is formed in the adhesive layer at a desired existing density. In order to sufficiently progress the crosslinking reaction, the adhesive layer may be laminated on the substrate by the above-mentioned method, and the obtained work processing sheet may be aged by standing for several days at 23 ℃ under an environment with a relative humidity of 50%, for example.
Instead of the method of transferring the adhesive layer formed on the release sheet to one side of the substrate as described above, the adhesive layer may be directly formed on the substrate. In this case, the coating liquid for forming the adhesive layer is applied to one surface side of the base material to form a coating film, and the coating film is dried to form the adhesive layer.
4. Method for using sheet for processing workpiece
The workpiece-processing sheet of the present embodiment can be used for processing a workpiece (object to be cut). That is, the adhesive surface of the workpiece processing sheet of the present embodiment can be attached to the object to be cut, and then the object to be cut can be processed on the workpiece processing sheet. According to this processing, the workpiece processing sheet of the present embodiment can be used as a back grinding sheet, a cutting sheet, an expanding sheet, a pickup sheet, and the like. Examples of the object to be cut include semiconductor members such as a semiconductor wafer and a semiconductor package; glass members such as glass plates.
Further, when the sheet for work processing of the present embodiment is provided with the above-described adhesive layer, the sheet for work processing can be used as a dicing die bonding sheet. Further, when the work processing sheet of the present embodiment is provided with the above-described protective film forming layer, the work processing sheet can be used as a protective film forming and cutting sheet.
Even when an adhesive derived from the adhesive layer adheres to the object to be cut, the workpiece-processing sheet of the present embodiment can easily remove the adhesive by running water, and at the same time, can suppress water caused by the running water from penetrating into the interface between the workpiece-processing sheet and the object to be cut or the interface between the workpiece-processing sheet and the obtained chip. Therefore, the workpiece-processing sheet according to the present embodiment is suitable for processing using running water, and is particularly suitable for cutting accompanied by supply of running water to the cut portion. That is, the work processing sheet of the present embodiment is suitably used as a dicing sheet.
When the work processing sheet of the present embodiment is used as a dicing sheet, ordinary conditions can be used as conditions for dicing and conditions for supplying running water. In particular, as the supply condition of the running water, pure water or the like is preferably used as the water to be used. The amount of water supplied is preferably 0.5L/min or more, and particularly preferably 1L/min or more. The amount of water supplied is preferably 2.5L/min or less, and particularly preferably 2L/min or less. The temperature of water is not particularly limited, and is preferably, for example, about room temperature.
[ method for producing machined workpiece ]
A method for manufacturing a machined workpiece according to an embodiment of the present invention includes: a bonding step of bonding a surface of the adhesive layer of the sheet for processing a workpiece, the surface being opposite to the base material, to the workpiece; a machining step of machining a workpiece on the workpiece machining sheet to obtain a machined workpiece stacked on the workpiece machining sheet; an irradiation step of irradiating the adhesive layer with active energy rays to cure the adhesive layer, thereby reducing the adhesion of the work processing sheet to the processed work; and a separation step of separating the processed workpiece from the workpiece processing sheet irradiated with the active energy ray.
The workpiece-processing sheet used in the method for producing a processed workpiece according to the present embodiment can prevent water from penetrating into the interface between the workpiece-processing sheet and the workpiece or between the workpiece-processing sheet and the processed workpiece, and can satisfactorily remove the adhesive adhering to the workpiece during processing of the workpiece by flowing water. Therefore, according to the method for manufacturing a machined workpiece of the present embodiment, the machined workpiece can be efficiently manufactured.
Hereinafter, each step of the method for manufacturing a machined workpiece according to the present embodiment will be described.
(1) Bonding step
The bonding of the workpiece and the workpiece processing sheet in the bonding step can be performed by a conventionally known method. In addition, when the workpiece is cut in the subsequent processing step, it is preferable that the ring frame is bonded to an outer peripheral region of a region where the workpiece is bonded, out of the surface on the adhesive layer side of the workpiece processing sheet. The workpiece to be used may be a desired workpiece corresponding to a machined workpiece to be manufactured, and as a specific example, the workpiece described above may be used.
(2) Working procedure
In the machining step, the workpiece may be subjected to a desired machining, for example, back grinding, cutting, or the like. These processes can be performed by conventionally known methods.
In addition, when the cutting is performed as the processing using the rotary blade, a part of the adhesive agent layer of the workpiece processing sheet is generally cut together with the workpiece. In this case, the adhesive constituting the adhesive layer may be wound up by the blade and adhere to the processed workpiece. However, as described above, the workpiece-processing sheet used in the method for producing a processed workpiece according to the present embodiment can remove the adhesive adhering thereto with flowing water with good efficiency. From this viewpoint, the processing in the present embodiment is suitable for cutting, and particularly suitable for blade cutting using a rotary blade.
(3) Irradiation step
In the irradiation step, the irradiation conditions of the active energy ray are not limited as long as the adhesion of the workpiece-processing sheet to the processed workpiece can be reduced to a desired degree, and the irradiation can be performed by a conventionally known method. Examples of the type of the active energy ray to be used include ionizing radiation, i.e., X-rays, ultraviolet rays, electron beams, and the like, and among them, ultraviolet rays which are relatively easy to be introduced into an irradiation apparatus are preferable.
(4) Separation step
In the separation step, separation is performed by a method corresponding to the type of processing or the obtained processed workpiece. For example, when dicing is performed as the processing and chips obtained by singulating the workpiece by the dicing are obtained, the obtained chips are picked up one by one from the workpiece processing sheet by using a conventionally known pickup apparatus. Further, in order to facilitate the pickup, the workpiece processing sheet may be expanded to separate the processed workpieces from each other.
(5) Others
In the method for manufacturing a machined workpiece according to the present embodiment, a step other than the above-described steps may be provided. For example, after the bonding step, a conveyance step of conveying the obtained stacked body of the workpiece and the workpiece processing sheet to a predetermined position, a storage step of storing the stacked body for a predetermined period of time, and the like may be provided. Further, after the separation step, a mounting step of mounting the obtained machined workpiece on a predetermined base or the like may be provided.
The embodiments described above are described for easy understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiments also covers all design changes and equivalents that fall within the technical scope of the present invention.
For example, another layer may be provided between the substrate and the adhesive layer or on the surface of the substrate opposite to the adhesive layer.
Examples
The present invention will be described in more detail with reference to examples and the like, but the scope of the present invention is not limited to these examples and the like.
[ example 1]
(1) Preparation of adhesive composition
An acrylic copolymer obtained by copolymerizing 20 parts by mass of methyl acrylate, 60 parts by mass of 2-methoxyethyl acrylate, and 20 parts by mass of 2-hydroxyethyl acrylate was reacted with 21.4g (corresponding to 80 mol% relative to the number of moles of 2-hydroxyethyl acrylate) of methacryloyloxyethyl isocyanate (MOI) per 100g of the acrylic copolymer to obtain an active energy ray-curable polymer. The weight average molecular weight (Mw) of the active energy ray-curable polymer was measured by the method described below, and found to be 60 ten thousand.
100 parts by mass (in terms of solid content, the same applies hereinafter) of the obtained active energy ray-curable polymer, 3 parts by mass of 1-hydroxycyclohexyl phenyl ketone (product name "IRGACURE 184", manufactured by basf) as a photopolymerization initiator, and 10.87 parts by mass of toluene diisocyanate (product name "CORONATE L", manufactured by TOSOH CORPORATION) as a crosslinking agent were mixed in a solvent to obtain an adhesive composition.
(2) Formation of adhesive layer
The adhesive composition was applied to the release surface of a release sheet (product name "SP-PET381031" manufactured by LINETEC CORPORATION) in which a silicone-based release agent layer was formed on one surface of a polyethylene terephthalate film having a thickness of 38 μm, dried by heating, and then aged at 23 ℃ and 50% RH for 7 days, thereby forming an adhesive layer having a thickness of 5 μm on the release sheet.
(3) Production of sheet for workpiece processing
The surface of the adhesive layer formed in the step (2) opposite to the release sheet and one surface of an ethylene-methacrylic acid copolymer (EMAA) film having a thickness of 80 μm as a base material were laminated to obtain a sheet for processing a work.
Here, the weight average molecular weight (Mw) is a weight average molecular weight in terms of standard polystyrene measured by Gel Permeation Chromatography (GPC) (GPC measurement).
Examples 2 to 6 and comparative examples 1 to 4
A sheet for workpiece processing was produced in the same manner as in example 1, except that the composition of the acrylic copolymer was changed as shown in table 1 and the content of the crosslinking agent was changed as shown in table 2.
[ test example 1] (measurement of Water contact Angle)
The release sheet was peeled from the work processing sheets produced in examples and comparative examples, and the water contact angle (°) of the exposed surface of the adhesive layer exposed was measured using a full automatic contact angle measuring instrument (manufactured by Kyowa Interface Science, inc, product name "DM-701") under the following conditions. The results are shown in Table 3.
Drop amount of purified water: 2 μ l
Measurement time: after dropping for 3 seconds
Image analysis method: theta/2 method
[ test example 2] (measurement of adhesive force)
The release sheet was peeled from the work processing sheets produced in examples and comparative examples, and the exposed surface of the adhesive agent layer was laminated on the mirror surface of a 6-inch silicon wafer subjected to mirror surface processing, and the resultant was applied with a load by reciprocating a 2kg roller once, and left to stand for 20 minutes. Then, the work piece was peeled from the silicon wafer at a peeling speed of 300 mm/min and a peeling angle of 180 °, and the adhesion force F1 (mN/25 mm) to the silicon wafer was measured by a 180 ° peeling method based on JIS Z0237: 2009. The results are shown in Table 3.
Further, the release sheet was peeled from the work processing sheets produced in examples and comparative examples, and the exposed surface of the adhesive layer was immersed in distilled water at 23 ℃ for 12 hours and then dried at 23 ℃ for 24 hours. Then, the exposed surface was laminated on a mirror surface of a 6-inch silicon wafer subjected to mirror surface processing, and a 2kg roller was reciprocated once to apply a load to the surface for bonding, and left for 20 minutes. Subsequently, the work piece was peeled from the silicon wafer at a peeling speed of 300 mm/min and a peeling angle of 180 °, and the adhesive force F2 (mN/25 mm) to the silicon wafer after the immersion and drying was measured by a 180 ° peeling method based on JIS Z0237: 2009. The results are shown in Table 3.
Further, using the values of the adhesive force F1 (mN/25 mm) and the adhesive force F2 (mN/25 mm) obtained in the above manner, the reduction ratio (%) of the adhesive force was calculated from the following formula (1). The results are shown in Table 3.
Rate of decrease in adhesive force (%) = { (F1-F2)/F1 } x 100. Cndot. (1)
[ test example 3] (evaluation of adhesive removability)
The adhesive compositions prepared in examples and comparative examples were applied to the release surface of a release sheet (product name "SP-PET381031" manufactured by linec CORPORATION) in which a silicone-based release agent layer was formed on one surface of a polyethylene terephthalate film having a thickness of 38 μm, and dried by heating, thereby forming an adhesive layer having a thickness of 5 μm on the release sheet. From the laminate of the adhesive layer and the release sheet obtained in this manner, 20 pieces of the laminate having a size of 5mm × 5mm were cut.
Then, the adhesive layer side surfaces of the 20 chips obtained in the above manner were attached to polished surfaces of #2000 polished 6-inch silicon wafers (thickness: 150 μm), and then the release sheets were peeled from the adhesive layer, respectively. In this attachment, the small pieces are attached so as to be spaced apart from each other by 1mm or more.
Then, the release sheet was peeled from the work processing sheets manufactured in examples and comparative examples, and the surface of the 6-inch silicon wafer opposite to the surface to which the small pieces were attached was attached to the exposed surface of the exposed adhesive layer using a chip mounter (product name "advill RAD2500m/12" manufactured by linec CORPORATION). Next, an operation simulating dicing from a 6-inch silicon wafer side was performed while supplying running water to the dicing section using a dicing apparatus (manufactured by DISCO Corporation, product name "DFD-6361") under the following operation conditions.
< operating conditions >
A cutting device: DFD-6361 manufactured by DISCO Corporation
Blade: NBC-2H 2050 27HECC from DISCO Corporation
Blade width: 0.025-0.030 mm
Blade extension: 0.640-0.760 mm
Blade rotation speed: 50000rpm
Cutting speed: 20 mm/s
Blade height (blade height): 5mm
Flow rate: 1.0L/min
Temperature of running water: at room temperature
Cut size: 10mm
In addition, the above "blade height: the 5mm "means that the distance between the blade and the 6-inch silicon wafer is set to 5mm, and thus it is understood that the 6-inch silicon wafer is not cut by the blade in the above operation.
After the dicing, whether or not the adhesive derived from the above-described small piece remains on the silicon wafer was checked, and the adhesive removability was evaluated according to the following criteria. The results are shown in Table 3.
O: the adhesive was completely free from residue.
X: at least a part of the adhesive remains.
[ test example 4] (evaluation of Water permeation)
The release sheet was peeled from the work processing sheets manufactured in examples and comparative examples, and the polished surface of a 6-inch silicon wafer (thickness: 150 μm) polished by #2000 was attached to the exposed surface of the exposed adhesive layer using a chip mounter (product name "advill RAD2500m/12" manufactured by linec CORPORATION). Next, using a dicing apparatus (product name "DFD-6361" manufactured by DISCO Corporation), dicing was performed by cutting from the 6-inch silicon wafer side while supplying running water to the dicing section under the following dicing conditions.
< cutting Condition >
A cutting device: DFD-6361 manufactured by DISCO Corporation
The blade: NBC-2H 2050 27HECC from DISCO Corporation
Blade width: 0.025-0.030 mm
Blade extension: 0.640-0.760 mm
Blade rotation speed: 50000rpm
Cutting speed: 20 mm/sec
Incision depth: 15 μm from the surface of the adhesive layer side of the sheet for processing a workpiece
Flow rate: 1.0L/min
Temperature of running water: at room temperature
Cut size: 10mm
After the cutting was completed, all the obtained chips were removed from the work piece, the surface of the work piece on the adhesive layer side was observed with a digital microscope (product name "VHX-1000" manufactured by KEYENCE corporation, magnification: 500-fold), and the water permeation at the interface between the chip and the work piece was evaluated in accordance with the following criteria. The results are shown in Table 3.
O: the surface of the work processing sheet on the adhesive layer side is free from traces of water penetration.
X: the surface of the work processing sheet on the adhesive layer side has traces of water penetration.
The details of the abbreviations and the like shown in table 1 are as follows.
BA: acrylic acid butyl ester
MMA: methacrylic acid methyl ester
DMAA: dimethylacrylamide
ACMO (acyl-amino): acryloyl morpholine
MA: acrylic acid methyl ester
2MEA: 2-Methoxyethyl acrylate
MTG: acrylic acid methoxy ethylene glycol ester
HEA: 2-Hydroxyethyl acrylate
MOI: methacryloyloxyethyl isocyanate
[ Table 1]
[ Table 2]
[ Table 3]
As is clear from table 3, the work processing sheets obtained in the examples can satisfactorily remove the adhesive by running water and satisfactorily suppress the penetration of water.
Industrial applicability
The sheet for processing a workpiece of the present invention can be suitably used for dicing.
Claims (6)
1. A sheet for processing a workpiece, comprising a base material and an adhesive layer laminated on one surface side of the base material,
the adhesive layer is composed of an active energy ray-curable adhesive,
a water contact angle of the adhesive layer with respect to a surface of the adhesive layer opposite to the substrate is 50 DEG to 80 DEG,
wherein the reduction rate of the adhesive force calculated by the following formula (1) is 20% to 50% where F1 is the adhesive force of the work processing sheet to the silicon wafer, F2 is the adhesive force of the work processing sheet to the silicon wafer after immersing the work processing sheet in distilled water at 23 ℃ for 12 hours and further drying the work processing sheet at 23 ℃ for 24 hours,
the rate of decrease in adhesive force (%) = { (F1-F2)/F1 } × 100 · (1).
2. The sheet for processing a workpiece according to claim 1, wherein the adhesive force F1 is 1000mN/25mm or more and 10000mN/25mm or less.
3. The sheet for processing a work according to claim 1 or 2, wherein the adhesive force F2 is 900mN/25mm or more and 8000mN/25mm or less.
4. The sheet for processing a workpiece according to any one of claims 1 to 3, wherein the active energy ray-curable adhesive is formed from an adhesive composition containing an acrylic copolymer containing at least one selected from the group consisting of methyl acrylate, 2-methoxyethyl (meth) acrylate, ethyl carbitol (meth) acrylate, and methoxyethylene glycol (meth) acrylate as a monomer unit constituting a polymer.
5. The sheet for processing a workpiece according to any one of claims 1 to 4, which is a dicing sheet.
6. A method for manufacturing a machined workpiece, comprising:
a bonding step of bonding a surface of the adhesive layer of the sheet for processing a workpiece according to any one of claims 1 to 5, the surface being opposite to the substrate, to a workpiece;
a machining step of machining the workpiece on the workpiece machining sheet to obtain a machined workpiece stacked on the workpiece machining sheet;
an irradiation step of irradiating the adhesive layer with an active energy ray to cure the adhesive layer, thereby reducing the adhesion of the work processing sheet to the processed work; and
and a separation step of separating the processed workpiece from the workpiece processing sheet after the irradiation with the active energy ray.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-235375 | 2017-12-07 | ||
| JP2017235375 | 2017-12-07 | ||
| PCT/JP2018/043551 WO2019111758A1 (en) | 2017-12-07 | 2018-11-27 | Sheet for workpiece processing and method for producing processed workpiece |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111164738A CN111164738A (en) | 2020-05-15 |
| CN111164738B true CN111164738B (en) | 2023-03-28 |
Family
ID=66750968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880063343.9A Active CN111164738B (en) | 2017-12-07 | 2018-11-27 | Sheet for processing workpiece and method for manufacturing processed workpiece |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7086102B2 (en) |
| KR (1) | KR102579051B1 (en) |
| CN (1) | CN111164738B (en) |
| TW (1) | TWI791695B (en) |
| WO (1) | WO2019111758A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024029315A1 (en) * | 2022-08-03 | 2024-02-08 | 株式会社レゾナック | Method for producing (meth)acrylic resin and method for producing adhesive composition |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011184576A (en) * | 2010-03-09 | 2011-09-22 | Hitachi Maxell Ltd | Radiation-curable self-adhesive composition, self-adhesive film for dicing using the same, and method for producing cut piece |
| WO2016140176A1 (en) * | 2015-03-02 | 2016-09-09 | 古河電気工業株式会社 | Adhesive tape for protecting semiconductor wafer surface, and semiconductor wafer processing method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5352496Y2 (en) | 1973-06-21 | 1978-12-15 | ||
| JP4800778B2 (en) * | 2005-05-16 | 2011-10-26 | 日東電工株式会社 | Dicing pressure-sensitive adhesive sheet and processing method of workpiece using the same |
| JP5000370B2 (en) * | 2007-04-20 | 2012-08-15 | 日東電工株式会社 | Adhesive sheet for water jet laser dicing |
| JP6390034B2 (en) | 2014-08-01 | 2018-09-19 | リンテック株式会社 | Adhesive sheet |
| JP6464196B2 (en) * | 2015-01-14 | 2019-02-06 | リンテック株式会社 | Resin film forming sheet, resin film forming composite sheet, and silicon wafer recycling method |
| JP6587811B2 (en) * | 2015-02-24 | 2019-10-09 | 日東電工株式会社 | Thermally peelable adhesive sheet |
| TW201710426A (en) * | 2015-09-15 | 2017-03-16 | Furukawa Electric Co Ltd | Adhesive tape for semiconductor wafer processing, manufacturing method thereof and processing method for semiconductor wafer used in a chip integration step by back grinding on a semiconductor wafer that has been half-cut by a blade or modified by laser to from a modified layer |
-
2018
- 2018-11-27 CN CN201880063343.9A patent/CN111164738B/en active Active
- 2018-11-27 KR KR1020207008250A patent/KR102579051B1/en active IP Right Grant
- 2018-11-27 WO PCT/JP2018/043551 patent/WO2019111758A1/en active Application Filing
- 2018-11-27 JP JP2019558148A patent/JP7086102B2/en active Active
- 2018-11-30 TW TW107142908A patent/TWI791695B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011184576A (en) * | 2010-03-09 | 2011-09-22 | Hitachi Maxell Ltd | Radiation-curable self-adhesive composition, self-adhesive film for dicing using the same, and method for producing cut piece |
| WO2016140176A1 (en) * | 2015-03-02 | 2016-09-09 | 古河電気工業株式会社 | Adhesive tape for protecting semiconductor wafer surface, and semiconductor wafer processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI791695B (en) | 2023-02-11 |
| JP7086102B2 (en) | 2022-06-17 |
| TW201929075A (en) | 2019-07-16 |
| KR102579051B1 (en) | 2023-09-15 |
| KR20200094726A (en) | 2020-08-07 |
| CN111164738A (en) | 2020-05-15 |
| JPWO2019111758A1 (en) | 2020-12-10 |
| WO2019111758A1 (en) | 2019-06-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111149192B (en) | Workpiece processing sheet and method for manufacturing processed workpiece | |
| CN110753992B (en) | Adhesive sheet for invisible dicing and method for manufacturing semiconductor device | |
| CN111164738B (en) | Sheet for processing workpiece and method for manufacturing processed workpiece | |
| CN111164737B (en) | Workpiece processing sheet and method for manufacturing processed workpiece | |
| CN113016055A (en) | Sheet for processing workpiece | |
| JP7200260B2 (en) | Work processing sheet and manufacturing method for processed work | |
| CN109906504B (en) | Adhesive sheet for stealth dicing | |
| JP2024007771A (en) | Work processing sheet and method for manufacturing semiconductor device | |
| JP2022135016A (en) | Work processing sheet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |